A semiconductor wafer carrier device

Abstract

The present invention provides a semiconductor wafer supporting device, belonging to the technical field of semiconductor processing, including a cleaning tank, the cleaning tank is connected with a drain pipe, a motor, a water inlet pipe and a sealing baffle, a filter plate and a drainage plate are arranged inside the cleaning tank, and further includes: a pressing assembly, which fixes the wafer through its own movement; a supporting assembly, which further improves the protection and positioning of the wafer by means of the assistance of the pressing assembly. The beneficial effects of this invention are as follows: through the interaction and cooperation of the supporting assembly and the pressing assembly, the overall fixation of the wafer can be completed. At the same time, during the cleaning process, slight shaking of the wafer itself can be realized, so as to increase the directly cleaned area, ensure the removal of impurities attached to the surface of the wafer while increasing the effect, and after the cleaning is completed, the moisture on the surface of the wafer can be quickly removed through the action of centrifugal force, thus effectively avoiding the generation of water marks and improving the production quality.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular, to a semiconductor wafer supporting device. Background Art

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystal silicon. The silicon ingot is ground, polished, and sliced to form a wafer. Due to the characteristic that the wafer's electrical or optical properties will change under the influence of gas molecules, it needs to be processed in a vacuum environment.

[0003] During the production and processing of wafers, it is necessary to pickle their surfaces. Some existing wafer pickling devices mainly consist of a tank body, a flower basket, a liquid inlet mechanism, and a liquid outlet mechanism. When in use, an acidic solution is injected into the tank body through the liquid inlet mechanism. Then, the flower basket loaded with several wafers is placed at the bottom of the tank body, so that the acidic solution in the tank body completely submerges the wafers. After a period of time, the liquid outlet mechanism discharges the acidic solution in the tank body and removes the flower basket. Through the above operations, the acidic solution contacts and reacts with the impurities on the wafer surface, causing the impurities to dissolve or desorb, thereby ensuring the purification degree of the wafers. However, during the wafer pickling process, due to the mutual friction between the wafers or the friction with the supporting device, small scratches are easily generated on the wafer surface. However, these scratches not only affect the surface quality of the wafers but may also be a potential cause of chip failure. Traditional supporting devices do not fully consider the need to reduce friction in their designs, resulting in the wafers being easily mechanically damaged during the cleaning process. Moreover, the bottom of the tank body of the supporting device may cause the desorbed impurities to deposit, and since they are not discharged in time, the part of the wafer at the bottom of the supporting device is still in contact with the above impurities, so that after the subsequent acidic solution is discharged, some impurities still adhere to the wafers, thus affecting the purification degree of the wafers; how to invent a semiconductor wafer supporting device to solve these problems has become an urgent problem for those skilled in the art. Summary of the Invention

[0004] To make up for the above deficiencies, the present invention provides a semiconductor wafer supporting device, aiming to solve the problems that small scratches are easily generated on the wafer surface due to the friction between the wafers or with the supporting device, affecting the surface quality of the wafers, and the deposition and adhesion of impurities.

[0005] The present invention is implemented as follows:

[0006] The present invention provides a semiconductor wafer supporting device, including a cleaning tank, the cleaning tank is connected with a drain pipe, a motor, a water inlet pipe, and a sealing baffle. A filter plate and a drainage plate are provided inside the cleaning tank, and further includes:

[0007] A pressing component, which is located inside the cleaning box, and the pressing component fixes the wafer by its own movement;

[0008] A supporting component, which is located inside the cleaning box, and the supporting component further improves the protection and positioning of the wafer with the assistance of the pressing component.

[0009] Preferably, the inner wall of the bottom end of the cleaning box is fixedly connected with a drainage plate, and the drainage plate has a certain angle with the bottom end of the cleaning box. The inner wall of the cleaning box is fixedly connected with a filter plate, and the filter plate is located on one side of the lower end of the drainage plate.

[0010] Preferably, the side wall of the cleaning box is fixedly connected with a drain pipe, and the drain pipe is located on one side of the filter plate. The upper end of the cleaning box is fixedly connected with a water inlet pipe, and a spraying pipe is fixedly connected to the end of the water inlet pipe inside the cleaning box. The side wall of the cleaning box is fixedly connected with a motor, and the front end of the cleaning box is rotatably connected with a sealing baffle.

[0011] Preferably, the pressing component includes a pressing frame. The inner side wall of the pressing frame is fixedly connected with a fixing plate, and the fixing plate is arranged in an "Ω" shape. The pressing frame is fixedly connected with a protective sheet, and the protective sheet is located on one side of the fixing plate. The two ends of the pressing frame are slidably connected with movable rods, and a moving plate is fixedly connected to the outer wall of the movable rods. The moving plate is arranged in an arc shape.

[0012] Preferably, the pressing component further includes a convex block and a return spring. The convex block is arranged in a hemispherical shape, and the convex block is fixedly connected to one end of the movable rod. The return spring is sleeved on the outer wall of one end of the movable rod, and the two ends of the return spring are respectively fixedly connected to the side wall of the convex block and the side wall of the pressing frame.

[0013] Preferably, the supporting component includes a supporting plate. A plurality of uniformly distributed placing grooves are formed in the inner side wall of the supporting plate. A plurality of groups of uniformly distributed airbag telescopic tubes and connecting tubes are arranged inside the supporting plate. The two ends of the connecting tube are respectively fixedly connected to the outer wall of the airbag telescopic tube and the inner side wall of the supporting plate. Each group of the airbag telescopic tubes and the connecting tubes has three, and each group of the airbag telescopic tubes and the connecting tubes is located in the middle of two adjacent placing grooves. A wafer is arranged inside the placing groove.

[0014] Preferably, the supporting plate is arranged in an arc shape. Expansion frames are fixedly connected to both sides of the supporting plate. An airbag pad is fixedly connected inside the expansion frame. Water flow groove holes are formed in the outer wall of the supporting plate, and the water flow groove holes are communicated with the placing grooves. Protective strips are fixedly connected to the inner wall of the placing grooves.

[0015] Preferably, ventilation slot holes corresponding to a plurality of groups of airbag telescopic tubes and connecting tubes are formed on both sides of the supporting plate. A diversion cavity is formed inside the supporting plate. The diversion cavity communicates with one end of the ventilation slot holes. The other end of the ventilation slot holes communicates with the airbag pad. A docking hole is formed on the inner wall of the diversion cavity, and the docking hole is connected to the lower end of the connecting tube.

[0016] Preferably, the supporting assembly further includes a rotating plate and an electric telescopic rod. One end of the electric telescopic rod is fixedly connected to the side wall of the rotating plate, and the other end of the electric telescopic rod is fixedly connected to the pressing frame. There are two rotating plates, and the two rotating plates are respectively fixedly connected to both ends of the supporting plate. A rotating column is fixedly connected to the side wall of the rotating plate. One end of one of the rotating columns penetrates the side wall of the cleaning box and is fixedly connected to the motor. A fixed cylinder is rotatably connected to the outer wall of the other rotating column. A groove is formed on the side wall of one of the rotating plates, and three extrusion strips distributed in a circumferential array are fixedly connected to the inner wall of the groove.

[0017] Preferably, the outer wall of the fixed cylinder is fixedly connected to the side wall of the cleaning box away from the motor. A hollow column is fixedly connected to the outer wall of the fixed cylinder. An expansion plate and an expansion spring are arranged inside the hollow column. Two ends of the expansion spring are respectively fixedly connected to the inner wall of the hollow column and one side wall of the expansion plate. A chamfer is formed at the corner of the other end of the expansion plate, and the expansion plate is slidably connected to the inner wall of the hollow column.

[0018] The beneficial effects of the present invention are as follows:

[0019] During the process of supporting and cleaning the wafer, first, both ends of the airbag telescopic tube are used to initially resist both sides of the wafer inside the placement groove, so as to avoid direct contact between the surface of the wafer and the inner wall of the placement groove, thereby avoiding frictional damage to the surface of the wafer by the supporting plate. Then, through the downward movement of the pressing frame, the two ends of the airbag telescopic tube are expanded to achieve buffering and positioning of the wafer. At the same time, during the cleaning process, the motor drives the rotating plate to rotate, so that the expansion plate periodically impacts the rotating plate. Through the vibration effect, slight shaking of the wafer itself is realized, thereby changing the position where part of the cleaning liquid directly flushes the surface of the wafer, so as to expand the flushing area, increase the cleaning effect, and ensure the removal of impurities attached to the surface of the wafer. And after the cleaning is completed, through the action of centrifugal force, the moisture on the surface of the wafer can be quickly removed, thereby effectively avoiding the generation of water marks and improving the production quality. Description of the Drawings

[0020] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0021] Figure 1 is a schematic diagram of the overall structure of a semiconductor wafer supporting device provided by an embodiment of the present invention;

[0022] Figure 2 is a schematic diagram of the internal structure of a cleaning tank of a semiconductor wafer supporting device provided by an embodiment of the present invention;

[0023] Figure 3 is a schematic diagram of the top structure of a cleaning tank of a semiconductor wafer supporting device provided by an embodiment of the present invention;

[0024] Figure 4 is a schematic diagram of the structure of a pressing component and a supporting component of a semiconductor wafer supporting device provided by an embodiment of the present invention;

[0025] Figure 5 is a schematic diagram of the structure of a pressing component of a semiconductor wafer supporting device provided by an embodiment of the present invention;

[0026] Figure 6 is a partial cross-sectional view of a supporting component of a semiconductor wafer supporting device provided by an embodiment of the present invention;

[0027] Figure 7 is a schematic cross-sectional view of a supporting plate of a semiconductor wafer supporting device provided by an embodiment of the present invention;

[0028] Figure 8 is a schematic diagram of a wafer clamping structure of a semiconductor wafer supporting device provided by an embodiment of the present invention.

[0029] In the figure: 1. Cleaning tank; 2. Drain pipe; 3. Motor; 4. Water inlet pipe; 41. Spraying pipe; 5. Sealing baffle; 6. Pressing assembly; 61. Pressing frame; 62. Convex block; 63. Fixed plate; 64. Moving plate; 65. Movable rod; 66. Return spring; 67. Protective piece; 7. Supporting assembly; 71. Rotating plate; 7101. Extrusion strip; 7102. Groove; 7103. Fixed cylinder; 7104. Hollow column; 7105. Telescopic plate; 7106. Telescopic spring; 72. Electric telescopic rod; 73. Airbag pad; 74. Expansion frame; 75. Water chute hole; 76. Supporting plate; 761. Ventilation chute hole; 762. Shunt cavity; 77. Placing groove; 78. Airbag telescopic pipe; 781. Connecting pipe; 782. Docking hole; 79. Protective strip; 8. Filter plate; 9. Drainage plate; 10. Rotating column; 11. Wafer. Detailed implementation mode

[0030] To make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0031] Example 1. Refer to Figures 1 - 8 , a semiconductor wafer supporting device, including a cleaning tank 1, the cleaning tank 1 is connected with a drain pipe 2, a motor 3, a water inlet pipe 4 and a sealing baffle 5, a filter plate 8 and a drainage plate 9 are arranged inside the cleaning tank 1, and further includes:

[0032] A pressing assembly 6, the pressing assembly 6 is located inside the cleaning tank 1, and the pressing assembly 6 fixes the wafer by its own movement;

[0033] A supporting assembly 7, the supporting assembly 7 is located inside the cleaning tank 1, and the supporting assembly 7 further improves the protection and positioning of the wafer with the assistance of the pressing assembly 6.

[0034] Furthermore; the inner wall of the bottom end of the cleaning tank 1 is fixedly connected with the drainage plate 9, the drainage plate 9 has a certain angle with the bottom end of the cleaning tank 1, the inner wall of the cleaning tank 1 is fixedly connected with the filter plate 8, and the filter plate 8 is located on one side of the lower end of the drainage plate 9; the side wall of the cleaning tank 1 is fixedly connected with the drain pipe 2, the drain pipe 2 is located on one side of the filter plate 8, the upper end of the cleaning tank 1 is fixedly connected with the water inlet pipe 4, one end of the water inlet pipe 4 located inside the cleaning tank 1 is fixedly connected with a spraying pipe 41, the side wall of the cleaning tank 1 is fixedly connected with the motor 3, and the front end of the cleaning tank 1 is rotatably connected with the sealing baffle 5.

[0035] It should be noted that: after the wafer 11 is fixed, when cleaning, the water inlet pipe 4 is connected to the external conveying pipeline, and the chemical cleaning solution or deionized water is conveyed into the interior of the water inlet pipe 4 by pumping with a water pump. Then, the wafer 11 is sprayed through the spraying pipe 41. The lower end of the spraying pipe 41 is provided with a plurality of nozzles, which can increase the spraying range, ensure the uniformity of spraying, and improve the processing efficiency. In addition, during the spraying process, the rinsed liquid will drip to the lower end of the cleaning tank 1, and the rinsing liquid is collected on one side of the filter plate 8 through the action of the diversion plate 9. In this way, not only can the accumulation of liquid in the cleaning tank 1 be reduced, but also the rinsing liquid can be quickly discharged through the filtration of the filter plate 8, thereby effectively improving the filtration speed. After multiple filtrations, the metal impurities intercepted by the filter plate 8 inside the cleaning tank 1 can be collected for subsequent utilization, thus effectively saving resources and reducing production costs;

[0036] In addition, a transparent observation window is provided on the side wall of the sealing baffle 5, through which the cleaning process can be timely understood, so as to make corresponding treatments according to the processing conditions.

[0037] Refer to Figures 4 - 8 , further; the pressing assembly 6 includes a pressing frame 61. The inner side wall of the pressing frame 61 is fixedly connected with a fixing plate 63. The fixing plate 63 is arranged in an "Ω" shape. The pressing frame 61 is fixedly connected with a protective piece 67. The protective piece 67 is located on one side of the fixing plate 63. The two ends of the pressing frame 61 are slidably connected with movable rods 65. A moving plate 64 is fixedly connected to the outer wall of the movable rod 65. The moving plate 64 is arranged in an arc shape;

[0038] It should be noted that:

[0039] Auxiliary positioning: In the initial state, the pressing frame 61 is located directly above the supporting plate 76, and there is a certain distance between the pressing frame 61 and the supporting plate 76. The distance and gap between the two are sufficient for the wafer 11 to be freely taken and placed. Before cleaning the wafer 11, first open the sealing baffle 5, place the wafer 11 in the placement groove 77, and then control the mobile end of the electric telescopic rod 72 to contract, thereby driving the pressing frame 61 and the fixing plate 63 to move downward. At the same time, the fixing plate 63 will gradually squeeze the airbag pad 73, so as to inflate the airbag telescopic tube 78, thereby completing the auxiliary positioning function. The protective piece 67 is made of rubber material, which can protect the outer wall of the wafer 11 and reduce the damage to the wafer 11 during cleaning. Protective layers are provided on the surfaces of the fixing plate 63 and the moving plate 64 to avoid pinching the wafer during the fixing process.

[0040] Further, the pressing component 6 further includes a bump 62 and a return spring 66. The bump 62 is arranged in a hemispherical shape. The bump 62 is fixedly connected to one end of the movable rod 65. The return spring 66 is sleeved on the outer wall of one end of the movable rod 65. The two ends of the return spring 66 are respectively fixedly connected to the side wall of the bump 62 and the side wall of the pressing frame 61.

[0041] It should be noted that: during the downward movement of the pressing frame 61, the bump 62 and the movable rod 65 will be driven to move downward synchronously. During the gradual downward movement, through the mutual extrusion and sliding between the chamfer on the side wall of the rotating plate 71 and the bump 62, the return spring 66 is compressed, and the movable rod 65 and the moving plate 64 are driven to move toward the fixed plate 63. When the bump 62 and the chamfer are separated and mutually extruded with the side wall of the rotating plate 71, at this moment, the movable rod 65 moves to the final end, and the upper end of the wafer 11 is fixed through the mutual cooperation of the moving plate 64 and the fixed plate 63. Therefore, in this way, the positioning of the supporting component 7 can be effectively assisted to avoid the shaking of the wafer 11 during the processing and reduce the damage during flushing.

[0042] Further, the supporting component 7 includes a supporting plate 76. A plurality of uniformly distributed placing grooves 77 are formed in the inner side wall of the supporting plate 76. A plurality of groups of uniformly distributed airbag expansion tubes 78 and connecting tubes 781 are arranged inside the supporting plate 76. The two ends of the connecting tube 781 are respectively fixedly connected to the outer wall of the airbag expansion tube 78 and the inner side wall of the supporting plate 76. Each group of airbag expansion tubes 78 and connecting tubes 781 has three. Each group of airbag expansion tubes 78 and connecting tubes 781 is located in the middle of two adjacent placing grooves 77. The wafer 11 is arranged inside the placing groove 77. The supporting plate 76 is arranged in an arc shape. Expansion frames 74 are fixedly connected to both sides of the supporting plate 76. An airbag pad 73 is fixedly connected inside the expansion frame 74. A water flow groove hole 75 is formed in the outer wall of the supporting plate 76. The water flow groove hole 75 is communicated with the placing groove 77. A protective strip 79 is fixedly connected to the inner wall of the placing groove 77. Venting groove holes 761 corresponding to a plurality of groups of airbag expansion tubes 78 and connecting tubes 781 are formed on both sides of the supporting plate 76. A flow dividing cavity 762 is formed inside the supporting plate 76. The flow dividing cavity 762 is communicated with one end of the venting groove hole 761. The other end of the venting groove hole 761 is communicated with the airbag pad 73. A butting hole 782 is formed in the inner wall of the flow dividing cavity 762. The butting hole 782 is connected to the lower end of the connecting tube 781.

[0043] It should be noted that during the downward movement of the pressing frame 61, due to the extrusion of the airbag pad 73 by the fixing plate 63, the gas inside the airbag pad 73 will be evenly delivered to the inside of the diversion cavity 762 through the ventilation groove holes 761. As the airbag pad 73 is continuously extruded, the gas will be delivered to the inside of each airbag telescopic tube 78 through the docking holes 782 and the connecting tube 781. The two ends of the airbag telescopic tube 78 are telescopic. Therefore, when the gas enters the inside, the two ends of the airbag telescopic tube 78 will expand, and the positioning and protection of the lower end of the wafer 11 will be completed through the cooperation of two corresponding airbag telescopic tubes 78.

[0044] In addition, the two ends of the airbag telescopic tube 78 protrude into the placement groove 77 in the initial state. The advantage of this is that when the wafer 11 is placed in the placement groove 77, the two ends of the wafer 11 can be resisted to avoid the direct contact between the surface of the wafer 11 and the inner wall of the placement groove 77, thereby avoiding the frictional damage to the surface of the wafer 11 by the supporting plate 76. In this way, the supporting and positioning of the wafer 11 are completed through the mutual cooperation of the supporting component 7 and the pressing component 6, so as to reduce the shaking during the cleaning process. At the same time, through the support of the rubber protection strip 79 for the lower end of the wafer 11, the collision of the wafer 11 can be effectively avoided, and further the protection of the wafer 11 is increased.

[0045] Cleaning and dehydration: After the wafer 11 is fixed, start the motor 3 to drive the supporting component 7 and the pressing component 6 to rotate inside the cleaning tank 1 through the rotating column 10, and at the same time cooperate with the sprayed liquid to realize the flushing of the wafer 11. The flushing in the rotating mode can improve the cleaning efficiency, reduce the attachment of impurities on the wafer surface through the water flow impact in different directions, and the setting of the water trough holes 75 can avoid the accumulation of the flushing liquid inside the supporting plate 76 to ensure the cleaning degree, so as to avoid the attachment of impurities in the placement groove 77 and cause damage to the wafer surface during the next cleaning. In addition, after the cleaning is completed, the rotation of the supporting component 7 and the pressing component 6 can be continuously maintained, and the water stains on the wafer surface can be accelerated to be thrown out through the centrifugal action, so as to quickly complete the drying of the wafer after cleaning and avoid the phenomenon of water marks on the wafer surface caused by the slow flow of the liquid.

[0046] Example 2, refer to Figure 4 and Figure 6, the supporting component 7 further includes a rotating plate 71 and an electric telescopic rod 72. One end of the electric telescopic rod 72 is fixedly connected to the side wall of the rotating plate 71, and the other end of the electric telescopic rod 72 is fixedly connected to the pressing frame 61. There are two rotating plates 71, and the two rotating plates 71 are respectively fixedly connected to both ends of the supporting plate 76. A rotating column 10 is fixedly connected to the side wall of the rotating plate 71. One end of one rotating column 10 penetrates through the side wall of the cleaning tank 1 and is fixedly connected to the motor 3, and the outer wall of the other rotating column 10 is rotatably connected to a fixed cylinder 7103. A groove 7102 is formed in the side wall of one of the rotating plates 71, and three extrusion strips 7101 distributed in a circumferential array are fixedly connected to the inner wall of the groove 7102;

[0047] It should be noted that: during the rotation of the rotating column 10 driven by the motor 3, the extrusion strip 7101 will be driven to rotate synchronously. The extrusion strip 7101 is set as an arc with one end large and one end small in order to better slide with the chamfer at one end of the telescopic plate 7105 during the movement process, so as to realize the extrusion of the telescopic plate 7105 and make the telescopic spring 7106 start to store energy.

[0048] Furthermore; the outer wall of the fixed cylinder 7103 is fixedly connected to the side wall of the end of the cleaning tank 1 away from the motor 3. A hollow column 7104 is fixedly connected to the outer wall of the fixed cylinder 7103. A telescopic plate 7105 and a telescopic spring 7106 are arranged inside the hollow column 7104. Both ends of the telescopic spring 7106 are respectively fixedly connected to the inner wall of the hollow column 7104 and the side wall of one end of the telescopic plate 7105. A chamfer is formed at the corner of the other end of the telescopic plate 7105, and the telescopic plate 7105 is slidably connected to the inner wall of the hollow column 7104.

[0049] It should be noted that: during the process of the extrusion strip 7101 gradually extruding the telescopic plate 7105, the telescopic spring 7106 is simultaneously compressed, and the telescopic plate 7105 is contracted into the interior of the hollow column 7104. At the moment when the extrusion strip 7101 is separated from the telescopic plate 7105, the telescopic spring 7106 is no longer extruded and starts to recover elastically. Due to the instantaneous explosion of the elastic potential energy, the telescopic plate 7105 will impact the rotating plate 71, and then the vibration will be transmitted to the supporting plate 76 through the rotating plate 71, causing the clamped wafer 11 to vibrate slightly, so as to change the partial position where the water flow impacts the surface of the wafer 11, making the cleaning liquid and the original partial flushing position of the wafer 11 misaligned with each other, thereby expanding the directly cleaned area, improving the flushing effect. At the same time, due to the vibration effect, the adhesion of impurities on the surface of the wafer 11 can be further reduced, thereby improving the cleaning degree. Through the mutual cooperation of the above working process, the cleaning efficiency and cleaning intensity are effectively increased, and the damage and production cost of the wafer are reduced, improving the production efficiency; the rotating plate 71, the telescopic plate 7105 and the supporting plate 76 are all made of materials with relatively hard and good vibration transmission effects.

[0050] It should be noted that the specific model and specification of the motor need to be selected according to the actual specifications of the device, etc. The specific selection calculation method adopts the existing technology in the field, so it will not be elaborated in detail.

[0051] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A semiconductor wafer supporting device, comprising a cleaning tank (1), wherein the cleaning tank (1) is connected with a drain pipe (2), a motor (3), a water inlet pipe (4) and a sealing baffle (5), and a filter plate (8) and a diversion plate (9) are arranged inside the cleaning tank (1), characterized in that, It further includes: A pressing component (6), which is located inside the cleaning tank (1), and the pressing component (6) fixes the wafer by its own movement; A supporting component (7), which is located inside the cleaning tank (1), and the supporting component (7) further improves the protection and positioning of the wafer with the assistance of the pressing component (6); The pressing component (6) includes a pressing frame (61), the inner side wall of the pressing frame (61) is fixedly connected with a fixing plate (63), the fixing plate (63) is arranged in an "Ω" shape, the pressing frame (61) is fixedly connected with a protective sheet (67), the protective sheet (67) is located on one side of the fixing plate (63), both ends of the pressing frame (61) are slidably connected with movable rods (65), and a moving plate (64) is fixedly connected to the outer wall of the movable rod (65), and the moving plate (64) is arranged in an arc shape; The pressing component (6) further includes a convex block (62) and a return spring (66), the convex block (62) is arranged in a hemispherical shape, the convex block (62) is fixedly connected to one end of the movable rod (65), the return spring (66) is sleeved on the outer wall of one end of the movable rod (65), and both ends of the return spring (66) are respectively fixedly connected to the side wall of the convex block (62) and the side wall of the pressing frame (61); The supporting component (7) includes a supporting plate (76), a plurality of uniformly distributed placing grooves (77) are formed in the inner side wall of the supporting plate (76), a plurality of groups of uniformly distributed airbag expansion tubes (78) and connecting tubes (781) are arranged inside the supporting plate (76), both ends of the connecting tube (781) are respectively fixedly connected to the outer wall of the airbag expansion tube (78) and the inner side wall of the supporting plate (76), each group of the airbag expansion tubes (78) and the connecting tubes (781) has three, each group of the airbag expansion tubes (78) and the connecting tubes (781) is located in the middle of two adjacent placing grooves (77), and a wafer sheet (11) is arranged inside the placing groove (77); The supporting plate (76) is arranged in an arc shape, expansion frames (74) are fixedly connected to both sides of the supporting plate (76), an airbag pad (73) is fixedly connected inside the expansion frames (74), a water flow groove hole (75) is formed in the outer wall of the supporting plate (76), and the water flow groove hole (75) is communicated with the placing groove (77), and a protective strip (79) is fixedly connected to the inner wall of the placing groove (77); Ventilation groove holes (761) corresponding to a plurality of groups of airbag expansion tubes (78) and connecting tubes (781) are formed in both sides of the supporting plate (76), a diversion cavity (762) is formed inside the supporting plate (76), the diversion cavity (762) is communicated with one end of the ventilation groove hole (761), the other end of the ventilation groove hole (761) is communicated with the airbag pad (73), a docking hole (782) is formed in the inner wall of the diversion cavity (762), and the docking hole (782) is connected to the lower end of the connecting tube (781); The supporting component (7) further includes a rotating plate (71) and an electric telescopic rod (72). One end of the electric telescopic rod (72) is fixedly connected to the side wall of the rotating plate (71), and the other end of the electric telescopic rod (72) is fixedly connected to the pressing frame (61). There are two rotating plates (71), and the two rotating plates (71) are respectively fixedly connected to both ends of the supporting plate (76). A rotating column (10) is fixedly connected to the side wall of the rotating plate (71). One end of one of the rotating columns (10) penetrates through the side wall of the cleaning tank (1) and is fixedly connected to the motor (3). The outer wall of the other rotating column (10) is rotatably connected to a fixed cylinder (7103). A groove (7102) is formed in the side wall of one of the rotating plates (71), and three extrusion strips (7101) distributed in a circumferential array are fixedly connected to the inner wall of the groove (7102); The outer wall of the fixed cylinder (7103) is fixedly connected to the side wall of the end of the cleaning tank (1) far from the motor (3). A hollow column (7104) is fixedly connected to the outer wall of the fixed cylinder (7103). An expansion plate (7105) and an expansion spring (7106) are arranged inside the hollow column (7104). Both ends of the expansion spring (7106) are respectively fixedly connected to the inner wall of the hollow column (7104) and one side wall of the expansion plate (7105). A chamfer is formed at the corner of the other end of the expansion plate (7105). The expansion plate (7105) is slidably connected to the inner wall of the hollow column (7104).

2. The semiconductor wafer supporting device according to claim 1, wherein The bottom inner wall of the cleaning tank (1) is fixedly connected to a drainage plate (9). The drainage plate (9) has a certain angle with the bottom of the cleaning tank (1). A filter plate (8) is fixedly connected to the inner wall of the cleaning tank (1). The filter plate (8) is located on one side of the lower end of the drainage plate (9).

3. A semiconductor wafer supporting device according to claim 1, characterized in that, The side wall of the cleaning tank (1) is fixedly connected to a drain pipe (2). The drain pipe (2) is located on one side of the filter plate (8). The upper end of the cleaning tank (1) is fixedly connected to a water inlet pipe (4). One end of the water inlet pipe (4) located inside the cleaning tank (1) is fixedly connected to a spraying pipe (41). The side wall of the cleaning tank (1) is fixedly connected to a motor (3). The front end of the cleaning tank (1) is rotatably connected to a sealing baffle (5).

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