Carbon dioxide absorber with drying function and breathing assistance device

Abstract

The application relates to the technical field of carbon dioxide absorbers, in particular to a carbon dioxide absorber with a drying function and a breathing assistance device. In the working process of the carbon dioxide absorber, airflow is dried by a drying device and then enters the absorber body from a first air inlet, the carbon dioxide in the airflow is absorbed by an absorbent in the absorber body, and the carbon dioxide concentration in the airflow is reduced. Since the airflow is dried by the drying device before entering the absorber body, the moisture content in the airflow can be effectively reduced, the humidity of the airflow before entering the absorber body is reduced, the additional consumption of the absorbent in the absorber body caused by the water vapor in the airflow is avoided, the utilization rate of the absorbent in the absorber body is improved, and the replacement frequency of the carbon dioxide absorber is reduced. In this way, the moisture content of the gas entering the carbon dioxide absorber is reduced by the drying device.

Description

Technical Field

[0001] This application relates to the field of carbon dioxide absorber technology, and more particularly to a carbon dioxide absorber with a drying function and a breathing aid device. Background Technology

[0002] Carbon dioxide absorbers are commonly used in the circulatory absorption system of anesthesia machines to help absorb carbon dioxide and other acidic gases, ensuring the patient's respiratory safety. During operation, the patient's exhaled air enters a closed circuit, passes through the absorber, and then enters the inspiratory pathway for the patient to inhale.

[0003] Currently, during the operation of carbon dioxide absorbers, the patient's exhaled air typically enters the absorber directly without treatment. Since exhaled air usually contains a significant amount of moisture, the air entering the absorber has high humidity. If the humidity of the air entering the absorber is too high, the water vapor in the air will react with the absorbent in the absorber, causing the absorbent to be consumed by the water vapor in the air. This reduces the utilization rate of the absorbent and leads to an increased frequency of absorber replacement.

[0004] It is evident that reducing the moisture content of the gas entering the carbon dioxide absorber is a technical problem that urgently needs to be solved. Summary of the Invention

[0005] This application provides a carbon dioxide absorber and breathing aid device with a drying function, which aims to solve the technical problem of how to reduce the moisture content of the gas entering the carbon dioxide absorber in the prior art.

[0006] This application provides a carbon dioxide absorber with a drying function, comprising:

[0007] The absorber body is provided with a first air inlet and a first air outlet;

[0008] A drying device, wherein the drying device is connected to the first air inlet of the absorber body;

[0009] The airflow passes through the drying device to remove water before entering the absorber body through the first air inlet.

[0010] Optionally, the drying device includes a condensation component that dehydrates the airflow by condensation.

[0011] Optionally, the condensation assembly includes a semiconductor refrigeration module for reducing the temperature of the airflow so that moisture in the airflow condenses into a liquid state.

[0012] Optionally, the condensation assembly further includes:

[0013] A condensation chamber, in which the semiconductor refrigeration module is installed, and the condensation chamber is provided with a second air inlet;

[0014] A partition is provided, which divides the condensation chamber into a high-temperature chamber and a low-temperature chamber. The partition is provided with an air vent that connects the high-temperature chamber and the low-temperature chamber. A second air inlet is connected to the high-temperature chamber, and a first air inlet is connected to the low-temperature chamber.

[0015] The semiconductor cooling module is embedded in the partition, with the high-temperature side of the semiconductor cooling module facing the high-temperature chamber and the low-temperature side of the semiconductor cooling module facing the low-temperature chamber.

[0016] Optionally, the condensation assembly further includes:

[0017] A condenser is attached to the low-temperature side of the semiconductor refrigeration module, and the condenser is provided with condenser fins;

[0018] A heat-conducting component is attached to the high-temperature side of the semiconductor condensation module, and the heat-conducting component is provided with heat-conducting fins.

[0019] Optionally, the carbon dioxide absorber further includes: a liquid guiding assembly, wherein a liquid channel is provided inside the liquid guiding assembly, one end of the liquid channel is connected to the bottom of the low temperature chamber, and the other end of the liquid channel is connected to the first gas outlet;

[0020] The highest point of the liquid channel is lower than the bottom of the first air outlet and the low-temperature chamber.

[0021] Optionally, the liquid channel includes:

[0022] A liquid storage chamber, wherein the liquid storage chamber is connected to the first air outlet through a first air outlet pipe;

[0023] A first vertical passage, the top of which is connected to the bottom of the low-temperature greenhouse;

[0024] The second vertical channel has its top end connected to the top end of the liquid storage cavity, and the height of the top end of the second vertical channel is lower than the height of the top end of the first vertical channel.

[0025] A horizontal channel, one end of which is connected to the bottom end of the first vertical channel, and the other end of which is connected to the bottom end of the second vertical channel;

[0026] The top end of the first vent pipe is connected to the first vent, and the bottom end of the first vent pipe extends into the bottom of the liquid storage chamber.

[0027] Optionally, an air baffle is provided in the liquid storage chamber. The air baffle extends from the top to the bottom of the liquid storage chamber to divide the liquid storage chamber into an independent first chamber and a second chamber. The top end of the second vertical channel communicates with the first chamber, and the bottom end of the first vent pipe extends into the bottom of the second chamber.

[0028] The bottom of the air baffle is provided with a liquid passage hole, which connects the bottom of the first chamber with the bottom of the second chamber.

[0029] The bottom of the first vent pipe is higher than the height of the liquid passage hole.

[0030] Optionally, a second vent is provided at the top of the liquid storage chamber, and the second vent is connected to the outside through a second vent pipe.

[0031] On the other hand, this application also provides a respiratory assist device, including the carbon dioxide absorber, which is used to absorb carbon dioxide in the airflow before entering the respiratory assist device.

[0032] The beneficial effects achieved by this application are as follows: During the operation of the carbon dioxide absorber, the airflow is dried by a drying device before entering the absorber body through the first inlet. The absorbent within the absorber body absorbs the carbon dioxide in the airflow, thereby reducing the carbon dioxide concentration in the airflow. Because the airflow is dried by the drying device before entering the absorber body, the moisture content in the airflow is effectively reduced, thus lowering the humidity of the airflow before it enters the absorber body. This avoids additional consumption of the absorbent within the absorber body due to the presence of moisture in the airflow, thereby improving the utilization rate of the absorbent within the absorber body and reducing the replacement frequency of the carbon dioxide absorber. In this way, the moisture content of the gas entering the carbon dioxide absorber is reduced by the drying device. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the internal structure of the carbon dioxide absorber in an embodiment of the present invention;

[0034] Figure 2 This is an embodiment of the present invention. Figure 1 A magnified view of point A in the middle.

[0035] Explanation of main unit symbols:

[0036] 10. Carbon dioxide absorber; 20. Absorber body; 21. First air inlet; 22. First air outlet; 23. First air outlet pipe; 30. Drying device; 31. Condensation assembly; 32. Semiconductor refrigeration module; 33. Condensation component; 331. Condensation fins; 34. Heat-conducting component; 341. Heat-conducting fins; 35. Condensation chamber; 351. Partition; 352. High-temperature chamber; 353. Low-temperature chamber; 354. Second air inlet; 355. Air passage; 40. Liquid guiding assembly; 41. Liquid channel; 42. First vertical channel; 43. Second vertical channel; 44. Horizontal channel; 45. Liquid storage chamber; 451. Air baffle; 452. First chamber; 453. Second chamber; 454. Liquid passage; 455. Second air outlet; 456. Second air outlet pipe. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar units or units having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the invention, and should not be construed as limiting the invention. Furthermore, it should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0038] In the description of this invention, it should be understood that the terms "length", "width", "upper", "lower", "left", "right", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0039] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0040] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the communication within two units or the interaction between two units. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0041] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0042] The following disclosure provides numerous different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0043] In some embodiments of this application, this application provides a respiratory assist device, including a carbon dioxide absorber 10 provided in this application, which is used to absorb carbon dioxide in the airflow before entering the respiratory assist device.

[0044] Please see Figures 1 to 2 In some embodiments of this application, a carbon dioxide absorber 10 with a drying function is provided, comprising: an absorber body 20 and a drying device 30. The absorber body 20 is provided with a first air inlet 21 and a first air outlet 22. The drying device 30 is connected to the first air inlet 21 of the absorber body 20. The airflow is dehydrated by the drying device 30 before entering the absorber body 20 through the first air inlet 21.

[0045] During the operation of the carbon dioxide absorber 10, the airflow is dried by the drying device 30 before entering the absorber body 20 through the first air inlet 21. The absorbent within the absorber body 20 absorbs the carbon dioxide in the airflow, thereby reducing its concentration. Because the airflow is dried by the drying device 30 before entering the absorber body 20, the moisture content is effectively reduced, thus lowering the humidity of the airflow before it enters the absorber body 20. This avoids additional consumption of the absorbent within the absorber body 20 due to moisture in the airflow, improving the utilization rate of the absorbent and reducing the replacement frequency of the carbon dioxide absorber 10. In this way, the drying device 30 reduces the moisture content of the gas entering the carbon dioxide absorber 10.

[0046] In some embodiments of this application, the drying device 30 includes a condensation component 31, which dehydrates the airflow by condensation.

[0047] When the airflow enters the drying device 30, it is cooled by the condenser assembly 31, causing the moisture in the airflow to condense. Once condensed, the moisture leaves the airflow, reducing its moisture content. This condensation process dehydrates the airflow, achieving a drying effect. As a result, the moisture content in the airflow meets the expected requirements before entering the absorber body 20, reducing the additional consumption of the absorbent in the absorber body 20 due to absorbing excess moisture. This improves the utilization rate of the absorbent in the absorber body 20 and reduces the replacement frequency of the carbon dioxide absorber 10.

[0048] In some embodiments of this application, the condensation assembly 31 includes a semiconductor cooling module 32, which is used to reduce the temperature of the airflow so that the moisture in the airflow condenses into a liquid state.

[0049] Direct current can be supplied to the semiconductor cooling module 32. When the direct current passes through the thermocouple formed by two different semiconductor materials connected in series in the semiconductor cooling module 32, the two ends of the thermocouple will absorb heat and release heat respectively, thereby achieving the purpose of cooling.

[0050] Specifically, it can be understood that the movement of charge carriers in a conductor forms an electric current. Since charge carriers occupy different energy levels in different materials, when they move from a higher energy level to a lower energy level, they release excess heat; conversely, they need to absorb heat from the outside, which manifests as cooling. Semiconductor cooling devices utilize this effect to achieve heat transfer by controlling the magnitude and direction of the current, thereby achieving the purpose of cooling or heating.

[0051] The airflow is cooled by the semiconductor cooling module 32, causing the moisture in the airflow to condense into a liquid state, thereby achieving the effect of drying the airflow. Since there are no sliding parts in the process of cooling the airflow using the semiconductor cooling module 32, the reliability is high, making it suitable for applications with limited space and high reliability requirements, and it also avoids the problem of refrigerant contamination.

[0052] Please see Figures 1 to 2 In some embodiments of this application, the condensation assembly 31 further includes a condensation chamber 35 and a partition 351. A semiconductor refrigeration module 32 is installed within the condensation chamber 35, which has a second air inlet 354. The partition 351 divides the condensation chamber 35 into a high-temperature chamber 352 and a low-temperature chamber 353. The partition 351 has an air vent 355 connecting the high-temperature chamber 352 and the low-temperature chamber 353. The second air inlet 354 connects to the high-temperature chamber 352, and the first air inlet 21 connects to the low-temperature chamber 353. The semiconductor refrigeration module 32 is embedded in the partition 351, with its high-temperature side facing the high-temperature chamber 352 and its low-temperature side facing the low-temperature chamber 353.

[0053] The condensation chamber 35 is divided into a high-temperature chamber 352 and a low-temperature chamber by a partition 351. After the airflow enters the high-temperature chamber through the second air inlet 354, it is heated by the heat dissipated by the semiconductor cooling module 32, thereby increasing the movement speed of water molecules in the airflow. After being heated in the high-temperature chamber 352, the airflow enters the low-temperature chamber 353 through the air outlet 355, and is then cooled by the semiconductor cooling module 32, thereby reducing the intensity of water molecule movement in the airflow. When water molecules in the airflow collide with the surface of the low-temperature object, they are adsorbed onto the surface of the low-temperature object. Because the airflow is heated in the high-temperature chamber 352, the movement speed of water molecules in the airflow increases, allowing water molecules in the heated airflow in the low-temperature chamber 353 to collide more quickly with the surface of the low-temperature object. This increases the amount of water condensed on the surface of the low-temperature object per unit time, thereby increasing the condensation rate of water in the airflow and improving the drying efficiency of the drying device 30. This ensures that the dryness of the airflow before entering the absorber body 20 meets the expected requirements, thereby improving the utilization rate of the absorbent in the absorber body 20 and reducing the replacement frequency of the carbon dioxide absorber 10.

[0054] After the airflow is dried in the low-temperature chamber 353, it enters the absorber body 20 through the first air inlet 21, where the absorbent in the absorber body 20 absorbs the carbon dioxide in the airflow.

[0055] In some embodiments of this application, the absorbent includes at least one of calcium hydroxide, calcium lime, sodium lime, and barium lime.

[0056] Based on the chemical properties of the absorbent, it is known that the absorbent can react with carbon dioxide to absorb carbon dioxide, and it can also react with water to absorb moisture in the airflow. Therefore, if the moisture content in the airflow is too high, the absorbent will be consumed too quickly due to the need to absorb additional moisture. Furthermore, a high moisture content will cause the absorbent to react with both carbon dioxide and water simultaneously, thus affecting its carbon dioxide absorption efficiency. Consequently, a high moisture content in the airflow not only affects the utilization rate of the absorbent but also its carbon dioxide absorption efficiency. Drying the airflow before it enters the absorber body 20 using the drying device 30 effectively reduces the moisture content, thereby lowering the humidity of the airflow before it enters the absorber body 20. This prevents additional consumption of the absorbent within the absorber body 20 due to moisture in the airflow, improving the utilization rate of the absorbent within the absorber body 20, reducing the replacement frequency of the carbon dioxide absorber 10, and ensuring that the absorbent's carbon dioxide absorption efficiency meets the expected requirements.

[0057] In some embodiments of this application, the condensation assembly 31 further includes a condenser 33 and a heat-conducting element 34. The condenser 33 is bonded to the low-temperature side of the semiconductor refrigeration module 32, and the condenser 33 is provided with condensation fins 331. The heat-conducting element 34 is bonded to the high-temperature side of the semiconductor condensation module, and the heat-conducting element 34 is provided with heat-conducting fins 341.

[0058] By utilizing the heat-conducting element 34 and its heat-conducting fins 341, the heat dissipation rate of the high-temperature side of the semiconductor refrigeration module 32 is increased. This allows the airflow to absorb more heat as it passes through the high-temperature chamber 352, ensuring both the heat dissipation effect of the semiconductor refrigeration module 32 and the temperature rise of the airflow. By ensuring the heat dissipation effect of the semiconductor refrigeration module 32, overheating is avoided, thereby reducing the failure rate and extending its service life. Furthermore, by ensuring the temperature rise of the airflow, water molecules in the airflow can absorb sufficient energy, increasing their activity. This ensures that the condensation rate and amount of moisture in the airflow within the low-temperature chamber 353 meet the expected requirements, guaranteeing the drying effect of the drying device 30 on the airflow.

[0059] By using the condenser 33 and its condenser fins 331, the contact area between the airflow and the low-temperature surface is increased, thereby increasing the condensation rate and amount of moisture in the airflow, thus improving the condensation effect of moisture in the airflow and ensuring the drying effect of the drying device 30 on the airflow.

[0060] In some embodiments of this application, the carbon dioxide absorber 10 further includes a liquid guiding assembly 40, which has a liquid channel 41 inside. One end of the liquid channel 41 is connected to the bottom of the low-temperature chamber 353, and the other end of the liquid channel 41 is connected to the first air outlet 22. The highest point of the liquid channel 41 is lower than the bottom of the first air outlet 22 and the low-temperature chamber 353.

[0061] After the moisture in the airflow condenses in the low-temperature chamber 353, it flows towards the bottom of the chamber 353 under the influence of gravity and then enters the liquid channel 41. The condensate flows towards the first air outlet 22 after entering the liquid channel 41. The airflow, after carbon dioxide removal, flows out of the first air outlet 22 and then enters the liquid channel 41, where it absorbs moisture from the liquid, increasing the moisture content and ensuring that the humidity of the airflow discharged from the carbon dioxide absorber 10 meets the expected requirements.

[0062] Understandably, the airflow entering the carbon dioxide absorber 10 is first dried by the drying device 30 before the absorber body 20 removes carbon dioxide. This results in the airflow exiting from the first outlet 22 having an excessively low moisture content. Overly dry airflow would absorb too much moisture from the patient's respiratory tract, leading to discomfort or even worsening the patient's condition. By setting up a liquid channel 41, the condensed moisture at the drying device 30 is collected, and the dried airflow exiting from the first outlet 22 absorbs the collected condensate, thereby increasing the moisture content of the airflow exiting the carbon dioxide absorber 10. This ensures the humidity of the airflow for the patient's breathing meets the expected requirements, improving the patient's breathing experience and ensuring the safety of the breathing process. The condensate at the drying device 30 moistens the dried airflow after carbon dioxide removal, preventing waste of condensate and avoiding the risk of infection from introducing external water.

[0063] In some embodiments of this application, the liquid channel 41 includes: a liquid storage chamber 45, a first vertical channel 42, a second vertical channel 43, and a transverse channel 44. The liquid storage chamber 45 is connected to a first vent 22 via a first vent pipe 23. The top end of the first vertical channel 42 is connected to the bottom of the low-temperature chamber 353. The top end of the second vertical channel 43 is connected to the top end of the liquid storage chamber 45, and the height of the top end of the second vertical channel 43 is lower than the height of the top end of the first vertical channel 42. One end of the transverse channel 44 is connected to the bottom end of the first vertical channel 42, and the other end of the transverse channel 44 is connected to the bottom end of the second vertical channel 43. The top end of the first vent pipe 23 is connected to the first vent 22, and the bottom end of the first vent pipe 23 extends into the bottom of the liquid storage chamber 45.

[0064] After the drying device 30 dries the airflow by condensation, the condensate enters the first vertical channel 42 from the bottom of the low-temperature chamber 353 and then enters the second vertical channel 43 through the horizontal channel 44. According to the principle of communicating vessels, as the water level in the first vertical channel 42 rises, the water level in the second vertical channel 43 will rise along with the water level in the first vertical channel 42. Since the top of the second vertical channel 43 is lower than the top of the first vertical channel 42, and the top of the second vertical channel 43 is connected to the top of the liquid storage chamber 45, when the water level in the first vertical channel 42 rises to the height of the top of the second vertical channel 43, if the water level in the first vertical channel 42 continues to rise, the cooling water in the second vertical channel 43 will overflow from the top of the second vertical channel 43 into the liquid storage chamber 45. As the water level in the storage chamber 45 rises, it eventually surpasses the outlet of the first vent pipe 23. This causes the dry airflow exiting from the first vent 22 to pass below the water level in the storage chamber 45 before being discharged, allowing the dry airflow to absorb moisture from the storage chamber 45 and increasing its humidity. By ensuring that the top of the storage chamber 45 is lower than the top of the first vertical channel 42, condensate is prevented from flowing back from the first vertical channel 42 to the low-temperature chamber 353.

[0065] In some embodiments of this application, a first check valve may be provided at the entrance of the first vertical channel 42 to prevent liquid in the first vertical channel 42 from flowing into the low temperature chamber 353.

[0066] In some embodiments of this application, a second one-way valve may be provided at the outlet of the first vent pipe 23. The second one-way valve prevents water in the liquid storage chamber 45 from flowing into the first vent pipe 23, thereby preventing water from flowing into the absorber body 20 and preventing the absorbent in the absorber body 20 from being affected by moisture.

[0067] In some embodiments of this application, water can be pre-filled into the liquid channel 41 to seal it, allowing the airflow to overflow from both inside and outside the liquid channel 41, thus ensuring the airtightness of the airflow passage. During the drying process of the airflow by the drying device 30, condensate gradually accumulates in the liquid channel 41, thereby maintaining a high water level in the storage chamber 45 and preventing the water level in the storage chamber 45 from decreasing due to the absorption of moisture by the drying air. Thus, the condensate generated during the drying process replenishes the moisture in the storage chamber 45, ensuring that the water level in the storage chamber 45 always meets the expected requirements. This ensures that the dried airflow after passing through the absorber body 20 can be continuously moistened by the moisture in the storage chamber 45, and that the carbon dioxide absorber 10 can continuously discharge moistened airflow with reduced carbon dioxide concentration. The principle of communicating vessels is used to transport moisture, thereby ensuring the airtightness of the airflow passage and preventing the airflow from overflowing through the liquid channel 41.

[0068] In some embodiments of this application, a baffle plate 451 is provided inside the liquid storage chamber 45. The baffle plate 451 extends from the top to the bottom of the liquid storage chamber 45 to divide the liquid storage chamber 45 into independent first chamber 452 and second chamber 453. The top end of the second vertical channel 43 communicates with the first chamber 452, and the bottom end of the first vent pipe 23 extends into the bottom of the second chamber 453. A liquid passage hole 454 is provided at the bottom of the baffle plate 451, which connects the bottom of the first chamber 452 with the bottom of the second chamber 453. The bottom end of the first vent pipe 23 is higher than the height of the liquid passage hole 454.

[0069] The liquid storage chamber 45 is divided into a first chamber 452 and a second chamber 453 by the baffle plate 451. This prevents the airflow from entering the second chamber 453 during the process of the airflow entering the liquid storage chamber 45 through the first air outlet pipe 23, thereby preventing the airflow from entering the second vertical channel 43 and preventing the airflow from flowing back to the low temperature chamber 353 through the liquid channel 41.

[0070] In some embodiments of this application, a second vent 455 is provided at the top of the liquid storage chamber 45, and the second vent 455 is connected to the outside through a second vent pipe 456.

[0071] In the description of this specification, references to terms such as "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with the described embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0072] Furthermore, the above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A carbon dioxide absorber with a drying function, characterized in that, include: The absorber body is provided with a first air inlet and a first air outlet; A drying device, wherein the drying device is connected to the first air inlet of the absorber body; The airflow is dehydrated by the drying device and then enters the absorber body from the first air inlet; The carbon dioxide absorber further includes a liquid guiding component, wherein a liquid channel is provided inside the liquid guiding component, one end of the liquid channel is connected to the bottom of the low temperature chamber of the drying device, and the other end of the liquid channel is connected to the first gas outlet. The highest point of the liquid channel is lower than the first air outlet and the bottom of the low-temperature chamber; The liquid channel includes: A liquid storage chamber, wherein the liquid storage chamber is connected to the first air outlet through a first air outlet pipe; A first vertical passage, the top of which is connected to the bottom of the low-temperature greenhouse; The second vertical channel has its top end connected to the top end of the liquid storage cavity, and the height of the top end of the second vertical channel is lower than the height of the top end of the first vertical channel. A horizontal channel, one end of which is connected to the bottom end of the first vertical channel, and the other end of which is connected to the bottom end of the second vertical channel; The top end of the first vent pipe is connected to the first vent, and the bottom end of the first vent pipe extends into the bottom of the liquid storage chamber. Water is pre-filled into the liquid channel to seal it. Based on the principle of communicating vessels, the water in the liquid channel flows unidirectionally from the first vertical channel to the liquid storage chamber via the second vertical channel; An air baffle is provided inside the liquid storage chamber. The air baffle extends from the top to the bottom of the liquid storage chamber to divide the liquid storage chamber into an independent first chamber and a second chamber. The top end of the second vertical channel communicates with the first chamber, and the bottom end of the first vent pipe extends into the bottom of the second chamber. The bottom of the air baffle is provided with a liquid passage hole, which connects the bottom of the first chamber with the bottom of the second chamber. The bottom of the first vent pipe is higher than the height of the liquid passage hole; A first check valve is installed at the entrance of the first vertical channel to prevent liquid in the first vertical channel from flowing into the low-temperature chamber. A second check valve is installed at the outlet of the first vent pipe to prevent water in the liquid storage chamber from flowing into the first vent pipe. The top of the liquid storage chamber is provided with a second vent, which is connected to the outside through a second vent pipe.

2. The carbon dioxide absorber with drying function according to claim 1, characterized in that, The drying device includes a condensation component, which dehydrates the airflow by condensation.

3. The carbon dioxide absorber with drying function according to claim 2, characterized in that, The condensation assembly includes a semiconductor refrigeration module, which is used to reduce the temperature of the airflow so that the moisture in the airflow condenses into a liquid state.

4. The carbon dioxide absorber with drying function according to claim 3, characterized in that, The condensation assembly also includes: A condensation chamber, in which the semiconductor refrigeration module is installed, and the condensation chamber is provided with a second air inlet; A partition is provided, which divides the condensation chamber into a high-temperature chamber and a low-temperature chamber. The partition is provided with an air vent that connects the high-temperature chamber and the low-temperature chamber. A second air inlet is connected to the high-temperature chamber, and a first air inlet is connected to the low-temperature chamber. The semiconductor cooling module is embedded in the partition, with the high-temperature side of the semiconductor cooling module facing the high-temperature chamber and the low-temperature side of the semiconductor cooling module facing the low-temperature chamber.

5. The carbon dioxide absorber with drying function according to claim 4, characterized in that, The condensation assembly also includes: A condenser is attached to the low-temperature side of the semiconductor refrigeration module, and the condenser is provided with condenser fins; A heat-conducting component is attached to the high-temperature side of the semiconductor refrigeration module, and the heat-conducting component is provided with heat-conducting fins.

6. A respiratory assist device, characterized in that, Includes a carbon dioxide absorber as described in any one of claims 1-5, the carbon dioxide absorber being used to absorb carbon dioxide in the airflow before it enters the respiratory assist device.

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