Method and system for adjusting arc of welding wire of LED semiconductor device in combination with machine vision

Abstract

The present invention relates to the field of LED semiconductor welding technology, solves the problem of wire bonding generation and adjustment in the prior art, and provides a method and system for adjusting the wire bonding arc of LED semiconductor devices in combination with machine vision. The method includes: obtaining control parameters of the ultrasonic wire bonding machine according to the wire bonding path determined after the LED semiconductor is laid out on the workbench of the ultrasonic wire bonding machine; according to the control parameters, controlling the ultrasonic wire bonding machine to perform wire bonding and obtaining real-time image data during the wire bonding process; according to the real-time image data, obtaining real-time wire bonding information, the real-time wire bonding information includes: actual wire bonding shape information and actual welding quality information, and adjusting the control parameters according to the real-time wire bonding information and the wire bonding path, and controlling the ultrasonic wire bonding machine to bond wires on LED semiconductor devices. The present invention can adjust the width of the wire arc more dynamically through image acquisition to ensure the production quality of LED semiconductors.

Description

[0001] This invention is a divisional application of the invention patent application filed on June 6, 2024, with the invention name "Dynamic adjustment method and system for generating a specified wire arc by LED semiconductor welding wire" and application number 202410727806.4. Technical Field

[0002] The present invention relates to the technical field of LED semiconductor welding, and in particular to a method and system for adjusting a welding wire arc of an LED semiconductor device in combination with machine vision. Background Art

[0003] As a new type of optoelectronic device, LED (Light Emitting Diode) semiconductor has the advantages of low power consumption, high brightness, and long life, and is widely used in lighting, display, communication and other fields. In the manufacturing process of LED semiconductors, bonding wires play an important role in connecting chips and external circuits, affecting the performance and reliability of LED devices.

[0004] In the prior art, the wire bonding adjustment technology mainly generates wire bonding by setting fixed parameters, which may include ultrasonic vibration parameters, bonding pressure parameters, temperature parameters, etc. However, due to the different layouts and shapes of LED semiconductor chips, as well as the influence of factors such as materials, processes and environment during the wire bonding process, the traditional fixed parameter settings often cannot meet the needs of different LED semiconductors, resulting in unstable wire bonding quality and even welding failure.

[0005] Existing wire bonding adjustment technology is widely used in LED semiconductor manufacturing, but there is a major problem, that is, the wire bonding process cannot be dynamically adjusted according to the real-time wire bonding parameters. The root of this problem is that the traditional method is based on fixed preset parameters to perform wire bonding, without considering the dynamic changes in the actual wire bonding process. Since the chip layout and shape of LED semiconductor devices may vary depending on application requirements, coupled with the influence of factors such as materials, processes and environment, the welding quality and shape of the wire bonding process fluctuate, and even welding failures may occur. Summary of the invention

[0006] In view of this, an embodiment of the present invention provides a method and system for adjusting the arc of a bonding wire of an LED semiconductor device in combination with machine vision, so as to solve the problems in the prior art.

[0007] In a first aspect, an embodiment of the present invention provides a method for adjusting a bonding wire arc of an LED semiconductor device in combination with machine vision, the method comprising:

[0008] According to the wire bonding path determined after the LED semiconductor is laid out on the workbench of the ultrasonic wire bonding machine, the control parameters of the ultrasonic wire bonding machine are obtained, wherein the control parameters include the moving speed of the workbench;

[0009] According to the control parameters, the ultrasonic wire bonding machine is controlled to perform wire bonding and obtain real-time image data during the wire bonding process;

[0010] According to the real-time image data, real-time welding line information is obtained, and the real-time welding line information includes: actual welding line shape information and actual welding line quality information, specifically including:

[0011] Preprocessing the real-time image data to obtain target image data,

[0012] According to a preset contour extraction algorithm, the weld line contour in the target image data is obtained,

[0013] Perform curve fitting according to a preset curve fitting algorithm and the weld line profile to obtain a fitted weld line,

[0014] Acquiring the real-time welding line information according to the fitted welding line and the welding line profile;

[0015] According to the real-time wire bonding information and the wire bonding path, the control parameters are adjusted and the ultrasonic wire bonding machine is controlled to bond wires on the LED semiconductor device;

[0016] The acquiring the real-time welding line information according to the fitted welding line and the welding line profile includes:

[0017] According to the fitted welding wires, acquiring the actual welding wire shape information, wherein the actual welding wire shape information includes the actual welding wire length, the actual welding wire curvature and the welding wire width;

[0018] According to the welding wire profile, the actual welding wire quality information is obtained, wherein the actual welding wire quality information includes welding wire continuity parameters and welding wire integrity parameters and width consistency;

[0019] The obtaining of the moving speed of the workbench according to the welding line path comprises:

[0020] Determining a first shape parameter of the welding wire path according to the welding wire path;

[0021] Dividing the bonding wire path into a plurality of sub-bonding wire paths according to the first shape parameter and a preset division rule;

[0022] According to the first shape parameter, obtaining a second shape parameter corresponding to each of the sub-welding wire paths;

[0023] Determining a workbench moving speed of each of the corresponding sub-welding wire paths according to each of the second shape parameters;

[0024] Among them, the first shape parameter includes the target welding wire length, welding wire curvature and welding point position; the workbench moving speed is positively correlated with the length of the corresponding sub-welding wire path, and the workbench moving speed is negatively correlated with the curvature of the corresponding sub-welding wire path and the number of welding points in the sub-welding wire path.

[0025] As a preferred embodiment of the present invention, the preset curve fitting algorithm includes one of a polynomial fitting algorithm, a Bezier curve fitting algorithm and a spline curve fitting algorithm.

[0026] As a preferred embodiment of the present invention, the step of obtaining control parameters of an ultrasonic wire bonding machine according to the wire bonding path includes:

[0027] According to the material properties of the bonding wire material, the ultrasonic vibration parameter, the bonding pressure parameter and the temperature parameter are obtained, wherein the material properties include the material type and the material thickness;

[0028] Obtaining the welding time according to the temperature parameter and the moving speed of the workbench;

[0029] The control parameter is obtained according to the ultrasonic vibration parameter, the bonding pressure parameter, the temperature parameter, the workbench moving speed and the welding time.

[0030] As a preferred embodiment of the present invention, adjusting the control parameters and controlling the ultrasonic wire bonding machine to bond wires on the LED semiconductor device according to the real-time wire bonding information and the wire bonding path includes:

[0031] Establishing a matching relationship between the fitting welding wire and each of the sub-welding wire paths according to the actual welding wire shape information and the second shape parameter, wherein the matching relationship includes an association relationship between the actual welding wire and the most matching sub-welding wire path;

[0032] According to the matching relationship and the actual welding wire shape information, actual welding wire shape information and actual welding wire quality information corresponding to the actual welding wire being processed are obtained, and recorded as target shape information and target quality information respectively;

[0033] Acquire a shape similarity between an actual welding wire and a corresponding sub-welding wire path according to the target shape information and a corresponding second shape parameter;

[0034] Determining whether the control parameter needs to be adjusted according to the shape similarity and the target quality information;

[0035] If necessary, the control parameters are adjusted according to the shape similarity and the target quality information, which specifically includes:

[0036] When the target quality information does not meet the preset quality condition, adjusting one or more of the ultrasonic vibration parameter, the bonding pressure parameter, the temperature parameter and the welding time according to a preset adaptive control algorithm;

[0037] When the shape similarity is less than or equal to a preset similarity threshold, performing a difference calculation based on the target shape information and the corresponding second shape parameter to obtain a first shape deviation degree in the X direction and a second shape deviation degree in the Y direction;

[0038] adjusting a first moving speed and a second moving speed according to the first shape deviation degree and / or the second shape deviation degree, wherein the first moving speed is negatively correlated with the first shape deviation degree, and the second moving speed is negatively correlated with the second shape deviation degree;

[0039] Returning to the control parameters, controlling the ultrasonic wire bonding machine to perform wire bonding and acquiring real-time image data during the wire bonding process until the wire bonding of the target LED semiconductor is completed.

[0040] As a preferred embodiment of the present invention, determining the workbench moving speed of each of the corresponding sub-welding wire paths according to each of the second shape parameters includes:

[0041] Acquire a second shape parameter of each of the sub-welding wire paths, wherein the second shape parameter includes a curvature of the sub-welding wire path, a length of the sub-welding wire path, and a number of welding points on the sub-welding wire path;

[0042] Performing parameter fitting on the sub-bonding wire path according to the second shape parameter to obtain a parameter equation of the sub-bonding wire path;

[0043] According to the second shape parameter, a parameter equation of the sub-welding wire path is obtained by a fitting algorithm; according to the parameter equation, a first curvature change rate in the X direction and a second curvature change rate in the Y direction of the sub-welding wire path are calculated;

[0044] Projecting the length of the sub-bonding wire path according to the angles between the sub-bonding wire path and the X direction and the Y direction to obtain the length in the X direction and the length in the Y direction;

[0045] Determine a first moving speed of the workbench in the X direction according to the first curvature change rate, the length in the X direction, and the number of welding points, wherein the first moving speed, the first curvature change rate, and the number of welding points are negatively correlated, and the first moving speed and the length in the X direction are positively correlated;

[0046] Determine a second moving speed of the workbench in the Y direction according to the second curvature change rate, the length in the Y direction, and the number of welding points, wherein the second moving speed, the second curvature change rate, and the number of welding points are negatively correlated, and the second moving speed and the length in the Y direction are positively correlated;

[0047] The workbench moving speed of the sub-bonding wire path is determined according to the first moving speed and the second moving speed.

[0048] In a second aspect, an embodiment of the present invention further provides a system for adjusting the arc of a welding wire of an LED semiconductor device in combination with machine vision, wherein the system comprises an ultrasonic welding machine and a camera arranged on the ultrasonic welding machine, wherein the system adopts any of the methods described above.

[0049] As a preferred embodiment of the present invention, the ultrasonic wire welding machine includes: a frame, a welding head, a workbench, a first driving mechanism, a second driving mechanism and the camera, wherein the workbench is arranged on the frame and connected to the first driving mechanism, the first driving mechanism is used to drive the workbench to reciprocate in the horizontal direction, the second driving mechanism is connected to the welding head, and is used to drive the welding head to reciprocate in the vertical direction, and the camera is used to obtain real-time image data.

[0050] As a preferred embodiment of the present invention, the system further includes: a control module, a sensor module and a power module; wherein the sensor module is used to monitor key parameters in the wire welding process, and the key parameters include temperature data and pressure data; the power module is used to supply energy to the system, and the control module is used to control the ultrasonic wire welding machine, the first drive mechanism, the second drive mechanism and the camera.

[0051] In summary, the beneficial effects of the present invention are as follows:

[0052] The embodiment of the present invention provides a method and system for adjusting the arc of the welding wire of an LED semiconductor device in combination with machine vision. By introducing image processing, control parameters can be continuously adjusted to ensure that the shape and quality of the welding wire always meet the requirements, thereby ensuring the manufacturing quality and efficiency of the LED semiconductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings required for use in the embodiment of the present invention will be briefly introduced below. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work, and these are all within the protection scope of the present invention.

[0054] Figure 1It is a structural schematic diagram of an ultrasonic wire bonding machine according to an embodiment of the present invention.

[0055] Figure 2 The present invention is a flowchart of a method for dynamically adjusting an LED semiconductor bonding wire to generate a specified arc.

[0056] Figure 3 It is another flow chart of a method for dynamically adjusting an LED semiconductor bonding wire to generate a designated arc according to an embodiment of the present invention.

[0057] Figure 4 It is another flow chart of a method for dynamically adjusting an LED semiconductor bonding wire to generate a designated arc according to an embodiment of the present invention.

[0058] Figure 5 The present invention is a schematic structural diagram of a dynamic adjustment system for generating a designated arc by an LED semiconductor bonding wire according to an embodiment of the present invention.

[0059] Reference numerals:

[0060] Frame-1, welding head-21, workbench-11, first driving mechanism-12, second driving mechanism-22, display-10. DETAILED DESCRIPTION

[0061] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and Examples. It should be understood that the specific embodiments described herein are only configured to explain the present invention and are not configured to limit the present invention. For those skilled in the art, the present invention can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by illustrating examples of the present invention.

[0062] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0063] Example 1

[0064] See also Figure 1 The embodiment of the present invention provides a dynamic adjustment method for generating a specified arc of an LED semiconductor wire, which is used for an ultrasonic wire bonding machine, wherein the ultrasonic wire bonding machine comprises: a frame 1, a welding head 21, a workbench 11, a first driving mechanism 12 and a second driving mechanism 22, wherein the workbench is arranged on the frame and connected to the first driving mechanism, the first driving mechanism is used to drive the workbench to reciprocate in the horizontal direction, the second driving mechanism is connected to the welding head, and is used to drive the welding head to reciprocate in the vertical direction, and the ultrasonic wire bonding machine also includes a display 10;

[0065] Specifically, the frame is the main supporting structure of the welding machine, which is used to carry and support components such as the welding head, workbench and driving mechanism. The welding head is a key component of ultrasonic welding, which is used to transmit ultrasonic vibration and apply pressure to weld the workpieces together. The workbench is a platform for placing the workpiece. The workpiece is placed on the workbench during welding. The workbench can move in the horizontal direction to weld workpieces in different positions. The first driving mechanism is connected to the workbench and is responsible for driving the workbench to move in the horizontal direction and controlling the position of the welding head relative to the workpiece. The second driving mechanism is connected to the welding head and is responsible for driving the welding head to move in the vertical direction. The ultrasonic wire welding machine also includes an ultrasonic transducer, which is responsible for converting electrical energy into ultrasonic vibration energy and transmitting the vibration to the welding head. It may be necessary to heat the workpiece or welding head to improve the welding effect. Therefore, the ultrasonic wire welding machine is equipped with a heating system to provide the necessary heating energy;

[0066] See also Figure 2 Based on the above ultrasonic wire bonding machine, an embodiment of the present invention further provides a method for dynamically adjusting a LED semiconductor wire bonding to generate a specified wire arc, the method comprising:

[0067] S1. Acquire a wire bonding path according to layout information of a target LED semiconductor, wherein the target LED semiconductor is placed at a designated position of the workbench;

[0068] Specifically, the layout information of the target LED semiconductor refers to the layout arrangement of the LED semiconductor components on the circuit board, including the location, connection method, arrangement method, etc. of the LED. The layout information usually exists in the form of a circuit board design file, which may include a layout diagram, a component list, etc. The wire path is the path of the wires or connecting lines connecting the LED semiconductor components. These paths usually need to be arranged according to specific design specifications and connection requirements to ensure the normal function and performance of the circuit;

[0069] According to the layout information of the target LED semiconductor, the wire bonding path can be drawn through computer-aided design software or circuit board design software. The wire bonding path can be drawn on the circuit board according to the position and connection requirements of the LED components and saved in a digital file format.

[0070] By drawing the wire bonding path according to the layout information of the LED semiconductor, it is possible to ensure that the wire bonding is correctly connected to the pins or circuit nodes of the LED component, avoiding circuit failure or performance degradation caused by connection errors.

[0071] S2. According to the wire bonding path, obtaining control parameters of the ultrasonic wire bonding machine, wherein the control parameters include ultrasonic vibration parameters, bonding pressure parameters, temperature parameters, workbench moving speed and welding time;

[0072] Specifically, an ultrasonic wire bonder is a special device used to bond metal wires or solder materials to electronic components. It heats and bonds the welding material to the welding position through ultrasonic vibration and pressure. The control parameters of the ultrasonic wire bonder include the following aspects:

[0073] Ultrasonic vibration parameters refer to the frequency, amplitude and waveform of ultrasonic vibration, which affect the melting and flow of welding materials during welding. Bonding pressure parameters refer to the pressure applied to the welding position, which affects the pressing and connection quality of welding materials. Temperature parameters refer to the temperature control parameters of the welding position, including preheating temperature, welding temperature and cooling temperature, which affect the flow and solidification of solder during welding. The workbench movement speed refers to the speed at which the workbench moves along the welding line path during welding, which affects the speed and accuracy of welding. Welding time refers to the duration of the welding process, which affects the melting and solidification time of welding materials.

[0074] According to the welding wire path and welding requirements, engineers can set the control parameters through the control panel of the ultrasonic wire welding machine or dedicated software. These parameters usually need to be adjusted and optimized according to the specific welding materials, welding positions and welding requirements. In addition, factors such as the shape, length and curvature of the welding wire path will directly affect the setting of the control parameters of the ultrasonic wire welding machine, which need to be adjusted and optimized according to the specific situation to ensure welding quality and production efficiency.

[0075] Preferably, see Figure 3 , the step of obtaining control parameters of the ultrasonic wire bonding machine according to the wire bonding path includes:

[0076] S21, acquiring the ultrasonic vibration parameter, the bonding pressure parameter and the temperature parameter according to the material properties of the bonding wire material, wherein the material properties include material type and material thickness;

[0077] In this step, the ultrasonic vibration parameters, bonding pressure parameters and temperature parameters are determined according to the type and thickness of the material used for welding. The selection of these parameters is closely related to the characteristics of the welding material;

[0078] The frequency and amplitude of ultrasonic vibration are determined according to the type and thickness of the welding material. The characteristics of different materials will affect their response to ultrasonic vibration, so they need to be adjusted according to the material type. Thicker materials may require higher vibration frequency and amplitude to ensure welding quality;

[0079] The thickness and hardness of the materials being welded will affect the required bonding pressure. Generally, thicker or harder materials require more pressure to ensure adequate contact and a good bond.

[0080] Determine the preheating temperature and soldering temperature based on the type and thickness of the soldering material. For some materials, you may need to preheat them before soldering to improve their soldering performance. For other materials, you may need to provide enough heat during soldering to ensure that the solder is fully melted and flowed.

[0081] The selection of these parameters is crucial to welding quality. Appropriate parameters can improve welding efficiency and quality and reduce adverse conditions during welding.

[0082] S22, acquiring the moving speed of the workbench according to the welding wire path;

[0083] According to the welding wire path, factors such as length and curvature can be obtained to determine the moving speed of the workbench. When the length of the welding wire path is long or the curvature is large, it is necessary to appropriately increase the moving speed of the welding head to ensure welding efficiency. In a specific part of the welding wire path, if the curvature is large, it is necessary to control the moving speed of the welding head more carefully. The welding wire path with a large curvature needs to reduce the moving speed of the welding head to ensure the accuracy and stability of welding. Reducing the moving speed helps the welding head to better follow the curved path and reduce the overspeed phenomenon during welding, thereby reducing the error between the welding head and the welding wire and improving the welding quality. Therefore, it is crucial to determine the moving speed of the welding head according to the characteristics of the welding wire path, especially in the part with a large curvature, where the moving speed needs to be reduced to ensure the welding quality. Conversely, for a shorter or straighter welding wire path, the moving speed of the welding head can be increased to ensure welding efficiency.

[0084] Preferably, see Figure 4 , the obtaining of the workbench moving speed according to the welding wire path comprises:

[0085] S221, determining first shape parameters of the welding path according to the welding wire path, wherein the first shape parameters include target welding wire length, welding wire curvature and welding point position;

[0086] According to the welding line path, the basic shape parameters of the welding path are determined by measurement or calculation. These parameters usually include the target welding line length, the curvature of the welding line and the welding point position. The target welding line length refers to the distance from the welding start point to the welding end point. The curvature of the welding line indicates the degree of bending of the welding line during the welding process, which can be estimated or calculated based on the curvature of the welding path. The welding point position refers to the specific position of each welding point on the welding path.

[0087] S222, dividing the welding path into a plurality of sub-welding paths according to the first shape parameter and a preset division rule;

[0088] According to the preset division rule and the first shape parameter, the entire welding path is divided into a plurality of sub-welding paths. The division rule can be determined according to specific welding requirements and process standards, and is usually divided according to factors such as the length and curvature of the welding path. The divided sub-welding paths can be better controlled and adjusted to achieve a more accurate welding process.

[0089] In one embodiment, the preset division rule includes dividing the welding wheel diameter based on the length of the welding path, for example, evenly dividing the welding path into several segments, each of which is of equal length. This division method is simple and intuitive, but may not take into account the actual characteristics of the welding path, or, according to a preset ratio, the welding path is divided into several segments in a certain ratio. For example, the welding path is divided into three segments in a ratio of 1:2:1, wherein the middle segment is longer and the segments on both sides are shorter. This division method may be suitable for welding paths with specific structures or geometric shapes, and there may be more complexity or more welding operations in the central part of the welding path. Therefore, dividing the middle part longer can better handle this complexity, while dividing the two side parts shorter can reduce the processing time of these parts, thereby improving welding efficiency;

[0090] In one embodiment, the preset division rule includes dividing the welding wheel diameter based on the number of welding points in the welding path. Specifically, first, the welding path is traversed, and the number of welding points in each sub-path is counted. According to the actual situation, the number of welding points can be divided according to a certain ratio. This ratio can be determined based on experience or specific needs. According to the determined ratio, the welding path is divided into several sections, wherein the part with a larger number of welding points corresponds to a longer section, and the part with a smaller number of welding points corresponds to a shorter section. The advantage of this division method is that it can be divided according to the specific distribution of welding points in the welding path, so as to more finely control the processing process of the welding path and improve welding efficiency and quality.

[0091] In a preferred embodiment, the preset division rule includes: dividing the welding path based on the complexity of the welding path so that the difference in complexity of each of the sub-welding paths is less than a preset complexity threshold;

[0092] Then, the step of dividing the welding path into a plurality of sub-welding paths according to the first shape parameter and a preset division rule comprises:

[0093] S2221. Determine the number of divisions according to the complexity of the welding path and a preset complexity threshold, wherein the complexity is calculated based on the following formula: Where CI is the complexity, C curvature represents the total curvature of the welding path, C length represents the length of the path, C points Indicates the number of welding points in the path, W curvature , W length , W points They are curvature weight, length weight and welding point quantity weight respectively;

[0094] First, the entire welding path is comprehensively analyzed to calculate the overall complexity CI, where the number of divisions = round (complexity / complexity threshold), where round means taking the nearest integer. This formula ensures that the number of divisions increases with the increase in complexity, but not too much. The complexity threshold and can be set according to the specific situation to control the upper limit of the number of divisions;

[0095] In one embodiment, the values ​​of the curvature weight, length weight and welding point number weight are 0.4, 0.4 and 0.2 respectively. The change of curvature can affect the movement of the welding head during the welding process. A larger curvature change may require more complex control to ensure the welding quality. Therefore, the change of curvature is given a relatively high weight to better reflect its impact on the welding process. The length of the path directly affects the welding time. A longer sub-path may require a longer welding time and may also increase the possibility of welding quality fluctuations. Therefore, the length is given a higher weight to better consider the welding time and welding quality fluctuations. The number of welding points in the path reflects the complexity of the welding path. A larger number of welding points may mean a more complex welding shape or more welding steps, thereby increasing the complexity of welding. Although the impact of the number of welding points is relatively small, it still needs to be considered and is therefore given an appropriate weight.

[0096] Taking into account the influence of these three factors and their importance in the welding process, the curvature weight is determined to be 0.4, the length weight is 0.4, and the welding point number weight is 0.2. Such weight distribution can more comprehensively consider the complexity of the welding path, thereby more accurately determining the number of divisions and ensuring welding quality.

[0097] S2222, evenly dividing the welding path according to the determined number of divisions to obtain a plurality of sub-welding paths;

[0098] S2223, adjusting the length of the corresponding sub-welding path according to the complexity of each of the sub-welding paths;

[0099] For each sub-welding path, make adjustments based on its own complexity. If a certain path is more complex, its length can be shortened appropriately; conversely, if a certain path is relatively simple, its length can be extended to achieve a balance in the complexity of each path;

[0100] By dynamically determining the number of divisions and adjusting the length of the sub-welding path according to the complexity of the welding path, real-time adaptation of the welding process can be achieved. In this way, the number of divisions and the length of the sub-path can be flexibly adjusted in different welding situations to adapt to different welding requirements and conditions. The dynamic adjustment of the number of divisions and the length of the sub-path can ensure that resources (such as time, energy, etc.) in the welding process are effectively utilized. By adjusting the number of divisions and the length of the sub-path according to actual conditions, unnecessary resource waste can be minimized and welding efficiency and quality can be improved. Adjusting the length according to the complexity of the sub-welding path can help control the welding quality. More complex sub-welding paths may require more welding time and fine control. By adjusting the length, it can be ensured that each sub-welding path can get appropriate welding time and quality assurance. By dynamically adjusting the number of divisions and the length of the sub-path, the welding process can be made more efficient. Reasonable allocation of welding time and resources ensures that each sub-welding path can get appropriate welding treatment, thereby improving overall production efficiency and capacity utilization. In summary, the above scheme can dynamically adjust the division and length of the welding path according to the actual welding situation to maximize welding quality, efficiency and resource utilization.

[0101] S223, acquiring second shape parameters corresponding to each of the sub-welding paths according to the first shape parameters;

[0102] Specifically, according to the first shape parameter, a corresponding second shape parameter is obtained for each sub-welding path. The second shape parameter generally includes information such as the length, curvature, and welding point position of the sub-welding path. These parameters can be used to further calculate the specific characteristics of the sub-welding path and provide a reference for the subsequent welding process.

[0103] S224. Determine the workbench moving speed of each of the sub-welding paths according to the second shape parameter, wherein the workbench moving speed is proportional to the length of the corresponding sub-welding path, and the workbench moving speed is inversely proportional to the curvature of the corresponding sub-welding path and the number of welding points in the sub-welding path.

[0104] Specifically, the workbench moving speed of each sub-welding path is determined according to the second shape parameter. Generally, the workbench moving speed is proportional to the length of the sub-welding path, that is, the longer the welding path, the faster the moving speed; and inversely proportional to the curvature of the sub-welding path and the number of welding points, that is, the greater the curvature or the more welding points, the slower the moving speed. This design can ensure that the speed during the welding process adapts to the characteristics of the welding path, thereby achieving more accurate and stable welding.

[0105] Preferably, the workbench moving speed includes a first moving speed in the X direction and a second moving speed in the Y direction, and the X direction is perpendicular to the Y direction;

[0106] Specifically, the welding path is often carried out on a plane, which is usually a two-dimensional space with a horizontal direction (X direction) and a vertical direction (Y direction). Therefore, in order to accurately control the movement of the workbench, the movement speed in the X direction and the Y direction needs to be considered separately. Decomposing the movement speed of the welding head into two components in the X direction and the Y direction helps to control the welding process more finely, especially when the welding path contains curves or complex shapes. This decomposition allows the workbench to make different adjustments in the X direction and the vertical direction according to the specific situation, so as to better adapt to the changes in the welding path.

[0107] Determining the workbench moving speed of each of the sub-welding paths according to the second shape parameter includes:

[0108] S2241, obtaining second shape parameters of the sub-welding wire path, wherein the second shape parameters include a curvature of the sub-welding wire path, a length of the sub-welding wire path, and a number of welding points on the sub-welding wire path;

[0109] Specifically, for each sub-welding wire path, a corresponding second shape parameter is obtained, where the second shape parameter includes a sub-welding wire path curvature, a sub-welding wire path length, and a number of welding points on the sub-welding wire path; the curvature describes the degree of bending of the welding wire path in space, the length represents the actual length of the sub-welding wire path, and the number of welding points refers to the number of points on the sub-welding wire path that need to be welded.

[0110] S2242, performing parameter fitting on the sub-bonding wire path according to the second shape parameter to obtain a parameter equation of the sub-bonding wire path;

[0111] Specifically, according to the second shape parameter, a parametric equation of the sub-welding wire path is obtained by a fitting algorithm such as polynomial fitting, spline curve fitting, etc. The equation represents a mathematical model of the welding wire path, which is helpful for the subsequent calculation of the curvature change rate.

[0112] S2243, calculating a first curvature change rate of the sub-welding wire path in the X direction and a second curvature change rate in the Y direction according to the parameter equation;

[0113] Specifically, the parametric equation is used to calculate the curvature change rate of the sub-welding line path in the X direction and the Y direction. The curvature change rate can be calculated by the first and second order derivatives of the curve in the X direction and the Y direction;

[0114] Specifically, the parameter equation obtained after fitting is: Wherein, t is a parameter variable used to represent the position in the curve fitting process, and its value range is determined according to the starting point and the end point of the sub-welding wire path, x(t) is the coordinate function of the sub-welding wire path in the X direction, and y(t) is the coordinate function of the path in the Y direction;

[0115] Based on the above parameter equations, the curvature change rate of the sub-welding wire path in the X direction and the Y direction can be calculated respectively;

[0116] Among them, the curvature change rate in the X direction κ x Calculated by the following formula: ;

[0117] Curvature change rate in the Y direction κ y Calculated by the following formula: ;

[0118] In the formula, and are the first-order derivatives of the curve in the X and Y directions, and are the second-order derivatives of the curve in the X and Y directions respectively;

[0119] S2244, decomposing the length of the sub-welding wire path according to the angles between the sub-welding path and the X direction and the Y direction to obtain the length in the X direction and the length in the Y direction;

[0120] Specifically, the total length is decomposed into the length in the X direction and the length in the Y direction according to the angle between the sub-wire path and the X direction and the Y direction. The angle can be calculated by the parameter equation of the curve.

[0121] S2245, determining a first moving speed of the workbench in the X direction according to the first curvature change rate, the length in the X direction, and the number of welding points, wherein the first moving speed, the first curvature change rate, and the number of welding points are negatively correlated, and the first moving speed and the length in the X direction are positively correlated;

[0122] Specifically, the curvature change rate reflects the curvature of the path. A higher curvature change rate means that the path has a larger curvature in that direction, and the welding head needs to adjust its position more frequently. In order to ensure the accuracy and quality of welding, the moving speed needs to be reduced so that the welding head has enough time to adjust. Therefore, the moving speed in the X direction is negatively correlated with the curvature change rate.

[0123] The X-direction length indicates the straight-line distance of the path in the X-direction. A longer length usually means a straighter path, and the moving speed can be appropriately increased because the welding difficulty on a straight path is relatively low. Increasing the moving speed can improve the welding efficiency, so the moving speed in the X-direction is positively correlated with the X-direction length.

[0124] The number of welding points represents the number of welding operations required during the welding process. A larger number of welding points means that more time and precision are required to complete the welding task. In order to ensure the quality of each welding point, the moving speed needs to be reduced so that the welding head can accurately position and complete the welding. Therefore, the moving speed in the X direction is negatively correlated with the number of welding points. These relationships can be quantified by formulas, so that the moving speed can be dynamically adjusted during the actual welding process to achieve the best welding effect;

[0125] In addition to quantification through formulas, machine learning and artificial intelligence technologies can also be used to optimize and adjust welding parameters. Through a large amount of historical welding data and real-time feedback data, a model can be trained to predict and dynamically adjust the moving speed, or a fuzzy logic controller can be used to dynamically adjust the moving speed. Fuzzy logic systems can handle uncertainty and nonlinear relationships, and reason and make decisions through fuzzy rules.

[0126] The curvature change rate, number of welding points and path length are defined as fuzzy variables, and a fuzzy rule base is established based on expert experience and experimental data. For example, if the curvature change rate is high and the number of welding points is large, the moving speed is slow. During the welding process, fuzzy reasoning is performed based on real-time data to output the corresponding moving speed adjustment amount. The fuzzy reasoning results are defuzzified and converted into specific moving speed adjustment values.

[0127] S2246, determining a second moving speed of the workbench in the Y direction according to the second curvature change rate, the length in the Y direction, and the number of welding points, wherein the second moving speed, the second curvature change rate, and the number of welding points are negatively correlated, and the second moving speed and the length in the Y direction are positively correlated;

[0128] Specifically, the second moving speed of the workbench in the Y direction is determined according to the second curvature change rate, the length in the Y direction, and the number of welding points. This moving speed is negatively correlated with the curvature change rate and the number of welding points, and positively correlated with the length in the Y direction. This speed can be used to control the movement of the workbench in the Y direction. This step is similar to the previous step and will not be repeated here.

[0129] S2247. Determine the workbench moving speed of the sub-welding path according to the first moving speed and the second moving speed.

[0130] Finally, the first moving speed and the second moving speed are combined to obtain the moving speed of the workbench in each sub-welding wire path.

[0131] S23, acquiring the welding time according to the temperature parameter and the moving speed of the workbench;

[0132] First, it is necessary to determine the relationship between the welding time and the distance the welding head moves. This can be determined through experiments or previous empirical data. Generally, the welding time is proportional to the welding distance; the influence of temperature parameters on the welding time can be achieved by controlling the welding time to adjust the temperature. Generally, as the temperature increases, the welding time may need to be shortened to avoid overheating of the material and resulting in poor welding results. Therefore, when determining the welding time, the influence of the temperature parameters on the welding time needs to be considered. Combined with the workbench movement speed and temperature parameters, the actual welding time can be calculated based on the previously determined relationship between the welding time and the welding distance. Depending on the required welding quality and the actual welding situation, fine-tuning may be required to ensure the best welding effect.

[0133] S24. Obtain the control parameter according to the ultrasonic vibration parameter, the bonding pressure parameter, the temperature parameter, the workbench moving speed and the welding time.

[0134] Finally, the final control parameters are determined by comprehensively considering factors such as ultrasonic vibration parameters, bonding pressure parameters, temperature parameters, workbench moving speed and welding time. The selection of these parameters needs to maximize the welding efficiency and productivity while ensuring the welding quality.

[0135] S3. According to the control parameters, control the ultrasonic wire bonding machine to perform wire bonding and obtain real-time image data during the wire bonding process;

[0136] According to the control parameters obtained in the previous steps, including ultrasonic vibration parameters, bonding pressure parameters, temperature parameters, workbench movement speed and welding time, the ultrasonic wire bonding machine is controlled to perform wire bonding. This involves inputting the control parameters into the control system of the ultrasonic wire bonding machine to ensure that each parameter in the welding process is adjusted according to the preset values ​​to achieve a good welding effect. During the wire bonding process, the corresponding image acquisition device (such as a camera) is used to monitor the welding area in real time and obtain real-time image data during the wire bonding process. These image data can be used to monitor the welding process in real time, detect welding quality, and perform subsequent quality analysis and improvement. By monitoring the image data during the wire bonding process in real time, problems and defects in the welding process can be discovered in time. Based on the real-time feedback image data, the control parameters can be dynamically adjusted to ensure the stability of the welding process and the welding quality. For example, if a wire offset or poor welding quality is detected, the problem can be corrected by adjusting the ultrasonic vibration parameters, bonding pressure parameters, etc.

[0137] S4. Acquire real-time welding line parameters according to the real-time image data, wherein the real-time welding line parameters include: actual welding line shape information and actual welding quality information;

[0138] By analyzing the real-time image data, the shape information of the welding wire can be extracted, including the length, curvature, width, etc. of the welding wire. This information can help evaluate whether the geometric shape of the welding wire is consistent with the expected design, and detect whether the welding wire has problems such as offset and deformation. For example, by measuring the length and curvature of the welding wire, it can be determined whether the welding wire is welded according to the predetermined path and whether the curvature of the welding wire is within the design range.

[0139] Real-time image data can also be used to evaluate the quality of welding. By analyzing the image features of the welding line, it is possible to detect whether there are welding defects during the welding process, such as loose welding, broken welding points, and overflow of welding materials. In addition, the welding quality can also be quantitatively evaluated through image processing technology, such as detecting the density, uniformity, surface flatness and other indicators of the welding points, so as to determine whether the welding quality meets the requirements.

[0140] Preferably, acquiring real-time welding wire parameters according to the real-time image data includes:

[0141] S41, preprocessing the real-time image data to obtain target image data;

[0142] In this step, the real-time image data must first be preprocessed to eliminate noise in the image, enhance the characteristics of the weld line, etc. Preprocessing techniques may include grayscale, smoothing, edge detection, etc. Through these preprocessing steps, clear target image data can be obtained, which is beneficial to the subsequent weld line contour extraction and curve fitting.

[0143] S42, acquiring the weld line contour in the target image data according to a preset contour extraction algorithm;

[0144] The contour of the welding wire is extracted from the target image data using a preset contour extraction algorithm. Common contour extraction algorithms include edge detection, threshold segmentation, connected region analysis, etc. These algorithms can identify the edge information of the welding wire in the image, thereby accurately extracting the contour of the welding wire.

[0145] S43, performing curve fitting according to a preset curve fitting algorithm and the weld wire profile to obtain a fitted weld wire, wherein the preset curve fitting algorithm includes a polynomial fitting algorithm, a Bezier curve fitting algorithm, and a spline curve fitting algorithm;

[0146] Specifically, this step uses a preset curve fitting algorithm to perform curve fitting on the weld wire contour extracted from the image. Commonly used curve fitting algorithms include polynomial fitting algorithms, Bezier curve fitting algorithms, and spline curve fitting algorithms. Through these algorithms, discrete contour points can be fitted into a continuous curve, thereby obtaining the shape information of the fitted weld wire.

[0147] S44. Acquire the real-time welding wire parameters according to the fitted welding wire and the welding wire profile, wherein the actual welding wire shape information includes actual welding wire length, actual welding wire curvature and welding wire width.

[0148] Finally, in this step, the real-time welding wire parameters can be obtained based on the fitted welding wire and the original welding wire profile, including information such as actual welding wire length, actual welding wire curvature and welding wire width. These parameters can provide detailed information about the shape and quality of the welding wire, which is helpful for real-time monitoring of the quality of the welding process and making corresponding adjustments and improvements.

[0149] Preferably, acquiring the real-time welding line parameters according to the fitted welding line and the welding line profile includes:

[0150] S441, acquiring the actual welding line shape information of each welding line according to the fitted welding line, wherein the actual welding line shape information includes the actual welding line length, the actual welding line curvature and the welding line width;

[0151] Specifically, the actual wire length can be obtained by calculating the length of the fitted curve. This can be achieved by mathematically calculating the sum of the distances between the points on the curve, or by calculating it through the discretization representation of the curve. The actual wire curvature can be obtained through the curvature of the curve. The curvature describes the degree of curvature of the curve at a certain point. The curvature of the curve at each point can be calculated by the method of differential geometry, and the average value can be taken or other statistics can be selected as needed. Wire width: It can be obtained by the width of the fitting curve. According to the shape and width distribution of the curve, the width of the wire at each point can be calculated, and the average value can be taken or other statistics can be selected as needed. Through these calculations, real-time wire shape information can be obtained, which provides an important basis for subsequent quality assessment.

[0152] S442, performing morphological processing on the weld wire profile to obtain the actual weld wire quality information, wherein the morphological processing includes an opening operation and a closing operation, and the actual weld wire quality information includes a weld wire continuity parameter, a weld wire integrity parameter, and width consistency.

[0153] In this step, the extracted weld line contour is morphologically processed to obtain the quality information of the actual weld line. Morphological processing often includes opening and closing operations. The opening operation is to first perform an erosion operation and then a dilation operation. The opening operation can eliminate small noise in the image, smooth the edges of the weld line, and improve the continuity and integrity of the weld line. The closing operation is to first perform an dilation operation and then an erosion operation. The closing operation can fill the voids in the weld line, bridge the broken parts, and improve the integrity and continuity of the weld line.

[0154] Through these morphological processing operations, the continuity parameters and integrity parameters of the welding wire, as well as the width consistency information of the welding wire can be obtained. These parameters can be used to evaluate the quality of the welding wire and guide the subsequent adjustment and optimization of the welding process.

[0155] S5. Adjust the control parameters according to the real-time wire bonding parameters and the wire bonding path, and return to control the ultrasonic wire bonding machine to perform wire bonding according to the control parameters and obtain real-time image data during the wire bonding process until the wire bonding of the target LED semiconductor is completed.

[0156] A comprehensive analysis is performed based on the real-time acquired wire bonding parameters (such as length, curvature, width, etc.) and the known wire bonding path information. This includes comparing the difference between the actual wire bonding parameters and the target parameters, and checking whether the wire bonding follows the expected path. Based on the analysis of the real-time wire bonding parameters and the wire bonding path, the control parameters of the ultrasonic wire bonding machine need to be adjusted. These control parameters may include ultrasonic vibration parameters, bonding pressure parameters, temperature parameters, workbench movement speed, and welding time. For example, if the actual wire bonding length exceeds the expected value, the welding time or movement speed may need to be adjusted to increase or decrease the wire bonding extension during the welding process. After adjusting the control parameters, these parameters are input into the ultrasonic wire bonding machine to start the wire bonding process. The ultrasonic wire bonding machine starts the welding operation according to the new parameter settings. During the wire bonding process, real-time image data is continuously acquired. These image data are used to monitor the quality of the wire bonding and provide feedback for the next round of parameter adjustment. During the wire bonding process, the real-time wire bonding parameters and image data are continuously monitored, and the parameters are adjusted as needed. By iteratively optimizing the control parameters, the quality of the wire bonding can be gradually improved to ensure that the final wire bonding meets the expected requirements. Repeat the above steps until the wire bonding of the entire target LED semiconductor is completed. By dynamically adjusting the control parameters and continuously monitoring the real-time data, fine control of the wire bonding process can be achieved, thereby ensuring that the wire bonding quality meets the requirements and improving production efficiency.

[0157] Preferably, the control parameter is adjusted according to the real-time wire bonding parameter and the wire bonding path, and the control parameter is returned to control the ultrasonic wire bonding machine to perform wire bonding and obtain real-time image data during the wire bonding process until the wire bonding of the target LED semiconductor is completed, including:

[0158] S51, establishing a matching relationship between the fitting welding wire and each of the sub-welding wire paths according to the actual welding wire shape information and the second shape parameter;

[0159] In this step, it is necessary to establish a matching relationship between the actual welding wires and the sub-welding wire paths divided according to the preset division rules based on their shape information, which includes determining which sub-welding wire path each actual welding wire best matches, and associating the actual welding wires with their corresponding sub-welding wire paths.

[0160] S52, acquiring actual welding wire shape information and actual welding wire quality information corresponding to the actual welding wire being processed according to the matching relationship and the actual welding wire shape information, and recording them as target shape information and target quality information respectively;

[0161] According to the matching relationship established previously, the sub-welding wire path corresponding to the actual welding wire being processed is determined, the actual welding wire is associated with its corresponding sub-welding wire path and the corresponding target shape information and target quality information are obtained. This information will be used as a basis for determining whether the control parameters need to be adjusted.

[0162] S53, acquiring shape similarity between an actual welding wire and the corresponding sub-welding wire path according to the target shape information and the corresponding second shape parameter;

[0163] Specifically, according to the target shape information and the second shape parameter, the shape difference between the actual welding wire and the corresponding sub-welding wire path is calculated. This may include differences in the length, curvature, width, etc. of the welding wire. The calculated shape difference value is normalized to compare the similarity between different welding wires. Normalization can be performed by methods such as standardization or linear normalization to convert the difference value into a range between 0 and 1. Using the normalized shape difference value, a shape similarity measure between the actual welding wire and the sub-welding wire path can be obtained. The closer the similarity measure value is to 1, the more similar the shape between the actual welding wire and the sub-welding wire path is, and vice versa, the greater the shape difference is. Through the above steps, the shape similarity between the actual welding wire and the sub-welding wire path can be accurately calculated based on the target shape information and the second shape parameter, providing a basis for subsequent judgment and adjustment.

[0164] S54, judging whether the control parameter needs to be adjusted according to the shape similarity and the target quality information;

[0165] Specifically, the shape similarity reflects the degree of shape consistency between the actual weld wire and the expected weld wire. If the shape similarity is close to 1, it means that the actual weld wire is very similar to the expected weld wire shape, indicating that the welding process may be in good condition; if the shape similarity is low, it means that there is a large difference between the actual weld wire and the expected weld wire shape, and the welding parameters may need to be adjusted. The target quality information includes parameters such as the continuity, integrity and width consistency of the weld wire. These parameters reflect the quality status of the weld wire during the welding process. If the target quality information shows that the weld wire quality is poor, such as breakage, defects or uneven width, the welding parameters may need to be adjusted to improve the welding quality.

[0166] According to the shape similarity and target quality information, a threshold can be set to determine whether the control parameters need to be adjusted. For example, but not limitation, if the shape similarity is low or the target quality information shows that the welding line quality is poor, and exceeds the preset threshold, then the system can determine that the control parameters need to be adjusted to improve the welding quality; if the shape similarity is high and the target quality information shows that the welding line quality is good, the current control parameters can be maintained unchanged.

[0167] S55, if necessary, adjusting the control parameter according to the shape similarity and the target quality information;

[0168] Specifically, if the control parameters need to be adjusted based on the shape similarity and target quality information, the control parameters will be adjusted accordingly. The shape similarity reflects the degree of shape consistency between the actual weld wire and the expected weld wire. If the shape similarity is low, it means that the shape of the actual weld wire is quite different from the expected weld wire shape, and the control parameters may need to be adjusted to correct the weld wire shape. The target quality information includes parameters such as the continuity, integrity, and width consistency of the weld wire. If the target quality information shows that the weld wire quality is poor, such as breakage, defects, or uneven width, the control parameters may need to be adjusted to improve the welding quality.

[0169] The way to adjust the control parameters can be determined according to the specific situation. For example, the amplitude or frequency of the ultrasonic vibration parameters can be increased or decreased, the bonding pressure parameters can be adjusted, the temperature parameters can be modified, etc. These adjustments may affect the vibration of the welding head, the pressure applied, the temperature control, and the welding speed, etc., thereby changing the shape and quality of the weld during the welding process. If the surface of the weld is not smooth, the temperature parameters can be adjusted to increase or decrease the welding temperature to improve the quality of the weld surface. If the weld point is not firm, the workbench movement speed parameters can be adjusted to ensure that the weld point is fully fused and firm. If the weld is prone to breaking, the bonding pressure parameters can be increased to increase the firmness of the weld.

[0170] Preferably, adjusting the control parameter according to the shape similarity and the target quality information includes:

[0171] S541, when the target quality information does not meet the preset quality condition, adjusting one or more of the ultrasonic vibration parameter, bonding pressure parameter, temperature parameter and welding time according to a preset adaptive control algorithm;

[0172] Specifically, if the target quality information does not meet the preset quality conditions, it means that there may be problems with welding quality during the welding process, such as broken welding wires, unsatisfactory welding point quality, etc. The preset adaptive control algorithms include PID control algorithms, fuzzy logic control algorithms, etc. The fuzzy logic control algorithm is based on fuzzy logic principles and applies fuzzy rules to the control system. It adjusts the control parameters by fuzzifying the input and output variables and performing reasoning and fuzzy reasoning based on a set of fuzzy rules.

[0173] According to the actual quality problem, select the control parameters that need to be adjusted. You can adjust one parameter alone or multiple parameters at the same time. According to the preset adaptive control algorithm, adjust the selected control parameters. For example, if the quality of the wire is not ideal, you need to increase the bonding pressure parameter or adjust the ultrasonic vibration parameter to increase the firmness of the wire. This adaptive control algorithm can make the welding process more stable and efficient, while ensuring the stability and consistency of the welding quality, which helps to improve the overall efficiency of the production line and the quality level of the product.

[0174] S542: when the shape similarity is less than or equal to a preset similarity threshold, performing a difference calculation based on the target shape information and the corresponding second shape parameter to obtain a first shape deviation degree in the X direction and a second shape deviation degree in the Y direction;

[0175] Specifically, the shape deviation is evaluated by calculating the difference between the actual welding wire shape information and the target shape information in the X and Y directions. Specifically, the position, length, curvature and other features of the actual welding wire and the target welding wire in the X and Y directions are compared, and the difference values ​​of each feature are calculated; through the target shape information and the corresponding second shape parameter, the features of the actual welding wire and the target welding wire in the X and Y directions can be obtained, and the position, length, curvature and other features of the actual welding wire and the target welding wire in the X direction are compared, and the difference between these features is calculated, such as the actual welding wire length minus the target welding wire length, the actual welding wire curvature minus the target welding wire curvature, etc., and the calculated difference value is normalized so that it is within a comparable range, thereby obtaining the first shape deviation degree in the X direction and the second shape deviation degree in the Y direction. The first shape deviation degree indicates the deviation degree of the actual welding wire from the target welding wire in the X direction. The second shape deviation degree indicates the deviation degree of the actual welding wire from the target welding wire in the Y direction. These indicators can indicate the deviation of the actual welding wire shape relative to the target shape, which is the basis for shape adjustment. A large deviation degree means that the shape difference between the actual welding wire and the target welding wire is large.

[0176] S543. Adjust the first moving speed and the second moving speed according to the first shape deviation degree and / or the second shape deviation degree, wherein the first moving speed is negatively correlated with the first shape deviation degree, and the second moving speed is negatively correlated with the second shape deviation degree.

[0177] The first moving speed is to control the moving speed of the ultrasonic wire bonding machine in the X direction. When the first shape deviation is large, it means that the shape difference between the actual welding wire and the target welding wire is large and needs to be adjusted. In order to make the actual welding wire shape closer to the target shape, the movement of the welding wire in the X direction can be slowed down by reducing the first moving speed, so as to better control the shape of the welding wire. The second moving speed is to control the moving speed of the ultrasonic wire bonding machine in the Y direction. When the second shape deviation is large, in order to make the actual welding wire shape closer to the target shape, the movement of the welding wire in the Y direction can be slowed down by reducing the second moving speed, so as to better control the shape of the welding wire.

[0178] Preferably, adjusting the first moving speed and the second moving speed according to the first shape deviation degree and / or the second shape deviation degree includes:

[0179] S5431: when the first shape deviation degree is less than a first shape deviation degree threshold, and / or when the second shape deviation degree is less than a second shape deviation degree threshold, adjusting the first moving speed and the second moving speed according to a closed-loop control algorithm;

[0180] When the first shape deviation is less than the first shape deviation threshold, and / or when the second shape deviation is less than the second shape deviation threshold, it indicates that the actual welding line is relatively close to the target shape, and there is no need to significantly adjust the moving speed. In the case of a small shape deviation, excessive adjustment of the moving speed may cause repeated fluctuations in the shape of the welding line, affecting the accuracy and stability of welding. Therefore, a closed-loop control algorithm can be used to make fine adjustments based on the real-time shape deviation to more finely control the adjustment of the welding line shape and avoid excessive adjustment.

[0181] The closed-loop control algorithm can intelligently adjust the moving speed based on real-time feedback information, making it more adaptable to changes in the shape of the welding line. This can avoid unnecessary waste of energy and resources and improve welding efficiency and resource utilization.

[0182] S5432: When the first shape deviation degree is greater than or equal to a first shape deviation degree threshold, adjust the first moving speed according to a first moving speed adjustment formula, wherein the expression of the first moving speed adjustment formula is as follows: Where V1 new is the first moving speed after adjustment, V1 old is the first moving speed before adjustment, α1 is the first shape deviation coefficient, which is used to adjust the influence of the first shape deviation degree on the first moving speed, ΔL1 is the first shape deviation degree, and Lt is the target shape information after normalization;

[0183] When the first shape deviation degree is greater than or equal to the first shape deviation degree threshold, the first moving speed is adjusted according to the first moving speed adjustment formula, where V1new represents the adjusted X-direction moving speed and V1old is the original X-direction moving speed. The adjustment amount of the first moving speed is determined by the shape deviation degree ΔL1. The greater the deviation degree, the greater the adjustment amount. By comparing the shape deviation amount ΔL1 with the target shape information Lt, it is ensured that the ratio of the adjustment amount matches the size of the target shape. The first shape deviation coefficient α1 is used to adjust the degree of influence of the shape deviation on the moving speed adjustment. A larger value will make the shape deviation have a more significant effect on the speed adjustment, thereby correcting the deviation faster; while a smaller value will slow down the speed adjustment and make the adjustment process smoother.

[0184] The shape deviation coefficient can be set to a reasonable initial value based on experience, and then adjusted through actual testing. According to the experimental results, the size of α is gradually adjusted until the best system performance and welding quality are achieved. Optimization algorithms, such as genetic algorithms and particle swarm algorithms, can be used to automatically search for the optimal α value. By setting optimization goals and constraints, the optimization algorithm can help the system find the most suitable parameter combination to achieve the best welding performance.

[0185] Through the above formula, the system can adjust the moving speed of the welding head in real time according to the actual shape deviation during welding to ensure that the shape of the welding line is as close to the target shape as possible. This adaptive speed adjustment mechanism can improve welding quality and stability, and make the system have better adaptability and control ability.

[0186] S5433: When the second shape deviation degree is greater than or equal to a second shape deviation degree threshold, adjust the second moving speed according to a second moving speed adjustment formula, wherein the expression of the second moving speed adjustment formula is as follows: Where V2 new is the adjusted second moving speed, V2 old is the second moving speed before adjustment, α2 is the shape deviation coefficient, which is used to adjust the influence of the second shape deviation degree on the second moving speed, ΔL2 is the second shape deviation degree, and Lt is the target shape information after normalization.

[0187] This formula is similar to that in S5442 and will not be repeated here;

[0188] S56, returning to the step of controlling the ultrasonic wire bonding machine to perform wire bonding according to the control parameters and acquiring real-time image data during the wire bonding process until the wire bonding of the target LED semiconductor is completed.

[0189] Finally, according to the adjusted control parameters, the ultrasonic wire bonding machine is controlled to perform wire bonding, and real-time image data is continuously acquired to monitor the quality of the wire bonding. This process will continue until all wire bonding of the target LED semiconductor is completed.

[0190] Example 2

[0191] See also Figure 5 The embodiment of the present invention further provides a dynamic adjustment system for generating a specified arc of an LED semiconductor wire, the system comprising: a control module, an ultrasonic wire bonding machine, an image acquisition module, a sensor module and a power supply module; wherein the ultrasonic wire bonding machine is used to bond the wires of LED semiconductors, the image acquisition module is used to acquire real-time image data during the wire bonding process, the sensor module is used to monitor key parameters during the wire bonding process, the key parameters including temperature data and pressure data; the power supply module is used to supply energy to the system, and the controller is used to execute the dynamic adjustment method for generating a specified arc of an LED semiconductor wire as described in Example 1.

[0192] Specifically, the ultrasonic wire bonding machine is used to bond the wires of LED semiconductors and is responsible for the actual welding operation. The wire bonding machine operates according to the parameters and instructions sent by the control module and generates the wire bonding of LED semiconductors. The image acquisition module is used to collect real-time image data during the wire bonding process. These data can be used to monitor the shape, position and quality of the wire bonding, providing a basis for subsequent adjustments. The sensor module is used to monitor key parameters in the wire bonding process, including temperature data and pressure data. These data can reflect the real-time status of the welding process and help the system to adjust and optimize. The power module provides energy for the entire system to ensure the normal operation of each component. The control module controls the operation of the entire system and is responsible for coordinating the communication and data transmission between the various components.

[0193] Through the collaboration of the above components, the system can achieve dynamic adjustment of the LED semiconductor wire generation process. The control module monitors the status and quality of the wire generation process in real time based on the data fed back by the image acquisition module and the sensor module, and adjusts and optimizes according to the preset algorithms and rules to ensure that the shape, position and quality of the wire meet the design requirements. The automation and real-time performance of the entire system can improve the accuracy and stability of wire generation, thereby improving the production efficiency and quality of LED semiconductors.

[0194] Example 3

[0195] In addition, in combination with the above-mentioned method for dynamically adjusting the LED semiconductor bonding wire to generate a specified arc, the present invention can provide a computer-readable storage medium for implementation. The computer-readable storage medium stores computer program instructions; when the computer program instructions are executed by a processor, any of the above-mentioned methods for dynamically adjusting the LED semiconductor bonding wire to generate a specified arc is implemented.

[0196] It should be clear that the present invention is not limited to the specific configuration and processing described above and shown in the figures. For the sake of simplicity, a detailed description of the known method is omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present invention is not limited to the specific steps described and shown, and those skilled in the art can make various changes, modifications and additions, or change the order between the steps after understanding the spirit of the present invention.

[0197] The functional blocks shown in the structural block diagram described above can be implemented as hardware, software, firmware or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application specific integrated circuit (ASIC), appropriate firmware, a plug-in, a function card, etc. When implemented in software, the elements of the present invention are programs or code segments used to perform the required tasks. The program or code segment can be stored in a machine-readable medium, or transmitted on a transmission medium or a communication link by a data signal carried in a carrier. "Machine-readable medium" may include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROMs, flash memories, erasable ROMs (EROMs), floppy disks, CD-ROMs, optical disks, hard disks, optical fiber media, radio frequency (RF) links, etc. The code segment can be downloaded via a computer network such as the Internet, an intranet, etc.

[0198] It should also be noted that the exemplary embodiments mentioned in the present invention describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiments, or in a different order from the embodiments, or several steps can be performed simultaneously.

[0199] The above is only a specific implementation of the present invention. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the system, module and unit described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. It should be understood that the protection scope of the present invention is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be covered within the protection scope of the present invention.

Claims

1. A method for adjusting the arc of a bonding wire of an LED semiconductor device in combination with machine vision, characterized in that: The method comprises: According to the wire bonding path determined after the LED semiconductor is laid out on the workbench of the ultrasonic wire bonding machine, the control parameters of the ultrasonic wire bonding machine are obtained, wherein the control parameters include the moving speed of the workbench; According to the control parameters, the ultrasonic wire bonding machine is controlled to perform wire bonding and obtain real-time image data during the wire bonding process; According to the real-time image data, real-time welding line information is obtained, and the real-time welding line information includes: actual welding line shape information and actual welding line quality information, specifically including: Preprocessing the real-time image data to obtain target image data, According to a preset contour extraction algorithm, the weld line contour in the target image data is obtained, Perform curve fitting according to a preset curve fitting algorithm and the weld line profile to obtain a fitted weld line, Acquiring the real-time welding line information according to the fitted welding line and the welding line profile; According to the real-time wire bonding information and the wire bonding path, the control parameters are adjusted and the ultrasonic wire bonding machine is controlled to bond wires on the LED semiconductor device; The acquiring the real-time welding line information according to the fitted welding line and the welding line profile includes: According to the fitted welding wires, acquiring the actual welding wire shape information, wherein the actual welding wire shape information includes the actual welding wire length, the actual welding wire curvature and the welding wire width; According to the welding wire profile, the actual welding wire quality information is obtained, wherein the actual welding wire quality information includes welding wire continuity parameters and welding wire integrity parameters and width consistency; The obtaining the moving speed of the workbench according to the welding wire path comprises: Determining a first shape parameter of the welding wire path according to the welding wire path; Dividing the bonding wire path into a plurality of sub-bonding wire paths according to the first shape parameter and a preset division rule; According to the first shape parameter, obtaining a second shape parameter corresponding to each of the sub-welding wire paths; Determining a workbench moving speed of each of the corresponding sub-welding wire paths according to each of the second shape parameters; Among them, the first shape parameter includes the target welding wire length, welding wire curvature and welding point position; the workbench moving speed is positively correlated with the length of the corresponding sub-welding wire path, and the workbench moving speed is negatively correlated with the curvature of the corresponding sub-welding wire path and the number of welding points in the sub-welding wire path.

2. The method according to claim 1, characterized in that The preset curve fitting algorithm includes one of a polynomial fitting algorithm, a Bezier curve fitting algorithm and a spline curve fitting algorithm.

3. The method according to any one of claims 1 to 2, characterized in that: The step of obtaining control parameters of the ultrasonic wire bonding machine according to the wire bonding path includes: Acquiring ultrasonic vibration parameters, bonding pressure parameters, and temperature parameters according to material properties of the bonding wire material, wherein the material properties include material type and material thickness; Obtaining welding time according to the temperature parameter and the moving speed of the workbench; The control parameter is obtained according to the ultrasonic vibration parameter, the bonding pressure parameter, the temperature parameter, the workbench moving speed and the welding time.

4. The method according to claim 3, characterized in that The adjusting the control parameters and controlling the ultrasonic wire bonding machine to bond wires on the LED semiconductor device according to the real-time wire bonding information and the wire bonding path comprises: Establishing a matching relationship between the fitting welding wire and each of the sub-welding wire paths according to the actual welding wire shape information and the second shape parameter, wherein the matching relationship includes an association relationship between the actual welding wire and the most matching sub-welding wire path; According to the matching relationship and the actual welding wire shape information, actual welding wire shape information and actual welding wire quality information corresponding to the actual welding wire being processed are obtained, and recorded as target shape information and target quality information respectively; Acquire a shape similarity between an actual welding wire and a corresponding sub-welding wire path according to the target shape information and a corresponding second shape parameter; Determining whether the control parameter needs to be adjusted according to the shape similarity and the target quality information; If necessary, the control parameters are adjusted according to the shape similarity and the target quality information, which specifically includes: When the target quality information does not meet the preset quality condition, adjusting one or more of the ultrasonic vibration parameter, the bonding pressure parameter, the temperature parameter and the welding time according to a preset adaptive control algorithm; When the shape similarity is less than or equal to a preset similarity threshold, performing a difference calculation based on the target shape information and the corresponding second shape parameter to obtain a first shape deviation degree in the X direction and a second shape deviation degree in the Y direction; adjusting a first moving speed and a second moving speed according to the first shape deviation degree and / or the second shape deviation degree, wherein the first moving speed is negatively correlated with the first shape deviation degree, and the second moving speed is negatively correlated with the second shape deviation degree; Returning to the control parameters, controlling the ultrasonic wire bonding machine to perform wire bonding and acquiring real-time image data during the wire bonding process until the wire bonding of the target LED semiconductor is completed.

5. The method according to claim 3, characterized in that: The step of determining the workbench moving speed of each of the sub-welding wire paths according to each of the second shape parameters includes: Acquire a second shape parameter of each of the sub-welding wire paths, wherein the second shape parameter includes a curvature of the sub-welding wire path, a length of the sub-welding wire path, and a number of welding points on the sub-welding wire path; Performing parameter fitting on the sub-bonding wire path according to the second shape parameter to obtain a parameter equation of the sub-bonding wire path; According to the second shape parameter, a parameter equation of the sub-welding wire path is obtained by a fitting algorithm; according to the parameter equation, a first curvature change rate in the X direction and a second curvature change rate in the Y direction of the sub-welding wire path are calculated; Projecting the length of the sub-bonding wire path according to the angles between the sub-bonding wire path and the X direction and the Y direction to obtain the length in the X direction and the length in the Y direction; Determine a first moving speed of the workbench in the X direction according to the first curvature change rate, the length in the X direction, and the number of welding points, wherein the first moving speed, the first curvature change rate, and the number of welding points are negatively correlated, and the first moving speed and the length in the X direction are positively correlated; Determine a second moving speed of the workbench in the Y direction according to the second curvature change rate, the length in the Y direction, and the number of welding points, wherein the second moving speed, the second curvature change rate, and the number of welding points are negatively correlated, and the second moving speed and the length in the Y direction are positively correlated; The workbench moving speed of the sub-bonding wire path is determined according to the first moving speed and the second moving speed.

6. A system for adjusting the arc of a bonding wire of an LED semiconductor device in combination with machine vision, characterized in that: The system comprises an ultrasonic welding machine and a camera arranged on the ultrasonic welding machine, wherein the system adopts the method described in any one of claims 1-5.

7. The system according to claim 6, characterized in that The ultrasonic wire welding machine includes: a frame, a welding head, a workbench, a first driving mechanism, a second driving mechanism and the camera, wherein the workbench is arranged on the frame and connected to the first driving mechanism, the first driving mechanism is used to drive the workbench to reciprocate in the horizontal direction, the second driving mechanism is connected to the welding head, and is used to drive the welding head to reciprocate in the vertical direction, and the camera is used to obtain real-time image data.

8. The system according to claim 7, characterized in that The system also includes: a control module, a sensor module and a power module; wherein the sensor module is used to monitor key parameters in the wire welding process, and the key parameters include temperature data and pressure data; the power module is used to supply energy to the system, and the control module is used to control the ultrasonic wire welding machine, the first drive mechanism, the second drive mechanism and the camera.

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