A wafer non-contact pick-and-place device

Abstract

The present invention provides a non-contact wafer picking and releasing device applied to the field of wafer handling technology, comprising a column head installed in a disc hole, a truncated cone-shaped through hole opened in the column head, and a truncated cone-shaped guide block installed in the through hole. The present invention installs the column head in the disc hole, and sets the through hole in the column head to a truncated cone-shaped structure, and sets the guide block, which is also a truncated cone-shaped structure, in the through hole. When a high-speed airflow is ejected from top to bottom in the through hole, the high-speed airflow is guided by the truncated cone-shaped structure of the inner end wall of the through hole and the outer end wall of the guide block, so that the high-speed airflow can be evenly dispersed in various directions on the top of the wafer when it is ejected, thereby making the negative pressure adsorption force on the wafer in various directions in a relatively balanced state, avoiding shaking of the wafer when it is suspended and held, and improving the stability of the device for non-contact wafer grabbing to a certain extent.

Description

Technical Field

[0001] The present application relates to the field of wafer handling technology, and in particular to a method for picking up and releasing wafers without contact. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. It is formed by grinding, polishing, and slicing a cylindrical silicon crystal rod. After slicing, it has a thin circular structure, so it is called a wafer. It is an important raw material for preparing semiconductor chips.

[0003] Normally, the thickness of a wafer is less than 1 mm, and due to the brittle and hard characteristics of silicon wafers, the wafer is easily damaged during transportation and placement, which in turn affects the wafer qualification rate. For this reason, in the prior art, a non-contact suction cup is manufactured based on the Bernoulli principle to achieve contactless transportation of wafers, which can greatly reduce the damage to the wafers during transportation and placement. However, in actual use of the Bernoulli suction cup, high-speed airflow is usually ejected directly downward from the hole at the bottom of the suction cup. When it acts on the top of the wafer, it is affected by the direction of the airflow ejection and the angle of the top of the wafer, which will cause the airflow in one direction to be too concentrated, while the airflow in other directions will be more dispersed, making the airflow around the suction cup not uniform on the top of the wafer, causing the wafer to shake easily when being contactlessly held, thereby affecting its stability during transportation.

[0004] Therefore, a wafer non-contact pick-up and release method is proposed to solve some problems existing in the above-mentioned prior art. Summary of the invention

[0005] The purpose of the present application is to ensure that the high-speed airflow sprayed on the top of the wafer can be evenly dispersed to the surroundings during the use of the Bernoulli suction cup, thereby improving the stability of the wafer during non-contact transportation. Compared with the prior art, a non-contact wafer picking and releasing method is provided, including a rod body, a suction cup assembly is installed at the end of the rod body, and the suction cup assembly includes an L-shaped frame arranged in an L-shaped structure, the bottom of the L-shaped frame is fixedly connected to a connecting block by bolts, the bottom of the connecting block is fixedly connected to a suction cup head by bolts, an air pipe joint is fixedly installed on the side end wall of the connecting block, a disk hole is provided at the bottom of the suction cup head, and a column head is installed in the disk hole, a through hole with a truncated cone structure is provided in the column head, and the through hole is connected to the air pipe joint, and a guide block with the same truncated cone structure is provided in the through hole, and the outer size of the guide block is smaller than the inner size of the through hole.

[0006] Furthermore, a first air flow channel connected to the air pipe joint is vertically opened at the bottom of the connecting block, a second air flow channel corresponding to the bottom of the first air flow channel is vertically opened at the top of the suction cup head, a third air flow channel connected to the interior of the second air flow channel is opened on one side end wall of the suction cup head, and a fourth air flow channel vertically connected to the third air flow channel is opened on the other side end wall of the suction cup head, and one end of the fourth air flow channel located in the suction cup head is connected to the interior of the through hole.

[0007] Furthermore, a fifth air flow channel connected between the fourth air flow channel and the inner end wall of the through hole is opened on the column head, and the fifth air flow channel is configured as a spiral structure.

[0008] Furthermore, an internal thread is mounted on the inner end wall of the disc hole, and an external thread matching the internal thread is mounted on the outer end wall of the column head, and the column head thread is screwed into the disc hole.

[0009] Furthermore, the fourth air flow channel is directly connected to the inner end wall of the disc hole, and an annular groove connected to the fifth air flow channel is formed around the outer end wall of the column head, and the annular groove and the fourth air flow channel are located on the same plane.

[0010] Furthermore, the top of the column cap is covered with a top cover that blocks the through hole, and the top cover is fixedly connected to the column cap by bolts, and the guide block is also fixedly connected to the top cover by bolts, and the fifth air flow channel and the annular groove are both provided on the end wall where the column cap and the top cover fit together.

[0011] Furthermore, a first sponge pad is fixedly installed at the four corners of the bottom of the suction cup head and is arranged around the outside of the cup hole. A second sponge pad is also fixed to the bottom of the guide block. The bottoms of the first sponge pad and the second sponge pad are flush.

[0012] Furthermore, the rod body includes a grip rod, and a universal adjustment rod is connected to one end of the grip rod close to the suction cup assembly. The universal adjustment rod includes a sleeve arranged on the outside, two shaping cylinders arranged on the inside of the sleeve, and a first spring supported in the two shaping cylinders. The sleeve includes a plurality of outer ring sleeves and inner ring sleeves that are alternately sleeved in sequence, and the outer ring sleeves and the inner ring sleeves are movably sleeved. Connectors that are fastened to the grip rod and the L-shaped frame are installed at the two side ends of the sleeve. The shaping cylinder includes a plurality of metal wires arranged in a surrounding manner, and a first circular ring and a second circular ring are respectively fixed at both ends of the plurality of metal wires. A through hole matching the outer diameter of the metal wire is opened in the second circular ring, and the metal wire in the shaping cylinder is movably inserted into the through hole in the other shaping cylinder.

[0013] Furthermore, a sixth air flow channel is opened through the grip rod, and one end of the sixth air flow channel away from the universal adjustment rod is externally connected to an air pump, and the other end of the sixth air flow channel is connected to a hose movably inserted in the first spring, and the other end of the hose is inserted in the air pipe joint.

[0014] Furthermore, a valve body is embedded in the grip rod, and a pressing plate is rotatably installed on the top of the valve body, a straight channel connected to the inside of the sixth airflow channel is opened in the valve body, a chamber vertically opened in the valve body and vertically connected to the straight channel, and the bottom of the chamber is connected to the outside of the grip rod, a valve column is slidably installed in the chamber, and a pressure rod extending through and extending to the bottom of the pressing plate is fixedly installed on the top of the valve column, a connecting hole connected to the middle position of the straight channel is opened in the valve column, a cavity is arranged inside the valve column, and the bottom of the cavity is arranged as a through-shaped structure, an air hole connected to the cavity is opened on the outer end wall of the valve column, and the air hole is arranged in parallel above the connecting hole and faces the air inlet end of the sixth airflow channel, and a second spring elastically supported at the bottom of the valve column is fixedly installed at the bottom of the chamber.

[0015] Compared with the prior art, the advantages of this application are:

[0016] (1) The present application installs a column head in a disk hole, and sets the through hole in the column head to a truncated cone structure, and sets a guide block which is also a truncated cone structure in the through hole. When a high-speed airflow is ejected from the through hole from top to bottom, the high-speed airflow is guided by the truncated cone structure of the inner end wall of the through hole and the outer end wall of the guide block, so that the high-speed airflow can be evenly dispersed in all directions on the top of the wafer when ejected, thereby making the negative pressure adsorption force on the wafer in all directions in a relatively balanced state, avoiding the shaking of the wafer when it is suspended and held, and to a certain extent improving the stability of the device when grasping the wafer without contact.

[0017] (2) By opening a fifth airflow channel with a spiral structure in the column head and connecting it between the fourth airflow channel and the through hole, the high-speed airflow can cut into the through hole in a spiral direction under the guidance of the fifth airflow channel before entering the through hole, and then, under the restriction of the truncated cone-shaped inner end wall of the through hole and the inclined guidance of the truncated cone-shaped outer end wall of the guide block, it is ejected from top to bottom in a spiral trajectory in the through hole, which can further enhance the dispersion uniformity of the airflow when ejecting from the through hole, and further ensure the stability of the wafer being suspended and held by the device.

[0018] (3) By assembling the internal and external threads that match each other on the inner end wall of the disk hole and the outer end wall of the column head respectively, the column head can be conveniently disassembled and assembled by means of a spiral connection, which is conducive to the flexible selection of whether to install the column head in the disk hole according to actual use requirements. At the same time, by providing an annular groove that is located in the same plane as the fourth air flow channel on the outer end wall of the column head and connecting it with the fifth air flow channel, after the column head is installed, there is no need to specially adjust the docking condition of the fifth air flow channel with the fourth air flow channel, and the fifth air flow channel can be kept in a connected state with the fourth air flow channel, which improves the flexibility and convenience of the device when used to a certain extent.

[0019] (4) By connecting the universal adjustment rod between the grip rod and the suction cup assembly, the position relationship and the deflection angle of the suction cup assembly relative to the grip rod can be flexibly adjusted. At the same time, by movably connecting the two shaping cylinders to each other, the length of the universal adjustment rod can be flexibly adjusted by stretching or pushing. The cooperation between the two can further improve the flexibility of the device in actual use.

[0020] (5) By pressing the pressing plate, the high-speed airflow continuously supplied to the device is directly guided out to the outside, thereby realizing the shutdown control of the device. Compared with the prior art of directly pressing and blocking the airflow channel to realize the interruption control of the high-speed airflow, when the pressure is continuously pressed, there is no need to overcome the impact force carried by the high-speed airflow, which can effectively improve the convenience of the staff in controlling the start and stop of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a three-dimensional image from the top perspective of this application;

[0022] Figure 2 This is a stereoscopic view from the bottom perspective of this application;

[0023] Figure 3 A disassembled diagram of the suction cup assembly for this application;

[0024] Figure 4 A top view cross-sectional view of the suction cup head of the present application;

[0025] Figure 5 A three-dimensional diagram of the column capital and its surrounding structure of this application;

[0026] Figure 6 This is a disassembled diagram of the column capital and its surrounding structures for this application;

[0027] Figure 7 A three-dimensional image of the wafer being grabbed for this application;

[0028] Figure 8 For this application Figure 7 Front view of the structure in section;

[0029] Fig. 9 For this application Figure 8 Schematic diagram of the structure at A in the middle;

[0030] Fig.10 For this application Figure 8 Schematic diagram of the structure at B in the middle;

[0031] Fig.11 For this application Figure 8 Schematic diagram of the structure at C in the middle;

[0032] Fig.12 This is a disassembled diagram of the universal adjustment rod of this application;

[0033] Fig.13 This is a disassembled diagram of two shaping cylinders for this application;

[0034] Fig.14 This is a three-dimensional diagram of the valve column and its surrounding structure of this application.

[0035] Description of the numbers in the figure:

[0036] 1. Rod body; 101. Grip; 102. Outer ring sleeve; 103. Inner ring sleeve; 104. Connector; 105. Metal wire; 106. First ring; 107. Second ring; 108. First spring;

[0037] 2. Suction cup assembly; 201. L-shaped frame; 202. Connecting block; 203. Suction cup head; 204. Air pipe joint; 205. Suction cup hole; 206. First air flow channel; 207. Second air flow channel; 208. Third air flow channel; 209. Fourth air flow channel;

[0038] 3. column head; 301. guide block; 302. top cover; 303. fifth air flow channel; 304. annular groove;

[0039] 4. a first sponge pad; 401. a second sponge pad;

[0040] 5. Sixth air flow channel; 501. Hose;

[0041] 6. Valve body; 601. Pressing plate; 602. Straight channel; 603. Chamber; 604. Valve column; 605. Pressure rod; 606. Connecting hole; 607. Cavity; 608. Air hole; 609. Second spring. DETAILED DESCRIPTION

[0042] The embodiments will be combined with the drawings in the specification to clearly and completely describe the technical solution of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making any creative work shall fall within the scope of protection of the present application.

[0043] Embodiment 1:

[0044] The present invention provides a method for picking up and releasing wafers without contact. Figure 1 - Fig.14, comprising a shaft 1, a suction cup assembly 2 is installed at the end of the shaft 1, and the suction cup assembly 2 comprises an L-shaped frame 201 set as an L-shaped structure, the bottom of the L-shaped frame 201 is fixedly connected with a connecting block 202 by bolts, the bottom of the connecting block 202 is fixedly connected with a suction cup head 203 by bolts, a trachea joint 204 is fixedly installed on the side end wall of the connecting block 202, a disc hole 205 is opened at the bottom of the suction cup head 203, and a column head 3 is installed in the disc hole 205, a through hole with a truncated cone structure is opened in the column head 3, and the through hole is connected with the trachea joint 204, and a guide block 301 with the same truncated cone structure is arranged in the through hole, and the outer dimension of the guide block 301 is smaller than the inner dimension of the through hole.

[0045] During the use of the device, the staff connects the device to the air pump, and the air pump continuously supplies high-speed airflow to the air pipe joint 204. Then, the staff holds the rod body 1 to control the movement of the device, and moves the suction cup assembly 2 to the wafer to be grasped, so that the plate hole 205 is on the top of the wafer and does not directly contact the top of the wafer. In this state, the high-speed airflow provided by the air pump enters the air pipe joint 204, and then enters the through hole opened in the column head 3. Since the shape of the through hole is set to a truncated cone structure, and the guide block 301 of the same truncated cone structure is set in the through hole, the high-speed airflow enters from the through hole from top to bottom. During the downward flow, affected by the small upper and large lower inner diameter of the through hole and the dispersion effect of the inclined surface of the outer end wall of the guide block 301, the high-speed airflow blowing directly from top to bottom can be evenly dispersed to the surroundings, and the high-speed airflow is evenly scattered on the top of the wafer. In this state, the airflow velocity at the top of the wafer is much greater than the airflow velocity at the bottom. According to the Bernoulli principle, the greater the flow velocity, the smaller the pressure, the pressure at the bottom of the wafer is greater than the pressure at the top, thereby forming a negative pressure between the bottom of the disk hole 205 and the top of the wafer, so that the wafer and the bottom of the disk hole 205 form an air surface suspension, and finally complete the non-contact suction of the wafer.

[0046] Since the high-speed airflow ejected downward from the through hole can be evenly dispersed in all directions on the top of the wafer, the negative pressure adsorption force formed in all directions is in a relatively balanced state, thereby ensuring the stability of the wafer being suspended and sucked at the bottom of the disc hole 205. Under the action of the Bernoulli principle, the wafer is firmly sucked at the bottom of the suction cup assembly 2. Subsequently, the staff can hold the rod body 1 to move the device to achieve the transportation of the wafer. When the wafer is transported to the predetermined position, the staff cuts off the air supply of the air pump to the air pipe joint 204, so that the high-speed airflow is no longer ejected downward from the through hole. Then, the suspended suction of the wafer by the device automatically fails, and the wafer is automatically separated from the device, and finally the non-contact transportation of the wafer is completed. During the use of the device, the device does not come into contact with the wafer, which can greatly reduce the probability of the wafer being worn during transportation, which is beneficial to ensure the qualified rate of the wafer after transportation.

[0047] See also Figure 3 and Figure 4 A first air channel 206 connected to the air pipe connector 204 is vertically opened at the bottom of the connecting block 202, and a second air channel 207 corresponding to the lower part of the first air channel 206 is vertically opened at the top of the suction cup head 203. A third air channel 208 connected to the inside of the second air channel 207 is opened on one side end wall of the suction cup head 203, and a fourth air channel 209 vertically connected to the third air channel 208 is opened on the other side end wall of the suction cup head 203, and one end of the fourth air channel 209 located in the suction cup head 203 is connected to the inside of the through hole. During the use of the device, the high-speed airflow provided by the air pump enters the first air channel 206 through the air pipe connector 204, and then enters the second air channel 207 directly connected to the lower part of the first air channel 206, and is input into the disc hole 205 through the connection between the third air channel 208 and the fourth air channel 209, and is finally sprayed from top to bottom from the through hole in the column head 3.

[0048] In the device, a first air channel 206 communicating with the air pipe joint 204 is vertically formed in the connecting block 202 by drilling through the bottom of the connecting block 202, a second air channel 207 aligned with and communicating with the first air channel 206 is vertically formed in the sucker head 203 by drilling through the top of the sucker head 203, a third air channel 208 communicating with the second air channel 207 is horizontally formed in the sucker head 203 by drilling through the side end wall of the sucker head 203, and a fourth air channel 209 communicating between the third air channel 208 and the through hole is formed in the sucker head 203 by drilling. The side end wall of the suction cup head 203 is also horizontally formed in the suction cup head 203 by drilling. In the present application, the modular connection between the L-shaped frame 201, the connecting block 202 and the suction cup head 203 is achieved by screwing with bolts, and the first air flow channel 206, the second air flow channel 207, the third air flow channel 208 and the fourth air flow channel 209 that are interconnected are opened by drilling holes in a straight line from the outside to the inside, so that the air flow channels connected between the through holes are opened conveniently, which is beneficial to reduce the processing difficulty during the preparation of the device and facilitates the widespread promotion and use of the device.

[0049] See also Figure 3 - Figure 6 and Fig. 9 A fifth air flow channel 303 connected between the fourth air flow channel 209 and the inner end wall of the through hole is provided on the column head 3, and the fifth air flow channel 303 is set to a spiral structure, an internal thread is provided on the inner end wall of the disc hole 205, and an external thread matching the internal thread is provided on the outer end wall of the column head 3. The column head 3 is threadedly screwed into the disc hole 205, and the fourth air flow channel 209 is directly connected to the inner end wall of the disc hole 205. An annular groove 304 connected to the fifth air flow channel 303 is provided on the outer end wall of the column head 3, and the annular groove 304 and the fourth air flow channel 209 are located on the same plane, the top of the column head 3 is covered with a top cover 302 that blocks the through hole, and the top cover 302 is fixedly connected to the column head 3 by bolts, and the guide block 301 is also fixedly connected to the top cover 302 by bolts, and the fifth air flow channel 303 and the annular groove 304 are both provided on the end wall where the column head 3 and the top cover 302 fit.

[0050] During use of the device, the air flow that enters the fourth air flow channel 209 through the air pipe joint 204, the first air flow channel 206, the second air flow channel 207 and the third air flow channel 208 enters the fifth air flow channel 303 through the connection of the annular groove 304, and finally enters the through hole opened inside the column head 3. When the air flow enters the through hole through the fifth air flow channel 303, since the outer shape of the fifth air flow channel 303 is set to a spiral structure, the high-speed air flow that enters the through hole through the fifth air flow channel 303 can also cut into the through hole in a spiral direction under the guidance of the spiral structure of the fifth air flow channel 303. Then, under the restriction of the truncated cone-shaped inner end wall of the through hole and the inclined guidance of the truncated cone-shaped outer end wall of the guide block 301, the high-speed air flow blown into the through hole from the fifth air flow channel 303 finally presents a spiral trajectory and is sprayed from top to bottom, which can further enhance the dispersion uniformity of the air flow when it is sprayed from the through hole, and further ensure the stability of the wafer being suspended and held by the device.

[0051] In the device, by assembling mutually compatible internal and external threads on the inner end wall of the disk hole 205 and the outer end wall of the column head 3 respectively, the column head 3 can be fixed in the disk hole 205 by rotation under the engagement of the threads, so that the column head 3 can be flexibly disassembled and assembled from the disk hole 205, and whether to install the column head 3 in the disk hole 205 can be flexibly selected according to actual needs during use. The annular groove 304 connected to the fifth air flow channel 303 is surrounded and opened on the outer end wall of the column head 3, and it is arranged that after the column head 3 is installed in the disk hole 205, the annular groove 304 and the fourth air flow channel 209 are in the same plane. This makes it possible to keep the fifth air flow channel 303 and the fourth air flow channel 209 connected in a connected state after the column head 3 is installed, so that the installation and use of the device for the column head 3 are convenient.

[0052] By covering the top cover 302 on the top of the column head 3, and bolting the column head 3, the guide block 301 and the top cover 302 to form a whole, the column head 3 and the guide block 301 are installed in the disk hole 205 together for use, or removed from the disk hole 205 together. In this device, the top cover 302 is fixedly connected to the top of the column head 3 by bolting, so that the fifth air flow channel 303 and the annular groove 304 can be opened on the end wall of the column head 3 and the guide block 301 that are in contact with each other, so that the fifth air flow channel 303 set as a spiral structure can be easily processed and formed, thereby reducing its processing difficulty, thereby reducing the manufacturing cost of the device, which is of great significance for the wide promotion and use of the device.

[0053] See also Figure 2 - Figure 3 and Fig. 9, the first sponge pad 4 arranged around the outside of the disc hole 205 is fixedly installed at the four corners of the bottom of the suction cup head 203, and the second sponge pad 401 is also fixed at the bottom of the guide block 301. The bottoms of the first sponge pad 4 and the second sponge pad 401 are flush with each other. During the use of the device, the thickness of the first sponge pad 4 and the second sponge pad 401 is less than the height of the suspended air surface formed by the high-speed airflow ejected from the through hole, so that when the device is suspended to adsorb the wafer, the bottom of the first sponge pad 4 and the second sponge pad 401 does not contact the top of the wafer. The reason for setting the first sponge pad 4 and the second sponge pad 401 is essentially a fool-proof measure. The first sponge pad 4 and the second sponge pad 401 are both made of dense and soft sponge material, which can prevent the harder part of the bottom of the suction cup assembly 2 from contacting the top of the wafer due to the staff holding the device downward with too much force when the suction cup assembly 2 is placed on the wafer, thereby ensuring the stability and safety of the device during actual use.

[0054] See also Fig.10 , Fig.12 and Fig.13 The rod body 1 includes a grip rod 101, and one end of the grip rod 101 close to the suction cup assembly 2 is connected to a universal adjustment rod, the universal adjustment rod includes a sleeve arranged on the outside, two shaping cylinders arranged on the inside of the sleeve, and a first spring 108 supported in the two shaping cylinders, the sleeve includes a plurality of outer ring sleeves 102 and inner ring sleeves 103 which are alternately sleeved in sequence, the outer ring sleeves 102 and the inner ring sleeves 103 are movably sleeved, and connectors 104 which are fastened to the grip rod 101 and the L-shaped frame 201 are installed at the ends of both sides of the sleeve, the shaping cylinder includes a plurality of metal wires 105 which are arranged around, a first circular ring 106 and a second circular ring 107 are respectively fixed at both ends of the plurality of metal wires 105, a through hole which is adapted to the outer diameter of the metal wire 105 is opened around the second circular ring 107, and the metal wire 105 in the shaping cylinder is movably inserted into the through hole in another shaping cylinder.

[0055] When the device is in use, the staff holds the gripping rod 101 to use the device. During use, the position relationship of the suction cup assembly 2 relative to the gripping rod 101 can be adjusted by bending and adjusting the universal adjustment rod, so that the suction cup assembly 2 is oriented to different directions and angles relative to the gripping rod 101, thereby improving the flexibility of the device during use. When bending the universal adjustment rod, the bending force is applied to the shaping cylinder, and the corresponding position on the metal wire 105 in the shaping cylinder is squeezed and bent, and the metal wire 105 undergoes plastic deformation, and the bending direction of the universal adjustment rod is shaped on the inside, so as to realize the multi-angle flexible bending adjustment of the universal adjustment rod. The outer plurality of outer ring sleeves 102 and the inner ring sleeves 103 are movably connected to each other on the outside, so as to protect and limit the shaping cylinder from the outside, and ensure the stability of the outside when the shaping cylinder is bent and plastically deformed. The first spring 108 provided with a spiral structure can support the shaping cylinder from the inside, and ensure the stability of the inside when the shaping cylinder is bent and plastically deformed.

[0056] When using the device, the staff can adjust the elongation of the universal adjusting rod by stretching it. The staff holds the connecting heads 104 at both ends of the universal adjusting rod with both hands, and stretches the two ends outward, so that the two internal shaping cylinders move away from each other, and the overall length of the universal adjusting rod is stretched and extended. After the two ends push each other, this will make the two internal shaping cylinders move closer to each other, and the overall length of the universal adjusting rod is shortened, which can further improve the flexibility and convenience of the device during use. The multiple outer ring sleeves 102 and inner ring sleeves 103 located on the outside and connected to each other can slide with each other, so they will not interfere with the stretching and contraction of the two shaping cylinders from the outside. The first spring 108 located on the inside can also stretch and compress itself, so it will not interfere with the stretching and contraction of the two shaping cylinders from the inside, so that the universal adjusting rod is flexible and stable during actual use.

[0057] See also Figure 8 , Fig.11 and Fig.14A sixth air flow channel 5 is provided through the grip 101, and one end of the sixth air flow channel 5 away from the universal adjustment rod is externally connected to an air pump, and the other end of the sixth air flow channel 5 is connected to a hose 501 movably inserted in the first spring 108, and the other end of the hose 501 is plugged into the air pipe joint 204, a valve body 6 is embedded in the grip 101, and a pressing plate 601 is rotatably installed on the top of the valve body 6, a straight channel 602 connected to the inside of the sixth air flow channel 5 is provided in the valve body 6, a chamber 603 vertically connected to the straight channel 602 is vertically provided in the valve body 6, and the bottom of the chamber 603 is connected to the outside of the grip 101, and the inside of the chamber 603 A valve column 604 is slidably installed, and a pressure rod 605 extending through to the bottom of the pressing plate 601 is fixedly installed on the top of the valve column 604, a connecting hole 606 connected to the middle position of the straight channel 602 is opened in the valve column 604, a cavity 607 is arranged inside the valve column 604, and the bottom of the cavity 607 is arranged as a through structure, an air hole 608 connected to the cavity 607 is opened on the outer end wall of the valve column 604, and the air hole 608 is arranged in parallel above the connecting hole 606 and faces the air inlet end of the sixth air flow channel 5, and a second spring 609 elastically supported at the bottom of the valve column 604 is fixedly installed at the bottom of the chamber 603.

[0058] When the device is in use, the high-speed airflow supplied by the air pump is connected through the end of the grip 101, the high-speed airflow enters the sixth airflow channel 5, and passes through the straight channel 602 connected in the sixth airflow channel 5 and is led out from the other end. With the help of the connection of the hose 501, the high-speed airflow is continuously supplied to the air pipe connector 204. During this process, under the elastic support of the second spring 609, the valve column 604 is located in the upper position inside the chamber 603, so that the connecting hole 606 is aligned and connected in the straight channel 602 to maintain the stability of the airflow. When it is necessary to interrupt the high-speed airflow continuously supplied to the air pipe connector 204, the staff presses the end of the pressing plate 601 downward, so that the pressing plate 601 rotates and swings downward to squeeze the downward Force is applied to the pressure rod 605, and the pressure rod 605 moves downward, pushing the valve column 604 to overcome the elastic support of the second spring 609 and slide downward in the chamber 603, so that the connecting hole 606 moves downward and exits the connection with the straight channel 602. After the valve column 604 moves downward, the air hole 608 located above the connecting hole 606 will be aligned with the straight channel 602. At this time, the high-speed airflow continuously supplied into the straight channel 602 will enter the cavity 607 through the air hole 608, and be discharged outward through the through-shaped structure at the bottom of the cavity 607. In this state, the high-speed airflow cannot continue to be transported to the air pipe joint 204 through the straight channel 602. There is no airflow supplied into the air pipe joint 204, and the suction cup assembly 2 no longer holds the wafer below in suspension.

[0059] In the device, during the pressing of the pressing plate 601, the high-speed airflow continuously supplied into the device is directly guided outward to realize the shut-down control of the device. If it is necessary to reconnect the supply of high-speed airflow to the suction cup assembly 2, the staff only needs to release the pressing of the pressing plate 601. Under the elastic support of the second spring 609, the valve column 604 moves up and resets in the chamber 603, so that the connecting hole 606 is reconnected to the straight channel 602, thereby realizing the opening of the device. Compared with directly pressing and blocking the airflow channel to realize the control, this operation mode The interruption control of the high-speed airflow does not need to overcome the impact force carried by the high-speed airflow when continuously pressed, which can effectively improve the convenience of the staff in controlling the start and stop of the device. A slide groove parallel to the moving direction of the connecting hole 606 is opened on the inner end wall of the chamber 603, and a slider slidably installed in the slide groove is fixed on the outer end wall of the valve column 604. Through the cooperation of the slide groove and the slider, the stability of the valve column 604 moving up and down in the chamber 603 can be guaranteed, thereby avoiding the connection deviation of the connecting hole 606, the air hole 608 and the straight channel 602.

[0060] The above are only the best implementation methods adopted by this application in combination with current actual needs, but the protection scope of this application is not limited to this.

Claims

1. A wafer non-contact pick-up and release device, comprising a rod body (1), characterized in that: A suction cup assembly (2) is installed at the end of the rod body (1), and the suction cup assembly (2) comprises an L-shaped frame (201) arranged in an L-shaped structure, the bottom of the L-shaped frame (201) is fixedly connected to a connecting block (202) by bolts, the bottom of the connecting block (202) is fixedly connected to a suction cup head (203) by bolts, a trachea joint (204) is fixedly installed on the side end wall of the connecting block (202), a disc hole (205) is provided at the bottom of the suction cup head (203), and a column head (3) is installed in the disc hole (205), a through hole with a truncated cone structure is provided in the column head (3), and the through hole is connected to the trachea joint (204), and a guide block (301) with the same truncated cone structure is arranged in the through hole, and the outer dimension of the guide block (301) is smaller than the inner dimension of the through hole; A first air flow channel (206) connected to the air pipe joint (204) is vertically opened at the bottom of the connecting block (202); a second air flow channel (207) correspondingly arranged below the first air flow channel (206) is vertically opened at the top of the suction cup head (203); a third air flow channel (208) connected to the inside of the second air flow channel (207) is opened on one end wall of the suction cup head (203); a fourth air flow channel (209) vertically connected to the third air flow channel (208) is opened on the other end wall of the suction cup head (203); and one end of the fourth air flow channel (209) located in the suction cup head (203) is connected to the inside of the through hole; The column head (3) is provided with a fifth air flow channel (303) connected between the fourth air flow channel (209) and the inner end wall of the through hole, and the fifth air flow channel (303) is arranged in a spiral structure; The inner end wall of the disc hole (205) is equipped with an internal thread, the outer end wall of the column head (3) is equipped with an external thread matching the internal thread, and the column head (3) is threadedly screwed into the disc hole (205); The fourth air flow channel (209) is directly connected to the inner end wall of the disc hole (205), and an annular groove (304) connected to the fifth air flow channel (303) is formed on the outer end wall of the column head (3), and the annular groove (304) and the fourth air flow channel (209) are located on the same plane; The top of the column head (3) is covered with a top cover (302) that blocks the through hole, and the top cover (302) is fixedly connected to the column head (3) by bolts. The guide block (301) is also fixedly connected to the top cover (302) by bolts. The fifth air flow channel (303) and the annular groove (304) are both provided on the end wall where the column head (3) and the top cover (302) are in contact.

2. The wafer non-contact pick-up and release method according to claim 1, characterized in that: A first sponge pad (4) arranged around the outside of the cup hole (205) is fixedly mounted at the four corners of the bottom of the suction cup head (203), and a second sponge pad (401) is also fixedly mounted at the bottom of the guide block (301). The bottoms of the first sponge pad (4) and the second sponge pad (401) are flush with each other.

3. The wafer non-contact pick-up and release method according to claim 1, characterized in that: The shaft (1) comprises a gripping rod (101), and one end of the gripping rod (101) close to the suction cup assembly (2) is connected to a universal adjustment rod, the universal adjustment rod comprises a sleeve arranged on the outside, two shaping cylinders arranged on the inside of the sleeve, and a first spring (108) supported in the two shaping cylinders, the sleeve comprises a plurality of outer ring sleeves (102) and inner ring sleeves (103) which are alternately sleeved in sequence, the outer ring sleeves (102) and the inner ring sleeves (103) are movably sleeved, and both side ends of the sleeve are A connector (104) is installed at the head and is tightly connected to the grip rod (101) and the L-shaped frame (201). The shaping cylinder includes a plurality of metal wires (105) arranged in a surrounding manner. A first circular ring (106) and a second circular ring (107) are respectively fixed at both ends of the plurality of metal wires (105). A through hole matching the outer diameter of the metal wire (105) is formed in the second circular ring (107). The metal wire (105) in the shaping cylinder is movably inserted into the through hole in another shaping cylinder.

4. The wafer non-contact pick-up and release method according to claim 3, characterized in that: A sixth air flow channel (5) is provided through the handle (101), and one end of the sixth air flow channel (5) away from the universal adjustment rod is externally connected to an air pump, and the other end of the sixth air flow channel (5) is connected to a hose (501) movably inserted in the first spring (108), and the other end of the hose (501) is inserted into the air pipe joint (204).

5. The wafer non-contact pick-up and release method according to claim 4, characterized in that: A valve body (6) is embedded in the gripping rod (101), and a pressing plate (601) is rotatably mounted on the top of the valve body (6); a straight channel (602) connected to the inside of the sixth flow channel (5) is provided in the valve body (6); a chamber (603) vertically connected to the straight channel (602) is vertically provided in the valve body (6), and the bottom of the chamber (603) is connected to the outside of the gripping rod (101); a valve column (604) is slidably mounted in the chamber (603), and a pressing rod (605) extending through and extending to the bottom of the pressing plate (601) is fixedly mounted on the top of the valve column (604); The valve column (604) is provided with a connecting hole (606) connected to the middle position of the straight channel (602), the valve column (604) is provided with a cavity (607) inside, and the bottom of the cavity (607) is provided with a through-shaped structure, the outer end wall of the valve column (604) is provided with an air hole (608) connected to the cavity (607), and the air hole (608) is arranged parallel to the top of the connecting hole (606) and faces the air inlet end of the sixth air flow channel (5), and the bottom of the chamber (603) is fixedly installed with a second spring (609) elastically supported at the bottom of the valve column (604).

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