An RFID anti-counterfeiting label and its preparation method

Abstract

The present invention relates to the technical field of RFID tag, and particularly relates to an RFID anti-counterfeiting tag and a preparation method thereof, which include a base layer and a containing layer; the containing layer is arranged on the top of the base layer; an antenna groove and a chip groove are penetrated through the containing layer; the antenna groove is communicated with the chip groove; the top surface of the base layer is a rough surface; solders are filled between the antenna groove and the top surface of the base layer and between the chip groove and the top surface of the base layer; an RFID chip is arranged in the chip groove; and the RFID chip is connected with the solder. By providing the rough surface, the present invention enables the solder to adhere between the antenna groove, the chip groove and the rough surface, forms solid tin between the antenna groove, the chip groove and the rough surface, welds the RFID chip in the chip groove, and electrically conducts the pins of the RFID chip with the solid tin in the antenna groove, thereby effectively improving the production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of RFID tags, and particularly to an RFID anti-counterfeiting tag and a preparation method thereof. Background Art

[0002] The antenna preparation processes of existing RFID anti-counterfeiting tags are divided into a conductive ink printing process and a copper foil lithography process; the conductive ink printing process has high production efficiency, but due to the electrical performance limitations of the conductive ink, the signal attenuation of the obtained anti-counterfeiting tag is relatively large, and the remote reading and writing performance is poor; for the anti-counterfeiting tag obtained by the copper foil lithography process, since the antenna body is a metal with good conductivity, its signal attenuation is small and the performance is good, but the production process requires multiple process steps with high precision requirements such as gluing, exposure, development, drying, etching, and cleaning, resulting in low production efficiency and good product rate. Summary of the Invention

[0003] The purpose of the present invention is to provide an RFID anti-counterfeiting tag and a preparation method thereof for the above deficiencies in the prior art.

[0004] The purpose of the present invention is achieved through the following technical solutions: an RFID anti-counterfeiting tag includes a base layer and a containing layer; the containing layer is arranged on the top of the base layer; the containing layer is provided with an antenna groove and a chip groove in a penetrating manner; the antenna groove communicates with the chip groove; the top surface of the base layer is a rough surface; solder is filled between the antenna groove and the top surface of the base layer and between the chip groove and the top surface of the base layer; the chip groove is provided with an RFID chip; the RFID chip is connected to the solder.

[0005] The present invention is further provided that a release paper layer is arranged at the bottom of the base layer; a pattern printing layer is arranged at the top of the containing layer.

[0006] A preparation method of an RFID anti-counterfeiting tag includes the following steps:

[0007] S1. Provide a containing layer, and prepare an antenna groove and a chip groove in a penetrating manner on the containing layer, and the shape of the antenna groove is the same as the shape of the antenna;

[0008] S2. Provide a base layer, perform sandblasting treatment on the base layer so that the base layer forms a rough surface; attach one side of the containing layer to the rough surface;

[0009] S3. Provide an aluminum film layer, prepare a convex surface on the surface of the aluminum film layer, and the shape of the convex surface is the same as the shape formed by the combination of the antenna groove and the chip groove; form solid tin on the surface of the convex surface;

[0010] S4. Attach the aluminum film layer to the other side of the containing layer so that the convex surface is embedded into the antenna groove and the chip groove, and the solid tin abuts against the rough surface;

[0011] S5. Heat the solid tin on the convex surface to melt it into liquid tin, so that the liquid tin adheres between the antenna groove, the chip groove and the rough surface. After removing the aluminum film layer and cooling, solid tin is formed between the antenna groove, the chip groove and the rough surface.

[0012] S6. Heat the solid tin between the antenna groove, the chip groove and the rough surface to melt it into liquid tin, and place the RFID chip in the chip groove; cool the liquid tin between the antenna groove, the chip groove and the rough surface, so that the RFID chip is welded in the chip groove, and the pins of the RFID chip are electrically connected to the solid tin in the antenna groove.

[0013] The present invention is further configured that in step S1, preparing the antenna groove and the chip groove through the accommodating layer specifically includes the following steps:

[0014] A1. Attach the first release film to the surface of the accommodating layer.

[0015] A2. Pass the accommodating layer and the first release film through the first cutting roller, and the first cutting roller is provided with a first cutting tool, and the shape of the first cutting tool is the same as the combined shape of the antenna groove and the chip groove.

[0016] A3. Remove the first release film.

[0017] The present invention is further configured that in step S2, perform sandblasting on the base layer, control the sand particle diameter within the range of 0.25 mm - 0.6 mm, and control the compressed air pressure within the range of 0.4 MPa - 0.6 MPa; after sandblasting, control the surface roughness of the rough surface of the base layer within the range of 8 μm - 12.5 μm.

[0018] The present invention is further configured that in step S3, preparing the convex surface on the aluminum film layer specifically includes the following steps:

[0019] Pass the aluminum film layer through a rolling device, and the rolling device includes an upper pressing roller and a lower pressing roller; the upper pressing roller is provided with an upper pressing block; the upper pressing roller is provided with a lower pressing groove that cooperates with the upper pressing block; the shapes of the upper pressing block and the lower pressing groove are the same; the shape of the upper pressing block is the same as the combined shape of the antenna groove and the chip groove.

[0020] The present invention is further configured that in step S3, forming solid tin on the surface of the convex surface specifically includes the following steps:

[0021] Convey the aluminum film layer formed with the convex surface through the molten tin tank; when the convex surface passes through the molten tin tank, the top contacts the tin liquid surface, and the liquid tin adheres to the convex surface under the action of surface tension, and solid tin is formed along the convex surface after cooling.

[0022] The present invention is further configured that in step S5, after the aluminum film layer, the base layer, and the accommodating layer pass through the first turning roller and the second turning roller, the accommodating layer is disposed on top of the base layer and the aluminum film layer is disposed on top of the accommodating layer;

[0023] Through the heating of the heating channel, the solid tin on the convex surface melts to form liquid tin. The adhesion of the rough surface of the base layer to the liquid tin is greater than the adhesion of the convex surface of the aluminum film layer to the liquid tin; the liquid tin adheres between the antenna groove, the chip groove, and the rough surface under the action of gravity and surface tension. After removing the aluminum film layer and cooling, solid tin is formed between the antenna groove, the chip groove, and the rough surface.

[0024] The present invention is further configured that in step S6, a feeding film is provided, and a plurality of RFID chips are provided on the feeding film; the feeding film is attached to the other side of the accommodating layer, and the RFID chips are aligned with the chip grooves;

[0025] The feeding film, the base layer, and the accommodating layer are passed through a heating plate to melt the solid tin between the antenna groove, the chip groove, and the rough surface to form liquid tin;

[0026] The feeding film, the base layer, and the accommodating layer are passed through a cooling plate to cool the liquid tin between the antenna groove, the chip groove, and the rough surface, so that the RFID chips are welded in the chip grooves, and the pins of the RFID chips are electrically conducted with the solid tin in the antenna grooves; then the feeding film is removed.

[0027] The present invention is further configured to further include step S7: providing a pattern printing layer, attaching the pattern printing layer to the top of the accommodating layer; attaching a release paper layer to the bottom of the base layer; printing a label pattern on the printed pattern layer through a printing device, and after completion, performing cutting through a die-cutting device to obtain an RFID anti-counterfeiting label.

[0028] Advantages of the present invention: By providing a rough surface, the present invention enables the solder to adhere between the antenna groove, the chip groove, and the rough surface, forming solid tin between the antenna groove, the chip groove, and the rough surface, so that the RFID chips are welded in the chip grooves, and the pins of the RFID chips are electrically conducted with the solid tin in the antenna grooves, thereby effectively improving the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The invention is further described with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation to the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the following drawings.

[0030] Figure 1 is a schematic structural diagram of the present invention;

[0031] Figure 2It is the structural decomposition diagram of the present invention;

[0032] Figure 3 It is the schematic structural diagram of the present invention after the hidden pattern printing layer;

[0033] Figure 4 It is the process flow diagram of the present invention;

[0034] Figure 5 It is Figure 4 The partial enlarged view of part A in

[0035] Wherein: 1. Base layer; 2. Accommodating layer; 21. Antenna groove; 22. Chip groove; 23. RFID chip; 31. Release paper layer; 32. Pattern printing layer; 4. Aluminum film layer; 41. Convex surface; 5. First cutting roller; 51. First cutting tool; 52. First release film; 61. Upper pressure roller; 62. Lower pressure roller; 63. Upper pressure block; 64. Lower pressure groove; 65. Molten tin groove; 71. First turning roller; 72. Second turning roller; 73. Heating channel; 81. Heating plate; 82. Cooling plate; 83. Feeding film; 91. Printing device; 92. Die-cutting device. Specific embodiments

[0036] The present invention will be further described in conjunction with the following embodiments.

[0037] It is composed of Figures 1 to 3 It can be seen that an RFID anti-counterfeiting label described in this embodiment includes a base layer 1 and an accommodating layer 2; the accommodating layer 2 is arranged on the top of the base layer 1; the accommodating layer 2 is provided with an antenna groove 21 and a chip groove 22 penetrating through; the antenna groove 21 is communicated with the chip groove 22; the top surface of the base layer 1 is a rough surface; solder is filled between the antenna groove 21 and the top surface of the base layer 1 and between the chip groove 22 and the top surface of the base layer 1; the chip groove 22 is provided with an RFID chip 23; the RFID chip 23 is connected to the solder.

[0038] Specifically, for the RFID anti-counterfeiting label described in this embodiment, by setting the rough surface, the solder can adhere between the antenna groove 21, the chip groove 22 and the rough surface, forming solid tin between the antenna groove 21, the chip groove 22 and the rough surface, so that the RFID chip 23 is welded in the chip groove 22, and the pins of the RFID chip 23 are electrically conducted with the solid tin in the antenna groove 21, thereby effectively improving the production efficiency.

[0039] For an RFID anti-counterfeiting label described in this embodiment, a release paper layer 31 is arranged at the bottom of the base layer 1; a pattern printing layer 32 is arranged at the top of the accommodating layer 2.

[0040] It is composed of Figures 4 to 5It can be seen that a method for preparing an RFID anti-counterfeiting label according to this embodiment includes the following steps:

[0041] S1. Provide a containing layer 2, and penetrate and prepare an antenna groove 21 and a chip groove 22 on the containing layer 2. The shape of the antenna groove 21 is the same as the shape of the antenna.

[0042] S2. Provide a base layer 1, perform sandblasting on the base layer 1 so that the base layer 1 forms a rough surface; attach one side of the containing layer 2 to the rough surface.

[0043] S3. Provide an aluminum film layer 4, prepare a convex surface 41 on the surface of the aluminum film layer 4. The shape of the convex surface 41 is the same as the combined shape of the antenna groove 21 and the chip groove 22; form solid tin on the surface of the convex surface 41.

[0044] S4. Attach the aluminum film layer 4 to the other side of the containing layer 2 so that the convex surface 41 is embedded in the antenna groove 21 and the chip groove 22, and the solid tin abuts against the rough surface.

[0045] S5. Heat to melt the solid tin on the convex surface 41 to form liquid tin, so that the liquid tin adheres between the antenna groove 21, the chip groove 22 and the rough surface. After removing the aluminum film layer 4 and cooling, solid tin is formed between the antenna groove 21, the chip groove 22 and the rough surface.

[0046] S6. Heat to melt the solid tin between the antenna groove 21, the chip groove 22 and the rough surface to form liquid tin, and place the RFID chip 23 in the chip groove 22; cool the liquid tin between the antenna groove 21, the chip groove 22 and the rough surface, so that the RFID chip 23 is welded in the chip groove 22, and the pins of the RFID chip 23 are electrically connected to the solid tin in the antenna groove 21.

[0047] In the method for preparing an RFID anti-counterfeiting label according to this embodiment, in step S1, penetrating and preparing the antenna groove 21 and the chip groove 22 on the containing layer 2 specifically includes the following steps:

[0048] A1. Attach a first release film 52 to the surface of the containing layer 2.

[0049] A2. Pass the containing layer 2 and the first release film 52 through a first cutting roller 5. The first cutting roller 5 is provided with a first cutter 51, and the shape of the first cutter 51 is the same as the combined shape of the antenna groove 21 and the chip groove 22.

[0050] A3. Remove the first release film 52.

[0051] A method for preparing an RFID anti-counterfeiting label according to this embodiment. In step S2, the base layer 1 is subjected to sandblasting treatment, the diameter of the sand grains is controlled within the range of 0.25 mm - 0.6 mm, and the compressed air pressure is controlled within the range of 0.4 MPa - 0.6 MPa; after the sandblasting treatment, the surface roughness of the rough surface of the base layer 1 is controlled within the range of 8 μm - 12.5 μm.

[0052] A method for preparing an RFID anti-counterfeiting label according to this embodiment. In step S3, preparing a convex surface 41 on the surface of the aluminum film layer 4 specifically includes the following steps:

[0053] The aluminum film layer 4 is passed through a rolling device, and the rolling device includes an upper pressing roller 61 and a lower pressing roller 62; the upper pressing roller 61 is provided with an upper pressing block 63; the upper pressing roller 61 is provided with a lower pressing groove 64 that cooperates with the upper pressing block 63; the shapes of the upper pressing block 63 and the lower pressing groove 64 are the same; the shape of the upper pressing block 63 is consistent with the shape formed by the combination of the antenna groove 21 and the chip groove 22.

[0054] A method for preparing an RFID anti-counterfeiting label according to this embodiment. In step S3, forming solid tin on the surface of the convex surface 41 specifically includes the following steps:

[0055] The aluminum film layer 4 forming the convex surface 41 is conveyed through a molten tin tank 65; when the convex surface 41 passes through the molten tin tank 65, the top contacts the tin liquid surface, and the liquid tin adheres to the convex surface 41 under the action of surface tension, and forms solid tin distributed along the convex surface 41 after cooling.

[0056] A method for preparing an RFID anti-counterfeiting label according to this embodiment. In step S5, after the aluminum film layer 4, the base layer 1, and the accommodating layer 2 pass through the first turning roller 71 and the second turning roller 72, the accommodating layer 2 is disposed on top of the base layer 1 and the aluminum film layer 4 is disposed on top of the accommodating layer 2;

[0057] Through the heating of the heating channel 73, the solid tin on the convex surface 41 melts to form liquid tin. The adhesion of the rough surface of the base layer 1 to the liquid tin is greater than the adhesion of the convex surface 41 of the aluminum film layer 4 to the liquid tin; the liquid tin adheres between the antenna groove 21, the chip groove 22, and the rough surface under the action of gravity and surface tension. After removing the aluminum film layer 4 and cooling, solid tin is formed between the antenna groove 21, the chip groove 22, and the rough surface.

[0058] A method for preparing an RFID anti-counterfeiting label according to this embodiment. In step S6, a feeding film 83 is provided, and a plurality of RFID chips 23 are provided on the feeding film 83; the feeding film 83 is attached to the other side of the accommodating layer 2, and the RFID chips 23 are aligned with the chip grooves 22;

[0059] Pass the feeding film 83, the base layer 1 and the accommodating layer 2 through the heating plate 81 to melt the solid tin between the antenna groove 21, the chip groove 22 and the rough surface to form liquid tin;

[0060] Pass the feeding film 83, the base layer 1 and the accommodating layer 2 through the cooling plate 82 to cool the liquid tin between the antenna groove 21, the chip groove 22 and the rough surface, so that the RFID chip 23 is welded in the chip groove 22, and the pins of the RFID chip 23 are electrically connected to the solid tin in the antenna groove 21; then remove the feeding film 83.

[0061] A method for preparing an RFID anti-counterfeiting label according to this embodiment further includes step S7: providing a pattern printing layer 32, attaching the pattern printing layer 32 to the top of the accommodating layer 2; attaching the release paper layer 31 to the bottom of the base layer 1; printing a label pattern on the printed pattern layer through a printing device 91, and after completion, performing cutting through a die-cutting device 92 to obtain the RFID anti-counterfeiting label.

[0062] Specifically, in this embodiment, a convex surface 41 with a shape consistent with the combination of the antenna groove 21 and the chip groove 22 and a cross-sectional size slightly smaller than the combination shape of the antenna groove 21 and the chip groove 22 is formed by pressing on the aluminum film layer 4; when the convex surface 41 passes through the tin melting tank 65, the top contacts the tin liquid surface, and the liquid tin adheres to the convex surface 41 under the action of surface tension, and forms solid tin distributed along the convex surface 41 after cooling; the aluminum film layer 4 with adhered tin is film-bonded to the accommodating layer 2, so that the convex surface 41 is embedded in the antenna groove 21 and the chip groove 22, and the solid tin abuts against the base film layer; heating to melt the tin, the adhesion of the frosted surface of the base film layer after sandblasting treatment to the liquid tin is greater than the adhesion of the convex surface 41 of the aluminum film layer 4 to the liquid tin; the liquid tin adheres to the antenna groove 21 and the chip groove 22 under the action of gravity and surface tension, and after removing the aluminum film layer 4, the liquid tin remains in the antenna groove 21 and the chip groove 22; heating the accommodating groove to keep the tin in a molten state, and attaching the RFID chip 23 to the accommodating groove, and after cooling, an antenna made of tin with a shape consistent with the antenna groove 21 is obtained in the antenna, and the RFID chip 23 is also electrically connected to the antenna; the RFID anti-counterfeiting label is obtained after printing and die-cutting.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the protection scope of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A method for preparing an RFID anti-counterfeiting label, characterized in that: The RFID anti-counterfeiting label comprises a base layer and a containing layer; the containing layer is arranged on the top of the base layer; the containing layer is provided with an antenna slot and a chip slot; the antenna slot is connected with the chip slot; the top surface of the base layer is a rough surface; solder is filled between the antenna slot and the top surface of the base layer and between the chip slot and the top surface of the base layer; the chip slot is provided with an RFID chip; the RFID chip is connected with the solder; a release paper layer is provided at the bottom of the base layer; a pattern printing layer is provided on the top of the containing layer; The following steps are also included: S1. Provide a receiving layer, and penetrate and prepare an antenna slot and a chip slot on the receiving layer, wherein the shape of the antenna slot is consistent with the shape of the antenna; S2, providing a base layer, and performing sandblasting on the base layer so that the base layer has a rough surface; and laminating one side of the accommodation layer to the rough surface; S3, providing an aluminum film layer, preparing a convex surface on the surface of the aluminum film layer, the shape of the convex surface being consistent with the combined shape of the antenna slot and the chip slot; forming solid tin on the surface of the convex surface; S4, attaching the aluminum film layer to the other side of the accommodation layer, so that the convex surface is embedded in the antenna slot and the chip slot, and the solid tin is against the rough surface; S5, heating to melt the solid tin on the convex surface to form liquid tin, so that the liquid tin adheres to the antenna slot, the chip slot and the rough surface, and cooling after removing the aluminum film layer to form solid tin between the antenna slot, the chip slot and the rough surface; S6, heating to melt the solid tin between the antenna slot, the chip slot and the rough surface to form liquid tin, and placing the RFID chip in the chip slot; cooling the liquid tin between the antenna slot, the chip slot and the rough surface, so that the RFID chip is welded in the chip slot, and the pins of the RFID chip are electrically connected to the solid tin in the antenna slot; In step S3, forming solid tin on the surface of the convex surface specifically includes the following steps: The aluminum film layer forming the convex surface is transported through the molten tin tank; when the convex surface passes through the molten tin tank, the top of the convex surface contacts the tin liquid surface, and the liquid tin adheres to the convex surface under the action of surface tension, and after cooling, solid tin distributed along the convex surface is formed.

2. The method for preparing an RFID anti-counterfeit label according to claim 1, characterized in that: In step S1, the preparation of antenna slots and chip slots through the accommodation layer specifically includes the following steps: A1. Laminating a first release film on the surface of the accommodation layer; A2, passing the accommodation layer and the first release film through a first cutting roller, wherein the first cutting roller is provided with a first cutter, and the shape of the first cutter is consistent with the shape of the combination of the antenna slot and the chip slot; A3. Remove the first release film.

3. The method for preparing an RFID anti-counterfeiting label according to claim 1, characterized in that: In step S2, the base layer is sandblasted, the diameter of the sand particles is controlled within the range of 0.25 mm-0.6 mm, and the compressed air pressure is controlled within the range of 0.4 MPa-0.6 MPa; after the sandblasting, the surface roughness of the rough surface of the base layer is controlled within the range of 8 um-12.5 um.

4. The method for preparing an RFID anti-counterfeit label according to claim 1, characterized in that: In step S3, preparing a convex surface on the surface of the aluminum film layer specifically includes the following steps: The aluminum film layer passes through a rolling device, which includes an upper pressing roller and a lower pressing roller; the upper pressing roller is provided with an upper pressing block; the upper pressing roller is provided with a lower pressing groove cooperating with the upper pressing block; the shape of the upper pressing block is the same as the shape of the lower pressing groove; the shape of the upper pressing block is consistent with the shape of the combination of the antenna groove and the chip groove.

5. The method for preparing an RFID anti-counterfeit label according to claim 1, characterized in that: In step S5, the aluminum film layer, the base layer and the accommodation layer are passed through a first turning roller and a second turning roller, so that the accommodation layer is disposed on top of the base layer and the aluminum film layer is disposed on top of the accommodation layer; The solid tin on the convex surface is melted to form liquid tin through heating in the heating channel, and the adhesion of the rough surface of the base layer to the liquid tin is greater than the adhesion of the convex surface of the aluminum film layer to the liquid tin; the liquid tin adheres to the antenna slot, the chip slot and the rough surface under the action of gravity and surface tension, and after the aluminum film layer is removed, cooling forms solid tin between the antenna slot, the chip slot and the rough surface.

6. The method for preparing an RFID anti-counterfeiting label according to claim 1, characterized in that: In step S6, a feed film is provided, on which a plurality of RFID chips are arranged; the feed film is attached to the other side of the receiving layer, and the RFID chip is aligned with the chip slot; The feeding film, the base layer and the accommodation layer are passed through a heating plate to melt the solid tin between the antenna slot, the chip slot and the rough surface to form liquid tin; The feeding film, the base layer and the accommodation layer are passed through a cooling plate to cool the liquid tin between the antenna slot, the chip slot and the rough surface, so that the RFID chip is welded in the chip slot, and the pins of the RFID chip are electrically connected with the solid tin in the antenna slot; then the feeding film is removed.

7. The method for preparing an RFID anti-counterfeit label according to claim 1, characterized in that: The step S7 is also included: providing a pattern printing layer, and attaching the pattern printing layer to the top of the accommodation layer; attaching the release paper layer to the bottom of the base layer; printing a label pattern on the printed pattern layer by a printing device, and after completion, cutting it by a die-cutting device to obtain an RFID anti-counterfeiting label.

Images