A multi-power interchangeable head semiconductor laser for easy spot conversion

Abstract

The present invention provides a multi-power interchangeable head semiconductor laser that facilitates spot conversion, belonging to the field of semiconductor laser technology, and includes a semiconductor laser, a handle body, and an interchangeable treatment head. Its structure uses a water cooling mode to dissipate heat from the laser heat sink module, achieving greater heat exchange, better heat removal, and the ability to package higher-power laser chips to obtain greater output energy; the interchangeable treatment head adopts a customized TEC cooling plate heat dissipation method. In terms of optics, each laser chip 101 uses a cylindrical collimating lens to compress its fast axis, reducing the divergence angle to a certain extent, ensuring that the fast axis outputs at a uniform angle. Because the slow axis divergence angle of the laser chip is small, the slow axis uses a slow axis compression lens to compress the overall light spot. Then, the fast axis spot uses a fast axis compression lens to compress the light spot area as a whole, meeting the light spot size required by customers and ensuring that the optical homogenization of each light spot is good.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor lasers, and in particular to a multi-power replaceable-head semiconductor laser that facilitates light spot conversion. Background Art

[0002] Lasers are categorized into solid-state lasers, liquid lasers, gas lasers, and semiconductor lasers. Semiconductor lasers are used in beauty and industrial fields such as hair removal, skin rejuvenation, and freckle removal. With the improvement of people's living standards, their pursuits have shifted from satisfying basic necessities to focusing on personal image. Improving beauty has become a constant pursuit, leading to the introduction of a wide variety of beauty devices to help people achieve their aesthetic aspirations. Semiconductor lasers are particularly popular. Semiconductor laser hair removal devices feature adjustable pulse width, energy, and exposure time. Their synchronized cooling system allows them to remove hair of varying thicknesses. Furthermore, ensuring uniform light spot distribution—i.e., uniform energy density distribution—during treatment is paramount, ensuring patient comfort and achieving satisfactory, painless hair removal results in the shortest possible time. Furthermore, patients require varying spot sizes depending on the area being treated and the technique being used. To provide optimal treatment results and solutions, lasers with multiple handles and interchangeable head handles are now available to meet these needs.

[0003] The existing interchangeable head solution uses a light guide cone for optical transmission, which is heavy and has a large contradiction between the maximum and minimum light spots. It is difficult to ensure the optical uniformity of the small light spot while ensuring the optical uniformity of the small light spot, and it is difficult to ensure the spot size and area of ​​the large light spot while ensuring the optical uniformity of the small light spot. Summary of the Invention

[0004] In order to solve the above technical problems, the present invention proposes a multi-power interchangeable head semiconductor laser that facilitates light spot conversion. The laser can facilitate light spot conversion while ensuring optical homogenization of the light spot.

[0005] The present invention provides the following technical solutions:

[0006] A multi-power interchangeable-head semiconductor laser for easy spot conversion, comprising:

[0007] A semiconductor laser comprises a housing and a plurality of laser chips; one side of the housing has a light outlet and is provided with a window; the plurality of laser chips are packaged in series within the housing and close to the light outlet; a collimating lens is provided between the emission end of each laser chip and the window;

[0008] An L-shaped handle body; the inner side surface of one plate of the handle body is a mounting surface for the semiconductor laser, fixedly connected to the bottom of the housing; the other plate surface is provided with a first light channel that cooperates with the light outlet; the handle body has a circulating water channel inside;

[0009] a slow-axis compression lens, embedded on the outer side of the other plate surface of the handle body and located at the first light channel;

[0010] A TEC cooling plate, the hot surface of which is fixedly connected to the outer side of the other plate surface of the handle body through a heat conductive material, and exchanges heat through the water channel;

[0011] A cooling plate, one end surface of which is fixedly connected to the cooling surface of the TEC cooling sheet through a heat-conducting material; the TEC cooling sheet and the cooling plate are both provided with a second light channel that cooperates with the first light channel;

[0012] Multiple replaceable treatment heads have positioning surfaces and tapered light-emitting ends; multiple replaceable treatment heads are equipped with fast-axis compression lenses with different focal lengths, and their light-emitting ends are equipped with lenses or nose hair heads; the positioning surface of each replaceable treatment head is detachably connected to the other end surface of the cooling plate.

[0013] Preferably, a heat dissipation tooth channel is provided inside the housing and on one side of the laser chip; a water channel is provided inside the housing and is connected to one end of the heat dissipation tooth channel; a water inlet is provided at the bottom of the housing and is connected to the other end of the heat dissipation tooth channel, and a water outlet is provided at the bottom of the housing;

[0014] The mounting surface of the handle body is provided with an opening connected to the water inlet and the water outlet; the outer side of a plate surface of the handle body is provided with a water inlet nozzle and a water outlet nozzle connected to the water channel; wherein, water flows in from the water inlet nozzle, passes through one of the openings into the hot tooth channel and the waterway, cools the semiconductor laser, flows through the water channel to exchange heat with the TEC cooling plate, and then flows out from another point of the water outlet nozzle.

[0015] Preferably, positive and negative electrode leads are provided on the outside of the shell; and the plurality of laser chips are connected to an external power source via the electrode leads.

[0016] Preferably, the other end surface of the cooling plate and the positioning surface of the replaceable treatment head are both provided with a plurality of magnetic elements that cooperate with each other.

[0017] Preferably, a first PCB probe is provided on the top of the other end surface of the cooling plate; a second PCB probe cooperating with the first PCB probe is provided on the positioning surface of each of the replaceable treatment heads, and the first PCB probe detects the second PCB probe to determine the spot area currently provided by the replaceable treatment head.

[0018] Preferably, when the light-emitting end of the replaceable treatment head is a nose hair head, a group of focusing lenses are arranged between the nose hair head and the fast-axis compression lens; a rotating sleeve is provided at the end of the nose hair head, and a sealing ring is fixed on the inside of the rotating sleeve; the rotating sleeve is rotatably engaged with the end of the light-emitting end, and its inner side is frictionally engaged with the outer side of the end of the light-emitting end through a sealing ring.

[0019] Preferably, the inner cavity of the replaceable treatment head is polished and plated with bright gold.

[0020] Preferably, the lens is a sapphire lens.

[0021] Preferably, the fast-axis compression lens and the sapphire lens are bonded and fixed by sealing silicone rubber.

[0022] Preferably, the thermally conductive material is thermal paste, thermal paste or graphene; the thermal conductivity of the thermally conductive material is 13.5 to 20 W·m -1 ·K -1 .

[0023] Beneficial effects of the present invention:

[0024] The present invention proposes a multi-power interchangeable head semiconductor laser that is convenient for spot conversion. The laser is provided with a detachable and interchangeable treatment head, which can switch the spot size. Each laser chip of the laser uses a collimating lens to compress its fast axis, reducing the divergence angle to a certain extent, ensuring that the fast axis is output at a uniform angle. Because the slow axis divergence angle of the laser chip is small, the slow axis can use a slow axis compression lens to compress the overall spot. The fast axis spot uses a lens to compress the spot area as a whole to meet the spot size required by customers, and the optical homogenization of each spot is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is an overall assembly diagram of a multi-power interchangeable-head semiconductor laser that facilitates spot conversion according to an embodiment of the present invention;

[0026] Figure 2 : is a schematic structural diagram of a semiconductor laser according to an embodiment of the present invention, wherein: Figure 2 (a) is the main view, Figure 2 (b) is an internal cross-sectional view, Figure 2 (c) is the local structure view, Figure 2 (d) is a top view, Figure 2 (e) is a three-dimensional structure diagram;

[0027] Figure 3 : is a structural diagram of the handle body of an embodiment of the present invention, wherein: Figure 3 (a) is a schematic diagram of section AA, Figure 3(b) is a three-dimensional structure diagram, Figure 3 (c) is the main view, Figure 3 (d) is a side view;

[0028] Figure 4 is an optical simulation diagram of the fast axis and slow axis of an embodiment of the present invention;

[0029] Figure 5 1. It is a schematic structural diagram of a replaceable treatment head according to an embodiment of the present invention;

[0030] Figure 6 is a cross-sectional view of the interior of a nose hair head according to an embodiment of the present invention;

[0031] Figure 7 1 is an optical simulation diagram of a variable light spot according to an embodiment of the present invention.

[0032] In the figure, 100, semiconductor laser; 101, laser chip; 102, collimating lens; 103, window; 104, electrode lead; 200, handle body; 201, water channel; 202, water inlet nozzle; 203, TEC cooling plate; 204, cooling plate; 205, slow axis compression lens; 206, first PCB probe; 207, magnetic component; 300, replaceable treatment head; 310, treatment head No. 1; 320, treatment head No. 2; 330, treatment head No. 3; 340, treatment head No. 4; 311, 321, 331, 341, fast axis compression lens; 312, 322, 332, sapphire lens; 342, nose hair head; 343, focusing lens; 344, rotating sleeve; 345, sealing ring. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0035] The terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include one or more of such features; in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0036] Example 1

[0037] This embodiment proposes a multi-power replaceable head semiconductor laser that is convenient for spot conversion, including a semiconductor laser 100, a handle body 200 and a replaceable treatment head 300. Figure 1 As shown, in this embodiment, a water-cooling scheme is used to dissipate heat from the laser heat sink module, achieving greater heat exchange and better heat removal. This allows for the packaging of higher-power laser chips 101, resulting in greater output energy. The interchangeable treatment head 300 utilizes a customized TEC cooling plate 203 for cooling, providing a more stable cooling effect for the interchangeable treatment head 300, significantly enhancing human protection and user comfort. Optically, because the laser chip 101 has a large fast-axis divergence angle, each laser chip 101 is fast-axis compressed using a cylindrical collimating lens 102 to reduce the divergence angle to a certain level and ensure uniform fast-axis output. Because the laser chip 101 has a small slow-axis divergence angle, a slow-axis compression lens 205 is used to compress the overall light spot. The fast-axis spot is then compressed using a fast-axis compression lens to meet customer-required spot sizes and ensure optimal optical homogeneity for each spot.

[0038] like Figure 2 As shown, Figure 2 is a schematic diagram of the structure of a semiconductor laser, where Figure 2 (a) is the main view, Figure 2 (b) is an internal cross-sectional view, Figure 2 (c) is the local structure view, Figure 2 (d) is a top view, Figure 2 (e) is a three-dimensional structural diagram. Water enters through the inlet, flows through the heat dissipation tooth channel, removes the heat generated by the laser chip 101, and then flows out of the outlet after heat exchange, completing a heat dissipation cycle. The circuit system is characterized by current input from the positive terminal of the electrode lead 104, passing through the laser chip 101. The laser chips 101 are powered in series. After flowing through each laser chip 101, the current is output from the negative terminal of the electrode lead 104, forming a circuit loop.

[0039] Optics: After the laser chip 101 is powered on, it emits light. Since the divergence angle of the fast-axis spot of the laser chip 101 is large, it needs to be compressed first to facilitate subsequent spot shaping. Therefore, a collimating lens 102 is added to the front end of each laser chip 101 to compress each group of spots to a controllable small-angle divergence angle, reduce the virtual weak light at both ends of the divergence angle, and integrate the light. However, because the power required by each customer is different, the number of laser chips 101 is also different. If it is necessary to include multiple powers and the optical system needs to be universal, different package sizes need to be designed according to different powers. It is necessary to adjust the distance between each laser chip 101 to ensure that the spot area size is consistent when different powers are output from the laser, and the spot homogenization must also be guaranteed. Therefore, if the spacing between the laser chips 101 is too large or too small, the spot homogenization cannot be achieved. Therefore, optical simulation and actual testing are required to ensure the quality and spot area of ​​the subsequent shaping beam.

[0040] like Figure 3 As shown, Figure 3 It is a structural diagram of the handle body, wherein: Figure 3 (a) is a schematic diagram of section AA, Figure 3 (b) is a three-dimensional structure diagram, Figure 3 (c) is the main view, Figure 3 (d) is a side view. In terms of water cooling, the water channel 201 is a positioning carrier for the semiconductor laser 100, and supplies water to the semiconductor laser 100 for cooling. The water flows in from the water inlet nozzle 202, cools the semiconductor laser 100, and then flows through the inner cavity of the water channel 201. After cooling the water channel 201, it flows out from the water outlet nozzle, completing the entire water circulation cooling work. The purpose of cooling the water channel 201 is to cool the TEC cooling plate 203, because after the TEC cooling plate 203 is powered on, it needs to cool the heat generated by the terminal's interchangeable treatment head 300 after operation. The TEC cooling plate 203 will transfer the heat from the cooling surface to the hot surface, and finally take it away through the water channel 201. The TEC cooling plate 203 and the water channel 201 are connected by applying a thermal conductive material. The thermal conductive material includes thermal paste, thermal paste or graphene. The thermal conductivity of the thermal conductive material is 13.5~20W·m -1 ·K -1 The cooling plate 204 connects the TEC cooling sheet 203 and the treatment head 300, both to secure the connection and to transfer heat generated by the interchangeable treatment head 300 during operation to the TEC cooling sheet 203. In this embodiment, the cooling plate 204 is made of a highly thermally conductive ceramic material, which facilitates heat transfer. A thermally conductive material is also applied to the cooling plate 204 to form a connection between the TEC cooling sheet 203 and the treatment head 300.

[0041] like Figure 4 As shown, Figure 4This is an optical simulation diagram of the fast axis and slow axis. In terms of optics, when the semiconductor laser 100 is working normally, the collimating lens 102 is used to compress the fast-axis spot to emit light. Then, the slow-axis compression lens 205 is used to compress the spot in the slow-axis direction to the size required by the customer, and finally output. The angle of the slow-axis spot compression is relatively small, and the main purpose is to shape the astigmatism on both sides to obtain high beam quality. The slow-axis compression lens 205 is a non-standard convex lens that can reduce the overall spot size to the required size. It is made of high-purity quartz glass and is double-sidedly coated with a high damage threshold film system. The purpose is to increase the transmittance of light and reduce energy attenuation and damage to the slow-axis compression lens 205.

[0042] Furthermore, a first PCB probe 206 is provided at the top of the other end surface of the cooling plate 204; a second PCB probe 302 cooperating with the first PCB probe 206 is provided on the positioning surface of each interchangeable treatment head 300. The first PCB probe 206 detects the second PCB probe 302 to determine the spot area provided by the current interchangeable treatment head 300, and automatically switches to the electrical parameters suitable for the spot area to avoid errors in manual parameter adjustment and accidents.

[0043] The function of the magnetic component 207 is to adsorb the replaceable treatment head 300 onto the handle body 200. Because the treatment head 300 is replaceable, it is necessary to replace the treatment head 300 from time to time according to different treatment parts of the human body. Therefore, the magnetic component 207 is used for adsorption and mechanical positioning, which is more convenient and quick. After clinical use, it has high stability during the treatment process.

[0044] like Figure 5 The figure shows the structure of an interchangeable treatment tip. After the laser spot is initially shaped by the semiconductor laser 100 and the handle body 300, the slow-axis spot size is essentially set. Since the slow-axis spot size required for each treatment tip is consistent, only the overall fast-axis spot size needs to be changed to achieve variations in the spot area of ​​multiple interchangeable tips. The positioning surface of the interchangeable treatment tip 300 is coated with a thermally conductive material and connected to the cooling plate 204 of the handle body 200. This increases thermal conductivity and allows heat generated by the interchangeable treatment tip 300 to be transferred to the handle body 200, where it is removed by the TEC cooling plate 203.

[0045] In terms of optics, this embodiment can meet the needs of four light spot conversions, namely the first treatment head 310, the second treatment head 320, the third treatment head 330 and the fourth treatment head 340. Each treatment head has its own independent optical transmission method. Because the semiconductor laser 100 and the handle body 200 reduce the divergence angle of the fast axis and shape the slow axis, Figure 7As shown, the interchangeable treatment head 300 utilizes fast-axis compression lenses 311, 321, 331, and 341 to achieve overall variation in the fast-axis spot area. Each treatment head features a different fast-axis compression lens, designed and optically simulated based on the desired spot area. The front end utilizes sapphire lenses 312, 322, 332, and a nose hair lens 342 for optical output treatment. Sapphire's fast thermal conductivity, high hardness, and excellent transmittance improve the user experience and extend the lifespan. This optical solution, through theoretical simulation and actual testing, has demonstrated low optical transmittance loss, and all four models exhibit good spot area homogeneity. The fast-axis compression lenses are made of high-purity quartz glass and are coated on both sides with a high-damage threshold coating to increase light transmittance and minimize light loss.

[0046] Furthermore, considering that the requirements for four interchangeable spot sizes must be met across multiple power levels, different package sizes must be designed for each power level. This requires adjusting the distance between each laser chip 101 to ensure consistent spot size at different laser powers. Furthermore, spot homogeneity must be ensured. Therefore, neither too large nor too small a spacing between laser chips 101 will achieve uniform spot homogeneity. This is because too large a spacing between laser chips 101 will result in weak light on the luminous surface, resulting in poor spot homogeneity. However, too small a spacing between laser chips 101 will result in a smaller overall spot area, failing to meet the requirements for a large output spot size. Therefore, optical simulation and actual testing are required to ensure the subsequent beam shaping quality and spot area. Currently, this embodiment can accommodate four interchangeable spot sizes across five power levels, offering high versatility and reducing R&D and management costs. In this embodiment, the fast-axis compression lens and sapphire lens are bonded using sealing silicone rubber. This ensures a hermetic seal within the treatment head cavity, preventing the risk of condensation on the sapphire lens due to large temperature differences during use.

[0047] like Figure 6The inner planed surface of the fourth treatment head 340 is small because the entrance of the nose hair head 342 is small and the required spot area is also small. If the light spot compressed by the fast-axis compression lens 341 is directly input into the nose hair head 342, a large part of the light will be scattered into the interior of the fourth treatment head 340 or reflected back and forth, causing the treatment head to overheat and affect normal operation, resulting in a poor user experience. Only a small part of the light enters the nose hair head 342, resulting in low output energy and poor treatment effect. Therefore, the light spot compressed by the fast-axis compression lens 341 needs to be focused. Therefore, a set of focusing lenses 343 is added to achieve this. The light spot is compressed 360° to a certain diameter before entering the nose hair head 342, which can solve the problems of low transmission efficiency and light leakage. Because the market requires that the nose hair head 342 can rotate 360° without dead angles, a rotating sleeve 344 is added to fix and position the nose hair head 342 and the other to rotate it. The function of the sealing ring 345 is to connect the rotating sleeve 344 and the No. 4 treatment head 340 through overpressure, which can not only ensure that the rotating sleeve 344 drives the nose hair head 342 to rotate smoothly, but also has a certain damping so that it does not move during the treatment process. It can also ensure that the cavity of the No. 4 treatment head 340 is sealed to prevent condensation.

[0048] In addition, during normal treatment, since the light spot is diffusely reflected when it hits the human body, some of the light will return to the cavity, causing the treatment head to overheat and affecting the experience. Therefore, the inner cavity of the replaceable treatment head 300 is polished and then the surface of the inner cavity is plated with bright gold. This method can ensure that more than 80% of the returned light will not stay on the inner wall of the treatment head, and return to the semiconductor laser 100 and the handle body 200 again. Because both of them have water cooling, most of the light will be absorbed and converted into heat, which will be carried away by the water channel.

[0049] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A multi-power interchangeable head semiconductor laser that facilitates spot conversion, characterized in that: include: A semiconductor laser (100) comprises a housing and a plurality of laser chips (101); one side of the housing has a light outlet and is provided with a window (103); the plurality of laser chips (101) are packaged in series within the housing and are close to the light outlet; a collimating lens (102) is provided between the emission end of each laser chip (101) and the window (103); An L-shaped handle body (200); the inner side surface of one plate surface of the handle body (200) is a mounting surface for the semiconductor laser (100) and is fixedly connected to the bottom of the housing; the other plate surface is provided with a first light channel that cooperates with the light outlet; the handle body (200) has a circulating water channel (201) inside; a slow axis compression lens (205), embedded on the outside of the other plate surface of the handle body (200), located at the first light channel; A TEC cooling plate (203), the heat surface of which is fixedly connected to the outer side of the other plate surface of the handle body (200) via a heat-conducting material, and exchanges heat through the water channel (201); A refrigeration plate (204) has one end surface fixedly connected to the refrigeration surface of the TEC refrigeration sheet (203) via a heat-conducting material; the TEC refrigeration sheet (203) and the refrigeration plate (204) are both provided with a second light channel cooperating with the first light channel; A plurality of replaceable treatment heads (300) are provided with a positioning surface and a tapered light-emitting end; a plurality of the replaceable treatment heads (300) are provided with fast-axis compression lenses of different focal lengths, and a lens or a nose hair head (342) is provided on the light-emitting end; the positioning surface of each replaceable treatment head (300) is detachably connected to the other end surface of the refrigeration plate (204).

2. The multi-power interchangeable head semiconductor laser for easy spot switching according to claim 1, characterized in that: A heat dissipation tooth channel is provided inside the shell and on one side of the laser chip (101); a water channel is provided inside the shell and is connected to one end of the heat dissipation tooth channel; a water inlet is provided at the bottom of the shell and is connected to the other end of the heat dissipation tooth channel, and a water outlet is provided at the bottom of the shell; The mounting surface of the handle body (200) is provided with an opening connected to the water inlet and the water outlet; the outer side of a plate surface of the handle body (200) is provided with a water inlet nozzle (202) and a water outlet nozzle connected to the water channel (201); wherein, water flows in from the water inlet nozzle (202), enters the hot tooth channel and the waterway through one of the openings, cools the semiconductor laser (100), flows through the water channel (201) to exchange heat with the TEC cooling plate (203), and then flows out from another point of the water outlet nozzle.

3. The multi-power interchangeable head semiconductor laser for easy spot switching according to claim 1, characterized in that: Positive and negative electrode leads (104) are provided on the outside of the shell; the plurality of laser chips (101) are connected to an external power source via the electrode leads (104).

4. The multi-power interchangeable head semiconductor laser for easy spot switching according to claim 1, characterized in that: The other end surface of the cooling plate (204) and the positioning surface of the replaceable treatment head (300) are both provided with a plurality of mutually cooperating magnetic attracting parts (207).

5. The multi-power interchangeable head semiconductor laser for easy spot switching according to claim 1, characterized in that: A first PCB probe (206) is provided at the top of the other end surface of the cooling plate (204); a second PCB probe (302) cooperating with the first PCB probe (206) is provided on the positioning surface of each of the replaceable treatment heads (300); the first PCB probe (206) detects the second PCB probe (302) to determine the light spot area currently provided by the replaceable treatment head (300).

6. The multi-power interchangeable head semiconductor laser for easy spot switching according to claim 1, characterized in that: When the light-emitting end of the replaceable treatment head (300) is a nose hair head (342), a group of focusing lenses (343) are provided between the nose hair head (342) and the fast-axis compression lens; a rotating sleeve (344) is provided at the end of the nose hair head (342), and a sealing ring (345) is fixed on the inner side of the rotating sleeve (344); the rotating sleeve (344) is rotationally engaged with the end of the light-emitting end, and the inner side of the rotating sleeve is frictionally engaged with the outer side of the end of the light-emitting end through the sealing ring (345).

7. The multi-power interchangeable head semiconductor laser for easy spot switching according to claim 6, characterized in that: The inner cavity of the replaceable treatment head (300) is polished and plated with bright gold.

8. The multi-power interchangeable head semiconductor laser for easy spot switching according to claim 1, characterized in that: The lens is a sapphire lens.

9. The multi-power interchangeable head semiconductor laser for easy spot switching according to claim 8, characterized in that: The fast axis compression lens and the sapphire lens are bonded and fixed by means of sealing silicone rubber.

10. The multi-power interchangeable head semiconductor laser for easy spot switching according to claim 1, characterized in that: The thermal conductive material is thermal paste, thermal paste or graphene; the thermal conductivity of the thermal conductive material is 13.5 to 20 W·m -1 ·K -1 .

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