Rear cover and electronic device

Abstract

The application relates to the technical field of electronic equipment, and provides a back cover and electronic equipment, which can solve the problem that electronic elements in the electronic equipment are easily damaged in the related art. The back cover is used for electronic equipment and comprises a cover body, an appearance structure, an inner side conductive part and a conductive connecting part. The cover body has a first cover body surface and a second cover body surface arranged oppositely, and the first cover body surface is an appearance surface of the cover body. The first cover body surface is provided with a concave cavity, the appearance structure is a conductive part and is arranged in the concave cavity. The second cover body surface is provided with a mounting part used for mounting the inner side conductive part. The conductive connecting part is embedded in the cover body, the conductive connecting part electrically connects the appearance structure and the inner side conductive part, and at least the appearance structure, the conductive connecting part and the inner side conductive part form a conductive channel. The application can be used in a mobile phone.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and more particularly to a back cover and an electronic device. Background Technology

[0002] The back cover (also known as the battery cover) is a structural component that covers the back of an electronic device. It not only significantly impacts the device's appearance and feel but also protects the internal electronic components. Therefore, designing the back cover structure to better protect these components has become a crucial research topic in the industry. Summary of the Invention

[0003] Embodiments of this application provide a back cover and an electronic device to solve the problem of easily damaged electronic components inside electronic devices in related technologies.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, embodiments of this application provide a back cover for an electronic device, including a cover body, an external structural component, an inner conductive component, and a conductive connection portion; the cover body is a non-metallic cover body and has a first cover body surface and a second cover body surface disposed opposite to each other, the first cover body surface being the external surface of the cover body; the first cover body surface is provided with a cavity, the external structural component being a conductive component and disposed in the cavity; the second cover body surface is provided with a mounting portion, the mounting portion being used to mount the inner conductive component; the conductive connection portion is embedded in the cover body, the conductive connection portion electrically connecting the external structural component and the inner conductive component, at least the external structural component, the conductive connection portion, and the inner conductive component constitute a conductive channel.

[0006] In this embodiment of the back cover, since the conductive connection part is embedded in the cover body, the conductive connection part electrically connects the outer structural component and the inner conductive component. At least the outer structural component, the conductive connection part, and the inner conductive component form a conductive channel. In this way, the inner conductive component can be electrically connected to the reference ground of the electronic device. The static charge accumulated on the outer structural component can be conducted to the reference ground of the electronic device along the conductive channel and the elastic connection part. This can avoid electrostatic discharge caused by the large accumulation of static charge on the outer structural component, thereby protecting the electronic components inside the electronic device from interference and damage caused by electrostatic discharge. This can improve the working reliability of the electronic device and extend its service life.

[0007] In some embodiments of the first aspect, a receiving through hole is provided on the cover between the outer structural component and the inner conductive component. The receiving through hole is filled with conductive paste to form a conductive connection portion, and the two ends of the conductive connection portion abut against the outer structural component and the inner conductive component, respectively. This arrangement simplifies the structure of the conductive connection portion and facilitates its manufacture; moreover, it helps to reduce the contact resistance between the conductive connection portion and the outer structural component and the inner conductive component.

[0008] In some embodiments of the first aspect, the conductive paste is conductive silver paste. This configuration can reduce the resistance of the conductive connection.

[0009] In some embodiments of the first aspect, the diameter of the accommodating via ranges from 0.8 mm to 1.5 mm. This arrangement allows the accommodating via to occupy less space while also enabling the conductive connection to have a lower resistance value.

[0010] In some embodiments of the first aspect, the resistance of the conductive channel is less than or equal to 10 ohms. This arrangement facilitates the smooth discharge of static charge from the exterior structural components.

[0011] In some embodiments of the first aspect, the receiving through-hole penetrates the bottom surface of the cavity, and an overflow receiving groove is provided on the bottom surface of the cavity. The overflow receiving groove is disposed around the receiving through-hole and is used to receive conductive paste that overflows outside the receiving through-hole. This arrangement can prevent uncured conductive paste from flowing to other parts of the cavity and affecting the arrangement of other structures.

[0012] In some embodiments of the first aspect, the bottom surface of the cavity has a first edge, and the receiving through hole is disposed at the first edge. This arrangement avoids the receiving through hole occupying the central area of ​​the bottom surface of the cavity, thus freeing up the central area of ​​the bottom surface of the cavity to be used for other structures.

[0013] In some embodiments of the first aspect, the overflow receiving groove includes a first overflow receiving groove, at least a portion of which is located between the receiving through hole and the first edge. This arrangement prevents the overflowing conductive paste from being pressurized and diffused from the first edge to the outer surface of the appearance structure and the periphery of the cavity when the appearance structure is inserted into the cavity.

[0014] In some embodiments of the first aspect, a first overflow receiving groove is disposed around a receiving through hole, and the central angle of the receiving through hole corresponding to the first overflow receiving groove is greater than 90 degrees along the circumference of the receiving through hole. With this arrangement, the first overflow receiving groove can accommodate conductive slurry overflowing towards the first edge in different directions.

[0015] In some embodiments of the first aspect, the overflow receiving tank includes a second overflow receiving tank; along the arrangement direction of the second overflow receiving tank and the receiving through hole, the second overflow receiving tank is located on the side of the receiving through hole away from the first edge. With this configuration, the first overflow receiving tank can contain conductive paste overflowing in the direction away from the first edge, preventing the overflowing conductive paste from spreading to other areas of the cavity bottom surface and affecting the configuration of other structures.

[0016] In some embodiments of the first aspect, the edge of the accommodating through hole has a notch, and the second overflow receiving groove is connected to the notch. This arrangement helps to increase the contact area between the conductive connection and the appearance structural component, and reduces the contact resistance between the conductive connection and the appearance structural component.

[0017] In some embodiments of the first aspect, a connecting groove is provided on the bottom surface of the cavity. The connecting groove is disposed between the second overflow receiving groove and the receiving through hole, with one end of the connecting groove communicating with the second overflow receiving groove and the other end communicating with the notch. The bottom surface of the connecting groove protrudes beyond the bottom surface of the second overflow receiving groove. This arrangement can further increase the contact area between the conductive connection part and the appearance structural component, thereby reducing the contact resistance between the conductive connection part and the appearance structural component; at the same time, it is beneficial for the connecting groove to guide the overflowing conductive slurry to the second overflow receiving groove.

[0018] In some embodiments of the first aspect, the bottom surface of the cavity includes an adhesive surface and a supporting surface protruding from the adhesive surface. An adhesive layer is provided between the adhesive surface and the external structural component. The supporting surface is located at the edge of the cavity and is used to support the external structural component. This arrangement ensures that the edge of the external structural component is flush with the edge of the cavity, preventing the cavity edge from forming protruding sharp edges that could scratch the user during use.

[0019] In some embodiments of the first aspect, the conductive connection extends through the support surface and is electrically connected to the exterior structural component. This arrangement facilitates the electrical connection between the conductive connection and the exterior structural component.

[0020] In some embodiments of the first aspect, a clearance hole is provided on the bottom surface of the cavity, the clearance hole penetrating the surface of the second cover, and the clearance hole is used for electronic components inside the electronic device to extend into. This arrangement helps to reduce the thickness of the electronic device.

[0021] In some embodiments of the first aspect, a raised rib is provided at the edge of the clearance hole. The raised rib is a strip-shaped structure and extends along the edge of the clearance hole. The raised rib is used to support the appearance structural component. This arrangement can improve the rigidity of the appearance structural component at the clearance hole, thereby reducing the indentation deformation of the appearance structural component towards the clearance hole side when it is pressed by an external force.

[0022] In some embodiments of the first aspect, the back cover further includes a support frame, which is at least partially disposed within the clearance hole along its depth direction. The support frame is used to support the exterior structural member. This arrangement can improve the rigidity of the exterior structural member at the clearance hole, thereby greatly reducing the indentation deformation of the exterior structural member towards the clearance hole side when subjected to external pressure.

[0023] In some embodiments of the first aspect, the appearance structural component includes a first steel sheet and a first nickel layer, the first nickel layer being disposed in the central region of the first steel sheet and used for electrical connection with the testing equipment. This arrangement can reduce the contact resistance between the testing equipment and the appearance structural component.

[0024] In some embodiments of the first aspect, the exterior structural component includes a first steel sheet and a second nickel layer; the second nickel layer is disposed on the edge region of the first steel sheet and abuts against the conductive connection portion. This arrangement reduces the contact resistance between the exterior structural component and the conductive connection portion, thereby ensuring the conductivity between the exterior structural component and the conductive connection portion.

[0025] In some embodiments of the first aspect, the first steel sheet is shaped as a polygon with an even number of sides, and there are two second nickel layers that are centrally symmetrical about the geometric center of the first steel sheet, with one of the second nickel layers abutting against the conductive connection portion. This arrangement ensures that after the exterior structural component is inserted into the cavity, one second nickel layer always abuts against the conductive connection portion, thereby improving the assembly tolerance of the exterior structural component.

[0026] In some embodiments of the first aspect, the inner conductive element includes a second steel sheet and a third nickel layer. The third nickel layer covers the surface of the second steel sheet near the conductive connection portion and abuts against the conductive connection portion. This arrangement can reduce the contact resistance between the inner conductive element and the conductive connection portion, thereby ensuring the conductivity between the inner conductive element and the conductive connection portion.

[0027] In some embodiments of the first aspect, the inner conductive element includes a second steel sheet and a fourth nickel layer, the fourth nickel layer covering the surface of the second steel sheet away from the conductive connection portion. This arrangement reduces the contact resistance between the inner conductive element and the elastic connector, thereby ensuring the conductivity between the inner conductive element and the elastic connector.

[0028] In some embodiments of the first aspect, the mounting portion is an adhesive area disposed on the surface of the second cover, and a positioning line is provided around the mounting portion to locate its position. This arrangement ensures that the inner conductive component is accurately installed to the position of the mounting portion, preventing a significant deviation between the actual installation position of the inner conductive component and the position of the mounting portion.

[0029] In some embodiments of the first aspect, the back cover further includes a protective film comprising a membrane body covering the outside of the exterior structural member and lugs connected to the edge of the membrane body, the lugs extending outwards toward the periphery of the cavity. This arrangement allows the protective film to protect the exterior structural member; the lugs facilitate the removal of the protective film from the outside of the exterior structural member.

[0030] In some embodiments of the first aspect, the lug is provided with a through hole. This arrangement allows the through hole to serve a visual positioning function, ensuring that the protective film is applied to the correct position circumferentially.

[0031] Secondly, embodiments of this application provide an electronic device, including a display screen and a housing. The housing includes a mid-frame and a rear cover as described in the first aspect. The mid-frame is disposed between the display screen and the rear cover, and the inner conductive element of the rear cover is electrically connected to the reference ground of the electronic device.

[0032] The beneficial effects of the electronic device in this embodiment are the same as those of the back cover in the first aspect, and will not be repeated here.

[0033] Thirdly, embodiments of this application provide an electronic device, which is a foldable electronic device, including a display screen, a first housing, a second housing, and a hinge mechanism; the display screen includes a first screen area and a second screen area; the first housing includes a first middle frame and a first rear cover, the first middle frame being disposed between the first screen area and the first rear cover; the second housing includes a second middle frame and a second rear cover, the second middle frame being disposed between the second screen area and the second rear cover; the hinge mechanism is disposed at the junction of the first housing and the second housing, and the first housing and the second housing can switch between an unfolded state and a folded state; wherein, the first rear cover is the rear cover described in the first aspect, and the inner conductive element of the first rear cover is electrically connected to the reference ground of the electronic device.

[0034] The beneficial effects of the electronic device in this embodiment are the same as those of the back cover in the first aspect, and will not be repeated here.

[0035] In some embodiments of the second aspect, the second rear cover is provided with a magnetic closure. When the first and second housings are in a folded state, the external structural component on the first rear cover and the area on the second rear cover where the magnetic closure is provided are positioned opposite each other, and the magnetic closure attracts the external structural component. With this arrangement, the first and second housings can fit more tightly together under the magnetic attraction between the magnetic closure and the external structural component, preventing the first and second housings from opening under external force when in a folded state. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the structure of the back of an electronic device in the related technology;

[0037] Figure 2 for Figure 1 A cross-sectional view of an electronic device in China;

[0038] Figure 3 This is a schematic diagram of the structure of the back of the electronic device (mobile phone) in the first embodiment of this application;

[0039] Figure 4 for Figure 3 BB cross-sectional view of electronic equipment in China;

[0040] Figure 5 This is a longitudinal sectional view of the electronic device (mobile phone) at the exterior structural component in the second embodiment of this application;

[0041] Figure 6 for Figure 5 A magnified view of the recessed cavity after the exterior structural components of the rear cover have been removed;

[0042] Figure 7 for Figure 5 A bottom view of the external structural components and support frame of the electronic device;

[0043] Figure 8 This is a partial view of the rear cover of the electronic device in the third embodiment of this application at the appearance structure.

[0044] Figure 9 for Figure 8 A schematic diagram showing the back cover near the inside of the electronic device;

[0045] Figure 10 for Figure 8 The exploded view of the rear cover shown is from one perspective.

[0046] Figure 11 for Figure 8 The exploded view of the back cover shown from another perspective;

[0047] Figure 12 for Figure 8 The diagram shows the structure of the recessed cavity after the exterior structural components of the back cover have been removed.

[0048] Figure 13 for Figure 12 A magnified view of the cavity in the middle where it accommodates the through hole;

[0049] Figure 14 for Figure 12 The diagram shows the structure of the cavity in the back cover from another perspective;

[0050] Figure 15 for Figure 14 A magnified view of the cavity in the middle where it accommodates the through hole;

[0051] Figure 16 for Figure 8CC section view of the rear cover;

[0052] Figure 17 for Figure 8 A magnified view of a portion of the rear cover at the location of the through-hole;

[0053] Figure 18 This is an assembly diagram of the exterior structural components, inner conductive components, conductive connection parts, and support frame in the third embodiment of this application;

[0054] Figure 19 for Figure 18 Cross-sectional view of structural component 2 at the dashed line DD;

[0055] Figure 20 for Figure 19 EE sectional view of the exterior structural component;

[0056] Figure 21 for Figure 19 The component shown is a K-direction view after the inner conductive parts have been removed;

[0057] Figure 22 for Figure 12 The back side view of the rear cover;

[0058] Figure 23 This is a partial view of the rear cover at the exterior structural component in the fourth embodiment of this application;

[0059] Figure 24 for Figure 23 The diagram shown illustrates the separation of the external structural components of the back cover from the protective film.

[0060] Figure 25 This is a front view of the electronic device in the unfolded state according to the fifth embodiment of this application;

[0061] Figure 26 for Figure 25 A schematic diagram of the back side of the electronic device shown;

[0062] Figure 27 for Figure 25 FF cross-sectional view of the electronic device in the image;

[0063] Figure 28 for Figure 27 The diagram shows the structure of the electronic device in its folded state.

[0064] Figure 29 for Figure 28 Enlarged view of a portion of the exterior structural component;

[0065] Figure 30 This is a front view of the electronic device in the unfolded state according to the sixth embodiment of this application;

[0066] Figure 31 for Figure 30 A schematic diagram of the back side of the electronic device shown;

[0067] Figure 32 for Figure 30 GG cross-sectional view of the electronic device in the image;

[0068] Figure 33 for Figure 32 The diagram shows the structure of the electronic device in its folded state. Detailed Implementation

[0069] The technical solutions in some embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0070] The back cover is a structural component that covers the back of electronic devices (such as mobile phones and tablets). It not only has a significant impact on the appearance and feel of electronic devices, but also plays a role in protecting the internal electronic components. Therefore, how to design the structure of the back cover to better protect the internal electronic components (such as electrostatic discharge protection) has become an important research topic in the industry.

[0071] Figure 1 This is a schematic diagram of the structure of the back of an electronic device in related technologies. Figure 2 for Figure 1 A cross-sectional view (AA) of an electronic device. (e.g.) Figure 1 and Figure 2 As shown, the electronic device is a mobile phone, which includes a display screen 200 and a housing 100.

[0072] The housing 100 includes a middle frame 110 and a back cover 120. The middle frame 110 is disposed between the display screen 200 and the back cover 120. The display screen 200 and the middle frame 110 form a first accommodating space 130, which is used to accommodate components such as a front-facing camera. The back cover 120 and the middle frame 110 form a second accommodating space 140, which is used to accommodate components such as a rear-facing camera, a battery, and a circuit board.

[0073] The back cover 120 includes a cover body 1 and an appearance structural component 2. The cover body 1 is a non-metallic cover body, such as a ceramic cover body, a glass cover body, a plastic cover body, a fiber composite material cover body, etc. The appearance surface of the cover body 1 has a cavity 11. The appearance structural component 2 is a conductive component (such as a steel sheet) and is disposed in the cavity 11. The outer surface of the appearance structural component 2 has a product mark (i.e., product logo).

[0074] In related technologies, electronic devices, since the outer structural component 2 of the back cover 120 is a conductive component, when the outer structural component 2 of the back cover 120 comes into contact with or rubs against other objects (such as human body, clothing, table, etc.) during the use of the electronic device, static charge is easily accumulated on the outer structural component 2. When the static charge accumulates to a certain level, it will break down the medium (such as air or other insulating material) between the outer structural component 2 and the internal electronic components of the electronic device, so as to generate electrostatic discharge. The instantaneous electromagnetic field and large current generated by electrostatic discharge can easily interfere with and damage the internal electronic components of the electronic device, thereby reducing the working reliability and service life of the electronic device.

[0075] Therefore, this application provides a back cover and an electronic device. By providing an inner conductive element that is electrically connected to the exterior structural component on the inner side of the back cover, and the inner conductive element being electrically connected to the reference ground of the electronic device, the static charge accumulated on the exterior structural component can be promptly conducted away to avoid electrostatic discharge that could interfere with or damage the electronic components inside the electronic device.

[0076] The electronic devices in this application embodiment can be mobile phones, tablets, wearable devices (such as smartwatches), etc. The following uses a mobile phone as an example to specifically describe the electronic devices in this application embodiment. Other types of electronic devices can be set up with reference to the structure of the mobile phone embodiment, and will not be described in detail here.

[0077] Figure 3 This is a schematic diagram of the structure of the back of the electronic device (mobile phone) in the first embodiment of this application. Figure 4 for Figure 3 A BB cross-sectional view of an electronic device. (e.g.) Figure 3 and Figure 4 As shown, the electronic device is a candybar mobile phone, including a display screen 200 and a housing 100. The housing 100 includes a mid-frame 110 and a back cover 120, with the mid-frame 110 disposed between the display screen 200 and the back cover 120.

[0078] The display screen 200 can be a light-emitting diode (LED) display screen, a liquid crystal display (LCD) display screen, or an organic light-emitting diode (OLED) display screen, etc., without any specific limitation.

[0079] like Figure 4As shown, the mid-frame 110 (also known as the front frame or front shell) includes a bottom wall 110a and a side wall 110b disposed at the edge of the bottom wall 110a. The edge of the display screen 200 is connected to the side wall 110b. The display screen 200 and the mid-frame 110 form a first receiving space 130, which is used to accommodate components such as a front-facing camera and a backlight (when the display screen 200 is an LCD screen 200). The edge of the rear cover 120 is connected to the side wall of the mid-frame. The rear cover 120 and the mid-frame 110 form a second receiving space 140, which is used to accommodate components such as a rear-facing camera and a battery. Of course, the structure of the mid-frame 110 is not limited to... Figure 4 As shown, it can also be set to other structures according to the actual situation.

[0080] like Figure 4 As shown, the back cover 120 includes a cover body 1, an external structural component 2, an inner conductive component 3, and a conductive connection part 4.

[0081] The cover 1 has a first cover surface 10a and a second cover surface 10b arranged opposite to each other. The first cover surface 10a is the outer surface of the cover 1. The first cover surface 10a is provided with a cavity 11, and the outer structural component 2 is a conductive component and is disposed in the cavity 11.

[0082] The cavity 11 can be a groove (e.g.) Figure 4 (As shown), it can also be a hole, depending on the shape of the external structural component 2. For example... Figure 4 As shown, the appearance structural component 2 can be a product identification component, with a product identification mark on its outer surface; however, it is not limited to this, the appearance structural component 2 can also be an appearance decorative component, etc.

[0083] The second cover surface 10b is provided with a mounting portion 12, which is used to mount the inner conductive component 3. In some embodiments, such as... Figure 4 As shown, the mounting portion 12 is an adhesive area disposed on the surface 10b of the second cover. The adhesive area is used to provide an adhesive layer for bonding with the inner conductive component, and the adhesive layer for bonding the inner conductive component 3. Of course, the mounting portion 12 is not limited to this. In some other embodiments, the mounting portion 12 can also be a mounting groove, in which the inner conductive component 3 is disposed.

[0084] like Figure 4 As shown, the conductive connection part 4 is embedded in the cover 1. The conductive connection part 4 electrically connects the outer structural component 2 and the inner conductive component 3. At least the outer structural component 2, the conductive connection part 4 and the inner conductive component 3 form a conductive channel. The inner conductive component 3 is electrically connected to the reference ground of the electronic device.

[0085] Here, "conductive channel" refers to a path through which static charge (or current) can flow. In order for the static charge on the exterior structural component 2 to flow along the conductive channel to the reference ground of the electronic device, in some embodiments, such as... Figure 4 As shown, the cover 1 can be a non-metallic cover, which can be a plastic cover, a glass cover, a ceramic cover, or a fiber composite material cover. In this way, the cover 1 can serve as an insulator, preventing static charges on the appearance structure 2 from being conducted from the cover 1 to the reference ground of the electronic device, thereby ensuring that the static charges on the appearance structure 2 flow to the reference ground of the electronic device along the conductive channel.

[0086] The fiber composite cover is primarily made of fiber composite materials, a high-performance material formed by mixing reinforcing fibers and matrix materials (such as resin) in a specific ratio. Fiber composite materials are characterized by their lightweight yet rigidity, non-conductivity, high mechanical strength, and corrosion resistance. Fiber composite materials can be inorganic, such as glass fiber composites and carbon fiber composites; or organic, such as PI (Polyimide) fiber composites, PBO (Poly-p-phenylene benzobisoxazole) fiber composites, aramid fiber composites, and UHMWPE (ultra-high molecular weight polyethylene) fiber composites.

[0087] Of course, the cover 1 is not limited to a non-metallic cover. The cover 1 can also be a metallic cover. The conductivity of the materials of the outer structural component 2, the conductive connection part 4 and the inner conductive component 3 is greater than that of the material of the cover 1. This can make the resistance of the conductive channel smaller, thereby ensuring that the static charge on the outer structural component 2 flows along the conductive channel to the reference ground of the electronic device.

[0088] In some embodiments, such as Figure 4 As shown, the reference ground can be the ground layer of the first circuit board 310, which is disposed in the second receiving space 140. The first circuit board 310 is provided with an elastic connector 320, which is electrically connected to the ground layer of the first circuit board 310 and also electrically connected to the inner conductive member 3. Besides the ground layer of the first circuit board 310, in some embodiments, the reference ground can also be the middle frame 110, which is a metal or alloy middle frame, such as an aluminum middle frame or an aluminum alloy middle frame.

[0089] In some embodiments, such as Figure 4As shown, the elastic connector 320 is a conductive spring sheet, which abuts against the inner conductive member 3. Of course, it is not limited to this; the elastic connector 320 can also be a pogo pin.

[0090] In this embodiment, the back cover 120 has a conductive connection part 4 embedded in the cover body 1. The conductive connection part 4 electrically connects the outer structural component 2 and the inner conductive component 3. At least the outer structural component 2, the conductive connection part 4, and the inner conductive component 3 form a conductive channel. In this way, the inner conductive component 3 can be electrically connected to the reference ground of the electronic device. The static charge accumulated on the outer structural component 2 can be introduced to the reference ground of the electronic device along the conductive channel and the elastic connection part 320. This can avoid electrostatic discharge caused by the large accumulation of static charge on the outer structural component 2, thereby protecting the electronic components inside the electronic device from interference and damage caused by electrostatic discharge. This can improve the working reliability of the electronic device and extend its service life.

[0091] In some embodiments, such as Figure 4 As shown, the conductive connection part 4 includes a conductive layer 41, a plurality of first conductive pads 42 disposed on the surface of the conductive layer 41 near the outer structural member 2, and a second conductive pad 43 disposed on the surface of the conductive layer 41 near the inner conductive member 3. The conductive layer 41 is embedded in the interior of the cover 1. The first conductive pads 42 penetrate the bottom surface 111 of the cavity 11 and abut against the outer structural member 2. The second conductive pads 43 penetrate the surface 10b of the second cover and abut against the inner conductive member 3.

[0092] By setting multiple first conductive pads 42 to abut against the outer structural component 2, the contact area between the conductive connection part 4 and the outer structural component 2 can be increased, thereby reducing the contact resistance between the conductive connection part 4 and the outer structural component 2. By setting multiple second conductive pads 43 to abut against the inner conductive component 3, the contact area between the conductive connection part 4 and the inner conductive component 3 can be increased, thereby reducing the contact resistance between the conductive connection part 4 and the inner conductive component 3, thus making the release of static charge on the outer structural component 2 smoother.

[0093] The conductive layer 41, the first conductive pad 42, and the second conductive pad 43 can be made of metal or alloy, such as copper, nickel, aluminum, copper alloy, aluminum alloy, etc. The number of first conductive pads 42 can be three, two, four, five, etc., without specific limitation. The number of second conductive pads 43 can also be three, two, four, five, etc., without specific limitation.

[0094] In some embodiments, such as Figure 3 and Figure 4As shown, both the outer structural component 2 and the inner conductive component 3 are made of steel sheets. However, they are not limited to this; the outer structural component 2 and the inner conductive component 3 can also be made of other metal sheets or alloy sheets, depending on the specific circumstances.

[0095] Figure 5 This is a longitudinal sectional view of the electronic device at the exterior structural member 2 in the second embodiment of this application. Figure 5 Electronic devices and Figure 4 The main differences between the electronic devices are: the structure of the conductive connection part 4 is different, and the structure of the elastic connector 320 is different, as detailed below:

[0096] In some embodiments, such as Figure 5 As shown, a through hole 13 is provided on the cover 1 between the outer structural component 2 and the inner conductive component 3. The through hole 13 is filled with conductive paste to form a conductive connection part 4. The two ends of the conductive connection part 4 abut against the outer structural component 2 and the inner conductive component 3, respectively. Here, "abut against" specifically refers to at least one of point contact, line contact, and surface contact. The "contact" here can be direct contact or indirect contact, and is not specifically limited here.

[0097] By filling the receiving through-hole 13 with conductive paste to form the conductive connection part 4, the structure of the conductive connection part 4 is simple and easy to manufacture, thereby reducing the manufacturing cost of the back cover 120. In addition, the conductive connection part 4 formed by the conductive paste can make better contact with the outer structural component 2 and the inner conductive component 3, reducing the contact resistance between the conductive connection part 4 and the outer structural component 2 and the inner conductive component 3. This allows the outer structural component 2, the conductive connection part 4 and the inner conductive component 3 to have better overall conductivity, thereby making the release of static charge on the outer structural component 2 smoother.

[0098] The aforementioned conductive paste, also known as conductive adhesive, is a viscous liquid containing conductive particles. After curing in the through-hole 13, the conductive paste forms the conductive connection part 4. The conductive paste can be a carbon paste, meaning it contains carbon particles; or it can be a metal paste, meaning it contains metal particles. The metal particles can include at least one of gold powder particles, silver powder particles, copper powder particles, nickel powder particles, or silver-copper alloy particles.

[0099] In some embodiments, such as Figure 5 As shown, the conductive paste is conductive silver paste, meaning it contains silver powder particles. Since silver powder particles have good conductivity, using conductive silver paste as the conductive paste can reduce the resistance of the conductive connection part 4, thereby giving the conductive connection part 4 better conductivity and allowing for smoother release of static charge on the appearance structure part 2.

[0100] In some embodiments, such as Figure 5 As shown, the diameter of the accommodating through-hole 13 ranges from 0.8mm to 1.5mm. This design avoids the through-hole 13 being too large or too small. If the diameter of the accommodating through-hole 13 is too large, it will occupy too much space within the cavity 11, which is not conducive to the optimized arrangement of other structures within the cavity 11. If the diameter of the accommodating through-hole 13 is too small, the resistance value of the conductive connection part 4 will be too large, which is not conducive to the smooth discharge of static charge on the appearance structural component 2. By setting the diameter range of the accommodating through-hole 13 to 0.8mm to 1.5mm, the accommodating through-hole 13 occupies less space and allows the conductive connection part 4 to have a lower resistance value, thereby facilitating the smooth discharge of static charge on the appearance structural component 2.

[0101] In some embodiments, such as Figure 5 As shown, the diameter of the through hole 13 is 1.2 mm, and the depth of the through hole 13 is 0.67 mm.

[0102] In some embodiments, such as Figure 5 As shown, the resistance of the conductive channel formed by the outer structural component 2, the conductive connection part 4, and the inner conductive component 3 is less than or equal to 10 ohms. This configuration allows for a lower overall resistance of the outer structural component 2, the conductive connection part 4, and the inner conductive component 3, thereby facilitating the smooth discharge of static charge from the outer structural component 2.

[0103] In some embodiments, such as Figure 5 and Figure 6 As shown, Figure 6 for Figure 5 The image shows a partial enlarged view of the recessed cavity 11 of the rear cover 120 after the exterior structural component 2 has been removed. The recessed cavity 11 includes a bottom surface 111 and a side surface 112 located at the edge of the bottom surface 111. The bottom surface 111 is positioned opposite to the opening of the recessed cavity 11. An clearance hole 113 is provided on the bottom surface 111, penetrating the surface 10b of the second cover. The clearance hole 113 allows the electronic device 330 inside the electronic device to extend into it. This arrangement allows the electronic device 330 to fully utilize the space of the clearance hole 113, reducing the excessive occupation of the second accommodating space 140 in the height direction, thereby helping to reduce the thickness of the electronic device.

[0104] Among them, such as Figure 5As shown, the electronic device 330 can be an inductor mounted on the first circuit board 310, connected between the elastic connector 320 and the reference ground of the electronic device. This configuration allows the inductor to limit sudden changes in current flowing to the reference ground. For the release of static charge on the external structural component 2, the inductor can delay the entry of large current spikes into the reference ground, thereby protecting other electronic components connected to the reference ground from damage. This improves the operational reliability of the electronic device and extends its service life.

[0105] Of course, it is not limited to inductors; the electronic device 330 can also be other high-profile components.

[0106] In some embodiments, such as Figure 5 As shown, the elastic connector 320 is a pogo pin disposed on the first circuit board 310. The end of the pogo pin of the elastic connector 320 has a contact plane 321, which contacts the inner conductive element 3. This arrangement increases the contact area between the elastic connector 320 and the inner conductive element 3, thereby reducing the contact resistance between the elastic connector 320 and the inner conductive element 3, which is more beneficial for the reference ground of the electrostatic charge guiding electronic device on the appearance structure 2.

[0107] Of course, the flexible connector 320 is not limited to a pogo pin; the flexible connector 320 can also be a conductive spring.

[0108] In some embodiments, such as Figure 5 and Figure 7 As shown, Figure 7 for Figure 5 The rear cover 120 also includes a support frame 5, which is at least partially disposed in the clearance hole 113 along the depth direction H of the clearance hole 113 and is used to support the exterior structural component 2. This arrangement increases the rigidity of the exterior structural component 2 at the clearance hole 113, thereby significantly reducing the indentation deformation of the exterior structural component 2 towards the clearance hole 113 when subjected to external pressure, thus improving the structural stability of the exterior structural component 2.

[0109] The connection method between the support frame 5 and the appearance structural component 2 is not unique; in some embodiments, such as... Figure 5 As shown, the support frame 5 can be bonded to the exterior structural component 2, for example, by providing an adhesive layer between the support frame 5 and the exterior structural component 2. In other embodiments, the support frame 5 can also be connected to the exterior structural component 2 by fasteners (such as screws).

[0110] To improve the support effect of the support frame 5 on the appearance structural component 2, in some embodiments, such as Figure 5 and Figure 7As shown, the support frame 5 is a metal frame or an alloy frame, such as a steel frame.

[0111] The support frame 5 is a rectangular frame, but it is not limited to this. The support frame 5 can also be set to other shapes, depending on the shape of the clearance hole 113.

[0112] In some embodiments, such as Figure 5 As shown, electronic device 330 extends into support frame 5.

[0113] Figure 8 This is a partial view of the rear cover 120 of the electronic device in the third embodiment of this application at the appearance structure 2. Figure 9 for Figure 8 The diagram shown depicts the back cover 120 near the interior of the electronic device. Figure 10 for Figure 8 The exploded view of the rear cover 120 shown in the image is from one perspective. Figure 11 for Figure 8 The exploded view of the rear cover 120 shown from another perspective. Figure 12 for Figure 8 The diagram shown illustrates the structure of the recess 11 after the outer structural component 2 is removed from the rear cover 120. Figure 13 for Figure 12 A magnified view of the recessed cavity 11 at the location of the through hole 13.

[0114] Figures 8-13 The back cover 120 shown is... Figures 5-7 The main difference between the back cover 120 shown is that the structure of the cavity 11 is different. Figures 8-13 The cavity 11 of the rear cover 120 shown in the figure has an overflow receiving groove 114 around the receiving through hole 13, the bottom surface 111 of the cavity 11 has a protruding support surface 118, and the edge of the clearance hole 113 has a raised rib 119 for supporting the appearance structure 2, as described in detail below:

[0115] In some embodiments, such as Figure 10 and Figure 12 As shown, the receiving through hole 13 penetrates the bottom surface 111 of the cavity 11. An overflow receiving groove 114 is provided on the bottom surface 111 of the cavity 11. The overflow receiving groove 114 is located around the receiving through hole 13 and is used to collect conductive paste that overflows beyond the receiving through hole 13. By providing the overflow receiving groove 114 around the receiving through hole 13, the overflow receiving groove 114 can collect the overflowing conductive paste, thereby preventing uncured conductive paste from flowing to other locations in the cavity 11 and affecting the installation of other structures.

[0116] In some embodiments, such as Figure 10 and Figure 12As shown, the bottom surface 111 of the cavity 11 has a first edge 115, and the receiving through hole 13 is disposed at the first edge 115. By disposing the receiving through hole 13 at the first edge 115, the occupancy of the central area of ​​the bottom surface 111 by the receiving through hole 13 can be avoided, thus freeing up the central area of ​​the bottom surface 111 to be used for other structures, such as setting the clearance hole 113.

[0117] It is important to understand that the first edge 115 is a portion of the edge of the cavity bottom surface 111, that is, a portion of the edge adjacent to the receiving through hole 13. For example... Figure 12 and Figure 13 As shown, the contour shape of the cavity 11 is hexagonal, and correspondingly, the shape of the cavity bottom surface 111 is hexagonal. The cavity bottom surface 111 has six sides, one of which is the first edge 115.

[0118] In some embodiments, such as Figure 12 and Figure 13 As shown, the overflow receiving groove 114 includes a first overflow receiving groove 114a, at least a portion of which is located between the receiving through hole 13 and the first edge 115. This arrangement allows the first overflow receiving groove 114a to accommodate conductive paste overflowing towards the first edge 115, preventing the overflowing conductive paste from being pressurized and diffused from the first edge 115 to the outer surface of the outer structural component 2 and the periphery of the cavity 11 when the outer structural component 2 is inserted into the cavity 11. This saves the step of removing excess conductive paste from the outside, thereby reducing the manufacturing cost of the back cover 120.

[0119] Among them, such as Figure 12 and Figure 13 As shown, the depth of the first overflow receiving tank 114a can be set to 0.1 mm so as to be able to well accommodate the conductive paste overflowing in the direction of the first edge 115.

[0120] In some embodiments, such as Figure 12 and Figure 13 As shown, the first overflow receiving groove 114a is arranged around the receiving through hole 13, and along the circumference of the receiving through hole 13, the central angle θ of the receiving through hole 13 corresponding to the first overflow receiving groove 114a is greater than 90 degrees. With this arrangement, the first overflow receiving groove 114a can accommodate conductive paste overflowing towards the first edge 115 in different directions, thereby better preventing the conductive paste from spreading under pressure to the outer surface of the appearance structural component 2 and the periphery of the cavity 11 when it is inserted into the cavity 11.

[0121] Among them, such as Figure 13 As shown, the central angle θ of the receiving through hole 13 corresponding to the first overflow receiving groove 114a is: in the same plane (e.g. Figure 13The bottom surface 111 of the cavity surrounding the through hole 13, along the circumferential direction of the through hole 13, the angle formed by the line connecting the two end walls 1141 of the first overflow receiving tank 114a with the center point O of the through hole 13, wherein the line is connected to the end point A1 of the end wall 1141 of the first overflow receiving tank 114a near the center point O.

[0122] In some embodiments, such as Figure 12 and Figure 13 As shown, the overflow receiving tank 114 includes a second overflow receiving tank 114b. Along the arrangement direction M of the second overflow receiving tank 114b and the receiving through hole 13, the second overflow receiving tank 114b is located on the side of the receiving through hole 13 away from the first edge 115. With this configuration, the first overflow receiving tank 114a can contain conductive paste overflowing in the direction away from the first edge 115, preventing the overflowing conductive paste from spreading to other areas of the cavity bottom surface 111 and affecting the configuration of other structures.

[0123] Among them, such as Figure 12 and Figure 13 As shown, the depth of the second overflow receiving tank 114b can be set to 0.1 mm so as to be able to well contain the conductive paste overflowing in the direction away from the first edge 115.

[0124] In some embodiments, such as Figure 14 and Figure 15 As shown, Figure 14 for Figure 12 A schematic diagram of the cavity 11 of the rear cover 120 from another perspective. Figure 15 for Figure 14 The enlarged view of the cavity 11 in the middle at the receiving through hole 13. The receiving through hole 13 has a notch 131 at the edge, and the second overflow receiving groove 114b is connected to the notch 131.

[0125] With this configuration, the conductive paste overflowing into the second overflow receiving tank 114b can connect with the conductive paste in the receiving through hole 13 to form a whole, which helps to expand the contact area between the conductive connection part 4 and the appearance structure 2, and reduces the contact resistance between the conductive connection part 4 and the appearance structure 2, thereby facilitating the smooth discharge of static charge on the appearance structure 2.

[0126] In some embodiments, such as Figure 14 and Figure 15As shown, a connecting groove 116 is provided on the bottom surface 111 of the cavity 11. The connecting groove 116 is located between the second overflow receiving groove 114b and the receiving through hole 13. One end of the connecting groove 116 is connected to the second overflow receiving groove 114b, and the other end of the connecting groove 116 is connected to the notch 131. The bottom surface of the connecting groove 116 protrudes from the bottom surface of the second overflow receiving groove 114b, that is, the depth of the connecting groove 116 is less than the depth of the second overflow receiving groove 114b.

[0127] By providing a connecting groove 116 between the second overflow receiving tank 114b and the receiving through hole 13, the conductive slurry overflowing into the connecting groove 116 and the conductive slurry overflowing into the second overflow receiving tank 114b can connect with the conductive slurry in the receiving through hole 13 to form a whole. This further expands the contact area between the conductive connection part 4 and the appearance structure 2, thereby reducing the contact resistance between the conductive connection part 4 and the appearance structure 2, which is more conducive to the smooth discharge of static charge on the appearance structure 2. At the same time, since the bottom surface of the connecting groove 116 protrudes from the bottom surface of the second overflow receiving tank 114b, the bottom surface of the connecting groove 116 and the bottom surface of the second overflow receiving tank 114b form a step, which is beneficial for the connecting groove 116 to guide the overflowing conductive slurry to the second overflow receiving tank 114b.

[0128] Of course, in addition to being connected to the notch 131 through the connecting groove 116, the second overflow receiving groove 114b can also be directly connected to the notch 131 of the receiving through hole 13.

[0129] In the embodiments of this application, such as Figure 12 As shown, a first overflow receiving groove 114a and a second overflow receiving groove 114b can be provided around the receiving through hole 13. Of course, it is not limited to this. Alternatively, only one of the first overflow receiving groove 114a and the second overflow receiving groove 114b can be provided around the receiving through hole 13. The specific arrangement can be determined according to the actual situation.

[0130] In some embodiments, such as Figure 14 , Figure 16 and Figure 17 As shown, Figure 16 for Figure 8 CC section view of the rear cover 120 in the middle. Figure 17 for Figure 8 The rear cover 120 is partially enlarged at the receiving through hole 13. The bottom surface 111 of the cavity 11 includes an adhesive surface 117 and a support surface 118 protruding from the adhesive surface 117. An adhesive layer 6 (such as an adhesive layer) for the appearance structure 2 is provided between the adhesive surface 117 and the appearance structure 2. The support surface 118 is located at the edge of the cavity 11 and is used to support the appearance structure 2.

[0131] By providing a support surface 118 at the edge of the cavity 11, the support surface 118 can support the edge of the appearance structure 2, preventing the edge of the appearance structure 2 from sinking inward, so that the edge of the appearance structure 2 is flush with the edge of the cavity 11, thereby preventing the edge of the cavity 11 from forming a protruding edge that scratches the hand during the use of the electronic device.

[0132] Among them, such as Figure 14 As shown, there are multiple support surfaces 118, which are arranged at intervals along the circumference of the cavity 11. Of course, it is not limited to this; the number of support surfaces 118 can also be one, and the support surface 118 can be an annular support surface provided at the edge of the cavity 11.

[0133] In some embodiments, such as Figure 14 and Figure 15 As shown, the conductive connection portion 4 penetrates the support surface 118 and is electrically connected to the exterior structural component 2. That is, the receiving through-hole 13 is provided on the support surface 118. This arrangement separates the conductive connection portion 4 from the adhesive layer 6 of the exterior structural component. During the fabrication of the conductive connection portion 4, the adhesive material of the adhesive layer 6 is less likely to enter the receiving through-hole 13, thus preventing the conductive connection portion 4 from being mixed with the adhesive material of the adhesive layer 6, thereby ensuring the conductivity of the conductive connection portion 4.

[0134] Among them, such as Figure 14 and Figure 15 As shown, the overflow receiving groove 114 is correspondingly provided on the support surface 118 where the receiving through hole 13 is located.

[0135] In some embodiments, such as Figure 12 and Figure 14 As shown, a clearance hole 113 is provided on the bottom surface 111 of the cavity 11. The clearance hole 113 penetrates the surface 10b of the second cover and is used for the electronic device 330 inside the electronic device to extend into. With this configuration, the electronic device inside the electronic device can make full use of the space of the clearance hole 113, reducing the excessive occupation of the second accommodating space 140 by the electronic device in the height direction, thereby helping to reduce the thickness of the electronic device.

[0136] For details regarding the specific types and configurations of the electronic components 330 within the electronic device, please refer to [link / reference needed]. Figure 5 The electronic device shown in the diagram uses the structure shown in the diagram, which will not be described in detail here.

[0137] In some embodiments, such as Figure 12 and Figure 14 As shown, the clearance hole 113 can be set in the central area of ​​the cavity bottom surface 111, and the adhesive surface 117 is set around the periphery of the clearance hole 113 and is arranged around the clearance hole 113.

[0138] In some embodiments, such as Figure 12 and Figure 14 As shown, a raised rib 119 is provided at the edge of the clearance hole 113. The raised rib 119 is a strip-shaped structure and extends along the edge of the clearance hole 113. The raised rib 119 is used to support the appearance structural component 2. With this arrangement, the raised rib 119 can improve the rigidity of the appearance structural component 2 at the clearance hole 113, thereby reducing the indentation deformation of the appearance structural component 2 towards the clearance hole 113 when it is pressed by external force, thus improving the structural stability of the appearance structural component 2. In addition, the raised rib 119 can also block the adhesive layer 6, which can greatly reduce the probability of the adhesive layer 6 leaking out of the clearance hole 113.

[0139] Among them, such as Figure 12 and Figure 14 As shown, there can be multiple ribs 119, such as three, with multiple ribs 119 arranged around the clearance hole 113.

[0140] In some embodiments, such as Figure 16 and Figure 17 As shown, the cover 1 includes a cover body 16 and an appearance decorative layer 15 covering the cover body 16. The outer surface of the appearance decorative layer 15 is the first cover surface 10a, and the inner surface of the cover body 16 is the second cover surface 10b. A cavity 11 is provided through the appearance decorative layer 15.

[0141] Among them, such as Figure 16 and Figure 17 As shown, the cover body 16 is made of non-metallic materials, such as plastic, glass, ceramic, fiber composite materials, etc.; the exterior decorative layer 15 can be a decorative paint layer, such as a piano lacquer layer, a matte paint layer, a gradient paint layer, a textured paint layer, etc. The exterior decorative layer 15 can also be a coating, such as a scratch-resistant coating, an anti-fingerprint coating, an anti-reflective coating, etc.

[0142] In some embodiments, such as Figure 18 , Figure 19 and Figure 20 As shown, Figure 18 This is an assembly diagram of the exterior structural component 2, the inner conductive component 3, the conductive connection part 4, and the support frame 5 in the third embodiment of this application. Figure 19 for Figure 18 DD cross-sectional view of the component shown. Figure 20 for Figure 19 The EE cross-sectional view of the exterior structural component 2 is shown. The exterior structural component 2 includes a first steel sheet 21 and a first nickel layer 22. The first nickel layer 22 is disposed in the central region of the first steel sheet 21 and is used for electrical connection with the testing equipment.

[0143] Because the nickel layer has good conductivity, by setting the first nickel layer 22 on the first steel sheet 21, the strength of the appearance structure 2 (the first steel sheet 21 has high strength) can be guaranteed, while the contact resistance between the testing equipment and the appearance structure 2 can be reduced, thus facilitating the testing by the testing equipment.

[0144] The testing device can be a multi-point pen, with one contact abutting against the first nickel layer 22 and the other contact abutting against the inner conductive component 3, to perform resistance testing on the conductive channel formed by the outer structural component 2, the conductive connection part 4 and the inner conductive component 3, so as to ensure that the resistance value of the conductive channel is less than a set value (e.g., 10 ohms).

[0145] In some embodiments, such as Figure 20 As shown, the first nickel layer 22 is polygonal in shape, such as a rectangle, but it is not limited to this; the first nickel layer 22 can also be circular.

[0146] In some embodiments, such as Figures 18-20 As shown, the first nickel layer 22 is disposed on the inner surface of the first steel sheet 21 to avoid affecting the appearance of the appearance structural component 2.

[0147] In some embodiments, such as Figures 18-20 As shown, the exterior structural component 2 also includes a second nickel layer 23, which is disposed on the edge region of the first steel sheet 21 and abuts against the conductive connection portion 4. Since the nickel layer has good conductivity, the contact resistance between the exterior structural component 2 and the conductive connection portion 4 is reduced through the contact between the second nickel layer 23 and the conductive connection portion 4, thereby ensuring good conductivity between the exterior structural component 2 and the conductive connection portion 4, so that static charges on the exterior structural component 2 can be smoothly discharged.

[0148] In some embodiments, such as Figure 20 As shown, the first steel sheet 21 is a polygon with an even number of sides, and there are two second nickel layers 23. The two second nickel layers 23 are symmetrical about the geometric center point of the first steel sheet 21, and one of the second nickel layers 23 abuts against the conductive connection part 4.

[0149] Since the two second nickel layers 23 are centrally symmetrical about the geometric center of the first steel sheet 21, the two second nickel layers 23 can still overlap after the appearance structure 2 is rotated 180 degrees. In this way, no matter how the left and right ends or the top and bottom ends of the appearance structure 2 are swapped, there will always be a second nickel layer 23 that abuts against the conductive connection part 4 after the appearance structure 2 is installed into the cavity 11, thereby improving the assembly error tolerance of the appearance structure 2.

[0150] In some embodiments, such as Figure 20As shown, the second nickel layer 23 is trapezoidal in shape, but it is not limited to this. The shape of the second nickel layer 23 can also be rectangular, circular, etc.

[0151] In some embodiments, such as Figure 20 As shown, the exterior structural component 2 also includes an insulating layer 24 covering the first steel sheet 21, which separates the first nickel layer 22 from the second nickel layer 23. The insulating layer 24 can be an insulating ink layer.

[0152] In the embodiments of this application, such as Figure 20 As shown, a first nickel layer 22 and a second nickel layer 23 are simultaneously provided on the first steel sheet 21. Of course, it is not limited to this. Either the first nickel layer 22 or the second nickel layer 23 can be provided on the first steel sheet 21. The specific arrangement can be determined according to the actual situation.

[0153] In some embodiments, such as Figure 19 and Figure 21 As shown, Figure 21 for Figure 19 The component shown is a K-direction view after the inner conductive part 3 has been removed. The support frame 5 is bonded to the outer structural part 2, for example, by providing an adhesive layer (not shown in the figure) between the support frame 5 and the outer structural part 2. Of course, in addition to bonding, the support frame 5 can also be connected to the outer structural part 2 by fasteners (such as screws).

[0154] In some embodiments, such as Figure 19 and Figure 21 As shown, the support frame 5 is disposed on the insulating layer 24, and the first nickel layer 22 is disposed on the inner surface of the first steel sheet 21. The frame hole 51 of the support frame 5 is disposed opposite to the first nickel layer 22. In this arrangement, the frame hole 51 serves to avoid the detection equipment, so as to facilitate the electrical connection between the detection equipment and the first nickel layer 22.

[0155] Specifically, the relative arrangement of the frame hole 51 and the first nickel layer 22 means that the orthographic projection of the frame hole 51 on the external structural component 2 overlaps with the first nickel layer 22. Figure 21 As shown, the first nickel layer 22 is located within the orthographic projection area of ​​the frame hole 51 on the exterior structural component 2.

[0156] In some embodiments, such as Figure 18 and Figure 19As shown, the inner conductive component 3 includes a second steel sheet 31 and a third nickel layer 32. The third nickel layer 32 covers the surface of the second steel sheet 31 near the conductive connection portion 4 and abuts against the conductive connection portion 4. By abutting against the conductive connection portion 4 with the third nickel layer 32, the strength of the inner conductive component 3 (the second steel sheet 31 has high strength) is ensured, while the contact resistance between the inner conductive component 3 and the conductive connection portion 4 is reduced. This ensures good conductivity between the inner conductive component 3 and the conductive connection portion 4, so that static charge on the outer structural component 2 can be smoothly discharged.

[0157] In some embodiments, such as Figure 18 and Figure 19 As shown, the inner conductive element 3 also includes a fourth nickel layer 34, which covers the surface of the second steel sheet 31 away from the conductive connection portion 4. This arrangement reduces the contact resistance between the inner conductive element 3 and the elastic connector 320, thereby ensuring good conductivity between the inner conductive element 3 and the elastic connector 320, so that static charges on the outer structural element 2 can be smoothly guided to the reference ground of the electronic device.

[0158] In the embodiments of this application, such as Figure 19 As shown, the second steel sheet 31 is provided with both a third nickel layer 32 and a fourth nickel layer 34. Of course, it is not limited to this. Either the third nickel layer 32 or the fourth nickel layer 34 can be provided on the second steel sheet 31. The specific arrangement can be determined according to the actual situation.

[0159] In some embodiments, such as Figure 22 As shown, Figure 22 for Figure 12 The image shows a rear side view of the back cover 120. The mounting portion 12 is an adhesive area provided on the surface 10b of the second cover. This adhesive area is used to provide an adhesive layer for bonding the inner conductive component 3 to the inner conductive component 3. A positioning line 14 is provided around the mounting portion 12 to position the mounting portion 12. By providing the positioning line 14, the positioning line 14 positions the inner conductive component 3, ensuring that the inner conductive component 3 is accurately installed in the mounting portion 12, preventing a significant deviation between the actual installation position of the inner conductive component 3 and the position of the mounting portion 12.

[0160] In some embodiments, such as Figure 22 As shown, positioning line 14 can be a laser engraving line.

[0161] Figure 23 This is a partial view of the rear cover 120 in the fourth embodiment of this application at the appearance structure 2. Figure 24 for Figure 23 The diagram shows the exterior structural component 2 of the back cover 120 separated from the protective film. Figure 23 , Figure 24The back cover 120 shown is Figures 8 to 22 The main difference of the back cover 120 shown is that a protective film is provided on the outer side of the exterior structural component 2, as described below:

[0162] like Figure 23 and Figure 24 As shown, the back cover 120 also includes a protective film 7. The protective film 7 includes a film body 71 covering the outside of the outer structural component 2, and a lug 72 connected to the edge of the film body 71, with the lug 72 extending towards the periphery of the cavity 11. By covering the outside of the outer structural component 2 with the protective film 7, the film body 71 can protect the outer structural component 2 and prevent foreign objects from scratching the outer surface of the outer structural component 2 during the manufacturing process. By providing the lug 72 at the edge of the film body 71, the user can peel the protective film 7 off the outside of the outer structural component 2 through the lug 72 when using the electronic device.

[0163] In some embodiments, such as Figure 23 As shown, the film body 71 of the protective film 7 can be bonded to the appearance structure 2.

[0164] In some embodiments, such as Figure 23 As shown, the lug 72 has a through hole 721. With this design, during the application of the protective film 7, the through hole 721 can serve as a visual positioning tool, ensuring that the protective film 7 is applied to the correct position along the circumference.

[0165] Figure 25 This is a front view of the electronic device in its unfolded state according to the fifth embodiment of this application. Figure 26 for Figure 25 The diagram shows the back side of the electronic device. Figure 27 for Figure 25 FF cross-sectional view of the electronic device in the middle. Figure 28 for Figure 27 The diagram shown is a schematic of the electronic device in its folded state. Figure 29 for Figure 28 Enlarged view of a portion of the exterior structural component 2. Figures 25-29 The electronic devices shown are Figure 5 The main difference between the electronic devices shown is that they are of different types, as detailed below:

[0166] like Figures 25-28As shown, the electronic device is a foldable electronic device (foldable mobile phone), including a display screen 200 and a housing 100. The housing 100 includes a first housing 150, a second housing 160 and a hinge mechanism 180. The first housing 150 and the second housing 160 are used to support the display screen 200. The hinge mechanism 180 is an outward folding hinge mechanism and is disposed at the junction of the first housing 150 and the second housing 160 so that the first housing 150 and the second housing 160 can switch between an unfolded state and a folded state.

[0167] like Figure 25 and Figure 27 As shown, the display screen 200 includes a first screen area 210, a second screen area 220, and a third screen area 230 connected between the first screen area 210 and the second screen area 220. The first screen area 210 covers the first housing 150, the second screen area 220 covers the second housing 160, and the third screen area 230 covers the rotating shaft mechanism 180.

[0168] like Figure 25 and Figure 27 As shown, when the first housing 150 and the second housing 160 are in the unfolded state, the first housing 150 and the second housing 160 are arranged side by side, the display screen 200 is unfolded, and the display area of ​​the display screen 200 is exposed to facilitate the display of image information to the user.

[0169] like Figure 28 As shown, when the first housing 150 and the second housing 160 are in a folded state, the first housing 150 and the second housing 160 are stacked on top of each other, and the display screen 200 is located outside the first housing 150, the second housing 160 and the rotating mechanism 180. At this time, the first screen area 210 and the second screen area 220 of the display screen 200 are parallel or approximately parallel (for example, the deviation is within 10°), and the cross-sectional shape of the third screen area 230 of the display screen 200 is an inverted U-shape.

[0170] The display screen 200 can be entirely made of flexible screen structure, such as the first screen area 210, the second screen area 220 and the third screen area 230 of the display screen 200 are all flexible screen structures; of course, the display screen 200 can also have a flexible screen structure in the middle folding part and a rigid screen structure on both sides, such as the first screen area 210 and the second screen area 220 of the display screen 200 are rigid screen structures and the third screen area 230 is a flexible screen structure.

[0171] like Figure 27 and Figure 28 As shown, the rotating shaft mechanism 180 includes a rotating shaft base 181, a shaft cover 182, and a swing arm assembly 183. The shaft cover 182 is disposed on the back side of the rotating shaft base 181 (i.e., the side of the rotating shaft base 181 away from the third screen area 230). The rotating shaft base 181 is connected to the first housing 150 and the second housing 160 respectively through the swing arm assembly 183.

[0172] like Figure 26 and Figure 27 As shown, the shaft cover 182 is an external part of the rotating shaft mechanism 180. When the first housing 150 and the second housing 160 are in the unfolded state, the shaft cover 182 is located between the first housing 150 and the second housing 160, and is used to cover the inner rotating shaft base 181 and the swing arm assembly 183.

[0173] like Figure 27 and Figure 28 As shown, the first housing 150 includes a first middle frame 151 and a first rear cover 152, with the first middle frame 151 disposed between the first screen area 210 and the first rear cover 152; the second housing 160 includes a second middle frame 161 and a second rear cover 162, with the second middle frame 161 disposed between the second screen area 220 and the second rear cover 162.

[0174] Of course, in addition to being an outward folding hinge mechanism, the hinge mechanism 180 can also be an inward folding hinge mechanism. When the first housing 150 and the second housing 160 are in a folded state, the display screen 200 is folded between the first housing 150 and the second housing 160.

[0175] like Figure 27 , Figure 28 and Figure 29 As shown, the first back cover 152 includes a cover body 1, an external structural component 2, an inner conductive component 3, and a conductive connection part 4. The cover body 1 has a first cover surface 10a and a second cover surface 10b arranged opposite to each other. The first cover surface 10a is the external surface of the cover body 1. The first cover surface 10a is provided with a cavity 11, and the external structural component 2 is a conductive component and is disposed in the cavity 11. The second cover surface 10b is provided with a mounting part 12, which is used to install the inner conductive component 3.

[0176] The conductive connection part 4 is embedded in the cover 1. The conductive connection part 4 electrically connects the outer structural component 2 and the inner conductive component 3. At least the outer structural component 2, the conductive connection part 4 and the inner conductive component 3 form a conductive channel. The inner conductive component 3 is electrically connected to the reference ground of the electronic device.

[0177] In some embodiments, such as Figure 27 and Figure 28 As shown, the reference ground can be the ground layer of the first circuit board 310, which is disposed in the first housing 150. The first circuit board 310 has an elastic connector 320, which is electrically connected to the ground layer of the first circuit board 310 and also electrically connected to the inner conductive member 3. Besides the ground layer of the first circuit board 310, in some embodiments, the reference ground can also be the first middle frame 151, which is a metal or alloy middle frame, such as an aluminum middle frame or an aluminum alloy middle frame.

[0178] In some embodiments, such as Figure 27 and Figure 28 As shown, the elastic connector 320 can be a pogo pin, with the pogo pin abutting against the inner conductive member 3. However, it is not limited to this; the elastic connector 320 can also be a conductive spring, with the conductive spring abutting against the inner conductive member 3.

[0179] As for the specific structure of the cover 1, the external structural component 2, the inner conductive component 3, and the conductive connection part 4, please refer to the electronic device settings in the first embodiment, the second embodiment, the third embodiment, and the fourth embodiment of this application, and will not be described in detail here.

[0180] In some embodiments, such as Figure 26 and Figure 27 As shown, the second rear cover 162 is provided with a magnetic element 400, such as... Figure 28 and Figure 29 As shown, when the first housing 150 and the second housing 160 are in a folded state, the appearance structural component 2 on the first rear cover 152 and the area on the second rear cover 162 where the magnetic component 400 is located are positioned opposite each other, and the magnetic component 400 attracts the appearance structural component 2. With this arrangement, the first housing 150 and the second housing 160 can fit more tightly under the magnetic attraction between the magnetic component 400 and the appearance structural component 2, preventing the first housing 150 and the second housing 160 from opening under external force when in a folded state, thereby improving the stability of the first housing 150 and the second housing 160 when in a folded state.

[0181] Specifically, when the first housing 150 and the second housing 160 are in a folded state, the relative arrangement of the external structural component 2 and the area where the magnetic 400 is located on the second rear cover 162 means that the orthographic projection of the external structural component 2 on the second rear cover 162 overlaps with the orthographic projection of the magnetic 400 on the second rear cover 162. This "overlap" can be complete or partial, and is not specifically limited here.

[0182] In some embodiments, such as Figure 28 and Figure 29 As shown, the magnetic attractor 400 can be a permanent magnet, and the external structural component 2 can be a steel sheet. Of course, it is not limited to this; in other embodiments, the magnetic attractor 400 can also be an electromagnet, and the external structural component 2 can be a nickel sheet.

[0183] In some embodiments, such as Figure 28 and Figure 29As shown, the magnetic locator 400 is disposed in the second housing 160 and on the inner surface of the second rear cover 162. For example, the magnetic locator 400 can be adhered to the inner surface of the second rear cover 162. Of course, it is not limited to this. In some embodiments, the inner surface of the second rear cover 162 is provided with a magnetic locator receiving groove, and the magnetic locator 400 is embedded in the magnetic locator receiving groove.

[0184] In some embodiments, such as Figure 26 and Figure 27 As shown, the electronic device also includes a first camera module 500, which is a rear-facing camera module and is disposed within the second housing 160. The first camera module 500 includes a first camera circuit board 510 and a first camera 520 disposed on the first camera circuit board 510. A camera window 1621 is provided on the second rear cover 162, and the camera window 1621 is positioned opposite to the light-receiving end of the first camera 520.

[0185] Among them, such as Figure 26 As shown, the number of first cameras 520 can be multiple, such as three, or one; no specific limitation is made here.

[0186] In some embodiments, such as Figure 26 and Figure 27 As shown, the magnetic suction component 400 is disposed on the side of the first camera 520 near the rotating shaft mechanism 180.

[0187] Figure 30 This is a front view of the electronic device in its unfolded state according to the sixth embodiment of this application. Figure 31 for Figure 30 The diagram shows the back side of the electronic device. Figure 32 for Figure 30 GG cross-sectional view of the electronic device in the middle. Figure 33 for Figure 32 The diagram shows the structure of the electronic device in its folded state.

[0188] Figures 30-33 The electronic devices shown are Figures 25-29 The main differences between the electronic devices shown are their structures and folding methods, as detailed below:

[0189] like Figures 30-33 As shown, the electronic device is a foldable electronic device (foldable mobile phone), including a display screen 200 and a housing 100. The housing 100 includes a first housing 150, a second housing 160, a third housing 170 and a pivot mechanism 180. The first housing 150, the second housing 160 and the third housing 170 are used to support the display screen 200.

[0190] There are two rotating shaft mechanisms 180, namely a first rotating shaft mechanism 180a and a second rotating shaft mechanism 180b. The first rotating shaft mechanism 180a is an outward folding rotating shaft mechanism and is located at the junction of the first housing 150 and the second housing 160, so that the first housing 150 and the second housing 160 can switch between an unfolded state and a folded state. The second rotating shaft mechanism 180b is an inward folding rotating shaft mechanism and is located at the junction of the second housing 160 and the third housing 170, so that the third housing 170 and the second housing 160 can switch between an unfolded state and a folded state.

[0191] like Figure 30 and Figure 32 As shown, the display screen 200 includes a first screen area 210, a second screen area 220, two third screen areas 230 and a fourth screen area 240. The first screen area 210 covers the first housing 150, the second screen area 220 covers the second housing 160, the fourth screen area 240 covers the third housing 170, and the two third screen areas 230 cover the first rotating shaft mechanism 180 and the second rotating shaft mechanism 180, respectively.

[0192] like Figure 30 and Figure 32 As shown, when the first housing 150 and the second housing 160 are in the unfolded state, and the second housing 160 and the third housing 170 are in the unfolded state, the first housing 150, the second housing 160 and the third housing 170 are arranged side by side, and the second housing 160 is disposed between the first housing 150 and the third housing 170; the display screen 200 is unfolded, and the display area of ​​the display screen 200 is exposed to facilitate the display of image information to the user.

[0193] like Figure 33 As shown, when the first housing 150 and the second housing 160 are in a folded state, and the second housing 160 and the third housing 170 are in a folded state, the first housing 150, the second housing 160, and the third housing 170 are stacked. The first screen area 210 of the display screen 200 is located outside the first housing 150, and the second screen area 220 and the fourth screen area 240 are both located between the second housing 160 and the third housing 170. At this time, any two of the first screen areas 210, the second screen area 220, and the fourth screen area 240 of the display screen 200 are parallel or approximately parallel (for example, the deviation is within 10°). The cross-sectional shape of the two third screen areas 230 of the display screen 200 is U-shaped.

[0194] Among them, such as Figure 32 and Figure 33As shown, the first housing 150 includes a first middle frame 151 and a first rear cover 152, with the first middle frame 151 disposed between the first screen area 210 and the first rear cover 152; the second housing 160 includes a second middle frame 161 and a second rear cover 162, with the second middle frame 161 disposed between the second screen area 220 and the second rear cover 162; the third housing 170 includes a third middle frame 171 and a third rear cover 172, with the third middle frame 171 disposed between the fourth screen area 240 and the third rear cover 172.

[0195] like Figure 31 , Figure 32 and Figure 33 As shown, the first back cover 152 includes a cover body 1, an external structural component 2, an inner conductive component 3, and a conductive connection part 4. The cover body 1 has a first cover surface 10a and a second cover surface 10b arranged opposite to each other. The first cover surface 10a is the external surface of the cover body 1. The first cover surface 10a is provided with a cavity 11, and the external structural component 2 is a conductive component and is disposed in the cavity 11. The second cover surface 10b is provided with a mounting part 12, which is used to install the inner conductive component 3.

[0196] The conductive connection part 4 is embedded in the cover 1. The conductive connection part 4 electrically connects the outer structural component 2 and the inner conductive component 3. At least the outer structural component 2, the conductive connection part 4 and the inner conductive component 3 form a conductive channel. The inner conductive component 3 is electrically connected to the reference ground of the electronic device.

[0197] In some embodiments, such as Figure 32 and Figure 33 As shown, the reference ground can be the ground layer of the first circuit board 310, which is disposed in the first housing 150. The first circuit board 310 has an elastic connector 320, which is electrically connected to the ground layer of the first circuit board 310 and also electrically connected to the inner conductive member 3. In addition to the ground layer of the first circuit board 310, in some embodiments, the reference ground can also be the first middle frame 151.

[0198] In some embodiments, such as Figure 32 and Figure 33 As shown, the elastic connector 320 can be a pogo pin, with the pogo pin abutting against the inner conductive member 3. However, it is not limited to this; the elastic connector 320 can also be a conductive spring, with the conductive spring abutting against the inner conductive member 3.

[0199] As for the specific structure of the cover 1, the external structural component 2, the inner conductive component 3, and the conductive connection part 4, please refer to the electronic device settings in the first embodiment, the second embodiment, the third embodiment, and the fourth embodiment of this application, and will not be described in detail here.

[0200] In some embodiments, such as Figure 32 and Figure 33 As shown, the second rear cover 162 is provided with a magnetic element 400, such as... Figure 33 As shown, when the first housing 150 and the second housing 160 are in a folded state, the orthographic projection of the exterior structural member 2 on the second rear cover 162 overlaps with the orthographic projection of the magnetic member 400 on the second rear cover 162, and the magnetic member 400 attracts the exterior structural member 2.

[0201] Among them, such as Figure 32 and Figure 33 As shown, the magnetic chuck 400 is disposed in the second housing 160 and on the inner surface of the second rear cover 162. Of course, it is not limited to this. In some other embodiments, the inner surface of the second rear cover 162 is provided with a magnetic chuck receiving groove, and the magnetic chuck 400 is embedded in the magnetic chuck receiving groove.

[0202] In some embodiments, such as Figure 31 and Figure 32 As shown, the electronic device also includes a second camera module 700, which is a rear-facing camera module and is disposed within the third housing 170. The second camera module 700 includes a second camera circuit board 710 and a second camera 520 disposed on the second camera circuit board 710. A second camera window 1721 is provided on the third rear cover 172, and the second camera window 1721 is positioned opposite to the light-receiving end of the second camera 720.

[0203] Among them, such as Figure 31 As shown, the number of second cameras 720 can be multiple, such as three, or one; no specific limitation is made here.

[0204] In some embodiments, such as Figure 33 As shown, when the second housing 160 and the third housing 170 are in the folded state, the orthographic projection of the magnetic component 400 on the third rear cover 172 is offset from the orthographic projection of the second camera 520 on the third rear cover 172. That is, the orthographic projection of the magnetic component 400 on the third rear cover 172 is outside the orthographic projection of the second camera 520 on the third rear cover 172. This arrangement keeps the magnetic component 400 away from the second camera 520, thus avoiding interference with the normal operation of the focusing motor of the second camera 520 (the focusing motor of the second camera 520 typically contains magnetic components such as magnets, which can easily generate magnetic field interference with the magnetic component 400).

[0205] As for the other structures of the electronic device in the embodiments of this application, they can be set with reference to the structure of the electronic device in the fifth embodiment of this application, and will not be described in detail here.

[0206] The types of cross-sectional lines in the accompanying drawings are for distinguishing different components and should not be construed as limiting the materials of the components. The accompanying drawings are for illustrating structural composition and are not shown to scale of the actual product.

[0207] While the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may arise based on the claims of this application. To provide a thorough understanding of this application, many specific details are included in the above description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0208] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0209] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0210] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The directional terms mentioned in the embodiments of this application, such as "upper," "lower," "left," "right," "inner," and "outer," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. "Multiple" refers to at least two.

[0211] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0212] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A back cover for an electronic device, characterized in that, It includes a cover (1), an exterior structural component (2), an inner conductive component (3), and a conductive connection part (4); The cover (1) has a first cover surface (10a) and a second cover surface (10b) arranged opposite to each other. The first cover surface (10a) is the outer surface of the cover (1). The first cover surface (10a) is provided with a cavity (11). The outer structural component (2) is a conductive component and is disposed in the cavity (11). The second cover surface (10b) is provided with a mounting part (12). The mounting part (12) is used to install the inner conductive component (3). The conductive connection part (4) is embedded in the cover (1). The conductive connection part (4) electrically connects the outer structural component (2) to the inner conductive component (3). At least the outer structural component (2), the conductive connection part (4) and the inner conductive component (3) constitute a conductive channel. The cover (1) between the outer structural component (2) and the inner conductive component (3) is provided with a receiving through hole (13), and the receiving through hole (13) is filled with conductive paste to form the conductive connection part (4). The two ends of the conductive connection part (4) abut against the outer structural component (2) and the inner conductive component (3) respectively. The receiving through hole (13) penetrates the bottom surface (111) of the cavity (11), and the bottom surface (111) of the cavity (11) is provided with an overflow receiving groove (114). The overflow receiving groove (114) is arranged around the receiving through hole (13) and is used to receive the conductive paste that overflows to the outside of the receiving through hole (13). The cavity bottom surface (111) of the concave cavity (11) has a first edge (115), and the receiving through hole (13) is provided at the first edge (115); the overflow receiving groove (114) includes a first overflow receiving groove (114a) and / or a second overflow receiving groove (114b). At least a portion of the first overflow receiving groove (114a) is located between the receiving through hole (13) and the first edge (115); along the arrangement direction (M) of the second overflow receiving groove (114b) and the receiving through hole (13), the second overflow receiving groove (114b) is located on the side of the receiving through hole (13) away from the first edge (115).

2. The back cover according to claim 1, characterized in that, The conductive paste is a conductive silver paste.

3. The back cover according to claim 1, characterized in that, The diameter of the receiving through hole (13) ranges from 0.8 mm to 1.5 mm.

4. The back cover according to claim 1, characterized in that, The resistance of the conductive channel is less than or equal to 10 ohms.

5. The back cover according to claim 1, characterized in that, The first overflow receiving groove (114a) is arranged around the receiving through hole (13), and along the circumference of the receiving through hole (13), the central angle of the receiving through hole (13) corresponding to the first overflow receiving groove (114a) is greater than 90 degrees.

6. The back cover according to claim 1, characterized in that, The receiving through hole (13) has a notch (131) at its edge, and the second overflow receiving groove (114b) is connected to the notch (131).

7. The back cover according to claim 6, characterized in that, The cavity (11) has a connecting groove (116) on its bottom surface (111). The connecting groove (116) is located between the second overflow receiving groove (114b) and the receiving through hole (13). One end of the connecting groove (116) is connected to the second overflow receiving groove (114b), and the other end of the connecting groove (116) is connected to the notch (131). The bottom surface of the connecting groove (116) protrudes from the bottom surface of the second overflow receiving groove (114b).

8. The back cover according to any one of claims 1 to 7, characterized in that, The bottom surface (111) of the cavity (11) includes an adhesive surface (117) and a support surface (118) protruding from the adhesive surface (117). An adhesive layer (6) for the appearance structure (2) is provided between the adhesive surface (117) and the appearance structure (2). The support surface (118) is located at the edge of the cavity (11) and is used to support the appearance structure (2).

9. The back cover according to claim 8, characterized in that, The conductive connection part (4) penetrates the support surface (118) and is electrically connected to the appearance structure (2).

10. The back cover according to any one of claims 1 to 7, characterized in that, The cavity (11) has a clearance hole (113) on the bottom surface (111) of the cavity (11). The clearance hole (113) is provided through the surface (10b) of the second cover and is used for the electronic device (330) inside the electronic device to extend into.

11. The back cover according to claim 10, characterized in that, The clearance hole (113) is provided with a raised rib (119) at the edge. The raised rib (119) is a strip structure and extends along the edge of the clearance hole (113). The raised rib (119) is used to support the appearance structure (2).

12. The back cover according to claim 10, characterized in that, The rear cover also includes a support frame (5) along the depth direction (H) of the clearance hole (113). The support frame (5) is at least partially disposed in the clearance hole (113) and is used to support the exterior structural component (2).

13. The back cover according to any one of claims 1 to 7, characterized in that, The exterior structural component (2) includes a first steel sheet (21), a first nickel layer (22) and / or a second nickel layer (23); The first nickel layer (22) is disposed in the central region of the first steel sheet (21) and is used for electrical connection with the detection device; the second nickel layer (23) is disposed in the edge region of the first steel sheet (21) and abuts against the conductive connection part (4).

14. The back cover according to claim 13, characterized in that, The first steel sheet (21) is a polygon with an even number of sides. There are two second nickel layers (23). The two second nickel layers (23) are symmetrical about the geometric center of the first steel sheet (21). One of the second nickel layers (23) abuts against the conductive connection part (4).

15. The back cover according to any one of claims 1 to 7, characterized in that, The inner conductive element (3) includes a second steel sheet (31), and a third nickel layer (32) and / or a fourth nickel layer (33). The third nickel layer (32) covers the surface of the second steel sheet (31) near the conductive connection (4) and abuts against the conductive connection (4); the fourth nickel layer (33) covers the surface of the second steel sheet (31) away from the conductive connection (4).

16. The back cover according to any one of claims 1 to 7, characterized in that, The mounting part (12) is an adhesive area provided on the surface (10b) of the second cover. The mounting part (12) is provided with a positioning line (14) around its periphery. The positioning line (14) is used to position the mounting part (12).

17. The back cover according to any one of claims 1 to 7, characterized in that, The back cover also includes a protective film (7), which includes a film body (71) covering the outside of the exterior structure (2) and a lug (72) connected to the edge of the film body (71). The lug (72) extends to the periphery of the cavity (11) and has a through hole (721).

18. An electronic device, characterized in that, The device includes a display screen (200) and a housing (100), the housing (100) including a middle frame (110) and a rear cover (120) according to any one of claims 1 to 17, the middle frame (110) being disposed between the display screen (200) and the rear cover (120), and the inner conductive element (3) of the rear cover (120) being electrically connected to the reference ground of the electronic device.

19. An electronic device, wherein the electronic device is a foldable electronic device, characterized in that, It includes a display screen (200), a first housing (150), a second housing (160), and a rotating mechanism (180). The display screen (200) includes a first screen area (210) and a second screen area (220); the first housing (150) includes a first middle frame (151) and a first rear cover (152), the first middle frame (151) being disposed between the first screen area (210) and the first rear cover (152); the second housing (160) includes a second middle frame (161) and a second rear cover (162), the second middle frame (161) being disposed between the second screen area (220) and the second rear cover (162); The rotating shaft mechanism (180) is disposed at the junction of the first housing (150) and the second housing (160), and the first housing (150) and the second housing (160) can switch between an unfolded state and a folded state; Wherein, the first back cover (152) is the back cover according to any one of claims 1 to 17, and the inner conductive element (3) of the first back cover (152) is electrically connected to the reference ground of the electronic device.

20. The electronic device according to claim 19, characterized in that, The second back cover (162) is provided with a magnetic attractor (400). When the first housing (150) and the second housing (160) are in the folded state, the orthographic projection of the appearance structure (2) of the first back cover (152) on the second back cover (162) and the orthographic projection of the magnetic attractor (400) on the second back cover (162) overlap at least partially, and the magnetic attractor (400) attracts the appearance structure (2).

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