An apparatus for bare die surface cleaning and method of use thereof

Abstract

The present application relates to a kind of for bare chip surface cleaning device and its use method, it is characterized in that: the preparation of pedestal A: a group of shallow grooves is machined on the surface of an aluminum alloy plate, the size of each shallow groove is matched with the size of bare chip box of chip placement, while a circle of steps is opened in the periphery of aluminum alloy plate;The preparation of cap B: customize an aluminum frame, the size of the aluminum frame is matched with the size of the periphery step of pedestal A;Then a layer of silk screen is bonded on the surface of aluminum frame;(1) the bare chip box with bare chip is placed into the shallow groove of pedestal A, pedestal A is placed into plasma cleaning machine, then cap B is covered on pedestal A, and then it is plasma cleaned;(2) take an empty box with the same model as bare chip box, it is placed in mouth-to-mouth alignment, then it is turned over, and according to the method of step (1) is plasma cleaned.The present application has the advantages of: effectively avoiding the damage of chip collision during cleaning;It improves the cleaning efficiency.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of integrated circuit manufacturing, and relates to a device for cleaning the surface of a bare chip and a method for using the same. BACKGROUND

[0002] When assembling the bare chips in an integrated circuit, some of the bare chips may have a shear force drop or even fall off, which seriously affects the quality of the integrated circuit. Through analysis, it is found that this is caused by the oxidation or contamination of the surface of the bare chip. Therefore, the bare chip is cleaned by plasma to improve the assembly quality. The commonly used cleaning method is plasma cleaning, but the plasma cleaning method still has the following problems:

[0003] (1) During plasma cleaning, the bare chip is blown everywhere, which cannot effectively clean the surface and is prone to chip damage; even if a blue film or the like is used to stick the bare chip, the chip is still damaged when the bare chip is taken out and placed due to the thinness of the bare chip;

[0004] (2) When cleaning the front and back surfaces of the chip, there are great difficulties in placing the chip, one is to use manual taking and placing, which is low in efficiency; and two is that the chip is prone to damage during manual placing. SUMMARY

[0005] The purpose of the present application is to solve the problems existing in the prior art, and to provide a device for cleaning the surface of a bare chip and a method for using the same, which improves the assembly quality of the bare chip by cleaning the surface of the bare chip.

[0006] In order to achieve the above purpose, the technical scheme adopted by the present application is as follows:

[0007] A device for cleaning the surface of a bare chip, characterized by two parts:

[0008] (1) Preparation of base A: first, a group of shallow grooves are processed on the surface of an aluminum alloy plate, so that the length and width dimensions of each shallow groove match the dimensions of the bare chip box for placing the chip, and the depth of each shallow groove is preferably 1-2 mm above the surface of the shallow groove after the bare chip box is placed in the shallow groove; second, a step is opened around the aluminum alloy plate to place cap B;

[0009] (2) Preparation of cap B: first, an aluminum frame is customized, the dimensions of which match the dimensions of the step around base A, that is, the outer circle length and width dimensions of the aluminum frame are the same as the outer circle length and width dimensions of the aluminum alloy plate of base A, and the inner circle length and width dimensions of the aluminum frame are the same as the outer circle length and width dimensions of the step of base A, and when the aluminum frame is placed on base A, its height is slightly higher than the surface of base A by 1-2 mm (i.e. consistent with the height of the bare chip box placed on base A); second, a layer of silk screen is bonded on the surface of the aluminum frame, and the preparation of cap B is completed.

[0010] Further, the number of shallow grooves on the base A is 1-8.

[0011] Further, the length of the bare chip box is 30-60 mm, the width is 30-60 mm, and the height is 3-6 mm.

[0012] Further, the mesh number of the silk screen is 80-300.

[0013] A method for using a device for cleaning the surface of a bare chip, comprising a bare chip plasma cleaning step, characterized by comprising the following steps:

[0014] (1) Front cleaning: place the bare chip box containing the bare chip into the shallow groove of the base A, then place the base A into the plasma cleaning machine, and then cover the cap B on the base A, at this time the bare chip can be seen under the silk screen of the cap B, then perform plasma cleaning;

[0015] (2) Back cleaning: take an empty box of the same model as the bare chip box, place it mouth to mouth, then turn it over, at this time the back of the bare chip falls into the empty box, then follow the operation method of front cleaning to complete the back plasma cleaning of the bare chip.

[0016] Compared with the prior art, the device has the following advantages:

[0017] (1) First, the position is fixed, when using the device for plasma cleaning, the bare chip is completely fixed in the box, and the upper part is pressed by the silk screen of the cap B, so that the surface of the bare chip can be effectively cleaned, and the chip will not be damaged, and the mutual collision and damage of the chip during cleaning are effectively avoided;

[0018] (2) Second, it is easy to use, and the existing chip box can be directly placed in the device;

[0019] (3) Third, the cleaning efficiency is high, the chip box is directly turned over to realize double-sided cleaning;

[0020] (4) Fourth, it is widely used, and can be used for various eutectic soldering pieces (silver tin, lead tin, copper tin, indium tin, etc.), metal transition pieces (copper aluminum, copper gold, copper alloy, etc.). BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a base A structure diagram of a device for cleaning the surface of a bare chip;

[0022] Figure 2 It is a cap B structure diagram of a device for cleaning the surface of a bare chip;

[0023] Figure 3 It is a base A and bare chip box placement diagram;

[0024] Figure 4 Figure 1 is a schematic view of the base A and the cap B for placing the chip box;

[0025] Figure 5 Figure 2 is a schematic view of the plasma cleaning using the device for cleaning the surface of the bare chip.

[0026] According to the present application Figures 1-5 The present application is further described as follows:

[0027] A device for cleaning the surface of the bare chip is composed of two tools:

[0028] The first tool is the base A: firstly, four shallow grooves (50mm x 50mm x 3mm) are opened on an aluminum alloy plate (120mm x 120mm x 6mm) for the chip box (50mm x 50mm x 5mm) of the bare chip; secondly, a step is opened around the aluminum alloy plate, and the height of the step is 4mm and the width is 11mm. (See Figure 1) Figure 1

[0029] The second tool is the cap B: firstly, an aluminum frame (120mm x 120mm x 5mm) is customized; secondly, a layer of 200-mesh silk screen is adhered to the surface of the aluminum frame, thus completing the cap (See Figure 2) Figure 2 . DETAILED DESCRIPTION

[0030] Example 1

[0031] The use method of the device for cleaning the surface of the bare chip is as follows:

[0032] (1) Front surface cleaning: the chip box containing the bare chip is placed in the shallow groove of the base A, then the base A is placed in the plasma cleaning machine, and the cap B is placed on the base A, at this time the bare chip is under the silk screen of the cap B, then it is placed in the plasma cleaning machine for plasma cleaning;

[0033] (2) Back surface cleaning: an empty box of the same model as the chip box is taken and placed in the same position, then it is turned over, at this time the back surface of the bare chip falls into the empty box, then the operation method of the front surface cleaning is followed to complete the plasma cleaning of the back surface of the bare chip. After the plasma cleaning of the bare chip, the chip does not scatter, the surface is clean, and the whole box can be taken out for use. Example 2

[0034] Example 2 is the same as Example 1, except that the chip box contains various eutectic solder pieces, and the size of the solder piece matches the size of the original chip in the chip box, that is, the eutectic solder piece can be smoothly loaded into the chip box. Example 3​

[0035] Example 3 is the same as Example 1, except that the chip box is loaded with a metal transition sheet, the size of which matches the size of the original chip in the chip box, i.e. the metal transition sheet can be smoothly loaded into the chip box.

Claims

1. An apparatus for cleaning the surface of a bare die, characterized by It consists of two parts: (1) Preparation of base A: a set of shallow grooves are processed on the surface of an aluminum alloy plate, so that the length and width of each shallow groove match the size of the bare chip box where the chip is placed, and the depth of each shallow groove is 1-2 mm above the surface of the shallow groove after the bare chip box is placed in the shallow groove; At the same time, a circle of steps is opened around the aluminum alloy plate to place the cap B; (2) Preparation of cap B: customize an aluminum frame, the size of which matches the size of the steps around base A, that is, the outer circle of the aluminum frame has the same length and width as the outer circle of the aluminum alloy plate of base A, and the inner circle of the aluminum frame has the same length and width as the outer circle of the steps of base A, and when the aluminum frame is placed on base A, its height is slightly higher than the surface of base A by 1-2 mm; Then bond a layer of silk screen on the surface of the aluminum frame, that is, the cap B is prepared; It includes the following steps for use: (1) Front cleaning: place the bare chip box containing the bare chip into the shallow groove of base A, then place base A into the plasma cleaning machine, and then cover cap B on base A, at this time you can see that the bare chip is below the silk screen of cap B, then perform plasma cleaning; (2) Back cleaning: take an empty box of the same model as the bare chip box, place it mouth to mouth, then turn it over, at this time the back of the bare chip falls into the empty box, then follow the operation method of front cleaning to complete the back plasma cleaning of the bare chip.

2. The apparatus for cleaning a bare die surface according to claim 1, wherein: The number of shallow grooves on the base A is 1-8.

3. The apparatus for cleaning a die surface according to claim 1, wherein: The length of the bare chip box is 30-60 mm, the width is 30-60 mm, and the height is 3-6 mm.

4. The apparatus for cleaning a die surface according to claim 1, wherein: The silk screen has a mesh of 80-300 meshes.

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