Method and apparatus for detecting an analyte
By using a first edge detection module to acquire sidewall images in a wafer inspection device, the problem of increased costs due to additional ranging devices is solved, achieving the effects of equipment simplification and cost reduction.
Patent Information
- Application Number
- CN202410952820.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-16
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2044-07-16
AI Technical Summary
In existing wafer inspection equipment, the additional ranging device increases the equipment cost, resulting in high inspection costs.
The first edge detection module is used to obtain a complete image of the sidewall of the object under test. The height of the object under test along the direction perpendicular to the top surface is obtained by the position information of the sidewall of the object under test in the sidewall image, which simplifies the equipment structure and reduces the detection cost.
The height information of the object under test can be obtained directly by the first edge detection module, which simplifies the equipment structure, reduces the detection cost, and improves the detection accuracy.
Smart Images

Figure CN119008456B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of optical equipment technology, and specifically to a method and equipment for detecting an object under test. Background Technology
[0002] In wafer edge inspection equipment, an imaging device is required to photograph the wafer surface. To ensure that the wafer surface remains within the depth of field of the imaging device during the inspection process, an autofocus device is used to detect the position of the wafer surface to determine whether the wafer is in focus. If it is out of focus, the relative position of the wafer and the imaging device needs to be adjusted.
[0003] Existing technologies often use a ranging device to detect the height of the wafer surface to determine whether the imaging device is out of focus. However, this method requires an additional ranging device, increasing equipment costs. Summary of the Invention
[0004] The technical solution of this application is to provide a detection method and detection equipment for the analyte, which simplifies the equipment and reduces the detection cost.
[0005] This invention provides a method for detecting an object to be tested, the object to be tested including a top surface and a side surface connected to the top surface, comprising: acquiring a complete image of the side wall of the object to be tested using a first edge detection module to obtain a side wall image, the side wall image including position information of several points of the side wall of the object to be tested in a plane perpendicular to the normal direction of the side wall; and acquiring the height of the object to be tested along the direction perpendicular to the top surface using the first edge detection module based on the position information of the side wall of the object to be tested in the side wall image.
[0006] Optionally, the height to be measured is the height of a feature point of the object to be measured along a direction perpendicular to the top surface; the feature point is the center of the object to be measured, the center of any surface of the object to be measured, or a corner point; the first edge detection module obtains the height to be measured of the object to be measured along a direction perpendicular to the top surface based on the position information of the sidewall of the object to be measured in the sidewall image, including: obtaining an edge contour image of the edge contour of the object to be measured in the sidewall image; and obtaining the height to be measured of the feature point along a direction perpendicular to the top surface based on the edge contour image.
[0007] Optionally, the feature point is the center of the object to be measured; the edge contour image includes a first edge contour image and a second edge contour image; the step of obtaining the height to be measured of the feature point along the direction perpendicular to the top surface based on the edge contour image includes: obtaining the height to be measured based on the position information of the first center of symmetry of the first edge contour image and the second edge contour image.
[0008] Optionally, the step of obtaining the edge contour image of the edge contour of the object to be measured in the sidewall image includes: obtaining a first edge contour image of the first edge contour of the object to be measured in the sidewall image; obtaining a second edge contour image of the second edge contour of the object to be measured in the sidewall image; both the first edge contour image and the second edge contour image are cosine curves; the step of obtaining the height to be measured based on the position information of the first center of symmetry of the first edge contour image and the second edge contour image includes: obtaining the valley value of the position information of the first edge contour image closest to the reference point along the first direction and the peak value of the position information of the second edge contour image along the first direction, wherein the reference point and the feature point have the same height along the direction perpendicular to the first direction, and the first direction is parallel to the arrangement direction of the first edge contour image and the second edge contour image; and taking the average of the valley value of the position information of the first edge contour image along the first direction and the peak value of the position information of the second edge contour image along the first direction as the height to be measured. The height to be measured can be determined by: obtaining the peak value of the position information of the first edge contour image and the second edge contour image along the first direction, and the valley value of the position information of the first edge contour image and the second edge contour image along the first direction, wherein the reference point and the feature point have the same height along the direction perpendicular to the first direction, and the first direction is parallel to the arrangement direction of the first edge contour image and the second edge contour image; taking the average of the peak value of the position information of the first edge contour image and the valley value of the position information of the second edge contour image along the first direction as the height to be measured; or, obtaining the height to be measured based on the position information of the first edge contour image and the second edge contour image along the first direction, wherein: obtaining the center contour image of the first edge contour image and the second edge contour image; and obtaining the height to be measured based on the average of the peak value and the valley value of the position information of the center contour image along the first direction.
[0009] Optionally, the cross-sectional shape of the object to be tested along the central axis perpendicular to the object to be tested is circular; the detection method of the object to be tested further includes: obtaining the tilt angle α of the object to be tested based on the thickness d of the object to be tested, the difference between the valley value Z0 of the position information of the first edge contour image along the first direction and the peak value Z1 of the position information of the second edge contour image along the first direction and the radius R of the object to be tested; Sinα=(Z1+d-Z0) / 2R.
[0010] Optionally, it further includes: obtaining the defocus state of the object under test based on the measured height of the object under test along the direction perpendicular to the top surface; obtaining the defocus state of the object under test includes: when the difference between the measured height and the reference height is less than or equal to a preset threshold, the object under test is in focus along the height perpendicular to the top surface; when the difference between the measured height and the reference height is greater than the preset threshold, the object under test is out of focus along the height perpendicular to the top surface.
[0011] Optionally, obtaining the sidewall image by acquiring a complete image of the object under test using the first edge detection module includes: acquiring multiple initial sidewall images of the object under test at different positions using the first edge detection module; stitching the multiple initial sidewall images together to obtain a complete image of the object under test; or, fitting the sidewall of the object under test to multiple initial sidewall images to obtain the sidewall image.
[0012] Optionally, the method further includes: if the object under test is out of focus along a height perpendicular to the top surface, adjusting the position of the object under test along the direction perpendicular to the top surface to bring the object under test back into focus; after adjusting the position of the object under test along the direction perpendicular to the top surface, the detection method for the object under test further includes: using the first edge detection module to detect along the normal direction of the sidewall of the object under test; using the second edge detection module to detect the sidewall of the object under test along a direction having an inclined angle with the top surface; using the third edge detection module to detect the sidewall of the object under test along a direction having an inclined angle with the top surface; the third edge detection module and the second edge detection module are located on both sides of the first edge detection module along a direction perpendicular to the top surface.
[0013] Optionally, it further includes: if the object under test is out of focus along a height perpendicular to the top surface, adjusting the position of the object under test along the direction perpendicular to the top surface so that the object under test is in focus; setting the top detection module on one side of the top surface of the object under test; after adjusting the position of the object under test along the direction perpendicular to the top surface, using the top detection module to detect the top surface of the edge area of the object under test.
[0014] The present invention also provides a detection device for detecting an object to be tested, the object to be tested including a top surface and a side surface connected to the top surface, comprising: a first edge detection module; the first edge detection module is used to acquire a complete image of the side wall of the object to be tested to obtain a side wall image, the side wall image including position information of several points of the side wall of the object to be tested in a plane perpendicular to the normal direction of the side wall, the first edge detection module is further used to acquire the height of the object to be tested along the direction perpendicular to the top surface based on the position information of the side wall of the object to be tested in the side wall image.
[0015] Optionally, the height to be measured is the height of the feature point of the object to be measured along the direction perpendicular to the top surface; the feature point is the center of the object to be measured, the center of any surface of the object to be measured, or a corner point; the first edge detection module includes a sidewall image acquisition unit, an image processing unit, and a height acquisition unit. The sidewall image acquisition unit is used to acquire a complete image of the sidewall of the object to be measured to obtain a sidewall image. The image processing unit is used to acquire an edge contour image of the edge contour of the object to be measured in the sidewall image. The height acquisition unit is used to acquire the height to be measured of the feature point along the direction perpendicular to the top surface based on the edge contour image.
[0016] Optionally, the feature point is the center of the object to be measured; the image processing unit is used to acquire the edge contour image of the edge contour of the object to be measured in the sidewall image, including: the image processing unit is used to acquire a first edge contour image and a second edge contour image that are opposite each other; the height acquisition unit is used to acquire the height to be measured based on the position information of the first center of symmetry of the first edge contour image and the second edge contour image.
[0017] Optionally, the first edge detection module is used to perform detection along the normal direction of the sidewall of the object to be tested; the detection device further includes: a second edge detection module, used to perform detection on the sidewall of the object to be tested along a direction having an inclined angle with the top surface; a third edge detection module, used to perform detection on the sidewall of the object to be tested along a direction having an inclined angle with the top surface; the third edge detection module and the second edge detection module are located on both sides of the first edge detection module along a direction perpendicular to the top surface; and a top detection module is used to perform detection on the top surface of the edge area of the object to be tested.
[0018] Optionally, it also includes: a motion stage for rotating the object under test relative to the first edge detection module.
[0019] The detection method for the test object provided by the present invention uses a first edge detection module to obtain a complete image of the sidewall of the test object to obtain a sidewall image. The first edge detection module then uses the position information of the sidewall in the sidewall image to obtain the height of the test object along the direction perpendicular to the top surface. This method allows for direct acquisition of the height information of the test object using the first edge detection module, thereby simplifying the equipment and reducing detection costs. Attached Figure Description
[0020] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0021] Figure 1 This is a flowchart of a detection method for a analyte provided in an embodiment of the present invention;
[0022] Figure 2 This is a schematic diagram of a detection device provided in an embodiment of the present invention;
[0023] Figure 3 This is a schematic diagram of a sidewall image obtained in one embodiment of the present invention;
[0024] Figure 4 This is a schematic diagram of the structure of the first edge detection module in one embodiment of the present invention. Detailed Implementation
[0025] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0026] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0027] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0028] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0029] One embodiment of the present invention provides a method for detecting an analyte, referencing Figure 1 ,include:
[0030] Step S1: The first edge detection module is used to obtain a complete image of the sidewall of the object under test to obtain a sidewall image. The sidewall image includes the position information of several points of the sidewall of the object under test in a plane perpendicular to the normal of the sidewall.
[0031] Step S2: The first edge detection module is used to obtain the height of the object to be tested along the direction perpendicular to the top surface based on the position information of the side wall of the object to be tested in the side wall image.
[0032] In the detection method for the object under test in this embodiment, a first edge detection module is used to obtain a complete image of the sidewall of the object under test to obtain a sidewall image. The first edge detection module then uses the position information of the sidewall in the sidewall image to obtain the height of the object under test along the direction perpendicular to the top surface. This method allows for direct acquisition of the height information of the object under test using the first edge detection module, thereby simplifying the equipment and reducing detection costs.
[0033] refer to Figure 2 The motion stage 7 drives the test object 8 to rotate relative to the first edge detection module 4. During the rotation of the test object 8 relative to the first edge detection module 4, the first edge detection module acquires a complete image of the side wall of the test object to obtain a side wall image.
[0034] In this embodiment, the motion stage 7 drives the object under test 8 to rotate relative to the first edge detection module 4, including: driving the object under test 8 to rotate relative to the first edge detection module 4 using the motion stage 7. Specifically, the motion stage 7 drives the object under test 8 to rotate around its central axis. The object under test 8 can be placed on the support surface of the motion stage 7, and the motion stage 7 drives the object under test 8 to rotate around its central axis.
[0035] In other embodiments of this application, the motion stage 7 drives the object under test 8 to rotate relative to the first edge detection module 4, including: driving the first edge detection module 4 to rotate using the motion stage 7, so that the object under test 8 and the first edge detection module 4 rotate relative to each other. Specifically, the motion stage 7 drives the first edge detection module 4 to rotate around the sidewall of the object under test 8.
[0036] In this embodiment, the cross-sectional shape of the test object 8 along a direction perpendicular to its central axis is, for example, circular. The test object 8 can be a wafer. Correspondingly, the top surface of the test object 8 is circular. In other embodiments of this application, the test object can also be glass, an OLED screen, or a chip.
[0037] refer to Figure 2 and Figure 3The first edge detection module 4 is used to obtain a complete image of the sidewall of the object under test 8 to obtain a sidewall image B0. The sidewall image B0 includes the position information of several points of the sidewall of the object under test 8 in a plane perpendicular to the sidewall normal.
[0038] In this embodiment, the first edge detection module 4 is used to acquire the sidewall image B0 along the normal direction of the sidewall of the object under test 8.
[0039] In this embodiment, the height to be measured is the height of the feature point of the object to be measured along the direction perpendicular to the top surface of the object to be measured 8; the feature point is the center of the object to be measured, the center of any surface of the object to be measured, or a corner point.
[0040] In this embodiment, the first edge detection module 4 is used to obtain the height to be measured of the object under test 8 along the direction Z perpendicular to the top surface of the object under test 8 based on the position information of the side wall of the object under test in the side wall image B0. This includes: obtaining the edge contour image B1 of the edge contour of the object under test 8 in the side wall image B0; and obtaining the height to be measured of the feature points along the direction Z perpendicular to the top surface of the object under test 8 based on the edge contour image B1.
[0041] In this embodiment, the feature point is the center of the object to be measured. The edge contour image B1 includes a first edge contour image B11 and a second edge contour image B12. The step of obtaining the height to be measured of the feature point along the direction Z perpendicular to the top surface of the object to be measured 8 based on the edge contour image B1 includes: obtaining the height to be measured based on the position information of the first center of symmetry of the first edge contour image B11 and the second edge contour image B12.
[0042] In this embodiment, the step of obtaining the edge contour image B1 of the edge contour of the object under test 8 in the sidewall image B0 includes: obtaining the first edge contour image B11 of the first edge contour of the object under test 8 in the sidewall image B0; and obtaining the second edge contour image B12 of the second edge contour of the object under test 8 in the sidewall image B0.
[0043] In this embodiment, the first edge profile and the second edge profile of the object under test 8 are arranged along a direction Z perpendicular to the top surface of the object under test 8. The height of the first edge profile of the object under test 8 is higher than the height of the second edge profile of the object under test 8.
[0044] In this embodiment, the object under test is a wafer. When the central axis of the object under test 8 makes a certain angle with the Z direction, both the first edge profile image B11 and the second edge profile image B12 are cosine curves (e.g., Figure 3 (As shown).
[0045] In other embodiments of this application, the test object is a wafer. When the central axis of the test object 8 is parallel to the Z direction, both the first edge profile image B11 and the second edge profile image B12 are straight lines.
[0046] In this embodiment, the step of obtaining the height to be measured based on the position information of the first symmetry center of the first edge contour image B11 and the second edge contour image B12 includes: obtaining the valley value of the position information of the first edge contour image B11 closest to the reference point along the first direction and the peak value of the position information of the second edge contour image B12 along the first direction, wherein the reference point and the feature point have the same height along the direction perpendicular to the first direction, and the first direction is parallel to the arrangement direction of the first edge contour image B11 and the second edge contour image B12; and taking the average of the obtained valley value of the position information of the first edge contour image B11 along the first direction and the peak value of the position information of the second edge contour image B12 along the first direction as the height to be measured.
[0047] When the first edge detection module 4 has a certain aberration, the two edge regions of the edge contour image B1 along the perpendicular direction are prone to distortion. The average value of the valley value of the position information of the first edge contour image B11 closest to the reference point in the first direction and the peak value of the position information of the second edge contour image B12 in the first direction is used as the height to be measured, thereby improving the detection accuracy.
[0048] In this embodiment, the step of obtaining the height to be measured based on the position information of the first symmetry center of the first edge contour image B11 and the second edge contour image B12 includes: obtaining the peak value of the position information of the first edge contour image B11 closest to the reference point along the first direction and the valley value of the position information of the second edge contour image B12 along the first direction, wherein the reference point and the feature point have the same height along the direction perpendicular to the first direction, and the first direction is parallel to the arrangement direction of the first edge contour image and the second edge contour image; and taking the average of the obtained peak value of the position information of the first edge contour image B11 along the first direction and the valley value of the position information of the second edge contour image B12 along the first direction as the height to be measured. When the first edge detection module 4 has a certain aberration, the two edge areas of the edge contour image B1 along the direction perpendicular to the first direction are prone to distortion. Taking the average of the obtained peak value of the position information of the first edge contour image B11 along the first direction and the valley value of the position information of the second edge contour image B12 along the first direction as the height to be measured improves the detection accuracy.
[0049] In this embodiment, the step of obtaining the height to be measured based on the position information of the first symmetry center of the first edge contour image B11 and the second edge contour image B12 includes: obtaining the center contour images of the first edge contour image B11 and the second edge contour image B12; and obtaining the height to be measured based on the average of the peak and valley values of the position information of the center contour images along the first direction.
[0050] In this embodiment, the cross-sectional shape of the object under test along the central axis perpendicular to the object under test is circular. The detection method of the object under test further includes: obtaining the tilt angle α of the object under test 8 based on the thickness d of the object under test 8, the difference between the valley value Z0 of the position information of the first edge contour image along the first direction and the peak value Z1 of the position information of the second edge contour image along the first direction and the radius R of the object under test 8; Sinα=(Z1+d-Z0) / 2R.
[0051] In this embodiment, the detection method for the object under test further includes: obtaining the defocus state of the object under test based on the measured height of the object under test along the direction perpendicular to the top surface. Obtaining the defocus state of the object under test includes: when the difference between the measured height and the reference height is less than or equal to a preset threshold, the object under test is in focus along the height Z in the direction perpendicular to the top surface of the object under test; when the difference between the measured height and the reference height is greater than the preset threshold, the object under test is out of focus along the height Z in the direction perpendicular to the top surface of the object under test.
[0052] In this embodiment, if the object under test 8 is out of focus at a height Z perpendicular to its top surface, the position of the object under test 8 along the direction perpendicular to its top surface is adjusted to bring it back into focus. The position of the object under test 8 along the direction perpendicular to its top surface is adjusted according to the difference between the measured height and the reference height until the difference between the measured height and the reference height is less than or equal to a preset threshold.
[0053] In this embodiment, the first edge detection module 4 is used to obtain a complete image of the sidewall of the object under test 8 to obtain a sidewall image B0, which includes: using the first edge detection module to obtain multiple initial sidewall images of the sidewall of the object under test at different positions; stitching multiple initial sidewall images to obtain a complete image of the sidewall of the object under test to obtain the sidewall image.
[0054] In other embodiments of this application, the first edge detection module 4 is used to obtain a complete image of the sidewall of the object under test 8 to obtain a sidewall image B0, which includes: using the first edge detection module to obtain multiple initial sidewall images of the sidewall of the object under test at different positions; and fitting the sidewall of the object under test with the multiple initial sidewall images to obtain the sidewall image.
[0055] The sidewall of the test object is fitted using multiple initial sidewall images to obtain the sidewall image, including: acquiring position information at multiple locations on the sidewall of the test object from the initial sidewall images; fitting the correspondence between the sidewall positions and the position information using trigonometric functions to obtain a curve graph of each sidewall position and the position information, thereby obtaining the sidewall image.
[0056] In this embodiment, after adjusting the position of the object under test along the direction perpendicular to the top surface, the detection method of the object under test further includes: using the first edge detection module 4 to perform detection along the normal direction of the sidewall of the object under test 8; using the second edge detection module 5 to perform detection along the sidewall of the object under test 8 in a direction having an inclined angle with the top surface of the object under test 8; and using the third edge detection module 6 to perform detection along the sidewall of the object under test 8 in a direction having an inclined angle with the top surface of the object under test 8.
[0057] In this embodiment, the detection method for the object to be tested further includes: setting the top detection module 3 on one side of the top surface of the object to be tested 8; adjusting the position of the object to be tested along the direction perpendicular to the top surface, and then using the top detection module 3 to detect the top surface of the edge area of the object to be tested 8.
[0058] Another embodiment of the present invention provides a detection device for detecting an object to be tested, the object to be tested including a top surface and a side surface connected to the top surface, as shown in the reference. Figure 2 The system includes: a first edge detection module 4, which is used to acquire a complete image of the sidewall of the object under test 8 to obtain a sidewall image. The sidewall image includes the position information of several points of the sidewall of the object under test in a plane perpendicular to the normal of the sidewall of the object under test. The first edge detection module 4 is also used to acquire the height of the object under test 8 in a direction perpendicular to the top surface of the object under test based on the position information of the sidewall of the object under test in the sidewall image.
[0059] In the detection device of this embodiment, the height information of the object to be tested can be obtained directly using the first edge detection module 4, thereby simplifying the device and reducing the detection cost.
[0060] In this embodiment, the cross-sectional shape of the test object 8 along a direction perpendicular to its central axis is, for example, circular. The test object 8 can be a wafer. Correspondingly, the top surface of the test object 8 is circular. In other embodiments of this application, the test object can also be glass, an OLED screen, or a chip.
[0061] In this embodiment, the detection device further includes a motion stage 7, which is used to rotate the object to be tested 8 relative to the first edge detection module.
[0062] In this embodiment, the motion stage drives the object under test 8 to rotate, causing the object under test 8 to rotate relative to the first edge detection module 4. Specifically, the motion stage 7 drives the object under test 8 to rotate around its central axis. The object under test 8 can be placed on the support surface of the motion stage 7, and the motion stage 7 drives the object under test 8 to rotate around its central axis.
[0063] In other embodiments of this application, the motion stage 7 drives the first edge detection module 4 to rotate, causing the object under test 8 to rotate relative to the first edge detection module 4. Specifically, the motion stage 7 drives the first edge detection module 4 to rotate around the sidewall of the object under test 8.
[0064] In this embodiment, the support surface of the motion table 7 is used to support the object under test 8. The top surface of the object under test 8 faces away from the support surface of the motion table 7. The bottom surface of the object under test 8 faces the support surface of the motion table 7.
[0065] In this embodiment, the first edge detection module 4 is located on the side of the motion table 7.
[0066] The height to be measured is the height of the feature point of the object to be measured along the direction perpendicular to the top surface of the object to be measured; the feature point is the center of the object to be measured, the center of any surface of the object to be measured, or a corner point.
[0067] In this embodiment, the first edge detection module 4 is used to perform detection along the normal direction of the sidewall of the object to be tested 8.
[0068] The object to be tested includes a bottom surface opposite to the top surface. The normal direction of the sidewall is parallel to the top surface. The edge of the object to be tested includes: a side surface perpendicular to the normal direction; a first inclined surface connecting the first side surface and the top surface, with a non-zero angle between the first inclined surface and the side surface; and a second inclined surface connecting the first side surface and the bottom surface, with a non-zero angle between the second inclined surface and the side surface.
[0069] In this embodiment, the first edge detection module 4 includes a sidewall image acquisition unit 42, an image processing unit 43, and a height acquisition unit 41. The sidewall image acquisition unit 42 is used to acquire a complete image of the sidewall of the object under test 8 to obtain a sidewall image. The image processing unit 43 is used to acquire the edge contour image of the edge contour of the object under test in the sidewall image. The height acquisition unit 41 is used to acquire the height of the feature point along the direction perpendicular to the top surface of the object under test based on the edge contour image.
[0070] In this embodiment, the feature point is the center of the object to be measured. The image processing unit is used to acquire the edge contour image of the edge contour of the object to be measured in the sidewall image, including: image processing unit 43 is used to acquire a first edge contour image and a second edge contour image; height acquisition unit 41 is used to acquire the height to be measured based on the position information of the first center of symmetry of the first edge contour image and the second edge contour image.
[0071] In this embodiment, the detection device further includes a second edge detection module 5, used to detect the sidewall of the object under test 8 along a direction having an inclined angle with the top surface of the object under test.
[0072] In this embodiment, the detection device further includes a third edge detection module 6, used to detect the sidewall of the object under test 8 along a direction having an inclined angle with the top surface of the object under test.
[0073] The third edge detection module 6 and the second edge detection module 5 are located on either side of the first edge detection module 4 in a direction perpendicular to the top surface of the object to be measured.
[0074] Specifically, the first edge detection module is used to detect the side surface; the second edge detection module is used to detect the first inclined surface; and the third edge detection module is used to detect the second inclined surface.
[0075] In other embodiments of this application, the detection device may not include the second edge detection module and the third edge detection module.
[0076] The edge detection module is used to detect defects in the sidewalls of the object under test. The first edge detection module 4, the second edge detection module 5, and the third edge detection module 6 are used to acquire images of the edge regions of the object under test 8. The first edge detection module 4, the second edge detection module 5, and the third edge detection module 6 are used to detect whether the sidewalls of the object under test 8 have defects.
[0077] In this embodiment, the detection device further includes: a top detection module 3, used to detect the top surface of the edge region of the object to be tested 8; and a bottom detection module, used to detect the bottom surface of the edge region of the object to be tested 8. In other embodiments of this application, the detection device may not include the top detection module 3 and the bottom detection module.
[0078] In this embodiment, the first edge detection module 4 acquires a single-view sidewall image and detects the surface perpendicular to the normal direction in the sidewall of the object under test, which simplifies the equipment.
[0079] In this embodiment, the top detection module 3 is disposed on one side of the support surface of the motion table 7.
[0080] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.
Claims
1. A method for detecting a analyte, characterized in that, The object to be tested includes a top surface and a side surface connected to the top surface, including: A complete image of the sidewall of the object under test is obtained by using a first edge detection module. The sidewall image includes the position information of several points on the sidewall of the object under test in a plane perpendicular to the normal of the sidewall. Obtain the edge contour image of the object under test from the sidewall image; obtain the measured height of the object under test along the direction perpendicular to the top surface based on the edge contour image.
2. The detection method for the analyte according to claim 1, characterized in that, The height to be measured is the height of a feature point of the object to be measured along a direction perpendicular to the top surface; the feature point is the center of the object to be measured, the center of any surface of the object to be measured, or a corner point. The measured height of the feature point along the direction perpendicular to the top surface is obtained based on the first center of the edge contour image.
3. The detection method for the analyte according to claim 2, characterized in that, The feature point is the center of the object to be measured; the edge contour image includes a first edge contour image and a second edge contour image; the step of obtaining the height to be measured of the feature point along the direction perpendicular to the top surface based on the edge contour image includes: obtaining the height to be measured based on the first edge contour image and the second edge contour image.
4. The detection method for the analyte according to claim 3, characterized in that, The step of obtaining the edge contour image of the object under test from the sidewall image includes: obtaining the first edge contour image of the first edge contour of the object under test from the sidewall image; obtaining the second edge contour image of the second edge contour of the object under test from the sidewall image; both the first edge contour image and the second edge contour image are cosine curves; The step of obtaining the height to be measured based on the first edge contour image and the second edge contour image includes: obtaining the valley value of the position information of the first edge contour image closest to the reference point along the first direction and the peak value of the position information of the second edge contour image along the first direction, wherein the reference point and the feature point have the same height along a direction perpendicular to the first direction, and the first direction is parallel to the arrangement direction of the first edge contour image and the second edge contour image; and taking the average of the obtained valley value of the position information of the first edge contour image along the first direction and the peak value of the position information of the second edge contour image along the first direction as the height to be measured. Alternatively, the step of obtaining the height to be measured based on the first edge contour image and the second edge contour image includes: obtaining the peak value of the position information of the first edge contour image closest to the reference point along the first direction and the valley value of the position information of the second edge contour image along the first direction, wherein the reference point and the feature point have the same height along a direction perpendicular to the first direction, and the first direction is parallel to the arrangement direction of the first edge contour image and the second edge contour image; and taking the average of the obtained peak value of the position information of the first edge contour image along the first direction and the valley value of the position information of the second edge contour image along the first direction as the height to be measured. Alternatively, the step of obtaining the height to be measured based on the first edge contour image and the second edge contour image includes: obtaining the center contour image of the first edge contour image and the second edge contour image; and obtaining the height to be measured based on the average of the peak and valley values of the position information of the center contour image along the first direction.
5. The method for detecting the analyte according to claim 3 or 4, characterized in that, The cross-sectional shape of the object under test along the central axis perpendicular to the object under test is circular; The detection method for the object to be tested further includes: obtaining the tilt angle α of the object to be tested based on the thickness d of the object to be tested, the difference between the valley value Z0 of the position information of the first edge contour image along the first direction and the peak value Z1 of the position information of the second edge contour image along the first direction and the radius R of the object to be tested; Sinα=(Z1+d-Z0) / 2R.
6. The method for detecting the analyte according to claim 1, characterized in that, Also includes: The defocus state of the test object is obtained based on the test height along the direction perpendicular to the top surface; Obtaining the defocus state of the object under test includes: when the difference between the height to be tested and the reference height is less than or equal to a preset threshold, the object under test is in focus along the height perpendicular to the top surface. When the difference between the measured height and the reference height is greater than a preset threshold, the measured object defocuses along the height direction perpendicular to the top surface.
7. The detection method for the analyte according to claim 1, characterized in that, The sidewall image is obtained by acquiring a complete image of the object under test using the first edge detection module, including: The first edge detection module is used to obtain multiple initial sidewall images of the object under test at different positions. The sidewall image is obtained by stitching together multiple initial sidewall images to obtain a complete image of the sidewall of the object under test; or, the sidewall image is obtained by fitting multiple initial sidewall images to the sidewall of the object under test.
8. The method for detecting the analyte according to claim 6, characterized in that, Also includes: If the object under test is out of focus along a height perpendicular to the top surface, adjust the position of the object under test along the direction perpendicular to the top surface so that the object under test is in focus; After adjusting the position of the object to be tested along a direction perpendicular to the top surface, the detection method for the object to be tested further includes: The first edge detection module is used to detect along the normal direction of the sidewall of the object to be tested; The second edge detection module is used to detect the sidewall of the object under test along a direction with an inclined angle to the top surface; the third edge detection module is used to detect the sidewall of the object under test along a direction with an inclined angle to the top surface; the third edge detection module and the second edge detection module are located on both sides of the first edge detection module along a direction perpendicular to the top surface.
9. The method for detecting the analyte according to claim 6, characterized in that, Also includes: If the object under test is out of focus along a height perpendicular to the top surface, adjust the position of the object under test along the direction perpendicular to the top surface so that the object under test is in focus; The top detection module is positioned on one side of the top surface of the object to be tested; After adjusting the position of the object under test along the direction perpendicular to the top surface, the top detection module is used to detect the top surface of the edge area of the object under test.
10. A detection device for detecting an object to be tested, the object to be tested comprising a top surface and a side surface connected to the top surface, characterized in that, include: First edge detection module; The first edge detection module is used to obtain a complete image of the sidewall of the object under test to obtain a sidewall image. The sidewall image includes the position information of several points of the sidewall of the object under test in a plane perpendicular to the normal of the sidewall. The first edge detection module is also used to obtain the edge contour image of the object under test in the sidewall image, and obtain the height of the object under test along the direction perpendicular to the top surface based on the edge contour image.
11. The detection device according to claim 10, characterized in that, The height to be measured is the height of a feature point of the object to be measured along a direction perpendicular to the top surface; the feature point is the center of the object to be measured, the center of any surface of the object to be measured, or a corner point. The first edge detection module includes a sidewall image acquisition unit, an image processing unit, and a height acquisition unit. The sidewall image acquisition unit is used to acquire a complete image of the sidewall of the object to be tested to obtain a sidewall image. The image processing unit is used to acquire an edge contour image of the edge contour of the object to be tested in the sidewall image. The height acquisition unit is used to acquire the height of the feature point along the direction perpendicular to the top surface based on the first center of the edge contour image.
12. The detection device according to claim 11, characterized in that, The feature point is the center of the object to be tested; the image processing unit is used to acquire the edge contour image of the edge contour of the object to be tested in the sidewall image, including: the image processing unit is used to acquire the relative first edge contour image and second edge contour image. The height acquisition unit is used to acquire the height to be measured based on the first edge contour image and the second edge contour image.
13. The detection device according to claim 10, characterized in that, The first edge detection module is used to detect along the normal direction of the sidewall of the object to be tested; The detection device further includes: a second edge detection module for detecting the sidewall of the object under test along a direction having an inclined angle with the top surface; a third edge detection module for detecting the sidewall of the object under test along a direction having an inclined angle with the top surface; the third edge detection module and the second edge detection module are located on both sides of the first edge detection module along a direction perpendicular to the top surface; and a top detection module for detecting the top surface of the edge area of the object under test.
14. The detection device according to claim 10, characterized in that, Also includes: A motion stage is used to rotate the object under test relative to the first edge detection module.
Citation Information
Patent Citations
Transparent object side surface detecting system and method
CN106123783A