Wafer transfer pad rapid prototyping glue dispenser and glue dispensing method

Abstract

The application discloses a wafer wafer turnover pad rapid forming glue dispensing machine, which comprises a glue supply mechanism, a rack, a loading platform, a first sliding rail, a first sliding block, a Y-axis sliding plate, an X-axis linear motor module, a Z-axis linear motor module and a glue dispensing mechanism, the glue supply mechanism is arranged at the back of the rack, the glue supply mechanism comprises a machine box, an A glue stirring storage barrel, a B glue stirring storage barrel, a vacuum pump, a glue outlet pipe and a control box, the glue dispensing mechanism comprises a fixing plate, a protection box body, a sliding plate, a glue dispensing control valve, a glue dispensing needle nozzle and a plasma rotary nozzle, the glue dispensing needle nozzle is arranged at the lower end of the glue dispensing control valve, the plasma rotary nozzle is arranged at the front end wall of the fixing plate, the plasma rotary nozzle is connected with a plasma processing machine, the glue dispensing control valve is electrically connected with the control box, and a wafer wafer turnover pad rapid forming glue dispensing method is further provided. The technical scheme of the application can effectively improve the glue dispensing efficiency, and the plasma rotary nozzle can be used for cleaning and dust removal.

Description

Technical Field

[0001] This invention relates to the field of dispensing machine technology, and in particular to a rapid prototyping dispensing machine and dispensing method for wafer turnover pads. Background Technology

[0002] A wafer, or chip, is the carrier used to produce integrated circuits. It typically refers to a single-crystal silicon wafer, called a wafer because of its circular shape. Various circuit element structures can be fabricated on silicon wafers to create IC products with specific electrical functions. With the rapid development of the electronics industry, chips have become core components in various electronic products. Their quality and performance directly affect the operation of the entire system. To ensure the stability and long lifespan of chips, chip packaging technology is a crucial step, and controlling the performance of the chip encapsulant has become a focus for researchers.

[0003] However, the dispensing devices commonly used in the market for wafers, chips, and transfer pads are cumbersome to operate, have low dispensing efficiency, and are prone to dust accumulation on the wafers after dispensing, which affects the quality of the dispensed products. Summary of the Invention

[0004] The main objective of this invention is to propose a rapid prototyping dispensing machine and dispensing method for wafer turnover pads, aiming to solve the problems of cumbersome operation and low dispensing efficiency of existing dispensing devices for wafers, wafers, and turnover pads, as well as the technical problems that dust easily appears on the wafers after dispensing, affecting the quality of the dispensed products.

[0005] To achieve the above objectives, the present invention proposes a rapid prototyping dispensing machine for wafer turnover pads, comprising a glue supply mechanism, a frame, a loading platform, a first slide rail, a first slider, a Y-axis sliding plate, an X-axis linear motor module, a Z-axis linear motor module, and a dispensing mechanism. The glue supply mechanism is located at the rear of the frame and includes a housing, an A-glue mixing and storage tank, a B-glue mixing and storage tank, a vacuum pump, a dispensing pipe, and a control box. The A-glue mixing and storage tank and the B-glue mixing and storage tank are arranged side by side at the upper end of the housing. Each of the A-glue mixing and storage tanks has a glue inlet pipe at its upper end. Each of the material hoppers has a glue inlet at its upper end. The vacuum pump is located on one side of the machine housing. The vacuum pump's outlet pipe is connected to both the A-glue mixing and storage hopper and the B-glue mixing and storage hopper. Flow control valves are located at the lower ends of both the A-glue and B-glue mixing and storage hoppers. One end of the glue outlet pipe is connected to each of the flow control valves. The control box is located at the upper end of the machine housing and is electrically connected to the flow control valves and the vacuum pump. Control buttons are located on the front wall of the control box. The loading platform is arranged side-by-side along its length at the front of the upper end of the frame. Limiters are provided around the upper wall of the loading platform on all four sides. The frame has a first slide rail parallel to the rear of the upper end of the frame. The first slider is slidably connected to the first slide rail to the left and right respectively. The Y-axis sliding plate is fixedly connected to the first slider. The X-axis linear motor module is horizontally positioned above the Y-axis sliding plate, with one end fixedly connected to the Y-axis sliding plate. The Z-axis linear motor module is vertically positioned in front of the X-axis linear motor module, and its slider is fixedly connected to the slider of the X-axis linear motor module. The dispensing mechanism is vertically positioned above the loading platform and includes a fixed plate, a protective housing, and a sliding... The system includes a moving plate, a dispensing control valve, a dispensing nozzle, and a plasma rotating nozzle. The fixed plate is fixedly connected to the slider of the Z-axis linear motor module. The protective housing covers the front end of the fixed plate. The sliding plate is slidably disposed at the front end of the fixed plate. The dispensing control valve is vertically disposed at the lower end of the front wall of the sliding plate. The other end of the dispensing tube is connected to the dispensing control valve. The dispensing nozzle is disposed at the lower end of the dispensing control valve. The plasma rotating nozzle is disposed at the lower end of the front wall of the fixed plate. The plasma rotating nozzle is connected to the plasma processor. The dispensing control valve is electrically connected to the control box.

[0006] Optionally, it also includes a Y-axis drive motor, a lead screw, and a nut. The Y-axis drive motor is located at one end of the frame, the two ends of the lead screw are connected to the two ends of the frame, the nut is screwed onto the lead screw, the output shaft of the Y-axis drive motor is connected to the lead screw, and the nut is fixedly connected to the Y-axis sliding plate.

[0007] Optionally, it also includes a Y-axis drive motor, a first synchronous pulley, a second synchronous pulley, and a synchronous belt. The Y-axis drive motor is disposed at one end of the frame. The first synchronous pulley is fixedly connected to the output shaft of the Y-axis drive motor. The second synchronous pulley is rotatably disposed at one end of the frame. The synchronous belt is connected to the first synchronous pulley and the second synchronous pulley respectively. The Y-axis sliding plate is fixedly connected to the synchronous belt.

[0008] Optionally, the dispensing mechanism further includes a first driving cylinder, a support plate, a second slide rail, and a second slider. The first driving cylinder is vertically disposed on the upper end of the fixed plate. The support plate protrudes from both sides of the front end wall of the lower end of the fixed plate. The second slide rail is disposed on the front end wall of the support plate. The second slider is slidably disposed on the second slide rail. The sliding plate is fixedly connected to the second slider, and the lower end of the cylinder rod of the first driving cylinder is fixedly connected to the upper end of the sliding plate.

[0009] Optionally, the dispensing mechanism further includes a crossbeam, a second drive cylinder, and a dispensing needle nozzle protective baffle. The crossbeam is fixedly connected to the lower end of the fixed plate. The second drive cylinder is horizontally disposed on the crossbeam. The dispensing needle nozzle protective baffle is fixedly connected to the cylinder rod of the second drive cylinder. The dispensing needle nozzle protective baffle may be disposed below the dispensing needle nozzle.

[0010] Optionally, the glue supply mechanism further includes a column and a bracket. The column is vertically disposed at the upper end of the chassis, the rear end of the bracket is rotatably connected to the upper end of the column, and the glue outlet tube is detachably and fixedly connected to the front end of the bracket.

[0011] Optionally, both the A-polymer mixing and storage tank and the B-polymer mixing and storage tank are provided with transparent liquid level limiting pipes on their side walls.

[0012] Optionally, both the A-polymer mixing and storage tank and the B-polymer mixing and storage tank are equipped with silicon piezoresistive pressure sensors on their side walls, and the silicon piezoresistive pressure sensors are electrically connected to the control box.

[0013] On the other hand, the present invention also proposes a rapid prototyping dispensing method for wafer turnover pads, which uses the aforementioned rapid prototyping dispensing machine for wafer turnover pads. The dispensing method includes the following steps:

[0014] S100: First, fill the A-polymer mixing tank and the B-polymer mixing tank with epoxy resin respectively, set the temperature inside the tank to 25 degrees Celsius, and stir evenly. Adjust the viscosity of the glue in the A-polymer mixing tank and the B-polymer mixing tank as needed. Adjust the mixing ratio of the A-polymer mixing tank and the B-polymer mixing tank as needed by adjusting the flow control valve at the bottom of the A-polymer mixing tank and the B-polymer mixing tank.

[0015] S200: The dispensing volume of the dispensing nozzle is adjusted by the dispensing control valve, and the dispensing volume of the dispensing nozzle is tested and calibrated by a balance.

[0016] S300: The loading platform is divided into 4 sections, each of which can hold 32 products to be glued, for a total of 128 products to be glued. Place the products to be glued on the first section at the front end of the loading platform, and manually press the control button on the front wall of the control box. The glue dispensing mechanism will then dispense glue onto the products on the first section at the front end of the loading platform one by one according to the set program until all products are glued.

[0017] S400: After the first section of the product to be glued is finished, the glue dispensing nozzle protective baffle slides to the left and below the glue dispensing nozzle to protect the glue dispensing nozzle. The plasma rotating nozzle is started and the plasma rotating nozzle performs plasma cleaning and dust removal on the products at the front end of the first section of the loading platform one by one according to the set program.

[0018] S500: While dispensing adhesive, the products to be dispensed are placed on the second, third, and fourth sections of the loading platform in a front-to-back order. The dispensing mechanism and the plasma rotary nozzle dispense adhesive and clean the products on the second, third, and fourth sections in a front-to-back order. At the same time, the products that have been dispensed and cleaned are removed and new products to be dispensed are placed. This process is repeated to achieve uninterrupted dispensing.

[0019] The technical solution of this invention has the following beneficial effects: In this invention, a Y-axis sliding plate is fixedly connected to a first slider; an X-axis linear motor module is horizontally positioned above the Y-axis sliding plate, with one end of the X-axis linear motor module fixedly connected to the Y-axis sliding plate; a Z-axis linear motor module is vertically positioned in front of the X-axis linear motor module; the sliders of the Z-axis linear motor module and the X-axis linear motor module are fixedly connected; a dispensing mechanism is vertically positioned in front of the loading platform; a fixing plate is fixedly connected to the slider of the Z-axis linear motor module; and a protective housing cover is installed... At the front end of the fixed plate, a sliding plate is slidably mounted on the front end of the fixed plate. A dispensing control valve is vertically mounted on the lower end of the front wall of the sliding plate. The other end of the dispensing tube is connected to the dispensing control valve. A dispensing nozzle is mounted on the lower end of the dispensing control valve. A plasma rotary nozzle is mounted on the lower end of the front wall of the fixed plate. The plasma rotary nozzle is connected to the plasma processor. The dispensing control valve is electrically connected to the control box. This effectively improves the dispensing efficiency of wafers, and the plasma rotary nozzle can remove dust from the wafers after dispensing, effectively improving the quality of the dispensed products. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the overall structure of a rapid prototyping dispensing machine for wafer turnover pads according to an embodiment of the present invention;

[0022] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0023] Figure 3 This is a schematic diagram of the overall structure of a rapid prototyping dispensing machine for wafer turnover pads according to an embodiment of the present invention from another perspective.

[0024] Figure 4 for Figure 3 Enlarged view of point B in the middle;

[0025] Figure 5 This is a partial structural schematic diagram of a rapid prototyping dispensing machine for wafer turnover pads according to an embodiment of the present invention;

[0026] Figure 6 This is a schematic diagram of another part of the structure of a rapid prototyping dispensing machine for wafer turnover pads according to an embodiment of the present invention;

[0027] Figure 7 This is a schematic diagram of another part of the structure of a rapid prototyping dispensing machine for wafer turnover pads according to an embodiment of the present invention.

[0028] Figure 8 This is a schematic diagram of another part of the structure of a rapid prototyping dispensing machine for wafer turnover pads according to an embodiment of the present invention.

[0029] Figure 9 This is a schematic diagram of the structure of the product to be glued using a rapid prototyping dispensing machine for wafer turnover pads according to an embodiment of the present invention.

[0030] Figure 10 This is a flowchart illustrating the rapid prototyping and dispensing method for wafer turnover pads according to an embodiment of the present invention.

[0031] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0033] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0034] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0035] This invention proposes a rapid prototyping dispensing machine and dispensing method for wafer turnover pads.

[0036] like Figures 1 to 9As shown, in one embodiment of the present invention, the wafer turnover pad rapid prototyping dispensing machine includes a glue supply mechanism 101, a frame 102, a loading platform 103, a first slide rail 104, a first slider (not shown), a Y-axis sliding plate 105, an X-axis linear motor module 106, a Z-axis linear motor module 107, and a dispensing mechanism 200. The glue supply mechanism 101 is located behind the frame 102. The glue supply mechanism 101 includes a housing 1011, an A-adhesive mixing and storage tank 1012, a B-adhesive mixing and storage tank 1013, a vacuum pump 1014, a dispensing pipe 1015, and a control box 1016. The A-adhesive mixing and storage tank 1012 and the B-adhesive mixing and storage tank 1013 are arranged side by side at the upper end of the housing 1011. Both the upper ends of the mixing and storage tanks 1012 and 1013 (both containing adhesive B) are equipped with an inlet pipe 1017, and the upper ends of the mixing and storage tanks 1012 and 1013 (both containing adhesive A) are equipped with an adhesive inlet 1018. A vacuum pump 1014 is located on one side of the casing 1011, and its outlet pipe is connected to both the mixing and storage tanks 1012 and 1013 (both containing adhesive B). The lower ends of the mixing and storage tanks 1012 and 1013 (both containing adhesive A) are equipped with flow control valves 1019, and one end of the outlet pipe 1015 is connected to each flow control valve 1019. A control box 1016 is located at the upper end of the casing 1011, and is electrically connected to the flow control valves 1019 and the vacuum pump 1014. Next, the front wall of the control box 1016 is equipped with control buttons (not shown). The loading platform 103 is arranged side by side along the length direction in front of the upper end of the frame 102. Limiting strips 1031 are provided around the upper wall of the loading platform 103. The first slide rail 104 is arranged parallel to the rear of the upper end of the frame 102. The first slider is slidably connected to the first slide rail 104 in the left and right directions. The Y-axis sliding plate 105 is fixedly connected to the first slider. The X-axis linear motor module 106 is horizontally arranged above the Y-axis sliding plate 105. One end of the X-axis linear motor module 106 is fixedly connected to the Y-axis sliding plate 105. The Z-axis linear motor module 107 is vertically arranged in front of the X-axis linear motor module 106. The Z-axis linear motor module 107 is fixedly connected to the Y-axis sliding plate 105 in the left and right directions. The slider of the X-axis linear motor module 106 is fixedly connected. The dispensing mechanism 200 is vertically arranged above the loading platform 103. The dispensing mechanism 200 includes a fixed plate 201, a protective housing 202, a sliding plate 203, a dispensing control valve 204, a dispensing nozzle 205, and a plasma rotating nozzle 206. The fixed plate 201 is fixedly connected to the slider of the Z-axis linear motor module 106. The protective housing 202 covers the front end of the fixed plate 201. The sliding plate 203 is slidably arranged in front of the fixed plate 201. The dispensing control valve 204 is vertically arranged at the lower end of the front wall of the sliding plate 203. The other end of the dispensing tube 1015 is connected to the dispensing control valve 204. The dispensing nozzle 205 is arranged at the lower end of the dispensing control valve 204.A plasma rotary nozzle 206 is disposed at the lower end of the front wall of the fixed plate 201. The plasma rotary nozzle 206 is connected to a plasma treatment machine (not shown), and the dispensing control valve 204 is electrically connected to the control box 1016.

[0037] Specifically, it also includes a Y-axis drive motor 108, a lead screw (not shown), and a nut (not shown). The Y-axis drive motor 108 is located at one end of the frame 102, the two ends of the lead screw are connected to the two ends of the frame 102, the nut is screwed onto the lead screw, the output shaft of the Y-axis drive motor 108 is connected to the lead screw, and the nut is fixedly connected to the Y-axis sliding plate 105.

[0038] Specifically, it also includes a Y-axis drive motor 108, a first synchronous pulley (not shown), a second synchronous pulley (not shown), and a synchronous belt (not shown). The Y-axis drive motor 108 is disposed at one end of the frame 102. The first synchronous pulley is fixedly connected to the output shaft of the Y-axis drive motor 108. The second synchronous pulley is rotatably disposed at one end of the frame 102. The synchronous belt is connected to the first synchronous pulley and the second synchronous pulley respectively. The Y-axis sliding plate 105 is fixedly connected to the synchronous belt.

[0039] Specifically, the dispensing mechanism 200 also includes a first driving cylinder 207, a support plate 208, a second slide rail 209, and a second slider (not shown). The first driving cylinder 207 is vertically disposed on the upper end of the fixed plate 201. The support plate 208 protrudes from both sides of the front end wall of the lower end of the fixed plate 201. The second slide rail 209 is disposed on the front end wall of the support plate 208. The second slider is disposed on the second slide rail 209 in a way that allows it to slide up and down. The sliding plate 203 is fixedly connected to the second slider, and the lower end of the cylinder rod of the first driving cylinder 207 is fixedly connected to the upper end of the sliding plate 203.

[0040] Specifically, the dispensing mechanism 200 also includes a crossbeam 209, a second drive cylinder 210, and a dispensing needle nozzle protective baffle 211. The crossbeam 209 is fixedly connected to the lower end of the fixed plate 201. The second drive cylinder 210 is horizontally arranged on the crossbeam 210. The dispensing needle nozzle protective baffle 211 is fixedly connected to the cylinder rod of the second drive cylinder 210. The dispensing needle nozzle protective baffle 211 can be located below the dispensing needle nozzle 205. The dispensing needle nozzle is protected by the dispensing needle nozzle protective baffle to prevent the temperature of the plasma rotating nozzle from affecting the glue in the dispensing needle nozzle.

[0041] Specifically, the glue supply mechanism 101 also includes a column 10110 and a bracket 10111. The column 10110 is vertically arranged at the upper end of the housing 1011. The rear end of the bracket 10111 is rotatably connected to the upper end of the column 10110. The glue dispensing pipe 1015 is detachably and fixedly connected to the front end of the bracket 10111. The bracket effectively protects the glue dispensing pipe.

[0042] Specifically, there are four loading platforms 103, each of which can accommodate 32 products 300 to be dispensed.

[0043] Specifically, both the A-adhesive mixing and storage tank 1012 and the B-adhesive mixing and storage tank 1013 are equipped with transparent liquid level limiting tubes 10112 on their side walls, which allows for easy viewing of the liquid level of the adhesive inside the A-adhesive mixing and storage tank 1012 and the B-adhesive mixing and storage tank 1013, facilitating the replenishment of adhesive.

[0044] Specifically, both the side walls of the A-polymer mixing and storage tank 1012 and the B-polymer mixing and storage tank 1013 are equipped with silicon piezoresistive pressure sensors 10113. The silicon piezoresistive pressure sensors 10113 are electrically connected to the control box 1016, thereby enabling accurate measurement of the internal pressure of the A-polymer mixing and storage tank 1012 and the B-polymer mixing and storage tank 1013.

[0045] On the other hand, such as Figure 10 As shown, this invention also proposes a rapid prototyping dispensing method for wafer turnover pads, using the aforementioned rapid prototyping dispensing machine for wafer turnover pads. The dispensing method includes the following steps:

[0046] S100: First, fill the A-polymer mixing tank and the B-polymer mixing tank with epoxy resin respectively, set the temperature inside the tank to 25 degrees Celsius, and stir evenly. Adjust the viscosity of the glue in the A-polymer mixing tank and the B-polymer mixing tank as needed. Adjust the mixing ratio of the A-polymer mixing tank and the B-polymer mixing tank as needed by adjusting the flow control valve at the bottom of the A-polymer mixing tank and the B-polymer mixing tank.

[0047] S200: The dispensing volume of the dispensing nozzle is adjusted by the dispensing control valve, and the dispensing volume of the dispensing nozzle is tested and calibrated by a balance.

[0048] S300: The loading platform is divided into 4 sections, each of which can hold 32 products to be glued, for a total of 128 products to be glued. Place the products to be glued on the first section at the front end of the loading platform, and manually press the control button on the front wall of the control box. The glue dispensing mechanism will then dispense glue onto the products on the first section at the front end of the loading platform one by one according to the set program until all products are glued.

[0049] S400: After the first section of the product to be glued is finished, the glue dispensing nozzle protective baffle slides to the left and below the glue dispensing nozzle to protect the glue dispensing nozzle. The plasma rotating nozzle is started and the plasma rotating nozzle performs plasma cleaning and dust removal on the products at the front end of the first section of the loading platform one by one according to the set program.

[0050] S500: While dispensing adhesive, the products to be dispensed are placed on the second, third, and fourth sections of the loading platform in a front-to-back order. The dispensing mechanism and the plasma rotary nozzle dispense adhesive and clean the products on the second, third, and fourth sections in a front-to-back order. At the same time, the products that have been dispensed and cleaned are removed and new products to be dispensed are placed. This process is repeated to achieve uninterrupted dispensing, which effectively improves dispensing efficiency and is easy to operate.

[0051] Specifically, in this invention, a Y-axis sliding plate is fixedly connected to a first slider. An X-axis linear motor module is horizontally positioned above the Y-axis sliding plate, with one end of the X-axis linear motor module fixedly connected to the Y-axis sliding plate. A Z-axis linear motor module is vertically positioned in front of the X-axis linear motor module, and the sliders of the Z-axis linear motor module and X-axis linear motor modules are fixedly connected. A dispensing mechanism is vertically positioned in front of the loading platform. A fixed plate is fixedly connected to the slider of the Z-axis linear motor module. A protective housing is fitted onto the front end of the fixed plate. The sliding plate is slidably mounted on the front end of the fixed plate. The dispensing control valve is vertically mounted on the lower end of the front wall of the sliding plate. The other end of the dispensing tube is connected to the dispensing control valve. The dispensing nozzle is mounted on the lower end of the dispensing control valve. The plasma rotary nozzle is mounted on the lower end of the front wall of the fixed plate. The plasma rotary nozzle is connected to the plasma processor. The dispensing control valve is electrically connected to the control box. This effectively improves the dispensing efficiency of wafers, and the plasma rotary nozzle can be used to clean dust after dispensing, effectively improving the quality of the dispensed products.

[0052] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A wafer wafer handling pad rapid prototyping dispenser, characterized in that, The application relates to a glue feeding mechanism, a rack, a loading platform, a first sliding rail, a first sliding block, a Y-axis sliding plate, an X-axis linear motor module, a Z-axis linear motor module and a glue feeding mechanism, wherein the glue feeding mechanism is arranged at the back of the rack; the glue feeding mechanism comprises a machine box, A-gum stirring storage barrels, B-gum stirring storage barrels, a vacuum pump, glue outlet pipes and a control box; the A-gum stirring storage barrels and the B-gum stirring storage barrels are arranged side by side at the upper end of the machine box; the upper ends of the A-gum stirring storage barrels and the B-gum stirring storage barrels are provided with glue inlet pipes; the upper ends of the A-gum stirring storage barrels and the B-gum stirring storage barrels are respectively provided with glue inlet openings; the vacuum pump is arranged at one side of the machine box; the air outlet pipes of the vacuum pump are respectively connected with the A-gum stirring storage barrels and the B-gum stirring storage barrels; the lower ends of the A-gum stirring storage barrels and the B-gum stirring storage barrels are respectively provided with flow control valves; one end of the glue outlet pipes is respectively connected with the flow control valves; the control box is arranged at the upper end of the machine box; the control box is electrically connected with the flow control valves and the vacuum pump; the front end wall of the control box is provided with control buttons; the loading platform is arranged side by side in the length direction in front of the upper end of the rack; limiting strips are arranged around the upper end wall of the loading platform; the first sliding rail is arranged in parallel at the back of the upper end of the rack; the first sliding blocks are respectively connected with the first sliding rail in the left and right sliding modes; the Y-axis sliding plate is fixedly connected with the first sliding blocks; the X-axis linear motor module is horizontally arranged above the Y-axis sliding plate; one end of the X-axis linear motor module is fixedly connected with the Y-axis sliding plate; the Z-axis linear motor module is vertically arranged in front of the X-axis linear motor module; the Z-axis linear motor module is fixedly connected with the sliding blocks of the X-axis linear motor module; the glue feeding mechanism is vertically arranged above the loading platform; the glue feeding mechanism comprises a fixed plate, a protective box body, a sliding plate, a glue feeding control valve, a glue feeding needle nozzle and a plasma rotating nozzle; the fixed plate is fixedly connected with the sliding blocks of the Z-axis linear motor module; the protective box body is arranged on the front end of the fixed plate; the sliding plate is arranged on the front end of the fixed plate in the up and down sliding mode; the glue feeding control valve is vertically arranged at the lower end of the front end wall of the sliding plate; the other end of the glue outlet pipe is connected with the glue feeding control valve; the glue feeding needle nozzle is arranged at the lower end of the glue feeding control valve; the plasma rotating nozzle is arranged at the lower end of the front end wall of the fixed plate; the plasma rotating nozzle is connected with a plasma processing machine; the glue feeding control valve is electrically connected with the control box. The glue feeding mechanism further comprises a cross beam, a second driving cylinder and a glue feeding needle nozzle protection baffle; the cross beam is fixedly connected with the lower end of the fixed plate; the second driving cylinder is horizontally arranged on the cross beam; the glue feeding needle nozzle protection baffle is fixedly connected with the cylinder rod of the second driving cylinder; the glue feeding needle nozzle protection baffle is arranged below the glue feeding needle nozzle; the glue feeding needle nozzle is protected by the glue feeding needle nozzle protection baffle; the temperature of the plasma rotating nozzle does not affect the glue in the glue feeding needle nozzle.

2. The wafer wafer-handling-pad rapid prototyping dispenser of claim 1, wherein, The application further comprises a Y-axis driving motor, a lead screw and a nut; the Y-axis driving motor is arranged at one end of the rack; the lead screw is arranged at both ends of the rack; the nut is arranged on the lead screw; the output shaft of the Y-axis driving motor is connected with the lead screw; and the nut is fixedly connected with the Y-axis sliding plate.

3. The wafer wafer-handling-pad rapid prototyping dispenser of claim 1, wherein, The Y-axis driving motor is arranged at one end of the rack, the first synchronous pulley is fixedly connected with the output shaft of the Y-axis driving motor, the second synchronous pulley is rotatably arranged at one end of the rack, and the synchronous belt is connected with the first synchronous pulley and the second synchronous pulley respectively.

4. The wafer wafer-handling-pad rapid prototyping dispenser of claim 1, wherein, The dispensing mechanism further comprises a first driving cylinder, a support plate, a second sliding rail and a second sliding block. The first driving cylinder is vertically arranged at the upper end of the fixed plate. The support plate is protruded on both sides of the front end wall of the lower end of the fixed plate. The second sliding rail is arranged on the front end wall of the support plate. The second sliding block is vertically arranged on the second sliding rail. The sliding plate is fixedly connected with the second sliding block. The lower end of the cylinder rod of the first driving cylinder is fixedly connected with the upper end of the sliding plate.

5. The wafer wafer-handling-pad rapid prototyping dispenser of claim 1, wherein, The glue supply mechanism further comprises a stand and a support. The stand is vertically arranged at the upper end of the case. The rear end of the support is rotatably connected with the upper end of the stand. The glue outlet pipe is detachably fixedly connected with the front end of the support.

6. The wafer wafer-handling-pad rapid prototyping dispenser of claim 1, wherein, The side walls of the A glue stirring storage barrel and the B glue stirring storage barrel are provided with transparent liquid level limiting pipes.

7. The wafer wafer-handling-pad rapid prototyping dispenser of claim 1, wherein, The side walls of the A glue stirring storage barrel and the B glue stirring storage barrel are provided with silicon piezoresistive pressure sensors, which are electrically connected with the control box.

8. The wafer wafer-handling-pad rapid prototyping dispenser of claim 1, wherein, The diameter of the lower end of the plasma rotating nozzle is 80 mm.

9. The dispensing method of the wafer wafer transfer pad rapid prototyping dispensing machine according to any one of claims 1-8, characterized in that, The dispensing method comprises the following steps: S100: First, fill the A glue stirring storage barrel and the B glue stirring storage barrel with epoxy resin glue respectively, set the temperature in the barrels to 25 degrees, and stir uniformly. Adjust the viscosity of the glue in the A glue stirring storage barrel and the B glue stirring storage barrel as needed. Adjust the mixing ratio of the A glue stirring storage barrel and the B glue stirring storage barrel by adjusting the flow control valve at the lower end of the A glue stirring storage barrel and the B glue stirring storage barrel. S200: Adjust the glue output of the dispensing needle nozzle through the dispensing control valve, and test and calibrate the glue output of the dispensing needle nozzle through the balance. S300: The loading platform is divided into four sections, each of which can place 32 products to be dispensed, a total of 128 products to be dispensed. Place the products to be dispensed on the first section at the front end of the loading platform. Press the control button on the front end wall of the control box manually. Dispense the products to be dispensed on the first section at the front end of the loading platform one by one according to the set program through the dispensing mechanism until all the products are dispensed. S400: When the dispensing of the products to be dispensed on the first section is completed, the dispensing needle nozzle protection baffle slides to the lower side of the dispensing needle nozzle to protect the dispensing needle nozzle. Start the plasma rotating nozzle and clean the products on the first section at the front end of the loading platform one by one according to the set program through the plasma rotating nozzle. S500: while dispensing, the products to be dispensed are placed on the second section, the third section and the fourth section on the loading platform in the order from front to back, and the dispensing mechanism and the plasma rotating nozzle dispense and clean the products to be dispensed on the second section, the third section and the fourth section in the order from front to back, while the products that have been dispensed and cleaned are taken off and new products to be dispensed are placed, and the process is repeated to realize uninterrupted dispensing.

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