A sediment thickness detection system, method and storage medium for cast-in-place piles

Abstract

The present invention discloses a sediment thickness detection system, method, and storage medium for bored piles. The system includes a sediment detector, a pay-out device, and a host computer. The sediment detector is lowered into the bored pile via the pay-out device. The sediment detector includes a detector body, an aviation plug, a bottom cone, a vernier, a depth gauge, and a main control board. The aviation plug and the bottom cone are respectively mounted at both ends of the detector body. A vibration motor is provided within the bottom cone. A permanent magnet is provided within the vernier and is slidably mounted on the exterior of the detector body. The depth gauge is provided with a magnetic sensing module for sensing the position of the vernier on the detector body as it slides. When the sediment detector is lowered into place, the main control board acquires a sensing signal from the magnetic sensing module and transmits it to the host computer, enabling the host computer to detect the sediment thickness of the bored pile based on the sensing signal. The present invention realizes automatic sediment thickness detection without the need for human intervention.

Description

Technical Field

[0001] The present invention relates to the field of concrete pouring, and in particular to a sediment thickness detection system, method and storage medium for cast-in-place piles. Background Art

[0002] Before pouring concrete, to ensure the quality of the concrete, the sediment within the pile must be cleaned and kept within a thickness of 50mm±10mm. Therefore, the sediment thickness within the pile must be tested to determine whether it meets the requirements and whether it requires cleaning. However, most instruments currently available for sediment detection and cleaning suffer from large size, poor measurement accuracy, and can even affect the quality of the pile. Summary of the Invention

[0003] In order to overcome the deficiencies of the prior art, one of the objectives of the present invention is to provide a sediment thickness detection system for cast-in-place piles, which can solve the problems of large size and low detection accuracy of existing sediment thickness detection equipment.

[0004] A second object of the present invention is to provide a sediment thickness detection method for cast-in-place piles, which can solve the problems of large size and low detection accuracy of existing sediment thickness detection equipment.

[0005] A third object of the present invention is to provide a computer-readable storage medium that can solve the problems of existing sediment thickness detection equipment, such as large size and low detection accuracy.

[0006] One of the purposes of the present invention is achieved by the following technical solution:

[0007] A sediment thickness detection system for cast-in-place piles, comprising a sediment detector, a wire-laying device, and a host computer; wherein the wire-laying device is connected to the sediment detector via a cable; the wire-laying device is also in communication with the host computer and is used to lower the sediment detector into the cast-in-place pile via the cable;

[0008] The sediment detector includes a detector body, an aviation plug, a bottom cone head, a vernier, a depth gauge and a main control board arranged inside the detector body; wherein the aviation plug is installed at the top of the detector body and is electrically connected to an external power supply; the bottom cone head is installed at the bottom end of the detector body; a vibration motor is also provided in the bottom cone head for driving the bottom cone head to vibrate; the vibration motor is electrically connected to the main control board; the main control board is arranged in the detector body and is electrically connected to the aviation plug;

[0009] The cursor is slidably mounted on the outside of the detector body, and a permanent magnet is provided in the cursor; a magnetic sensing module is provided in the depth gauge, and the magnetic sensing module is electrically connected to the main control board, and is used to sense the position of the cursor with the permanent magnet on the detector body during the sliding process of the cursor;

[0010] When the sediment detector is lowered into place, the bottom cone head contacts the bottom horizontal surface of the cast-in-place pile, and the cursor is located at the uppermost horizontal surface of the sediment layer in the cast-in-place pile; the main control board is communicatively connected to the host computer, and is used to obtain the induction signal of the magnetic induction module when the sediment detector is lowered into place to determine the position of the cursor on the detector body, and then derive the scale of the corresponding depth gauge according to the position of the cursor on the detector body, so as to derive the thickness of the sediment in the cast-in-place pile according to the scale of the corresponding depth gauge.

[0011] Furthermore, a vibration intensity sensor and an inclination sensor are further provided in the bottom cone head; the main control board is electrically connected to the vibration intensity sensor, and is used to obtain the vibration intensity data of the bottom cone head in real time through the vibration intensity sensor during the lowering process of the sediment detector and feed it back to the host computer, so that the host computer can determine whether the sediment detector is lowered into place according to the vibration intensity data;

[0012] The main control board is also electrically connected to the inclination sensor, and is used to obtain the inclination data of the sediment detector in real time through the inclination sensor and send it to the host computer, so that the host computer can determine whether the sediment detector is tilted according to the inclination data.

[0013] Furthermore, the top of the bottom cone head contacts the bottom end of the depth gauge; when the sediment detector is in the initial state, the cursor is located outside the detector body and the permanent magnet in the cursor corresponds to the bottom end level of the depth value.

[0014] Furthermore, the cursor includes a scum cursor and a laitance cursor; wherein the scum cursor and the laitance cursor are both slidably mounted on the outside of the detector body, and the scum cursor is located below the laitance cursor; permanent magnets are provided inside the scum cursor and the laitance cursor; when the sediment detector is in an initial state, the permanent magnet of the scum cursor is horizontally aligned with the bottom end of the depth gauge;

[0015] When the sediment detector is lowered into place, the scum cursor is located at the uppermost horizontal surface of the scum layer in the cast-in-place pile, and the slurry cursor is located at the uppermost horizontal surface of the slurry layer in the cast-in-place pile.

[0016] Furthermore, the gravity of the slurry cursor is less than or equal to the buoyancy of the slurry layer in the cast-in-place pile; the gravity of the scum cursor is less than or equal to the buoyancy of the scum layer in the cast-in-place pile, and the gravity of the scum cursor is greater than the buoyancy of the scum cursor in the cast-in-place pile.

[0017] Furthermore, the magnetic sensing module includes a Hall sensor array composed of a plurality of three-axis linear Hall sensors arranged equidistantly along the depth gauge, and each three-axis linear Hall sensor is electrically connected to the main control board;

[0018] When the sediment detector is lowered into the bored pile, when the cursor slides on the detector body, the corresponding three-axis linear Hall sensor generates a sensing signal and feeds the sensing signal back to the main control board; the main control board is used to send the sensing signal to the host computer, so that the host computer can derive the corresponding three-axis linear Hall sensor according to the sensing signal, and derive the scale of the depth gauge corresponding to the cursor according to the assembly relationship between the corresponding three-axis linear Hall sensor and the depth gauge, and then derive the thickness of the sediment in the bored pile.

[0019] Furthermore, the main control board includes a main control MCU, a power conversion module, a motor drive circuit, a 485 communication module and a voltage acquisition module;

[0020] The input end of the power conversion module is electrically connected to the aviation plug and is used to convert the external power supply into the internal power supply; wherein, the power conversion module includes a first power module, a second power module and a third power module; the input end of the first power module is electrically connected to the aviation plug, and the output end outputs the first internal power supply; the input end of the second power module inputs the first internal power supply, and the output end outputs the second internal power supply; the input end of the third power module inputs the second internal power supply, and the output end outputs the third internal power supply;

[0021] The main control MCU is electrically connected to the vibration motor through the motor drive circuit; the vibration motor is a brushless motor; the main control MCU is communicatively connected to the 485 communication module and the host computer; the main control MCU is electrically connected to the aviation plug through the voltage acquisition module;

[0022] The detector body includes a shell, in which the fixing plate is provided; the main control board and the depth gauge are fixed on the fixing plate; a motor fixing block is also provided in the bottom cone head, and the vibration motor is installed on the motor fixing block;

[0023] A display screen is provided on the housing, and the display screen is arranged corresponding to the depth gauge and is used to display the scale of the depth gauge.

[0024] The second object of the present invention is achieved by adopting the following technical solution:

[0025] A sediment thickness detection method for cast-in-place piles, applied to a sediment thickness detection system for cast-in-place piles adopted as one of the purposes of the present invention, the sediment detection method comprising:

[0026] Controlling the lowering step: lowering the sediment detector into the cast-in-place pile, and sending a control signal to the main control board of the sediment detector during the lowering process of the sediment detector to control the vibration motor of the sediment detector to drive the bottom cone head of the sediment detector to vibrate;

[0027] Calculation steps: When the sediment detector is lowered into place, the induction signal of the magnetic induction module is obtained and the position of the cursor on the detector body of the sediment detector is obtained according to the induction signal. Then, the corresponding scale of the depth gauge is obtained according to the position of the cursor on the detector body of the sediment detector, and the thickness of the sediment in the cast-in-place pile is obtained according to the corresponding scale.

[0028] Furthermore, the method further includes: the step of lowering the sediment detector into place: obtaining vibration intensity data of the bottom cone head of the sediment detector and judging whether the sediment detector is lowered into place according to the vibration intensity data; a vibration intensity sensor is provided in the bottom cone head, and the vibration intensity sensor is electrically connected to the main control board for obtaining the vibration intensity data of the bottom cone head in real time;

[0029] Tilt determination step: determining whether the sediment detector is tilted by acquiring tilt data of the sediment detector; a tilt sensor is provided in the sediment detector, and the tilt sensor is electrically connected to the main control board for acquiring the tilt data of the sediment detector;

[0030] Qualification judgment step: judging whether the cast-in-place pile is qualified according to the thickness of the sediment in the cast-in-place pile obtained; if not, notifying relevant staff to clean the sediment in the cast-in-place pile.

[0031] The third object of the present invention is achieved by adopting the following technical solution:

[0032] A computer-readable storage medium stores a sediment thickness detection program for cast-in-place piles. The sediment thickness detection program for cast-in-place piles is a computer program. When the sediment thickness detection program for cast-in-place piles is executed by a processor, the steps of a sediment thickness detection method for cast-in-place piles adopted as one of the purposes of the present invention are implemented.

[0033] Compared with the prior art, the present invention has the following beneficial effects:

[0034] The present invention utilizes magnetic induction and a depth gauge to sense the movement distance of a cursor provided on the outside of the detector body, thereby realizing the detection of the sediment thickness in the cast-in-place pile. At the same time, the upper computer, the pay-out device and the vibration intensity sensor are combined to realize the lowering control of the sediment detector and the detection of the sediment detection in place, so as to realize automatic detection of the sediment thickness, without the need for manual measurement, easy operation and higher efficiency. At the same time, the equipment has the characteristics of simple structure, small size and easy operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 This is a module diagram of a sediment thickness detection system for cast-in-place piles provided by the present invention;

[0036] Figure 2 for Figure 1 Schematic diagram of the overall structure of the sediment detector;

[0037] Figure 3 for Figure 2 Schematic diagram of the cross section structure;

[0038] Figure 4 A circuit diagram of a first power supply module of the sediment detector provided by the present invention;

[0039] Figure 5 A circuit diagram of the second power module and the third power module of the sediment detector provided by the present invention;

[0040] Figure 6 A circuit diagram of the main control MCU of the sediment detector provided by the present invention;

[0041] Figure 7 A circuit diagram of a three-axis linear Hall sensor of the sediment detector provided by the present invention;

[0042] Figure 8 A circuit diagram of the 485 communication module of the sediment detector provided by the present invention;

[0043] Figure 9 A circuit diagram of a voltage acquisition module of the sediment detector provided by the present invention;

[0044] Figure 10 A circuit diagram of a motor drive circuit of the sediment detector provided by the present invention;

[0045] Figure 11 A circuit diagram of the inclination sensor of the sediment detector provided by the present invention;

[0046] Figure 12 The present invention provides a flow chart of a method for detecting sediment thickness of cast-in-place piles.

[0047] In the figure: 1. Detector body; 2. Bottom cone head; 3. Aviation plug; 11. Scum cursor; 12. Slurry cursor; 13. Main control board; 14. Three-axis linear Hall sensor; 15. Fixing plate; 21. Motor fixing block; 22. Vibration motor; 31. Aviation plug female; 32. Aviation plug male. DETAILED DESCRIPTION

[0048] The present invention will be further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0049] Example 1

[0050] like Figure 1 - Figure 3 As shown, the present invention provides a preferred embodiment, a sediment thickness detection system for cast-in-place piles, comprising a sediment detector, a line-laying device, and a host computer.

[0051] The present invention lowers a sediment detector into a cast-in-place pile to detect the thickness of sediment in the cast-in-place pile. A wire-laying device is connected to the sediment detector via a cable, so that the sediment detector is lowered into the cast-in-place pile via the cable to detect the thickness of sediment in the cast-in-place pile.

[0052] Furthermore, the pay-out device is also connected to a host computer, controlling the cable according to the host computer's control signals, thereby lowering the sediment detector into the cast-in-place pile. Remote control of the pay-out device is achieved through the host computer, enabling the sediment detector to be automatically lowered without manual operation.

[0053] More specifically, the sediment detector includes a detector body 1, an aviation plug 3, a bottom cone 2, a vernier, a depth gauge located within the detector body 1, and a main control board 13. The aviation plug 3 is mounted at the top of the detector body 1 and is electrically connected to an external power supply to provide power to the sediment detector.

[0054] The bottom cone head 2 is mounted at the bottom end of the detector body 1. A vibration motor 22 is also provided within the bottom cone head 2. This vibration motor 22 drives the bottom cone head 2 to vibrate, thereby driving the bottom cone head 2 into the sediment within the cast-in-place pile. More preferably, a motor fixing block 21 is also provided within the bottom cone head 2. The vibration motor 22 is mounted on the motor fixing block 21 to prevent the vibration motor 22 from shifting during vibration of the bottom cone head 2.

[0055] Furthermore, a cursor is slidably mounted on the exterior of the detector body 1, and a permanent magnet is disposed within the cursor. A magnetic sensing module is also disposed within the depth gauge, electrically connected to the main control board 13, for sensing the position of the cursor with the permanent magnet on the detector body 1 as the cursor slides.

[0056] When the sediment detector is lowered into place, the bottom cone 2 contacts the bottom horizontal surface of the pile, and the cursor is located at the uppermost horizontal surface of the sediment layer within the pile. At this point, the main control board 13 is used to obtain the sensing signal from the magnetic sensing module to determine the position of the cursor on the detector body 1. Based on the cursor position on the detector body 1, the corresponding depth gauge scale is determined, and the thickness of the sediment layer within the pile is determined based on the corresponding depth gauge scale.

[0057] Specifically, when the sediment detector is lowered into the sediment in the bored pile, as the bottom cone head 2 is inserted into the sediment, the cursor will move linearly on the detector body 1 under the action of the buoyancy or resistance of the sediment layer. At this time, the magnetic sensing module in the depth gauge will sense the permanent magnet and generate an induction signal. In this way, the position of the cursor on the detector body 1 can be obtained based on the induction signal, and the thickness of the sediment layer in the bored pile can be obtained in combination with the scale of the depth gauge.

[0058] In addition, when the thickness of the sediment layer in the bored pile is obtained, it is also judged whether the bored pile meets the pouring requirements based on the thickness of the sediment layer. If so, the bored pile is qualified and the next step is allowed; otherwise, the bored pile is unqualified, and the sediment in the bored pile needs to be cleaned so that the sediment thickness meets the pouring requirements.

[0059] More specifically, the maximum sediment thickness measured by the sediment detector provided in this embodiment can reach 500 mm, wherein the scale at the bottom end of the depth gauge is 0 mm and the scale at the top end is 500 mm.

[0060] Furthermore, since the bottom of the detector body 1 housing houses the bottom cone head 2 and vibration motor 22, along with other equipment designed for a horizontal front-end, the bottom cone head 2 in this embodiment is configured as a conical cage-type horizontal front-end structure. In the initial state of the sediment detector, the front end of the conical cage is aligned with the bottom end of the depth gauge, and the permanent magnet on the vernier is aligned horizontally with the scale at the bottom end of the depth gauge. Specifically, the bottom end of the depth gauge can be calibrated to 0 mm.

[0061] Preferably, the sediment within the cast-in-place pile is divided into a scum layer and a laitance layer depending on the sediment material. Therefore, the cursors in this embodiment include a laitance cursor 12 and a scum cursor 11, with the laitance cursor 12 positioned above the scum cursor 11. The permanent magnet of the scum cursor 11 is aligned with the bottom scale of the depth gauge, while the permanent magnet of the laitance cursor 12 is aligned with the 20 mm mark on the depth gauge.

[0062] More preferably, to ensure accurate measurement, when the sediment detector is lowered into place, the bottom cone 2 contacts the bottom of the bored pile. At this point, the scum cursor 11 is located at the topmost horizontal plane of the scum layer, and the grout cursor 12 is located at the topmost horizontal plane of the grout layer. That is, when the sediment detector is lowered into place, the gravity of the grout cursor 12 is less than or equal to the buoyancy of the grout cursor 12 in the bored pile. The gravity of the scum cursor 11 is less than or equal to the buoyancy of the scum layer in the bored pile, and the gravity of the scum cursor 11 is greater than the buoyancy of the grout cursor 11 in the bored pile. That is, when the sediment detector is lowered into place, the positions of the grout cursor 12 and scum cursor 11 on the detector body 1 are sensed by the permanent magnet, allowing the scum and grout layers in the bored pile to be detected, thereby measuring the sediment thickness.

[0063] Preferably, the magnetic induction module includes a Hall sensor array composed of a plurality of three-axis linear Hall sensors 14 installed on the depth gauge and arranged equidistantly along the depth gauge. Each three-axis linear Hall sensor 14 is electrically connected to the main control board 13. Once the cursor moves to the corresponding three-axis linear Hall sensor 14, the corresponding three-axis linear Hall sensor 14 will sense the permanent magnet and generate an induction signal. The main control board 13 sends the induction signal to the host computer, and the host computer can identify the corresponding three-axis linear Hall sensor 14 based on the induction signal, and then the scale corresponding to the cursor can be obtained based on the scale of the depth gauge corresponding to the three-axis linear Hall sensor 14, thereby realizing the detection of the sediment thickness. Similarly, when the cursor includes a slurry cursor 12 and a scum cursor 11, the same principle is used to realize the detection of the thickness of the slurry layer and the scum layer in the cast-in-place pile.

[0064] Furthermore, the main control board 13 also includes a main control MCU. Figure 6 As shown, the main control MCU includes a chip U30 of model STM32L431CCT6 and its peripheral circuits, specifically including resistor R188, capacitor C47, capacitor C48, a switch, capacitor C45, capacitor C54, capacitor C49, capacitor C50, capacitor C51, capacitor C53, resistor R187, capacitor C52, resistor R189, chip U29 and plug connector H1.

[0065] One end of the resistor R188 is grounded (GND), and the other end is electrically connected to the forty-fourth terminal of the chip U30.

[0066] The 48th, 36th and 24th terminals of the chip U30 are connected to the second internal power supply, that is, 3.3V.

[0067] The first terminal (VBAT terminal) of the chip U30 is connected to the second internal power supply and grounded through the capacitor C47. The eighth terminal of the chip U30 is connected to AGND, the ninth terminal is connected to VREF, the thirty-fifth terminal is grounded, and the twenty-third terminal is grounded.

[0068] One end of capacitor C48 is electrically connected to the first and third ends of the switch, and the other end is electrically connected to the second and fourth ends of the switch; the first and third ends of the switch are also electrically connected to the seventh end of the chip U30, and the second and fourth ends of the switch are grounded; a reset signal can be sent to the chip U30 through the switch to realize the reset function.

[0069] One end of capacitors C45, C54, C49, and C50 is connected to the second internal power supply, i.e., 3.3V, and the other end is connected to ground (GND). The parallel circuit formed by these capacitors filters the second internal power supply connected to chip U30 to ensure stable power supply.

[0070] One end of the capacitor C51 and the capacitor C53 is connected to the ninth terminal (VREF terminal) of the chip U30, and the other end is connected to AGND.

[0071] One end of resistor R187 is connected to the second internal power supply (3.3V), and the other end is electrically connected to the ninth terminal (VREF) of chip U30. Chip U29 has its first and second ends connected between resistor R187 and the ninth terminal of chip U30, and its third end connected to AGND. Capacitor C52 has one end connected to ground, and its other end connected between resistor R187 and the ninth terminal of chip U30.

[0072] One end of the resistor R189 is connected to ground (GND), and the other end is connected to AGND.

[0073] The first end of the plug connector H1 is grounded, the second end is connected to the second internal power supply, the third end is electrically connected to the thirty-seventh end of the chip U30, and the fourth end is electrically connected to the thirty-fourth end of the chip U30.

[0074] like Figure 7As shown, a three-axis linear Hall sensor 14 in this embodiment includes a chip U1, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a capacitor C1, and a resistor R22. The first end of the chip U1 is electrically connected to the main control MCU via resistor R1, the second end is electrically connected to the main control MCU via resistor R2, the third end is electrically connected to the main control MCU via resistor R3, and the fourth end is electrically connected to the main control MCU via resistor R4. The sixth and seventh ends of the chip U1 are grounded. The fifth end of the chip U1 is connected to the fourth internal power supply, and the fifth end is also grounded via capacitor C1. One end of the resistor R22 is connected to the third internal power supply, and the other end outputs the fourth internal power supply. The model of the chip U1 is TMAG5170A1QDGKR.

[0075] By electrically connecting each three-axis linear Hall sensor 14 to the chip U30 of the main control MCU, signal sensing is achieved for each three-axis linear Hall sensor 14. That is, when the slurry cursor 12 or the scum cursor 11 with a permanent magnet is located at the corresponding three-axis linear Hall sensor 14, the main control MCU will sense the corresponding electrical signal and send it to the host computer. The host computer can calculate the thickness of the slurry layer and the scum layer based on the installation position of the corresponding three-axis linear Hall sensor 14 and the size of the detector body 1, thereby detecting the sediment in the cast-in-place pile.

[0076] More preferably, a vibration intensity sensor is also provided in the bottom cone head 2 in this embodiment. The main control board 13 is electrically connected to the vibration intensity sensor, and is used to obtain the vibration intensity data of the bottom cone head 2 in real time through the vibration intensity sensor during the lowering process of the sediment detector, and feed it back to the host computer so that the host computer can judge whether the sediment detector is lowered into place based on the vibration intensity data of the bottom cone head 2. That is, since there are slurry layers, scum layers, etc. in the bored pile, and the hardness of different layers is different, this embodiment uses the vibration intensity sensor to feedback the medium layer where the bottom cone head 2 is located, and then judge whether the sediment detector is lowered into place. Specifically, in this embodiment, when the bottom cone head 2 passes through the scum layer and contacts the bottom end of the bored pile, it is considered that the sediment detector is lowered into place.

[0077] In addition, the present embodiment can also determine whether the sediment detector has been lowered into place by using a pay-out device. Specifically, when the bottom cone head 2 contacts the bottom end of the bored pile, since the hardness of the bottom end of the bored pile intersects with the harder scum layer, by controlling the operation of the appropriate vibration motor 22, the bottom cone head 2 can penetrate the scum layer but cannot penetrate the bottom end of the bored pile. In this way, when the bottom cone head 2 of the sediment detector contacts the bottom end of the bored pile, since the bottom cone head 2 cannot penetrate the bottom end of the bored pile, if the pay-out device is continued to pay out the line at this time, the tension of the cable of the pay-out device will change significantly. Therefore, the present embodiment determines whether the sediment detector has been lowered into place by real-time detection of the tension of the cable of the pay-out device. Specifically, the pay-out device includes a pay-out motor, a pay-out drive device, and a tensioning pulley. Among them, one end of the pay-off drive device is electrically connected to the host computer, and the other end is connected to the tensioning wheel through the pay-off motor. By receiving the control command of the host computer, the pay-off motor drives the rotation of the tensioning wheel to achieve pay-off. The tensioning wheel is also connected to the detector body 1 of the sediment detector through a cable. The pay-off of the tensioning wheel drives the sediment detector to be lowered into the cast-in-place pile, and driven by the vibration motor 22, the cone head passes through the slurry layer and the scum layer in sequence, and then contacts the bottom of the cast-in-place pile. At this time, the sediment detector can be judged to be in place based on the tension of the tensioning wheel cable. Specifically, the tensioning wheel is also connected to the host computer, and the tension of the tensioning wheel cable is obtained by the host computer to determine whether the sediment detector is in place. Preferably, when judging whether the sediment detector is in place, the tension of the tensioning wheel cable and the vibration intensity data of the bottom cone head 2 can be combined to judge to improve the accuracy of the judgment. The sediment detector of the present invention does not require manual measurement, and can realize automatic measurement through a host computer, thereby improving measurement precision and accuracy and reducing labor costs.

[0078] Preferably, the main control board 13 is further provided with a motor drive circuit, a power conversion module, a 485 communication module and a voltage acquisition module.

[0079] Among them, the input end of the power conversion module is electrically connected to the aviation plug 3, and is used to convert the external power supply into the internal power supply. In addition, since the voltage of the power supply required by each module such as the main control MCU, the motor drive circuit, the 485 communication module, the voltage acquisition module, etc. is different, the power conversion module in this embodiment specifically includes a first power module, a second power module and a third power module. Among them, the first power module is electrically connected to the aviation plug 3, and is used to convert the external power supply into the first internal power supply for use in the motor drive circuit. More specifically, as Figure 4As shown, the first power module includes a fuse F1, an ESD bidirectional diode E1, a TVS diode D6, a capacitor C40, a capacitor C26, a capacitor C27, a capacitor C42, a chip U34, an inductor L1, a Schottky diode D1, a resistor R181, a resistor R182, and a resistor R183. One end of the fuse F1 is electrically connected to the input terminal VIN, and the other end is electrically connected to the seventh terminal of the chip U34. An external power supply is also connected between the seventh terminal of the chip U34 and the fuse F1. The sixth terminal of the chip U34 is connected between the fuse F1 and the seventh terminal of the chip U34 via the capacitor C26. One end of the ESD bidirectional diode E1, the TVS diode D2, and the capacitor C40 is grounded, and the other end is connected between the other end of the fuse F1 and the seventh terminal of the chip U34. The eighth terminal and the first end of the chip U34 are grounded. The second end of the chip U34 is grounded via the resistor R183. The third end of the chip U34 outputs the first internal power supply. The fourth terminal of chip U34 is also grounded via Schottky diode D1. The fourth terminal of chip U34 is also connected to output terminal OUT_C ​​via inductor L1. One end of resistor R181 outputs the first internal power supply, and the other end is electrically connected to inductor L1. One end of capacitor C27 is grounded, and the other end is connected between inductor L1 and resistor R181. One end of resistor R182 is electrically connected to inductor L1 via resistor R181, and the other end is connected between the second end of chip U34 and capacitor C42. One end of resistor R183 is grounded, and the other end is connected between the second end of chip U34 and capacitor C42. The fifth terminal of chip U5 is also connected between inductor L1 and resistor R181. The model of chip U34 is XL7056E1.

[0080] The second power supply module is used to convert the first internal power supply into the second internal power supply for use by the main control MCU and the 485 communication module. Figure 5 As shown, the second power supply module includes capacitor C9, capacitor C10, capacitor C11, capacitor C12 and chip U36. Among them, one end of capacitor C9 is electrically connected to the third end of chip U36, and the other end is grounded. One end of capacitor C12 is electrically connected to the third end of chip U36, and the other end is grounded. One end of capacitor C9 is electrically connected to the second end and the fourth end of chip U36, and the other end is grounded. One end of capacitor C11 is electrically connected to the second end and the fourth end of chip U36, and the other end is grounded. The first end of chip U36 is connected to the first internal power supply, the second end and the fourth end output the second internal power supply, and the third end is grounded.

[0081] The third power supply module is used to convert the second internal power supply into a third internal power supply for use by the three-axis linear Hall sensor 14. Specifically, Figure 5As shown, the third power supply module includes a resistor R21, wherein one end of the resistor R21 is connected to the second internal power supply, and the other end thereof outputs the third internal power supply.

[0082] By setting up the power supply module, the power supply voltage conversion is achieved to adapt to the use of different modules to ensure the normal operation of each module.

[0083] Furthermore, the main control MCU is electrically connected to the vibration motor 22 through the motor drive circuit, and the vibration motor 22 is driven to vibrate by the motor drive circuit. More specifically, the vibration motor 22 is a brushless motor. Specifically, Figure 10 As shown, the motor drive circuit includes resistors R34, R35, and R36, a chip UX, capacitors C13, C14, and C15, and a plug connector CN5. One end of resistor R35 is grounded, and the other end is electrically connected to the first end of the chip UX. The second end of the chip UX is grounded; the third and fourth ends of the chip UX are electrically connected to the main control MCU. The fifth end of the chip UX is grounded via capacitor C13, and the sixth end of the chip UX is grounded via resistor R34. The eighth end of the chip UX is grounded via resistor R36; the seventh, tenth, seventeenth, and sixteenth ends of the chip UX are all grounded. The fourteenth end of the chip UX is connected to the first internal power supply. The fifteenth end of the chip UX is electrically connected to the fourteenth end of the chip UX via capacitor C14; the thirteenth, twelfth, and eleventh ends of the chip UX are electrically connected to the vibration motor 22 via plug connector CN5; one end of capacitor C15 is grounded, and the other end is electrically connected to the fourteenth end of the chip UX. The model of the chip UX is 2DRV10974PWPR.

[0084] The main control MCU is also connected to the host computer through the 485 communication module to realize data interaction with the host computer, such as receiving control instructions sent by the host computer or uploading data to the host computer. Figure 8As shown, the 485 communication module includes resistors R184, R193, R185, R186, capacitor C18, resistor RT1, anti-static diode D4, resistors MOV1, MOV2, voltage protector M1, voltage protector M2, chip U28, and plug connector CN1. Resistor R184 has one end connected to the second internal power supply and the other end electrically connected to the first end of chip U28. Resistor R193 has one end connected to ground and the other end electrically connected to the second end of chip U28. The first and fourth ends of chip U28 are electrically connected to the main control MCU; the second and third ends of chip U28 are electrically connected to the main control MCU. The eighth end of chip U28 is connected to the second internal power supply and is also connected to ground via capacitor C46. The fifth end of chip U28 is grounded. The seventh end of chip U28 is electrically connected to the third end of voltage protector M1 via resistor R185. The first end of voltage protector M1 is electrically connected to the third end of plug connector CN1. The sixth terminal of chip U28 is electrically connected to the third terminal of voltage protector M2 via resistor R186. The first terminal of voltage protector M2 is electrically connected to the fourth terminal of plug connector CN1. The first terminal of voltage protector M1 is also grounded via resistor MOV2, and the first terminal of voltage protector M2 is also grounded via resistor MOV1. The first terminal of anti-static diode D4 is grounded, the second terminal is connected between resistor R185 and the third terminal of voltage protector M1, and the third terminal is connected between resistor R186 and the third terminal of voltage protector M2. One terminal of resistor RT1 is connected between resistor R185 and the third terminal of voltage protector M1, and the other terminal is connected between resistor R186 and the third terminal of voltage protector M2.

[0085] The main control MCU is also electrically connected to the aviation plug 3 through the voltage acquisition module to obtain the voltage of the external power supply to determine whether the external power supply is normal. Figure 9 As shown, the voltage acquisition module includes resistors R191, R192, R190, R195, TVS surge protection diode D5, and capacitor C77. One end of resistor R192 is connected to the aviation plug 3, and the other end is electrically connected to the first end of the TVS surge protection diode D5 through resistor R191. One end of resistor R195 is electrically connected to the first end of the TVS surge protection diode D5, and the other end is electrically connected to the main control MCU. One end of capacitor C77 is grounded, and the other end is connected between resistor R195 and the main control MCU. One end of resistor R190 is grounded, and the other end is connected between resistor R191 and resistor R195.

[0086] Preferably, the detector body 1 of this embodiment is further provided with an inclination sensor. The main control MCU is electrically connected to the inclination sensor, and is used to obtain the inclination data of the sediment detector in real time through the inclination sensor and send it to the host computer, so that the host computer can judge whether the sediment detector is tilted based on the inclination data of the sediment detector. By judging the inclination of the sediment detector, abnormalities of the sediment detector can be discovered in time to avoid false detection. Specifically, Figure 11 As shown, the tilt sensor includes a resistor R15, a resistor R16, a capacitor C55, a capacitor C56, and a chip U31. One end of the resistor R15 is connected to the second internal power supply, and the other end is electrically connected to the fourth end of the chip U31. One end of the resistor R16 is connected to the second internal power supply, and the other end is electrically connected to the sixth end of the chip U31. The fourth end and the sixth end of the chip U31 are electrically connected to the main control MCU. The fifth, seventh, twelfth, and tenth ends of the chip U31 are grounded; the fourteenth and eighth ends of the chip U31 are connected to the second internal power supply. The first end of the chip U31 is grounded via the parallel capacitors C55 and C56. The model of the chip U31 is LIS3DHTR.

[0087] More preferably, the detector body 1 includes a housing. The main control board 13, magnetic sensing module, and depth gauge are all housed within the housing. Furthermore, a fixing plate 15 is provided within the housing. The main control board 13 and magnetic sensing module are secured to the fixing plate 15 to prevent displacement of the main control board 13 and magnetic sensing module when the vibration motor 22 drives the bottom cone head 2 to vibrate.

[0088] Similarly, a motor fixing block 21 is further provided in the bottom cone head 2 , and the vibration motor 22 is installed in the motor fixing block 21 to limit the vibration motor 22 .

[0089] More preferably, the aviation plug 3 includes a male aviation plug 32 and a female aviation plug 31; the male aviation plug 32 is fixedly connected to the top of the detector body 1; the female aviation plug 31 is mated and connected to the male aviation plug 32; and the female aviation plug 31 is electrically connected to an external power supply. The main control board 13 in the sediment detector is powered by the aviation plug 3.

[0090] Example 2

[0091] Based on the first embodiment, the present invention further provides a method for detecting concrete sediment, which is applied to a sediment thickness detection system for cast-in-place piles as provided in the first embodiment. Figure 12 Shown, including:

[0092] Step S1: lowering the sediment detector into the cast-in-place pile and sending a control signal to the main control board of the sediment detector during the lowering process to control the vibration motor of the sediment detector to drive the bottom cone head of the sediment detector to vibrate.

[0093] Specifically, the sediment detector is controlled by the upper computer and the vibration motor is controlled by the main control board, thereby realizing remote control without manual operation.

[0094] Step S2: When the sediment detector is lowered into place, the induction signal of the magnetic induction module is obtained and the position of the cursor on the detector body of the sediment detector is obtained according to the induction signal. Then, the corresponding scale of the depth gauge is obtained according to the position of the cursor on the detector body of the sediment detector, and the thickness of the sediment in the cast-in-place pile is obtained according to the corresponding scale.

[0095] Furthermore, lowering the sediment detector into place in step S2 also includes: obtaining vibration intensity data of the bottom cone head of the sediment detector and judging whether the sediment detector is lowered into place based on the vibration intensity data; a vibration intensity sensor is provided in the bottom cone head, and the vibration intensity sensor is electrically connected to the main control board for obtaining the vibration intensity data of the bottom cone head in real time.

[0096] Furthermore, it also includes: obtaining the inclination data of the sediment detector to determine whether the sediment detector is tilted; the sediment detector is provided with an inclination sensor, the inclination sensor is electrically connected to the main control board, and is used to obtain the inclination data of the sediment detector.

[0097] Furthermore, it also includes: whether the thickness of the sediment in the bored pile obtained by calculation meets the requirements. If so, the bored pile is qualified and the next pouring operation can be carried out; if not, the bored pile is unqualified, and the relevant department is notified to clean the bored pile to remove excess sediment in the bored pile and ensure the quality of concrete pouring.

[0098] Example 3

[0099] Based on Example 2, the present invention also provides a computer-readable storage medium on which a sediment thickness detection program for cast-in-place piles is stored. The sediment thickness detection program for cast-in-place piles is a computer program. When the sediment thickness detection program for cast-in-place piles is executed by a processor, the steps of a sediment thickness detection method for cast-in-place piles provided in Example 2 of the present invention are implemented.

[0100] The above embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and replacements made by technicians in this field on the basis of the present invention fall within the scope of protection required by the present invention.

Claims

1. A sediment thickness detection system for bored piles, characterized in that: The utility model comprises a sediment detector, a wire-paying device and a host computer; wherein the wire-paying device is connected to the sediment detector via a cable; the wire-paying device is also in communication connection with the host computer and is used to lower the sediment detector into the cast-in-place pile via the cable; the wire-paying device comprises a wire-paying motor, a wire-paying drive device and a tensioning wheel; one end of the wire-paying drive device is electrically connected to the host computer, and the other end is connected to the tensioning wheel via the wire-paying motor; the tensioning wheel is connected to the detector body of the sediment detector via a cable; the wire-paying drive device drives the rotation of the tensioning wheel by receiving control instructions from the host computer, thereby driving the sediment detector to be lowered into the cast-in-place pile; The sediment detector includes a detector body, an aviation plug, a bottom cone, a vernier, a depth gauge located inside the detector body, and a main control board. The aviation plug is installed at the top of the detector body and is electrically connected to an external power supply. The bottom cone is installed at the bottom of the detector body. A vibration motor is also provided inside the bottom cone to drive the bottom cone to vibrate. The vibration motor is electrically connected to the main control board. The main control board is located inside the detector body and is electrically connected to the aviation plug. The cursor is slidably mounted on the outside of the detector body, and a permanent magnet is provided inside the cursor. A magnetic sensing module is provided inside the depth gauge, and the magnetic sensing module is electrically connected to the main control board to sense the position of the cursor on the detector body during the sliding process of the cursor. When the sediment detector is lowered into place, the cone head at the bottom contacts the bottom horizontal surface of the bored pile, and the cursor is located at the uppermost horizontal surface of the sediment layer in the bored pile; the main control board is connected to the host computer for communication, and is used to obtain the induction signal of the magnetic induction module when the sediment detector is lowered into place to determine the position of the cursor on the detector body, and then determine the scale of the corresponding depth gauge according to the position of the cursor on the detector body, so as to determine the thickness of the sediment in the bored pile according to the scale of the corresponding depth gauge; The magnetic sensing module includes a Hall sensor array composed of multiple three-axis linear Hall sensors arranged equidistantly along the depth gauge, and each three-axis linear Hall sensor is electrically connected to the main control board; A vibration intensity sensor is also provided in the bottom cone head; the main control board is electrically connected to the vibration intensity sensor, and is used to obtain the vibration intensity data of the bottom cone head in real time through the vibration intensity sensor during the lowering process of the sediment detector and feed it back to the host computer; the host computer also determines whether the sediment detector is lowered into place based on the tensioning force of the tensioning wheel cable and the vibration intensity data.

2. The sediment thickness detection system for cast-in-place piles according to claim 1, characterized in that: The top end of the bottom cone head contacts the bottom end of the depth gauge; when the sediment detector is in the initial state, the cursor is located outside the detector body and the permanent magnet in the cursor corresponds horizontally to the bottom end of the depth gauge.

3. The sediment thickness detection system for cast-in-place piles according to claim 2, characterized in that: The cursors include a scum cursor and a slurry cursor; wherein the scum cursor and the slurry cursor are both slidably mounted on the outside of the detector body, and the scum cursor is located below the slurry cursor; permanent magnets are provided inside the scum cursor and the slurry cursor; when the sediment detector is in an initial state, the permanent magnet of the scum cursor is horizontally aligned with the bottom end of the depth gauge; When the sediment detector is lowered into place, the scum cursor is located at the uppermost horizontal surface of the scum layer in the cast-in-place pile, and the slurry cursor is located at the uppermost horizontal surface of the slurry layer in the cast-in-place pile.

4. The sediment thickness detection system for bored piles according to claim 3, characterized in that: The gravity of the slurry cursor is less than or equal to the buoyancy of the slurry layer in the cast-in-place pile; the gravity of the scum cursor is less than or equal to the buoyancy of the scum layer in the cast-in-place pile, and the gravity of the scum cursor is greater than the buoyancy of the scum cursor in the cast-in-place pile.

5. The sediment thickness detection system for bored piles according to claim 1, characterized in that: The detector body includes a shell, a fixing plate is provided in the shell; the main control board and the depth gauge are fixed on the fixing plate; a motor fixing block is also provided in the bottom cone head, and the vibration motor is installed on the motor fixing block; A display screen is provided on the housing, and the display screen is arranged corresponding to the depth gauge and is used to display the scale of the depth gauge.

6. The sediment thickness detection system for cast-in-place piles according to claim 1, characterized in that: When the sediment detector is lowered into the bored pile, the cursor slides on the detector body, causing the corresponding three-axis linear Hall sensor to generate a sensing signal and feed the sensing signal back to the main control board; the main control board is used to send the sensing signal to the host computer, so that the host computer can determine the corresponding three-axis linear Hall sensor based on the sensing signal, and determine the scale of the depth gauge corresponding to the cursor based on the assembly relationship between the corresponding three-axis linear Hall sensor and the depth gauge, thereby determining the thickness of the sediment in the bored pile; An inclination sensor is also provided in the bottom cone head; the main control board is also electrically connected to the inclination sensor, and is used to obtain the inclination data of the sediment detector in real time through the inclination sensor and send it to the host computer, so that the host computer can determine whether the sediment detector is tilted according to the inclination data.

7. The sediment thickness detection system for cast-in-place piles according to claim 1, characterized in that: The main control board includes a main control MCU, a power conversion module, a motor drive circuit, a 485 communication module and a voltage acquisition module; The input end of the power conversion module is electrically connected to the aviation plug and is used to convert the external power supply into the internal power supply; wherein, the power conversion module includes a first power module, a second power module and a third power module; the input end of the first power module is electrically connected to the aviation plug, and the output end outputs the first internal power supply; the input end of the second power module inputs the first internal power supply, and the output end outputs the second internal power supply; the input end of the third power module inputs the second internal power supply, and the output end outputs the third internal power supply; The main control MCU is electrically connected to the vibration motor through the motor drive circuit; the vibration motor is a brushless motor; the main control MCU is communicatively connected to the 485 communication module and the host computer; the main control MCU is electrically connected to the aviation plug through the voltage acquisition module; The power conversion module includes a first power module, a second power module and a third power module, and the first power module includes a fuse F1, an ESD bidirectional diode E1, a TVS diode D6, a capacitor C40, a capacitor C26, a capacitor C27, a capacitor C42, a chip U34, an inductor L1, a Schottky diode D1, a resistor R181, a resistor R182 and a resistor R183; wherein, one end of the fuse F1 is electrically connected to the input end VIN, and the other end is electrically connected to the seventh end of the chip U34; an external power supply is also connected between the seventh end of the chip U34 and the fuse F1; the sixth end of the chip U34 is connected between the fuse F1 and the seventh end of the chip U34 through the capacitor C26; one end of the ESD bidirectional diode E1, the TVS diode D2 and the capacitor C40 is grounded, and the other end is connected between the other end of the fuse F1 and the seventh end of the chip U34; the chip The eighth terminal and the first terminal of chip U34 are grounded; the second terminal of chip U34 is grounded through resistor R183; the third terminal of chip U34 outputs the first internal power supply; the fourth terminal of chip U34 is also grounded through Schottky diode D1; the fourth terminal of chip U34 is also connected to the output terminal OUT_C ​​through inductor L1; one end of resistor R181 outputs the first internal power supply, and the other end is electrically connected to inductor L1; one end of capacitor C27 is grounded, and the other end is connected between inductor L1 and resistor R181; one end of resistor R182 is electrically connected to inductor L1 through resistor R181, and the other end is connected between the second terminal of chip U34 and capacitor C42; one end of resistor R183 is grounded, and the other end is connected between the second terminal of chip U34 and capacitor C42; the fifth terminal of chip U5 is also connected between inductor L1 and resistor R181; the model of chip U34 is XL7056E1; A second power supply module is used to convert the first internal power supply into a second internal power supply; the second power supply module includes capacitor C9, capacitor C10, capacitor C11, capacitor C12 and chip U36; wherein, one end of capacitor C9 is electrically connected to the third end of chip U36, and the other end is grounded; one end of capacitor C12 is electrically connected to the third end of chip U36, and the other end is grounded; one end of capacitor C9 is electrically connected to the second end and the fourth end of chip U36, and the other end is grounded; one end of capacitor C11 is electrically connected to the second end and the fourth end of chip U36, and the other end is grounded; the first end of chip U36 is connected to the first internal power supply, the second end and the fourth end output the second internal power supply, and the third end is grounded; A third power supply module is used to convert the second internal power supply into a third internal power supply; the third power supply module includes a resistor R21; one end of the resistor R21 is connected to the second internal power supply, and the other end outputs the third internal power supply; The voltage acquisition module includes a resistor R191, a resistor R192, a resistor R190, a resistor R195, a TVS surge protection diode D5 and a capacitor C77; one end of the resistor R192 is connected to the aviation plug 3, and the other end is electrically connected to the first end of the TVS surge protection diode D5 through the resistor R191; one end of the resistor R195 is electrically connected to the first end of the TVS surge protection diode D5, and the other end is electrically connected to the main control MCU; one end of the capacitor C77 is grounded, and the other end is connected between the resistor R195 and the main control MCU; one end of the resistor R190 is grounded, and the other end is connected between the resistor R191 and the resistor R195.

8. A method for detecting sediment thickness of a bored pile, applied to a sediment thickness detection system for a bored pile according to any one of claims 1 to 7, characterized in that: The sediment thickness detection method comprises: Controlling the lowering step: lowering the sediment detector into the cast-in-place pile, and sending a control signal to the main control board of the sediment detector during the lowering process of the sediment detector to control the vibration motor of the sediment detector to drive the bottom cone head of the sediment detector to vibrate; Calculation step: When the sediment detector is lowered into place, the position of the cursor on the detector body of the sediment detector is obtained by acquiring the induction signal of the magnetic induction module and the position of the cursor on the detector body of the sediment detector is obtained according to the induction signal, and then the corresponding scale of the depth gauge is obtained according to the position of the cursor on the detector body of the sediment detector, and the thickness of the sediment in the cast-in-place pile is obtained according to the corresponding scale; The lowering into place: by obtaining the vibration intensity data of the bottom cone head of the sediment detector and judging whether the sediment detector is lowered into place according to the vibration intensity data; a vibration intensity sensor is provided in the bottom cone head, and the vibration intensity sensor is electrically connected to the main control board for obtaining the vibration intensity data of the bottom cone head in real time; Tilt judgment step: determining whether the sediment detector is tilted by obtaining the tilt data of the sediment detector; a tilt sensor is provided in the sediment detector, and the tilt sensor is electrically connected to the main control board for obtaining the tilt data of the sediment detector.

9. The sediment thickness detection method for cast-in-place piles according to claim 8, characterized in that: Also includes: Qualification judgment step: judging whether the cast-in-place pile is qualified according to the thickness of the sediment in the cast-in-place pile obtained; if not, notifying relevant staff to clean the sediment in the cast-in-place pile.

10. A computer-readable storage medium storing a sediment thickness detection program for cast-in-place piles, characterized in that: The sediment thickness detection program for cast-in-place piles is a computer program. When the sediment thickness detection program for cast-in-place piles is executed by a processor, the steps of the sediment thickness detection method for cast-in-place piles as described in any one of claims 8 to 9 are implemented.

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