Housing components and electronic equipment

Abstract

The present application provides a housing assembly and electronic device, relating to the field of electronic device technology. The housing assembly includes a laminated base layer and a cortex layer. The cortex layer includes a laminated fiber layer and a polyurethane resin layer, with the fiber layer positioned between the base layer and the polyurethane resin layer. The fiber layer is made of fiber yarn with a tensile modulus greater than 60 GPa. This arrangement allows the back cover to be thinned to provide sufficient strength and puncture resistance to meet usage requirements.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic devices, and in particular to a housing assembly and an electronic device. Background Art

[0002] With the development of the mobile phone terminal and plastic back cover industries, creating lightweight, high-strength, and thinner back covers has become a common pursuit in the industry. Currently, back covers are made of polyurethane (PU) resin, but PU itself lacks the necessary support strength to provide sufficient strength and puncture resistance for thinned back covers, failing to meet user requirements. Therefore, ensuring sufficient strength and puncture resistance for thinned back covers has become a pressing issue. Summary of the Invention

[0003] The embodiments of the present application provide a housing assembly and an electronic device. The back cover of the electronic device is designed to be thinner and has sufficient strength and puncture resistance to meet usage requirements.

[0004] In a first aspect, the present application provides a shell assembly comprising a laminated base layer and a cortex layer, wherein the cortex layer comprises a laminated fiber layer and a polyurethane resin layer, the fiber layer being located between the base layer and the polyurethane resin layer, and the fiber layer being made of fiber yarn having a tensile modulus greater than 60 GPa.

[0005] In this implementation, the fiber layer is made of fiber yarn with a tensile modulus greater than 60 GPa, which gives the fiber layer a certain strength, can enhance the strength of the cortical layer, and play a role in supporting the polyurethane resin layer. In addition, while the fiber layer provides supporting strength, the thickness of the fiber layer is thin, making the thickness of the cortical layer thinner, thereby thinning the thickness of the shell assembly, thereby achieving a thinning design. Therefore, when the shell assembly is applied to the back cover, the back cover can provide sufficient strength and puncture resistance while achieving a thinning design to meet the requirements of use.

[0006] In some possible implementations, the tensile strength of the cortical layer can be greater than 100 N / cm, so that the cortical layer provides a certain support strength and puncture resistance, so that the thinned shell assembly has sufficient strength, and the shell assembly can be designed to be thinned.

[0007] In some possible implementations, the fiber layer is made of fiber yarns of the same material, or the fiber layer is made of fiber yarns of multiple different materials. The fiber layer made of one or more fiber yarns can provide a certain support strength, so that the cortical layer can provide support strength, thereby ensuring that the thinned shell assembly provides sufficient strength and puncture resistance.

[0008] In some possible implementations, the fiber layer is a woven fabric with a denier greater than or equal to 100D and less than or equal to 150D. By limiting the denier of the woven fabric to between 100D and 150D, the fiber layer can not only provide a certain degree of support strength, but also control the thickness of the fiber layer within a reasonable range, thereby achieving a thinner design of the housing assembly.

[0009] In some possible implementations, the fiber layer is unidirectional fabric, and the unidirectional fabric has a deflection density greater than or equal to 100D and less than or equal to 250D. By limiting the deflection density of the unidirectional fabric to between 100D and 250D, the fiber layer can not only provide a certain degree of support strength, but also control the thickness of the fiber layer within a reasonable range, thereby achieving a thinner design for the shell assembly.

[0010] In some possible implementations, the fiber yarn includes at least one of the following fibers: glass fiber, high-modulus glass fiber, poly(p-phenylene benzobisoxazole) fiber, polyimide fiber, and aramid fiber. These fibers can produce a fiber yarn with a tensile modulus greater than 60 GPa, thereby providing a certain degree of support strength for the fiber layer and enabling a thinner design for the housing assembly.

[0011] In some possible implementations, the shell assembly further includes a hot melt adhesive layer, the hot melt adhesive layer being located between the base layer and the fiber layer, and the base layer and the cortical layer being bonded together via the hot melt adhesive layer. Thus, the cortical layer is bonded to the base layer via the hot melt adhesive layer, simplifying the process.

[0012] In some possible implementations, the viscosity of the hot melt adhesive layer is greater than or equal to 900 cps and less than or equal to 1100 cps. Since the fiber layer has a relatively small specific surface area, controlling the viscosity of the hot melt adhesive layer between 900 cps and 1100 cps allows the hot melt adhesive to have high fluidity. This allows the hot melt adhesive layer to penetrate more deeply into the fiber layer as it dissolves, resulting in a more secure connection between the hot melt adhesive layer and the fiber layer.

[0013] In some possible implementations, the melting point of the hot melt adhesive layer is greater than or equal to 80°C and less than or equal to 90°C. By controlling the melting point of the hot melt adhesive layer between 80°C and 90°C, the difficulty of dissolving the hot melt adhesive layer can be reduced, allowing the hot melt adhesive layer to transition from a solid state to a liquid state more quickly, thereby reducing the difficulty of connecting the hot melt adhesive layer to the fiber layer. Furthermore, this prevents the fiber layer from being deformed or damaged by heat due to excessively high temperatures in the hot melt adhesive layer.

[0014] In some possible implementations, the molecular weight of the hot melt adhesive layer is greater than or equal to 5W and less than or equal to 5.5W. By controlling the molecular weight of the hot melt adhesive layer to between 5W and 5.5W, the molecular weight of the hot melt adhesive is lowered, which can improve the viscosity and fluidity of the hot melt adhesive layer, making it easier to flow and cure quickly. This can also enhance the bonding strength between the hot melt adhesive layer and the fiber layer.

[0015] In some possible implementations, the hot melt adhesive layer is a polyurethane hot melt adhesive layer or an epoxy resin hot melt adhesive layer. The polyurethane hot melt adhesive layer or the epoxy resin hot melt adhesive layer can firmly connect the base layer and the cortical layer.

[0016] In some possible implementations, the base layer comprises at least one of the following materials: a glass fiber epoxy composite, an aramid fiber composite, a poly(p-phenylene benzobisoxazole) fiber composite, a polyimide fiber composite, a polycarbonate composite, or a poly(methyl methacrylate) composite. Base layers formed from these materials exhibit high strength and high modulus. Using these materials in housing components results in high strength and a thin, lightweight design.

[0017] A second aspect of the present application provides an electronic device, which includes a middle frame, a display screen and a back cover, wherein the back cover and the display screen are respectively connected to opposite sides of the middle frame, and the back cover includes any shell assembly of the first aspect.

[0018] A third aspect of the present application provides a composite material for use as a cortical layer of a housing assembly, the composite material comprising a stacked fiber layer and a polyurethane resin layer. The fiber layer is disposed between the housing assembly's base layer and the polyurethane resin layer, and is made of fiber yarn having a tensile modulus greater than 60 GPa.

[0019] In some possible implementations, the tensile strength at break of the cortical layer may be greater than 100 N / cm.

[0020] In some possible implementations, the fiber layer is made of fiber yarns made of the same material, or the fiber layer is made of fiber yarns made of multiple different materials.

[0021] In some possible implementations, the fiber layer is a woven fabric, and the denier of the woven fabric is greater than or equal to 100D and less than or equal to 150D.

[0022] In some possible implementations, the fiber layer is a unidirectional fabric, and the denier of the unidirectional fabric is greater than or equal to 100D and less than or equal to 250D.

[0023] In some possible implementations, the fiber yarn includes at least one of the following fibers: glass fiber, high modulus glass fiber, poly(p-phenylene benzobisoxazole) fiber, polyimide fiber, and aramid fiber.

[0024] The fourth aspect of the present application provides a method for preparing a shell assembly, which includes: forming a base layer and a cortical layer respectively, the cortical layer including a stacked fiber layer and a polyurethane resin layer; and attaching the base layer to the side of the fiber layer facing away from the polyurethane resin layer.

[0025] In some possible implementations, laminating the base layer to the side of the fiber layer facing away from the polyurethane resin layer includes:

[0026] The fiber layer is bonded to the base layer through a hot melt adhesive layer.

[0027] In some possible implementations, forming the cortical layer includes:

[0028] Providing a polyurethane resin laminate and a fiber layer, wherein the polyurethane resin laminate comprises a polyurethane resin layer and a release paper that are stacked;

[0029] A polyurethane resin layer is laminated to one side of the fiber layer to form a cortex layer.

[0030] In some possible implementations, after the polyurethane resin layer and the fiber layer are bonded together to form the cortical layer, the method further includes:

[0031] A pattern is formed on a side of the polyurethane resin layer away from the fiber layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 Schematic cross-sectional view of a back cover in the related art;

[0033] Figure 2 An exploded diagram of an electronic device provided in an embodiment of the present application;

[0034] Figure 3 A schematic cross-sectional view of a housing assembly provided in an embodiment of the present application;

[0035] Figure 4 A schematic diagram of a process for preparing a housing assembly provided in an embodiment of the present application;

[0036] Figure 5 A schematic diagram of a process for preparing a cortical layer provided in an embodiment of the present application;

[0037] Figure 6 A schematic diagram of the preparation process of a polyurethane resin laminate provided in an embodiment of the present application.

[0038] Description of reference numerals:

[0039] 100. Electronic equipment;

[0040] 110. display screen; 111. optical aperture area;

[0041] 120, middle frame; 121, middle plate; 122, frame;

[0042] 130. Back cover; 131. Through hole;

[0043] 140. Battery; 150. Circuit board; 160. Front camera module; 170. Rear camera module;

[0044] 200, housing assembly;

[0045] 10. basal layer;

[0046] 20. Cortical layer;

[0047] 21, polyurethane resin layer; 211, first polyurethane resin coating layer; 212, second polyurethane resin coating layer; 213, third polyurethane resin coating layer;

[0048] 22. fiber layer; 221. fiber yarn;

[0049] 30. Hot melt adhesive layer;

[0050] 300. Release paper. DETAILED DESCRIPTION

[0051] Figure 1 Schematic diagram of a cross section of a back cover in the related art. Figure 1 As shown, the back cover 600 of the electronic device includes a leather layer 620 and a base layer 610. The leather layer 620 is located on the side of the base layer 610 facing away from the battery. The leather layer 620 includes a polyurethane resin layer 621 and a polyester fabric layer 622. The polyurethane resin layer 621 is made of polyurethane (PU) material, and the polyester fabric layer 622 is connected to the base layer 610. The leather layer 620 gives the electronic device a leather-like appearance and feel, enhancing its texture.

[0052] Because polyurethane resin materials lack support strength, to ensure battery safety, in one embodiment, a cortex layer 620 with a thickness of 0.3mm-0.4mm and a base layer 610 with a thickness greater than 0.5mm are used. This provides the back cover 600 with sufficient strength and puncture resistance to meet usage requirements. However, the back cover 600 in this embodiment is thicker than 0.7mm, making it relatively thick and preventing a thinner design.

[0053] Therefore, it can be seen that in order to reduce the thickness of the back cover 600, the thickness of the cortical layer 620 and / or the base layer 610 can be reduced, so that the thickness of the back cover 600 is reduced, that is, the thickness of the back cover 600 is reduced to less than 0.7 mm. However, after the thickness of the base layer 610 is reduced, the improved strength and puncture resistance of the back cover 600 are also reduced, and it cannot meet the usage requirements. Therefore, how to ensure that the thinned back cover 600 provides sufficient strength and puncture resistance has become an urgent problem to be solved.

[0054] In view of this, embodiments of the present application provide a housing assembly and electronic device. The housing assembly is made of a composite material, giving the housing assembly a leather-like appearance and effect, thereby enhancing the texture of the electronic device incorporating the housing assembly. The composite material is composed of a fiber layer and a polyurethane resin layer. The fiber layer can provide a certain degree of support strength and play a role in supporting the polyurethane resin layer. Therefore, after the housing assembly is thinned, the composite material can provide a certain degree of support strength, so that the housing assembly provides sufficient strength and puncture resistance to meet usage requirements.

[0055] The embodiments of the present application provide an electronic device, which may be a product with a display interface, such as a tablet computer, a mobile phone, an e-reader, a remote control, a personal computer (PC), a laptop computer, a personal digital assistant (PDA), an in-vehicle device, an Internet-connected television, a wearable device, a television, or a smart display wearable product, such as a smart watch or a smart bracelet. The embodiments of the present application do not impose any particular restrictions on the form of the above-mentioned electronic devices.

[0056] For the convenience of explanation, the following embodiments are all described by taking a mobile phone as an example of an electronic device. The mobile phone can be a foldable mobile phone, a straight-screen mobile phone, or a slider mobile phone. The following specific description is given using a straight-screen mobile phone as an example.

[0057] Figure 2 This is a schematic diagram of an explosion of an electronic device provided in an embodiment of the present application.

[0058] See also Figure 2 As shown, the electronic device 100 includes a middle frame 120, a display screen 110 and a back cover 130 (or a back shell). The middle frame 120 is located between the display screen 110 and the back cover 130, and the back cover 130 and the display screen 110 are respectively connected to opposite sides of the middle frame 120.

[0059] The display screen 110 is used to display images, and the display screen 110 may also be integrated with a touch function.

[0060] Continue to see Figure 2As shown, the middle frame 120 may include a middle plate 121 and a frame 122 surrounding the outer edge of the middle plate 121. The inner wall of the frame 122 may be connected to the outer edge of the middle plate 121 to form an integral structure. The material of the middle plate 121 may be aluminum or aluminum alloy, or the material of the middle plate 121 may be stainless steel.

[0061] Continue to see Figure 2 As shown, the electronic device 100 may further include a battery 140 and a circuit board 150. The battery 140 and the circuit board 150 may be disposed on the middle plate 121. The battery 140 and the circuit board 150 may be disposed on the side of the middle plate 121 facing the back cover 130. Alternatively, in some embodiments, the battery 140 and the circuit board 150 may also be disposed on the side of the middle plate 121 facing the display screen 110. Alternatively, in some embodiments, the battery 140 is located on the side of the middle plate 121 facing the back cover 130, and the circuit board 150 is located on the side of the middle plate 121 facing the display screen 110.

[0062] Continuing with FIG. 2 , the electronic device 100 may further include a front camera module 160 and a rear camera module 170. The display screen 110 is provided with an optical aperture 111 that cooperates with the front camera module 160. The front camera module 160 uses the optical aperture 111 to achieve functions such as filming or taking photos. The back cover 130 is provided with a through hole 131. A portion of the rear camera module 170 is located between the middle frame 120 and the back cover 130, while the remaining portion is located outside the electronic device 100 through the through hole 131.

[0063] The back cover 130 is connected to the middle frame 120 to form a receiving cavity for accommodating electronic components such as the above-mentioned circuit board 150, battery 140, front camera module 160 and rear camera module 170, thereby preventing external moisture and dust from invading the receiving cavity and avoiding affecting the performance of the above-mentioned electronic components.

[0064] Continue to see Figure 2 As shown, the back cover 130 includes a housing assembly 200 , wherein the orthographic projection of the battery 140 in the thickness direction Z of the electronic device 100 is located inside the orthographic projection of the housing assembly 200 in the thickness direction Z of the electronic device 100 , that is, the housing assembly 200 covers the battery 140 .

[0065] The housing assembly 200 is made of a polyurethane leather material comprising a polyurethane resin, giving the housing assembly 200 a leather-like appearance and feel, thereby enhancing the texture of the back cover 130. Furthermore, the polyurethane leather material supports the polyurethane resin material via a fiber material having a certain supporting strength, thereby providing a certain degree of support strength. This allows the housing assembly 200 to be thinned to provide sufficient strength and puncture resistance, and further, the back cover 130 to be thinned to provide sufficient strength and puncture resistance, thereby ensuring the safety of the battery 140.

[0066] It should be noted that, in addition to the shell assembly 200 , the back cover 130 may also include other parts. For example, in some embodiments, the back cover 130 may also include an edge assembly (not shown in the figure) surrounding the shell assembly 200 .

[0067] In the embodiment of the present application, there is no limitation on the thickness of the housing assembly 200. For example, the thickness of the housing assembly 200 can be less than or equal to 0.65 mm. For example, the thickness of the housing assembly 200 can be 0.65 mm, 0.6 mm, 0.55 mm, 0.5 mm, etc.

[0068] Figure 3 A schematic cross-sectional view of a housing assembly provided in an embodiment of the present application.

[0069] See also Figure 3 As shown, the shell assembly 200 includes a base layer 10 and a cortex layer 20 that are stacked. The cortex layer 20 includes a fiber layer 22 and a polyurethane resin layer 21 that are stacked. The polyurethane resin layer 21 is made of a polyurethane resin material. The polyurethane resin layer 21 is used to give the shell assembly 200 the appearance and feel of leather, so that the shell assembly 200 is applied to the back cover 130, and the back cover 130 has the texture of leather. The fiber layer 22 is located between the base layer 10 and the polyurethane resin layer 21. The fiber layer 22 is made of fiber yarn 221 with a tensile modulus greater than 60Gpa, so that the fiber layer 22 can provide a certain support strength while supporting the polyurethane resin layer 21, thereby playing a reinforcing role, and the cortex layer 20 can also provide a certain strength and puncture resistance.

[0070] It can be understood that the cortical layer 20 is made of a composite material that can provide support strength and puncture resistance, and the composite material is composed of a fiber layer 22 and a polyurethane resin layer 21 that are stacked.

[0071] When the shell assembly 200 is thinned, the thickness of the base layer 10 is reduced, and the support strength and puncture resistance that the base layer 10 can provide are also reduced. However, the fiber layer 22 can provide a certain support strength, so that the cortical layer 20 can provide a certain support strength to make up for the part of the shell assembly 200 reduced in strength due to the reduction in the thickness of the base layer 10, so that the shell assembly 200 can provide sufficient strength and puncture resistance after thinning, and thus can meet the use requirements. In addition, while the fiber layer 22 provides a certain support strength, the thickness of the fiber layer 22 can still be thinned, so that the cortical layer 20 can provide a certain strength and puncture resistance while being thinned. Therefore, the shell assembly 200 is applied to the back cover 130, and the back cover 130 can provide sufficient strength and puncture resistance while achieving a thinning design, and can meet the use requirements.

[0072] To give the back cover 130 a richer appearance, in some embodiments, a pattern is typically formed on the side of the polyurethane resin layer 21 facing away from the fiber layer 22. In some embodiments, this can be achieved through mechanical lamination using a textured release paper 300. Of course, other methods, such as roller coating or printing, are also possible.

[0073] In some possible implementations, the tensile breaking strength of the cortical layer 20 can be greater than 100 N / cm, so that the cortical layer 20 provides a certain support strength and puncture resistance, so that the thinned shell assembly 200 has sufficient strength, and the shell assembly 200 can be designed to be thinned.

[0074] It can be understood that when the tensile breaking strength of the cortical layer 20 can be greater than 100 N / cm, the cortical layer 20 can not only provide a certain support strength and puncture resistance, but also control the thickness of the cortical layer 20 within a reasonable range to achieve a thinning design of the shell assembly 200.

[0075] There is no limitation on the specific value of the tensile strength at break of the cortical layer 20. For example, the tensile strength at break of the cortical layer 20 may be 101 N / cm, 105 N / cm, 110 N / cm, 115 N / cm, 115.95 N / cm, or 120 N / cm.

[0076] In the embodiment of the present application, there is no limitation on the specific thickness of the cortical layer 20. For example, the thickness of the cortical layer 20 may be 0.2 mm.

[0077] In the embodiment of the present application, there is no limitation on the specific thickness of the polyurethane resin layer 21. For example, the thickness of the polyurethane resin layer 21 may be 0.1 mm.

[0078] In the embodiment of the present application, there is no limitation on the specific thickness of the fiber layer 22. For example, the thickness of the fiber layer 22 may be 0.1 mm.

[0079] In the embodiment of the present application, the fiber yarn 221 refers to a yarn made of fiber, and the tensile modulus of the yarn is greater than 60 GPa.

[0080] The fiber yarn 221 can be made of one or more fibers selected from the group consisting of glass fiber, high-modulus glass fiber, poly(p-phenylene benzobisoxazole) fiber (PBO fiber), polyimide fiber (PI fiber), and aramid fiber. These fibers can provide a fiber yarn 221 with a tensile modulus greater than 60 GPa, thereby providing the fiber layer 22 with a certain degree of support strength, thereby achieving a thinner design for the housing assembly 200.

[0081] There is no limitation on the specific value of the tensile modulus of the fiber yarn 221. The tensile modulus of the fiber yarn 221 may be 61 GPa, 69 GPa, 70 GPa, 74.6 GPa, 90 GPa, etc.

[0082] In the embodiment of the present application, the fiber layer 22 is made of a plurality of fiber yarns 221. The fiber layer 22 can be made of fiber yarns 221 of the same material, or can be made of fiber yarns 221 of multiple different materials. The fiber layer 22 made of one or more fiber yarns 221 can provide a certain degree of support strength, thereby enabling the cortical layer 20 to provide support strength and puncture resistance, thereby ensuring that the thinned shell assembly 200 provides sufficient strength and puncture resistance.

[0083] There is no limitation on the type of the fiber layer 22 made of the plurality of fiber yarns 221. Several types of the fiber layer 22 are described below.

[0084] In some possible implementations, the fiber layer 22 may be a woven fabric (or a woven fabric), which is a mesh structure composed of warp and weft threads interwoven (e.g., Figure 3 (As shown), the warp and weft threads are interwoven perpendicularly. That is, a portion of the multiple fiber yarns 221 serve as warp threads and another portion as weft threads. Alternatively, it can be understood that multiple fiber yarns 221 are arranged in a cross pattern. The woven fabric can be formed by knitting or weaving.

[0085] It should be noted that Figure 3 The structure of the woven cloth shown is a schematic diagram. The specific structure of the woven cloth can also be other structures, which will not be described here one by one.

[0086] In some embodiments, the tensile strength of the woven fabric can be greater than or equal to 100 D and less than or equal to 150 D. By limiting the tensile strength of the woven fabric to between 100 D and 150 D, the fiber layer 22 can provide a certain support strength and the thickness of the fiber layer 22 can be controlled within a reasonable range, thereby achieving a thinner design of the housing assembly 200.

[0087] There is no limitation on the specific tensile strength of the woven fabric. For example, the tensile strength of the woven fabric can be 100D, 105D, 110D, 120D, 130D, 140D or 150D, etc.

[0088] In other possible implementations, the fiber layer 22 may also be a unidirectional cloth (or unidirectional fabric). Unidirectional cloth (UD cloth) is composed of a series of parallel cores, one of which is a base thread, and the other core threads intersect perpendicularly with it.

[0089] In some embodiments, the unidirectional fabric's tensile strength can be greater than or equal to 100 D and less than or equal to 250 D. By limiting the tensile strength of the unidirectional fabric to between 100 D and 250 D, the fiber layer 22 can provide a certain level of support strength while also maintaining a reasonable thickness, thereby achieving a thinner design for the housing assembly 200.

[0090] There is no limitation on the specific load factor of the unidirectional fabric. For example, the load factor of the unidirectional fabric can be 100D, 105D, 110D, 120D, 130D, 140D, 150D, 155D, 160D, 170D, 180D, 190D, 200D, 210D, 230D, or 250D.

[0091] To attach the cortical layer 20 to the base layer 10, see Figure 3 As shown, the shell assembly 200 may further include a hot melt adhesive layer 30, which is located between the base layer 10 and the fiber layer 22. The hot melt adhesive layer 30 is connected to the fiber layer 22 and the base layer 10, respectively, so that the base layer 10 and the cortical layer 20 are bonded together via the hot melt adhesive layer 30. Thus, the cortical layer 20 is bonded to the base layer 10 via the hot melt adhesive layer 30, and the process is simple.

[0092] There is no limitation on the specific type of the hot melt adhesive layer 30. The hot melt adhesive layer 30 may be a polyurethane hot melt adhesive layer or an epoxy resin hot melt adhesive layer, etc., which can firmly connect the base layer 10 and the cortical layer 20.

[0093] There is no limitation on the thickness of the hot melt adhesive layer 30. For example, the hot melt adhesive layer 30 can be 80 μm. Of course, the thickness of the hot melt adhesive layer 30 can also be other values.

[0094] In order to make the connection between the base layer 10 and the fiber layer 22 more firmly, the performance of the hot melt adhesive layer 30 can be improved by controlling one or more parameters of the hot melt adhesive layer 30 such as viscosity, melting point, molecular weight, etc.

[0095] In some possible implementations, the viscosity of the hot melt adhesive layer 30 can be greater than or equal to 900 cps and less than or equal to 1100 cps. Because the fiber layer 22 has a relatively small specific surface area, controlling the viscosity of the hot melt adhesive layer 30 to between 900 cps and 1100 cps allows the hot melt adhesive to have high fluidity. As the hot melt adhesive layer 30 dissolves, it can more readily penetrate into the fiber layer 22, resulting in a more secure connection between the hot melt adhesive layer 30 and the fiber layer 22.

[0096] There is no limitation on the specific value of the viscosity of the hot melt adhesive layer 30. The viscosity of the hot melt adhesive layer 30 may be 900 cps, 950 cps, 980 cps, 1000 cps, 1050 cps, 1100 cps, etc.

[0097] In some possible implementations, the melting point of the hot melt adhesive layer 30 can be greater than or equal to 80°C and less than or equal to 90°C. By controlling the melting point of the hot melt adhesive layer 30 between 80°C and 90°C, the difficulty of dissolving the hot melt adhesive layer 30 can be reduced, allowing the hot melt adhesive layer 30 to transition from a solid state to a liquid state more quickly, thereby reducing the difficulty of connecting the hot melt adhesive layer 30 to the fiber layer 22. Furthermore, excessive heat from the hot melt adhesive layer 30, which could cause thermal deformation or damage to the fiber layer 22, can be avoided.

[0098] There is no limitation on the specific value of the melting point of the hot melt adhesive layer 30. The melting point of the hot melt adhesive layer 30 may be 80°C, 81°C, 81.5°C, 83°C, 86°C, 89.65°C, etc.

[0099] In some possible implementations, the molecular weight of the hot melt adhesive layer 30 can be greater than or equal to 5W and less than or equal to 5.5W. By controlling the molecular weight of the hot melt adhesive layer 30 to between 5W and 5.5W, the molecular weight of the hot melt adhesive is lowered, which improves the viscosity and fluidity of the hot melt adhesive layer 30, allowing the hot melt adhesive layer 30 to flow more easily and solidify more quickly. Furthermore, the bonding strength between the hot melt adhesive layer 30 and the fiber layer 22 can be increased.

[0100] There is no limitation on the specific molecular weight of the hot melt adhesive layer 30. The molecular weight of the hot melt adhesive layer 30 may be 5W, 5.1W, 5.13W, 5.2W, 5.3W, 5.35W, 5.45W, 5.49W, etc.

[0101] In the embodiment of the present application, there is no limitation on the specific material of the base layer 10. The material of the base layer 10 can include one or more materials such as glass fiber epoxy composite material, aramid fiber composite material, poly (p-phenylene benzobisoxazole) fiber composite material, polyimide fiber composite material, polycarbonate (PC) composite material, or polymethyl methacrylate (PMMA) composite material. The base layer 10 formed by the above materials has the characteristics of high strength and high modulus. When the above materials are used in the housing assembly 200, the housing assembly 200 has high strength and is light and thin.

[0102] In the embodiment of the present application, there is no limitation on the specific thickness of the base layer 10. For example, the thickness of the base layer 10 can be 0.4 mm. Of course, the thickness of the base layer 10 can also be other values.

[0103] In summary, since the fiber layer 22 can be made of fiber yarns 221 made of one or more fibers such as glass fiber, high modulus glass fiber, poly(p-phenylene benzobisoxazole) fiber, polyimide fiber and aramid fiber, and the base layer 10 can be made of one or more materials such as glass fiber epoxy composite material, aramid fiber composite material, poly(p-phenylene benzobisoxazole) fiber composite material, polyimide fiber composite material, polycarbonate composite material or polymethyl methacrylate composite material, the fiber layer 22 made of different fiber materials can be freely combined with the base layer 10 made of different materials. In addition, the fiber layer 22 can be a woven cloth or a unidirectional cloth, and can also be freely combined with the base layer 10 made of different materials (for example, Examples 1 to 4 below). Similarly, different types of hot melt adhesive layers 30 can also be freely combined with fiber layers 22 of different materials and base layers 10 of different materials.

[0104] Figure 4 A schematic flow chart of a method for preparing a shell assembly provided in an embodiment of the present application.

[0105] See also Figure 4 As shown, the embodiment of the present application further provides a method for preparing a housing assembly 200, the method comprising the following steps:

[0106] S10 , forming a base layer 10 and a cortical layer 20 , respectively. The cortical layer 20 includes a fiber layer 22 and a polyurethane resin layer 21 that are stacked.

[0107] The base layer 10 may be made of one or more of the following materials: glass fiber epoxy composite material, aramid fiber composite material, poly(p-phenylene benzobisoxazole) fiber composite material, polyimide fiber composite material, polycarbonate composite material, or polymethyl methacrylate composite material. These materials are used to form the base layer 10 of a corresponding thickness.

[0108] The fiber layer 22 is made of a plurality of fiber yarns 221, each of which has a tensile modulus greater than 60 GPa. The fiber layer 22 may be a woven fabric or a unidirectional fabric. The fiber yarns 221 may be made of one or more fibers selected from the group consisting of glass fiber, high-modulus glass fiber, poly(p-phenylene benzobisoxazole) fiber, polyimide fiber, and aramid fiber.

[0109] Figure 5 This is a schematic diagram of a process for preparing a cortical layer provided in an embodiment of the present application. Figure 6 A schematic diagram of the preparation process of a polyurethane resin laminate provided in an embodiment of the present application.

[0110] In some embodiments, see Figure 5 As shown, the cortical layer 20 can be formed by the following steps:

[0111] S101 , providing a polyurethane resin laminate and a fiber layer 22 , wherein the polyurethane resin laminate includes a polyurethane resin layer 21 and a release paper 300 that are stacked.

[0112] Specifically, see Figure 6 As shown, a first polyurethane resin coating 211 of a first thickness is applied to one side of the release paper 300 by scraping and then dried. Next, a second polyurethane resin coating 212 of a second thickness is applied to the side of the first polyurethane resin coating 211 facing away from the release paper 300 and then dried. Next, a third polyurethane resin coating 213 of a third thickness is applied to the side of the second polyurethane resin coating 212 facing away from the first polyurethane resin coating 211 and then dried, thereby forming a polyurethane resin laminate.

[0113] The first thickness, the second thickness, and the third thickness may be different, or at least two of the first thickness, the second thickness, and the third thickness may be the same.

[0114] S102 , laminating the polyurethane resin layer 21 to one side of the fiber layer 22 to form the cortical layer 20 .

[0115] Specifically, the fiber layer 22 is laminated to the polyurethane resin layer 21 in the polyurethane resin laminate, and the release paper 300 is removed to form the cortical layer 20 .

[0116] S103 , after the polyurethane resin layer 21 and the fiber layer 22 are bonded together to form the cortical layer 20 , the process may further include: forming a pattern on a side of the polyurethane resin layer 21 away from the fiber layer 22 .

[0117] Specifically, the surface of the polyurethane resin layer 21 away from the fiber layer 22 can be surface treated by processes such as rolling or printing, so that a pattern is formed on the side of the polyurethane resin layer 21 away from the fiber layer 22, so that the surface of the polyurethane resin layer 21 can form a structure similar to the surface of leather.

[0118] It should be noted that in addition to forming patterns through processes such as roller coating or printing, in some embodiments, a texture structure can also be provided on the side of the release paper 300 that contacts the first polyurethane resin coating 211, and the texture structure is used to form a pattern on the surface of the polyurethane resin layer 21.

[0119] S20 , attaching the base layer 10 to the side of the fiber layer 22 facing away from the polyurethane resin layer 21 .

[0120] The fiber layer 22 can be bonded to the base layer 10 via a hot melt adhesive layer 30. Specifically, the hot melt adhesive layer 30 can be placed between the fiber layer 22 and the base layer 10, and then, by hot pressing, the hot melt adhesive layer 30 is firmly bonded to the fiber layer 22 and the base layer 10, respectively.

[0121] The housing assembly provided in the embodiments of the present application is described below with reference to specific embodiments.

[0122] Example 1:

[0123] The housing assembly 200 provided in this embodiment may include a stacked base layer 10, a hot melt adhesive layer 30, and a cortical layer 20. The hot melt adhesive layer 30 is a polyurethane hot melt adhesive layer 30. The base layer 10 is made of a glass fiber composite material and may be 0.4 mm thick. The cortical layer 20 includes a polyurethane resin layer 21 and a fiber layer 22. The polyurethane resin layer 21 may be 0.1 mm thick. The fiber layer 22 may be made of fiber yarn 221 made of E-grade glass fiber and may be 0.1 mm thick.

[0124] When the housing assembly 200 is applied to the back cover 130, the thickness of the back cover 130 is 0.65 mm. According to the GB / T10004-2008 puncture test standard, the puncture force of the back cover 130 is 110 N, and the puncture strength of the back cover 130 is 169 N / mm. This shows that after thinning the back cover 130, sufficient strength and puncture resistance can be improved, ensuring the safety of the battery 140.

[0125] Example 2:

[0126] The housing assembly 200 provided in this embodiment may include a stacked base layer 10, a hot melt adhesive layer 30, and a cortical layer 20. The hot melt adhesive layer 30 is a polyurethane hot melt adhesive layer 30. The base layer 10 is made of a glass fiber composite material and may be 0.3 mm thick. The cortical layer 20 includes a polyurethane resin layer 21 and a fiber layer 22. The polyurethane resin layer 21 may be 0.1 mm thick. The fiber layer 22 may be made of fiber yarn 221 made of S-grade glass fiber and may be 0.1 mm thick.

[0127] When the housing assembly 200 is applied to the back cover 130, the thickness of the back cover 130 can be 0.65 mm. According to the GB / T10004-2008 puncture test standard, the puncture force of the back cover 130 was 130 N, and the puncture strength of the back cover 130 was 200 N / mm. This shows that after thinning the back cover 130, sufficient strength and puncture resistance can be improved, ensuring the safety of the battery 140.

[0128] Example 3:

[0129] The shell assembly 200 provided in this embodiment may include a stacked base layer 10, a hot melt adhesive layer 30, and a cortical layer 20. The hot melt adhesive layer 30 is a polyurethane hot melt adhesive layer 30. The base layer 10 is made of a glass fiber composite material and may be 0.25 mm thick. The cortical layer 20 includes a polyurethane resin layer 21 and a fiber layer 22. The polyurethane resin layer 21 may be 0.1 mm thick. The fiber layer 22 may be made of fiber yarn 221 made of poly(p-phenylene benzobisoxazole) fiber (PBO fiber) and may be 0.1 mm thick.

[0130] When the housing assembly 200 is applied to the back cover 130, the thickness of the back cover 130 can be 0.55 mm. According to the GB / T10004-2008 puncture test standard, the puncture force of the back cover 130 was 150 N, and the puncture strength of the back cover 130 was 272.73 N / mm. This shows that after thinning the back cover 130, sufficient strength and puncture resistance can be improved, ensuring the safety of the battery 140.

[0131] Example 4:

[0132] The shell assembly 200 provided in this embodiment may include a stacked base layer 10, a hot melt adhesive layer 30, and a cortical layer 20. The hot melt adhesive layer 30 is a polyurethane hot melt adhesive layer 30. The base layer 10 is made of a poly(p-phenylene benzobisoxazole) composite material, and the thickness of the base layer 10 may be 0.25 mm. The cortical layer 20 includes a polyurethane resin layer 21 and a fiber layer 22. The polyurethane resin layer 21 may be 0.1 mm thick. The fiber layer 22 may be made of a fiber yarn 221 made of polyimide fiber (PI fiber), and the thickness of the fiber layer 22 may be 0.1 mm.

[0133] When the housing assembly 200 is applied to the back cover 130, the thickness of the back cover 130 can be 0.55 mm. According to the GB / T10004-2008 puncture test standard, the puncture force of the back cover 130 was 170 N, and the puncture strength of the back cover 130 was 309 N / mm. This shows that after thinning the back cover 130, sufficient strength and puncture resistance can be improved, ensuring the safety of the battery 140.

[0134] It should be noted that the combination of the fiber layer 22 made of different materials and the base layer 10 made of different materials is not limited to the above four embodiments, and other combinations are also possible, which will not be described in detail here.

[0135] In the related art, the back cover 600 includes a cortex layer 620 and a base layer 610. The cortex layer 620 includes a polyurethane resin layer 621 and a polyester fabric layer 622. The polyurethane resin layer 621 is made of polyurethane (PU) resin. The polyester fabric layer 622 is connected to the base layer 610, and the base layer 610 is made of a glass fiber composite material. The back cover 600 has a thickness of 0.7 mm. According to the GB / T10004-2008 puncture test standard, the puncture force of the back cover 600 is 100 N, and the puncture strength of the back cover 600 is 142 N / mm.

[0136] In summary, the puncture strength of the back cover 130 provided in Examples 1 to 4 is greater than that of the back cover 600 in the related art, and the thickness is less than that of the back cover 600 in the related art. In addition, by changing the material constituting the fiber yarn 221, the thickness of the back cover 130 can be further reduced, and the puncture strength can be further improved. Therefore, the housing assembly 200 provided in the embodiments of the present application is applied to the back cover 130, and the back cover 130 can provide sufficient strength and puncture resistance after being thinned.

[0137] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0138] In the embodiments of the present application, any device or element referred to or implied must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless otherwise specifically specified.

[0139] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0140] The term "plurality" in this document refers to two or more. The term "and / or" in this document simply describes a relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the related objects; in a formula, the character " / " indicates a "division" relationship between the related objects.

[0141] It will be understood that the various numerical numbers involved in the embodiments of the present application are merely distinctions for the convenience of description and are not intended to limit the scope of the embodiments of the present application.

[0142] It can be understood that in the embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. A housing assembly, characterized in that: It includes the basal layer and the cortical layer arranged in layers; The cortical layer comprises a fiber layer and a polyurethane resin layer stacked together, wherein the fiber layer is located between the base layer and the polyurethane resin layer; The plurality of fiber yarns in the fiber layer are cross-arranged, and the tensile modulus of the fiber yarns is greater than 60 GPa; The fiber layer is a woven fabric, and the denier of the woven fabric is greater than or equal to 100D and less than or equal to 150D; The shell assembly also includes a hot melt adhesive layer, which is located between the base layer and the fiber layer. The base layer and the cortical layer are bonded together through the hot melt adhesive layer, wherein the melting point of the hot melt adhesive layer is greater than or equal to 80°C and less than or equal to 90°C, the viscosity of the hot melt adhesive layer is greater than or equal to 900cps and less than or equal to 1100cps, and the molecular weight of the hot melt adhesive layer is greater than or equal to 5W and less than or equal to 5.5W.

2. The housing assembly according to claim 1, wherein: The tensile breaking strength of the cortical layer is greater than 100 N / cm.

3. The housing assembly according to claim 1 or 2, wherein: The fiber layer is made of the fiber yarns made of the same material, or the fiber layer is made of a plurality of fiber yarns made of different materials.

4. The housing assembly according to claim 1 or 2, wherein: The fiber yarn includes at least one of the following fibers: glass fiber, poly(p-phenylene benzobisoxazole) fiber, polyimide fiber, and aramid fiber.

5. The housing assembly according to claim 3, wherein: The fiber yarn includes at least one of the following fibers: glass fiber, poly(p-phenylene benzobisoxazole) fiber, polyimide fiber, and aramid fiber.

6. The housing assembly according to claim 4, wherein: The glass fiber is a high modulus glass fiber.

7. The housing assembly according to claim 5, wherein: The glass fiber is a high modulus glass fiber.

8. The housing assembly according to any one of claims 1, 2, 5-7, characterized in that: The hot melt adhesive layer is a polyurethane hot melt adhesive layer or an epoxy resin hot melt adhesive layer.

9. The housing assembly according to claim 3, wherein: The hot melt adhesive layer is a polyurethane hot melt adhesive layer or an epoxy resin hot melt adhesive layer.

10. The housing assembly according to claim 4, wherein: The hot melt adhesive layer is a polyurethane hot melt adhesive layer or an epoxy resin hot melt adhesive layer.

11. The housing assembly according to any one of claims 1, 2, 5-7, 9, and 10, characterized in that: The material of the base layer includes at least one of the following materials: glass fiber epoxy composite material, aramid fiber composite material, poly(p-phenylene benzobisoxazole) fiber composite material, polyimide fiber composite material, polycarbonate composite material or polymethyl methacrylate composite material.

12. The housing assembly according to claim 3, wherein: The material of the base layer includes at least one of the following materials: glass fiber epoxy composite material, aramid fiber composite material, poly(p-phenylene benzobisoxazole) fiber composite material, polyimide fiber composite material, polycarbonate composite material or polymethyl methacrylate composite material.

13. The housing assembly according to claim 4, wherein: The material of the base layer includes at least one of the following materials: glass fiber epoxy composite material, aramid fiber composite material, poly(p-phenylene benzobisoxazole) fiber composite material, polyimide fiber composite material, polycarbonate composite material or polymethyl methacrylate composite material.

14. The housing assembly according to claim 8, wherein: The material of the base layer includes at least one of the following materials: glass fiber epoxy composite material, aramid fiber composite material, poly(p-phenylene benzobisoxazole) fiber composite material, polyimide fiber composite material, polycarbonate composite material or polymethyl methacrylate composite material.

15. An electronic device, characterized in that: It comprises a middle frame, a display screen and a back cover, wherein the back cover and the display screen are respectively connected to two opposite sides of the middle frame, and the back cover comprises the shell assembly according to any one of claims 1 to 14.

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