A wafer cleaning and drying fixture

Abstract

The invention relates to the technical field of wafer processing and treatment, and discloses a wafer cleaning and drying fixture. The invention adopts a design that three supporting frames are installed on a rotating plate, and a plurality of wafer mounting mechanisms are stacked and arranged on each supporting frame, and a plurality of wafers can be placed on each mounting mechanism, so that a plurality of wafers can be spun-dried at one time, thereby greatly improving the efficiency of wafer spun-driing treatment. The design that a downward-pressing positioning component cooperates with a supporting component allows the side edge of the wafer to be engaged in a notch of a supporting plate in the supporting component, and when a net frame is covered, the top of the wafer is engaged in a groove at the bottom of a pressing plate, thereby realizing efficient positioning of the wafer, preventing the wafer from shaking during the spun-drying process and colliding with the fixture, thereby reducing the risk of wafer damage. The meshing design of an inner gear ring and an outer gear ring allows the self-rotation of the wafer fixture to be realized while driving a plurality of wafer fixtures to revolve, and the directions of the revolution and the self-rotation are opposite, thereby improving the spun-drying effect of the wafer.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing, and in particular to a wafer cleaning and drying jig. Background Art

[0002] During the process, the wafer will be contaminated by water, organic matter, metal pollution, etc. These pollutants will accelerate the oxidation of the wafer surface, resulting in a decrease in wafer yield and poor device quality. Therefore, the wafer needs to be cleaned and dried to remove surface pollutants and keep the wafer clean and dry.

[0003] Currently, after the 12-inch wafer processing is completed, because too much product leaks out of the cleaning rack, it can only be dried after cleaning. This causes the dirty dust particles on the surface of the product to directly adhere to the surface of the product during drying and cannot be removed.

[0004] After searching, the patent with application number CN202320359488.1 discloses a wafer cleaning and drying device, including a device body, a water collecting tank is fixedly connected to the bottom of the device body, a water tank is installed on the left side of the device body, and a connecting shaft is movably connected to the middle of the device body. The wafer cleaning and drying device is provided with a placement basket, a connecting shaft, a cabinet door, a wafer body, a rotating motor, a limit plate and a drain basket. When in use, the cabinet door is opened, and the wafer body is placed in the groove of the placement basket. Then the limit plate is clamped on the top of the placement basket to limit and fix the placement basket, and it is not easy to fall off. Then the rotating motor is started, and under the action of the rotating motor, the connecting shaft is driven to start rotating, and the water after the placement basket is rinsed is dried by the centrifugal force during rotation. The water passes through the drain basket and collects at the bottom of the device body. After a period of time, the water on the surface of the wafer is dried, which solves the problem of inconvenience in limiting the wafer.

[0005] The patent with application number CN202110173368.8 discloses a spin-drying device for wafer cleaning, including a machine body, a drain trough, a spin-drying machine door, a door handle, a door control mechanism, a spin-drying drive mechanism, and a wafer fixing mechanism, wherein the wafer fixing mechanism includes a fixed frame, a drain hole, a chute, a movable bottom plate, a roller, a bottom plate push rod, and a front baffle. The chute is provided on both sides of the interior below the fixed frame, and the drain hole is provided on the side wall and the top of the fixed frame. The movable bottom plate is provided between the chute, and the roller is provided on both sides of the movable bottom plate. Through the wafer fixing mechanism with a bottom plate that can be extended adopted by the invention, when the wafer needs to be placed, the bottom plate is extended. At this time, the wafer tray is placed on the bottom plate from top to bottom, and there is no need to extend the arm to place the wafer tray into the spin-drying device, thereby reducing the risk of collision of the wafer and improving the production yield.

[0006] In order to avoid the above-mentioned problem that the dirty dust particles caused by drying will directly adhere to the surface of the product during drying and cannot be removed, the spin drying method is now often used to remove moisture and dirty dust on the surface of the wafer;

[0007] However, the existing drying device after wafer cleaning has the following defects:

[0008] 1. The wafer fixture has insufficient carrying capacity, and only a few wafers can be dried at a time, which reduces the efficiency of wafer drying.

[0009] 2. The wafer fixture has a poor positioning effect on the wafer, which can easily cause the wafer to shake during the drying process, causing the wafer to collide with the fixture, posing a risk of damaging the wafer; and the current wafer fixture is not convenient for taking and placing the wafer, that is, it is more troublesome to lock the wafer through the fixture, which reduces the efficiency of the wafer drying process;

[0010] 3. When the current wafer is dried, a driving mechanism is usually used to drive the wafer fixture (driving the wafer) to rotate at high speed in one direction. The drying effect of the wafer needs to be improved, so we need to propose a wafer cleaning and drying fixture. Summary of the invention

[0011] The object of the present invention is to provide a wafer cleaning and drying jig, which is designed by installing three support frames on a rotating plate, and stacking a plurality of wafer mounting mechanisms on each support frame, and each mounting mechanism can be used to place multiple wafers, so that more wafers can be spun-dried at one time, thereby greatly improving the efficiency of wafer spun-drying. By pressing down the positioning assembly and cooperating with the supporting assembly, the side of the wafer is engaged in the notch of the supporting plate in the supporting assembly, and when the net frame is covered, the top of the wafer is engaged in the groove at the bottom of the pressing plate, thereby achieving efficient positioning of the wafer and avoiding The wafer shakes during the spin-drying process and collides with the fixture, reducing the risk of wafer damage; through the design of the locking component, after the wafer is placed in the wafer fixture and covered with the net frame, the wafer can be locked by simply turning the turntable and driving the arc-shaped positioning rod to pass through the positioning ring. The operation is simple and quick, which further improves the efficiency of the wafer spin-drying process; through the meshing design of the inner gear ring and the outer gear ring, while driving multiple wafer fixtures to revolve, the wafer fixture can rotate, and the directions of revolution and rotation are opposite, which improves the wafer drying effect to solve the problems raised in the above background technology.

[0012] To achieve the above object, the present invention provides the following technical solution: a wafer cleaning and drying fixture, comprising:

[0013] Drying bucket;

[0014] Rotate multiple groups of wafer fixtures arranged inside the drying barrel around the axis of the drying barrel;

[0015] A fixing ring is installed on the outer side of the wafer fixture, an outer ring of the fixing ring is fixedly provided with an outer gear ring, an inner wall of the spin-drying barrel is installed with an inner gear ring, and the inner gear ring is meshed with the outer gear ring;

[0016] The wafer fixture comprises a support frame, and a plurality of mounting mechanisms stacked inside the support frame for carrying wafers;

[0017] The installation mechanism includes a lower mesh frame and an upper mesh frame rotatably installed on the upper end of one side of the lower mesh frame, a plurality of groups of support components equidistantly arranged in a ring shape are installed inside the lower mesh frame, a downward pressing positioning component pressed on the top of the wafer is installed on the top of the upper mesh frame, and a locking component for locking the upper mesh frame and the lower mesh frame is installed on the upper mesh frame.

[0018] Preferably, a limiting groove is provided on the inner wall of the support frame, and the side of the lower net frame is connected to a limiting bar, and the limiting bar is slidably installed inside the limiting groove.

[0019] Preferably, a handle for taking and placing the installation mechanism is installed on the top of the upper net frame, a slot is opened on the top of the upper net frame, and a plug column aligned with the slot is connected to the bottom of the lower net frame.

[0020] Preferably, the downward positioning assembly includes two fixing rods fixed to the top of the upper net frame and a pressure plate movably installed below the two fixing rods. The pressure plate is configured as an arc-shaped pressure plate, and a groove aligned with the wafer is provided at the bottom of the pressure plate.

[0021] Preferably, a movable column is connected to the top of the pressure plate, a sliding groove is provided at the bottom of the fixed rod, the movable column is slidably installed inside the sliding groove, and a spring sleeved on the outer periphery of the movable column is connected between the fixed rod and the pressure plate.

[0022] Preferably, the locking assembly includes two fixing plates fixed on the upper net frame and a positioning ring fixed on the lower net frame, a worm is rotatably installed between the two fixing plates, and a turntable for driving the worm to rotate is installed on one side of one of the fixing plates.

[0023] Preferably, a rotating column is rotatably provided on the upper net frame, a worm wheel and a collar are respectively sleeved on the outer wall of the rotating column, the worm wheel is meshed with the worm, an arc-shaped positioning rod is connected to the outer side of the collar, and the positioning rod is aligned with the positioning ring.

[0024] Preferably, the support assembly includes a connecting rod connected to two opposite inner walls of the lower mesh frame, a support plate is mounted on the connecting rod, and a plurality of notches arranged at equal intervals are formed on the support plate, and the notches are triangular in shape.

[0025] Preferably, a driving mechanism for driving the wafer fixture to rotate is installed at the bottom of the spin-drying tub, and the driving mechanism includes a rotating plate rotatably arranged at the bottom of the spin-drying tub, and a motor for driving the rotating plate to rotate is installed at the bottom of the spin-drying tub.

[0026] Preferably, the rotating plate is configured as a Y-shaped rotating plate, the supporting frame is rotatably mounted on the end of the rotating plate, a supporting seat is mounted on the end surface of the rotating plate, a clamping block is connected to the supporting seat, a clamping slot is provided at the bottom of the supporting frame, and the clamping block is clamped inside the clamping slot.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] 1. The present invention installs three support frames on the rotating plate, and stacks a plurality of wafer mounting mechanisms on each support frame, and each mounting mechanism can hold multiple wafers, thereby achieving a spin-drying operation for a large number of wafers at the same time, thereby greatly improving the efficiency of the wafer spin-drying process;

[0029] 2. The present invention adopts the design of pressing down the positioning assembly and cooperating with the supporting assembly, so that the side of the wafer is engaged in the notch of the supporting plate in the supporting assembly. When the net frame is covered, the top of the wafer is engaged in the groove at the bottom of the pressing plate, so as to realize efficient positioning of the wafer, avoid shaking of the wafer during the drying process, and avoid collision with the fixture, thereby reducing the risk of wafer damage;

[0030] 3. The present invention adopts the design of the locking assembly. After the wafer is placed in the wafer fixture and the net frame is covered, the wafer can be locked by rotating the turntable and driving the arc-shaped positioning rod to pass through the positioning ring. The operation is simple and quick, thereby further improving the efficiency of the wafer drying process.

[0031] 4. The present invention uses the meshing design of the inner gear ring and the outer gear ring to drive multiple wafer fixtures to revolve while realizing the self-rotation of the wafer fixture, and the directions of the revolution and the self-rotation are opposite, thereby improving the drying effect of the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a structural schematic diagram of the present invention;

[0033] Figure 2 It is a structural schematic diagram of the support frame and the installation mechanism of the present invention;

[0034] Figure 3 It is a structural schematic diagram of the support frame and the limiting groove of the present invention;

[0035] Figure 4 An exploded view of the mounting mechanism of the present invention;

[0036] Figure 5It is a structural schematic diagram of the lower screen frame, the supporting assembly and the limiting strip of the present invention;

[0037] Figure 6 It is a structural schematic diagram of the driving mechanism of the present invention;

[0038] Figure 7 It is a schematic diagram of the structure of the inner gear ring, the fixed ring and the outer gear ring of the present invention;

[0039] Figure 8 It is a structural schematic diagram of the locking assembly of the present invention;

[0040] Fig. 9 It is a schematic diagram of the structure of the support assembly of the present invention;

[0041] Fig.10 It is a structural schematic diagram of the downward pressing positioning component of the present invention.

[0042] In the figure: 100, spin drying barrel; 200, wafer fixture; 1, support frame; 11, limit slot; 2, installation mechanism; 21, net frame; 22, slot; 23, handle; 24, press down positioning assembly; 241, pressure plate; 242, groove; 243, movable column; 244, spring; 245, fixing rod; 25, lower net frame; 26, locking assembly; 261, fixing plate; 262, worm; 2 63. Turntable; 264. Rotating column; 265. Worm gear; 266. Ring; 267. Positioning rod; 268. Positioning ring; 27. Support assembly; 271. Connecting rod; 272. Support plate; 273. Slot; 28. Limiting strip; 29. ​​Insert column; 3. Driving mechanism; 31. Motor; 32. Rotating plate; 33. Support seat; 34. Block; 4. Inner gear ring; 5. Fixing ring; 6. Outer gear ring. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] See also Figure 1-10 The present invention provides a technical solution: a wafer cleaning and drying fixture, comprising:

[0045] The spin drying barrel 100; the spin drying barrel 100 is configured as a circular spin drying barrel, a plurality of legs are installed at the bottom of the spin drying barrel 100, a truncated cone-shaped fixed block is installed at the bottom of the legs, and optionally, a protective pad made of silicone rubber is provided at the bottom of the fixed block to increase the friction between the fixed block and the ground, thereby ensuring the stability of the device during operation.

[0046] The spin-drying barrel 100 is also provided with a cleaning mechanism (not shown in the figure, the cleaning mechanism mainly includes a water pipe and a nozzle installed on the water pipe to clean the wafer), which can directly spin-dry the wafer after cleaning.

[0047] See also Figure 1 , multiple groups of wafer fixtures 200 arranged inside the spin drying barrel 100 are rotated around the axis of the spin drying barrel 100; in this embodiment, three groups of wafer fixtures 200 are arranged, and the three groups of wafer fixtures 200 are arranged in a ring at equal intervals, which can ensure the stability of the wafer fixtures 200 during the drying process.

[0048] like Figure 7 As shown, a fixing ring 5 is installed on the outer side of the wafer fixture 200, and an outer gear ring 6 is fixedly provided on the outer ring of the fixing ring 5. An inner gear ring 4 is installed on the inner wall of the spin-drying barrel 100, and the inner gear ring 4 is meshed with the outer gear ring 6. Through the cooperation between the inner gear ring 4 and the outer gear ring 6, the wafer fixture 200 can rotate while revolving inside the spin-drying barrel 100, which can effectively improve the effect of wafer drying.

[0049] like Figure 2 and Figure 3 As shown, the wafer fixture 200 includes a support frame 1, and multiple groups of mounting mechanisms 2 for carrying wafers stacked inside the support frame 1; two non-adjacent pairs of sides of the support frame 1 are provided with through grooves, and two other non-adjacent pairs of sides are provided with multiple drainage holes arranged laterally and at equal intervals, so as to facilitate the removal of moisture on the wafer during drying.

[0050] like Figure 4 and Figure 5 As shown, the mounting mechanism 2 includes a lower mesh frame 25, and an upper mesh frame 21 rotatably mounted on the upper end of one side of the lower mesh frame 25, the upper mesh frame 21 has the same height as the lower mesh frame 25, and half of the wafer is located in the upper mesh frame 21, and the other half of the wafer is located in the lower mesh frame 25, and a plurality of groups of support assemblies 27 equidistantly arranged in a ring shape are installed inside the lower mesh frame 25, and the plurality of support assemblies 27 can realize multi-point support for the wafer.

[0051] The top of the upper net frame 21 is provided with a downward pressing positioning component 24 pressed on the top of the wafer, and the upper net frame 21 is provided with a locking component 26 for locking the upper net frame 21 and the lower net frame 25. The downward pressing positioning component 24 is pressed on the top of the wafer to realize efficient positioning of the wafer and ensure the stability of the wafer during the drying process.

[0052] The inner wall of the support frame 1 is provided with a limiting groove 11, and the side of the lower net frame 25 is connected to a limiting strip 28, which is set as a semi-cylindrical limiting strip. The limiting strip 28 is slidably installed inside the limiting groove 11 to facilitate the placement of the installation mechanism 2.

[0053] A handle 23 for taking and placing the installation mechanism 2 is installed on the top of the upper net frame 21, which is convenient for taking and placing the installation mechanism 2. A slot 22 is opened on the top of the upper net frame 21, and the bottom of the lower net frame 25 is connected with a plug post 29 aligned with the slot 22. The plug post 29 on the lower net frame 25 in the lowermost installation mechanism 2 is inserted into the inside of the notch (not shown in the figure) on the support frame 1, and the plug post 29 on the lower net frame 25 in the upper installation mechanism 2 is inserted into the slot 22 in the upper net frame 21 in the lower installation mechanism 2 to ensure the stability of the upper and lower installation mechanisms 2.

[0054] like Fig.10 As shown, the downward pressing positioning assembly 24 includes two fixing rods 245 fixed on the top of the upper net frame 21, and a pressure plate 241 movably installed under the two fixing rods 245. The two fixing rods 245 are arranged in parallel, and the pressure plate 241 is set to be an arc-shaped pressure plate. The bottom of the pressure plate 241 is provided with a groove 242 aligned with the wafer, that is, the position of the groove 242 is aligned with the notch 273.

[0055] The top of the pressing plate 241 is connected with a movable column 243, the bottom of the fixing rod 245 is provided with a sliding groove, the movable column 243 is slidably installed inside the sliding groove, and a spring 244 is connected between the fixing rod 245 and the pressing plate 241 and sleeved on the outer periphery of the movable column 243. The top of the wafer is inserted into the groove 242, and as the wafer continues to resist the pressing plate 241, the pressing plate 241 drives the movable column 243 to be inserted into the sliding groove, and the spring 244 is squeezed to achieve the positioning of the wafer.

[0056] like Figure 8 As shown, the locking assembly 26 includes two fixing plates 261 fixed on the upper net frame 21 and a positioning ring 268 fixed on the lower net frame 25. A worm 262 is rotatably installed between the two fixing plates 261, and a turntable 263 for driving the worm 262 to rotate is installed on one side of one of the fixing plates 261.

[0057] The net frame 21 is rotatably provided with a rotating column 264, and the outer wall of the rotating column 264 is respectively sleeved with a worm wheel 265 and a collar 266, and the worm wheel 265 is meshed with the worm 262, and the outer side of the collar 266 is connected with an arc-shaped positioning rod 267, and the positioning rod 267 is aligned with the positioning ring 268. The positioning rod 267 includes a cylindrical rod with a straight end, and an arc-shaped rod is connected to one end of the cylindrical rod, and the diameter of the arc-shaped rod is smaller than the inner diameter of the positioning ring 268.

[0058] Rotate the turntable 263 to drive the worm 262 to rotate. The worm 262 drives the rotating column 264 and the ring 266 to rotate through the worm gear 265, and then drives the arc-shaped positioning rod 267 to rotate, so that the end of the positioning rod 267 passes through the positioning ring 268, which can lock the upper net frame 21 and the lower net frame 25, ensuring that the wafer remains stable inside the installation mechanism 2 and does not shake during the drying process. In addition, with the cooperation of the worm 262 and the worm gear 265, it has a self-locking function, that is, after the positioning rod 267 moves into place, it can be stably inserted into the inside of the positioning ring 268, which can ensure that the locked upper net frame 21 and the lower net frame 25 will not loosen automatically.

[0059] like Fig. 9 As shown, the support assembly 27 includes a connecting rod 271 connected to two opposite inner walls of the lower mesh frame 25, and a support plate 272 is installed on the connecting rod 271. The support plate 272 is provided with a plurality of notches 273 arranged at equal intervals. Through the arrangement of the plurality of notches 273, a plurality of wafers can be placed in one installation mechanism 2. The notches 273 are set to be triangular notches, which is convenient for positioning wafers of different thicknesses. In order to reduce damage to the wafer, a soft silicone layer can be installed on the inner wall of the notch 273.

[0060] like Figure 6 As shown, a driving mechanism 3 for driving the wafer fixture to rotate is installed at the bottom of the spin drying barrel 100, and the driving mechanism 3 includes a rotating plate 32 rotatably arranged at the bottom of the spin drying barrel 100. A motor 31 for driving the rotating plate 32 to rotate is installed at the bottom of the spin drying barrel 100. The motor 31 is configured as a servo motor, and one end of the output shaft of the motor 31 passes through the bottom of the spin drying barrel 100 and is connected to the bottom of the rotating plate 32.

[0061] The rotating plate 32 is configured as a Y-shaped rotating plate, the supporting frame 1 is rotatably mounted on the end of the rotating plate 32, a supporting seat 33 is mounted on the end surface of the rotating plate 32, specifically, the supporting seat 33 includes a bearing embedded on the rotating plate 32, the inner ring of the bearing is plugged with a supporting column, a clamping block 34 is connected to the supporting seat 33, the clamping block 34 is fixed on the supporting column, a clamping slot is provided at the bottom of the supporting frame 1 (not shown in the figure due to viewing angle), and the clamping block 34 is clamped inside the clamping slot. The clamping block 34 is configured as a circular clamping block, and a plurality of protrusions are provided on the side of the clamping block 34 to increase the stability of the clamping block 34 inside the clamping slot.

[0062] When in use, take a plurality of wafers, first place the wafers inside the lower mesh frame 25, specifically, align the side of the wafer with the notch 273 on the support plate 272 in the support assembly 27, and insert the side of the wafer into the notch 273, and a plurality of annular equidistantly arranged support assemblies 27 can realize multi-point support for the wafer, ensuring the stability of wafer installation, and since a plurality of notches 273 are evenly spaced on the support plate 272, a plurality of wafers can be placed in one installation mechanism 2 (lower mesh frame 25), realizing large-scale cleaning and drying of the wafers;

[0063] Then, the upper net frame 21 is turned over and covered on the lower net frame 25. During the covering process, the pressing plate 241 contacts the top of the wafer, and the top of the wafer is stuck into the inside of the groove 242. As the wafer continues to contact the pressing plate 241, the pressing plate 241 drives the movable column 243 to insert into the inside of the sliding groove, and the spring 244 is squeezed to achieve the positioning of the wafer.

[0064] After the wafer is positioned, the locking assembly 26 is used to lock the upper frame 21 and the lower frame 25. Specifically, the turntable 263 is rotated to drive the worm 262 to rotate. The worm 262 drives the rotating column 264 and the collar 266 to rotate through the worm gear 265, thereby driving the arc-shaped positioning rod 267 to rotate, and the end of the positioning rod 267 passes through the positioning ring 268, so that the upper frame 21 and the lower frame 25 can be locked, ensuring that the wafer remains stable inside the mounting mechanism 2 and does not shake during the drying process.

[0065] Then, according to the above process, wafers are filled in each mounting mechanism 2, and then the mounting mechanisms 2 are stacked in sequence and placed inside the support frame 1 by means of the handles 23, and the plugging posts 29 on the lower mesh frame 25 of the lowest mounting mechanism 2 are inserted into the inside of the notch (not shown in the figure) on the support frame 1, and the plugging posts 29 on the lower mesh frame 25 of the upper mounting mechanism 2 are inserted into the slots 22 in the upper mesh frame 21 of the lower mounting mechanism 2, to ensure the stability of the upper and lower mounting mechanisms 2;

[0066] Finally, the motor 31 in the driving mechanism 3 is operated, and the motor 31 drives the rotating plate 32 to rotate, and the rotating plate 32 drives multiple wafer fixtures 200 loaded with wafers to revolve. In the process of the revolution of the wafer fixture 200, since the outer side of the support frame 1 is equipped with an outer gear ring 6 meshing with the inner gear ring 4, the self-rotation of the wafer fixture 200 is achieved with the cooperation of the inner gear ring 4 and the outer gear ring 6, thereby further improving the effect of wafer drying.

[0067] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer cleaning and drying fixture, characterized in that: include: Drying bucket (100); A plurality of groups of wafer fixtures (200) arranged inside the drying barrel (100) are rotated around the axis of the drying barrel (100); A fixing ring (5) is installed on the outer side of the wafer fixture (200), an outer ring of the fixing ring (5) is fixedly provided with an outer gear ring (6), an inner wall of the spin-drying barrel (100) is installed with an inner gear ring (4), and the inner gear ring (4) is meshed with the outer gear ring (6); The wafer fixture (200) comprises a support frame (1), and a plurality of mounting mechanisms (2) stacked and arranged inside the support frame (1) and used for carrying wafers; The mounting mechanism (2) comprises a lower screen frame (25), an upper screen frame (21) rotatably mounted on the upper end of one side of the lower screen frame (25), a plurality of groups of support components (27) equidistantly arranged in a ring shape are mounted inside the lower screen frame (25), a downward pressing positioning component (24) pressed on the top of the wafer is mounted on the top of the upper screen frame (21), and a locking component (26) for locking the upper screen frame (21) and the lower screen frame (25) is mounted on the upper screen frame (21); The downward pressing positioning assembly (24) comprises two fixing rods (245) fixed to the top of the net frame (21), and a pressing plate (241) movably installed below the two fixing rods (245); the pressing plate (241) is configured as an arc-shaped pressing plate, and a groove (242) aligned with the wafer is provided at the bottom of the pressing plate (241); The top of the pressing plate (241) is connected to a movable column (243), the bottom of the fixed rod (245) is provided with a sliding groove, the movable column (243) is slidably installed inside the sliding groove, and a spring (244) sleeved on the outer periphery of the movable column (243) is connected between the fixed rod (245) and the pressing plate (241); The locking assembly (26) comprises two fixing plates (261) fixed on the upper net frame (21) and a positioning ring (268) fixed on the lower net frame (25); a worm (262) is rotatably mounted between the two fixing plates (261); a rotating disk (263) for driving the worm (262) to rotate is mounted on one side of one of the fixing plates (261); A rotating column (264) is rotatably arranged on the net frame (21), a worm wheel (265) and a collar (266) are respectively sleeved on the outer wall of the rotating column (264), the worm wheel (265) is meshed with the worm (262), an arc-shaped positioning rod (267) is connected to the outer side of the collar (266), and the positioning rod (267) is aligned with the positioning ring (268); The support assembly (27) comprises a connecting rod (271) connected to two opposite inner walls of the lower net frame (25); a support plate (272) is mounted on the connecting rod (271); a plurality of notches (273) arranged at equal intervals are formed on the support plate (272); and the notches (273) are triangular notches.

2. The wafer cleaning and drying fixture according to claim 1, characterized in that: The inner wall of the support frame (1) is provided with a limiting groove (11), the side of the lower net frame (25) is connected to a limiting strip (28), and the limiting strip (28) is slidably installed inside the limiting groove (11).

3. The wafer cleaning and drying fixture according to claim 1, characterized in that: A handle (23) for taking and placing the installation mechanism (2) is installed on the top of the upper screen frame (21), a slot (22) is opened on the top of the upper screen frame (21), and a plug post (29) aligned with the slot (22) is connected to the bottom of the lower screen frame (25).

4. The wafer cleaning and drying fixture according to claim 1, characterized in that: A driving mechanism (3) for driving the wafer fixture to rotate is installed at the bottom of the spin-drying barrel (100), and the driving mechanism (3) comprises a rotating plate (32) rotatably arranged at the bottom of the spin-drying barrel (100), and a motor (31) for driving the rotating plate (32) to rotate is installed at the bottom of the spin-drying barrel (100).

5. The wafer cleaning and drying fixture according to claim 4, characterized in that: The rotating plate (32) is configured as a Y-shaped rotating plate, the supporting frame (1) is rotatably mounted on the end of the rotating plate (32), a supporting seat (33) is mounted on the end surface of the rotating plate (32), a clamping block (34) is connected to the supporting seat (33), a clamping slot is provided at the bottom of the supporting frame (1), and the clamping block (34) is clamped inside the clamping slot.

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