Display panel, method for manufacturing display panel, and display device

Abstract

The application discloses a display panel, a preparation method of the display panel and a display device, and relates to the technical field of display. The display panel comprises a substrate, a plurality of partition structures, a plurality of light-emitting units and a first inorganic encapsulation layer. The plurality of partition structures are arranged on the substrate at intervals, a pixel opening is formed between two adjacent partition structures, the plurality of light-emitting units are arranged one by one in the pixel opening, and the first inorganic encapsulation layer covers a side, away from the substrate, of the light-emitting unit and the partition structure. The display panel further comprises a first organic encapsulation layer and a second organic encapsulation layer. The first organic encapsulation layer is arranged between the two adjacent partition structures, the second organic encapsulation layer is arranged on a side, away from the substrate, of the first organic encapsulation layer, and the viscosity of the first organic encapsulation layer is lower than that of the second organic encapsulation layer. Through the above design, the organic encapsulation filling interface is flat, and the encapsulation reliability is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a preparation method of the display panel and a display device. BACKGROUND

[0002] In the field of display panel, in the technology without fine mask plate, a partition structure is formed on a substrate by stacking a pixel definition layer, a conductive layer and an insulating layer to achieve the purpose of limiting the deposition area of the evaporation film layer and to enable product development with lower cost selection.

[0003] However, the design of the partition structure easily affects the reliability of the package.

[0004] Therefore, it is an urgent problem to be solved at present. SUMMARY

[0005] The purpose of the present application is to provide a display panel with flat organic package filling interface and improved package reliability, a preparation method of the display panel and a display device.

[0006] The present application discloses a display panel, comprising a substrate, a plurality of partition structures, a plurality of light emitting units and a first inorganic encapsulation layer, the plurality of partition structures are arranged on the substrate at intervals, a pixel opening is formed between two adjacent partition structures, the plurality of light emitting units are arranged one by one in the pixel opening, the first inorganic encapsulation layer covers one side of the light emitting unit and the partition structure away from the substrate, the display panel further comprises a first organic encapsulation layer and a second organic encapsulation layer, the first organic encapsulation layer is arranged between two adjacent partition structures, the second organic encapsulation layer is arranged on one side of the first organic encapsulation layer away from the substrate, and the viscosity of the first organic encapsulation layer is lower than that of the second organic encapsulation layer.

[0007] Optionally, a leveling area is formed between the adjacent partition structures, the height of the horizontal plane where the upper surface of the first organic encapsulation layer is located is at least flush with the height of the horizontal plane where the upper surface of the leveling area is located, and the height of the horizontal plane where the upper surface of the first organic encapsulation layer is located is lower than the height of the horizontal plane where the upper surface of the partition structure is located.

[0008] Optionally, the thickness of the first organic encapsulation layer is 1.5 microns-4 microns, and the thickness of the second organic encapsulation layer is 4 microns-10 microns.

[0009] Optionally, the materials of the first organic encapsulation layer and the second organic encapsulation layer are made of organic materials of acrylic series or organic materials of epoxy series.

[0010] Optionally, the display panel further comprises a third organic encapsulation layer, the second organic encapsulation layer is in plurality, and each second organic encapsulation layer is arranged between two adjacent partition structures; a third encapsulation groove is formed between the second organic encapsulation layer and the partition structure, and the third organic encapsulation layer is arranged in the third encapsulation groove; the first organic encapsulation layer and the second organic encapsulation layer have the same refractive index, and the third organic encapsulation layer has a refractive index less than that of the first organic encapsulation layer and the second organic encapsulation layer.

[0011] Optionally, the first organic encapsulation layer and the second organic encapsulation layer have a refractive index of 1.6-1.8; and the third organic encapsulation layer has a refractive index greater than 1.4 and less than 1.5.

[0012] Optionally, the third organic encapsulation layer has a trapezoidal structure in the cross section in the thickness direction of the substrate.

[0013] Optionally, the partition structure comprises a pixel definition layer, a conductive layer and an insulating layer stacked in sequence, the first inorganic encapsulation layer forms a first encapsulation part and a second encapsulation part on the insulating layer, a groove structure is formed between the first encapsulation part, the insulating layer and the second encapsulation part, the third organic encapsulation layer comprises a first organic encapsulation part and a second organic encapsulation part stacked in sequence, and the first organic encapsulation part is fitted in the groove structure; wherein the second organic encapsulation part has a right trapezoidal structure in the cross section in the thickness direction of the substrate, the second organic encapsulation part comprises a first inclined surface and a second inclined surface arranged oppositely, and the included angle between the first inclined surface and the horizontal plane and the included angle between the second inclined surface and the horizontal plane are both a, wherein 60°≦a<90°.

[0014] The application further discloses a preparation method of a display panel, which is used in the display panel.

[0015] providing a substrate;

[0016] forming a plurality of pixel definition layers arranged at intervals on the substrate, and forming a pixel opening between two adjacent pixel definition layers;

[0017] forming a conductive layer and an insulating layer on the pixel definition layer in sequence, and forming a partition structure by the pixel definition layer, the conductive layer and the insulating layer;

[0018] forming a light emitting unit in the pixel opening;

[0019] forming a first inorganic encapsulation layer above the light emitting unit and the partition structure;

[0020] forming the first organic encapsulation layer on the first inorganic encapsulation layer between two adjacent partition structures.

[0021] forming a second organic encapsulation layer on the first organic encapsulation layer;

[0022] etching the second organic encapsulation layer at positions corresponding to the partition structures to form third encapsulation grooves above the partition structures;

[0023] forming a third organic encapsulation layer in the third encapsulation grooves to form a display panel with encapsulation completed.

[0024] The application further discloses a display device comprising the display panel.

[0025] Compared with the prior art, the display panel further comprises a first organic encapsulation layer and a second organic encapsulation layer, the first organic encapsulation layer is arranged between two adjacent partition structures, the second organic encapsulation layer is arranged on a side of the first organic encapsulation layer away from the substrate, and the viscosity of the first organic encapsulation layer is lower than that of the second organic encapsulation layer. In this way, after printing the first inorganic encapsulation layer, the first inorganic encapsulation layer with lower viscosity has better flowability and can be filled and leveled better, and then the second organic encapsulation layer with higher viscosity is used for the second organic encapsulation, so that the reliability of encapsulation is improved. BRIEF DESCRIPTION OF DRAWINGS

[0026] The accompanying drawings, which are included to provide a further understanding of the embodiments of the application and constitute a part of the specification, serve to explain the principles of the application together with the text. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor. In the drawings:

[0027] Figure 1 is a block diagram structure schematic diagram of a display device provided by the application;

[0028] Figure 2 is a structure schematic diagram of a display panel provided by the application;

[0029] Figure 3 is a structure schematic diagram of a display panel provided by the application; Figure 2 is a cross-sectional structure schematic diagram along the cross-sectional line A-A' in FIG. 8;

[0030] Figure 4 is a film layer structure schematic diagram of a display panel provided by the first embodiment of the application;

[0031] Figure 5 is a structure schematic diagram of a display panel provided by the application; Figure 4 is a local enlarged structure schematic diagram of a B region in FIG. 8;

[0032] Figure 6 is a flow chart of a method for manufacturing a display panel provided by the present application;

[0033] Figure 7 is a schematic diagram of a film layer structure of a display panel provided by a second embodiment of the present application.

[0034] wherein, 10, display device; 100, display panel; 110, substrate; 120, partition structure; 121, pixel definition layer; 122, conductive layer; 123, insulating layer; 130, light emitting unit; 131, anode; 132, light emitting layer; 133, cathode; 140, first inorganic encapsulation layer; 141, first encapsulation part; 142, second encapsulation part; 143, pit; 150, pixel opening; 160, first organic encapsulation layer; 170, second organic encapsulation layer; 180, leveling area; 190, third encapsulation groove; 200, third organic encapsulation layer; 210, first organic encapsulation part; 220, second organic encapsulation part; 221, first inclined surface; 222, second inclined surface; 223, first bottom surface; 224, first surface; 300, groove structure; 310, second inorganic encapsulation layer; 320, black matrix; 330, color filter layer; 340, first encapsulation surface; 350, second encapsulation surface. DETAILED DESCRIPTION

[0035] It should be understood that the terms, specific structures and functional details used herein are merely to describe specific embodiments and are representative, but the present application can be embodied in many alternative forms, and should not be interpreted as being limited to the embodiments set forth herein.

[0036] In the description of the present application, the terms "first", "second" are used only for the purpose of description, and should not be understood as indicating relative importance, or implying the number of the indicated technical features. Therefore, unless otherwise specified, the features defined with "first", "second" can explicitly or implicitly include one or more of the features; the meaning of "multiple" is two or more. In addition, the terms indicating the orientation or positional relationship such as "up", "down", "left", "right", "second direction", "first direction", etc. are described based on the orientation or relative positional relationship shown in the drawings, and are only for the convenience of the simplified description of the present application, and should not be understood as indicating that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present application. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0037] Figure 1 is a block diagram structure schematic diagram of a display device provided by the present application, Figure 2This is a schematic diagram of the structure of the display panel provided in this application. Figure 3 Yes, yes Figure 2 A schematic diagram of the cross-section structure along section line A-A' is shown below. Figures 1-3 As shown, this application discloses a display device 1010, including a display panel 100. The display panel 100 includes a substrate 110, a plurality of partition structures 120, a plurality of light-emitting units 130, and a first inorganic encapsulation layer 140. The plurality of partition structures 120 are spaced apart on the substrate 110, and a pixel opening 150 is formed between two adjacent partition structures 120. The plurality of light-emitting units 130 are correspondingly disposed in the pixel opening 150. The first inorganic encapsulation layer 140 covers the side of the light-emitting units 130 and the partition structures 120 away from the substrate 110. The display panel 100 also includes a first organic encapsulation layer 160 and a second organic encapsulation layer 170. The first organic encapsulation layer 160 is disposed between two adjacent partition structures 120, and the second organic encapsulation layer 170 is disposed on the side of the first organic encapsulation layer 160 away from the substrate 110. The viscosity of the first organic encapsulation layer 160 is lower than that of the second organic encapsulation layer 170.

[0038] The existing display panel has a partition structure similar to a mushroom, with the conductive layer resembling the mushroom stem and the insulating layer resembling the mushroom cap. The structural features between the conductive and insulating layers easily lead to significant unevenness at different locations in this area during the encapsulation of the first inorganic encapsulation layer after the evaporation of the light-emitting layer and cathode. The inventors of this application discovered that such a design easily causes the subsequent organic encapsulation layer to fail to fill and level well in some narrow areas. Therefore, this application proposes that the display panel 100 further include a first organic encapsulation layer 160 and a second organic encapsulation layer 160. 70. The first organic encapsulation layer 160 is disposed between two adjacent partition structures 120, and the second organic encapsulation layer 170 is disposed on the side of the first organic encapsulation layer 160 away from the substrate 110. The viscosity of the first organic encapsulation layer 160 is lower than that of the second organic encapsulation layer 170. In this way, after the first inorganic encapsulation layer 140 is printed first, the first inorganic encapsulation layer 140 with lower viscosity has better fluidity and can be filled and leveled better first. Then, the second organic encapsulation is performed by the second inorganic encapsulation layer 310 with higher viscosity, so as to improve the reliability of the encapsulation.

[0039] The present application will now be described in detail with reference to the accompanying drawings and optional embodiments.

[0040] First embodiment:

[0041] The material of the first organic encapsulation layer 160 and the second organic encapsulation layer 170 is made of acrylic organic material or epoxy organic material, both of which are liquid small-molecule organic monomer structure materials, and can be changed into polymers for solidification after heating by external heat source. Taking the acrylic organic material as an example, if it is a monomer, the viscosity can be adjusted by adjusting the branched structure of the organic monomer. The acrylic resin organic material has good leveling effect. Compared with the mixed organic material of solute and ink solvent, it is more convenient to use without the need of solute and solvent matching. Of course, the first organic encapsulation layer 160 and the second organic encapsulation layer 170 can also be mixed with solute and solvent, which is selected according to the display panel 100, and is not limited here.

[0042] Figure 4 is a film layer structure schematic diagram of the display panel provided by the first embodiment of the present application, as shown in Figure 4 as shown in Figure 4 The leveling area 180 is formed between the adjacent partition structures 120, and the leveling area 180 is a region with significant ups and downs. The recess 143 is formed at the position of the partition structure 120 in the leveling area 180. The structure of the recess 143 is a polygonal structure, and there is a narrow position. The height of the horizontal plane where the upper surface of the first organic encapsulation layer 160 is located is at least flush with the height of the horizontal plane where the upper surface of the leveling area 180 is located. In this way, when the first organic encapsulation layer 160 is encapsulated, the first organic encapsulation material can quickly flow to the position of the recess 143, which ensures that the leveling area 180 can be basically filled, thereby reducing the difficulty of leveling of the subsequent second organic encapsulation layer 170.

[0043] When printing the first organic encapsulation layer 160, because the viscosity of the first organic encapsulation layer 160 is relatively low, if the first organic encapsulation layer 160 is made too thick, the printed encapsulation material will easily flow out from the encapsulation barrier area at the edge of the panel. Therefore, the height of the horizontal plane where the upper surface of the first organic encapsulation layer 160 is located is set lower than the height of the horizontal plane where the upper surface of the partition structure 120 is located. Subsequently, the second organic encapsulation layer 170 with higher viscosity is formed, which can be effectively blocked in the encapsulation barrier area at the edge of the panel. The thickness of the first organic encapsulation layer 160 is 1.5 micrometers to 4 micrometers, and the thickness of the second organic encapsulation layer 170 is 4 micrometers to 10 micrometers, that is, the thickness of the second organic encapsulation layer 170 is more than twice that of the first organic encapsulation layer 160. In this way, while the first organic encapsulation layer 160 can ensure the leveling and filling of the leveling area 180, the entire organic encapsulation layer can also be effectively blocked at the edge of the panel. Preferably, the thickness of the first organic encapsulation layer 160 is 2.5 micrometers, which is just enough to fill the positions of the recesses 143 on both sides. Of course, the thickness of the first organic encapsulation layer 160 and the thickness of the second organic encapsulation layer 170 can also be adjusted according to the actual needs of the display panel 100 in production, and are not limited here.

[0044] Figure 5 yes Figure 4 A magnified schematic diagram of a portion of region B in the middle, as shown below. Figure 5 As shown, combined with Figure 4 The display panel 100 further includes a third organic encapsulation layer 200. Multiple second organic encapsulation layers 170 are present, and each second organic encapsulation layer 170 is disposed between two adjacent partition structures 120. A third encapsulation groove 190 is formed between adjacent second organic encapsulation layers 170 and the partition structure 120, and the third organic encapsulation layer 200 is disposed within the third encapsulation groove 190. The display panel 100 also includes a second inorganic encapsulation layer 310, multiple color filter layers 330, and multiple black matrices 320. The second inorganic encapsulation layer 310... The second inorganic encapsulation layer 310 is covered above the third organic encapsulation layer 200 and the second organic encapsulation layer 170. Multiple color filter layers 330 are disposed on the side of the second inorganic encapsulation layer 310 away from the third organic encapsulation layer 200 and the second organic encapsulation layer 170. Multiple black matrices 320 are disposed one-to-one between two adjacent color filter layers 330, and the orthographic projection of the black matrix 320 on the substrate 110 overlaps with the orthographic projection of the third organic encapsulation layer 200 on the substrate 110. The color filter layers 330 are mainly used to filter out ambient light.

[0045] The light emitting unit is combined by anode 131, light emitting layer 132 and cathode 133 stacked in sequence, the color of light emitting layer 132 is generally red, green, blue, and of course, white color can also be included, when the light emitting unit 130 of display panel 100 is red or blue or green, the color of color resistance in color filter layer 330 is the same as the color of corresponding light emitting unit 130, black matrix 320 is mainly used to reduce the problem of light mixing and light leakage between adjacent light emitting units 130, because part of light of light emitting unit 130 will pass through the area below black matrix 320 and will be absorbed by black matrix 320 or color filter layer 330, therefore, the utilization rate of light of light emitting unit 130 will be reduced.

[0046] Therefore, the refractive index of the first organic encapsulation layer 160 and the second organic encapsulation layer 170 is the same, the refractive index of the third organic encapsulation layer 200 is less than the refractive index of the first organic encapsulation layer 160 and the second organic encapsulation layer 170, so that the light emitted by light emitting unit 130 is refracted and produces total reflection at the interface between the second organic encapsulation layer 170 and the third organic encapsulation layer 200, thereby collecting the light emitted by light emitting unit 130, avoiding that the light emitted from light emitting unit 130 is absorbed by color filter layer 330 or black matrix 320, and improving the utilization rate of light. The refractive index of the first organic encapsulation layer 160 and the second organic encapsulation layer 170 is 1.6-1.8, the refractive index of the third organic encapsulation layer 200 is greater than 1.4 and less than 1.5.

[0047] As shown in Figure 5 The cross section of the third organic encapsulation layer 200 in the thickness direction of the substrate 110 is a trapezoidal structure, specifically, the partition structure 120 includes pixel definition layer 121, conductive layer 122 and insulating layer 123 stacked in sequence, the first inorganic encapsulation layer 140 forms spaced first encapsulation part 141 and second encapsulation part 142 on the insulating layer 123, a groove structure 300 is formed between the first encapsulation part 141, the insulating layer 123 and the second encapsulation part 142, the third organic encapsulation layer 200 includes first organic encapsulation part 210 and second organic encapsulation part 220 stacked in sequence, the first organic encapsulation part 210 is fitted in the groove structure 300, the lower surface of the first organic encapsulation part 210 is arranged in contact with part of the insulating layer 123, so that a surrounding structure encapsulation is formed at the partition structure 120 by the first encapsulation part 141, the first organic encapsulation part 210 and the second encapsulation part 142, which improves the encapsulation effect above the partition structure 120.

[0048] The second organic encapsulation portion 220 has a trapezoidal cross-section in the thickness direction of the substrate 110. The second organic encapsulation portion 220 includes a first inclined surface 221 and a second inclined surface 222 disposed opposite to each other. Figure 4 As shown in the figure, the arrows represent part of the emitted light from the light-emitting unit 130. When part of the emitted light from the light-emitting unit 130 reaches the first inclined surface 221 or the second inclined surface 222, it is refracted on the first inclined surface 221 or the second inclined surface 222. The refracted light is emitted from the light-emitting surface corresponding to the light-emitting unit 130, which can concentrate the light. Let the angle between the first inclined surface 221 and the horizontal plane and the angle between the second inclined surface 222 and the horizontal plane be α, where 60°≦α<90°. In this way, basically all the light that would have been absorbed by the filter layer above the partition structure 120 or by the black matrix 320 on the opposite side can be reflected back, which can maximize the light concentration effect.

[0049] like Figure 5 As shown, the first organic encapsulation portion 210 has an inverted trapezoidal cross-section in the thickness direction of the substrate 110. The second organic encapsulation portion 220 further includes a first bottom surface 223. The first organic encapsulation portion includes a first surface 224. The first bottom surface 223 is the long side of the trapezoidal second organic encapsulation portion 220, and the first surface 224 is the long side of the inverted trapezoidal first organic encapsulation portion 210. The first bottom surface 223 overlaps with the first surface 224. Along the direction of the arrangement of the partition structure 120, the width of the first bottom surface 223 is greater than the width of the first surface 224, that is, the first... A portion of the bottom surface 223 abuts against the first encapsulation portion 141 to form a first encapsulation surface 340, and a portion of the first bottom surface 223 abuts against the second encapsulation portion 142 to form a second encapsulation surface 350. In this way, the third organic encapsulation layer 200 not only forms a fitted encapsulation structure by the cooperation of the first organic encapsulation portion 210 with the first encapsulation portion 141 and the second encapsulation portion 142, but also further improves the encapsulation stability of the third organic encapsulation layer 200 by the cooperation of the first encapsulation surface 340 with the upper surface of the first encapsulation portion 141 and the second encapsulation surface 350 with the upper surface of the second encapsulation portion 142.

[0050] Figure 6 This is a schematic diagram of the process steps for manufacturing the display panel provided in this application, as shown below. Figure 6 As shown, this application also discloses a method for manufacturing a display panel 100, used for manufacturing the display panel 100 as described above, comprising the following steps:

[0051] S1: Provides a substrate;

[0052] S2: forming a plurality of pixel definition layers arranged at intervals on the substrate, a pixel opening being formed between two adjacent pixel definition layers;

[0053] S3: sequentially forming a conductive layer and an insulating layer on the pixel definition layer, the pixel definition layer, the conductive layer and the insulating layer forming a partition structure 120;

[0054] S4: forming a light emitting unit in the pixel opening;

[0055] S5: forming a first inorganic encapsulation layer above the light emitting unit and the partition structure;

[0056] S6: forming the first organic encapsulation layer on the first inorganic encapsulation layer between adjacent partition structures;

[0057] S7: forming a second organic encapsulation layer on the first organic encapsulation layer;

[0058] S8: etching the second organic encapsulation layer corresponding to the position of the partition structure to form a third encapsulation groove above the partition structure;

[0059] S9: forming a third organic encapsulation layer in the third encapsulation groove to form a display panel with completed encapsulation.

[0060] Wherein, etching is performed after forming the second organic encapsulation layer 170, so that the shape structure of the third organic encapsulation layer 200 printed by encapsulation meets the requirements of refraction. Of course, after the first organic encapsulation layer 160 is printed, the third organic encapsulation layer 200 can also be printed first, and the second organic encapsulation layer 170 can also be printed after the third organic encapsulation layer 200 is completed. Specifically, the printing speed of the third organic encapsulation layer 200 can be reduced, and an external heat source can be used to assist in curing during encapsulation printing.

[0061] Second embodiment:

[0062] Figure 7 The film layer structure schematic diagram of the display panel provided by the second embodiment of the present application is shown in Figure 7 As the second embodiment of the present application, the second embodiment is different from the first embodiment in that the cross-sectional structure of the second organic encapsulation part 220 in the thickness direction of the substrate 110 is an inverted trapezoidal structure, that is, the included angle between the first inclined surface 221 and the horizontal plane or the included angle a between the second inclined surface 222 and the horizontal plane is an obtuse angle, and the angle of the obtuse angle is: 90° < a < 120°. When the small-angle light emitted from the light emitting unit 130 reaches the first inclined surface 221 or the second inclined surface 222, refraction can also be performed, which plays a role in converging the light.

[0063] It should be noted that the definition of each step involved in the present scheme does not limit the order of the steps without affecting the implementation of the specific scheme, and the steps written in the front can be executed in advance, or executed later, or even executed at the same time, as long as the scheme can be implemented, it should be considered to belong to the protection scope of the present application.

[0064] It should be noted that the inventive concept of the present application can form a very large number of embodiments, but the length of the application file is limited and cannot be listed one by one, therefore, on the premise of not conflicting, the above described each embodiment or each technical feature can be combined to form a new embodiment, and the combination of each embodiment or technical feature will enhance the original technical effect.

[0065] The above is a further detailed description of the present application in combination with specific optional embodiments, and the specific implementation of the present application cannot be limited to these descriptions. For ordinary skilled persons in the art to which the present application belongs, without departing from the concept of the present application, a number of simple deductions or substitutions can be made, which should be considered to belong to the protection scope of the present application.

Claims

1. A display panel, comprising a substrate, a plurality of partition structures, and a plurality of light emitting units, the plurality of partition structures are arranged on the substrate in a spaced manner, a pixel opening is formed between any two adjacent partition structures, and the plurality of light emitting units are arranged in one-to-one correspondence in the pixel openings, characterized in that, The display panel further comprises a first inorganic encapsulation layer, a first organic encapsulation layer and a second organic encapsulation layer, the first inorganic encapsulation layer covers the side of the light emitting unit and the partition structure away from the substrate, the first organic encapsulation layer is arranged between two adjacent partition structures, and the second organic encapsulation layer is arranged on the side of the first organic encapsulation layer away from the substrate; the viscosity of the first organic encapsulation layer is lower than that of the second organic encapsulation layer. The display panel further comprises a third organic encapsulation layer, the number of the second organic encapsulation layers is multiple, and each second organic encapsulation layer is arranged between two adjacent partition structures; a third encapsulation groove is formed between the second organic encapsulation layers and the partition structures, and the third organic encapsulation layer is arranged in the third encapsulation groove; the refractive index of the first organic encapsulation layer and the second organic encapsulation layer is the same, and the refractive index of the third organic encapsulation layer is less than that of the first organic encapsulation layer and the second organic encapsulation layer.

2. The display panel of claim 1, wherein, A leveling area is formed between the two adjacent partition structures, the height of the horizontal plane where the upper surface of the first organic encapsulation layer is located is at least flush with the height of the horizontal plane where the upper surface of the leveling area is located, and the height of the horizontal plane where the upper surface of the first organic encapsulation layer is located is lower than the height of the horizontal plane where the upper surface of the partition structure is located.

3. The display panel of claim 2, wherein, The thickness of the first organic encapsulation layer is 1.5-4 microns, and the thickness of the second organic encapsulation layer is 4-10 microns.

4. The display panel of claim 1, wherein, The materials of the first organic encapsulation layer and the second organic encapsulation layer are both made of acrylic organic materials or epoxy organic materials.

5. The display panel of claim 1, wherein, The refractive index of the first organic encapsulation layer and the second organic encapsulation layer is 1.6-1.8, and the refractive index of the third organic encapsulation layer is greater than 1.4 and less than 1.

5.

6. The display panel of claim 5, wherein, The cross section of the third organic encapsulation layer in the thickness direction of the substrate is a trapezoidal structure.

7. The display panel of claim 5, wherein, The partition structure comprises a pixel definition layer, a conductive layer and an insulating layer stacked in sequence, the first inorganic encapsulation layer forms spaced first and second encapsulation parts on the insulating layer, a groove structure is formed between the first encapsulation part, the insulating layer and the second encapsulation part, the third organic encapsulation layer comprises first and second organic encapsulation parts stacked in sequence, and the first organic encapsulation part is fitted in the groove structure; wherein the cross section of the second organic encapsulation part in the thickness direction of the substrate is a right trapezoidal structure, the second organic encapsulation part comprises oppositely arranged first and second inclined surfaces, and the included angle between the first inclined surface and the horizontal plane and the included angle between the second inclined surface and the horizontal plane are both a, wherein 60°≦a<90°.

8. A method for manufacturing a display panel as defined in any one of claims 1 to 7, c h a r a c t e r i z e d b y The method comprises the steps of: providing a substrate; forming a plurality of spaced pixel definition layers on the substrate, and forming a pixel opening between two adjacent pixel definition layers; forming a conductive layer and an insulating layer on the pixel definition layer in sequence, and forming a partition structure by the pixel definition layer, the conductive layer and the insulating layer; forming a light emitting unit in the pixel opening; forming a first inorganic encapsulation layer above the light-emitting unit and the partition structure; forming the first organic encapsulation layer on the first inorganic encapsulation layer between adjacent partition structures; forming a second organic encapsulation layer on the first organic encapsulation layer; etching the second organic encapsulation layer at positions corresponding to the partition structures to form third encapsulation grooves above the partition structures; forming a third organic encapsulation layer in the third encapsulation grooves to form a completed display panel.

9. A display device comprising the display panel of any one of claims 1-7.

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