A reflectivity thermal imaging test method and computer equipment

Abstract

The present invention discloses a reflectivity thermal imaging test method and computer equipment, wherein the method uses a continuous band light source to provide incident light for a test area of ​​a device to be tested, obtains the thermal reflection calibration coefficient of all positions of the device to be tested area under different band light sources through a thermal reflection calibration coefficient test step; obtains the reflectivity of all positions of the device to be tested area under different band light sources through a reflectivity test step; calculates and obtains temperature data of all positions of the device to be tested through a data processing step based on the maximum thermal reflection calibration coefficient of all positions of the device to be tested, and the reflectivity of all positions tested under the corresponding band light source when the thermal reflection calibration coefficient is maximum, and combines the temperature data to form a temperature distribution. The present invention can solve the problems of long test time and great deviation of temperature test results due to poor response of materials to light sources in some areas in the prior art, and improves the efficiency and accuracy of reflectivity thermal imaging testing.

Description

Technical Field

[0001] The invention belongs to the field of high-resolution thermal detection, and in particular relates to a reflectivity thermal imaging test method and computer equipment. Background Art

[0002] Reflectivity thermal imaging uses the property that a light beam will reflect when it shines on a material, and the reflectivity is related to the material temperature. The temperature change is obtained by testing the change in the intensity of the reflected light on the surface of the device. In recent years, as the power density of microelectronic devices continues to increase and their size continues to shrink, the heating problem of devices has attracted great attention. The industry has shown an urgent need for thermal detection of devices. Efficient and accurate thermal detection technology has become an important technical means for thermal management, reliability evaluation, and device performance optimization design of microelectronic devices.

[0003] The reflectivity thermal imaging test system of the prior art is mainly composed of a light source system, a microscope system, a camera system, and a signal trigger / excitation / synchronization device, etc., wherein the light source system is used to provide incident light, and its emitted light is irradiated to the surface of the device to be tested through the microscope system, and the reflected light on the surface of the device to be tested is then returned to the camera through the microscope system. The trigger / excitation / synchronization device is mainly used to ensure that the pulse excitation signal of the device is synchronized with the system under the pulse test condition. When the temperature of the device changes, the intensity of the reflected light detected by the camera system changes accordingly. Therefore, by testing the change in the intensity of the reflected light, and then based on the proportional coefficient of the reflectivity and temperature change of the material (thermal reflection calibration coefficient Cth), the temperature data can be obtained.

[0004] In the reflectivity thermal imaging test system of the above-mentioned prior art, the light source system mainly supports ultraviolet and visible light bands (wavelength is about 0.36um-0.8um), and the light source system emits light in discontinuous bands. For example, the mainstream NT450 reflectivity thermal imaging test system in the market can support the emission of 11 discontinuous wavelengths of light, including 365nm, 400nm, 450nm, 500nm, 530nm, 550nm, 600nm, 630nm, 650nm, 670nm, and 700nm. During the reflectivity thermal imaging test, it is necessary to select light sources one by one for testing and exploration according to the response of the surface material of the device to be tested to the light source, and determine a single light source with a higher thermal reflection calibration coefficient Cth for subsequent temperature testing, which greatly prolongs the test time. In addition, because different materials have very different responses to light sources in the same band, when the surface of the device to be tested is composed of a combination of multiple materials, this test method will cause the temperature test results to deviate greatly due to the poor response of the materials in some areas to the light source, which seriously affects the accuracy of the test. Summary of the invention

[0005] The purpose of the present invention is to provide a reflectivity thermal imaging test method, computer equipment, computer-readable storage medium and computer program product, which can solve the problems existing in the prior art of long test time and great deviation in temperature test results in some areas due to poor material response to light source, and improve the efficiency and accuracy of reflectivity thermal imaging testing.

[0006] In order to achieve the above object, one aspect of the present invention provides a reflectivity thermal imaging test method, which uses a continuous-band light source to provide incident light for a test area of ​​a device to be tested, and the method comprises:

[0007] Step S1: Fix the device to be tested on the device loading platform, set the wavelength range and test interval of the continuous band light source, and form multiple light sources with different bands;

[0008] Step S2: Put the device in a shutdown state, adjust the temperature of the device loading platform to a low temperature, and test the reflectivity of all positions of the device to be tested area under light sources of different wavelengths as the low temperature reflectivity; adjust the temperature of the device loading platform to a high temperature, and test the reflectivity of all positions of the device to be tested area under light sources of different wavelengths as the high temperature reflectivity; calculate the thermal reflection calibration coefficient of all positions of the device to be tested area under light sources of different wavelengths according to the low temperature reflectivity and high temperature reflectivity of all positions of the device to be tested area under light sources of different wavelengths;

[0009] Step S3: adjusting the temperature of the device loading platform to a low temperature, loading a working signal to put the device in a working state, and testing the reflectivity of all positions of the device to be tested under light sources of different wavelengths as the working reflectivity;

[0010] Step S4: From the thermal reflection calibration coefficients of all positions in the device to be tested area under light sources of different bands, select and determine the maximum thermal reflection calibration coefficient of all positions and the corresponding band light source when the thermal reflection calibration coefficient of all positions is maximum; based on the light source of the corresponding band when the thermal reflection calibration coefficient of all positions is maximum, select and determine the working reflectivity of all positions under the light source of its corresponding band; based on the determined maximum thermal reflection calibration coefficient of all positions and the working reflectivity of all positions tested under the light source of the corresponding band when the thermal reflection calibration coefficient is maximum, obtain the temperature data of all positions of the device to be tested, and combine the temperature data to form a temperature distribution.

[0011] Preferably, in step S2, the thermal reflection calibration coefficients of all positions of the device to be tested area under light sources of different wavelength bands are calculated by the following formula:

[0012] ,

[0013] Among them, C th is the thermal reflection calibration coefficient, and are low temperature and high temperature respectively, and They are low temperature reflectivity and high temperature reflectivity respectively.

[0014] Preferably, in step S4, the temperature of all positions of the device to be tested is calculated by the following formula: :

[0015] .

[0016] in, is the working reflectivity.

[0017] Preferably, in step S1, the wavelength range of the light source is set to 360nm-500nm, the test interval is 10nm, and 15 light sources with different wavelength bands are formed.

[0018] Another aspect of the present invention provides a computer device, including a memory, a processor, and a computer program stored in the memory, wherein the processor executes the computer program to implement the steps of the above method.

[0019] Another aspect of the present invention provides a computer-readable storage medium having a computer program stored thereon, which implements the steps of the above method when executed by a processor.

[0020] Another aspect of the present invention provides a computer program product, comprising a computer program, which implements the steps of the above method when executed by a processor.

[0021] The reflectivity thermal imaging test method, computer equipment, computer-readable storage medium and computer program product according to the above aspects of the present invention can solve the problems existing in the prior art of long test time and large deviations in temperature test results in some areas due to poor material response to light sources, thereby improving the efficiency and accuracy of reflectivity thermal imaging testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings used in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work:

[0023] Figure 1 is a flow chart of a reflectivity thermal imaging test method according to an embodiment of the present invention;

[0024] Figure 2 It is a structural diagram of a computer device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] An embodiment of the present invention provides a reflectivity thermal imaging test method. Figure 1 FIG. 1 is a flow chart of a reflectivity thermal imaging test method according to an embodiment of the present invention. Figure 1 As shown, the reflectivity thermal imaging test method of the embodiment of the present invention includes steps S1 to S4.

[0027] S1: DUT loading step

[0028] After the device to be tested is unpacked and the chip surface is exposed, it is fixed on the device loading platform and the test state is initialized, including but not limited to determining the light source wavelength range and test interval, platform temperature, and the area to be tested.

[0029] In one embodiment, the wavelength range of the light source is set to 360 nm to 500 nm, and the test interval is 10 nm, forming 15 light sources with different wavelength bands, which are respectively recorded as light source 1 to light source 15.

[0030] S2: Thermal Reflectance Calibration Coefficient Test Procedure

[0031] Thermal reflection calibration coefficient C th The calculation method is as follows:

[0032] (1)

[0033] In the formula, ΔT is the temperature change, ∆R is the reflectivity change, R is the average reflectivity, C th Usually in 10 -2 ~10 -5 K -1 scope.

[0034] In the embodiment of the present invention, the thermal reflection calibration coefficient C is tested under different light sources (light sources 1 to 15) at two temperature points, high temperature H and low temperature L. th , the specific test method is as follows:

[0035] (2)

[0036] In the formula, and are low temperature and high temperature respectively (low temperature and high temperature), and They are the reflectivity at low temperature and high temperature respectively (low temperature reflectivity and high temperature reflectivity).

[0037] In this step, the device is in the off state and the device loading platform temperature is adjusted to :

[0038] a. When the device temperature reaches a stable state, test the reflectivity of all positions of the device under different wavelengths (light sources 1 to 15) ;

[0039] b. Adjust the device loading platform temperature to When the device temperature reaches a stable state, test the reflectivity of all positions of the device under different wavelengths (light sources 1 to 15). ;

[0040] c. Based on the reflectivity of all positions of the device under test under different wavelength light sources (light sources 1 to 15) and , combined with formula 2, the thermal reflection calibration coefficient C of all positions in the device to be tested area under different band light sources (light sources 1 to 15) can be obtained th .

[0041] S3: Reflectivity test steps

[0042] Adjust the device loading platform temperature to , load the working signal to put the device in working state, and when the device temperature reaches stability, test the reflectivity of all positions of the device under different light sources (light source 1 to light source 15) (Operating reflectivity).

[0043] S4: Data processing steps

[0044] Temperature at different locations of the device under test The specific calculation method is as follows:

[0045] (3)

[0046] Based on the thermal reflection calibration coefficient and reflectivity test results of steps S2 and S3, the temperature at different locations of the device can be obtained by referring to formula (3): The specific data processing method is as follows:

[0047] a. Based on the thermal reflection calibration coefficient test results in step S2, select and determine the maximum thermal reflection calibration coefficient C of all positions of the device to be tested th , and the thermal reflectance calibration coefficient C for all positionsth The light source of the corresponding band in the maximum case.

[0048] b. Based on the thermal reflectance calibration coefficient C for all positions determined above th The light source of the corresponding band in the maximum case, select to determine the reflectivity of all positions under the corresponding light source .

[0049] c. Maximum thermal reflectance calibration coefficient C for all positions determined based on the above selection th , and the thermal reflectance calibration coefficient C for all positions th Reflectivity tested under the corresponding band light source in the maximum case , referring to the calculation method of formula (3), the temperature data of all positions of the device to be tested can be obtained, and the temperature data can be combined to form a temperature distribution.

[0050] The reflectivity thermal imaging test system and method of the above embodiment of the present invention uses a continuous band light source to scan the test area, and automatically records and presents the temperature test data of each area in its best response band to form a temperature distribution according to the response of different test areas to different band light sources. The embodiment of the present invention can improve the situation where the temperature test results of some areas are greatly deviated due to the poor response of the material to the light source, greatly improves the efficiency and accuracy of the test, and can effectively help the reflectivity thermal imaging test technology to be further promoted to the industry and improve the commercial maturity of related products. Therefore, it has huge economic and social benefits.

[0051] An embodiment of the present invention further provides a computer device, which may be a server, and its internal structure diagram may be as shown in FIG. Figure 2 As shown. The computer device includes a processor, a memory and a network interface connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store operating parameter data of each framework. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, the steps of the method of the embodiment of the present invention are implemented.

[0052] Those skilled in the art will understand that Figure 2The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0053] An embodiment of the present invention further provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of the method of the embodiment of the present invention are implemented.

[0054] An embodiment of the present invention further provides a computer program product, including a computer program, which implements the steps of the method of the embodiment of the present invention when executed by a processor.

[0055] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A reflectivity thermal imaging test method, characterized in that: A continuous-waveband light source is used to provide incident light to a test area of ​​a device under test, and the method comprises: Step S1: Fix the device to be tested on the device loading platform, set the wavelength range and test interval of the continuous band light source, and form multiple light sources with different bands; Step S2: Put the device in a shutdown state, adjust the temperature of the device loading platform to a low temperature, and test the reflectivity of all positions of the device to be tested area under light sources of different wavelengths as the low temperature reflectivity; adjust the temperature of the device loading platform to a high temperature, and test the reflectivity of all positions of the device to be tested area under light sources of different wavelengths as the high temperature reflectivity; calculate the thermal reflection calibration coefficient of all positions of the device to be tested area under light sources of different wavelengths according to the low temperature reflectivity and high temperature reflectivity of all positions of the device to be tested area under light sources of different wavelengths; Step S3: adjusting the temperature of the device loading platform to a low temperature, loading a working signal to put the device in a working state, and testing the reflectivity of all positions of the device to be tested under light sources of different wavelengths as the working reflectivity; Step S4: From the thermal reflection calibration coefficients of all positions in the device to be tested area under light sources of different bands, select and determine the maximum thermal reflection calibration coefficient of all positions and the corresponding band light source when the thermal reflection calibration coefficient of all positions is maximum; based on the light source of the corresponding band when the thermal reflection calibration coefficient of all positions is maximum, select and determine the working reflectivity of all positions under the light source of its corresponding band; based on the determined maximum thermal reflection calibration coefficient of all positions and the working reflectivity of all positions tested under the light source of the corresponding band when the thermal reflection calibration coefficient is maximum, obtain the temperature data of all positions of the device to be tested, and combine the temperature data to form a temperature distribution.

2. The method according to claim 1, characterized in that In step S2, the thermal reflection calibration coefficients of all positions of the device to be tested area under light sources of different wavelengths are calculated by the following formula: ， Among them, C th is the thermal reflection calibration coefficient, and are low temperature and high temperature respectively, and They are low temperature reflectivity and high temperature reflectivity respectively.

3. The method according to claim 2, characterized in that In step S4, the temperature of all positions of the device to be tested is calculated by the following formula: : ， in, is the working reflectivity.

4. The method according to any one of claims 1 to 3, characterized in that In step S1, the wavelength range of the light source is set to 360nm-500nm, and the test interval is 10nm, forming 15 light sources with different wavelength bands.

5. A computer device comprising a memory, a processor and a computer program stored in the memory, characterized in that: The processor executes the computer program to implement the steps of the method according to any one of claims 1 to 4.

6. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 4 are implemented.

7. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 4 are implemented.

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