An electrically controlled deformation structure for adjusting an absorbing frequency band and an implementation method thereof

Abstract

The application discloses an electrically-controlled deformation structure for adjusting an absorbing frequency band and an implementation method thereof, and belongs to the technical field of intelligent electromagnetic stealth structures. The electrically-controlled deformation structure for adjusting the absorbing frequency band comprises an electrically-controlled deformation scatterer structure array, a fixed substrate and a total control circuit. The electrically-controlled deformation scatterer structure array is composed of N electrically-controlled deformation scatterer structure units. The application adjusts the shape change of the electrically-controlled scatterer subunit, changes the resonant frequency of the corresponding scatterer subunit, and enables the electrically-controlled deformation structure to realize electrically-controlled wideband continuous adjustment of the absorbing frequency band. The random distribution of the space positions of the scatterer subunits enhances the electromagnetic coupling between the scatterer subunits, and enables the electrically-controlled deformation structure to have a wide-angle incident non-sensitive super-wideband absorbing capacity. The dynamic regulation and control of the electrically-controlled scatterer subunit is integrated with the electromagnetic resonant loss absorbing function, and the electrically-controlled deformation structure has the characteristics of simple preparation process, light weight and high mechanical reliability.

Description

Technical Field

[0001] This invention relates to a deformable structure for electromagnetic wave absorption stealth, which enables electronically controlled adjustment of the electromagnetic wave absorption frequency band, and belongs to the field of intelligent electromagnetic stealth structure technology. Background Technology

[0002] As a crucial supporting material for electromagnetic interference suppression and low-detectability technologies, absorbing materials have become a current research hotspot. With the gradual improvement of intelligent radar detection capabilities, even stealth materials with fixed absorption spectra face the risk of being detected by enemy radar. Therefore, dynamic absorbing materials have emerged. By loading active devices (such as PIN diodes, varactor diodes, MEMS, etc.) into electromagnetic absorbing structures, or by using intelligent dynamic methods to change the size of the material's electromagnetic absorbing structure, the working characteristics of the original electromagnetic absorbing structure can be maintained, while the absorption of electromagnetic waves can be dynamically controlled using active devices or smart materials. Currently, the most widely used active dynamic absorption control methods mainly include two types: one is loading diodes into the electromagnetic absorbing structure. The basic principle can be explained from the perspective of impedance matching. The on and off states of a PIN diode correspond to two different impedance characteristics, and for the subwavelength structure material loaded with a PIN diode, there are also two different matching states, which provides the possibility of switching absorption across different frequency bands. The other is dynamic electromagnetic absorption control based on graphene materials. Graphene materials can be used to create sandwich graphene capacitor structures filled with ionic liquids. These structures allow for dynamic modulation of electromagnetic wave absorption amplitude by controlling the carrier mobility of graphene through the application of a bias voltage. A graphene capacitor array can be considered equivalent to a metasurface structure with both capacitive and resistive effects; by changing the surface impedance of graphene, the resonant frequency can be dynamically modulated. Unlike static electromagnetic absorbing materials, tunable dynamic electromagnetic absorbing materials are often based on active device loading, which inevitably requires a power supply network design. Currently, many dynamic electromagnetic absorbing materials are limited to single-polarization response states due to the constraints of the power supply network. Alternatively, to achieve polarization-independent tunable band electromagnetic absorbing materials while avoiding the influence of the power supply network on absorption performance, the power supply network design often becomes quite complex. Besides using active electronic devices for absorption modulation, there are also modulation approaches that utilize smart materials and focus on the geometric dimensions of the material. This method utilizes the geometric deformation of smart materials (such as liquid crystal elastomers, hydrogels, and shape memory polymers) under external stimuli (temperature, current, humidity, etc.) to change the key geometric parameters of the electromagnetic wave absorption structure, thereby affecting the electromagnetic wave absorption frequency band. For example, the spacer layer of the interface loss type electromagnetic wave absorption structure can be replaced with an electrically deformable bulk material.

[0003] Currently, frequency band modulation of electromagnetic absorbing structures mainly relies on two methods: combinations of active electronic devices such as diodes and modulation using smart materials. However, both methods result in narrow bandwidths for the absorbing structures, limiting the adjustable bandwidth range. Furthermore, integrating electronic devices with composite materials is relatively complex, and issues such as the bonding strength at the composite interface cannot be effectively addressed. Separating smart material-driven modulation from the electromagnetic absorption function further increases the weight of the absorbing structure, failing to meet the lightweight requirements of electromagnetic absorbing structures. Summary of the Invention

[0004] To address the challenge of intelligent band modulation technology for electromagnetic absorbing material structures to meet the requirements of different electromagnetic environments, one objective of this invention is to propose an electrically controlled deformable structure that adjusts the absorption frequency band. By electrically controlling the shape change of the scatterer, the resonant frequency of the absorbing structure is affected, thereby achieving electromagnetic wave absorption frequency band modulation.

[0005] The second objective of this invention is to provide a method for fabricating an electrically controlled deformable structure that can adjust the absorption frequency band. This invention features lightweight construction and rapid, continuous deformation adjustment. The electrically controlled deformable structure enables continuous, broadband adjustment of the absorption frequency band. It gives the electrically controlled deformable structure an ultra-wideband absorption capability that is insensitive to wide-angle incident light. Furthermore, the electrically controlled deformable structure features a simple fabrication process, lightweight construction, and high mechanical reliability.

[0006] The objective of this invention is achieved through the following technical solution.

[0007] The present invention discloses an electrically controlled deformable structure for adjusting the absorption frequency band, comprising an array of electrically controlled deformable scattering structures, a fixed substrate, and a main control circuit.

[0008] The electrically controlled deformable scatterer structure array is composed of N electrically controlled deformable scatterer structure units.

[0009] The electrically controlled deformable scatterer structure unit includes an electrically controlled deformable scatterer subunit, a randomly distributed fixed frame, deformable scatterer subunit connecting wires, and a deformable scatterer structure control circuit board.

[0010] The electrically controlled deformable scatterer subunit adopts a material containing high electrical conductivity (1×10⁻⁶). 4 S / m~1×10 7 The electronically controlled deformation mechanism (S / m) is used to prepare the electronically controlled deformable scatterer subunit. This electronically controlled deformable scatterer subunit possesses both the ability to electronically change the subunit shape and the ability to scatter and resonate with electromagnetic waves.

[0011] Preferably, the electrically controlled scatterer subunit is achieved through a sequential lamination of a polydimethylsiloxane-polyimide-high-temperature pyrolytic graphene oxide (PDMS)-PI-PG material system via a thermal mismatch deformation mechanism. The thermal expansion coefficient of PDMS is one order of magnitude higher than that of PI and two orders of magnitude higher than that of PG. The PI material avoids the low reliability of the laminated structure caused by direct bonding between the elastic PDMS material and the easily delaminated, brittle PG material. The PG material has high electrical conductivity (1.2 × 10⁻⁶). 6 (S / m) characteristics. When current is passed into the PG layer circuit, the heat generated by the current-induced thermal effect in the PG material is transferred through the PI layer to the PDMS layer. Different thermal strains occur in the PDMS-PI-PG layers, causing instability and pre-bending deformation in the electrically controlled scatterer subunit laminated structure. By electrically adjusting the current in the PG layer, the radius of curvature of the open annular shape of the scatterer subunit is changed, thereby altering the electromagnetic resonant frequency and scattering capability of the scatterer.

[0012] The aforementioned randomly distributed fixed frame allows for a random spatial distribution of the electrically controlled scattering sub-units. This random spatial distribution enhances the electromagnetic coupling between the sub-units, enriches the electromagnetic resonant frequencies and electromagnetic scattering directions of the electrically controlled deformable scattering structure units, and thus greatly expands the wide-angle broadband absorption capability of the electrically controlled deformable scattering structure array.

[0013] Preferably, the randomly distributed fixed frame includes a left main support frame, a right main support frame, and several crossbeams. The left main support frame consists of irregularly shaped beams and support columns extending at both ends. The irregularly shaped beams include, but are not limited to, semi-elliptical, straight, and ridge-shaped beams. A pre-set protrusion structure at the tail end of each support column is used to connect and fix the randomly distributed fixed frame to the control circuit board of the deformable scatterer structure. The right main support frame is mirror-symmetrical to the left main support frame. Crossbeams connect the left and right main support frames and are evenly distributed along the irregularly shaped beams. Matching through holes are provided on the crossbeams for fixing the electrically controlled scatterer subunits. The spatial positions of the electrically controlled scatterer subunits are randomly distributed by mapping the rotation direction of the normal vector of the base surface around the randomly pre-set through holes. The base surface refers to the irregularly shaped column surface formed by the irregularly shaped beams of the left main support frame and the connected crossbeams, or the irregularly shaped column surface formed by the irregularly shaped beams of the right main support frame and the connected crossbeams.

[0014] The connecting wires of the deformable scatterer subunits enable electrical communication between the electrically controlled scatterer subunits.

[0015] Preferably, the connecting wires of the deformable scatterer subunits connect the electrically controlled scatterer subunits arranged in series along each crossbeam of the randomly dispersed fixed frame, and then connect the series circuits in parallel to achieve electrical connection of all electrically controlled scatterer subunits. Two main parallel circuits, used to power all electrically controlled scatterer subunits, are fabricated using rigid metal flat wires that have been bent and deformed. The ends of the wires in the two main parallel circuits are formed into bent pins that connect to the corresponding interfaces of the deformable structure control circuit board.

[0016] The aforementioned deformation structure control circuit board is used to achieve the following three functions:

[0017] Function 1: Provides electrical energy for the deformation of the electronically controlled deformable scatterer structure unit and regulates the voltage at the two main parallel circuit terminals of the connecting wires of the deformable scatterer subunit; Function 2: Provides a reflective backplate for the electromagnetic resonance loss and electromagnetic scattering of the electronically controlled deformable scatterer structure unit; Function 3: Connects and fixes the relative positions of the randomly dispersed fixed frame and the fixed substrate.

[0018] Preferably, the deformable structure control circuit board includes through holes at four corners for fixing the randomly distributed fixing frame, through holes at four corners for supplying power to the electrically controlled scattering subunit, through holes at four midpoints for fixing and connecting the deformable structure control circuit board and the fixing substrate, and a built-in double-layer circuit. The through holes at the four corners for fixing the randomly distributed fixing frame match the protruding support pillars of the left and right support frames in the randomly distributed fixing frame. The through holes at the four corners for supplying power to the electrically controlled scattering subunit match the shape of the ends of the two main parallel circuit wires in the connecting wires of the deformable scattering subunit. The through holes at the four midpoints for fixing and connecting the deformable structure control circuit board and the fixing substrate match the corresponding screw holes on the fixing substrate. The built-in double-layer circuit is divided into an upper layer circuit and a lower layer circuit, with the side closer to the randomly distributed fixing frame being the upper layer circuit and the other side being the lower layer circuit. The upper layer circuit is an all-metal layer serving as a reflective backplate. The lower-level circuit and the deformable scatterer subunit are connected by two main parallel circuit wires through preset through holes, which provide power to the deformable scatterer structure unit and regulate the voltage at both input ends.

[0019] The fixed substrate is used to fix the electrically controlled deformable scatterer structural units to form an array of electrically controlled deformable scatterer structures with a preset distribution pattern.

[0020] Preferably, the fixed substrate consists of a perforated substrate and bolt-connecting posts. The perforation positions of the perforated substrate match the distribution pattern of the preset N electrically controlled deformable scatterer structural units. The bottom of the spiral-connecting post is fixedly connected to the perforated substrate at the perforation position. The top of the spiral-connecting post is fixedly connected to the corresponding midpoint through-hole positions of the four sides of the deformable structure control circuit board in the electrically controlled deformable scatterer structural unit.

[0021] The overall control circuit provides power to the deformation structure control circuit boards in the N electrically controlled deformable scatterer structural units. The N electrically controlled deformable scatterer structural units are interconnected.

[0022] Preferably, the overall control circuit includes a control terminal, a communication conversion module, a high-power power supply, and connecting wires. The positive and negative terminals of the deformation structure control circuit boards in the N electrically controlled deformable scatterer structural units are connected in parallel to each other and then connected to the high-power power supply. The deformation structure control circuit boards, communication conversion module, and control terminal in the N electrically controlled deformable scatterer structural units are connected in series using wires for communication.

[0023] The static absorption bandwidth of the electrically controlled deformable structure is determined by the geometric parameters, pre-bending radius of curvature, and random distribution density in free space of the electrically controlled deformable scatterer sub-units. The dynamic frequency modulation function of the electrically controlled deformable structure is achieved by adjusting the radius of curvature of the electrically controlled deformable scatterer sub-units.

[0024] The working method of an electrically controlled deformable structure for adjusting the absorption frequency band disclosed in this invention is as follows:

[0025] The input voltages of N electrically controlled deformable scatterer structural units are set at the control terminal. The signals are transmitted to the deformation structure control circuit board in each electrically controlled deformable scatterer structural unit via the communication conversion module in the main control circuit. The voltage at the ends of the two main parallel circuit wires in the connecting wires of the deformable scatterer subunits is adjusted by the lower circuit in the deformation structure control circuit board. This, in turn, adjusts the current in the electrically controlled scatterer subunits, thereby changing the pre-bending curvature radius of the electrically controlled scatterer subunits that are randomly dispersed in three-dimensional space by the randomly dispersed fixed frame. Ultimately, this changes the electromagnetic resonant absorption frequency and electromagnetic scattering capability of the electrically controlled deformable scatterer structural array, thus adjusting the electromagnetic absorption frequency band of the electrically controlled deformable scatterer structural array.

[0026] The present invention discloses a method for manufacturing an electrically controlled deformable structure that adjusts the absorption frequency band as follows:

[0027] Step 1: Fabrication of the series circuit of the electrically controlled scattering subunits: Following a pre-designed series pattern of multiple electrically controlled scattering subunits, a high-power fiber laser is used to cut a PG film to fabricate the conductive layer of the series circuit. The PG pattern of the series circuit is transferred onto the adhesive side of PI tape to form a PI-PG laminate structure. PDMS prepolymer and the corresponding curing agent are uniformly mixed at a mass ratio of 10:1 to 2.5:1. A certain thickness of the PDMS prepolymer-curing agent mixture is applied to the adhesive-free side of the PI-PG laminate structure using a scraper. The uncured PDMS-PI-PG laminate structure is placed in an oven for 2.5 to 4 hours for thermosetting. The PDMS-PI-PG laminate structure is then removed from the oven and allowed to cool naturally to room temperature. First, a high-power CO2 laser is used to cut a polyester sheet according to a preset PI layer pattern to prepare a PI layer pattern template, and the position of the laser head is recorded. Then, the thermosetting PDMS-PI-PG laminate structure is aligned with the polyester template. Finally, the laminate structure of the electronically controlled scattering body sub-unit series circuit shape is obtained by in-situ laser cutting along the preset PI layer pattern.

[0028] Preferably, the electronically controlled scatterer sub-unit portion of the PG layer cut pattern in the series circuit of the electronically controlled scatterer sub-unit is a rectangular structure with serpentine wiring inside. The electronically controlled scatterer sub-units are connected in series on the same side using a long rectangular structure, and parallel connection terminals are left at both ends of the series circuit.

[0029] Preferably, the edge of the PI layer cutting pattern of the series circuit of the electrically controlled scatterer subunit surrounds the PG layer cutting pattern, and the tail of the series side of the PG layer cutting pattern of each electrically controlled scatterer subunit is cut into a chamfered structure to facilitate connection and fixation with the through hole structure at the corresponding position of the randomly dispersed fixed frame.

[0030] Step 2: Parallel fabrication of series circuits for electrically controlled scattering sub-units: Repeat step (1) to obtain several laminated structures of series circuits for electrically controlled scattering sub-units. Connect the laminated structures of series circuits for electrically controlled scattering sub-units in parallel using the reserved parallel terminals at both ends to form a complete scattering circuit.

[0031] Preferably, the parallel fabrication of the series circuit of the electrically controlled scattering sub-units is achieved through an integrated process using rigid metal wires, heat shrink tubing with an opening on one side of the wall, and tin rings. The number of openings on the heat shrink tubing wall and the number of tin rings are consistent with the number of series circuits of the electrically controlled scattering sub-units. First, multiple tin rings are placed 1mm to 3mm away from the corresponding openings on the side wall of the heat shrink tubing. Then, one end of the parallel terminal of several series circuits of electrically controlled scattering sub-units is embedded into the corresponding opening on the side wall of the heat shrink tubing and passes through the corresponding tin ring. The same operation is then performed to connect the other end of several series circuits of electrically controlled scattering sub-units. Next, rigid metal wires are inserted into the heat shrink tubing connected in parallel at both ends of several series circuits of electrically controlled scattering sub-units. Finally, a hot air gun is used to shrink the heat shrink tubing while melting the tin rings, forming an electrical path with the parallel terminals of several series circuits of electrically controlled scattering sub-units and the rigid metal wires. This completes the parallel connection of several series circuits of electrically controlled scattering sub-units.

[0032] Preferably, the rigid metal conductor is an exposed copper conductor with a rectangular cross-section.

[0033] Step 3: Fabrication of the randomized and fixed frame: The randomized and fixed frame is fabricated using 3D printing technology.

[0034] As a preferred option, nylon material (PA12) is prepared by 3D printing using multi-jet melting technology, with a dielectric constant of 2.6 and a loss tangent of 0.06.

[0035] Step 4: Integration of the electrically controlled scattering sub-units with the randomly distributed fixed frame: The series-parallel circuit layered structure of several electrically controlled scattering sub-units obtained in Step 2 is integrated with the randomly distributed fixed frame obtained in Step 3 to realize the spatial random distribution of the electrically controlled scattering sub-units.

[0036] Preferably, the tail of the electrically controlled scatterer subunit is pre-reserved with a chamfered structure and embedded in the random rotation through-hole of the crossbeam in the randomly dispersed fixing frame.

[0037] Step 5: Fabrication of the Deformable Structure Control Circuit Board: Using a CNC machine tool, three sets of through holes are machined on the insulating substrate, each set containing four through holes. The first set of through holes is used to fix the randomly distributed fixing frame, arranged at the four corner points according to a preset schedule. The second set of through holes is used to power the electrically controlled scattering subunit, arranged at the four corner points according to a preset schedule and distinct from the first set of through holes. The third set of through holes is used to fix and connect the deformable structure control circuit board and the fixing substrate, arranged at the midpoints of the four sides according to a preset schedule. The deformable structure control circuit board is fabricated using a double-layer circuit built into the aforementioned perforated insulating substrate using printed circuit board technology. The double-layer circuit is located close to both sides of the deformable structure control circuit board; one layer is an all-metal layer serving as a reflective backplate, and the other layer is the deformable scattering structure unit control circuit layer.

[0038] Step 6: Connect and assemble the deformable structure control circuit board obtained in Step 5 with the randomized fixed frame in the randomized dispersed electronically controlled scatterer subunit integrated structure obtained in Step 4.

[0039] Preferably, the corresponding through holes reserved in the deformation structure control circuit board are connected to the ends of the two main parallel circuit wires of the deformation scatterer subunit connecting wire.

[0040] Preferably, the corresponding through holes reserved in the deformation structure control circuit board are connected and fixed to the protruding structures at the ends of the support columns of the left and right support beams in the randomly distributed fixed frame.

[0041] Step 7: Fabrication of the electrically controlled deformable scatterer structure array: Repeat steps 1 to 6 to obtain N electrically controlled deformable scatterer structure units.

[0042] Step 8: Fabrication and Assembly of the Fixed Substrate and the Electro-Controlled Deformable Scattering Body Structure Array: The fixed substrate is fabricated using laser cutting to create connecting through-holes according to a preset arrangement of N electro-controlled deformable scattering body structure units. One end of the connecting post is connected to the corresponding position of the through-hole on the fixed substrate, and the other end is connected and fixed to the N electro-controlled deformable scattering body structure units according to the preset arrangement.

[0043] As a preferred option, the N processing electronically controlled deformable scatterer structural units are arranged in an orthogonal checkerboard pattern.

[0044] Step Nine: Integration of the Main Control Circuit, Fixed Substrate, and Electrically Controlled Deformable Scattering Body Structure Array: Metal wires are used to connect the control terminal of the main control circuit in series with the communication conversion module and the deformation structure control circuit boards of the N electrically controlled deformable scattering body structure units for communication. Metal wires are used to connect the positive and negative terminals of the deformation structure control circuit boards of the N electrically controlled deformable scattering body structure units in parallel, and then connect them in series with a high-power power supply to obtain the electrically controlled deformable structure that adjusts the absorption frequency band.

[0045] Beneficial effects:

[0046] 1. The present invention discloses an electrically controlled deformable structure for adjusting the absorption frequency band and its implementation method, which adopts the method of adjusting the shape change of the electrically controlled scattering sub-unit to change the resonant frequency of the corresponding scattering sub-unit, so that the electrically controlled deformable structure can realize the electrically controlled broadband continuous adjustment of the absorption frequency band.

[0047] 2. The present invention discloses an electrically controlled deformable structure for adjusting the absorption frequency band and its implementation method. By randomly dispersing a fixed frame, the electrically controlled scattering sub-units are randomly dispersed in free space. The random distribution of the spatial positions of the scattering sub-units enhances the electromagnetic coupling between the scattering sub-units, enriches the electromagnetic resonant frequency and electromagnetic scattering direction of the electrically controlled deformable scattering structure unit, and enables the electrically controlled deformable structure to have an ultra-wideband absorption capability that is insensitive to wide-angle incident radiation.

[0048] 3. The present invention discloses an electrically controlled deformable structure for adjusting the absorption frequency band and its implementation method, which integrates the dynamic control of the electrically controlled scattering subunit with the electromagnetic resonance loss absorption function, so that the electrically controlled deformable structure has the characteristics of simple manufacturing process, lightweight and high mechanical reliability. Attached Figure Description

[0049] Figure 1 The diagram shows the electrically controlled deformation structure of the 3×3 checkerboard array distribution arrangement electromagnetic absorption frequency band provided by this invention.

[0050] Figure 2 This is a structural unit diagram of an electrically controlled deformable scatterer provided by the present invention;

[0051] Figure 3 A flowchart illustrating the process of fabricating a scatterer circuit using a series-connected electrically controlled deformable scatterer subunit provided by this invention.

[0052] Figure 4 The randomized, distributed, fixed frame design diagram provided by this invention;

[0053] Figure 5 The electromagnetic parameters of PA12 material provided for this invention are: (a) relative permittivity and (b) relative permeability.

[0054] Figure 6 The deformable scatterer structure control circuit board provided by the present invention includes (a) the component attachment surface and (b) the non-component attachment surface.

[0055] Figure 7 The results of the unenergized reflectivity of the 3×3 checkerboard array of electrically adjustable deformable structure in the electromagnetic absorption frequency band provided by this invention;

[0056] Figure 8 Test results of reflectivity curves corresponding to different combinations of energized states of different units in the 3×3 checkerboard array of the electromagnetic absorption frequency band provided by the present invention: (a) Case 1, (b) Case 2, (c) Case 3, (d) Case 4, (e) Case 5, (f) Case 6;

[0057] Figure 1 In the middle: 1-Electrically controlled deformable scatterer structure array; 2-Fixed substrate; 3-Main control circuit;

[0058] Figure 2 In the middle: 1.1-Electrically controlled deformable scatterer subunit; 1.2-Randomly dispersed fixed frame; 1.3-Deformable scatterer subunit connecting wires; 1.4-Deformable scatterer structure control circuit board. Detailed Implementation

[0059] Exemplary embodiments of the present invention will now be described in detail. This detailed description should not be considered as a limitation of the present invention, but rather as a more detailed description of certain aspects, features, and embodiments of the present invention. It should be understood that the terminology used in this invention is merely for describing particular embodiments and is not intended to limit the present invention.

[0060] Furthermore, regarding the numerical ranges in this invention, it should be understood that each intermediate value between the upper and lower limits of the range is also specifically disclosed. Every smaller range between any stated value or intermediate value within a stated range, and any other stated value or intermediate value within said range, is also included within this invention. The upper and lower limits of these smaller ranges may be independently included or excluded from the range.

[0061] Unless otherwise stated, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. While only preferred methods and materials have been described herein, any methods and materials similar or equivalent to those described herein may be used in the implementation or testing of this invention. All references to this specification are incorporated by way of citation to disclose and describe methods and / or materials associated with those references. In the event of any conflict with any incorporated reference, the content of this specification shall prevail.

[0062] Various modifications and variations can be made to the specific embodiments described in this specification without departing from the scope or spirit of the invention, as will be apparent to those skilled in the art. Other embodiments derived from this specification will also be apparent to those skilled in the art. This specification and embodiments are merely exemplary.

[0063] The terms “comprising,” “including,” “having,” “containing,” etc., used in the invention description are all open-ended terms, meaning that they include but are not limited to.

[0064] The present invention will now be further described in conjunction with the accompanying drawings and embodiments.

[0065] Example

[0066] like Figure 1 As shown, a 3×3 checkerboard array of electrically controlled adjustable deformable structures in the electromagnetic absorption frequency band is arranged, including an electrically controlled deformable scatterer structure array 1, a fixed substrate 2, and a main control circuit 3.

[0067] The electrically controlled deformable scatterer structure array 1 consists of nine electrically controlled deformable scatterer structure units.

[0068] like Figure 2As shown, the electrically controlled deformable scatterer structure unit includes an electrically controlled deformable scatterer subunit 1.1, a randomly distributed fixed frame 1.2, deformable scatterer subunit connecting wires 1.3, and a deformable scatterer structure control circuit board 1.4.

[0069] Electrically controlled deformable scatterer subunit 1.1, such as Figure 3 As shown, a PDMS-PI-PG laminate material system is used, wherein the electrical conductivity of the PG material is 1.2 × 10⁻⁶. 6 S / m.

[0070] Randomly distributed fixed frame 1.2, such as Figure 4 As shown, PA12 material was prepared by 3D printing using multi-jet melting technology. The relative permittivity and relative permeability of the 3D-printed PA12 material are as follows: Figure 5 (a) and Figure 5 As shown in (b), the randomly distributed fixed frame 1.2 consists of a left main support frame, a right main support frame, and several crossbeams. The left main support frame consists of an irregularly shaped beam and support columns extending from both ends. The irregularly shaped beam is semi-elliptical. A pre-set protrusion structure at the tail end of the support columns is used to connect and fix the randomly distributed fixed frame to the control circuit board of the deformable scatterer structure. The right main support frame is mirror-symmetrical to the left main support frame. The crossbeams connecting the left and right main support frames are evenly distributed along the irregularly shaped beam. Matching through holes are provided on the crossbeams for fixing the electrically controlled scatterer subunits.

[0071] The connecting wires of the deformable scatterer subunits enable electrical communication between the electrically controlled scatterer subunits.

[0072] The deformable scatterer subunits are connected in series by connecting wires, first linking the electrically controlled scatterer subunits arranged along each crossbeam of the randomly distributed fixed frame, and then connecting the series circuits in parallel to achieve electrical connectivity between all the electrically controlled scatterer subunits. Two main parallel circuits, used to power all the electrically controlled scatterer subunits, are fabricated using rigid metal flat wires that have been bent and deformed. The ends of the wires in the two main parallel circuits are formed into bent pins that connect to the corresponding interfaces on the deformable structure control circuit board.

[0073] Deformable scatterer structure control circuit board 1.4, such as Figure 6 As shown, where Figure 6 (a) indicates that the components are arranged in a concentrated manner on one side. Figure 6 (b) indicates the side where non-components are arranged.

[0074] The deformable structure control circuit board includes through holes at four corners for fixing the randomly distributed fixing frame, through holes at four corners for supplying power to the electrically controlled scattering subunit, through holes at four midpoints for fixing and connecting the deformable structure control circuit board and the fixing substrate, and a built-in double-layer circuit. The through holes at the four corners for fixing the randomly distributed fixing frame match the protruding support pillars of the left and right support frames in the randomly distributed fixing frame. The through holes at the four corners for supplying power to the electrically controlled scattering subunit match the shape of the ends of the two main parallel circuit wires in the connecting wires of the deformable scattering subunit. The through holes at the four midpoints for fixing and connecting the deformable structure control circuit board and the fixing substrate match the corresponding screw holes on the fixing substrate. The built-in double-layer circuit is divided into an upper layer circuit and a lower layer circuit, with the side closer to the randomly distributed fixing frame being the upper layer circuit and the other side being the lower layer circuit. The upper layer circuit is an all-metal layer serving as a reflective backplate. The lower-level circuit and the deformable scatterer subunit are connected by two main parallel circuit wires through preset through holes, which provide power to the deformable scatterer structure unit and regulate the voltage at both input ends.

[0075] The fixed substrate consists of a perforated substrate and bolt-connecting posts. The perforation positions of the perforated substrate match the pre-defined distribution pattern of nine electrically controlled deformable scatterer structural units. The bottom of the spiral connecting post is fixedly connected to the perforated substrate at the perforation position. The top of the spiral connecting post is fixedly connected to the corresponding midpoint through-hole positions of the four sides of the deformation structure control circuit board in the electrically controlled deformable scatterer structural unit.

[0076] The aforementioned main control circuit provides power to the deformation structure control circuit boards in the nine electrically controlled deformable scatterer structural units. The nine electrically controlled deformable scatterer structural units are interconnected.

[0077] The main control circuit includes a control terminal, a high-power power supply, an RS485 communication conversion module, a PCB board, and randomly distributed electronically controlled deformable sub-units interconnected by wires. The main control circuit receives a 20V input and can arbitrarily adjust the voltage of the randomly distributed electronically controlled deformable sub-units from 3V to 18V. The demonstration experiment involved the control terminal sending commands to achieve voltage changes from 3V to 8V at the electronically controlled deformable sub-units.

[0078] In the specific implementation of the characterization of the electrically controlled adjustable deformable structure array, a standard board of the same height and size as the 3×3 checkerboard PCB board array was first prepared and placed on the test bench for calibration. Then, the 3×3 checkerboard array structure of the electromagnetic absorption frequency band was placed on the test bench to obtain the corresponding reflectivity curve. The test results of the reflectivity curve of the array structure in the unpowered state are as follows: Figure 7 As shown, this exhibits broadband electromagnetic stealth performance. The test results of the reflectivity curves corresponding to six different combinations of unit energization states of this array structure are as follows: Figure 8 (a) to Figure 8As shown in (f), by changing the voltage across the random scattering structure unit at the control terminal, the electromagnetic scattering performance of the random scattering structure array can be controlled, mainly manifested in the shifting of bandwidth and return loss peak values.

[0079] The working method of an electrically controlled deformable structure for adjusting the absorption frequency band disclosed in this embodiment is as follows:

[0080] The input voltage of the nine electrically controlled deformable scattering structure units in the 3×3 chessboard array is set at the control terminal. The signal is transmitted to the deformation structure control circuit board 1.4 in each electrically controlled deformable scattering structure unit through the communication conversion module in the main control circuit 3. The voltage at the ends of the two main parallel circuit wires in the connecting wires 1.3 of the deformable scattering subunit is adjusted by the lower circuit in the deformation structure control circuit board 1.4, thereby adjusting the current in the electrically controlled scattering subunit 1.1. This achieves the change of the pre-bending curvature radius of the electrically controlled scattering subunit 1.1, which is randomly dispersed in three-dimensional space by the randomly dispersed fixed frame 1.2. Ultimately, this changes the electromagnetic resonance absorption frequency and electromagnetic scattering capability of the electrically controlled deformable scattering structure array 1, thereby adjusting the electromagnetic absorption frequency band of the electrically controlled deformable scattering structure array 1.

[0081] The method for manufacturing an electrically controlled deformable structure that adjusts the absorption frequency band disclosed in this embodiment is as follows:

[0082] Step 1, Electronically Controlled Scattering Subunit 1.1 Series Circuit Fabrication: (e.g.) Figure 3As shown, following a pre-defined series pattern of multiple electrically controlled scattering subunits 1.1, a high-power fiber laser is used to cut a PG film to fabricate the conductive layer of the series circuit for the electrically controlled scattering subunits 1.1. The PG film thickness is 15μm, the number of loops is set to 2, the opening gap is 0.05mm, the subunit length is 24mm, the subunit width is 9mm, the number of subunits connected in series is 5, the line width of the PG material connecting the subunits in series is 1.5mm, and the parallel terminals at both ends of the series-connected electrically controlled subunits are 6mm long and 5mm wide. A PI tape with a thickness of 20μm is used to transfer the electrically controlled scattering subunits 1.1 to form a PI-PG laminated series circuit onto a high-temperature resistant glass substrate. Because the 1.5mm line width PG material in the series connection of the subunits is prone to breakage, a PI tape with a thickness of 30μm is then laminated to reinforce the series connection circuit portion. The PDMS prepolymer and corresponding curing agent were uniformly mixed at a mass ratio of 10:1. A 250μm layer of the PDMS prepolymer-curing agent mixture was applied using a doctor blade to the side of the PI-PG laminate where the PI tape was not adhered. To ensure that the PDMS coating was applied only to one side of the PI layer subunit, a 1.5mm wide and 50μm thick PI tape was then laminated onto the current PI layer surface, overlapping the series circuit connection portion. The uncured PDMS-PI-PG laminate attached to the glass substrate was placed in an oven and thermocured at a constant temperature of 126°C for 2.5 hours. Afterward, the PDMS-PI-PG laminate was removed from the oven and allowed to cool naturally to room temperature. Remove the 1.5mm linewidth PI tape that was previously bonded to the PI layer, then remove the uncut PDMS-PI-PG laminate structure from the glass substrate, align it with the PG pattern part of the outer frame of the PI layer cutting pattern mold made of PET sheet, and then use a high-power CO2 laser to cut in situ according to the preset pattern of the PI layer to obtain the PDMS-PI-PG laminate structure electronically controlled scattering body subunit 1.1 series circuit.

[0083] The part of the electrically controlled scattering subunit 1.1 in the PG layer of the series circuit of the series scattering subunit 1.1 is a rectangular structure with serpentine wiring inside. The parts of the electrically controlled scattering subunits 1.1 are connected in series on the same side using a long rectangular structure, and parallel connection terminals are left at both ends of the series circuit.

[0084] The PI layer cutting pattern of the series circuit of the electrically controlled scattering subunit 1.1 surrounds the PG layer cutting pattern, and the tail of the series circuit of the PG layer cutting pattern of each electrically controlled scattering subunit 1.1 is cut into a chamfered structure to facilitate connection and fixation with the through hole structure at the corresponding position of the randomly dispersed fixed frame 1.2.

[0085] Step 2: Parallel fabrication of the series circuit of the electrically controlled scatterer subunit 1.1: Repeat step (1) to obtain several series circuit laminated structures of the electrically controlled scatterer subunit 1.1. Connect the several series circuit laminated structures of the electrically controlled scatterer subunit 1.1 in parallel using the reserved parallel terminals at both ends to form a complete scatterer circuit.

[0086] The parallel fabrication of the series circuit of the electrically controlled scattering subunit 1.1 is achieved through an integrated process using rigid metal wires, heat shrink tubing with an opening on one side of the wall, and tin rings. The number of openings on the heat shrink tubing wall and the number of tin rings are consistent with the number of series circuits of the electrically controlled scattering subunit 1.1. First, multiple tin rings are placed 1 mm away from the corresponding openings on the side wall of the heat shrink tubing. Then, one end of the parallel terminal of several series circuits of the electrically controlled scattering subunit 1.1 is embedded into the corresponding opening on the side wall of the heat shrink tubing and passes through the corresponding tin ring. The same operation is then performed to connect the other end of several series circuits of the electrically controlled scattering subunit 1.1. Next, rigid metal wires are inserted into the heat shrink tubing connected in parallel at both ends of several series circuits of the electrically controlled scattering subunit 1.1. Finally, a hot air gun is used to shrink the heat shrink tubing and melt the tin rings, forming an electrical path with the parallel terminals of several series circuits of the electrically controlled scattering subunit 1.1 and the rigid metal wires. This completes the parallel connection of several series circuits of the electrically controlled scattering subunit 1.1.

[0087] Hard metal conductors are exposed copper conductors with a rectangular cross-section.

[0088] Step 3, Randomly Dispersed Fixed Frame 1.2 Preparation: As shown in the figure Figure 4 As shown, a randomly dispersed fixed frame was prepared by 3D printing PA12 material using multi-jet melting technology.

[0089] The semi-elliptical base surface of the random base shell has a major axis radius of 30mm, a minor axis radius of 5mm, an overall height of 15mm, an elliptical outer frame width of 5mm, and a parallel heat shrink tubing fixing groove wall thickness of 0.5mm. The semi-elliptical base surface of the random base shell has 5×5 randomly rotated rectangular through-holes, each with a length of 9.1mm, a width of 1mm, and a wall thickness of 0.8mm. The five rectangular through-holes are connected in series with a beam width of 3mm and a thickness of 1.5mm. The outwardly protruding rectangular connecting posts at the four corners of the random base shell have a length of 2.3mm and a width of 1.6mm. In the parallel process of multiple series-connected electrically controlled deformable scattering subunits 1.1, the inner diameter of the heat shrink tubing before shrinkage is 3mm, and the heat shrinkage ratio is 2.5; the cross-sectional length of the hard copper wire is 1.5mm, and the width is 0.7mm. Five series-connected electronic control sub-units are connected in parallel to form an overall scattering circuit. The PI layer at the tail of each electronic control sub-unit is inserted into the through hole according to the corresponding random rotating through hole position.

[0090] Step 4: Integration of the electrically controlled scattering subunit 1.1 with the randomly distributed fixed frame 1.2: The series-parallel circuit layered structure of several electrically controlled scattering subunits 1.1 obtained in step (2) is integrated with the randomly distributed fixed frame 1.2 obtained in step (3) to realize the spatial random distribution of the electrically controlled scattering subunits 1.1.

[0091] The electrically controlled scatterer subunit 1.1 is embedded and fixed with a pre-reserved chamfered structure at the tail and a randomly distributed fixed frame 1.2 with a crossbeam randomly rotating through hole.

[0092] Step 5, Fabrication and preparation of the deformation structure control circuit board: (e.g.) Figure 6 As shown, a CNC machine tool is used to process three sets of through holes on the insulating substrate, each set containing four through holes. The first set of through holes is used to fix the randomly distributed fixing frame 1.2, and is arranged at the four corner points according to a preset arrangement. The second set of through holes is used to power the electrically controlled scattering subunit 1.1, and is arranged at the four corner points according to a preset arrangement, distinct from the first set of through holes. The third set of through holes is used to fix and connect the deformable structure control circuit board 1.4 and the fixing substrate 2, and is arranged at the midpoint of the four sides according to a preset arrangement. The deformable structure control circuit board 1.4 is fabricated on the basis of the aforementioned perforated insulating substrate using a double-layer circuit built-in by printed circuit board technology. The double-layer circuit is located close to the two sides of the deformable structure control circuit board. One layer is an all-metal layer as a reflective backplate, and the other layer is the deformable scattering structure unit control circuit layer.

[0093] Step Six: Connect and assemble the deformable structure control circuit board 1.4 obtained in Step Five with the randomly distributed fixed frame 1.2 in the integrated structure of the randomly distributed electrically controlled scatterer subunit 1.1 obtained in Step Four. Connect the corresponding through holes reserved in the deformable structure control circuit board 1.4 to the two main parallel circuit wires of the deformable scatterer subunit connecting wire 1.3. This step obtains the electrically controlled deformable scatterer structure unit, such as... Figure 2 As shown.

[0094] The corresponding through holes reserved in the deformation structure control circuit board 1.4 will be connected and fixed to the end protruding structures of the support columns of the left and right support beams in the randomly distributed fixed frame 1.2.

[0095] Step 7: Fabrication of the electrically controlled deformable scatterer structure array 1: Repeat steps 1 to 6 to obtain nine electrically controlled deformable scatterer structure units.

[0096] Step 8: Fabrication and Assembly of the Fixed Substrate 2 and the Electrically Controlled Deformable Scattering Body Structure Array 1: The fixed substrate is fabricated by laser cutting through holes according to the preset arrangement of nine electrically controlled deformable scattering body structure units. One end of the connecting post is connected to the corresponding position of the through hole on the fixed substrate, and the other end is connected and fixed to the nine electrically controlled deformable scattering body structure units according to the preset arrangement.

[0097] The nine processed electronically controlled deformable scatterer structural units are arranged in an orthogonal checkerboard pattern.

[0098] Step Nine: Integration of the main control circuit 3, fixed substrate 2, and electrically controlled deformable scatterer structure array 1: The control terminal of the main control circuit 3 is connected in series with the communication conversion module and the deformable structure control circuit boards 1.4 in the nine electrically controlled deformable scatterer structure units using metal wires. The positive and negative terminals of the deformable structure control circuit boards 1.4 in the nine electrically controlled deformable scatterer structure units are connected in parallel using metal wires, and then connected in series with a high-power power supply to obtain the electrically controlled deformable structure that adjusts the absorption frequency band. Figure 1 As shown.

[0099] The above detailed description further illustrates the purpose, technical solution, and beneficial effects of the invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An electrically controlled deformation structure for adjusting the absorption frequency band, characterized in that: It includes an electronically controlled deformable scatterer structure array (1), a fixed substrate (2), and a main control circuit (3); The electrically controlled deformable scatterer structure array (1) is composed of N electrically controlled deformable scatterer structure units; The electrically controlled deformable scatterer structure unit includes an electrically controlled deformable scatterer subunit (1.1), a randomly distributed fixed frame (1.2), deformable scatterer subunit connecting wires (1.3), and a deformable scatterer structure control circuit board (1.4); The electrically controlled deformable scatterer subunit (1.1) is prepared using an electrically controlled deformation mechanism incorporating a high-conductivity material, wherein the high conductivity range is 1×10⁻⁶. 4 S / m~1×10 7 S / m; The electrically controlled deformable scatterer subunit (1.1) has both the ability to electrically change the shape of the subunit and the ability to scatter and resonate to lose electromagnetic waves; The randomized fixed frame (1.2) makes the spatial positions of the electrically controlled deformable scatterer subunits (1.1) randomly distributed; the random distribution of the spatial positions of the scatterer subunits enhances the electromagnetic coupling between the scatterer subunits, enriches the electromagnetic resonance frequency and electromagnetic scattering direction of the electrically controlled deformable scatterer structure unit, thereby greatly expanding the wide-angle broadband absorption capability of the electrically controlled deformable scatterer structure array (1). The connecting wire (1.3) of the deformable scatterer subunit enables the electrically controlled deformable scatterer subunits (1.1) to be electrically connected to each other; The deformable scatterer structure control circuit board (1.4) is used to achieve the following three functions: Function 1: Provide the electrical energy for the deformation of the scatterer structure subunits to the electrically controlled deformable scatterer structure unit and regulate the voltage at the two main parallel circuit terminals of the connecting wire (1.3) of the deformable scatterer subunits; Function 2: Provide a reflective backplate for the electromagnetic resonance loss and electromagnetic scattering of the electrically controlled deformable scatterer structure unit; Function 3: Connect the randomly dispersed fixed frame (1.2) and the fixed substrate (2) and fix the relative positions of the randomly dispersed fixed frame (1.2) and the fixed substrate (2); The fixed substrate (2) is used to fix the electrically controlled deformable scatterer structure unit to form an electrically controlled deformable scatterer structure array with a preset distribution pattern; The overall control circuit (3) is used to provide power to the deformation scatterer structure control circuit board (1.4) in the N electrically controlled deformation scatterer structure units; the N electrically controlled deformation scatterer structure units are interconnected. The static absorption bandwidth of the electrically controlled deformable structure is determined by the geometric parameters, pre-bending radius of curvature, and random distribution density in free space of the electrically controlled deformable scattering subunit (1.1). The dynamic frequency modulation function of the electrically controlled deformable structure is achieved by adjusting the radius of curvature of the electrically controlled deformable scatterer subunit (1.1).

2. The electrically controlled deformation structure for adjusting the absorption frequency band as described in claim 1, characterized in that: The electrically controlled deformable scatterer subunit (1.1) is achieved by sequentially laminating a polydimethylsiloxane-polyimide-high-temperature pyrolytic graphene oxide (PDMS)-PI-PG material system using a thermal mismatch deformation mechanism. The thermal expansion coefficient of PDMS material is one order of magnitude and two orders of magnitude higher than that of PI material and PG material, respectively. The PI material avoids the low reliability of the laminated structure caused by the direct bonding of elastic PDMS material and easily delaminated brittle PG material. When current is passed into the PG layer circuit, the heat generated by the current thermal effect of the PG material is transferred through the PI layer to the PDMS layer. The PDMS-PI-PG three layers produce different thermal strains, which leads to the instability of the electrically controlled deformation scatterer sub-unit laminated structure and the formation of pre-bending deformation. By electronically adjusting the current in the PG layer, the radius of curvature of the open annular shape of the scatterer subunit is changed, thereby altering the electromagnetic resonant frequency and scattering capability of the scatterer.

3. The electrically controlled deformation structure for adjusting the absorption frequency band as described in claim 1, characterized in that: The randomly distributed fixed frame (1.2) includes a left main support frame, a right main support frame, and several crossbeams; the left main support frame is composed of irregular beams and support columns extending at both ends; the irregular beams include, but are not limited to, semi-elliptical, straight, and ridge-shaped beams; the support columns have a pre-set protrusion structure at the tail end for connecting and fixing the randomly distributed fixed frame (1.2) to the deformation scatterer structure control circuit board (1.4); the right main support frame is mirror-symmetrical to the left main support frame; the crossbeams connect the left and right main support frames and are evenly distributed along the irregular beams; the crossbeams are provided with matching through holes for fixing the electrically controlled deformation scatterer subunits (1.1); the spatial positions of the electrically controlled deformation scatterer subunits (1.1) are randomly distributed by mapping the rotation direction of the base surface normal vector around the randomly preset through holes; the base surface refers to the irregular column surface composed of the irregular beams of the left main support frame and the connected crossbeams, or the irregular column surface composed of the irregular beams of the right main support frame and the connected crossbeams.

4. The electrically controlled deformation structure for adjusting the absorption frequency band as described in claim 1, characterized in that: The connecting wires (1.3) of the deformable scatterer subunits connect the electrically controlled deformable scatterer subunits (1.1) arranged along each crossbeam in the randomly dispersed fixed frame (1.2) in series, and then connect the series circuits in parallel to realize the electrical connection of all electrically controlled deformable scatterer subunits (1.1); the two main parallel circuits are used to supply power to all electrically controlled deformable scatterer subunits (1.1) and are made by bending and deforming hard metal flat wires. The two ends of the wires of the two main parallel circuits form bent pins and are connected to the corresponding interfaces of the deformable scatterer structure control circuit board (1.4).

5. The electrically controlled deformation structure for adjusting the absorption frequency band as described in claim 1, characterized in that: The deformable scatterer structure control circuit board (1.4) includes through holes at four corners for fixing the random dispersion fixing frame (1.2), through holes at four corners for supplying power to the electrically controlled deformable scatterer subunit (1.1), through holes at four midpoints for fixing and connecting the deformable scatterer structure control circuit board (1.4) and the fixing substrate (2), and a built-in double-layer circuit; the through holes at four corners for fixing the random dispersion fixing frame (1.2) match the left and right support column protrusions in the random dispersion fixing frame (1.2); the through holes at four corners for supplying power to the electrically controlled deformable scatterer subunit (1.1) match the deformable scatterer subunit. The two main parallel circuit wires in the connecting wire (1.3) are shaped to match; the through holes at the midpoints of the four sides used to fix the deformable scatterer structure control circuit board (1.4) and the fixed substrate (2) match the screw holes at the corresponding positions of the fixed substrate (2); the built-in double-layer circuit is divided into an upper circuit and a lower circuit, with the side closer to the fixed random dispersion fixing frame (1.2) being the upper circuit and the other side being the lower circuit; the upper circuit is an all-metal layer as a reflective backplate; the lower circuit and the deformable scatterer subunit connecting wire (1.3) are connected by the two main parallel circuit wires through preset through holes to provide power to the deformable scatterer structure unit and regulate the input voltage at both ends.

6. The electrically controlled deformation structure for adjusting the absorption frequency band as described in claim 1, characterized in that: The fixed substrate (2) consists of an open substrate and a bolted connecting post; the opening position of the open substrate matches the distribution pattern of the preset N electronically controlled deformable scatterer structure units; the bottom of the spiral connecting post is fixedly connected to the open substrate at the opening position; the top of the spiral connecting post is fixedly connected to the midpoint through hole position of the four sides of the deformable scatterer structure control circuit board (1.4) in the electronically controlled deformable scatterer structure unit.

7. The electrically controlled deformation structure for adjusting the absorption frequency band as described in claim 1, characterized in that: The overall control circuit (3) includes a control terminal, a communication conversion module, a high-power power supply, and connecting wires; the positive and negative terminals of the deformation scatterer structure control circuit boards (1.4) in the N electronically controlled deformation scatterer structure units are connected in parallel to each other and connected to the high-power power supply; the deformation scatterer structure control circuit boards (1.4), the communication conversion module, and the control terminal in the N electronically controlled deformation scatterer structure units are connected in series with wires for communication.

8. An electrically controlled deformation structure for adjusting the absorption frequency band as described in any one of claims 1, 2, 3, 4, 5, 6, or 7, characterized in that: The input voltage of N electrically controlled deformable scatterer structural units is set by the control terminal. The signal is transmitted to the deformable scatterer structure control circuit board (1.4) in each electrically controlled deformable scatterer structural unit through the communication conversion module in the total control circuit (3). The voltage of the two main parallel circuit wires in the connecting wire (1.3) of the deformable scatterer subunit is adjusted by the lower circuit in the deformable scatterer structure control circuit board (1.4). This adjusts the current in the electrically controlled deformable scatterer subunit (1.1) and realizes the change of the pre-bending curvature radius of the electrically controlled deformable scatterer subunit (1.1) which is randomly dispersed in three-dimensional space by the randomly dispersed fixed frame (1.2). Finally, the electromagnetic resonance absorption frequency and electromagnetic scattering capability of the electrically controlled deformable scatterer structure array (1) are changed, and the electromagnetic absorption band of the electrically controlled deformable scatterer structure array (1) is adjusted.

9. An electrically controlled deformation structure for adjusting the absorption frequency band as described in any one of claims 1, 2, 3, 4, 5, 6, or 7, characterized in that: The production method is as follows: Step 1: Fabrication of the series circuit of the electrically controlled deformable scattering body (1.1) subunit: According to the preset series pattern of multiple electrically controlled deformable scattering body (1.1) subunits, a high-power fiber laser is used to cut PG film to process the conductive layer of the series circuit of the electrically controlled deformable scattering body (1.1) subunits; the PG pattern of the series circuit of the electrically controlled deformable scattering body (1.1) subunits is transferred using the adhesive side of PI tape to form a PI-PG laminate structure; the PDMS prepolymer and the corresponding curing agent are uniformly mixed in a mass ratio range of 10:1 to 2.5:1, and a certain thickness of the PDMS prepolymer-curing agent mixture is coated on the surface using a doctor blade. The PI tape is not attached to the side of the PI-PG laminate structure; the uncured PDMS-PI-PG laminate structure is placed in an oven for 2.5h to 4h for thermosetting, and then the PDMS-PI-PG laminate structure is taken out of the oven and cooled to room temperature naturally; first, a high-power CO2 laser is used to cut a polyester sheet according to the preset PI layer pattern to prepare a PI layer pattern template, and the laser head position is recorded. Then, the thermosetting PDMS-PI-PG laminate structure is aligned with the polyester template, and finally, the electrically controlled deformable scattering body subunit (1.1) series circuit shape laminate structure is obtained by in-situ laser cutting along the preset PI layer pattern. Step 2, Parallel fabrication of series circuit of electronically controlled deformable scatterer subunit (1.1): Repeat step (1) to obtain a series circuit layered structure of several electronically controlled deformable scatterer subunit (1.1); connect the corresponding structures in parallel to form a complete scatterer circuit by using the reserved parallel terminals at both ends of the series circuit layered structure of several electronically controlled deformable scatterer subunit (1.1); Step 3, Preparation of the Randomly Dispersed Fixed Frame (1.2): The randomly dispersed fixed frame is prepared using 3D printing technology; Step 4: Integration of the electrically controlled deformable scattering subunit (1.1) with the randomly distributed fixed frame (1.2): The series-parallel circuit layered structure of several electrically controlled deformable scattering subunits (1.1) obtained in Step 2 is integrated with the randomly distributed fixed frame (1.2) obtained in Step 3 to realize the spatial random distribution of the electrically controlled deformable scattering subunits (1.1); Step 5, Fabrication of the Deformable Scatterer Structure Control Circuit Board (1.4): Using a CNC machine tool, three sets of through holes are fabricated on the insulating substrate, each set containing four through holes; the first set of through holes is used to fix the randomly dispersed fixing frame (1.2), arranged at the four corner points according to the preset; the second set of through holes is used to power the electrically controlled deformable scatterer subunit (1.1), arranged at the four corner points according to the preset and different from the first set of through holes; the third set of through holes is used to fix and connect the deformable scatterer structure control circuit board (1.4) and the fixing substrate (2), arranged at the midpoint of the four sides according to the preset; the deformable scatterer structure control circuit board (1.4) is fabricated on the basis of the aforementioned insulating substrate using a double-layer circuit built-in by the printed circuit board process, wherein the double-layer circuit is close to the two sides of the deformable structure control circuit board, one layer is an all-metal layer as a reflective back plate, and the other layer is the deformable scatterer structure unit control circuit layer; Step 6: Connect and assemble the deformable scatterer structure control circuit board (1.4) obtained in Step 5 with the randomized fixed frame (1.2) in the integrated structure of the randomly distributed electrically controlled deformable scatterer subunit (1.1) obtained in Step 4; Step 7, Fabrication of the electrically controlled deformable scatterer structure array (1): Repeat steps 1 to 6 to obtain N electrically controlled deformable scatterer structure units; Step 8, Fixing the substrate (2) Processing and preparation and assembling the electronically controlled deformable scatterer structure array (1): The substrate is fixed by using laser cutting to open the connecting through holes according to the preset N processing electronically controlled deformable scatterer structure unit arrangement pattern; One end of the connecting post is connected to the corresponding position of the through hole of the fixed substrate, and the other end is connected and fixed to N electrically controlled deformable scatterer structural units in a preset arrangement. Step 9: Integration of the main control circuit (3), fixed substrate (2) and electronically controlled deformable scatterer structure array (1): The control terminal in the main control circuit (3) is connected in series with the communication conversion module and the deformable scatterer structure control circuit board (1.4) in the N electronically controlled deformable scatterer structure units using metal wires; The positive and negative terminals of the deformable scatterer structure control circuit board (1.4) in the N electronically controlled deformable scatterer structure units are connected in parallel with metal wires, and then connected in series with a high-power power supply to obtain the electronically controlled deformable structure that can adjust the absorption frequency band.

10. The electrically controlled deformation structure for adjusting the absorption frequency band as described in claim 9, characterized in that: The part of the electrically controlled deformable scattering subunit (1.1) of the PG layer cut pattern of the series circuit ... of the series circuit of the series of the series circuit The PI layer cutting pattern of the series circuit of the electrically controlled deformable scatterer subunit (1.1) surrounds the PG layer cutting pattern, and the tail of the series circuit of the PG layer cutting pattern of each electrically controlled deformable scatterer subunit (1.1) is cut into a chamfered structure to facilitate connection and fixation with the through hole structure at the corresponding position of the randomly dispersed fixing frame (1.2); Parallel fabrication of the series circuit of the electrically controlled deformable scattering subunit (1.1) is achieved through an integrated process using hard metal wires, heat shrink tubing with an opening on one side of the wall, and tin rings. The number of openings on the heat shrink tubing wall and the number of tin rings are consistent with the number of series circuits of the electrically controlled deformable scattering subunit (1.1). First, multiple tin rings are placed at a distance of 1mm to 3mm from the corresponding openings on the side wall of the heat shrink tubing. Then, one end of the parallel terminal of several series circuits of the electrically controlled deformable scattering subunit (1.1) is embedded into the corresponding opening on the side wall of the heat shrink tubing and passes through the corresponding tin ring. Then, perform the same operation as above to connect a terminal in parallel at the other end of the series circuit of several electrically controlled deformable scattering body sub-units (1.1). Then, insert a hard metal wire into the heat shrink tube connected in parallel at both ends of the series circuit of several electrically controlled deformable scattering body sub-units (1.1). Finally, use a hot air gun to shrink the heat shrink tube and melt the tin ring to form an electrical path with the parallel terminals of the series circuit of several electrically controlled deformable scattering body sub-units (1.1) and the hard metal wire. Thus, the series circuit of several electrically controlled deformable scattering body sub-units (1.1) is connected in parallel. Hard metal conductors are exposed copper conductors with a rectangular cross-section; The nylon material PA12 was prepared by 3D printing using multi-jet melting technology, and its dielectric constant is 2.6 and loss tangent is 0.

06. The tail of the electrically controlled deformable scatterer subunit (1.1) is pre-reserved with a chamfered structure and is embedded and fixed in the random distributed fixing frame (1.2) with the crossbeam randomly rotating through hole; The corresponding through holes reserved in the deformable scatterer structure control circuit board (1.4) are connected to the two main parallel circuit wires of the deformable scatterer subunit connecting wire (1.3); The corresponding through holes reserved in the deformable scatterer structure control circuit board (1.4) are connected and fixed to the end protruding structures of the support columns of the left and right support beams in the random dispersion fixing frame (1.2); The N processing electronically controlled deformable scatterer structural units are arranged in an orthogonal checkerboard pattern.

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