A potted pulse power type capacitor

Abstract

A kind of potting pulse power type capacitor, including capacitor body, plastic package shell, potting layer and mounting seat, capacitor body includes two supports arranged oppositely and multiple capacitor chips arranged in two supports in upper and lower interval, support includes multiple support plates arranged in upper and lower interval, connecting pin vertically arranged between multiple support plates and fixed plate respectively arranged on multiple support plates for fixedly connecting pin;Plastic package shell includes interval arrangement accommodating cavity and stress cavity, the capacitor body is arranged in accommodating cavity;Potting layer is arranged in accommodating cavity, for fixing capacitor body;Mounting seat includes mounting seat body, installation slot for installing plastic package shell is arranged on mounting seat and clamping piece for fixing plastic package shell is arranged on mounting seat body;The structure of the present application specifically limits support, so that multiple capacitor chips are arranged in upper and lower interval, enough deformation space can be twisted and deformed to a certain extent as a whole in the moment of bearing impact without affecting its reliability.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of capacitor preparation, and particularly relates to a potting pulse power capacitor. BACKGROUND

[0002] The pulse capacitor can store the charging energy of a small power source to the capacitor in a long time interval, and rapidly release the stored energy in a short time interval to form a strong impact current and a strong impact power. The pulse capacitor is mainly used in the fields of high voltage test technology, high energy physics, laser technology, oscillation loop, geological prospecting, etc.

[0003] The existing pulse capacitor is mainly used for ignition, detonation and explosion, and therefore needs to have sufficient high impact resistance. SUMMARY

[0004] The application aims to overcome the defects of the prior art, and provides a potting pulse power capacitor.

[0005] The application adopts the following technical scheme:

[0006] The potting pulse power capacitor comprises a capacitor body, a plastic sealing shell, a potting layer and a mounting seat.

[0007] The capacitor body comprises two supports arranged oppositely and a plurality of capacitor chips arranged in the two supports in an up-down interval, the support comprises a plurality of support plates arranged in an up-down interval, a connecting pin arranged vertically between the plurality of support plates and a fixing plate arranged on each of the plurality of support plates for fixing the connecting pin, and the plurality of support plates are opposite to the end portions of the plurality of capacitor chips.

[0008] The plastic sealing shell comprises a containing cavity and a stress cavity arranged in an interval, and the capacitor body is arranged in the containing cavity.

[0009] The potting layer is arranged in the containing cavity and is used for fixing the capacitor body.

[0010] The mounting seat comprises a mounting seat body, a mounting groove arranged on the mounting seat body and used for mounting the plastic sealing shell and a clamping piece arranged on the mounting seat body and used for fixing the plastic sealing shell.

[0011] Further, the plastic sealing shell comprises a main body section and an arc-shaped stress section arranged on one side of the main body section, the containing cavity is arranged in the main body section, the stress cavity is arranged in the arc-shaped stress section, and the potting layer is arranged in the containing cavity and is used for fixing the capacitor body.

[0012] Further, the mounting base body is provided with a fixing groove extending downward from the top surface thereof, the clamping piece comprises a clamping piece body in inverted U shape and two support segments oppositely arranged at the lower end of the clamping piece body, when the plastic package shell is fixed in the mounting groove, the arc-shaped stress receiving segment is located above the main body segment, the clamping piece body is sleeved on the outer periphery of the plastic package shell, and the support segments are supported in the fixing groove.

[0013] Further, the mounting base further comprises a fixing mechanism for fixing the clamping piece in the fixing groove, the fixing mechanism comprises a fixing screw hole extending downward from the bottom surface of the fixing groove, a positioning hole arranged on the support segment opposite to the fixing screw hole, and a fixing bolt penetrating through the positioning hole and cooperating with the fixing screw hole.

[0014] Further, the plastic package shell further comprises a plurality of partition plates arranged in the stress receiving cavity, and the plurality of partition plates separate the stress receiving cavity into a plurality of first cavities and a plurality of second cavities arranged alternately.

[0015] Further, the plastic package shell further comprises a plurality of potting strips arranged in the second cavities respectively, and the plurality of potting strips are arranged in the stress receiving cavity at intervals.

[0016] Further, the connecting pin comprises a plurality of connecting segments arranged outside the plurality of support plates, a curved avoiding segment connected between adjacent two connecting segments, and a pin segment connected with the upper end connecting segment, and the curved avoiding segment is opposite to the interval between the adjacent two capacitor chips.

[0017] Further, the fixing plate is formed with a fixing groove extending outward from the inner side thereof for fixing the pin.

[0018] Further, the support plate is provided with a first air permeable hole opposite to the end of the capacitor chip, and the fixing plate is provided with a second air permeable hole opposite to the first air permeable hole.

[0019] Further, the inner wall of the accommodating cavity is provided with a plurality of reinforcing ribs at intervals.

[0020] From the above description of the present application, compared with the prior art, the beneficial effects of the present application are: by limiting the structure of the pulse capacitor, the structure of the capacitor body and the structure of the plastic package shell are improved, the structure of the support is specifically limited, the plurality of capacitor chips are arranged at intervals, and the capacitor chips are arranged with large gaps, sufficient deformation space is left for the overall torsional deformation to a certain extent without affecting the reliability; in addition, the structure of the existing plastic package shell is changed, the arc-shaped stress receiving segment is increased, and the structure of the arc-shaped stress receiving segment is further limited, so that the arc-shaped stress receiving segment as the stress receiving direction can absorb impact stress and extrude deformation when bearing high impact, reduce the impact on the capacitor body, so that the prepared pulse capacitor has extremely strong shock resistance and adaptability, and has extremely high reliability.BRIEF DESCRIPTION OF DRAWINGS BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a structural schematic diagram of the present application;

[0022] Figure 2 is an exploded schematic diagram of the present application;

[0023] Figure 3 is a partial structural schematic diagram of the present application;

[0024] Figure 4 is a structural schematic diagram of the plastic package shell;

[0025] Figure 5 is a structural schematic diagram of the capacitor body;

[0026] Figure 6 is an exploded schematic diagram of the capacitor body;

[0027] Figure 7 is a structural schematic diagram of the connecting pin;

[0028] Figure 8 is a structural schematic diagram of the fixing plate;

[0029] In the drawings, 1 is a capacitor body, 2 is a plastic package shell, 3 is a potting layer, 4 is a mounting seat, 11 is a support, 12 is a capacitor chip, 13 is a support plate, 131 is a first air hole, 14 is a connecting pin, 141 is a connecting section, 142 is a bending avoiding section, 143 is a pin section, 15 is a fixing plate, 151 is a fixing groove, 152 is a second air hole, 21 is a containing cavity, 211 is a reinforcing rib, 22 is a stress cavity, 23 is a main body section, 24 is an arc-shaped stress section, 25 is a partition plate, 26 is a potting strip, 27 is a reinforcing rib, 28 is a first cavity, 29 is a second cavity, 41 is a mounting seat body, 411 is a fixing groove, 42 is a mounting groove, 43 is a clamping piece, 431 is a clamping piece body, 432 is a supporting section, 44 is a carrier plate, 45 is a fixing mechanism, 451 is a fixing screw hole, 452 is a positioning hole, 453 is a fixing bolt, and 454 is a fixing nut. DETAILED DESCRIPTION

[0030] The present application is further described below through a specific embodiment.

[0031] Referring to Figures 1 to 8 the drawings, an anti-impact pulse capacitor includes a capacitor body 1, a plastic package shell 2, a potting layer 3, and a mounting seat 4.

[0032] The capacitor body 1 includes two oppositely arranged supports 11 and a plurality of capacitor chips 12 arranged in the two supports 11 in an up-down interval.

[0033] The support 11 comprises a plurality of support plates 13 arranged in an up-down interval, a connecting pin 14 arranged vertically between the plurality of support plates 13, and a plurality of fixing plates 15 arranged on the plurality of support plates 13 respectively for fixing the connecting pin 14, wherein the plurality of support plates 13 are opposite to the end of the plurality of capacitor chips 12; specifically, the fixing plate 15 is formed with a fixing groove 151 extending from the inner side to the outside for fixing the connecting pin 14, and the fixing groove 151 is arranged in a U shape, allowing the connecting pin 14 to have displacement and deformation in the fixing groove 151; further, the support plate 13 is provided with a first air hole 131 opposite to the end of the capacitor chip 12, and the fixing plate 151 is provided with a second air hole 152 opposite to the first air hole 131, through the first air hole 131 and the second air hole 152, the gas generated by the solder during reflow soldering is discharged outward; by limiting the structure of the support 11, the support plate 13 is arranged to wrap the end of the capacitor chip 12, the fixing plate 15 is arranged to limit and fix the connecting pin 14, the overall stress area of the end of the capacitor chip 12 and the overall structural strength of the support 1 are increased, and the arrangement of the support plate 13 and the fixing plate 15 inside and outside can ensure that the connecting pin 14 will not damage the end of the capacitor chip 12 during the stretching and deformation process.

[0034] The connecting pin 14 comprises a plurality of connecting segments 141 arranged outside the plurality of support plates 13, a bending avoiding segment 142 connected between the adjacent two connecting segments 141, and a pin segment 143 connected with the upper end connecting segment, wherein the bending avoiding segment 142 is opposite to the interval between the adjacent two capacitor chips 12, by limiting the structure of the connecting pin 14, the capacitor chips 12 are arranged with a large gap, and enough deformation space is left, so that the whole can be twisted and deformed to a certain extent without affecting its reliability in the instant of bearing impact, and the bending avoiding segment 142 is arranged opposite to the gap between the two capacitor chips 12, so that the connecting pin 14 can be stretched and deformed within a certain range, further improving the reliability of the capacitor; specifically, the connecting pin 14 is provided with two, and the two connecting pins 14 are arranged at intervals between the plurality of support plates 13;

[0035] The plastic sealing shell 2 comprises a plurality of accommodating cavities 21 and a plurality of stress cavities 22 which are arranged at intervals, wherein the capacitor body 1 is arranged in the accommodating cavities 21, and specifically, the plastic sealing shell 2 comprises a main body section 23 and an arc-shaped stress section 24 arranged on one side of the main body section 23, the accommodating cavities 21 are arranged in the main body section 23, and the stress cavities 22 are arranged in the arc-shaped stress section 24; by limiting the shape of the plastic sealing shell 2, when the pulse capacitor is installed, the arc-shaped stress section 24 is located above the main body section 23 in the direction of the impact force, and the arc-shaped stress section 24 is located above the main body section 23 in the direction of the impact force; when high impact is borne, the stress cavities 22 are deformed by extrusion, the impact stress is absorbed, and the impact borne by the capacitor body 1 is reduced; further, the plastic sealing shell 2 further comprises a plurality of partitions 25 arranged at intervals in the stress cavities 22, a plurality of filling strips 26 arranged at intervals in the stress cavities 22, and a plurality of reinforcing ribs 211 arranged at intervals on the inner wall of the accommodating cavities 21; the plurality of partitions 25 divide the stress cavities 22 into a plurality of first cavities 27 and a plurality of second cavities 28 which are arranged at intervals and alternately; the plurality of filling strips 26 are arranged in the plurality of second cavities 29, respectively; the structure in the stress cavities 22 is further limited; the plurality of filling strips 26 are arranged alternately; the strength of the stress cavities 22 is reduced; the stress cavities 22 are the weak part of the entire plastic sealing shell 2; when impact is borne, the stress cavities 22 can deform preferentially; and the stress cavities 22 also have a certain resetting capacity after deformation, thereby further improving the reliability of the capacitor.

[0036] The filling layer 3 is arranged in the accommodating cavities 21 and is used for fixing the capacitor body 1, and the end face of the filling layer 3 is flush with the end face of the main body section 23 of the plastic sealing shell; specifically, the plurality of reinforcing ribs 211 arranged at intervals in the accommodating cavities 21 can increase the contact area between the filling layer 3 and the inner wall of the accommodating cavities 21 after filling, so as to increase the bonding force between the filling layer 3 and the plastic sealing shell 2.

[0037] The mounting seat 4 is used for mounting the capacitor body 1 wrapped with the plastic sealing shell 2 on a circuit board, and comprises a mounting seat body 41, a mounting groove 42 arranged on the mounting seat body 41 and used for mounting the plastic sealing shell 2, a clamping piece 43 arranged on the mounting seat body 41 and used for fixing the plastic sealing shell 2, a carrier plate 44 arranged at the bottom of the mounting seat body 41, and a fixing mechanism 45 used for fixing the clamping piece 43 and the mounting seat body 41; specifically, the mounting seat body 41 is provided with a fixing groove 411 extending downward from the top face of the mounting seat body 41, and the bottom face of the fixing groove 411 is higher than the bottom face of the mounting groove 42, so as to limit the displacement of the capacitor body 1 in the direction of impact; further, the area of the carrier plate 44 is greater than the area of the mounting seat body 41.

[0038] The clamping piece 43 comprises a clamping piece body 431 arranged in an inverted U shape and two support sections 432 arranged at the lower ends of the two sides of the clamping piece body 431 oppositely; when the plastic sealing shell 2 is fixed in the mounting groove 42, the clamping piece body 431 is sleeved on the outer periphery of the plastic sealing shell 2, and the support sections 432 are supported in the fixing groove 411.

[0039] The fixing mechanism 45 comprises a fixing screw hole 451 extending downward from the bottom surface of the fixing groove 411 to the carrier plate 44, a positioning hole 452 arranged on the support section 432 opposite to the fixing screw hole 451, a fixing bolt 453 passing through the positioning hole 452 and matched with the fixing screw hole 451, and a fixing nut 454 matched with the fixing bolt 453 below the carrier plate 44. By arranging the fixing mechanism 45, the capacitor body 1 is clamped and fixed on the mounting seat 4, the capacitor vibration and the deformation of the bottom of the mounting seat body 41 are avoided, the transmission of the vibration and deformation of the carrier plate 44 is limited, the flatness of the carrier plate 44 is ensured, the stress area of the fixing bolt 453 is increased, and the stress concentration damage to the carrier plate 44 is avoided.

[0040] The application improves the structure of the capacitor body 1 and the plastic package shell 2 by limiting the structure of the pulse capacitor, specifically limits the structure of the bracket 11, arranges the plurality of capacitor chips 12 in an upper and lower interval, and arranges a large gap between the capacitor chips 12, so that sufficient deformation space is left to allow a certain degree of torsional deformation of the whole in the impact moment without affecting the reliability. In addition, the structure of the existing plastic package shell 2 is changed, the arc stress section 24 is increased, and the structure of the arc stress section 24 is further limited, so that the arc stress section 24 as the stress direction can absorb impact stress and extrude deformation when bearing high impact, reduce the impact on the capacitor body 1, so that the prepared pulse capacitor has strong shock resistance and adaptability, and has high reliability.

[0041] The above is only a preferred embodiment of the application, and cannot limit the range of the application. Equivalent changes and modifications made according to the application scope and content of the specification should still be within the scope of the application.

Claims

1. A potted pulse power capacitor, characterized in that: Includes the capacitor body, plastic casing, potting layer, and mounting base. The capacitor body includes two opposing supports and multiple capacitor chips spaced vertically between the two supports. Each support includes multiple support plates spaced vertically, connecting pins vertically arranged between the multiple support plates, and fixing plates respectively arranged on the multiple support plates for fixing the connecting pins. The multiple support plates are opposite to the ends of the multiple capacitor chips. The encapsulated housing includes a spaced-apart receiving cavity and a force-receiving cavity, with the capacitor body disposed in the receiving cavity; The potting layer, located within the receiving cavity, is used to fix the capacitor body; The mounting base includes a mounting base body, a mounting groove disposed on the mounting base for mounting a plastic encapsulated shell, and a clamping piece disposed on the mounting base body for fixing the plastic encapsulated shell; The encapsulated shell includes a main body section and an arc-shaped force-bearing section disposed on one side of the main body section. The receiving cavity is disposed in the main body section, the force-bearing cavity is disposed in the arc-shaped force-bearing section, and the potting layer is disposed in the receiving cavity to fix the capacitor body. The encapsulated housing also includes a plurality of partitions disposed in the force-bearing cavity, the plurality of partitions dividing the force-bearing cavity into a plurality of first cavities and a plurality of second cavities that are alternately arranged at intervals; The encapsulated shell also includes a plurality of potting strips respectively disposed in the second cavity, the plurality of potting strips being spaced apart in the stress cavity; The connection pins include multiple connection segments disposed on the outside of multiple support plates, a bending clearance segment connected between two adjacent connection segments, and a pin segment connected to the upper connection segment. The bending clearance segment is positioned relative to the spacing between two adjacent capacitor chips.

2. The potted pulse power capacitor according to claim 1, characterized in that: The mounting base body is provided with a fixing groove extending downward from its top surface. The clamping plate includes a clamping plate body arranged in an inverted U shape and two support sections arranged opposite to each other on both sides of the lower end of the clamping plate body. When the plastic-encapsulated shell is fixed in the mounting groove, the arc-shaped force-bearing section is located above the main body section, the clamping plate body is sleeved on the outer periphery of the plastic-encapsulated shell, and the support sections are supported in the fixing groove.

3. A potted pulse power capacitor according to claim 2, characterized in that: The mounting base also includes a fixing mechanism for fixing the clamping plate in the fixing groove. The fixing mechanism includes a fixing screw hole extending downward from the bottom of the fixing groove, a positioning hole on the support section opposite to the fixing screw hole, and a fixing bolt passing through the positioning hole and engaging with the fixing screw hole.

4. A potted pulse power capacitor according to claim 1, characterized in that: The fixing plate has a fixing groove extending outward from its inner side for fixing the connecting pin.

5. A potted pulse power capacitor according to claim 1, characterized in that: The support plate is provided with a first vent hole opposite to the end of the capacitor chip, and the fixing plate is provided with a second vent hole opposite to the first vent hole.

6. A potted pulse power capacitor according to claim 1, characterized in that: The inner wall of the receiving cavity is provided with multiple reinforcing ribs at intervals.

Images