Incomplete POP Package Chip Bridging Path On / Off Mass Production Test Method and System

Abstract

The present invention relates to the technical field of chip testing, and discloses a mass production test method and system for the continuity of the bridging path of an incompletely pop-packaged chip. The chip to be tested is placed on a detection board, and each bottom solder ball of the chip is electrically connected to a test socket on the detection board. A transfer board is placed on the detection board, and the transfer board is connected to each top solder ball of the chip from above, so that the top solder balls of the chip are short-circuited in groups of two. After the short circuit, power-on tests are respectively carried out in groups to judge the continuity state of the pins of the chip. This method uses a transfer board to short-circuit the top solder balls, quickly conducts continuity tests, simplifies the test process, is easy to operate, is applicable to incompletely pop-packaged chips in mass production, and improves the detection efficiency and convenience while maintaining the effectiveness and accuracy of the test.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and particularly to a mass production testing method and system for the continuity of bridging paths of incompletely pop-packaged chips. Background Art

[0002] After the existing chips are processed, the continuity detection of pins is required to ensure the yield of the chips. The existing non-contact detection methods commonly used for incompletely pop-packaged chips include infrared thermal imaging detection, laser scanning, X-ray detection, etc. The existing detection methods are relatively cumbersome, resulting in low efficiency and high cost when applied to the detection of mass-produced chips. Summary of the Invention

[0003] Aiming at the deficiencies of the existing technology, the purpose of the present invention is to provide a mass production testing method and system for the continuity of bridging paths of incompletely pop-packaged chips.

[0004] To achieve the above purpose, the present invention provides the following technical solutions:

[0005] A mass production testing method for the continuity of bridging paths of incompletely pop-packaged chips, wherein the chip to be tested is placed on a detection board, and each bottom solder ball of the chip is electrically connected to a test socket on the detection board. A transfer board is placed on the detection board, and the transfer board connects each top solder ball of the chip from above, so that the top solder balls of the chip are short-circuited in groups of two. After short-circuiting, power-on tests are respectively carried out in groups to judge the continuity state of the pins of the chip.

[0006] In the present invention, preferably, a plurality of connection pins are provided on the transfer board, and two connection pins are connected in series as a group to form a bridging circuit, and the two top solder balls of the chip to be tested connected to the two connection pins are short-circuited.

[0007] In the present invention, preferably, when performing the power-on test, one test socket on the detection board sends an excitation signal, and the other test socket receives a test signal.

[0008] In the present invention, preferably, when performing the power-on test, the excitation signal flows into the first bottom solder ball of the board to be detected through the first test socket of the detection board, reaches the first top solder ball through the internal circuit of the chip to be tested, enters the bridging circuit connected to the first top solder ball and then flows back into the second top solder ball of the board to be detected, returns to the second bottom solder ball through the internal circuit connected to the second top solder ball, and finally returns the test signal through the second test socket on the detection board connected to the second bottom solder ball.

[0009] In the present invention, preferably, the detection board is connected to a controller, the controller is electrically connected to the test socket, the controller sends an excitation signal to the test socket, and receives the test signal returned by the test socket, and determines the on-off state of the solder balls of the corresponding chip to be tested through the test signal.

[0010] In the present invention, preferably, the bridging circuits between the connection pins on the adapter board are different for different connection methods of the chips to be tested.

[0011] An incomplete pop package chip bridging path on-off mass production test system includes a detection board, an adapter board, and a controller. The controller is electrically connected to the detection board. The adapter board is placed above the detection board through copper posts, and the chip to be tested is detachably arranged on the detection board.

[0012] In the present invention, preferably, the adapter board includes connection pins and a bridging circuit between the connection pins. The bridging circuit shorts the two connection pins, and there are multiple bridging circuits.

[0013] In the present invention, preferably, the adapter board is connected to an adapter controller, a switch circuit is connected between the connection pins, the switch circuit is electrically connected to the adapter controller, and different bridging circuits between the connection pins are realized by controlling the turn-off of the switch circuit through the adapter controller.

[0014] In the present invention, preferably, the connection pins can be pin pins or solder balls.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] The method of the present invention uses the adapter board to short-circuit the top solder balls, quickly performs on-off tests, simplifies the test process, is easy to operate, is applicable to mass-produced incomplete pop package chips, and improves the detection efficiency and convenience while maintaining the effectiveness and accuracy of the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic structural diagram of the incomplete pop package chip bridging path on-off mass production test method described in the present invention.

[0018] Figure 2 It is a schematic diagram of a bridging circuit on the adapter board.

[0019] Figure 3 It is a schematic diagram of another bridging circuit on the adapter board. DETAILED DESCRIPTION OF THE INVENTION

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0022] Please also refer to Figures 1 to 3 , a preferred embodiment of the present invention provides a mass production test method for the on-off of the bridging path of an incompletely pop-packaged chip, mainly for incompletely pop (Package on Package) packaged chips. The chips to be tested are placed on a detection board, and each bottom solder ball of the chips is electrically connected to a test socket on the detection board. A transfer board is placed on the detection board, and the transfer board connects each top solder ball of the chips from above, so that the top solder balls of the chips are short-circuited in groups of two. After short-circuiting, power-on tests are performed separately for each group to judge the on-off state of the pins of the chips. The test method can quickly complete the on-off conditions of each pin of the incompletely pop-packaged chip, is suitable for chip testing during mass production, and the same type of chips can be tested using the same test board. The overall operation is simple and fast.

[0023] Specifically, a plurality of connection pins are provided on the transfer board, and two connection pins are connected in series as a group to form a bridging circuit to short-circuit two top solder balls of the chip to be tested connected to the two connection pins. The bridging circuits between the connection pins have different connection methods for different chips to be tested. It can be to short-circuit two horizontally adjacent connection pins, or to short-circuit two connection pins separated by several solder balls, or to connect according to the specific connection method of the chip to be tested. The bridging circuits of the connection board are easy to arrange and have strong applicability.

[0024] Specifically, when performing the power-on test, one test socket on the detection board sends an excitation signal, and the other test socket receives the test signal.

[0025] Specifically, during the power-on test, the excitation signal flows into the first bottom solder balls of the board to be tested through the first test socket of the detection board, reaches the first top solder balls through the internal circuit of the chip to be tested, then sequentially passes through the first top solder balls and the first connection pins, enters the bridging circuit, and then flows back into the second top solder balls of the board to be tested through the second connection pins, returns to the second bottom solder balls through the internal circuit connected to the second top solder balls, and finally returns the test signal through the second test socket on the detection board connected to the second bottom solder balls.

[0026] Specifically, the detection board is connected to a controller, and the controller is electrically connected to the test socket. After the board to be tested, the adapter board, and the detection board are connected, the controller sends an excitation signal to the test socket and receives the test signal returned by the test socket, and judges the on-off state of the solder balls of the corresponding chip to be tested through the test signal. Both the excitation signal and the test signal are current signals. Read the voltage value of the returned test signal. When the voltage value is within the set range, the corresponding chip pin is normal. When the voltage value is greater than the set range, it is judged that the corresponding pin is in an open circuit state.

[0027] A preferred embodiment of the present invention provides a mass production test system for the on-off of the bridging path of an incompletely pop-packaged chip. The system includes a detection board, an adapter board, and a controller. The controller is electrically connected to the detection board. The adapter board is placed above the detection board through copper pillars, and the chip to be tested is detachably arranged on the detection board.

[0028] Specifically, the adapter board includes connection pins and a bridging circuit between the connection pins. The bridging circuit shorts the two connection pins, and there are multiple types of bridging circuits that can be set according to different chips to be tested.

[0029] In another preferred embodiment of the present invention, the connection pins of the adapter board use pin needles. The upper end of the pin needle is electrically connected to the solder balls on the adapter board, and the lower end passes through the cover plate of the adapter board and is electrically connected to the top solder balls of the chip to be tested. Using pin needles facilitates the connection between the adapter board and the solder balls of the chip to be tested. A cover plate is provided on one side of the adapter board connected to the chip to be tested, and a support block is also provided on the outside of the cover plate. The position of the support block is set differently according to different chips to be tested. Since the chip to be tested is mainly an incompletely pop-packaged chip, which is a stacked chip, its overall is not a flat surface. When the cover plate is attached to the chip to be tested, only part of it can be attached, and the rest of the non-attached parts are in contact with the chip to be tested through the support block, ensuring the balance of the adapter board and no tilting, so as to ensure that the connection pins on the adapter board are all stably connected to the solder balls of the chip to be tested.

[0030] In another preferred embodiment of the present invention, the adapter board is connected with an adapter controller, a switch circuit is connected between the connection pins, the switch circuit is electrically connected with the adapter controller, and different bridging circuits between the connection pins are realized by controlling the turn-off of the switch circuit through the adapter controller. The switch circuit can adopt a switching tube between connections, such as a triode or a MOS tube.

[0031] Working principle:

[0032] Place the chip to be tested on the test board, make the bottom solder balls of the chip to be tested electrically connected with the test sockets on the test board, then place the adapter board on the test board. After aligning the connection pins with the top solder balls of the chip to be tested, press down the cover plate to contact the chip to be tested. At the same time, the connection pins are electrically connected with the top solder balls. After the connection is correct, the controller sequentially sends excitation signals to the set test sockets according to the set order, or synchronously issues excitation signals according to the setting, and receives the test signals returned by the remaining test sockets within the set time interval, and judges the on-off situation of the pins of the corresponding chip to be tested based on the received test signals. The whole process is simple, fast and efficient.

[0033] In some other preferred embodiments of the present invention, a computer-readable storage medium is provided, which stores a computer program. When the computer program is executed by a processor, the processor is made to execute the steps of the method as described in the above embodiments.

[0034] If the above functions are implemented in the form of software function units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the present invention, in essence, or the part that makes contributions to the prior art, or a part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in various embodiments of the present invention. The foregoing storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memories (ROM, Read-Only Memory), random access memories (RAM, Random Access Memory), magnetic disks or optical discs that can store program codes.

[0035] The above description is a detailed description of the preferred and feasible embodiments of the present invention, but the embodiments are not intended to limit the scope of the patent application of the present invention. Any equivalent changes or modifications made under the technical spirit disclosed by the present invention shall fall within the scope of the patent covered by the present invention.

Claims

1. A mass production test method for the on-off connection of the bridge path of an incomplete pop packaged chip, characterized in that: The chip to be tested is placed on the test board, and each bottom solder ball of the chip is electrically connected to the test socket on the test board. The adapter board is placed on the test board through the copper pillar, and the adapter board is connected to each top solder ball of the chip from above, so that the top solder balls of the chip are short-circuited in groups of two. After short-circuiting, power-on tests are performed in groups to determine the on-off status of the chip pins. The adapter board is provided with a plurality of connecting pins, two connecting pins are connected in series as a group to form a bridge circuit, and two top solder balls of the chip to be tested connected to the two connecting pins are short-circuited. The bridge circuit between the connecting pins on the adapter board has different connection modes for different chips to be tested; When conducting a power-on test, one of the two test sockets on the detection board sends an excitation signal, and the other test socket receives a test signal; During the power-on test, the excitation signal flows into the first bottom solder ball of the board to be tested through the first test socket of the test board, reaches the first top solder ball through the internal circuit of the chip to be tested, enters the bridge circuit connected to it through the first top solder ball, and then flows back to the second top solder ball of the board to be tested, returns to the second bottom solder ball through the internal circuit connected to the second top solder ball, and finally returns the test signal through the second test socket on the test board connected to the second bottom solder ball.

2. The method for mass production testing of the bridge path of an incomplete pop packaged chip according to claim 1 is characterized in that: The detection board is connected to a controller, which is electrically connected to a test socket. The controller sends an excitation signal to the test socket and receives a test signal returned by the test socket, and determines the on / off state of the solder ball of the corresponding chip to be tested through the test signal.

3. A system for implementing the mass production test method for the bridge path of the incomplete pop packaged chip as described in any one of claims 1-2, characterized in that: It comprises a detection board, an adapter board and a controller. The controller is electrically connected to the detection board. The adapter board is placed above the detection board through a copper column. The chip to be tested is detachably arranged on the detection board.

4. The system of the on-off mass production test method of the incomplete pop packaged chip bridge path according to claim 3 is characterized in that: The adapter board includes a connecting pin and a bridge circuit between the connecting pins, and the bridge circuit short-circuits two connecting pins. There are multiple types of bridge circuits.

5. The system of the on-off mass production test method of the incomplete pop packaged chip bridge path according to claim 4 is characterized in that: The connecting pins are pins.

6. The system of the on-off mass production test method of the incomplete pop packaged chip bridge path according to claim 4 is characterized in that: The adapter board is connected to an adapter controller, the connection pins are mutually connected with a switch circuit, the switch circuit is electrically connected to the adapter controller, and the switch circuit is controlled to be turned off by the adapter controller to realize different bridge circuits between the connection pins.

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