Microwave full-field three-dimensional displacement measurement method and system

Abstract

The present application discloses a microwave full-field three-dimensional displacement measurement method and system, which relates to displacement measurement fields such as deformation and vibration measurement. A structural coordinate system is established according to the target to be measured; a device coordinate system is established based on the microwave transceiver; the measurement points are mapped from the structural coordinate system to the microwave transceiver distance angle heat map to match the measurement points; the displacement time series of the measurement points of the target to be measured is monitored to obtain the initial three-dimensional displacement time series of the target to be measured in the device coordinate system; based on the conversion correspondence from the device coordinate system to the structural coordinate system, the transformed three-dimensional displacement time series of the target to be measured in the structural coordinate system is calculated. The present application realizes the automatic matching of the global measurement point selection in complex scenes based on microwave sensing three-dimensional displacement measurement, which can obtain the relative three-dimensional displacement information of the global measurement points based on the target to be measured or the structure itself, which is more concerned in engineering practice. It has high reliability and high efficiency, and is convenient for post-processing and analysis and calculation in different scenes.

Description

Technical Field

[0001] The present application relates to the field of displacement measurement including deformation and vibration, and in particular to a microwave full-field three-dimensional displacement measurement method and system. Background Art

[0002] Vibration and deformation are common phenomena in nature. Health monitoring of large buildings and bridges, status characterization and fault diagnosis of mechanical equipment, and even mechanical property analysis of biological tissues all require the measurement or monitoring of their vibration and deformation. Displacement is an important physical quantity that characterizes the degree of vibration and deformation and other forms of motion, and contains various key information in the time domain and frequency domain.

[0003] Microwave-based displacement measurement technology offers advantages such as long-range, high sensitivity, and strong environmental adaptability. However, it cannot accurately measure the full-field three-dimensional displacement of targets or measurement points, as required by actual engineering projects. Full-field three-dimensional displacement measurement reveals the three-dimensional displacement of all measured objects or measurement points within the field of view. This technology is urgently needed in complex scenes or equipment, structural vibration and deformation monitoring, and various motion information sensing applications. Summary of the Invention

[0004] After long-term observation and experiments, the inventors found that the existing technology still has the following problems:

[0005] (1) It can only measure the three-dimensional displacement of a single target or a few measurement points. When the measurement scene is complex and there are many measurement points or targets in the whole field, since multiple microwave transceivers are arranged at intervals in space, the coordinates of different measurement points in the distance angle thermal image of each microwave transceiver are obviously different and difficult to match. There is a problem that it is difficult to match the distance angle thermal image of the same target or measurement point in different microwave transceivers. As a result, it is difficult or even impossible to extract the distance of the same target object in the line of sight direction of each microwave transceiver and its corresponding displacement information based on the baseband signal, thereby failing to achieve the three-dimensional displacement measurement of the target or measurement point to be measured.

[0006] (2) Three-dimensional displacement measurement is based on a device coordinate system constructed by several measuring devices, such as microwave transceivers. Once the position of the microwave transceiver is determined, the device coordinate system is also determined. If you want to measure the displacement of a certain direction of the target, you can only make this direction as parallel as possible to a certain coordinate axis of the device coordinate system. Since displacement measurement using a microwave transceiver is a non-contact measurement, the microwave transceiver is generally several meters to tens of meters away from the target. In actual measurement, it is difficult to ensure that a certain coordinate axis of the device coordinate system is strictly parallel or perpendicular to the displacement direction that the user needs to measure, and it is also difficult to obtain the displacement component in the direction required by the user.

[0007] (3) Since the three-dimensional displacement measurement of the target can only be performed in the coordinate system of the device composed of multiple microwave transceivers, the distribution and spacing of the multiple microwave transceivers are fixed, and the structural dimensions of the fixed multiple microwave transceivers are limited. The position and size of the spatial distribution are strictly restricted, resulting in a significant increase in the measurement error, especially for targets or measuring points at a longer distance, the error will increase sharply.

[0008] (4) Only the three-dimensional displacement of the target under test can be obtained in the device coordinate system established by several microwave transceivers, that is, the displacement measurement result can only rely on the coordinate system formed by several microwave transceivers, and the three-dimensional displacement in the reference coordinate system of the target under test or the structure itself cannot be obtained. However, in actual engineering, special attention is paid to and the three-dimensional displacement information of the target under test in the whole field is required based on the target under test or the structure itself.

[0009] In view of the above-mentioned defects of the prior art, the present application provides a microwave full-field three-dimensional displacement measurement method and system. First, based on the measured target, three or more microwave transceivers are arranged, reference targets or measuring points are selected, and a structural coordinate system is established. The three-dimensional coordinates of each microwave transceiver in the structural coordinate system are calculated. Second, a device coordinate system is established based on the spatial distribution of multiple microwave transceivers. Next, the measuring points are mapped from the structural coordinate system to the microwave transceiver distance angle heat map to obtain the coordinates of the measuring points in the distance angle heat map of all microwave transceivers (or distance angle unit positions). Furthermore, the corresponding measuring points of each microwave transceiver are selected based on the obtained distance angle heat map coordinates, and all microwave transceivers are controlled to simultaneously perform displacement time series measurements on the measuring points. The microwave transceivers simultaneously transmit frequency-modulated continuous wave microwave signals to the measuring points and receive their corresponding echo signals. The baseband signals are extracted from the baseband signals to obtain the distance of each measuring point in the line of sight of each microwave transceiver and its corresponding displacement information, and the three-dimensional displacement time series of the measuring points in the device coordinate system is calculated. Finally, the conversion correspondence between the device coordinate system and the structural coordinate system is calculated as needed, and the three-dimensional displacement time series of the measuring points in the structural coordinate system is calculated.

[0010] The present application provides a microwave full-field three-dimensional displacement measurement method, comprising: establishing a structural coordinate system based on a measured target; establishing a device coordinate system based on a first microwave transceiver, a second microwave transceiver, and a third microwave transceiver; monitoring the displacement time series of the measured target through the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver to obtain an initial three-dimensional displacement time series of the measured target in the device coordinate system; establishing a coordinate transformation relationship from the device coordinate system to the structural coordinate system based on the device coordinate system and the structural coordinate system; and calculating a transformed three-dimensional displacement time series of the measured target in the structural coordinate system based on the coordinate transformation relationship and the initial three-dimensional displacement time series.

[0011] In some embodiments, optionally, the detection field of view of the first microwave transceiver can cover the target being measured; the detection field of view of the second microwave transceiver can cover the target being measured; and the detection field of view of the third microwave transceiver can cover the target being measured.

[0012] In some embodiments, optionally, the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver are not located on a collinear basis.

[0013] In some embodiments, optionally, a plane formed by two displacement directions to be measured of the target to be measured is selected as a reference target plane; a first reference target, a second reference target, and a third reference target are selected within the reference target plane, wherein the first reference target, the second reference target, and the third reference target are non-collinear; and a structural coordinate system is established based on the first reference target, the second reference target, and the third reference target.

[0014] In some embodiments, optionally, the detection field of view of the first microwave transceiver can cover the first reference target; the detection field of view of the second microwave transceiver can cover the first reference target; and the detection field of view of the third microwave transceiver can cover the first reference target; the detection field of view of the first microwave transceiver can cover the second reference target; the detection field of view of the second microwave transceiver can cover the second reference target; and the detection field of view of the third microwave transceiver can cover the second reference target; the detection field of view of the first microwave transceiver can cover the third reference target; the detection field of view of the second microwave transceiver can cover the third reference target; and the detection field of view of the third microwave transceiver can cover the third reference target.

[0015] In some embodiments, optionally, the structure coordinate system includes an origin O S 、X S Axis, Y S Axis, Z S Axis; where the origin O S is the location of the first reference target; Y S The positive direction of the X axis is the direction from the first reference target to the second reference target; S The positive direction of the Y axis S The positive direction of the Z axis is vertical and points to the half plane where the third reference target is located; S The positive direction of the axis points to the half space where the first microwave transceiver, the second microwave transceiver and the third microwave transceiver are located.

[0016] In some embodiments, optionally, the coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the structural coordinate system are calculated based on the distances between the first microwave transceiver and the first reference target, the second reference target, and the third reference target, respectively.

[0017] In some embodiments, optionally, a device coordinate system is established according to the coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the structure coordinate system.

[0018] In some embodiments, the device coordinate system optionally includes an origin O D 、X D Axis, Y D Axis, Z D Axis; where the origin O D is the position of the first microwave transceiver; X D O D Y D The plane is the plane formed by the positions of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver; Z D Axis and X D O D Y D The plane is vertical and points in the direction of the target being measured; Y D The positive direction of the X axis is the direction from the first microwave transceiver to the second microwave transceiver; D The positive direction of the axis is the direction pointing to the half space where the third microwave transceiver is located.

[0019] In some embodiments, optionally, the coordinates of the target to be measured in the distance angle heat map of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver are calculated based on the coordinates of the target to be measured, the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the structural coordinate system.

[0020] In some embodiments, optionally, a measuring point of the target to be measured in the first microwave transceiver is matched according to the coordinates of the target to be measured in the range-angle heat map of the first microwave transceiver.

[0021] In some embodiments, optionally, the measuring point of the target to be measured in the second microwave transceiver is matched according to the coordinates of the target to be measured in the range-angle heat map of the second microwave transceiver.

[0022] In some embodiments, optionally, the measuring point of the target to be measured in the third microwave transceiver is matched according to the coordinates of the target to be measured in the range-angle heat map of the third microwave transceiver.

[0023] In some embodiments, optionally, a coordinate conversion relationship is calculated based on the coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the device coordinate system and the coordinates in the structure coordinate system.

[0024] In some embodiments, optionally, the coordinate transformation relationship includes a rotation matrix and a translation matrix from the device coordinate system to the structure coordinate system.

[0025] In some embodiments, optionally, a standard orthogonal basis transformation method is used to calculate the rotation matrix and the translation matrix.

[0026] On the other hand, the present application also provides a microwave full-field three-dimensional displacement measurement system, including: a reference target module, configured to establish a structural coordinate system based on the target to be measured; a three-dimensional displacement solution module, configured to establish a device coordinate system based on the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver; a microwave sensing and control module, configured to monitor the displacement time series of the target to be measured through the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver; the three-dimensional displacement solution module is further configured to obtain the initial three-dimensional displacement time series of the target to be measured in the device coordinate system; a coordinate transformation relationship calculation unit, configured to establish a coordinate transformation relationship from the device coordinate system to the structural coordinate system based on the device coordinate system and the structural coordinate system; a structural coordinate system three-dimensional displacement conversion unit, configured to calculate the converted three-dimensional displacement time series of the target to be measured in the structural coordinate system based on the coordinate transformation relationship and the three-dimensional displacement time series in the device coordinate system.

[0027] In some embodiments, optionally, the microwave sensing and control module is further configured so that the detection field of view of the first microwave transceiver can cover the target being measured; the detection field of view of the second microwave transceiver can cover the target being measured; and the detection field of view of the third microwave transceiver can cover the target being measured.

[0028] In some embodiments, optionally, the microwave sensing and control module is further configured so that the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver are not located on a colinear line.

[0029] In some embodiments, optionally, the reference target module is further configured to be able to select a plane formed by two displacement directions to be measured of the target to be measured as a reference target plane; select a first reference target, a second reference target, and a third reference target in the reference target plane, wherein the first reference target, the second reference target, and the third reference target are non-collinear; and establish a structural coordinate system based on the first reference target, the second reference target, and the third reference target.

[0030] In some embodiments, optionally, the microwave sensing and control module is further configured so that the detection field of view of the first microwave transceiver can cover the first reference target; the detection field of view of the second microwave transceiver can cover the first reference target; and the detection field of view of the third microwave transceiver can cover the first reference target; the detection field of view of the first microwave transceiver can cover the second reference target; the detection field of view of the second microwave transceiver can cover the second reference target; and the detection field of view of the third microwave transceiver can cover the second reference target; the detection field of view of the first microwave transceiver can cover the third reference target; the detection field of view of the second microwave transceiver can cover the third reference target; and the detection field of view of the third microwave transceiver can cover the third reference target.

[0031] In some embodiments, optionally, the reference target module is further configured to have a structure coordinate system including an origin O S 、X S Axis, Y S Axis, Z S Axis; where the origin O S is the location of the first reference target; Y S The positive direction of the X axis is the direction from the first reference target to the second reference target; S The positive direction of the Y axis S The positive direction of the Z axis is vertical and points to the half plane where the third reference target is located; S The positive direction of the axis points to the half space where the first microwave transceiver, the second microwave transceiver and the third microwave transceiver are located.

[0032] In some embodiments, optionally, it further includes: a coordinate calculation unit, configured to calculate the coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the structural coordinate system based on the distances between the first microwave transceiver and the first reference target, the second reference target, and the third reference target, respectively.

[0033] In some embodiments, optionally, the three-dimensional displacement solving module is further configured to establish a device coordinate system according to the coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the structural coordinate system.

[0034] In some embodiments, optionally, the three-dimensional displacement solving module is further configured to include an origin O in the device coordinate system. D 、X D Axis, Y D Axis, Z D Axis; where the origin O D is the position of the first microwave transceiver; X D O D Y DThe plane is the plane formed by the positions of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver; Z D Axis and X D O D Y D The plane is vertical and points in the direction of the target being measured; Y D The positive direction of the X axis is the direction from the first microwave transceiver to the second microwave transceiver; D The positive direction of the axis is the direction pointing to the half space where the third microwave transceiver is located.

[0035] In some embodiments, optionally, it further includes: a measurement point matching and selection module, which is configured to calculate the coordinates of the measured target in the distance angle heat map of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver based on the coordinates of the measured target, the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the structural coordinate system.

[0036] In some embodiments, optionally, the measurement point matching and selection module is further configured to match the measurement points of the target to be measured in the distance angle heat maps of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver based on the coordinates of the target to be measured in the distance angle heat maps of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver.

[0037] In some embodiments, optionally, the coordinate transformation relationship calculation unit is further configured to calculate the coordinate transformation relationship based on the coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the device coordinate system and the coordinates in the structure coordinate system.

[0038] In some embodiments, optionally, the coordinate transformation relationship calculation unit is further configured to be able to calculate the rotation matrix and translation matrix from the device coordinate system to the structure coordinate system included in the coordinate transformation relationship.

[0039] In some embodiments, optionally, the coordinate transformation relationship calculation unit is further configured to calculate the rotation matrix and the translation matrix using a standard orthogonal basis transformation method.

[0040] On the other hand, the present application also provides a microwave full-field three-dimensional displacement measurement device, including a memory, a processor, and a computer program stored in the memory and capable of running on the processor. The processor is configured to implement the steps of the above-mentioned microwave full-field three-dimensional displacement measurement method when executing the computer program.

[0041] On the other hand, the present application also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of the above-mentioned microwave full-field three-dimensional displacement measurement method can be implemented.

[0042] The technical solution of this application has at least the following advantages over the prior art:

[0043] (1) This application can customize a structural coordinate system near the target to be measured. Since this coordinate system is near the structure or itself, it can make certain coordinate axes of the structural coordinate system parallel or perpendicular to the displacement direction that the user needs to measure with high accuracy.

[0044] (2) If the reference target is on a modeled structure, the spacing of the reference targets can be accurately measured in three dimensions in the three-dimensional digital model of the structure; if a calibration reference object is placed as a reference target, a calibration reference object model with a known spacing can be designed; this can improve measurement accuracy.

[0045] (3) The present application can complete the positioning of microwave transceivers in the structural coordinate system, thereby automatically and accurately calculating the spacing between microwave transceivers. Therefore, microwave sensing three-dimensional displacement measurement can be performed with higher calculation accuracy, and the displacement component in the required direction can be obtained with high precision.

[0046] (4) The present application can obtain the coordinates of the measuring points in the distance angle heat map of all microwave transceivers, realize the automatic matching and automatic selection of full-field measuring points in all microwave transceivers in complex scenes, and realize full-field three-dimensional displacement measurement based on microwave perception of multiple measuring points or full-field measuring points.

[0047] (5) The implementation process of this application only requires more than or equal to three reference targets or measuring points and more than or equal to three microwave transceivers to obtain the three-dimensional displacement information of all measuring points or targets in the field of view. The layout requirements are loose, the hardware complexity is low, and the test efficiency is high. The measuring points can be directly selected in the structural coordinate system established by the reference target or measuring point, and then automatically converted to the distance angle heat map of different microwave transceivers, which is highly convenient in the production or test site. The obtained three-dimensional displacement time series is based on the user-defined structural coordinate system, so it can be flexibly adjusted according to the needs of the on-site test to obtain the displacement in the direction required by the user, breaking away from the limitation that the displacement reconstructed by the traditional microwave three-dimensional displacement measurement method can only rely on the device coordinate system.

[0048] The concept, specific structure and technical effects of this application will be further explained below in conjunction with the accompanying drawings to fully understand the purpose, characteristics and effects of this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 This is a flow chart of a microwave full-field three-dimensional displacement measurement method according to an embodiment of the present application;

[0050] Figure 2 This is a schematic diagram of the process of establishing a structure coordinate system and a device coordinate system according to an embodiment of the present application;

[0051] Figure 3 This is a flow chart of a microwave full-field three-dimensional displacement measurement method according to another embodiment of the present application;

[0052] Figure 4 is a schematic diagram of a microwave distance angle heat map of a microwave transceiver according to an embodiment of the present application;

[0053] Figure 5 This is a structural block diagram of a microwave full-field three-dimensional displacement measurement system according to an embodiment of the present application;

[0054] Figure 6 This is a flow chart of a microwave full-field three-dimensional displacement measurement method according to another embodiment of the present application;

[0055] Figure 7 This is a schematic diagram of an experimental test scenario of an embodiment of the present application;

[0056] Figure 8 This is a schematic diagram of the experimental test results of an embodiment of the present application;

[0057] Figure 9 This is a microwave full-field three-dimensional displacement measurement system structure of another embodiment of the present application. DETAILED DESCRIPTION

[0058] The technical solutions in the embodiments of the present application will be described clearly and completely below. Obviously, the embodiments described are part of the embodiments of the present application, rather than all of the embodiments. The present application can be embodied through many different forms of embodiments, and the scope of protection of the present application is not limited to the embodiments mentioned in the text. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of the present application.

[0059] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, these technologies, methods, and equipment should be considered part of the specification.

[0060] Various specific embodiments of the present application will be described below with reference to the accompanying drawings that form a part of this specification. It should be understood that although terms indicating directions are used in this application, such as "front", "back", "up", "down", "left", "right", "inside", "outside", "top", "bottom", "positive", "negative", "near", "far", "transverse", "longitudinal", "width direction", "length direction", "height direction", "axial", "radial", "clockwise", "counterclockwise", etc., to describe various example structural parts and elements of the present application, these terms are used here only for the purpose of convenience of description and are determined based on the exemplary orientations shown in the accompanying drawings. The embodiments disclosed in this application can be set in different directions, so these terms indicating directions are only for illustration and should not be regarded as limiting.

[0061] For ease of description, the connection relationships between the various modules or parts shown in the drawings are only exemplary descriptions. Those skilled in the art can adopt other equivalent connection relationships as long as the various modules or parts can also achieve the functions of the technical solutions of the present application under such connection relationships. The embodiments disclosed in this application can be arranged according to different equivalent connection relationships, so the connection relationships shown in the drawings and the relevant contents of the specification are for illustration only and should not be regarded as limitations.

[0062] The dimensions of each component shown in the drawings are arbitrary. This application does not limit the specific dimensions of each component unless otherwise explicitly stated or described in the specification and drawings. To make the illustrations clearer, the dimensions of components in some places in the drawings are appropriately exaggerated or the corresponding proportions are adjusted.

[0063] The ordinal numbers used in this application, such as "first" and "second," are used solely for distinction and identification purposes and do not have any other meaning. Unless otherwise specified, they do not imply a specific order or relationship. For example, the term "first component" does not imply the existence of a "second component," nor does the term "second component" imply the existence of a "first component."

[0064] The singular forms of "a", "the" and "the" used in this application are intended to include both singular and plural forms, unless the context clearly indicates otherwise. "Multiple" or "a plurality" generally include at least two or more. The term "and / or" used in this application is merely a description of the association relationship between associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this application generally indicates that the associated objects before and after are in an "or" relationship.

[0065] The terms "comprises," "comprising," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0066] Figure 1 This is a flow chart of an embodiment of the present application. Figure 1 As shown, the microwave full-field three-dimensional displacement measurement method of the present application may include the following steps:

[0067] Step 1: Establish a structural coordinate system based on the target to be measured.

[0068] like Figure 2 As shown, three calibration reference objects (such as a first reference target 212 , a second reference target 213 , and a third reference target 214 ) are placed near the measured target 201 , or an existing target or measuring point 202 is selected as a reference target, and a structural coordinate system 211 is established using the reference targets.

[0069] The measured target refers to different measurement objects or different measurement points on a measurement object. If you want to measure the displacement of a certain direction of the measured target, select the two most critical displacement directions as the displacement directions to be measured. Use the plane where the two displacement directions of the measured target are located as the reference plane, select three non-collinear reference targets in the reference plane, and construct the structural coordinate system O S -X S Y S Z S The origin of the structural coordinate system O S Y is the location of the first reference target 212, located behind the target; S The positive direction of the X axis is from the first reference target 212 to the second reference target 213; S The positive direction of the axis is the same as the Y S The positive direction of the Z axis is vertical and points to the half plane where the third reference target 214 is located. S The positive direction of the axis points to the half space where the microwave transceiver is located, and the reference target is placed so that the positive direction of the three axes meets the conditions of the right-hand coordinate system.

[0070] Step 2: Establish a device coordinate system based on the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver.

[0071] More than three microwave transceivers are placed non-collinearly in front of the target to be measured, and the detection angle of each microwave transceiver is adjusted so that its field of view covers the target to be measured and the reference target.

[0072] Establish the device coordinate system O according to the spatial position of the microwave transceiver D -X D Y D Z D , select the first microwave transceiver 222 as the origin O of the device coordinate system 221 D , the plane formed by the first microwave transceiver 222, the second microwave transceiver 223, and the third microwave transceiver 224 is used as the X coordinate system of the device D O D Y D Plane, Z D Axis perpendicular to X D O D Y D The plane passes through the location of the first microwave transceiver 222 and points to the side where the target exists. The line connecting the first microwave transceiver 222 to the second microwave transceiver 223 is used as the Y coordinate system of the device. D The positive direction of the axis is from the first microwave transceiver 222 to the second microwave transceiver 223. The selection of the first microwave transceiver 222 and the second microwave transceiver 223 must satisfy the following requirements: D Axis and Z D The cross product of the axes points to the half space where the third microwave transceiver 224 is located. At this time, the X coordinate system of the device D The positive direction of the axis is Y D Axis and Z D The cross product of the axes is determined and passes through the location of the first microwave transceiver 222 .

[0073] Step 3: Monitor the displacement time series of the measured target through the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver to obtain an initial three-dimensional displacement time series of the measured target in the device coordinate system.

[0074] Control all microwave transceivers to transmit frequency modulated continuous wave microwave signals to the measuring point q and receive the corresponding echo signals at the same time. Extract the initial displacement time series of the measuring point q along the line of sight from the baseband signals of each microwave transceiver, and record them as Among them, m=1,2,… is the equivalent displacement sampling cycle number, T is the equivalent displacement sampling cycle time, p=A,B,C,… is the first microwave transceiver, the second microwave transceiver, the third microwave transceiver, and represents the microwave transceiver sequence number.

[0075] Then, the initial displacement time series of the measuring point q along each axis of the equipment coordinate system are calculated and are:

[0076]

[0077] Step 4: Based on the device coordinate system and the structure coordinate system, establish a coordinate transformation relationship from the device coordinate system to the structure coordinate system.

[0078] Coordinate transformation relationships, including the rotation matrix and translation matrix from the device coordinate system to the structure coordinate system. The rotation matrix R and translation matrix t can be solved by methods including standard orthogonal basis transformation, singular value decomposition, and quaternion. Optionally, the rotation matrix R and translation matrix t can be solved by standard orthogonal basis transformation:

[0079] The standard orthogonal basis of the structural coordinate system is The orthonormal basis of the device coordinate system is in, Represents the device coordinate system O D X D ,O D Y D ,O D Z D The unit vector in the direction Use The linear combination representation is:

[0080]

[0081] Among them, p ij (i, j = 1, 2, 3) are basis transformation coefficients.

[0082] is the coordinate of microwave transceiver A in the structural coordinate system, is the coordinate of microwave transceiver B in the structural coordinate system, is the coordinate of microwave transceiver C in the structural coordinate system;

[0083] set up

[0084]

[0085] in(*) T represents the transpose of the matrix. Then:

[0086]

[0087] Get the rotation matrix R from the device coordinate system to the structure coordinate system:

[0088]

[0089] And the translation matrix t from the device coordinate system to the structure coordinate system:

[0090]

[0091] For the measurement point q, according to the rotation matrix R and translation matrix t, we can get:

[0092]

[0093] in, is the coordinate of the measuring point q in the structural coordinate system, is the coordinate of the measuring point q in the device coordinate system.

[0094] Step 5: Calculate the transformed three-dimensional displacement time series of the measured target in the structural coordinate system based on the coordinate transformation relationship and the initial three-dimensional displacement time series.

[0095] According to the coordinate transformation relationship

[0096] Transform the initial displacement time series of the measuring point q along each axis of the equipment coordinate system (in, is the initial displacement time series of the measuring point q along the X-axis of the equipment coordinate system, is the initial displacement time series of the measuring point q along the Y axis of the equipment coordinate system, is the initial displacement time series of the measuring point q along the Z axis of the equipment coordinate system, m = 1, 2, ... is the equivalent displacement sampling cycle number, T is the equivalent displacement sampling cycle time), and the transformed displacement time series of the measuring point q along the X axis of the structure coordinate system is obtained. Time series of transformed displacement along the Y-axis of the structural coordinate system Time series of transformed displacement along the X-axis of the structural coordinate system

[0097]

[0098] The application obtains the transformed three-dimensional displacement time series in the structural coordinate system after transformation. How to use it specifically and what to reflect are different post-processings in different usage scenarios, which are all covered within the protection scope of the application.

[0099] Figure 3 This is a flowchart of another embodiment of the present application. The microwave full-field three-dimensional displacement measurement method of the present application may further include the steps of: calculating the coordinates of the measured target in the distance angle heat map of each microwave transceiver based on the coordinates of the measured target and the microwave transceiver in the structural coordinate system, and matching the measured target's measurement points in each microwave transceiver.

[0100] like Figure 3 As shown, the specific steps include:

[0101] Step 1: Establish a structural coordinate system based on the target to be measured.

[0102] Place more than or equal to three calibration reference objects near the target to be measured or select existing targets or measuring points from the field of view as reference targets, and use the reference targets to establish the structural coordinate system. S -X S Y S Z S .

[0103] The plane where the two displacement directions of the target to be measured are located is selected as the reference plane, and three non-collinear reference targets are selected in the reference plane to construct the structural coordinate system. Among them, the origin of the coordinate system is O S The first reference target is located at the rear of the target being measured; Y S The positive direction of the axis is from the first reference target to the second reference target; S The positive direction of the axis is the same as the Y S The positive direction of the axis is vertical and points to the half plane where the third reference target is located. S The positive direction of the axis points to the half space where the microwave transceiver is located, and the reference target is placed so that the positive direction of the three axes meets the conditions of the right-hand coordinate system.

[0104] Step 2: Establish a device coordinate system based on the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver.

[0105] Place more than or equal to three microwave transceivers in a non-collinear manner in front of the target to be measured, and adjust the detection angle of each microwave transceiver so that its field of view covers the target to be measured and the reference target.

[0106] Establish the device coordinate system O according to the spatial position of the microwave transceiver D -X D Y D Z D , select the first microwave transceiver as the origin of the device coordinate system O D , the plane formed by the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver is used as the X coordinate system of the device D O D Y D Plane, Z D Axis perpendicular to X D O D Y D The plane passes through the location of the first microwave transceiver and points to the side where the target exists. The line connecting the first microwave transceiver to the second microwave transceiver is used as the Y coordinate system of the device. D The positive direction of the axis is from the first microwave transceiver to the second microwave transceiver. The selection of the first microwave transceiver and the second microwave transceiver must meet the following requirements: the Y axis of the device coordinate system constructed by the above method D Axis and Z D The cross product of the axes points to the half space where the third microwave transceiver is located. At this time, the XD The positive direction of the axis is Y D Axis and Z D The axis is determined by the cross product of the first and second axes and passes through the location of the first microwave transceiver.

[0107] Step 3: Based on the coordinates of the measured target and the microwave transceiver in the structural coordinate system, the coordinates of the measured target in the range angle heat map of each microwave transceiver are calculated, and the measuring points of the measured target in each microwave transceiver are matched.

[0108] The coordinates of the measuring point q in the structural coordinate system are The vector matrix pointing from the p-th (p = A, B, C) microwave transceiver to the three reference targets:

[0109]

[0110] in, are the coordinates of the three reference targets 403 in the structural coordinate system. is the coordinate of microwave transceiver A in the structural coordinate system, is the coordinate of microwave transceiver B in the structural coordinate system, is the coordinate of the microwave transceiver C in the structural coordinate system.

[0111] The coordinates of the measuring point q 405 in the distance angle heat map 401 of the pth microwave transceiver 404 are

[0112] in represents the distance coordinate of the measurement point q in the distance angle heat map of the pth microwave transceiver, represents the angular coordinate of the measurement point q in the distance angle heat map of the p-th microwave transceiver, p = A, B, C, ..., represents the serial number of the microwave transceiver.

[0113] The unit normal vector of the zero-degree plane 402 of the distance angle heat map of the p-th (p=A, B, C) microwave transceiver is (p=A,B,C), because:

[0114]

[0115] You can get:

[0116]

[0117] Calculate the distance coordinate of the measurement point q in the distance-angle heat map of the pth (p = A, B, C) microwave transceiver and angular coordinates

[0118]

[0119] The coordinates of the measured target point q in the distance angle heat map of each microwave transceiver are obtained.

[0120] Step 4: Monitor the displacement time series of the target by using the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver to obtain an initial three-dimensional displacement time series of the target in the device coordinate system;

[0121] Control all microwave transceivers to transmit and receive frequency modulated continuous wave microwave signals toward the measuring point q and receive the corresponding echo signals. Extract the initial displacement time series of the measuring point q along the line of sight from the baseband signals of each microwave transceiver, and record them as Wherein, m=1, 2, ... is the equivalent displacement sampling cycle number, T is the equivalent displacement sampling cycle time, and p=A, B, C, ... represents the microwave transceiver number.

[0122] Then, the initial displacement time series of the measuring point q along each axis of the equipment coordinate system are calculated and are:

[0123]

[0124] Step 5: According to the device coordinate system and the structure coordinate system, a coordinate transformation relationship from the device coordinate system to the structure coordinate system is established;

[0125] Coordinate transformation relationships, including the rotation matrix and translation matrix from the device coordinate system to the structure coordinate system. The rotation matrix R and translation matrix t can be solved by methods including standard orthogonal basis transformation, singular value decomposition, and quaternion. Optionally, the rotation matrix R and translation matrix t can be solved by standard orthogonal basis transformation:

[0126] The standard orthogonal basis of the structural coordinate system is The orthonormal basis of the device coordinate system is in, Represents the device coordinate system O D X D ,O D Y D ,O D Z D The unit vector in the direction Use The linear combination representation is:

[0127]

[0128] Among them, p ij (i, j = 1, 2, 3) are basis transformation coefficients, and i and j are subscript numbers.

[0129] set up

[0130]

[0131] in(*) T represents the transpose of the matrix. Then:

[0132]

[0133] Get the rotation matrix R from the device coordinate system to the structure coordinate system:

[0134]

[0135] And the translation matrix t from the device coordinate system to the structure coordinate system:

[0136]

[0137] For the measurement point q, according to the rotation matrix R and translation matrix t, we can get:

[0138]

[0139] in, is the coordinate of the measuring point q in the structural coordinate system, is the coordinate of the measuring point q in the device coordinate system.

[0140] Step 6: Calculate the transformed three-dimensional displacement time series of the measured target in the structural coordinate system based on the coordinate transformation relationship and the initial three-dimensional displacement time series.

[0141] According to the coordinate transformation relationship

[0142] Transform the initial displacement time series of the measuring point q along each axis of the equipment coordinate system (in, is the initial displacement time series of the measuring point q along the X-axis of the equipment coordinate system, is the initial displacement time series of the measuring point q along the Y axis of the equipment coordinate system, is the initial displacement time series of the measuring point q along the Z axis of the equipment coordinate system), and the transformed displacement time series of the measuring point q along the X axis of the structure coordinate system is obtained. Time series of transformed displacement along the Y-axis of the structural coordinate system Time series of transformed displacement along the X-axis of the structural coordinate system

[0143]

[0144] In another embodiment of the present application, three-dimensional vibration and deformation displacement measurements can be performed on multiple measurement points or all measurement points in the field, including the following steps:

[0145] Step 1: Establish a structural coordinate system based on the target to be measured.

[0146] Place more than or equal to three calibration reference objects near the target to be measured or select existing targets or measuring points from the field of view as reference targets, and use the reference targets to establish the structural coordinate system. S -X S Y S Z S .

[0147] The plane where the two displacement directions of the target to be measured are located is selected as the reference plane, and three non-collinear reference targets are selected in the reference plane to construct the structural coordinate system. Among them, the origin of the coordinate system is O S The first reference target is located at the rear of the target being measured; Y S The positive direction of the axis is from the first reference target to the second reference target; S The positive direction of the axis is the same as the Y S The positive direction of the axis is vertical and points to the half plane where the third reference target is located. S The positive direction of the axis points to the half space where the microwave transceiver is located, and the reference target must be placed so that the positive direction of the three axes meets the conditions of the right-hand coordinate system.

[0148] Step 2: Establish a device coordinate system based on the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver.

[0149] Place more than or equal to three microwave transceivers in a non-collinear manner in front of the target to be measured, and adjust the detection angle of each microwave transceiver so that its field of view covers the target to be measured and the reference target.

[0150] Establish the device coordinate system O according to the spatial position of the microwave transceiver D -X D Y D Z D , select the first microwave transceiver as the origin of the device coordinate system O D , the plane formed by the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver is used as the X coordinate system of the device D O D Y D Plane, Z D Axis perpendicular to X D O D Y D The plane passes through the location of the first microwave transceiver and points to the side where the target exists. The line connecting the first microwave transceiver to the second microwave transceiver is used as the Y coordinate system of the device. D The positive direction of the axis is from the first microwave transceiver to the second microwave transceiver. The selection of the first microwave transceiver and the second microwave transceiver must meet the following requirements: the Y axis of the device coordinate system constructed by the above method DAxis and Z D The cross product of the axes points to the half space where the third microwave transceiver is located. At this time, the X D The positive direction of the axis is Y D Axis and Z D The axis is determined by the cross product of the first and second axes and passes through the location of the first microwave transceiver.

[0151] Step 3: Based on the coordinates of the measured target and the microwave transceiver in the structural coordinate system, the coordinates of the measured target in the range angle heat map of each microwave transceiver are calculated, and the measuring points of the measured target in each microwave transceiver are matched.

[0152] The measured targets refer to different measurement objects or different measurement points on a measurement object, which are uniformly described here as measurement points, where q = 1, 2, 3, ... are used to describe the measurement point numbers.

[0153] The coordinates of the qth measuring point in the structural coordinate system are The vector matrix pointing from the p-th (p = A, B, C) microwave transceiver to the three reference targets:

[0154]

[0155] in, are the coordinates of the three reference targets in the structural coordinate system. is the coordinate of microwave transceiver A in the structural coordinate system, is the coordinate of microwave transceiver B in the structural coordinate system, is the coordinate of the microwave transceiver C in the structural coordinate system.

[0156] The coordinates of the qth measurement point in the distance angle heat map of the pth microwave transceiver are: in represents the distance coordinate of the qth measurement point in the distance angle heat map of the pth microwave transceiver, represents the angular coordinate of the qth measurement point in the distance angle heat map of the pth microwave transceiver, p = A, B, C, ..., represents the serial number of the microwave transceiver.

[0157] The unit normal vector of the zero-degree plane of the distance angle heat map of the p-th (p = A, B, C) microwave transceiver is (p=A,B,C), because:

[0158]

[0159] You can get:

[0160]

[0161] Calculate the distance coordinate of the qth measurement point in the distance-angle heat map of the pth (p = A, B, C) microwave transceiver and angular coordinates

[0162]

[0163] Repeat the above steps to obtain the coordinates of each measuring point in the distance angle heat map of each microwave transceiver.

[0164] Step 4: Monitor the displacement time series of the target by using the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver to obtain an initial three-dimensional displacement time series of the target in the device coordinate system;

[0165] Control all microwave transceivers to transmit frequency modulated continuous wave microwave signals to multiple measurement points or full-field measurement points at the same time and receive corresponding echo signals. Extract the initial displacement time series of the qth measurement point along the line of sight from the baseband signal of each microwave transceiver, and record them as Wherein, m=1, 2, ... is the equivalent displacement sampling cycle number, T is the equivalent displacement sampling cycle time, and p=A, B, C, ... represents the microwave transceiver number.

[0166] Then, the initial displacement time series of the qth measuring point along each axis of the equipment coordinate system are calculated and are:

[0167] Step 5: Based on the device coordinate system and the structure coordinate system, establish a coordinate transformation relationship from the device coordinate system to the structure coordinate system.

[0168] Coordinate transformation relationships, including the rotation matrix and translation matrix from the device coordinate system to the structure coordinate system. The rotation matrix R and translation matrix t can be solved by methods including standard orthogonal basis transformation, singular value decomposition, and quaternion. Optionally, the rotation matrix R and translation matrix t can be solved by standard orthogonal basis transformation:

[0169] The standard orthogonal basis of the structural coordinate system is The orthonormal basis of the device coordinate system is in, Represents the device coordinate system O D X D ,O D Y D ,O D Z D The unit vector in the direction Use The linear combination representation is:

[0170]

[0171] Among them, p ij (i, j = 1, 2, 3) are basis transformation coefficients.

[0172] set up

[0173]

[0174] in(*) T represents the transpose of the matrix. Then:

[0175]

[0176] Get the rotation matrix R from the device coordinate system to the structure coordinate system:

[0177]

[0178] And the translation matrix t from the device coordinate system to the structure coordinate system:

[0179]

[0180] For the qth measuring point, according to the rotation matrix R and translation matrix t, we can get:

[0181]

[0182] in, is the coordinate of the qth measuring point in the structural coordinate system, is the coordinate of the qth measuring point in the device coordinate system.

[0183] Step 6: Calculate the transformed three-dimensional displacement time series of the measured target in the structural coordinate system based on the coordinate transformation relationship and the initial three-dimensional displacement time series.

[0184] According to the coordinate transformation relationship

[0185] Transform the initial displacement time series of the qth measuring point along each axis of the equipment coordinate system (in, is the initial displacement time series of the qth measuring point along the X-axis of the equipment coordinate system, is the initial displacement time series of the qth measuring point along the Y axis of the equipment coordinate system, is the initial displacement time series of the qth measuring point along the Z axis of the equipment coordinate system), and the transformed displacement time series of the qth measuring point along the X axis of the structure coordinate system is obtained. Time series of transformed displacement along the Y-axis of the structural coordinate system Time series of transformed displacement along the X-axis of the structural coordinate system

[0186]

[0187] The present application also provides a microwave full-field three-dimensional displacement measurement system, which can perform various microwave full-field three-dimensional displacement measurement methods as described above, such as Figure 5 As shown, it includes: a reference target module, a three-dimensional displacement solution module, a microwave sensing and control module, a coordinate conversion relationship calculation unit, and a structural coordinate system three-dimensional displacement conversion unit. The reference target module is configured to establish a structural coordinate system based on the measured target; the three-dimensional displacement solution module is configured to establish a device coordinate system based on the first microwave transceiver (microwave transceiver A), the second microwave transceiver (microwave transceiver A), and the third microwave transceiver (microwave transceiver C); the microwave sensing and control module is configured to monitor the displacement time series of the measured target through the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver; the three-dimensional displacement solution module is further configured to obtain the initial three-dimensional displacement time series of the measured target in the device coordinate system; the coordinate conversion relationship calculation unit is configured to establish a coordinate conversion relationship from the device coordinate system to the structural coordinate system based on the device coordinate system and the structural coordinate system; the structural coordinate system three-dimensional displacement conversion unit is configured to calculate the converted three-dimensional displacement time series of the measured target in the structural coordinate system based on the coordinate conversion relationship and the initial three-dimensional displacement time series in the device coordinate system.

[0188] In some embodiments, the microwave sensing and control module can be further configured so that the detection field of view of the first microwave transceiver can cover the target being measured; the detection field of view of the second microwave transceiver can cover the target being measured; and the detection field of view of the third microwave transceiver can cover the target being measured.

[0189] In some embodiments, the microwave sensing and control module may be further configured so that the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver are not located on a colinear line.

[0190] In some embodiments, the reference target module can be further configured to select a plane formed by two displacement directions to be measured of the target to be measured as a reference target plane; select a first reference target, a second reference target, and a third reference target within the reference target plane, wherein the first reference target, the second reference target, and the third reference target are non-collinear; and establish a structural coordinate system based on the first reference target, the second reference target, and the third reference target.

[0191] In some embodiments, the microwave sensing and control module can be further configured so that the detection field of view of the first microwave transceiver can cover the first reference target; the detection field of view of the second microwave transceiver can cover the first reference target; and the detection field of view of the third microwave transceiver can cover the first reference target; the detection field of view of the first microwave transceiver can cover the second reference target; the detection field of view of the second microwave transceiver can cover the second reference target; and the detection field of view of the third microwave transceiver can cover the second reference target; the detection field of view of the first microwave transceiver can cover the third reference target; the detection field of view of the second microwave transceiver can cover the third reference target; and the detection field of view of the third microwave transceiver can cover the third reference target.

[0192] In some embodiments, the reference target module can be further configured to construct a coordinate system including an origin O S 、X S Axis, Y S Axis, Z S Axis; where the origin O S is the location of the first reference target; Y S The positive direction of the X axis is the direction from the first reference target to the second reference target; S The positive direction of the Y axis S The positive direction of the Z axis is vertical and points to the half plane where the third reference target is located; S The positive direction of the axis points to the half space where the first microwave transceiver, the second microwave transceiver and the third microwave transceiver are located.

[0193] In some embodiments, the microwave full-field three-dimensional displacement measurement system may further include a coordinate calculation unit configured to calculate the coordinates of the first microwave transceiver in the structural coordinate system based on the distances between the first microwave transceiver and the first reference target, the second reference target, and the third reference target, respectively.

[0194] In some embodiments, the three-dimensional displacement solving module may be further configured to establish a device coordinate system according to the coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the structure coordinate system.

[0195] In some embodiments, the three-dimensional displacement solving module can be further configured to include the origin O in the device coordinate system. D 、X D Axis, Y D Axis, Z D Axis; where the origin O D is the position of the first microwave transceiver; X D O D Y D The plane is the plane formed by the positions of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver; ZD Axis and X D O D Y D The plane is vertical and points in the direction of the target being measured; Y D The positive direction of the X axis is the direction from the first microwave transceiver to the second microwave transceiver; D The positive direction of the axis is the direction pointing to the half space where the third microwave transceiver is located.

[0196] In some embodiments, the microwave full-field three-dimensional displacement measurement system may further include a measurement point matching and selection module. The measurement point matching and selection module is configured to calculate the coordinates of the measured target in the range-angle heat map of the first microwave transceiver based on the coordinates of the measured target and the first microwave transceiver in the structural coordinate system.

[0197] In some embodiments, the measurement point matching and selection module may be further configured to match the measurement point of the measured target in the first microwave transceiver according to the coordinates of the measured target in the range-angle heat map of the first microwave transceiver.

[0198] In some embodiments, the coordinate conversion relationship calculation unit may be further configured to calculate a coordinate conversion relationship according to the coordinates of the first microwave transceiver in the device coordinate system and the coordinates of the first microwave transceiver in the structure coordinate system.

[0199] In some embodiments, the coordinate transformation relationship calculation unit may be further configured to calculate a rotation matrix and a translation matrix from the device coordinate system to the structure coordinate system included in the coordinate transformation relationship.

[0200] In some embodiments, the coordinate transformation relationship calculation unit may be further configured to calculate the rotation matrix and the translation matrix using a standard orthogonal basis transformation method.

[0201] The present application also provides a microwave full-field three-dimensional displacement measurement device, including a memory, a processor, and a computer program stored in the memory and capable of running on the processor. The processor is configured to implement the steps of the above-mentioned microwave full-field three-dimensional displacement measurement method when executing the computer program.

[0202] The present application also provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps of the above-mentioned microwave full-field three-dimensional displacement measurement method can be implemented.

[0203] Compared to 3D displacement measurement in the device coordinate system, 3D displacement measurement in the structural coordinate system can truly reflect the vibration response of the structure, intuitively demonstrating the vibration and deformation of various structural components under actual loads and environments. For example, in the health monitoring of bridges and high-rise buildings, key measurement points can be selected specifically, and certain coordinate axes of the structural coordinate system can be aligned parallel to the key measurement directions of greatest interest. This allows for accurate reflection of the dynamic response of the structure in key directions due to external excitations such as vehicles and wind, facilitating long-term monitoring and trend analysis.

[0204] Furthermore, when designing mechanical structures, certain parts of the structure may require higher strength in certain directions. This can be achieved by establishing a structural coordinate system so that certain coordinate axes are parallel to key loads and force directions. Vibration measurement and analysis can then be performed at key measurement points on the structure. This can effectively assist in analyzing structural performance, optimizing design, and improving reliability. However, three-dimensional displacement measurement based on the device coordinate system often results in less accurate vibration information in key directions. The lack of information about the relative relationship between the device coordinate system and the structure can even make it impossible to determine vibration and deformation displacement in these directions.

[0205] In some embodiments, the microwave full-field three-dimensional displacement measurement method of the present application includes the following steps:

[0206] First, three or more microwave transceivers are arranged, reference targets or measuring points are selected, and a structural coordinate system is established. The three-dimensional coordinates of each microwave transceiver in the structural coordinate system are calculated. Second, a device coordinate system is established based on the spatial distribution positions of multiple microwave transceivers. Next, a measuring point on the target or structure to be measured is selected from the structural coordinate system, and the coordinates of the target or measuring point to be measured in the distance angle heat map of all microwave transceivers (or distance angle unit positions) are mapped. Furthermore, the corresponding matching measuring points of each microwave transceiver are selected based on the obtained microwave distance angle heat map coordinates, and all microwave transceivers are controlled to simultaneously perform displacement time series measurements on the target or measuring point to be measured, and the three-dimensional displacement time series of the target or measuring point in the device coordinate system is solved. Finally, as needed, the conversion correspondence between the device coordinate system and the structural coordinate system is calculated, and the three-dimensional displacement time series of the measured target or measuring point in the structural coordinate system is solved.

[0207] The implementation process of this application only requires more than or equal to three reference targets or measuring points and more than or equal to three microwave transceivers to obtain the three-dimensional vibration and deformation displacement information of the entire group of measuring points or targets in the field of view. The hardware complexity is low and the test efficiency is high. In addition, by matching the structural coordinates with the coordinates of the microwave transceiver distance angle heat map, the measuring point can be directly selected in the structural coordinate system established by the reference target or measuring point, and then automatically converted to the distance angle heat map of different microwave transceivers, which is highly convenient in the production or test site. Finally, since the obtained three-dimensional displacement time series is based on the user-defined structural coordinate system, it can be flexibly adjusted according to the needs of on-site testing to obtain the displacement in the direction required by the user, breaking away from the limitation that the displacement reconstructed by the traditional microwave three-dimensional displacement measurement method can only be based on the coordinate system established by multiple devices.

[0208] In some embodiments, the microwave full-field three-dimensional vibration and deformation displacement measurement method, such as Figure 6 As shown, the following steps may be included:

[0209] First, three or more microwave transceivers are arranged, reference targets or measuring points are selected, and a structural coordinate system is established. The three-dimensional coordinates of each microwave transceiver in the structural coordinate system are calculated. Second, a device coordinate system is established based on the spatial distribution positions of multiple microwave transceivers. Next, a measuring point on the target or structure to be measured is selected from the structural coordinate system, and the coordinates of the target or measuring point to be measured in the distance angle heat map of all microwave transceivers (or distance angle unit positions) are mapped. Furthermore, the corresponding matching measuring points of each microwave transceiver are selected based on the obtained microwave distance angle heat map coordinates, and all microwave transceivers are controlled to simultaneously perform displacement time series measurements on the target or measuring point to be measured, and the three-dimensional displacement time series of the target or measuring point in the device coordinate system is solved. Finally, as needed, the conversion correspondence between the device coordinate system and the structural coordinate system is calculated, and the three-dimensional displacement time series of the measured target or measuring point in the structural coordinate system is solved.

[0210] Step 1: Arrange microwave transceivers, establish a structural coordinate system, and calculate the three-dimensional coordinates of each microwave transceiver in the structural coordinate system.

[0211] Step 1.1: Arrange the microwave transceiver.

[0212] After selecting the target to be measured, three or more microwave transceivers are placed non-collinearly in front of the target. The detection angle of each microwave transceiver is adjusted so that its field of view covers both the target and the reference target. Since a single microwave transceiver can only provide a displacement time series of the target in one dimension, three or more microwave transceivers are required to measure the displacement time series of the target in three-dimensional space. Furthermore, if the three microwave transceivers are collinear, their three lines of sight to the target are in the same plane. In this case, the displacement time series measured by the three microwave transceivers in the line of sight directions are in the same two-dimensional plane, lacking information in one dimension, and the three-dimensional displacement time series of the target cannot be obtained. Therefore, the three microwave transceivers must be non-collinear.

[0213] Step 1.2, establish the structural coordinate system.

[0214] Place three or more calibration reference objects near the target to be measured or select an existing target from the field of view as a reference target, and use the reference target to establish a structural coordinate system.

[0215] Optionally, three reference targets (respectively numbered 1 to 3) are used to establish the structural coordinate system O S -X S Y S Z S The plane where the two displacement directions of the target to be measured are located is selected as the reference plane, and three non-collinear reference targets are selected in the reference plane to construct the structural coordinate system. Among them, the origin of the coordinate system is O S The location of reference target No. 1, located behind the target being measured; Y S The positive direction of the axis is from reference target 1 to reference target 2; S The positive direction of the axis is the same as the Y S The positive direction of the axis is vertical and points to the half plane where the reference target No. 3 is located. S The positive direction of the axis points to the half space where the microwave transceiver is located, and the placement of the reference target must make the positive direction of the three axes meet the conditions of the right-hand coordinate system. The coordinates of the three reference targets in the structural coordinate system are recorded as If the three reference targets are collinear, they are in one-dimensional space, and it is impossible to establish a structural coordinate system. As a result, it is impossible to calculate the coordinates of the three microwave transceivers in the structural coordinate system, and it is impossible to perform three-dimensional displacement measurement of the target under test in the structural coordinate system. Therefore, the three reference targets must be non-collinear.

[0216] Step 1.3, calculate the three-dimensional coordinates of each microwave transceiver in the structural coordinate system.

[0217] The distances between reference targets 1, 2, and 3 are measured or obtained through prior knowledge and are denoted as: r 12 ,r 13 ,r23 , where r ij represents the distance between reference targets i and reference target j (1 ≤ i < j ≤ 3). Then, control all microwave transceivers to simultaneously transmit and receive frequency-modulated continuous-wave microwave signals and receive the corresponding echo signals, and calculate the distances between each microwave transceiver and each reference target according to a method including estimating the beat frequency of the baseband signal, which are respectively denoted as represents the Euclidean distance from the p-th microwave transceiver to the i-th reference target (p = A, B, C; i = 1, 2, 3). The calculated coordinates of microwave transceivers A, B, and C in the structural coordinate system are:

[0218]

[0219] where is the coordinate of microwave transceiver A in the structural coordinate system, is the coordinate of microwave transceiver B in the structural coordinate system, is the coordinate of microwave transceiver C in the structural coordinate system.

[0220] Step 2, establish the device coordinate system.

[0221] Establish the device coordinate system using the spatial positions of at least three microwave transceivers themselves. Optionally, establish the device coordinate system O D -X D Y D Z D , select microwave transceiver A as the origin O of the device coordinate system D , take the plane formed by microwave transceivers A, B, and C as the X D O D [[ID=3十七]]Y D plane, and the Z D axis is perpendicular to the X D O D Y D plane and passes through the position of microwave transceiver A and points to the side where the target exists. The line connecting microwave transceiver A and microwave transceiver B is used as the Y D axis of the device coordinate system, and its positive direction points from microwave transceiver A to microwave transceiver B. The selection of microwave transceiver A and microwave transceiver B should satisfy that the cross product of the Y D axis and the Z D axis of the device coordinate system formed by the above method points to the half-space where the last microwave transceiver (denoted as microwave transceiver C) is located. At this time, the positive direction of the X D axis of the device coordinate system is determined by the cross product of the Y D axis and the Z D axis and passes through the position of microwave transceiver A.

[0222] Step 3: Select a measurement point on the target or structure to be measured from the structural coordinate system, and map the coordinates of the target or structure to be measured in the distance angle heat map of all microwave transceivers.

[0223] Assume that the coordinates of the measuring point q selected from the structural coordinate system are (q=1,2,3,…) Through the matching algorithm of the measurement point structure coordinates and the microwave transceiver distance angle heat map, the coordinates of the pth microwave transceiver in the distance angle heat map are obtained as in represents the distance coordinate of the measuring point q in the distance angle heat map of the pth microwave transceiver, It represents the angular coordinate of the measuring point q in the distance angle heat map of the pth microwave transceiver, where p = A, B, C, ..., represents the serial number of the microwave transceiver.

[0224] The specific implementation process of the matching algorithm between the measurement point structure coordinates and the microwave transceiver distance angle heat map is as follows:

[0225] Define the vector matrix pointing from the pth (p = A, B, C) microwave transceiver to each reference target

[0226] Assume that the unit normal vector of the zero-degree plane of the distance angle heat map of the p-th (p = A, B, C) microwave transceiver is but:

[0227]

[0228] You can get:

[0229]

[0230] For the coordinates in the structural coordinate system The coordinates of the measurement point q in the distance-angle heat map of the pth (p = A, B, C) microwave transceiver can be obtained by the following formula:

[0231]

[0232] Step 4: Control all microwave transceivers to simultaneously monitor the displacement time series of the target or measuring point to be measured, and calculate the three-dimensional displacement time series of the target or measuring point in the device coordinate system.

[0233] Select the measurement points corresponding to each microwave transceiver according to the obtained microwave distance-angle heat map coordinates Control all microwave transceivers to transmit and receive frequency modulated continuous wave microwave signals and receive corresponding echo signals simultaneously, and extract the displacement time series of the measuring point q along the line of sight from the baseband signal of each microwave transceiver, which are recorded as Wherein, m=1, 2, ... is the equivalent displacement sampling cycle number, T is the equivalent displacement sampling cycle time, and p=A, B, C, ... represents the microwave transceiver number.

[0234] Then, using algorithms including microwave multi-dimensional deformation and vibration measurement methods, the displacement time series of the measuring point q along each axis of the equipment coordinate system are calculated and recorded as

[0235] Step 5: Establish a coordinate transformation relationship from the device coordinate system to the structure coordinate system, and solve the three-dimensional displacement time series of the measured target or measuring point in the structure coordinate system.

[0236] Step 5.1: Establish the coordinate transformation relationship from the device coordinate system to the structure coordinate system.

[0237] Let the rotation matrix from the device coordinate system to the structure coordinate system be R, and the translation matrix be t.

[0238] The rotation matrix R and translation matrix t are obtained by the standard orthogonal basis transformation method:

[0239] Assume that the standard orthogonal basis of the structural coordinate system is The orthonormal basis of the device coordinate system is in, Represents the device coordinate system O D X D ,O D Y D ,O D Z D The unit vector in the direction Use It can be expressed as a linear combination of:

[0240]

[0241] set up

[0242]

[0243] in(*) T represents the transpose of the matrix, then:

[0244]

[0245] Then we get the rotation matrix R from the device coordinate system to the structure coordinate system:

[0246]

[0247] And the translation matrix from the device coordinate system to the structure coordinate system in(*) T Represents the transpose of a matrix.

[0248] For the measurement point q, according to the rotation matrix R and translation matrix t, we can get:

[0249]

[0250] in, is the coordinate of the measuring point q in the structural coordinate system, is the coordinate of the measuring point q in the device coordinate system.

[0251] Step 5.2: Calculate the three-dimensional displacement time series of the measured target or measuring point in the structural coordinate system.

[0252] Expand the coordinate transformation formula in step 5.1 to obtain:

[0253]

[0254] Derivative the above formula to obtain the transformed displacement time series of the measuring point q along the X-axis of the structural coordinate system: Time series of transformed displacement along the Y-axis of the structural coordinate system Time series of transformed displacement along the X-axis of the structural coordinate system

[0255]

[0256] Based on the microwave full-field three-dimensional vibration and deformation displacement measurement method provided by this application, Figure 7 and Figure 8 An example of experimental test results is shown. Figure 6 As shown in the figure, three corner reflectors No. 1 to No. 3 are used as reference targets to establish the structural coordinate system; No. 4 target is placed on the three-dimensional slide, and the movement direction of the slide is parallel to the three coordinate axes of the structural coordinate system; No. 5 target is placed on the table and remains stationary during the test. S ,Y S ,Z S The three axes each performed a reciprocating motion with an amplitude of 0.5 mm. Using the above method, the three-dimensional displacement solution results of targets 4 and 5 in the structural coordinate system were obtained. Figure 8 (a) is the three-dimensional displacement solution result of target 4 in the structural coordinate system; Figure 8(b) shows the calculated 3D displacement of target 5 in the structural coordinate system. As can be seen, the maximum relative error between the displacement amplitude of target 4 and the set value is less than 1%, while the maximum displacement of target 5 does not exceed 10μm throughout the entire test. This demonstrates that the proposed method can perform full-field 3D displacement measurement in a structural coordinate system with high accuracy using microwaves.

[0257] In some embodiments, a microwave full-field three-dimensional vibration and deformation displacement measurement system, such as Figure 9 As shown, the system structure diagram may include:

[0258] The microwave sensing and control module includes more than or equal to three microwave transceivers and a control unit.

[0259] The microwave transceiver is used to monitor the displacement time series of the reference target and the target being measured, transmit and receive electromagnetic wave signals, and output baseband signals.

[0260] The control unit is used to control all microwave transceivers to perform simultaneous monitoring and send sensing parameters to each microwave transceiver.

[0261] The reference target module includes three or more calibration reference objects placed manually, or existing targets selected from the field of view, which are used to build a custom structural coordinate system.

[0262] The measurement point matching and selection module includes a thermal image imaging unit and a measurement point matching and selection unit.

[0263] The processing content of the thermal imaging unit is: microwave distance-angle thermal imaging based on the baseband signal.

[0264] The processing content of the measuring point matching and selection unit is: mapping the measuring points of the target to be measured selected from the structural coordinate system to the distance-angle thermal map coordinates of each microwave transceiver, and selecting the measuring points.

[0265] The three-dimensional displacement calculation module includes a one-dimensional displacement extraction unit in the line of sight direction and a three-dimensional displacement calculation unit in the device coordinate system.

[0266] The processing content of the line of sight one-dimensional displacement extraction unit is: receiving the baseband signal output by each microwave transceiver, and extracting the original line of sight one-dimensional displacement time series measured by each microwave transceiver at the same measuring point.

[0267] The processing content of the device coordinate system three-dimensional displacement solution unit is: using the displacement of the measuring point of the target to be measured along the line of sight of each microwave transceiver and the relevant geometric relationships including the geometric distance between microwave transceivers, and by using algorithms including microwave multi-dimensional deformation and vibration measurement methods, the three-dimensional displacement time series of the measuring point of the target to be measured along each axis of the device coordinate system is obtained.

[0268] The three-dimensional displacement conversion module includes a coordinate conversion relationship calculation unit and a structural coordinate system three-dimensional displacement conversion unit.

[0269] The processing content of the coordinate transformation relationship calculation unit is to establish the coordinate transformation relationship from the device coordinate system to the user-defined structure coordinate system.

[0270] The processing content of the structural coordinate system three-dimensional displacement conversion unit is: using the coordinate transformation matrix obtained by the coordinate transformation relationship calculation unit, the three-dimensional displacement time series of the measuring point of the target to be measured along each axis of the equipment coordinate system is converted into the three-dimensional displacement time series of the corresponding measuring point in the custom structural coordinate system.

[0271] The data display and storage unit is used to display and store the one-dimensional displacement time series in the original line of sight direction, the three-dimensional displacement time series in the equipment and structure coordinate system, and the intermediate processing information including the mutual distance between reference targets, the Euclidean distance between the reference targets and the measuring points of the target to be measured and each microwave transceiver, and the three-dimensional coordinates of each microwave transceiver in the structure coordinate system.

[0272] This application overcomes the problems existing in existing three-dimensional displacement measurement methods based on microwave sensing, such as the difficulty in matching measurement points between multiple devices and the fact that displacement measurement results can only rely on the coordinate system composed of multiple devices. It realizes the selection and matching of multiple device measurement points from user-defined structural coordinates, and converts the three-dimensional displacement measurement results in the device coordinate system into the user-defined structural coordinate system; it improves the efficiency of measurement point selection, facilitates post-processing and analysis and calculation in different scenarios, and expands the application space of microwave vibration and deformation displacement measurement in actual test scenarios.

[0273] The technical solutions provided in this application may be systems, methods, devices, and / or computer program products. The computer program products may include a computer-readable storage medium carrying computer-readable program instructions for causing a processor to implement various aspects of this application.

[0274] In some embodiments, the present application also provides a computer device, equipment or terminal. The computer device, equipment or terminal includes a processor, memory, network interface, display screen and input device connected via a system bus. Among them, the processor is used to provide computing and control capabilities, and the memory includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and computer program in the non-volatile storage medium. The network interface is used to communicate with an external terminal via a network connection. When the computer program is executed by the processor, it implements the various methods, processes, and steps disclosed in the present application, or when the processor executes the computer program, it implements the functions of each module or unit in the embodiments disclosed in the present application. The display screen can be a liquid crystal display or an electronic ink display screen, and the input device can be a touch layer covering the display screen, or a button, trackball or touchpad provided on the housing, or an external keyboard, touchpad or mouse, etc.

[0275] For example, a computer program may be divided into one or more modules or units, which are stored in a memory and executed by a processor to implement the technical solution of the present application. These modules or units may be a series of computer program instruction segments capable of performing specific functions, and the instruction segments are used to describe the execution process of the computer program in an apparatus, device, or terminal.

[0276] The aforementioned devices, equipment, or terminals may be computing devices such as desktop computers, notebooks, mobile electronic devices, PDAs, and cloud servers. Those skilled in the art should understand that the structures shown in the figures are merely block diagrams of a portion of the structure related to the present application solution and do not constitute a limitation on the devices, equipment, or terminals to which the present application solution is applied. Specific devices, equipment, or terminals may include more or fewer components than those shown in the figures, or combine certain components, or have different component arrangements.

[0277] A processor can be a central processing unit (CPU), other general-purpose or specialized processors, microprocessors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The processor is the control center of the aforementioned device, equipment, or terminal, connecting the various parts of the device, equipment, or terminal using various interfaces and circuits.

[0278] The memory can be used to store computer programs, modules, and data. The processor implements various functions of the device, equipment, or terminal by running or executing the computer programs and / or modules stored in the memory, and calling the data stored in the memory. The memory can mainly include a program storage area and a data storage area. The program storage area can store an operating system, at least one application required for a function (such as a sound playback function, an image playback function, etc.); the data storage area can store various types of data created by the application (such as multimedia data, documents, operation history records, etc.). In addition, the memory can include high-speed random access memory and non-volatile memory, such as a hard disk, internal memory, a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, a disk storage device, a flash memory device, or other volatile solid-state storage devices.

[0279] The present application also provides a computer-readable storage medium having a computer program stored thereon, which implements the steps of the above method when the computer program is executed by a processor. Those skilled in the art will understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0280] The modules and units integrated in the above-mentioned devices or terminal equipment, if implemented in the form of software functional units and sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the various methods disclosed in this application can also be completed by instructing related hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned methods when executed by a processor. Among them, the computer program includes computer program code, which can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may include: any entity or device capable of carrying computer program code, recording medium, USB flash drive, mobile hard disk, magnetic disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal and software distribution medium. It should be noted that the content contained in the computer-readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction.

[0281] In some embodiments, the various methods, processes, modules, devices, equipment or systems disclosed in this application may be implemented or executed in one or more processing devices (e.g., digital processors, analog processors, digital circuits designed to process information, analog circuits designed to process information, state machines, computing devices, computers and / or other mechanisms for electronically processing information). The one or more processing devices may include one or more devices that perform some or all operations of the method in response to instructions stored electronically on an electronic storage medium. The one or more processing devices may include one or more devices that are configured by hardware, firmware and / or software and are specifically designed to perform one or more operations of the method. The above is only a preferred specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any technician familiar with the technical field of this application, within the technical scope disclosed in this application, may make equivalent substitutions or changes based on the technical solution and inventive concept of the present application, which should be covered within the scope of protection of the present application.

[0282] The embodiments of the present application can be carried out in hardware, firmware, software or various combinations thereof, and can also be implemented as instructions stored on a machine-readable medium and that can be read and executed using one or more processing devices. In some embodiments, a machine-readable medium may include various mechanisms for storing and / or transmitting information in a machine (e.g., computing device) readable form. For example, a machine-readable storage medium may include a read-only memory, a random access memory, a disk storage medium, an optical storage medium, a flash memory device, and other media for storing information, and a machine-readable transmission medium may include various forms of propagation signals (including carrier waves, infrared signals, digital signals), and other media for transmitting information. Although firmware, software, routines, or instructions may be described in the above disclosure in terms of the specific exemplary aspects and embodiments of performing certain actions, it will be apparent that such descriptions are only for convenience purposes and such actions are actually generated by machine equipment, computing devices, processing devices, processors, controllers, or other devices or machines that perform firmware, software, routines, or instructions.

[0283] In the claims and specification of this application, a module used to perform a specified function or a module described using functional features is intended to cover any way of performing the function, such as: a combination of circuit elements that perform the function, software, hardware, and a combination of software and hardware used to perform or implement the function, or any form of software, firmware, code, and a combination thereof with appropriate circuits or other devices. The functions provided by various modules are combined together in the manner claimed in the claims, and it should be considered that any module, component, or element that can provide these functions is equivalent to or equivalent to the module defined in the claims. According to the principle of equivalent transformation of circuits, the circuit structure of some embodiments in this application can also be changed or modified, for example, by converting a current source into a voltage source, a series structure into a parallel structure, etc., so as to obtain more diverse embodiments, but these changes and modifications are all within the scope disclosed in this application.

[0284] This specification uses examples to disclose the present application, one or more of which are described or illustrated in the specification and its drawings. Each example is provided for the purpose of explaining the present application and is not intended to limit the present application. In fact, it is obvious to those skilled in the art that various modifications and variations can be made to the present application without departing from the scope or spirit of the present application. For example, features illustrated or described as part of one embodiment can be used together with another embodiment to obtain a further embodiment. Therefore, it is intended that the present application covers modifications and variations made within the scope of the appended claims and their equivalents. The above is only a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any technical solution that can be obtained by any person skilled in the art based on the concept of the present application through logical analysis, reasoning or limited experimentation on the basis of the existing technology, or easily conceivable changes or replacements, should be included in the scope of protection of the present application.

Claims

1. A microwave full-field three-dimensional displacement measurement method, characterized in that: include: According to the measured target, select the reference target and establish the structural coordinate system; Calculating the coordinates of the microwave transceiver in the structural coordinate system according to the distance between the microwave transceiver and the reference target; the microwave transceiver includes a first microwave transceiver, a second microwave transceiver, and a third microwave transceiver; Establishing a device coordinate system based on the calculated coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the structure coordinate system; Calculate the coordinates of the measured target in the range angle heat map of the microwave transceiver according to the coordinates of the measured target and the microwave transceiver in the structural coordinate system, and match the measuring point of the measured target in the range angle heat map of the microwave transceiver; monitoring the displacement time series of the measured target by the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver to obtain an initial three-dimensional displacement time series of the measured target in the device coordinate system; Establishing a coordinate transformation relationship from the device coordinate system to the structure coordinate system according to the device coordinate system and the structure coordinate system; According to the coordinate transformation relationship and the initial three-dimensional displacement time series, the transformed three-dimensional displacement time series of the measured object in the structural coordinate system is calculated.

2. The microwave full-field three-dimensional displacement measurement method according to claim 1, characterized in that: The detection field of view of the first microwave transceiver covers the measured target and the reference target; The detection field of view of the second microwave transceiver covers the measured target and the reference target; and The detection field of view of the third microwave transceiver covers the target to be measured and the reference target.

3. The microwave full-field three-dimensional displacement measurement method according to claim 1, characterized in that: The first microwave transceiver, the second microwave transceiver, and the third microwave transceiver are not located on a collinear line.

4. The microwave full-field three-dimensional displacement measurement method according to claim 1, characterized in that: The reference targets include a first reference target, a second reference target, and a third reference target; The selected reference targets include: Selecting a plane formed by two displacement directions of the target to be measured as a reference target plane; Selecting a first reference target, a second reference target, and a third reference target in the reference target plane, wherein the first reference target, the second reference target, and the third reference target are not collinear; The structural coordinate system is established according to the first reference target, the second reference target, and the third reference target.

5. The microwave full-field three-dimensional displacement measurement method according to claim 4, characterized in that: The structural coordinate system includes the origin 、 axis, axis, axis; where The origin is the location of the first reference target; described The positive direction of the axis is the direction from the first reference target to the second reference target; described The positive direction of the axis is The positive direction of the axis is vertical and points to the half-plane where the third reference target is located; described The positive direction of the axis points to the half space where the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver are located.

6. The microwave full-field three-dimensional displacement measurement method according to claim 4, characterized in that: Calculating the coordinates of the microwave transceiver in the structural coordinate system according to the distance between the microwave transceiver and the reference target includes: Calculating the coordinates of the first microwave transceiver in the structural coordinate system according to the distances between the first microwave transceiver and the first reference target, the second reference target, and the third reference target respectively; and / or Calculating the coordinates of the second microwave transceiver in the structural coordinate system according to the distances between the second microwave transceiver and the first reference target, the second reference target, and the third reference target respectively; and / or The coordinates of the third microwave transceiver in the structural coordinate system are calculated according to the distances between the third microwave transceiver and the first reference target, the second reference target, and the third reference target respectively.

7. The microwave full-field three-dimensional displacement measurement method according to claim 1, characterized in that: The device coordinate system includes the origin 、 axis, axis, axis; where The origin is the position of the first microwave transceiver; The device coordinate system The plane is a plane formed by the positions of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver; described Axis and The plane is vertical and points in the direction of the target; described The positive direction of the axis is the direction from the first microwave transceiver to the second microwave transceiver; described The positive direction of the axis is the direction pointing to the half space where the third microwave transceiver is located.

8. The microwave full-field three-dimensional displacement measurement method according to any one of the preceding claims, characterized in that: Calculating the coordinates of the measured target in the range angle heat map of the microwave transceiver according to the measured target and the coordinates of the microwave transceiver in the structural coordinate system includes: Calculating the coordinates of the measured target in the range angle heat map of the first microwave transceiver according to the coordinates of the measured target and the first microwave transceiver in the structural coordinate system; and / or Calculating the coordinates of the measured target in the range angle heat map of the second microwave transceiver according to the coordinates of the measured target and the second microwave transceiver in the structural coordinate system; and / or According to the coordinates of the measured target and the third microwave transceiver in the structural coordinate system, the coordinates of the measured target in the distance angle heat map of the third microwave transceiver are calculated.

9. The microwave full-field three-dimensional displacement measurement method according to claim 8, characterized in that: The matching of the measuring points of the measured target in the range angle heat map of the microwave transceiver includes: Matching a measuring point of the measured target in the first microwave transceiver according to the coordinates of the measured target in the range-angle heat map of the first microwave transceiver; and / or Matching a measuring point of the measured target in the second microwave transceiver according to the coordinates of the measured target in the range-angle heat map of the second microwave transceiver; and / or According to the coordinates of the measured target in the range angle heat map of the third microwave transceiver, the measuring points of the measured target in the third microwave transceiver are matched.

10. The microwave full-field three-dimensional displacement measurement method according to claim 6, characterized in that: The step of establishing a coordinate transformation relationship from the device coordinate system to the structure coordinate system according to the device coordinate system and the structure coordinate system includes: The coordinate conversion relationship is calculated according to the coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the device coordinate system and the coordinates in the structure coordinate system.

11. Microwave full-field three-dimensional displacement measurement system, characterized by: include: The reference target module is configured to select a reference target and establish a structural coordinate system according to the target being measured; A coordinate calculation unit is configured to calculate the coordinates of the microwave transceiver in the structure coordinate system according to the distance between the microwave transceiver and the reference target; the microwave transceiver includes a first microwave transceiver, a second microwave transceiver, and a third microwave transceiver; a three-dimensional displacement solving module, configured to establish a device coordinate system based on the calculated coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the structure coordinate system; a measuring point matching and selection module, configured to calculate the coordinates of the measured target in the range-angle heat map of the microwave transceiver based on the coordinates of the measured target and the microwave transceiver in the structural coordinate system, and match the measuring points of the measured target in the range-angle heat map of the microwave transceiver; a microwave sensing and control module, configured to monitor the displacement time series of the measured target through the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver; The three-dimensional displacement solving module is further configured to obtain an initial three-dimensional displacement time series of the measured target in the device coordinate system; a coordinate transformation relationship calculation unit, configured to establish a coordinate transformation relationship from the device coordinate system to the structure coordinate system according to the device coordinate system and the structure coordinate system; The structural coordinate system three-dimensional displacement conversion unit is configured to calculate the transformed three-dimensional displacement time series of the measured object in the structural coordinate system according to the coordinate conversion relationship and the initial three-dimensional displacement time series.

12. The microwave full-field three-dimensional displacement measurement system according to claim 11, characterized in that: The reference targets include a first reference target, a second reference target, and a third reference target; The reference target module is further configured to: Selecting a plane formed by two displacement directions of the target to be measured as a reference target plane; Selecting a first reference target, a second reference target, and a third reference target in the reference target plane, wherein the first reference target, the second reference target, and the third reference target are not collinear; The structural coordinate system is established according to the first reference target, the second reference target, and the third reference target.

13. The microwave full-field three-dimensional displacement measurement system according to claim 12, wherein: The coordinate calculation unit is further configured to calculate the coordinates of the first microwave transceiver in the structural coordinate system according to the distances between the first microwave transceiver and the first reference target, the second reference target, and the third reference target respectively; and / or Calculating the coordinates of the second microwave transceiver in the structural coordinate system according to the distances between the second microwave transceiver and the first reference target, the second reference target, and the third reference target respectively; and / or The coordinates of the third microwave transceiver in the structural coordinate system are calculated according to the distances between the third microwave transceiver and the first reference target, the second reference target, and the third reference target respectively.

14. The microwave full-field three-dimensional displacement measurement system according to any one of the preceding claims, characterized in that: The measuring point matching and selection module is further configured to calculate the coordinates of the measured target in the range angle heat map of the first microwave transceiver based on the coordinates of the measured target and the first microwave transceiver in the structural coordinate system; and / or Calculating the coordinates of the measured target in the range angle heat map of the second microwave transceiver according to the coordinates of the measured target and the second microwave transceiver in the structural coordinate system; and / or According to the coordinates of the measured target and the third microwave transceiver in the structural coordinate system, the coordinates of the measured target in the distance angle heat map of the third microwave transceiver are calculated.

15. The microwave full-field three-dimensional displacement measurement system according to claim 14, characterized in that: The measuring point matching and selection module is further configured to match the measuring point of the measured target in the first microwave transceiver according to the coordinates of the measured target in the range angle heat map of the first microwave transceiver; and / or Matching a measuring point of the measured target in the second microwave transceiver according to the coordinates of the measured target in the range-angle heat map of the second microwave transceiver; and / or According to the coordinates of the measured target in the range angle heat map of the third microwave transceiver, the measuring points of the measured target in the third microwave transceiver are matched.

16. The microwave full-field three-dimensional displacement measurement system according to claim 13, wherein: The coordinate conversion relationship calculation unit is further configured to calculate the coordinate conversion relationship according to the coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the device coordinate system and the coordinates in the structure coordinate system.

17. A microwave full-field three-dimensional displacement measurement device, comprising a memory, a processor, and a computer program stored in the memory and capable of running on the processor, characterized in that: The processor is configured to implement the steps of the microwave full-field three-dimensional displacement measurement method according to any one of claims 1 to 10 when executing the computer program.

18. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the microwave full-field three-dimensional displacement measurement method according to any one of claims 1 to 10 can be implemented.

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