A layered topology microchannel heat sink with low flow resistance manifold structure

Abstract

A layered topology microchannel heat sink with a low-flow-resistance manifold structure includes a cover plate layer, a manifold layer, a return flow layer, and a heat dissipation layer arranged sequentially. The cooling medium flows into the manifold layer from an inlet on the heat dissipation layer and through an inlet hole penetrating the return flow layer and the manifold layer. Within the manifold layer, the medium is divided into two or more paths within a branch manifold structure. At the end of the branch manifold structure, the medium enters the heat dissipation structure on the heat dissipation layer through a jet hole and an annular through-hole on an annular boss structure in the return flow layer, where it undergoes convective heat transfer. Then, at the edge of the heat dissipation structure, it enters the return flow layer through a return flow groove in the return flow layer, and finally flows out through a return flow hole penetrating the return flow layer and an outlet in the heat dissipation layer. This invention features low flow resistance, uniform flow distribution, and high heat exchange efficiency. It employs topology optimization technology to optimize the design of the branch manifold structure and the microchannel fin structure, effectively achieving heat transport and dissipation in high heat flux density electronic devices.

Description

Technical Field

[0001] This invention belongs to the field of heat dissipation technology for electronic devices, and specifically relates to a layered topology microchannel heat sink with a low flow resistance manifold structure. Background Technology

[0002] With the rapid development of modern electronic devices, the integration and power density of electronic components are constantly increasing, leading to a significant increase in the heat flux density of chips. Therefore, heat dissipation has become a key factor restricting the performance of electronic devices. How to efficiently dissipate heat from high-power chips to ensure that electronic devices can operate under efficient and stable conditions has become an important research topic.

[0003] Common heat dissipation strategies mainly fall into two categories: air cooling and liquid cooling. Air cooling relies on airflow to remove heat, but due to the limitations of air's thermal conductivity, its cooling efficiency is often insufficient for high heat flux density electronic devices. Liquid cooling, on the other hand, achieves more efficient heat dissipation through the flow and high thermal conductivity of liquids. Microchannel heat sinks increase the heat exchange area per unit area by fabricating tiny channels on a substrate, utilizing convective heat transfer of the cooling medium within the microchannels to achieve more efficient heat transfer.

[0004] However, traditional microchannel heat sink designs generally have limitations, mainly including low heat dissipation efficiency, high flow resistance, and uneven heat distribution. Traditional microchannel heat sinks typically employ a parallel rectangular or circular single-layer microchannel structure. When the cooling medium flows through the microchannels, there is significant flow resistance. Furthermore, when faced with complex heat source distributions, uneven heat dissipation can easily occur, leading to excessively high temperatures in certain areas and affecting the stability and lifespan of electronic devices.

[0005] For example, patent CN 115371483 A describes a manifold microchannel heat exchanger with a flow-splitting structure. This structure uses a 45° inclined flow-splitting structure on the basis of a traditional rectangular microchannel to reduce flow resistance and improve heat transfer capacity. It can be applied to the thermal management of electronic devices with high heat flux density to enhance heat dissipation performance. However, due to the limitations of the rectangular microchannel structure, the flow of the cooling fluid in the channel is relatively simple, lacking an effective fluid dynamic adjustment mechanism, resulting in low heat dissipation efficiency. At the same time, the flow-splitting capacity of the traditional flow-splitting structure is limited, and the cooling fluid flow is uneven, leading to uneven heat distribution in the chip array and affecting the working efficiency of electronic devices. Summary of the Invention

[0006] In order to overcome the shortcomings of the prior art, the present invention aims to provide a layered topology microchannel heat sink with a low flow resistance manifold structure, which has the characteristics of high heat dissipation and low flow resistance, and can meet the heat dissipation requirements of high heat flux density electronic devices.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0008] A layered topology microchannel heat sink with a low flow resistance manifold structure includes a cover plate layer 1, a manifold layer 2, a return flow layer 3, and a heat dissipation layer 4 arranged sequentially. The cooling medium flows into the manifold layer 2 from the inlet 6 on the heat dissipation layer 4 and the inlet flow hole 5 penetrating the return flow layer 3 and the manifold layer 2. In the manifold layer 2, the medium is divided into two or more paths in the branch manifold structure 10. At the end of the branch manifold structure 10, the medium enters the heat dissipation structure 9 on the heat dissipation layer 4 through the jet flow hole 17 and the annular through hole 8 located in the return flow layer 3. Convection heat transfer occurs in the heat dissipation structure 9. Then, at the edge of the heat dissipation structure 9, the medium enters the return flow layer 3 through the return flow groove 16 in the return flow layer 3. Finally, the medium flows out through the return flow hole 15 penetrating the return flow layer 3 and the outlet 12 of the heat dissipation layer 4.

[0009] The heat dissipation layer 4 contains two or more heat dissipation structures 9. The heat dissipation structures 9 correspond to the heat source installation positions on the outer surface of the heat dissipation layer 4. The cooling working fluid enters the heat dissipation structure 9 in the form of jet impact, and then diffuses evenly to the edge of the heat dissipation structure 9 in the form of parallel flow. The heat dissipation structure 9 contains microchannel fin structures 13 of different sizes and shapes. Convection heat transfer is completed under the combined action of jet impact and fin turbulence. The heat dissipation structure 9 is designed using topology optimization technology with flow pressure drop and channel volume as constraints and the goal of minimizing temperature.

[0010] The reflux layer 3 contains two or more reflux structures 14. After the cooling medium flows through the heat dissipation structure 9, it enters the reflux layer 3 through the reflux groove 16 at the edge of the reflux structure 14. In the reflux structure 14, the cooling medium converges from the edge to the center and then merges into one path, flowing out through the reflux flow hole 15 on the reflux layer 3 and the outlet 12 on the heat dissipation layer 4. The central region of the reflux structure 14 contains a boss structure 7, which contains a through annular through hole 8. The annular through hole 8 is concentrically connected to the jet flow hole 17 on the manifold layer, ensuring that the cooling medium enters the heat dissipation layer 4 in the form of a jet. The boss structure 7 can separate the cooling medium in the annular through hole 8 from the cooling medium in the reflux structure 14, ensuring the flow of the cooling medium.

[0011] The manifold layer 2 includes a branch manifold structure 10, which can uniformly distribute the cooling working fluid from the inlet flow hole 5 to two or more branches, ensuring that the flow rate of the cooling working fluid entering the heat dissipation structure 9 on the heat dissipation layer 4 through the jet flow hole 17 is uniform, so as to meet the temperature consistency of the heat source on the outer surface of the heat dissipation layer 4. The branch manifold structure 10 is designed using topology optimization technology with the flow pressure drop and flow channel volume as constraints and the minimum mean square error of the branch flow as the objective.

[0012] The cover plate layer 1, manifold layer 2, reflux layer 3 and heat dissipation layer 4 are all made of high thermal conductivity aluminum alloy. The structure of each layer is connected by diffusion welding process to meet the interlayer sealing requirements. The cooling medium includes water, No. 65 coolant, etc.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] This invention proposes a layered topology microchannel heat sink with a low flow resistance manifold structure, which features low flow resistance, uniform flow distribution, and high heat exchange efficiency. It adopts topology optimization technology to optimize the design of the manifold structure and microchannel fin structure, achieving high heat exchange while taking into account low flow resistance and high flow uniformity. It can effectively realize the heat transport and heat dissipation of high heat flux density electronic devices, and improve the stability and reliability of electronic devices. Attached Figure Description

[0015] Figure 1 This is a structural schematic diagram of an embodiment of the present invention.

[0016] Figure 2 This is a schematic diagram of the heat dissipation layer in an embodiment of the present invention.

[0017] Figure 3 This is a schematic diagram of the reflux layer in an embodiment of the present invention.

[0018] Figure 4 This is a schematic diagram of the manifold layer in an embodiment of the present invention.

[0019] Figure 5 This is a schematic diagram of the cooling working fluid flow in an embodiment of the present invention. Detailed Implementation

[0020] The present invention will be further described below with reference to the embodiments and accompanying drawings.

[0021] like Figures 1-5 As shown, a layered topology microchannel heat sink with a low flow resistance manifold structure includes a cover plate layer 1, a manifold layer 2, a return flow layer 3, and a heat dissipation layer 4 arranged sequentially. The cooling medium flows into the manifold layer 2 from the inlet 6 on the heat dissipation layer 4 and the inlet flow hole 5 penetrating the return flow layer 3 and the manifold layer 2. It is divided into two paths in the branch manifold structure 10 of the manifold layer 2. At the end of the branch manifold structure 10, it enters the heat dissipation structure 9 on the heat dissipation layer 4 through the jet flow hole 17 and the annular through hole 8 located in the return flow layer 3, and convective heat transfer occurs in the heat dissipation structure 9. Then, it enters the return flow layer 3 through the return flow groove 16 in the return flow layer 3 at the edge of the heat dissipation structure 9, and finally flows out through the return flow hole 15 penetrating the return flow layer 3 and the outlet 12 of the heat dissipation layer 4. The diameter of the inlet 6 is 3 mm and the diameter of the outlet 12 is 3 mm.

[0022] like Figure 2As shown, the heat dissipation layer 4 includes two heat dissipation structures 9. The heat dissipation structures 9 correspond to the heat source installation positions on the outer surface of the heat dissipation layer 4. The cooling working fluid enters the heat dissipation structure 9 in the form of jet impact, and then diffuses evenly to the edge of the heat dissipation structure 9 in the form of parallel flow. The heat dissipation structure 9 includes microchannel fin structures 13 of different sizes and shapes. Under the combined action of jet impact and fin turbulence, convective heat transfer is completed, and the heat from the heat source is dissipated in time. The heat dissipation structure 9 is designed using topology optimization technology with flow pressure drop and channel volume as constraints and the goal of minimizing temperature.

[0023] like Figure 3 As shown, the reflux layer 3 includes two reflux structures 14. After flowing through the heat dissipation structure 9, the cooling medium enters the reflux layer 3 through the reflux groove 16 at the edge of the reflux structure 14. In the reflux structure 14, the cooling medium converges from the edge to the center and then merges into one path, flowing out through the reflux flow hole 15 on the reflux layer 3 and the outlet 12 on the heat dissipation layer 4. The diameter of the reflux flow hole 15 is 3 mm. The central area of ​​the reflux structure 14 includes a boss structure 7, which includes a through annular through hole 8. The annular through hole 8 is concentrically connected to the jet flow hole 17 on the manifold layer 2, ensuring that the cooling medium enters the heat dissipation layer 4 in the form of a jet. The boss structure 7 can separate the cooling medium in the annular through hole 8 from the cooling medium in the reflux structure 14, ensuring the flowability of the cooling medium. The diameter of the boss structure 7 is 1.8 mm, and the diameter of the annular through hole 8 is 1 mm.

[0024] like Figure 4 As shown, the manifold layer 2 includes a "Y"-shaped branch manifold structure 10, which can uniformly distribute the cooling working fluid from the inlet flow hole 5 to the two branches, ensuring that the flow rate of the cooling working fluid entering the two heat dissipation structures 9 on the heat dissipation layer 4 through the jet flow hole 17 is uniform, so as to meet the temperature consistency of the heat source on the outer surface of the heat dissipation layer 4. The diameter of the inlet flow hole 5 is 3mm, and the diameter of the jet flow hole 17 is 1mm. The branch manifold structure 10 is designed using topology optimization technology with the flow pressure drop and flow channel volume as constraints and the minimum mean square error of the branch flow as the objective.

[0025] like Figure 1 As shown, the dimensions of the cover plate layer 1, manifold layer 2, reflux layer 3, and heat dissipation layer 4 are all 20mm × 15mm; the thickness of the cover plate layer 1 is 1mm; the thickness of the manifold layer 2 is 2mm, and the depth of the branch manifold structure 10 is 1mm; the thickness of the reflux layer 3 is 2mm, and the depth of the reflux structure 14 is 1mm; the thickness of the heat dissipation layer 4 is 1mm, and the depth of the heat dissipation structure 9 is 0.5mm; each layer is made of high thermal conductivity aluminum alloy, and the layers are connected by diffusion welding to ensure interlayer sealing; the cooling medium includes, but is not limited to, water and No. 65 coolant.

[0026] Numerical experiments have verified that the layered topology microchannel heat sink with a low-flow-resistance manifold structure proposed in this embodiment can achieve 300–500 W / cm². 2 The heat flux density heat source can dissipate heat, and the friction loss of the cooling medium does not exceed 50 kPa, and the temperature difference between each heat dissipation area does not exceed ±5℃, which can meet the heat dissipation requirements of high heat flux density electronic equipment.

[0027] Although the invention has been described above with reference to specific embodiments, those skilled in the art will understand that many modifications can be made to the configurations and details disclosed herein within the principles and scope of the invention. The scope of protection of the invention is determined by the appended claims, which are intended to cover all modifications included in the literal meaning or scope of equivalents of the technical features in the claims.

Claims

1. A layered topology microchannel heat sink with a low flow resistance manifold structure, characterized in that: it includes a cover plate layer (1), a manifold layer (2), a return flow layer (3) and a heat dissipation layer (4) arranged sequentially; the cooling working fluid flows into the manifold layer (2) from the inlet (6) on the heat dissipation layer (4) and the inlet flow hole (5) penetrating the return flow layer (3), and is divided into two or more paths in the manifold structure (10) of the manifold layer (2), and enters the heat dissipation structure (9) on the heat dissipation layer (4) through the jet flow hole (17) and the annular through hole (8) on the annular boss structure (7) in the return flow layer (3) at the end of the manifold structure (10), and is convective heat exchanged in the heat dissipation structure (9), and then enters the return flow layer (3) through the return groove (16) in the return flow layer (3) at the edge of the heat dissipation structure (9), and finally flows out through the return flow hole (15) penetrating the return flow layer (3) and the outlet (12) of the heat dissipation layer (4).

2. A layered topology microchannel heat sink with a low flow resistance manifold structure according to claim 1, characterized in that: The heat dissipation layer (4) contains two or more heat dissipation structures (9). The heat dissipation structure (9) corresponds to the heat source installation position on the outer surface of the heat dissipation layer (4). The cooling working fluid enters the heat dissipation structure (9) in the form of jet impact, and then diffuses evenly to the edge of the heat dissipation structure (9) in the form of parallel flow. The heat dissipation structure (9) contains microchannel fin structures (13) of different sizes and shapes. Convection heat transfer is completed under the combined action of jet impact and fin turbulence. The heat dissipation structure (9) is designed using topology optimization technology with flow pressure drop and channel volume as constraints and the lowest temperature as the goal.

3. A layered topology microchannel heat sink with a low flow resistance manifold structure according to claim 1, characterized in that: The reflux layer (3) contains two or more reflux structures (14). After the cooling medium flows through the heat dissipation structure (9), it enters the reflux layer (3) through the reflux groove (16) at the edge of the reflux structure (14). In the reflux structure (14), the cooling medium converges from the edge to the center and then merges into one path, flowing out through the reflux hole (15) on the reflux layer (3) and the outlet (12) on the heat dissipation layer (4). The central area of ​​the reflux structure (14) contains a boss structure (7). The boss structure (7) contains a through annular through hole (8). The annular through hole (8) is concentrically connected with the jet through hole (17) on the manifold layer, ensuring that the cooling medium enters the heat dissipation layer (4) in the form of a jet. The boss structure (7) can separate the cooling medium in the annular through hole (8) and the cooling medium in the reflux structure (14), ensuring the flowability of the cooling medium.

4. A layered topology microchannel heat sink with a low flow resistance manifold structure according to claim 1, characterized in that: The manifold layer (2) includes a branch manifold structure (10), which can uniformly distribute the cooling working fluid from the inlet flow hole (5) to two or more branches, ensuring that the flow rate of the cooling working fluid entering the heat dissipation structure (9) on the heat dissipation layer (4) through the jet flow hole (17) is uniform, so as to meet the temperature consistency of the heat source on the outer surface of the heat dissipation layer (4). The branch manifold structure (10) is designed using topology optimization technology with the flow pressure drop and flow channel volume as constraints and the minimum mean square error of the branch flow as the goal.

5. A layered topology microchannel heat sink with a low flow resistance manifold structure according to claim 1, characterized in that: The materials of the cover plate layer (1), manifold layer (2), reflux layer (3) and heat dissipation layer (4) are all high thermal conductivity aluminum alloy materials. The structure of each layer is connected by diffusion welding process to meet the interlayer sealing. The cooling medium includes water and No. 65 coolant.

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