A BMS chip packaging structure, packaging mold and process

Abstract

The present invention relates to the field of chip processing and production, and specifically to a BMS chip packaging structure, a packaging mold and a process. The BMS chip packaging structure comprises a base, a plurality of vertical arms fixed on the base and a frame body slidably connected to the plurality of vertical arms, and further comprises: a first placement table and a second placement table, both of which are fixedly mounted on the base and are respectively used to place a circuit board and a chip, and a lifting mechanism is provided on the first placement table, which can lift the circuit board; an assembly plate, which is slidably mounted on the frame body, and a chip clamping mechanism is provided on the assembly plate, and the assembly plate is also connected to a transverse driving mechanism installed on the base through a follower mechanism, the follower mechanism cooperates with the lifting mechanism, and the transverse driving mechanism can drive the assembly plate to move back and forth between the first placement table and the second placement table through the follower mechanism, and the packaging process is carried out in an orderly manner through the mutual cooperation between various mechanisms and components, with a high degree of automation, and is suitable for popularization and use.

Description

Technical Field

[0001] The invention relates to the field of chip processing and production, and in particular to a BMS chip packaging structure, a packaging mold and a process. Background Art

[0002] Since there are a large number of control modules in automotive electronics, a large number of MCUs are needed to collect and control signals. Therefore, the importance of automotive-grade chips is self-evident. In order to ensure the safety and stability of batteries, battery management chips have become extremely important components in the fields of new energy vehicles, consumer electronics, industrial control, etc. Good BMS chips play a vital role in safe driving. BMS chips mainly involve AFE, MCU, ADC, digital isolators, etc.

[0003] Among them, chip packaging is a crucial production process. Nowadays, when doing this work, various sensor components are usually relied on to realize the orderly packaging of various components. However, sensor components have high requirements for the working environment. When they are affected by the external environment, it is easy to cause deviations in the combination of the chip and the circuit board, which in turn leads to packaging failure and even damage to the chip. Summary of the invention

[0004] The object of the present invention is to provide a BMS chip packaging structure, a packaging mold and a process to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A BMS chip packaging structure comprises a base, a plurality of vertical arms fixed on the base, and a frame body slidably connected to the plurality of vertical arms, and further comprises:

[0007] A first placement table and a second placement table, both of which are fixedly mounted on the base, and are used to place a circuit board and a chip respectively, and a lifting mechanism is provided on the first placement table, and the lifting mechanism can lift the circuit board;

[0008] An assembly plate is slidably mounted on the frame, a chip clamping mechanism is arranged on the assembly plate, the assembly plate is also connected to a transverse driving mechanism mounted on the base through a follower mechanism, the follower mechanism cooperates with the lifting mechanism, and the transverse driving mechanism can drive the assembly plate to move back and forth between the first placement platform and the second placement platform through the follower mechanism;

[0009] The height changing mechanism is installed on the base and connected to the frame, and can drive the frame to rise and fall. The height changing mechanism and the lateral driving mechanism are also connected to a Maltese cross movement mechanism arranged on the base.

[0010] As a further solution of the present invention: the lifting mechanism comprises two lifting plates slidably arranged on the first placement platform, and two sides of the lifting plates are respectively connected to a group of elastic support members arranged on the base;

[0011] The elastic support member includes a column fixedly mounted on the base, a boss fixed to one end of the column away from the base, and a first cylindrical spring sleeved on the outer circumference of the column. The side of the lifting plate is provided with a protrusion slidably connected to the column, and the two ends of the first cylindrical spring are respectively connected to the protrusion and the boss.

[0012] As a further solution of the present invention: a guide rail is fixed on the base, the follower mechanism includes a first follower plate slidably engaged in the guide rail and a second follower plate slidably engaged with the first follower plate, and the second follower plate is fixed to the assembly plate;

[0013] Wherein, a roller is provided on the side of the first follower plate facing the lifting plate, and the roller cooperates with a driven plate fixed on the lifting plate, and an inclined surface and a straight surface are provided on the driven plate.

[0014] As a further solution of the present invention: the Maltese cross movement mechanism includes a driving motor installed on the base, a driving wheel fixed on the output shaft of the driving motor, and a first driven wheel and a second driven wheel rotatably installed on the base, the rotating shaft of the first driven wheel is connected to the height changing mechanism, and the rotating shaft of the second driven wheel is connected to the transverse driving mechanism.

[0015] As a further solution of the present invention: the height change mechanism includes a disc rotatably mounted on the base and a first boss fixedly arranged at an eccentric position of the disc, the rotating shaft of the disc is connected to the rotating shaft of the first driven wheel via a first transmission belt, two strip cross bars are fixedly arranged on the frame, a gap is reserved between the two strip cross bars, the first boss extends into the gap and is slidably connected to the two strip cross bars.

[0016] As a further solution of the present invention: the transverse driving mechanism includes two driving wheels rotatably mounted on the base, a connecting member connecting the two driving wheels, and a second boss arranged on the side of the connecting member facing the first follower plate, the connecting member rollingly cooperates with the two driving wheels, and the rotating shaft of one of the driving wheels is connected to the rotating shaft of the second driven wheel through a second transmission belt, the first follower plate is provided with a strip through groove adapted to the second boss, the second boss extends into the strip through groove and is slidably connected to the first follower plate.

[0017] As a further solution of the present invention: the chip clamping mechanism comprises two sleeves symmetrically slidably arranged on the assembly plate, two clamping members movably arranged under the two sleeves, and a double-headed cylinder installed on the assembly plate, and the two ends of the double-headed cylinder are respectively fixed to the two sleeves;

[0018] Among them, the clamping member is arranged in an "L" shape and is connected to the lug formed on the sleeve plate through two groups of elastic connecting members. The elastic connecting member includes a transverse column fixedly connected to the clamping member and a second cylindrical spring sleeved on the transverse column. The transverse column is slidably connected to the lug, and the two ends of the second cylindrical spring are respectively connected to the clamping member and the lug.

[0019] A BMS chip packaging mould comprises the packaging structure.

[0020] A BMS chip packaging process, using the packaging mold, includes the following steps:

[0021] Step 1, placing the circuit board and the chip on the first placement table and the second placement table respectively;

[0022] Step 2: The Maltese cross movement mechanism drives the height change mechanism to move, and the height change mechanism drives the frame to slide back and forth, so that the chip clamping mechanism approaches the second placement table and clamps the chip on the second placement table;

[0023] Step 3: The Maltese cross movement mechanism drives the transverse driving mechanism to move, and the transverse driving mechanism drives the assembly plate to move from above the second placement table to above the first placement table through the follower mechanism, and the lifting mechanism drives the circuit board to move downward, so that the circuit board is positioned on the first placement table;

[0024] Step 4: The height change mechanism drives the frame to move, the chip clamping mechanism inserts the clamped chip onto the circuit board on the first placement table, and the transverse drive mechanism drives the frame to reset, completing the packaging process.

[0025] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention has a novel design. When working, the height change mechanism drives the frame to drive the chip clamping mechanism to rise and fall, so that the chip clamping mechanism can clamp the chip on the second placement table and the chip clamping mechanism can insert the clamped chip onto the circuit board on the first placement table. The transverse drive mechanism can realize the transfer of the chip between the first placement table and the second placement table, and promote the cooperation between the follow-up mechanism and the lifting mechanism to ensure that the circuit board is effectively positioned on the first placement table during the packaging process, thereby improving the accuracy of packaging. Therefore, through the mutual cooperation between various mechanisms and components, the packaging process is carried out in an orderly manner with a high degree of automation, which is suitable for popularization and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is an axonometric diagram of an embodiment of a BMS chip packaging structure.

[0027] Figure 2 The schematic diagram is a structural diagram of an embodiment of a BMS chip packaging structure.

[0028] Figure 3 This is a structural schematic diagram of another angle of an embodiment of a BMS chip packaging structure.

[0029] Figure 4 This is a structural schematic diagram of a BMS chip packaging structure from another angle.

[0030] Figure 5 for Figure 3 A magnified view of the structure at center.

[0031] Figure 6 This is an exploded diagram of the structure of the chip clamping mechanism in one embodiment of the BMS chip packaging structure.

[0032] Figure 7 The diagram is a schematic diagram of the coordination relationship between the lifting mechanism and the follower mechanism in one embodiment of the BMS chip packaging structure.

[0033] Figure 8 This is a schematic structural diagram of the Maltese cross movement mechanism in one embodiment of the BMS chip packaging structure.

[0034] In the figure: 1, base; 2, vertical arm; 3, frame; 301, strip cross bar; 4, first placement platform; 5, second placement platform; 6, lifting plate; 601, protrusion; 7, column; 701, boss; 8, first cylindrical spring; 9, driven plate; 901, inclined surface; 902, flat surface; 10, roller; 11, first follower plate; 1101, strip through groove; 12, second follower plate; 13, assembly plate; 14. sleeve plate; 1401. lug; 15. cylinder; 16. clamping member; 17. cross column; 18. second cylindrical spring; 19. driving motor; 20. driving wheel; 21. first driven wheel; 22. second driven wheel; 23. first transmission belt; 24. second transmission belt; 25. disc; 2501. first boss; 26. driving wheel; 27. connecting member; 2701. second boss; 28. guide track. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] In addition, when an element in the present invention is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only embodiment.

[0037] See also Figure 1-Figure 8 In an embodiment of the present invention, a BMS chip packaging structure includes a base 1, a plurality of vertical arms 2 fixed on the base 1, and a frame 3 slidably connected to the plurality of vertical arms 2, and further includes:

[0038] A first placement table 4 and a second placement table 5 are fixedly mounted on the base 1 and are used to place circuit boards and chips respectively. A lifting mechanism is provided on the first placement table 4, and the lifting mechanism can lift the circuit board.

[0039] An assembly plate 13 is slidably mounted on the frame 3. A chip clamping mechanism is mounted on the assembly plate 13. The assembly plate 13 is also connected to a transverse driving mechanism mounted on the base 1 through a follower mechanism. The follower mechanism cooperates with the lifting mechanism, and the transverse driving mechanism can drive the assembly plate 13 to move back and forth between the first placement table 4 and the second placement table 5 through the follower mechanism.

[0040] The height changing mechanism is installed on the base 1 and connected to the frame 3 , and can drive the frame 3 to rise and fall. The height changing mechanism and the lateral driving mechanism are also connected to a Maltese cross movement mechanism arranged on the base 1 .

[0041] Specifically, during operation, the circuit board and the chip are placed on the first placement table 4 and the second placement table 5 respectively, and the movement of the Maltese cross movement mechanism will first drive the movement of the height change mechanism, and the height change mechanism will drive the frame 3 to slide back and forth on the plurality of vertical arms 2, so that the chip clamping mechanism can approach the second placement table 5 and clamp the chip on the second placement table 5, and then the Maltese cross movement mechanism drives the transverse driving mechanism to move, and the transverse driving mechanism drives the assembly plate 13 from above the second placement table 5 to above the first placement table 4 through the follower mechanism, and then the frame 3 is driven by the height change mechanism to move, and the chip clamping mechanism can insert the clamped chip onto the circuit board on the first placement table 4, and finally the transverse driving mechanism drives the frame 3 to reset, and the packaging process is completed;

[0042] Among them, initially, the lifting mechanism is in a lifting state for the circuit board. In the process of the assembly plate 13 moving from the top of the second placement table 5 to the top of the first placement table 4, the follower mechanism cooperates with the lifting mechanism, so that the lifting mechanism drives the circuit board to move downward, and the circuit board enters the limiting rectangular groove (not numbered in the figure) provided on the first placement table 4. Therefore, in the process of the chip clamping mechanism inserting the chip onto the circuit board, the limiting rectangular groove can effectively stabilize the circuit board to avoid the accuracy of packaging being affected due to the offset of the circuit board.

[0043] In summary, when working, the height change mechanism drives the frame 3 to drive the chip clamping mechanism to rise and fall, so that the chip clamping mechanism can clamp the chip on the second placement table 5 and the chip clamping mechanism can insert the clamped chip onto the circuit board on the first placement table 4. The transverse drive mechanism can realize the transfer of the chip between the first placement table 4 and the second placement table 5, and promote the cooperation between the follow-up mechanism and the lifting mechanism to ensure that the circuit board is effectively positioned on the first placement table 4 during the packaging process, thereby improving the accuracy of packaging. Therefore, through the mutual cooperation between various mechanisms and components, the packaging process is carried out in an orderly manner with a high degree of automation, which is suitable for popularization and use.

[0044] Please refer again Figure 6 and Figure 7The lifting mechanism includes two lifting plates 6 slidably disposed on the first placement platform 4, and the two sides of the lifting plates 6 are each connected to a group of elastic support members disposed on the base 1. The elastic support member includes a column 7 fixedly mounted on the base 1, a boss 701 fixed to the end of the column 7 away from the base 1, and a first cylindrical spring 8 sleeved on the outer periphery of the column 7. A protrusion 601 slidably connected to the column 7 is provided on the side of the lifting plate 6, and the two ends of the first cylindrical spring 8 are respectively connected to the protrusion 601 and the boss 701.

[0045] A guide rail 28 is fixed on the base 1, and the follower mechanism includes a first follower plate 11 slidably engaged in the guide rail 28 and a second follower plate 12 slidably engaged with the first follower plate 11, and the second follower plate 12 is fixed to the assembly plate 13. A roller 10 is provided on the side of the first follower plate 11 facing the jacking plate 6, and the roller 10 cooperates with a follower plate 9 fixed on the jacking plate 6, and the follower plate 9 is provided with an inclined surface 901 and a straight surface 902.

[0046] After the chip on the second placement table 5 is clamped, the transverse driving mechanism works to drive the first follower plate 11 to slide along the guide rail 28. Correspondingly, the first follower plate 11 drives the assembly plate 13 to move from the upper side of the second placement table 5 to the upper side of the first placement table 4 on the frame 3 through the second follower plate 12. During this process, the roller 10 will first release from the inclined surface 901, thereby prompting the driven plate 9 to give way. Correspondingly, the lifting plate 6 slides downward, so that the electric The road plate moves down to the rectangular limiting groove on the first placement table 4 to realize the positioning of the circuit board during the packaging process and ensure the accuracy of the packaging. In addition, the protrusion 601 slides downward on the column 7, so that the first cylindrical spring 8 is stretched. After the chip packaging is completed, the assembly plate 13 returns from the top of the first placement table 4 to the top of the second placement table 5. After the roller 10 is separated from the flat surface 902, the first cylindrical spring 8 will retract, thereby causing the lifting plate 6 to rise, so that the packaged circuit board is lifted up, which is convenient for transferring the finished product.

[0047] Please refer again Figure 8 The Maltese cross movement mechanism includes a driving motor 19 installed on the base 1, a driving wheel 20 fixed on the output shaft of the driving motor 19, and a first driven wheel 21 and a second driven wheel 22 rotatably installed on the base 1, wherein the rotating shaft of the first driven wheel 21 is connected to the height changing mechanism, and the rotating shaft of the second driven wheel 22 is connected to the transverse driving mechanism.

[0048] Please refer again Figure 6 The height changing mechanism includes a disc 25 rotatably mounted on the base 1 and a first boss 2501 fixedly arranged at an eccentric position of the disc 25. The rotating shaft of the disc 25 is connected to the rotating shaft of the first driven wheel 21 through a first transmission belt 23. Two strip cross bars 301 are fixedly arranged on the frame 3. A gap is reserved between the two strip cross bars 301. The first boss 2501 extends into the gap and is slidably connected to the two strip cross bars 301.

[0049] Whenever the driving motor 19 drives the active wheel 20 to drive the first driven wheel 21 to rotate, the rotating shaft of the first driven wheel 21 will drive the disc 25 to rotate one circle, so that the first boss 2501 completes a circular motion and slides with the two strip cross bars 301, so that the frame 3 can drive the assembly plate 13 to complete a reciprocating lifting motion, so that the chip clamping mechanism can clamp the chip located on the second placement table 5 and insert the clamped chip into the circuit board located on the first placement table 4.

[0050] Please refer again Figure 8 The transverse driving mechanism includes two driving wheels 26 rotatably mounted on the base 1, a connecting member 27 connecting the two driving wheels 26, and a second boss 2701 provided on the connecting member 27 facing the first follower plate 11. The connecting member 27 rolls with the two driving wheels 26, and the rotating shaft of one of the driving wheels 26 is connected to the rotating shaft of the second driven wheel 22 through a second transmission belt 24. A strip through groove 1101 adapted to the second boss 2701 is provided on the first follower plate 11, and the second boss 2701 extends into the strip through groove 1101 and is slidably connected to the first follower plate 11.

[0051] Further, the connecting member 27 is in rolling cooperation with the two driving wheels 26, and forms a closed interval, the edge of which includes two opposite semicircles and two opposite straight line segments. Whenever the driving motor 19 drives the driving wheel 20 to drive the second driven wheel 22 to rotate, the rotating shaft of the second driven wheel 22 drives the driving wheel 26 to rotate, and then, the second protrusion 2701 is transferred from the midpoint of one of the semicircles to the midpoint of the other semicircle, and drives the first follower plate 11 to slide along the guide track 28 through the strip-shaped through groove 1101. Accordingly, the first follower plate 11 can drive the assembly plate 13 to move between the first placement platform 4 and the second placement platform 5 through the second follower plate 12. When the frame 3 slides on the vertical arm 2, the second follower plate 12 slides on the first follower plate 11.

[0052] It should be emphasized that the length of the strip cross bar 301 is relatively long to ensure that after the assembly plate 13 moves to the top of the first placement table 4, when the disc 25 drives the first boss 2501 to move, the first boss 2501 can still smoothly slide and cooperate with the two strip cross bars 301, thereby avoiding the first boss 2501 from being separated from the two strip cross bars 301 due to the length of the strip cross bar 301 being too short.

[0053] Please refer again Figure 6 The chip clamping mechanism includes two sleeve plates 14 symmetrically slidably arranged on the assembly plate 13, two clamping members 16 movably arranged under the two sleeve plates 14, and a double-headed cylinder 15 installed on the assembly plate 13, and the two ends of the double-headed cylinder 15 are respectively fixed to the two sleeve plates 14. The clamping member 16 is arranged in an "L" shape, and is connected to the lug 1401 formed on the sleeve plate 14 through two sets of elastic connecting members, and the elastic connecting member includes a cross column 17 fixedly connected to the clamping member 16 and a second column spring 18 sleeved on the cross column 17, the cross column 17 is slidably connected to the lug 1401, and the two ends of the second column spring 18 are respectively connected to the clamping member 16 and the lug 1401.

[0054] When clamping the chip, the double-headed cylinder 15 drives the two sleeve plates 14 to move closer to each other on the assembly plate 13, so that the two clamping members 16 are in contact with the two sides of the chip respectively. As the two sleeve plates 14 continue to approach, the distance between the lug 1401 and the clamping member 16 is shortened, and the second cylindrical spring 18 is gradually compressed, thereby achieving a flexible clamping effect on the chip, avoiding damage to the chip due to excessive clamping force, and effectively protecting the chip.

[0055] As another embodiment of the present invention, a BMS chip packaging mold is also proposed, including the packaging structure.

[0056] As another embodiment of the present invention, a BMS chip packaging process is also proposed, using the packaging mold, including the following steps:

[0057] Step 1: Place the circuit board and the chip on the first placement table 4 and the second placement table 5 respectively;

[0058] Step 2: The Maltese cross movement mechanism drives the height change mechanism to move, and the height change mechanism drives the frame 3 to slide back and forth, so that the chip clamping mechanism approaches the second placement table 5 and clamps the chip on the second placement table 5;

[0059] Step 3: The Maltese cross movement mechanism drives the transverse driving mechanism to move, and the transverse driving mechanism drives the assembly plate 13 to move from above the second placement table 5 to above the first placement table 4 through the follower mechanism, and the lifting mechanism drives the circuit board to move downward, so that the circuit board is positioned on the first placement table 4;

[0060] Step 4: the height change mechanism drives the frame 3 to move, the chip clamping mechanism inserts the clamped chip onto the circuit board on the first placement table 4, and the transverse drive mechanism drives the frame 3 to reset, completing the packaging process.

[0061] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0062] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A BMS chip packaging structure, comprising a base (1), a plurality of vertical arms (2) fixed on the base (1), and a frame (3) slidably connected to the plurality of vertical arms (2), characterized in that: Also includes: A first placement table (4) and a second placement table (5), both of which are fixedly mounted on the base (1), and are used to place a circuit board and a chip respectively, and a lifting mechanism is provided on the first placement table (4), and the lifting mechanism can lift the circuit board; An assembly plate (13) is slidably mounted on the frame (3), a chip clamping mechanism is provided on the assembly plate (13), the assembly plate (13) is also connected to a transverse driving mechanism mounted on the base (1) via a follower mechanism, the follower mechanism cooperates with the lifting mechanism, and the transverse driving mechanism can drive the assembly plate (13) to perform a reciprocating motion between the first placement platform (4) and the second placement platform (5) via the follower mechanism; a height change mechanism, mounted on the base (1) and connected to the frame (3), capable of driving the frame (3) to rise and fall, and the height change mechanism and the lateral drive mechanism are further connected to a Maltese cross movement mechanism provided on the base (1); The height changing mechanism comprises a disc (25) rotatably mounted on the base (1) and a first boss (2501) fixedly arranged at an eccentric position of the disc (25); the rotation axis of the disc (25) is connected to the rotation axis of the first driven wheel (21) in the Maltese cross movement mechanism via a first transmission belt (23); two strip cross bars (301) are fixedly arranged on the frame (3); a gap is reserved between the two strip cross bars (301); the first boss (2501) extends into the gap and is slidably connected to the two strip cross bars (301); The transverse driving mechanism comprises two driving wheels (26) rotatably mounted on the base (1), a connecting member (27) connecting the two driving wheels (26), and a second boss (2701) provided on the connecting member (27) facing the first follower plate (11) in the follower mechanism, wherein the connecting member (27) is in rolling cooperation with the two driving wheels (26), and the rotating shaft of one of the driving wheels (26) is connected to the rotating shaft of the second driven wheel (22) in the Maltese cross movement mechanism via a second transmission belt (24), and the first follower plate (11) is provided with a strip through groove (1101) adapted to the second boss (2701), and the second boss (2701) extends into the strip through groove (1101) and is slidably connected to the first follower plate (11).

2. A BMS chip packaging structure according to claim 1, characterized in that: The lifting mechanism comprises two lifting plates (6) slidably arranged on the first placement platform (4), and two sides of the lifting plates (6) are respectively connected to a group of elastic support members arranged on the base (1); The elastic support member comprises a column (7) fixedly mounted on the base (1), a boss (701) fixed to one end of the column (7) away from the base (1), and a first cylindrical spring (8) sleeved on the outer periphery of the column (7); a protrusion (601) slidably connected to the column (7) is provided on the side of the lifting plate (6); and two ends of the first cylindrical spring (8) are respectively connected to the protrusion (601) and the boss (701).

3. A BMS chip packaging structure according to claim 2, characterized in that: A guide rail (28) is fixed on the base (1), and the follower mechanism comprises a first follower plate (11) slidably engaged in the guide rail (28) and a second follower plate (12) slidably engaged with the first follower plate (11), and the second follower plate (12) is fixed to the assembly plate (13); A roller (10) is provided on the side of the first follower plate (11) facing the lifting plate (6), and the roller (10) cooperates with a driven plate (9) fixed on the lifting plate (6), and the driven plate (9) is provided with an inclined surface (901) and a straight surface (902).

4. A BMS chip packaging structure according to claim 3, characterized in that: The Maltese cross movement mechanism comprises a driving motor (19) mounted on the base (1), a driving wheel (20) fixed on the output shaft of the driving motor (19), and a first driven wheel (21) and a second driven wheel (22) rotatably mounted on the base (1), wherein the rotating shaft of the first driven wheel (21) is connected to the height changing mechanism, and the rotating shaft of the second driven wheel (22) is connected to the transverse driving mechanism.

5. The BMS chip packaging structure according to claim 1, characterized in that: The chip clamping mechanism comprises two sleeve plates (14) symmetrically slidably arranged on the assembly plate (13), two clamping members (16) movably arranged below the two sleeve plates (14), and a double-headed cylinder (15) mounted on the assembly plate (13), wherein both ends of the double-headed cylinder (15) are respectively fixed to the two sleeve plates (14); The clamping member (16) is arranged in an "L" shape and is connected to a lug (1401) formed on the sleeve (14) through two groups of elastic connecting members, the elastic connecting member comprising a transverse column (17) fixedly connected to the clamping member (16) and a second column spring (18) sleeved on the transverse column (17), the transverse column (17) being slidably connected to the lug (1401), and two ends of the second column spring (18) respectively connecting the clamping member (16) and the lug (1401).

6. A bms chip packaging mold, characterized in that: Comprising a packaging structure as described in any one of claims 1-5.

7. A BMS chip packaging process, using the packaging mold as claimed in claim 6, characterized in that: The following steps are involved: Step 1: placing the circuit board and the chip on a first placement platform (4) and a second placement platform (5) respectively; Step 2: The Maltese cross movement mechanism drives the height change mechanism to move, and the height change mechanism drives the frame (3) to slide back and forth, so that the chip clamping mechanism approaches the second placement platform (5) and clamps the chip on the second placement platform (5); Step 3: The Maltese cross movement mechanism drives the transverse driving mechanism to move, and the transverse driving mechanism drives the assembly plate (13) to move from above the second placement platform (5) to above the first placement platform (4) through the follower mechanism, and the lifting mechanism drives the circuit board to move downward, so that the circuit board is positioned on the first placement platform (4); In step 4, the height change mechanism drives the frame (3) to move, the chip clamping mechanism inserts the clamped chip onto the circuit board located on the first placement platform (4), and the transverse drive mechanism drives the frame (3) to reset, thus completing the packaging process.

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