A semiconductor chip testing device

Abstract

The present invention relates to a semiconductor chip testing device, comprising a testing body, conveying devices are arranged on both sides of the testing body, two rotating disks are arranged above the testing body, the rotating disks are rotatably mounted on a supporting frame and the supporting frame can drive the rotating disks to rotate, a plurality of pneumatic telescopic components are arranged in a circular array on the circumferential side of the rotating disk, the pneumatic telescopic components can adjust the extension length based on different test positions of the testing body, and a chip adsorption device is connected to one end of the pneumatic telescopic component away from the rotating disk; the present invention has the advantage of accelerating the test speed.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip testing devices, and in particular relates to a semiconductor chip testing device. Background Art

[0002] In electronics, semiconductor chips are a way of miniaturizing circuits (mainly semiconductor devices, but also passive components, etc.) and are usually manufactured on the surface of semiconductor wafers. Chip testing is generally divided into CP testing and FT testing; CP testing is a test of the chip during the design phase and is a test of semi-finished chips; FT testing is a test of the packaged wafer after the integrated circuit chip is packaged from the wafer into a finished product to ensure the performance and quality of the finished product. It is a test of the finished chip.

[0003] When a semiconductor chip testing device tests a chip, the chip is usually adsorbed by a robotic arm and a suction nozzle and then moved to a chip testing fixture. The chip is then tested through the test fixture and the chip testing circuit. After the test is completed, the chip is classified according to the test results. However, in the prior art, the robotic arm can only inspect the semiconductor chips one by one, place the chip on a tray, and then pick up another chip for testing. Continuous testing cannot be achieved, which reduces the test speed. Summary of the invention

[0004] The object of the present invention is to overcome the deficiencies of the prior art and provide a semiconductor chip testing device with accelerated testing speed.

[0005] The technical solution of the present invention is as follows:

[0006] A semiconductor chip testing device comprises a testing body, a conveying device is arranged on both sides of the testing body, two rotating disks are arranged above the testing body, the rotating disks are rotatably mounted on a supporting frame and the supporting frame can drive the rotating disks to rotate, a plurality of pneumatic telescopic components are arranged in a circular array on the circumferential side of the rotating disk, the pneumatic telescopic components can adjust the extension length based on different test positions of the testing body, and a chip adsorption device is connected to one end of the pneumatic telescopic component away from the rotating disk;

[0007] The support frame is connected to an air inlet pipe and an air intake pipe, and a connecting component is connected to the upper side of the rotating disk in a rotating seal. The connecting component is fixed to the support frame and connected to the air inlet pipe and the air intake pipe. Three double-layer drive boxes are arranged inside the connecting component, and the three double-layer drive boxes are all connected to the connecting component. The upper and lower layers of the double-layer drive boxes are both provided with control valves. When the rotating disk rotates, three of the several pneumatic telescopic components are respectively connected to the three double-layer drive boxes. At this time, the control valve controls the gas to enter the pneumatic telescopic component or be discharged from the pneumatic telescopic component to control the extension and retraction of the pneumatic telescopic component. The pneumatic telescopic component is connected to a chip adsorption device.

[0008] Furthermore, the chip adsorption device comprises a connecting cylinder fixed on the pneumatic telescopic assembly, a lifting column plugged into the connecting cylinder, an upper cylinder and a lower cylinder, wherein the lifting column is polygonal and has a lifting piston fixed at the upper end thereof and sealed and plugged into the connecting cylinder;

[0009] A driving hole is provided on the inner side of the connecting tube, and the driving hole is connected to the pneumatic telescopic assembly;

[0010] A plug hole is vertically provided inside the lifting column, a vertical hole is provided above the plug hole, the upper tube and the lower tube are both sealed and plugged in the plug hole up and down, and a gap is provided between the upper tube and the lower tube, a negative pressure locking assembly connected with the lower tube is provided in the upper tube, and the negative pressure locking assembly controls the upper tube and the lower tube to move synchronously when the pressure between the upper tube and the lower tube is lower than the rated pressure, a negative pressure piston is provided in the vertical hole and sealed and fixed with the upper tube, and a downward pressure spring fixed to the upper end of the vertical hole is provided on the upper side surface of the negative pressure piston, and connecting holes connected with the upper end of the vertical hole are provided on both sides of the lifting column, and when the lifting column moves down to the lowest position, the connecting holes are connected with the driving hole;

[0011] A suction nozzle is installed on the lower side of the lower tube, the friction between the lifting column and the connecting tube is greater than the friction between the lower tube and the plug hole, and the friction between the lower tube and the plug hole is greater than the friction between the upper tube and the plug hole;

[0012] A fourth one-way valve connected to the plug hole is fixed on one side of the lower end of the lifting column, the fourth one-way valve is connected to a pneumatic telescopic rod, the pneumatic telescopic rod is connected to the valve core of the fourth one-way valve, the pneumatic telescopic rod is connected to the pneumatic telescopic assembly to drive the pneumatic telescopic rod to drive the valve core of the fourth one-way valve to open, when the semiconductor chip on the suction nozzle contacts the test body or the conveying device, the fourth one-way valve connection point is located between the upper tube and the lower tube;

[0013] It also includes a lifting and limiting component, which is connected to the pneumatic telescopic component. When the lifting column moves up to the top of the plug-in hole, the lifting and limiting component limits the upper tube from moving downward, and when the lifting and limiting component enters high-pressure gas, the lifting and limiting component no longer limits the upper tube.

[0014] Furthermore, a guide cylinder connected to the negative pressure piston is vertically fixed inside the upper cylinder, and the negative pressure locking assembly includes a locking tooth plate, an air intake cylinder fixed to the lower cylinder, a guide shell fixedly connected to the other end of the air intake cylinder, two unlocking plates slidingly sealedly connected inside the guide shell, and a negative pressure telescopic rod fixed to the two unlocking plates, and at least two lifting grooves are axially opened on the inner wall of the guide cylinder, and the locking tooth plate is elastically plugged into the lifting groove;

[0015] The guide shell can be engaged with the locking tooth plate, and the unlocking plate is displaced left and right along the guide shell. The two unlocking plates are provided with protruding rods on the opposite sides. The protruding rods can pass through the guide shell and abut against the locking tooth plate. The locking tooth plate is provided with a sliding groove for the protruding rod to move up and down.

[0016] A plurality of through holes are provided on the circumferential side of the air intake cylinder, the guide shell is slidably connected in the guide cylinder, and the side surface of the guide shell is not in sealing contact with the guide cylinder.

[0017] Furthermore, at least two grooves are provided on the inner wall of the plug-in hole, and the lifting and limiting assembly includes a displacement block sealed and inserted in the groove, a limiting barrel that can be inserted in the groove, and a high-pressure channel provided on the lifting column, and the limiting barrel is sealed and inserted in the upper cylinder, and the high-pressure channel is connected to the pneumatic telescopic assembly, and the upper cylinder is provided with a limiting spring connected to the limiting barrel.

[0018] Furthermore, a pressure-compensating assembly is also provided on the lifting column, and the pressure-compensating assembly includes a negative pressure chamber opened on the lifting column, a fifth one-way valve and a pressure-compensating valve connected to the negative pressure chamber, the fifth one-way valve and the pressure-compensating valve are both provided on the lifting column, the fifth one-way valve is connected to the pneumatic telescopic assembly, when the upper tube is located at the uppermost part of the plug-in hole, the pressure-compensating valve is connected to the area between the upper tube and the lower tube, and when the upper tube is located at the lowermost part of the plug-in hole, the side of the upper tube closes the pressure-compensating valve.

[0019] Furthermore, the pressure-compensating valve includes a valve body fixed in a lifting column, a hollow ball is rotatably connected inside the valve body, a negative pressure hole C and a negative pressure hole A are provided in the valve body, the negative pressure hole A is connected to the negative pressure chamber, the negative pressure hole C is connected to the area between the upper cylinder and the lower cylinder, and there is also an arc groove in the valve body, a convex ball is provided at one end of the arc groove in the clockwise direction, a fan blade connected to the hollow sphere is provided in the arc groove, the fan blade is in sealing contact with the arc groove and can rotate around the center of the hollow sphere, the fan blade is connected in the arc groove through a spring, and a negative pressure hole B and a negative pressure hole D are provided in the hollow ball, the negative pressure hole B is connected to the area between the upper cylinder and the lower cylinder, and the negative pressure hole D is connected to the negative pressure hole A when the fan blade is in contact with the convex ball.

[0020] Furthermore, two sealing circular grooves coaxial with the rotating disk are provided on the upper side surface of the rotating disk, and the connecting component includes a negative pressure ring and a high pressure ring rotatably connected to the two sealing circular grooves, and a negative pressure annular cavity and a high pressure annular cavity are provided inside the negative pressure ring and the high pressure ring, and the negative pressure annular cavity and the high pressure annular cavity are respectively connected to the suction pipe and the intake pipe, and the three double-layer drive boxes are all arranged in the high-pressure ring, and the upper and lower layers of the three double-layer drive boxes are respectively connected to the annular cavities of the negative pressure ring and the high pressure ring, and two holes are provided on the end of the pneumatic telescopic component away from the chip adsorption device, and the two holes are respectively connected to the rotating disk and connected to the control valves of the upper and lower layers of the double-layer drive box.

[0021] Furthermore, an adjusting ring groove is provided on the inner wall of the rotating disk, and the pneumatic telescopic assembly comprises a connecting cylinder fixed in the adjusting ring groove, a displacement piston sealably plugged on the connecting cylinder, and a telescopic column fixed on the displacement piston, and one end of the connecting cylinder away from the chip adsorption device is sealably fixed on the side wall of the adjusting ring groove, and the adjusting ring groove is provided with two circular holes located in the connecting cylinder, and the circular holes can be rotatably connected with the control valve;

[0022] A positioning assembly is disposed outside the connecting tube, and the positioning assembly abuts against the telescopic column to limit the extension length of the telescopic column;

[0023] The telescopic column is provided with a high-pressure pipe and a negative-pressure pipe connected to the displacement piston, the high-pressure pipe and the negative-pressure pipe are both connected to an electrically controlled valve fixed on the telescopic column, the high-pressure pipe is connected to the pneumatic telescopic rod and the high-pressure channel, the negative-pressure pipe is connected to the driving hole and the fifth one-way valve, and the connecting tube is connected to the high-pressure pipe and the negative-pressure pipe respectively;

[0024] The friction force between the displacement piston and the connecting cylinder is greater than the friction force between the lifting column and the connecting cylinder.

[0025] Further, the positioning assembly includes a resistance block, an adjustment cylinder rotatably connected to the connecting cylinder, a guide plate fixed to the connecting cylinder, and two fixing plates fixed in the adjusting ring groove, the two fixing plates are arranged on both sides of the adjusting cylinder, the resistance block is plugged into the fixing plates and can be displaced along the radial direction of the telescopic column;

[0026] The side of the abutment block facing the adjusting cylinder is provided with a convex rod, the circumferential side of the adjusting cylinder is provided with a plurality of arc grooves in a circular array with the center of the adjusting cylinder as the center, the guide plate is fixed coaxially with the adjusting cylinder and the circular side is provided with a guide groove, the guide groove is provided along the radial direction of the guide plate, the convex rod is inserted into the guide groove and the arc groove, and a driving component for driving the adjusting cylinder to rotate is provided in the adjusting ring groove;

[0027] A limiting groove is provided on the outer circumferential surface of the telescopic column, and the diameter of the limiting groove gradually decreases from one side adjacent to the connecting tube to the other end of the telescopic column.

[0028] Furthermore, the driving assembly includes a gear ring rotatably connected in the adjusting ring groove, the gear ring is meshed with an adjusting motor fixed on the rotating disk, and the gear ring is meshed with the adjusting cylinder.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] 1. The present invention realizes the rotational displacement of the chip adsorption device through the rotating disk, and realizes the adsorption of the chip through the chip adsorption device, thereby realizing continuous loading and unloading of the chip, accelerating the test speed, and through the setting of the pneumatic telescopic rod, the chip adsorption device can realize position adjustment after rotation, which is convenient for adjustment according to the different positions of the test fixture, thereby ensuring the test;

[0031] 2. The present invention adopts the cooperation of the upper tube and the lower tube to assist in pressing the chip when it is pressed down, and enables the suction nozzle on the lower tube to adsorb the chip when the upper tube moves up, thereby ensuring the adsorption of the chip, and through the setting of the fourth one-way valve and the pneumatic telescopic rod, when the upper tube drives the lower tube to move downward through the negative pressure locking assembly, the pressure between the upper tube and the lower tube can be increased, so that after the chip fits the test fixture, the lower tube no longer adsorbs the chip and continues to press the chip to ensure the pressing of the chip.

[0032] In summary, the present invention has the advantage of accelerating the testing speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0034] Figure 2 For the present invention Figure 1 A schematic diagram of the structure of the rotating disk part;

[0035] Figure 3 For the present invention Figure 2 A schematic cross-sectional structure diagram of a rotating disk;

[0036] Figure 4 For the present invention Figure 3 A schematic diagram of the enlarged structure of part A;

[0037] Figure 5 For the present invention Figure 4 A schematic diagram of the structure of the positioning component;

[0038] Figure 6 For the present invention Figure 4 A schematic diagram of a guide plate;

[0039] Figure 7 For the present invention Figure 1 A schematic structural diagram of a chip adsorption device;

[0040] Figure 8For the present invention Figure 7 A schematic diagram of the structure of the connecting tube;

[0041] Fig. 9 For the present invention Figure 7 A schematic diagram of the enlarged structure of part B;

[0042] Fig.10 For the present invention Fig. 9 Schematic diagram of the enlarged structure of part C;

[0043] Fig.11 For the present invention Fig.10 Schematic diagram of the structure of the pressure compensation valve.

[0044] In the figure, 1, conveying device, 2, supporting frame, 3, chip adsorption device, 31, lifting column, 32, connecting cylinder, 321, driving hole, 33, lifting limit assembly, 331, limit barrel, 332, displacement block, 333, high pressure channel, 334, limit spring, 34, fourth one-way valve, 35, suction nozzle, 36, lower cylinder, 37, negative pressure locking assembly, 371, locking tooth plate, 372, air intake cylinder, 373 guide shell, 374, negative pressure telescopic rod, 375, unlocking plate, 377, lifting slot, 38, pressure compensation assembly, 381, fifth one-way valve, 382, ​​pressure compensation valve, 3821, displacement slot, 3822, negative pressure hole A, 3823, negative pressure hole B, 3824, negative pressure hole C, 383, negative pressure chamber, 39, upper cylinder, 391, guide cylinder, 30 , connecting hole, 301, negative pressure piston, 302, lifting piston, 303, downward pressure spring, 4, air intake pipe, 5, drive motor, 6, rotating disk, 61, connecting column, 62, negative pressure ring, 63, adjusting motor, 64, pneumatic telescopic assembly, 641, connecting cylinder, 642, adjusting cylinder, 6421, arc groove, 644, electric control valve, 645, high pressure pipe, 648, negative pressure pipe, 649, limit groove, 640, resistance block, 6401, guide plate, 6402, fixing plate, 6403, displacement piston, 6404, guide groove, 6405, telescopic column, 66, high pressure ring, 67, fixing cylinder, 68, adjusting ring groove, 69, control valve, 60, double-layer drive box, 601, gear ring, 7, suction pipe, 9, test body, 10, conductive slip ring. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] like Figure 1-3As shown, a semiconductor chip testing device comprises a testing body 9, a conveying device 1 is arranged on both sides of the testing body 9, two rotating disks 6 are arranged above the testing body 9, the rotating disks 6 are rotatably mounted on the support frame 2 through connecting columns 61 and fixing cylinders 67, a plurality of pneumatic telescopic components 64 are arranged in a circular array on the circumferential side of the rotating disk 6, the pneumatic telescopic components 64 can adjust the extension length based on different test positions of the testing body 9, a chip adsorption device 3 is connected to one end of the pneumatic telescopic component 64 away from the rotating disk 6, a driving motor 5 fixed on the support frame 2 is connected to the connecting column 61, and a conductive slip ring 10 connected to the support frame 2 is arranged on the connecting column 61;

[0047] The support frame 2 is connected with the air inlet pipe 4 and the air intake pipe 7, and the upper side of the rotating disk 6 is rotatably sealed and connected with a connecting component, which is fixed on the support frame 2 and connects the air inlet pipe 4 and the air intake pipe 7. Three double-layer drive boxes 60 are arranged inside the connecting component, and the three double-layer drive boxes 60 are all connected with the connecting component. The upper and lower layers of the double-layer drive boxes 60 are fixed with control valves 69. When the rotating disk 6 rotates, three of the several pneumatic telescopic components 64 are respectively connected with the three double-layer drive boxes 60. At this time, the control valve 69 controls the gas to enter the pneumatic telescopic component 64 or to be discharged from the pneumatic telescopic component 64 to control the extension and contraction of the pneumatic telescopic component 64. The pneumatic telescopic component 64 is connected with the chip adsorption device 3;

[0048] The test body 9 is mainly composed of test fixtures, test circuits, display panels and other components, and is used to implement chip testing. The test equipment used to test the chip is an existing technology, so it will not be described in detail.

[0049] The conveying device 1 is provided with a conveyor belt, and a plurality of groups of chip slots are provided on the conveyor belt, each group of chip slots is composed of two front and rear chip slots, and the depths of the two chip slots are one deep and one shallow, the chip slot with a deeper depth is the chip slot where the chip after the test is completed is placed, and the chip slot with a shallower depth is the chip slot for placing the chip that has not been tested;

[0050] When in use, the driving motor 5 drives the rotating disk 6 to rotate, so that two of the plurality of chip adsorption devices 3 are located above the conveying device 1, and one of them is located above the test fixture of the test body 9. Then, the chip adsorption device 3 located above the conveying device 1 absorbs the untested chip, and puts the tested chip into the chip slot for placing the tested chip. The chip adsorption device 3 located on the test fixture presses the chip into the test fixture, and the test body 9 tests the chip. After the test is completed, the chip adsorption device 3 adsorbs the chip, and the rotating disk 6 drives the chip adsorption device 3 to move, and the next round of testing is carried out.

[0051] During use, the pneumatic telescopic assembly 64 is telescopically controlled by controlling the valve 69, thereby ensuring that the chip is placed in the corresponding chip slot or test fixture.

[0052] In this embodiment, if Figure 3 , 7 As shown in FIGS. 8 and 9 , the chip adsorption device 3 includes a connecting cylinder 32 fixed on the pneumatic telescopic assembly 64, a lifting column 31 inserted in the connecting cylinder 32, an upper cylinder 39 and a lower cylinder 36. The lifting column 31 is polygonal and has a lifting piston 302 fixed at the upper end thereof and sealed and inserted in the connecting cylinder 32;

[0053] A driving hole 321 is formed on the inner side of the connecting tube 32, and the driving hole 321 is connected to the pneumatic telescopic assembly 64;

[0054] A plug hole is vertically opened inside the lifting column 31, and a vertical hole is opened above the plug hole. The upper cylinder 39 and the lower cylinder 36 are sealed and plugged into the plug hole up and down, and a gap is set between the upper cylinder 39 and the lower cylinder 36. The lower side of the upper cylinder 39 is connected to a pressing spring that abuts against the lower cylinder 36. A negative pressure locking component 37 connected to the lower cylinder 36 is arranged in the upper cylinder 39. The negative pressure locking component 37 controls the upper cylinder 39 and the lower cylinder 36 to move synchronously when the pressure between the upper cylinder 39 and the lower cylinder 36 is lower than the rated pressure. A negative pressure piston 301 sealed and fixed to the upper cylinder 39 is arranged in the vertical hole, and a downward pressure spring 303 fixed to the upper end of the vertical hole is arranged on the upper side of the negative pressure piston 301. Connecting holes 30 connected to the upper ends of the vertical holes are opened on both sides of the lifting column 31. When the lifting column 31 moves down to the lowest point, the connecting hole 30 is connected to the driving hole 321.

[0055] A suction nozzle 35 is installed on the lower side of the lower tube 36. The friction between the lifting column 31 and the connecting tube 32 is greater than the friction between the lower tube 36 and the plug hole. The friction between the lower tube 36 and the plug hole is greater than the friction between the upper tube 39 and the plug hole.

[0056] A fourth one-way valve 34 connected to the plug hole is fixed to one side of the lower end of the lifting column 31. The fourth one-way valve 34 is connected to a pneumatic telescopic rod. The pneumatic telescopic rod is connected to the valve core of the fourth one-way valve 34. The pneumatic telescopic rod is connected to the pneumatic telescopic assembly 64 to drive the pneumatic telescopic rod to drive the valve core of the fourth one-way valve 34 to open. When the semiconductor chip on the suction nozzle 35 contacts the test body 9 or the conveying device 1, the connection point of the fourth one-way valve 34 is located between the upper cylinder 39 and the lower cylinder 36.

[0057] It also includes a lifting limit assembly 33, which is connected to the pneumatic telescopic assembly 64. When the lifting column 31 moves up to the top of the plug hole, the lifting limit assembly 33 limits the upper cylinder 39 from moving down, and when the lifting limit assembly 33 enters the high-pressure gas, the lifting limit assembly 33 no longer limits the upper cylinder 39.

[0058] When the chip needs to be put down, the gas enters the connecting tube 32 through the pneumatic telescopic assembly 64, the lifting column 31 moves down to the bottom along the connection, the lifting limit assembly 33 is unlocked, and then the driving hole 321 enters the gas, and the downward pressure spring 303 pushes the upper tube 39 to move down, and the upper tube 39 drives the lower tube 36 to move down through the negative pressure locking assembly 37 until the fourth one-way valve 34 is located in the gap between the upper tube 39 and the lower tube 36. The pneumatic telescopic rod pushes the valve core to open as the gas enters, and air enters between the upper tube 39 and the lower tube 36. The negative pressure locking assembly 37 is unlocked, the upper tube 39 moves, and the upper tube 39 pushes the lower tube 36 to move down through the pressing spring until the chip is pressed on the test fixture. At this time, the suction nozzle 35 no longer adsorbs the chip;

[0059] When adsorption is required, air is discharged from the connecting tube 32. At this time, the pneumatic telescopic rod is reset, and the valve core is reset. Since the friction force between the lifting column 31 and the connecting tube 32 is greater than the friction force between the lower tube 36 and the plug hole, and the friction force between the lower tube 36 and the plug hole is greater than the friction force between the upper tube 39 and the plug hole, the upper tube 39 moves up first, and negative pressure is generated between the upper tube 39 and the lower tube 36, and the suction nozzle 35 adsorbs the chip. When the pressure between the upper tube 39 and the lower tube 36 is lower than the rated pressure, the rated pressure at this time is the pressure at which the suction nozzle 35 can adsorb the chip, and the negative pressure locking component 37 is locked with the upper tube 39, and the upper tube 39 drives the lower tube 36 to move up, and the chip moves up, and then the upper tube 39 continues to move up. When the upper tube 39 moves to the top, the lifting limit component 33 limits the upper tube 39 so that the upper tube 39 cannot move down.

[0060] In this embodiment, if Figure 7 , 9 As shown in Figures 10, a guide cylinder 391 connected to the negative pressure piston 301 is vertically fixed inside the upper cylinder 39, and the negative pressure locking assembly 37 includes a locking tooth plate 371, an air intake cylinder 372 fixed to the lower cylinder 36, a guide shell 373 fixedly connected to the other end of the air intake cylinder 372, two unlocking plates 375 slidingly sealed and connected to the inside of the guide shell 373, and a negative pressure telescopic rod 374 fixed on the two unlocking plates 375. The inner wall of the guide cylinder 391 is provided with at least two lifting grooves 377 along the axial direction, and the locking tooth plate 371 is elastically plugged into the lifting groove 377 by a spring, and the locking tooth plate 371 is provided with a rod body, and a hole for plugging the rod body is provided in the lifting groove 377, and a circular protrusion is provided on the rod body, and an arc groove for sliding the circular protrusion is provided in the hole, so that the rod body cannot be separated from the hole;

[0061] The guide shell 373 can be engaged with the locking tooth plate 371, and the unlocking plate 375 moves left and right along the guide shell 373. The two unlocking plates 375 are provided with protruding rods on the opposite sides. The protruding rods can pass through the guide shell 373 and abut against the locking tooth plate 371. The locking tooth plate 371 is provided with a sliding groove for the protruding rods to move up and down.

[0062] A plurality of through holes are provided on the circumferential side of the air inlet cylinder 372, and the guide shell 373 is slidably connected in the guide cylinder 391, and the side of the guide shell 373 is not in sealing contact with the guide cylinder 391;

[0063] When the pressure between the upper cylinder 39 and the lower cylinder 36 is lower than the rated pressure, the two unlocking plates 375 approach each other so that the protruding rod no longer contacts the locking tooth plate 371, and the locking tooth plate 371 is engaged with the guide shell 373. At this time, the guide shell 373 is fixed to the guide cylinder 391 through the locking tooth plate 371, so that the upper cylinder 39 and the lower cylinder 36 are displaced synchronously. When it is higher than the rated pressure, that is, when the lower cylinder 36 moves downward and gas enters through the fourth one-way valve 34, the negative pressure telescopic rod 374 pushes the unlocking rod to extend and contacts the slide groove through the protruding rod. At this time, the guide shell 373 and the locking tooth plate 371 are unlocked, and the upper cylinder 39 and the lower cylinder 36 are no longer displaced synchronously.

[0064] In this embodiment, if Figure 7 , 9 As shown, at least two grooves are provided on the inner wall of the plug hole, and the lifting and limiting assembly 33 includes a displacement block 332 sealed and plugged in the groove, a limiting barrel 331 that can be plugged in the groove, and a high-pressure channel 333 provided on the lifting column 31, the limiting barrel 331 is sealed and plugged in the upper cylinder 39, the high-pressure channel 333 is connected to the pneumatic telescopic assembly 64, the upper cylinder 39 is provided with a limiting spring 334 connected to the limiting barrel 331, wherein a plurality of convex points are provided at one end of the groove opening, the displacement block 332 is provided with a concave point for the convex point to pass through, and the limiting barrel 331 is provided with a linear groove for the convex point to pass through, and the displacement block 332 cannot be separated from the groove by the setting of the convex points and the concave points;

[0065] When the suction nozzle 35 sucks the chip, the upper tube 39 moves up to the top, and the limit spring 334 pushes the limit barrel 331 to insert into the groove and pushes the displacement block 332 to move, so that the upper tube 39 is displaced to a limited position. When the high-pressure channel 333 enters the high-pressure gas, the displacement block 332 resets and pushes the limit barrel 331 to reset. At this time, the upper tube 39 can move up and down.

[0066] In this embodiment, if Figure 8 , 10 As shown, the lifting column 31 is also provided with a pressure-compensating assembly 38, which includes a negative pressure chamber 383 provided on the lifting column 31, a fifth one-way valve 381 and a pressure-compensating valve 382 which are connected to the negative pressure chamber 383, the fifth one-way valve 381 and the pressure-compensating valve 382 are both provided on the lifting column 31, the fifth one-way valve 381 is connected to the pneumatic telescopic assembly 64, when the upper cylinder 39 is located at the uppermost part of the plug-in hole, the pressure-compensating valve 382 is connected to the area between the upper cylinder 39 and the lower cylinder 36, when the upper cylinder 39 is located at the lowermost part of the plug-in hole, the side surface of the upper cylinder 39 closes the pressure-compensating valve 382;

[0067] When the upper cylinder 39 is at the top and the pressure in the upper cylinder 39 gradually increases, the pressure compensation valve 382 gradually opens, so that the negative pressure chamber 383 sucks the air between the upper cylinder 39 and the lower cylinder 36, ensuring that the lower cylinder 36 continuously absorbs the chip;

[0068] During the upward movement of the upper tube 39 , the air in the negative pressure chamber 383 is sucked by the pneumatic telescopic assembly 64 , ensuring that the negative pressure chamber 383 maintains a negative pressure state. The fifth one-way valve 381 is provided to prevent air from entering the negative pressure chamber 383 .

[0069] In this embodiment, if Fig.11 As shown, the pressure-compensating valve 382 includes a valve body fixed in the lifting column 31, a hollow ball is rotatably connected inside the valve body, a negative pressure hole C3824 and a negative pressure hole A3822 are provided in the valve body, the negative pressure hole A3822 is connected to the negative pressure chamber 383, the negative pressure hole C3824 is connected to the area between the upper cylinder 39 and the lower cylinder 36, and a displacement groove 3821 is also provided in the valve body, a convex ball is provided at one clockwise end of the displacement groove 3821, a fan blade connected to the hollow sphere is provided in the displacement groove 3821, the fan blade is in sealing contact with the displacement groove 3821 and can rotate around the center of the hollow sphere, the fan blade is connected in the displacement groove 3821 through a spring, a negative pressure hole B3823 and a negative pressure hole D are provided in the hollow ball, the negative pressure hole B3823 is connected to the area between the upper cylinder 39 and the lower cylinder 36, and the negative pressure hole D is connected to the negative pressure hole A3822 when the fan blade contacts the convex ball;

[0070] When the upper cylinder 39 is at the top and the pressure in the upper cylinder 39 gradually increases, the fan blades are displaced counterclockwise along the displacement groove 3821 under the action of the spring until the negative pressure hole D is connected to the negative pressure hole A3822. At this time, the air between the upper cylinder 39 and the lower cylinder 36 enters the negative pressure chamber 383 through the hollow sphere. In the process of the air between the upper cylinder 39 and the lower cylinder 36 being extracted, the fan blades are gradually reset until the negative pressure hole D is connected to the negative pressure hole A3822 and is no longer connected.

[0071] In this embodiment, if Figure 3 , 4 As shown, two sealing circular grooves coaxial with the rotating disk 6 are provided on the upper side surface of the rotating disk 6, and the connecting component includes a negative pressure ring 62 and a high pressure ring 66 which are rotatably connected to the two sealing circular grooves, and a negative pressure ring 62-shaped cavity and a high pressure ring 66-shaped cavity are provided inside the negative pressure ring 62 and the high pressure ring 66, and the negative pressure ring 62-shaped cavity and the high pressure ring 66-shaped cavity are respectively connected to the suction pipe 7 and the intake pipe 4, and the three double-layer drive boxes 60 are all arranged in the high pressure ring 66, and the upper and lower layers of the three double-layer drive boxes 60 are respectively connected to the annular cavities of the negative pressure ring 62 and the high pressure ring 66, and the pneumatic telescopic component 64 is provided with two holes at one end away from the chip adsorption device 3, and the two holes are respectively connected to the rotating disk 6 and are connected to the control valves 69 of the upper and lower layers of the double-layer drive box 60;

[0072] When in use, the air in the double-layer drive box 60 is sucked out or filled with air through the negative pressure ring 62 and the high pressure ring 66, and the extension and retraction of the pneumatic telescopic component 64 is controlled under the control of the control valve 69. When the rotating disk 6 rotates, the negative pressure ring 62 and the high pressure ring 66 are in sealed contact with the rotating disk 6, so that the pneumatic telescopic component 64 will not be extended or retracted when it is not connected to the double-layer drive box 60, and the control valve 69 is connected to the conductive slip ring 10.

[0073] In this embodiment, if Figure 2 , 3 As shown in FIG. 4 , an adjusting ring groove 68 is provided on the inner wall of the rotating disk 6. The pneumatic telescopic assembly 64 includes a connecting cylinder 641 fixed in the adjusting ring groove 68, a displacement piston 6403 sealed and plugged on the connecting cylinder 641, and a telescopic column 6405 fixed on the displacement piston 6403. One end of the connecting cylinder 641 away from the chip adsorption device 3 is sealed and fixed on the side wall of the adjusting ring groove 68. The adjusting ring groove 68 is provided with two circular holes located in the connecting cylinder 641. The circular holes can be rotatably connected with the control valve 69.

[0074] A positioning assembly is disposed outside the connecting tube 641, and the positioning assembly abuts against the telescopic column 6405 to limit the extension length of the telescopic column 6405;

[0075] The telescopic column 6405 is provided with a high-pressure pipe 645 and a negative-pressure pipe 648 connected to the displacement piston 6403. The high-pressure pipe 645 and the negative-pressure pipe 648 are both connected to an electric control valve 644 fixed on the telescopic column 6405. The high-pressure pipe 645 is connected to the pneumatic telescopic rod and the high-pressure channel 333. The negative-pressure pipe 648 is connected to the driving hole 321 and the fifth one-way valve 381. The connecting tube 32 is connected to the high-pressure pipe 645 and the negative-pressure pipe 648 respectively.

[0076] The friction force between the displacement piston 6403 and the connecting cylinder 641 is greater than the friction force between the lifting column 31 and the connecting cylinder 32;

[0077] When in use, the positioning assembly is controlled to position the extension length of the telescopic column 6405 according to the position of the test fixture. Then, when the round hole is connected to the control valve 69, gas enters the connecting tube 641, and the displacement piston 6403 and the telescopic column 6405 are displaced. When resetting is required, the gas is extracted after passing through the control valve 69, and the displacement piston 6403 and the telescopic column 6405 are reset.

[0078] When the telescopic column 6405 is extended, under the action of the electric control valve 644, high-pressure air can enter the connecting tube 32, the pneumatic telescopic rod and the high-pressure channel 333 through the high-pressure pipe 645, so that the suction nozzle 35 is extended and the chip is placed on the test fixture;

[0079] After the chip test is completed, the air is extracted under the action of the electric control valve 644 and the control valve 69, and then retracted one by one in the front and back order of the upper cylinder 39, the lower cylinder 36, the lifting column 31 and the displacement piston 6403.

[0080] In this embodiment, if Figure 4 , 5 6, the positioning assembly includes a resistance block 640, an adjustment cylinder 642 rotatably connected to the connecting cylinder 641, a guide plate 6401 fixed to the connecting cylinder 641, and two fixing plates 6402 fixed in the adjusting ring groove 68, the two fixing plates 6402 are arranged on both sides of the adjusting cylinder 642, the resistance block 640 is plugged into the fixing plate 6402 and can be displaced along the radial direction of the telescopic column 6405;

[0081] A convex rod is provided on the side of the abutment block 640 facing the adjustment cylinder 642. A plurality of arc grooves 6421 are provided on the circumferential side of the adjustment cylinder 642 in a circular array with the center of the adjustment cylinder 642 as the center. The guide plate 6401 is fixed coaxially with the adjustment cylinder 642 and a guide groove 6404 is provided on the circular side. The guide groove 6404 is provided along the radial direction of the guide plate 6401. The convex rod is inserted into the guide groove 6404 and the arc groove 6421. A driving component for driving the adjustment cylinder 642 to rotate is provided in the adjustment ring groove 68.

[0082] A limiting groove 649 is provided on the outer side of the circumference of the telescopic column 6405, and the diameter of the limiting groove 649 gradually decreases from one side adjacent to the connecting tube 641 to the other end of the telescopic column 6405;

[0083] When it is necessary to adjust the extension length of the telescopic column 6405, the drive assembly is controlled to shorten or lengthen it as needed, and the drive assembly drives the adjusting cylinder 642 to rotate. The adjusting cylinder 642 rotates and pushes the convex rod to move along the guide groove 6404 under the action of the arc groove 6421, so that the resistance block 640 gradually moves toward the axis of the telescopic column 6405, and the extension length of the telescopic column 6405 is reduced under the cooperation of the resistance block 640 and the limiting groove 649. When it is necessary to lengthen the extension distance, the adjusting cylinder 642 can be driven by the drive assembly to rotate in the reverse direction.

[0084] In this embodiment, the driving assembly includes a gear ring 601 rotatably connected in the adjusting ring groove 68, the gear ring 601 is meshed with an adjusting motor 63 fixed on the rotating disk 6, the gear ring 601 is meshed with the adjusting cylinder 642, and the adjusting motor 63 is connected to the conductive slip ring 10;

[0085] When in use, the rotation drive of the adjustment cylinder 642 is realized by adjusting the cooperation between the motor 63 and the gear ring 601 to ensure the drive.

[0086] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor chip testing device, comprising a testing body, characterized in that: Conveying devices are provided on both sides of the test body, two rotating disks are provided above the test body, the rotating disks are rotatably mounted on a support frame and the support frame can drive the rotating disks to rotate, a plurality of pneumatic telescopic components are provided in a circular array on the circumferential side of the rotating disk, the pneumatic telescopic components can adjust the extension length based on different test positions of the test body, and a chip adsorption device is connected to one end of the pneumatic telescopic component away from the rotating disk; The support frame is connected with an air inlet pipe and an air intake pipe, and a connecting component is connected to the upper side of the rotating disk in a rotating seal. The connecting component is fixed to the support frame and connected with the air inlet pipe and the air intake pipe. Three double-layer drive boxes are arranged inside the connecting component. The three double-layer drive boxes are all connected with the connecting component. The upper and lower layers of the double-layer drive boxes are both provided with control valves. When the rotating disk rotates, three of the several pneumatic telescopic components are respectively connected with the three double-layer drive boxes. At this time, the control valve controls the gas to enter the pneumatic telescopic component or to be discharged from the pneumatic telescopic component to control the extension and contraction of the pneumatic telescopic component. The pneumatic telescopic component is connected with a chip adsorption device; The chip adsorption device comprises a connecting cylinder fixed on the pneumatic telescopic assembly, a lifting column inserted in the connecting cylinder, an upper cylinder and a lower cylinder, wherein the lifting column is polygonal and a lifting piston sealed and inserted in the connecting cylinder is fixed on the upper end; A driving hole is provided on the inner side of the connecting tube, and the driving hole is connected to the pneumatic telescopic assembly; A plug hole is vertically opened inside the lifting column, and a vertical hole is opened above the plug hole, and the upper tube and the lower tube are sealed and plugged in the plug hole up and down, and a gap is set between the upper tube and the lower tube, and the lower side surface of the upper tube is connected to a pressing spring that abuts against the lower tube, and a negative pressure locking component connected to the lower tube is arranged in the upper tube, and the negative pressure locking component controls the upper tube and the lower tube to move synchronously when the pressure between the upper tube and the lower tube is lower than the rated pressure, and a negative pressure piston is arranged in the vertical hole and sealed and fixed to the upper tube, and a downward pressure spring fixed to the upper end of the vertical hole is arranged on the upper side surface of the negative pressure piston, and connecting holes connected to the upper end of the vertical hole are opened on both sides of the lifting column, and when the lifting column moves down to the lowest position, the connecting holes are connected to the driving hole; A suction nozzle is installed on the lower side of the lower tube, the friction between the lifting column and the connecting tube is greater than the friction between the lower tube and the plug hole, and the friction between the lower tube and the plug hole is greater than the friction between the upper tube and the plug hole; A fourth one-way valve connected to the plug hole is fixed on one side of the lower end of the lifting column, the fourth one-way valve is connected to a pneumatic telescopic rod, the pneumatic telescopic rod is connected to the valve core of the fourth one-way valve, the pneumatic telescopic rod is connected to the pneumatic telescopic assembly to drive the pneumatic telescopic rod to drive the valve core of the fourth one-way valve to open, when the semiconductor chip on the suction nozzle contacts the test body or the conveying device, the fourth one-way valve connection point is located between the upper tube and the lower tube; It also includes a lifting and limiting component, which is connected to the pneumatic telescopic component. When the lifting column moves up to the top of the plug-in hole, the lifting and limiting component limits the upper tube from moving downward, and when the lifting and limiting component enters high-pressure gas, the lifting and limiting component no longer limits the upper tube.

2. A semiconductor chip testing device according to claim 1, characterized in that: A guide cylinder connected to the negative pressure piston is vertically fixed inside the upper cylinder, and the negative pressure locking assembly includes a locking tooth plate, an air intake cylinder fixed to the lower cylinder, a guide shell fixedly connected to the other end of the air intake cylinder, two unlocking plates slidingly sealedly connected inside the guide shell, and a negative pressure telescopic rod fixed to the two unlocking plates, and at least two lifting grooves are axially opened on the inner wall of the guide cylinder, and the locking tooth plate is elastically plugged into the lifting groove; The guide shell can be engaged with the locking tooth plate, and the unlocking plate is displaced left and right along the guide shell. The two unlocking plates are provided with protruding rods on the opposite sides. The protruding rods can pass through the guide shell and abut against the locking tooth plate. The locking tooth plate is provided with a sliding groove for the protruding rod to move up and down. A plurality of through holes are provided on the circumferential side of the air intake cylinder, the guide shell is slidably connected in the guide cylinder, and the side surface of the guide shell is not in sealing contact with the guide cylinder.

3. A semiconductor chip testing device according to claim 2, characterized in that: At least two grooves are provided on the inner wall of the plug-in hole. The lifting and limiting assembly includes a displacement block sealed and plugged in the groove, a limiting barrel capable of being plugged in the groove, and a high-pressure channel provided on the lifting column. The limiting barrel is sealed and plugged in the upper cylinder. The high-pressure channel is connected to the pneumatic telescopic assembly. The upper cylinder is provided with a limiting spring connected to the limiting barrel.

4. A semiconductor chip testing device according to claim 3, characterized in that: The lifting column is also provided with a pressure-compensating assembly, which includes a negative pressure chamber opened on the lifting column, a fifth one-way valve and a pressure-compensating valve connected to the negative pressure chamber. The fifth one-way valve and the pressure-compensating valve are both arranged on the lifting column. The fifth one-way valve is connected to the pneumatic telescopic assembly. When the upper tube is located at the uppermost part of the plug-in hole, the pressure-compensating valve is connected to the area between the upper tube and the lower tube. When the upper tube is located at the lowermost part of the plug-in hole, the side of the upper tube closes the pressure-compensating valve.

5. A semiconductor chip testing device according to claim 4, characterized in that: The pressure-compensating valve includes a valve body fixed in a lifting column, a hollow ball is rotatably connected inside the valve body, a negative pressure hole C and a negative pressure hole A are provided in the valve body, the negative pressure hole A is connected to the negative pressure chamber, the negative pressure hole C is connected to the area between the upper cylinder and the lower cylinder, and there is also an arc groove in the valve body, a convex ball is provided at one clockwise end of the arc groove, a fan blade connected to the hollow sphere is provided in the arc groove, the fan blade is in sealing contact with the arc groove and can rotate around the center of the hollow sphere, the fan blade is connected to the arc groove through a spring, and a negative pressure hole B and a negative pressure hole D are provided in the hollow ball, the negative pressure hole B is connected to the area between the upper cylinder and the lower cylinder, and the negative pressure hole D is connected to the negative pressure hole A when the fan blade is in contact with the convex ball.

6. A semiconductor chip testing device according to claim 5, characterized in that: Two sealing circular grooves coaxial with the rotating disk are provided on the upper side surface of the rotating disk, and the connecting component includes a negative pressure ring and a high pressure ring which are rotatably connected to the two sealing circular grooves, and a negative pressure annular cavity and a high pressure annular cavity are provided inside the negative pressure ring and the high pressure ring, and the negative pressure annular cavity and the high pressure annular cavity are respectively connected to the suction pipe and the intake pipe, and the three double-layer drive boxes are all arranged in the high pressure ring, and the upper and lower layers of the three double-layer drive boxes are respectively connected to the annular cavities of the negative pressure ring and the high pressure ring, and two holes are provided on the end of the pneumatic telescopic component away from the chip adsorption device, and the two holes are respectively connected to the rotating disk and connected to the control valves of the upper and lower layers of the double-layer drive box.

7. A semiconductor chip testing device according to claim 6, characterized in that: The inner wall of the rotating disk is provided with an adjusting ring groove, the pneumatic telescopic assembly comprises a connecting cylinder fixed in the adjusting ring groove, a displacement piston sealably plugged on the connecting cylinder, and a telescopic column fixed on the displacement piston, the end of the connecting cylinder away from the chip adsorption device is sealably fixed on the side wall of the adjusting ring groove, the adjusting ring groove is provided with two circular holes located in the connecting cylinder, and the circular holes can be rotatably connected with the control valve; A positioning assembly is disposed outside the connecting tube, and the positioning assembly abuts against the telescopic column to limit the extension length of the telescopic column; The telescopic column is provided with a high-pressure pipe and a negative-pressure pipe connected to the displacement piston, the high-pressure pipe and the negative-pressure pipe are both connected to an electrically controlled valve fixed on the telescopic column, the high-pressure pipe is connected to the pneumatic telescopic rod and the high-pressure channel, the negative-pressure pipe is connected to the driving hole and the fifth one-way valve, and the connecting tube is connected to the high-pressure pipe and the negative-pressure pipe respectively; The friction force between the displacement piston and the connecting cylinder is greater than the friction force between the lifting column and the connecting cylinder.

8. A semiconductor chip testing device according to claim 7, characterized in that: The positioning assembly includes a resistance block, an adjustment cylinder rotatably connected to the connecting cylinder, a guide plate fixed to the connecting cylinder, and two fixing plates fixed in the adjustment ring groove, the two fixing plates are arranged on both sides of the adjustment cylinder, the resistance block is plugged into the fixing plates and can be displaced along the radial direction of the telescopic column; The side of the abutment block facing the adjusting cylinder is provided with a convex rod, the circumferential side of the adjusting cylinder is provided with a plurality of arc grooves in a circular array with the center of the adjusting cylinder as the center, the guide plate is fixed coaxially with the adjusting cylinder and the circular side is provided with a guide groove, the guide groove is provided along the radial direction of the guide plate, the convex rod is inserted into the guide groove and the arc groove, and a driving component for driving the adjusting cylinder to rotate is provided in the adjusting ring groove; A limiting groove is provided on the outer circumferential surface of the telescopic column, and the diameter of the limiting groove gradually decreases from one side adjacent to the connecting tube to the other end of the telescopic column.

9. A semiconductor chip testing device according to claim 8, characterized in that: The driving assembly comprises a gear ring rotatably connected in an adjusting ring groove, the gear ring is meshed with an adjusting motor fixed on a rotating disk, and the gear ring is meshed with an adjusting cylinder.

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