Display device and display module

Abstract

The display device and the display module are provided. The display module comprises a display panel, a support layer arranged on a non-light-emitting side of the display panel and supporting the display panel, a support part connected with a side edge of the support layer, the support part being bent away from a side of the support layer close to the display panel, a circuit board arranged on the support part, and a chip on film electrically connected with the display panel and the circuit board. The display module has improved heat dissipation performance and is conducive to realizing a narrow frame.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a display device and a display module. BACKGROUND

[0002] With the development of economy, display modules have been more and more widely used in people's life. However, the existing display modules still need to be improved. SUMMARY

[0003] The purpose of the present disclosure is to provide a display device and a display module.

[0004] According to one aspect of the present disclosure, a display module is provided, comprising:

[0005] a display panel;

[0006] a support layer, disposed on a non-light-emitting side of the display panel and supporting the display panel;

[0007] a support portion, connected to a side edge of the support layer, the support portion being bent away from a side of the support layer facing the display panel;

[0008] a circuit board, disposed on the support portion;

[0009] a chip on film, electrically connected to the display panel and the circuit board.

[0010] Further, the chip on film comprises a substrate and a chip, the substrate comprises a first portion and a second portion, the first portion and the second portion are correspondingly disposed on opposite sides of the support portion in a direction parallel to the display panel; the chip is disposed on the first portion, and the circuit board is connected between the second portion and the support portion.

[0011] Further, the chip is disposed on a side of the first portion facing the support portion, the support portion is provided with a relief space, and the chip is disposed in the relief space.

[0012] Further, the number of chip on films is plural, the number of relief spaces is plural, and the chips of the plural chip on films are correspondingly disposed in the plural relief spaces.

[0013] Further, the display module comprises first adhesive and second adhesive; in a direction parallel to the display panel, the first adhesive and the second adhesive are located on the same side of the support portion; the first adhesive and the second adhesive are bonded between the substrate and the support portion; in a thickness direction of the display panel, the relief space is located between the first adhesive and the second adhesive.

[0014] Further, the avoiding space is a through hole penetrating the support part.

[0015] Further, the display module further comprises a third adhesive, the circuit board is adhered to the support part through the third adhesive, and the third adhesive covers at least part of the avoiding space.

[0016] Further, the display module further comprises:

[0017] A polarizer is arranged on a side of the display panel opposite to the support layer, and the display panel extends out of the polarizer in a direction parallel to the display panel, and the first part is connected to a part of the display panel extending out of the polarizer at an end away from the second part.

[0018] Further, the COF comprises a substrate and a chip arranged on the substrate, and the circuit board and the chip are arranged on the same side of the support part in a direction parallel to the display panel.

[0019] Further, part of the support part is in a plate structure and forms an angle less than or equal to 90° with the support layer.

[0020] Further, the support layer and the support part are in an integrated structure.

[0021] According to an aspect of the present disclosure, a display device is provided, comprising the display module. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is a schematic view of a display module in a flat state in the related art.

[0023] Figure 2 is Figure 1 is a partial schematic view of an A-A section of the structure shown.

[0024] Figure 3 is a schematic view of a display module in the related art.

[0025] Figure 4 is a schematic view of a display module in an embodiment of the present disclosure.

[0026] Figure 5 is a schematic view of a support layer and a support part in a display module in an embodiment of the present disclosure.

[0027] Figure 6 is a schematic view of a display panel in a display module in an embodiment of the present disclosure.

[0028] Explanation of reference signs: 1, display panel; 2, chip on film; 201, substrate; 2011, first part; 2012, second part; 202, chip; 3, circuit board; 4, glass cover plate; 5, support layer; 501, first side edge; 502, second side edge; 6, pressure sensitive adhesive; 7, polarizer; 8, OCA optical adhesive; 9, support portion; 10, first adhesive; 11, second adhesive; 12, avoidance space; 13, third adhesive; 14, active layer; 15, first gate insulating layer; 16, first gate electrode layer; 17, second gate insulating layer; 18, second gate electrode layer; 19, interlayer insulating layer; 20, first source / drain electrode layer; 21, first planarization layer; 22, second source / drain electrode layer; 23, second planarization layer; 24, first electrode; 25, light emitting layer; 26, second electrode; 27, pixel defining layer; 28, substrate; 29, adhesive. DETAILED DESCRIPTION

[0029] The exemplary embodiments will be described in detail herein with reference to the attached drawings. In the following description, the same numbers are used to indicate the same elements throughout the several views. The following description is not intended for limiting all embodiments consistent with the present disclosure to the examples described. Rather, it is intended to describe some examples consistent with aspects of the present disclosure, as detailed in the appended claims.

[0030] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to limit the disclosure. Unless otherwise defined, the technical or scientific terms used in this disclosure should be understood in their ordinary sense by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure and the claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “a” or “one,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. “A plurality” or “several” indicates two or more. Unless otherwise stated, the terms “front,” “rear,” “lower,” and / or “upper,” and similar terms are for ease of description only and are not limited to a location or spatial orientation. The terms “comprising,” “including,” and similar terms mean that the elements or objects preceding “comprising,” encompass the elements or objects listed following “comprising,” and their equivalents, and do not exclude other elements or objects. The terms “connected,” “linked,” and similar terms are not limited to physical or mechanical connections and can include electrical connections, whether direct or indirect. The singular forms “a,” “the,” and “the” used in this disclosure and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0031] Figure 2 yes Figure 1 A partial schematic diagram of the AA cross-section of the structure shown. In related technologies, such as... Figure 1 and Figure 2 As shown, the display panel 1 of the vehicle-mounted display module can be a long strip screen extending along the X direction (the direction of the long side of the display panel 1). The circuit board 3 is connected to the display panel 1 through the flip-chip film 2 and communicates with the display panel 1 through the flip-chip film 2. Figure 3 As shown, in actual products, the chip 202 on the circuit board 3 and the flip-chip film 2 needs to be flipped to the non-light-emitting side of the display panel 1 to connect with the support layer 5 via adhesive 29. This causes the circuit board 3 and the chip 202 to block the heat dissipation of the display module, which reduces the heat dissipation performance of the display module. Simultaneously, after the chip 202 on the circuit board 3 and the flip-chip film 2 is flipped to the back side of the display panel 1, in order for the glass cover plate 4 to cover the circuit board 3, the glass cover plate 4 needs to be enlarged in the Y direction (see...). Figure 1 The portion of the display panel 1 that extends beyond the size W of the display panel 1 (see figure 1) along its shorter side. Figure 1 and Figure 3 This makes it difficult to achieve a narrow bezel. The X direction is perpendicular to the Y direction.

[0032] The display module provided by the embodiments of the present disclosure can include a display panel 1, a support layer 5, a support portion 9, a circuit board 3, and a chip on film 2. Figure 4 and Figure 5 The display module can include a display panel 1, a support layer 5, a support portion 9, a circuit board 3, and a chip on film 2, wherein:

[0033] The support layer 5 is arranged on the non-light-emitting side of the display panel 1 and supports the display panel 1. The support portion 9 is connected to the side of the support layer 5, and the support portion 9 is bent away from the display panel 1 relative to the support layer 5. The circuit board 3 is arranged on the support portion 9. The chip on film 2 is electrically connected to the display panel 1 and the circuit board 3.

[0034] In the display module provided by the embodiments of the present disclosure, the circuit board 3 is arranged on the support portion 9, and the chip on film 2 is electrically connected to the display panel 1 and the circuit board 3. Since the support portion 9 is bent away from the display panel 1 relative to the support layer 5, the circuit board 3 is not connected to the support layer 5, and the heat dissipation of the display panel 1 is not blocked by the circuit board 3, which is beneficial to improve the heat dissipation performance of the display module. On the other hand, the size W (see Figure 1 ) of the glass cover plate 4 in the Y direction (see Figure 1 and Figure 4 ) beyond the display panel 1 does not need to be increased, which is beneficial to realize a narrow frame.

[0035] The display module provided by the embodiments of the present disclosure will be described in detail as follows:

[0036] The display panel 1 can be an organic electroluminescence (OLED) display panel, and of course, it can also be a liquid crystal (LCD) display panel. The display panel 1 can be a long screen used in a vehicle center console. Taking the OLED display panel as an example, as shown in Figure 4 and Figure 6 , the display panel 1 can include a substrate 28, a driving circuit layer (not shown), and a light-emitting structure (not shown). The substrate 28 can be a rigid substrate. The rigid substrate can be a glass substrate or a PMMA (Polymethylmethacrylate) substrate, etc. Of course, the substrate 28 can also be a flexible substrate. The flexible substrate can be a PET (Polyethylene terephthalate) substrate, a PEN (Polyethylene naphthalate two formic acid glycol ester) substrate, or a PI (Polyimide) substrate.

[0037] The driving circuit layer can be disposed on one side of the substrate 28. The driving circuit layer may include a thin-film transistor (TFT). The TFT can be a top-gate TFT, but it can also be a bottom-gate TFT. Taking a top-gate TFT as an example... Figure 6 As shown, the thin-film transistor may include an active layer 14, a first gate insulating layer 15, a first gate electrode layer 16, a second gate insulating layer 17, a second gate electrode layer 18, an interlayer insulating layer 19, a first source / drain electrode layer 20, a first planarization layer 21, and a second source / drain electrode layer 22. The active layer 14 may be disposed on a substrate 28. The first gate insulating layer 15 may be disposed on the substrate 28 and cover the active layer 14. The first gate electrode layer 16 may be disposed on the side of the first gate insulating layer 15 away from the substrate 28. The second gate insulating layer 17 may be disposed on the first gate insulating layer 15 and cover the first gate electrode layer 16. The second gate electrode layer 18 may be disposed on the side of the second gate insulating layer 17 away from the substrate 28. The interlayer insulating layer 19 may be disposed on the second gate insulating layer 17 and cover the second gate electrode layer 18. The first source / drain electrode layer 20 may be disposed on the interlayer insulating layer 19 and connected to the active layer 14 via vias passing through the interlayer insulating layer 19, the first gate insulating layer 15, and the second gate insulating layer 17. The first planarization layer 21 may cover the first source / drain electrode layer 20 and the interlayer insulating layer 19. The second source / drain electrode layer 22 may be disposed on the first planarization layer 21 and electrically connected to the first source / drain electrode layer 20 of the thin-film transistor via vias passing through the first planarization layer 21. The display panel 1 of this disclosure may further include a second planarization layer 23. The second planarization layer 23 may cover the second source / drain electrode layer 22.

[0038] The light-emitting structure can be arranged on the side of the driving circuit layer away from the substrate 28. The light-emitting structure can include the first electrode 24 and the second electrode 26 arranged oppositely, and the light-emitting layer 25 between the first electrode 24 and the second electrode 26. The first electrode 24 can be an anode, and the second electrode 26 can be a cathode, but the present disclosure is not limited thereto. The first electrode 24 can be arranged on the side of the second planarization layer 23 away from the substrate 28, and electrically connected with the second source-drain electrode layer 22 through a via hole passing through the second planarization layer 23. The display panel 1 of the present disclosure can further include a pixel definition layer 27. The pixel definition layer 27 covers the second planarization layer 23 and the first electrode 24. The pixel definition layer 27 is provided with a pixel opening exposing the first electrode 24. The light-emitting layer 25 of the light-emitting structure can be arranged on the side of the first electrode 24 away from the substrate 28. The second electrode 26 of the light-emitting structure is arranged on the side of the light-emitting layer 25 away from the substrate 28. The display panel 1 of the present disclosure can further include an encapsulation layer. The encapsulation layer can cover the light-emitting structure. The encapsulation layer can include a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. The first inorganic encapsulation layer and the second inorganic encapsulation layer are arranged oppositely, and the organic encapsulation layer is wrapped between the first inorganic encapsulation layer and the second inorganic encapsulation layer.

[0039] As shown in Figure 4 The display module can further include a polarizer 7 and a glass cover plate 4. The polarizer 7 can be arranged on the side of the encapsulation layer away from the substrate 28. The glass cover plate 4 can be arranged on the side of the polarizer 7 away from the substrate 28, and the polarizer 7 can be bonded to the glass cover plate 4 through OCA optical adhesive 8. In the direction parallel to the display panel 1, the display panel 1 can protrude out of the polarizer 7, and the aforementioned COF 2 can be connected to the part of the display panel 1 protruding out of the polarizer 7. Among them, the aforementioned display panel 1 can include a display area and a peripheral area surrounding the display area. The binding structure can be arranged in the peripheral area. At least part of the binding structure can be located outside the orthographic projection area of the polarizer 7 on the display panel 1, and the aforementioned COF 2 can be connected to the binding structure, so that the COF 2 is connected to the part of the display panel 1 protruding out of the polarizer 7. The glass cover plate 4 has a large area, which can cover the entire display panel 1.

[0040] As shown in Figure 4 The support layer 5 supports the non-light-emitting side of the display panel 1. Among them, the display panel 1 can be bonded to the support layer 5, for example, the display panel 1 can be bonded to the support layer 5 through pressure sensitive adhesive 6 (PSA). The material of the support layer 5 can be stainless steel, aluminum, etc., and the present disclosure does not make special limitations thereon. The support layer 5 can be a layered structure, etc. Taking the display panel 1 as a long strip screen as an example, the support layer 5 can also be long strip-shaped.

[0041] As shown in Figure 4and Figure 5 As shown, one end of the support portion 9 is connected to the support layer 5, and the other end of the support portion 9 is located on the side of the support layer 5 facing away from the display panel 1. In a direction parallel to the display panel 1, the support layer 5 includes opposing first side 501 and second side 502; the display panel 1 extends a polarizer 7 along a direction from the second side 502 to the first side 501; the support portion 9 can be connected to the first side 501 of the support layer 5. The material of the support portion 9 can be stainless steel, aluminum, etc., and this disclosure does not impose any special limitations on it. The support portion 9 can be a layered structure, etc. One end of the support portion 9 can be fixedly connected to the support layer 5, for example, by bonding or welding. Of course, the support portion 9 can also be detachably connected to the support layer 5, for example, by threaded connection. In other embodiments of this disclosure, the support layer 5 and the support portion 9 can be an integral structure, that is, the support portion 9 can be integrally formed from the support layer 5. An angle α exists between the support portion 9 and the support layer 5. Taking a structure where the support layer 5 and the support part 9 are integrated as an example, there is an angle α between the support part 9 and the support layer 5, meaning that the support part 9 is bent relative to the support layer 5. The support layer 5 can be perpendicular or approximately perpendicular to the support part 9, meaning the angle α between the support part 9 and the support layer 5 can be 90° or approximately 90°. Furthermore, the angle α between the support part 9 and the support layer 5 can also be an acute angle.

[0042] like Figure 4 As shown, the circuit board 3 can be disposed on the support portion 9. The circuit board 3 can be bonded to the support portion 9 using a third adhesive 13. The circuit board 3 can be a flexible printed circuit (FPC). The flip-chip film 2 is connected to the display panel 1. Specifically, the flip-chip film 2 can be connected to the bonding structure of the peripheral area of ​​the display panel 1. Furthermore, the flip-chip film 2 can be connected to the side of the display panel 1 facing away from the support layer 5. In addition, the flip-chip film 2 is also connected to the circuit board 3, enabling signal connection between the circuit board 3 and the display panel 1. The display panel 1 and the circuit board 3 can be connected using multiple flip-chip films 2. Figure 1 As shown, taking a long strip screen as an example, multiple flip-chip films 2 can be distributed along the extension direction of the long strip screen. For example, the substrate 201 of the flip-chip film 2 can include a first part 2011 and a second part 2012. In a direction parallel to the display panel 1, the first part 2011 and the second part 2012 are respectively disposed on opposite sides of the support portion 9; the chip 202 is disposed in the first part 2011, and the circuit board 3 is connected between the second part 2012 and the support portion 9. The chip 202 can be disposed on the side of the first part 2011 facing the support portion 9.

[0043] like Figure 4As shown, the flip-chip film 2 may include a substrate 201 and a chip 202 (IC). The substrate 201 may be a flexible substrate and may have a wiring structure. The substrate 201 may be electrically connected to the display panel 1 and the circuit board 3, so that the flip-chip film 2 is electrically connected to the display panel 1 and the circuit board 3. In addition, the substrate 201 may also be bonded to the support portion 9. Specifically, the display module may also include a first adhesive 10 and a second adhesive 11, and the substrate 201 may be bonded to the support portion 9 through the first adhesive 10 and the second adhesive 11. Wherein, in the direction parallel to the display panel 1, the first adhesive 10 and the second adhesive 11 may be located on the same side of the support portion 9, and the first adhesive 10 and the second adhesive 11 are bonded between the substrate 201 and the support portion 9. In addition, the first adhesive 10 and the second adhesive 11 may be spaced apart in the thickness direction of the display panel 1.

[0044] like Figure 4 As shown, the chip 202 can be disposed on the substrate 201 and electrically connected to the wiring structure. In a direction parallel to the display panel 1, the chip 202 can be disposed on one side of the support portion 9, and the chip 202 can be located between the substrate 201 and the support portion 9. Furthermore, the support portion 9 can be provided with a clearance space 12. The chip 202 can be disposed in the clearance space 12, that is, at least a portion of the chip 202 can be located within the clearance space 12. The clearance space 12 can be a through-hole penetrating the support portion 9. Furthermore, in the thickness direction of the display panel 1, the clearance space 12 can be located between the first adhesive 10 and the second adhesive 11. The number of flip-chip films 2 and clearance spaces 12 can both be multiple, and the chips 202 of the multiple flip-chip films 2 are correspondingly disposed in multiple clearance spaces 12. Furthermore, in a direction parallel to the display panel 1, the circuit board 3 can be disposed on the side of the support portion 9 away from the chip 202, that is, the circuit board 3 is connected to the second part 2012. Of course, the circuit board 3 can also be disposed on the same side of the support portion 9 as the chip 202. Taking the circuit board 3 being disposed on the side of the support portion 9 away from the chip 202 as an example, the third adhesive 13 can cover at least a portion of the clearance space 12.

[0045] This disclosure also provides a display device. The display device may include the display module described in any of the above embodiments. The display device may be a mobile phone or a computer, or of course, a television, etc. Since the display module included in the display device of this disclosure is the same as the display module in the embodiments described above, it has the same beneficial effects, and will not be described again here.

[0046] The above merely describes the preferred embodiments of the present disclosure and is not intended to limit the present disclosure in any form. Although the present disclosure has been described as above with the preferred embodiments, it is not intended to limit the present disclosure, and any person skilled in the art can make some changes or modifications to the equivalent embodiments with the above disclosed technical contents without departing from the scope of the technical solutions of the present disclosure. Any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present disclosure shall still fall within the scope of the technical solutions of the present disclosure.

Claims

1. A display module, characterized in that, include: Display panel; A support layer is disposed on the non-light-emitting side of the display panel and supports the display panel; A support portion is connected to the side of the support layer, and the support portion is bent relative to the support layer toward the side away from the display panel; The circuit board is disposed in the support portion; A flip-chip film is electrically connected to the display panel and the circuit board; wherein, The flip-chip film includes a substrate and a chip. The substrate includes a first part and a second part. In a direction parallel to the display panel, the first part and the second part are respectively disposed on opposite sides of the support portion. The chip is disposed in the first part, and the circuit board is connected between the second part and the support portion.

2. The display module according to claim 1, characterized in that, The chip is located on the side of the first part facing the support portion, the support portion has a clearance space, and the chip is located in the clearance space.

3. The display module according to claim 2, characterized in that, The number of flip-chip films is multiple, the number of clearance spaces is multiple, and the chips of the multiple flip-chip films are respectively disposed in the multiple clearance spaces.

4. The display module according to claim 2, characterized in that, The display module includes a first adhesive and a second adhesive; in a direction parallel to the display panel, the first adhesive and the second adhesive are located on the same side of the support portion; the first adhesive and the second adhesive are bonded between the substrate and the support portion; in the thickness direction of the display panel, the clearance space is located between the first adhesive and the second adhesive.

5. The display module according to claim 2, characterized in that, The clearance space is a through hole that penetrates the support portion.

6. The display module according to claim 5, characterized in that, The display module also includes a third adhesive, through which the circuit board is bonded to the support portion, and the third adhesive covers at least a portion of the clearance space.

7. The display module according to claim 1, characterized in that, The display module also includes: A polarizer is disposed on the side of the display panel facing away from the support layer, and the display panel extends out of the polarizer in a direction parallel to the display panel. The end of the first portion away from the second portion is connected to the portion of the display panel that extends out of the polarizer.

8. The display module according to claim 1, characterized in that, The portion of the support shown has a plate-like structure, and the angle between it and the support layer is less than or equal to 90°.

9. The display module according to claim 1, characterized in that, The support layer and the support part are an integral structure.

10. The display module according to claim 1, characterized in that, The flip-chip film includes a substrate and a chip disposed on the substrate; in a direction parallel to the display panel, the circuit board and the chip are disposed on the same side of the support portion.

11. A display device, characterized in that, Includes the display module as described in any one of claims 1-10.

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