A semiconductor package electronic component test thimble

Abstract

The present invention discloses a test ejector pin for semiconductor packaged electronic components, which relates to the field of semiconductor electronic component packaging electronics. It includes an ejector pin base body, and a needle head is received at the end of the ejector pin base body. It is characterized in that a first buffer cavity is provided on the side of the ejector pin base body facing the needle head, a buffer assembly is provided in the first buffer cavity, the buffer assembly includes a first plate body and a second plate body arranged oppositely, a counterweight ring is arranged between the first plate body and the second plate body, the first plate body, the counterweight ring and the second plate body are sequentially connected by no less than three first springs, the second plate body is connected to the inner wall of the first buffer cavity, and the first plate body is connected to the needle head. The purpose of the present invention is to provide a test ejector pin for semiconductor packaged electronic components with high positioning accuracy, adjustable stroke and long-term operation.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor electronic component packaging electronics, and particularly relates to a test thimble for semiconductor packaged electronic components. Background Art

[0002] After the semiconductor packaged electronic components are packaged and before leaving the factory, they all need to go through a testing process, that is, using a test thimble to hold the electronic component, making the electronic component contact and conduct with the test piece, and testing various electrical performances of the electronic component.

[0003] The prior art is an invention patent named a processor for testing electronic components, and the publication number of this invention patent is KR1020200015022A. This invention relates to a processing device for testing electronic components. According to this invention, the processing device for testing electronic components includes a test bracket for supporting certain functions performed on one side of the electronic component. In addition, it also includes a movable device for pressing the electronic component and connecting the electrical terminals on the other side of the electronic component to the electrical terminals of the test socket, and a movable device for moving at least a part of the test bracket. According to this invention, certain functions of the electronic component can be properly tested, and the reliability of the electrical connection between the electronic component and the tester can be improved. The test efficiency and detection accuracy of this invention are slightly low. Summary of the Invention

[0004] The purpose of the present invention is to provide a test thimble for semiconductor packaged electronic components with high positioning accuracy, adjustable stroke and long-term operation.

[0005] The technical solution adopted by the present invention to achieve the above purpose is as follows:

[0006] A test thimble for semiconductor packaged electronic components includes a thimble base body. A needle head is received at the end of the thimble base body. A first buffer cavity is provided on the side of the thimble base body facing the needle head. A buffer assembly is provided in the first buffer cavity. The buffer assembly includes a first plate body and a second plate body arranged oppositely. A counterweight ring is provided between the first plate body and the second plate body. The first plate body, the counterweight ring and the second plate body are sequentially connected by no less than three first springs. The second plate body is connected to the inner wall of the first buffer cavity, and the first plate body is connected to the needle head.

[0007] Through the overall design of a semiconductor package electronic component test thimble, the first buffer cavity in the thimble base can buffer the needle tip. That is, when the thimble base reciprocates, the needle tip needs to contact the spiral contact circuit. The buffer component prevents the needle tip from being damaged or the test being inaccurate due to excessive impact during the contact with the spiral contact circuit. Among them, since the needle tip contacts the spiral contact circuit to power on the electronic component for operation, the information of the electronic component is fed back to the external display screen, and various electrical performances of the electronic component are tested through the information on the display screen. It should be noted that when the thimble base is driven by the driving device, the thimble base will reciprocate. During this process, there will be a starting position and a test position. Among them, the test position is the position when the needle tip base contacts the spiral contact circuit, and the starting position is the position when the needle tip base is at the far end of the spiral contact circuit. When the needle tip base reciprocates, there will be an acceleration along the reciprocating motion direction at the starting position and the test position. Especially during the contact between the needle tip and the spiral contact circuit, the counterweight ring can prevent the thimble base from decelerating untimely at the test position or having a large impact force during the contact, resulting in a collision between the needle tip and the spiral contact circuit; in addition, the counterweight ring can achieve that when the thimble contacts the spiral contact circuit at the test position, when the driving device or the thimble base shakes, the cooperation of the first spring and the counterweight ring can balance the shake in the vertical direction, prevent the connection between the needle tip and the spiral contact circuit from being disconnected during the test, and realize the stability of the overall device.

[0008] According to an embodiment of the present invention, an adsorption sleeve is coaxially sleeved outside the thimble base. The adsorption sleeve has a first air path inside, and an adsorption cavity is provided at the end of the adsorption sleeve. The adsorption cavity and the first air path are connected by a first valve.

[0009] According to an embodiment of the present invention, a positioning protrusion is provided inside the adsorption sleeve, and the positioning protrusion is correspondingly arranged with the first valve.

[0010] Through the above design, the first gas path can be connected to an external air pump, so as to drive the first gas path to suck gas by the external air pump. At this time, the internal pressure of the first gas path is less than the pressure in the adsorption cavity, and the first valve opens, so as to suck the gas near the adsorption cavity, and then a negative pressure area is formed near the needle of the thimble base. The negative pressure area can suck the gas near the spiral contact circuit during the process of the needle contacting the spiral contact circuit, which can prevent the problem of decreased detection accuracy caused by excessive heat during long-term detection; in addition, by corresponding the adsorption cavity with the spiral contact circuit, the problem of connection between the needle and the spiral contact circuit can be solved during the detection of electronic components, that is, when the needle contacts the spiral contact circuit, then the air pump sucks the first gas path. At this time, the negative pressure area near the needle can form a relatively fixed connection between the needle and the spiral contact circuit, which can prevent the driving device or the whole device from vibrating and then causing poor contact between the needle and the spiral contact circuit.

[0011] In addition, the positioning protrusion is used to fix the first valve, that is, only when the first gas path is under negative pressure, the first valve will open. When the air pressure in the first gas path is standard air pressure or positive pressure, the first valve will fit with the positioning protrusion under its own elastic action to seal the adsorption wall.

[0012] According to an embodiment of the present invention, an adsorption assembly is accommodated in the adsorption cavity. The adsorption assembly includes at least two adsorption bending ring plates, which are sleeved in sequence, and adjacent adsorption bending ring plates are connected by a second spring;

[0013] The adsorption assembly further includes an adsorption ring, which is sleeved inside the innermost adsorption bending plate. An adsorption channel is provided in the adsorption ring, and the adsorption ring is connected to the adsorption bending ring plate by a third spring.

[0014] According to an embodiment of the present invention, a buffer pad is provided at one end of the adsorption bending ring plate away from the first valve.

[0015] With the above settings, by successively sleeving multiple adsorption bending ring plates and providing an adsorption collar inside the innermost adsorption bending ring plate, the adsorption of the spiral contact circuit can be achieved through the adsorption bending ring plates and the adsorption collar, further improving the contact tightness between the needle and the spiral contact circuit. In addition, by controlling the position of the adsorption sleeve, the adsorption force of the adsorption bending ring plates and the adsorption collar on the spiral contact circuit can be controlled. Specifically, under the action of gravity, the second spring, and the third spring, the multi-layer adsorption bending ring plates and the adsorption collar are all on different horizontal planes. When the needle contacts the spiral contact circuit, at this time, the end portions of the adsorption collar and the adsorption bending ring plates can be controlled manually to achieve multi-level contact with the spiral contact circuit. That is, by controlling the position of the adsorption sleeve, the magnitude of the adsorption force can be controlled, and thus the overall device can adapt to different spiral contact circuits, and further the overall device can adapt to different electronic components, improving the applicability of the overall device.

[0016] In addition, through the design of the adsorption component, the accuracy of the detection of electronic components can also be improved. Specifically, when the needle needs to be separated from the spiral contact circuit, at this time, the driving device will drive the thimble base to move away from the spiral contact circuit. Since there is a certain gap between the multi-layer adsorption bending ring plates and the adsorption collar and they are connected to each other through the second spring and the third spring, during the process of the needle moving away from the spiral contact circuit, the second spring and the third spring can be stretched, and the air can pass through the gap to quickly return the internal air pressure of the adsorption component to normal and stable. Thus, it can prevent the spiral contact circuit from being driven by the movement of the adsorption component, and then achieve the stability and position accuracy of the spiral contact circuit. Compared with improving the accuracy of the needle, it can further improve the accuracy and efficiency of the detection of electronic components.

[0017] A buffer pad is provided at one end of the adsorption bending ring plate away from the first valve. The buffer pad can prevent the adsorption bending ring plate and the adsorption collar from damaging the spiral contact circuit, and in addition, it can also play an insulating role.

[0018] According to an embodiment of the present invention, an air outlet cavity is laterally and circumferentially extended on the adsorption sleeve. The air outlet cavity and the first air path are connected through a second valve, and a one-way valve is provided in the air outlet cavity.

[0019] According to an embodiment of the present invention, an annular filter plate is provided between the one-way valve and the second valve in the air outlet cavity.

[0020] The air outlet cavity and the first air path are connected by a second valve. It should be noted that the second valve will only open when the air pressure in the first air path is positive. When the air pressure in the first air path is negative or at standard atmospheric pressure, the second valve is in a closed state to seal the air outlet cavity. In addition, the one-way valve in the air outlet cavity faces the same direction as the nozzle, and this one-way valve needs to be opened under a certain pressure. During the detection of electronic components, before the needle contacts the spiral contact circuit, a positive pressure is applied to the first air path through the outside air temperature, and when a certain pressure is reached, an air flow is ejected outward through the one-way valve. At this time, the air flow will flow through the contact surface of the spiral contact circuit, which can make the temperature of the entire spiral contact circuit and its surroundings stable and uniform, which is beneficial to reducing the overall internal temperature during subsequent detection, preventing the spiral contact circuit from failing or being damaged due to uneven internal heat distribution or heat accumulation, and can also clean the dust on the spiral contact circuit to prevent poor contact.

[0021] Furthermore, through the setting of the air outlet cavity, the accuracy of the contact between the needle and the spiral contact circuit can be improved. That is, when the needle detaches from the spiral contact circuit, it can prevent the adsorption cavity from being unable to separate from the spiral contact circuit or lagging in separation. By discharging air from the air outlet cavity, a positive pressure can be formed around the adsorption cavity, increasing the separation speed between the adsorption cavity and the spiral contact circuit. Description of the Drawings

[0022] Figure 1 It is a schematic diagram of the internal structure of a semiconductor package electronic component test thimble;

[0023] Figure 2 It is a schematic diagram of the internal structure of the adsorption sleeve;

[0024] Figure 3 It is a schematic diagram of the internal structure of the eccentric wheel;

[0025] Figure 4 It is a schematic diagram of the cooperation between the jacking rod and the eccentric wheel.

[0026] Reference numerals in the drawings: thimble base 1, needle 11, first buffer cavity 12, first plate body 21, second plate body 22, counterweight ring 23, first spring 24, adsorption sleeve 3, first air path 31, adsorption cavity 32, first valve 33, positioning protrusion 34, second valve 35, adsorption assembly 4, adsorption bent ring plate 41, second spring 42, adsorption ring 43, adsorption channel 44, third spring 45, buffer pad 46, air outlet cavity 5, one-way valve 51, annular filter plate 52, eccentric wheel 6, second buffer cavity 61, buffer block 62, fourth spring 63, guide rod 64, guide block 65, guide plate 66, jacking rod 71. Detailed Embodiments

[0027] The technical solution of the present invention will be further described in detail below in conjunction with specific embodiments and drawings:

[0028] As Figure 1 and Figure 2 described, a test thimble for a semiconductor package electronic component includes a thimble base body 1. A needle head 11 is received at the end of the thimble base body 1. A first buffer cavity 12 is provided on one side of the thimble base body 1 facing the needle head 11. A buffer assembly is provided in the first buffer cavity 12. The buffer assembly includes a first plate body 21 and a second plate body 22 arranged oppositely. A counterweight ring 23 is provided between the first plate body 21 and the second plate body 22. The first plate body 21, the counterweight ring 23, and the second plate body 22 are sequentially connected by no less than three first springs 24. The second plate body 22 is connected to the inner wall of the first buffer cavity 12, and the first plate body 21 is connected to the needle head 11.

[0029] Through the overall design of a test thimble for a semiconductor package electronic component, the first buffer cavity 12 in the thimble base body 1 can achieve buffering of the needle head 11. That is, when the thimble base body 1 is reciprocating, the needle head 11 needs to contact the spiral contact circuit. The buffer assembly prevents the needle head 11 from being damaged or the test being inaccurate due to excessive impact during the contact with the spiral contact circuit. Among them, since the needle head 11 contacts the spiral contact circuit to power on the electronic component for operation, the information of the electronic component is fed back to the outer display screen, and various electrical performances of the electronic component are tested through the information on the display screen. It should be noted that when the thimble base body 1 is driven by a driving device, the thimble base body 1 will reciprocate. In this process, there will be a starting position and a test position. Among them, the test position is the position when the needle head 11 base contacts the spiral contact circuit, and the starting position is the position when the needle head 11 base is at the far end of the spiral contact circuit. When the needle head 11 base reciprocates, there will be an acceleration along the reciprocating direction at the starting position and the test position. Especially during the contact process between the needle head 11 and the spiral contact circuit, the counterweight ring 23 can prevent the thimble base body 1 from decelerating in time at the test position or having a large impact force during the contact process, resulting in a collision between the needle head 11 and the spiral contact circuit; in addition, the counterweight ring 23 can achieve that when the thimble contacts the spiral contact circuit at the test position, when the driving device or the thimble base body 1 shakes, the cooperation of the first spring 24 and the counterweight ring 23 can balance the shaking in the vertical direction, prevent the connection between the needle head 11 and the spiral contact circuit from being disconnected during the test, and realize the stability of the overall device.

[0030] An adsorption sleeve 3 is coaxially sleeved outside the thimble base body 1. A first air passage 31 is provided in the adsorption sleeve 3. An adsorption cavity 32 is provided at the end of the adsorption sleeve 3. The adsorption cavity 32 and the first air passage 31 are connected by a first valve 33.

[0031] The adsorption sleeve 3 is provided with a positioning protrusion 34, and the positioning protrusion 34 is arranged corresponding to the first valve 33.

[0032] Through the above design, the first air path 31 can be connected to an external air pump, so as to realize that the external air pump drives the first air path 31 to suck gas. At this time, the internal pressure of the first air path 31 is less than the pressure in the adsorption cavity 32, and the first valve 33 opens, so as to realize sucking the gas near the adsorption cavity 32, and then forming a negative pressure area near the needle 11 of the thimble base 1. The negative pressure area can suck the gas near the spiral contact circuit during the process of the needle 11 contacting the spiral contact circuit, which can prevent the problem of decreased detection accuracy caused by excessive heat during long-term detection; in addition, by making the adsorption cavity 32 correspond to the spiral contact circuit, the problem of connection between the needle 11 and the spiral contact circuit can be solved during the detection of electronic components, that is, after the needle 11 contacts the spiral contact circuit, then the air pump sucks the first air path 31. At this time, the negative pressure area near the needle 11 can form a relatively fixed connection between the needle 11 and the spiral contact circuit, which can prevent the driving device or the whole device from vibrating and then causing poor contact between the needle 11 and the spiral contact circuit.

[0033] In addition, the positioning protrusion 34 is used to fix the first valve 33, that is, only when the pressure in the first air path 31 is negative, the first valve 33 will open. When the air pressure in the first air path 31 is standard air pressure or positive pressure, the first valve 33 will fit with the positioning protrusion 34 under its own elastic action to seal the adsorption wall.

[0034] The adsorption cavity 32 houses an adsorption component 4. The adsorption component 4 includes not less than two adsorption bending ring plates 41, and the adsorption bending ring plates 41 are sleeved in sequence. Adjacent adsorption bending ring plates 41 are connected by a second spring 42;

[0035] The adsorption component 4 further includes an adsorption ring 43. The adsorption ring 43 is sleeved inside the innermost adsorption bending ring plate 41. An adsorption channel 44 is arranged in the adsorption ring 43, and the adsorption ring 43 is connected to the adsorption bending ring plate 41 by a third spring 45.

[0036] One end of the adsorption bending ring plate 41 away from the first valve 33 is provided with a buffer pad 46.

[0037] With the above settings, multiple adsorption bending ring plates 41 are sleeved in sequence, and an adsorption collar is provided inside the innermost adsorption bending ring plate 41, so that the adsorption of the spiral contact circuit can be realized through the adsorption bending ring plate 41 and the adsorption collar, further improving the contact tightness between the needle 11 and the spiral contact circuit; in addition, by controlling the position of the adsorption sleeve 3, the adsorption force of the adsorption bending ring plate 41 and the adsorption collar on the spiral contact circuit can be controlled. Specifically, under the action of gravity, the second spring 42 and the third spring 45, the multi-layer adsorption bending ring plates 41 and the adsorption collars are all on different horizontal planes. When the needle 11 contacts the spiral contact circuit, at this time, the end parts of the adsorption collar and the adsorption bending ring plate 41 can, under artificial control, achieve multi-level contact with the spiral contact circuit, that is, by controlling the position of the adsorption sleeve 3, the magnitude of the adsorption force can be controlled, and then the overall device can be adapted to different spiral contact circuits, and then the overall device can be adapted to different electronic components, improving the applicability of the overall device.

[0038] In addition, through the design of the adsorption assembly 4, the detection accuracy of the electronic component can also be improved. Specifically, when the needle 11 needs to be separated from the spiral contact circuit, the driving device will drive the thimble base 1 to move away from the spiral contact circuit. Since there is a certain gap between the multi-layer adsorption bending ring plates 41 and the adsorption collars, and they are connected to each other through the second spring 42 and the third spring 45, during the process of the needle 11 moving away from the spiral contact circuit, the second spring 42 and the third spring 45 can be stretched, and the air passes through the gap to quickly return the internal air pressure of the adsorption assembly 4 to normal and stable, thereby preventing the spiral contact circuit from being driven by the movement of the adsorption assembly 4, and then realizing the stability and position accuracy of the spiral contact circuit. Compared with improving the accuracy of the needle 11, the detection accuracy and efficiency of the electronic component are improved.

[0039] A buffer pad 46 is provided at one end of the adsorption bending ring plate 41 away from the first valve 33. The buffer pad 46 can prevent the adsorption bending ring plate 41 and the adsorption collar from damaging the spiral contact circuit, and can also play an insulating role.

[0040] The adsorption sleeve 3 is laterally surrounded and extended with an air outlet cavity 5. The air outlet cavity 5 and the first air path 31 are connected through a second valve 35, and the air outlet cavity 5 is provided with a one-way valve 51.

[0041] An annular filter plate 52 is provided between the one-way valve 51 and the second valve 35 in the air outlet cavity 5.

[0042] The air outlet cavity 5 is connected to the first air path 31 through the second valve 35. It should be noted that the second valve 35 will only open when the air pressure in the first air path 31 is positive pressure. When the air pressure in the first record is negative pressure or standard atmospheric pressure, the second valve 35 is in a closed state to achieve the sealing of the air outlet cavity 5. In addition, the one-way valve 51 in the air outlet cavity 5 faces the same direction as the nozzle, and this one-way valve 51 needs to be opened under a certain applied pressure. During the detection process of the electronic component, when the needle 11 has not yet contacted the spiral contact circuit, a positive pressure is applied to the first air path 31 through the outside air temperature. When a certain pressure is reached, air flow is ejected to the outside through the one-way valve 51. At this time, the air flow will flow through the contact surface of the spiral contact circuit, which can achieve the stability and uniformity of the overall temperature of the spiral contact circuit and its surroundings, is beneficial to reducing the overall internal temperature during the subsequent detection process, preventing the spiral contact circuit from failing or being damaged due to uneven internal heat distribution or heat accumulation of the spiral contact circuit, and can also achieve the dust cleaning of the spiral contact circuit to prevent the occurrence of poor contact.

[0043] Furthermore, through the setting of the air outlet cavity 5, the accuracy of the contact between the needle 11 and the spiral contact circuit can be improved, that is, it can prevent the adsorption cavity 32 from being unable to separate from the spiral contact circuit or lagging behind when the needle 11 detaches from the spiral contact circuit. By discharging air from the air outlet cavity 5, a positive pressure can be formed around the adsorption cavity 32 to improve the separation speed between the adsorption cavity 32 and the spiral contact circuit.

[0044] Embodiment 2:

[0045] As Figure 3 and Figure 4 described, a semiconductor package electronic component test thimble according to another embodiment of the present invention is different from Embodiment 1 in that a semiconductor package electronic component test thimble further includes a driving device. The driving device includes an eccentric wheel 6 and a driving rod, wherein the eccentric wheel 6 is used to drive the driving rod, and the driving rod further drives the thimble base 1 to reciprocate.

[0046] Among them, the eccentric wheel 6 is internally provided with a second buffer cavity 61. A buffer block 62 is provided in the second buffer cavity 61, and the buffer block 62 is connected to the inner wall of the second buffer cavity 61 through a fourth spring 63.

[0047] It should be noted that the moving direction of the buffer block 62 is different from the radial direction of the eccentric wheel 6.

[0048] By providing a second buffer cavity 61 inside the eccentric wheel 6, since the eccentric wheel 6 has its own inertia at the moment of starting and stopping, the inertia of the eccentric wheel 6 itself may cause the eccentric wheel 6 to vibrate or be mispositioned. A buffer block 62 with a moving path offset radially from the eccentric wheel 6 is provided inside the second buffer cavity 61. The buffer block 62 can prevent the eccentric wheel 6 from vibrating or being mispositioned during starting and stopping.

[0049] Lifting rods 71 are provided at both ends of the driving rod, and the lifting rod 71 corresponding to the eccentric wheel 6 enables the driving rod to rotate.

[0050] Guide rods 64 are provided on both sides of the eccentric wheel 6, guide blocks 65 are provided on the guide rods 64, and the guide blocks 65 are connected to a guide plate 66. That is, the eccentric wheel 6 drives the guide plate 66, and the guide plate 66 drives the lifting rod 71, thereby enabling the driving rod to drive the thimble base 1 to move. Among them, the guide block 65 can be slidably arranged, and the guide plate 66 can be replaced. Through the guide plate 66, even when the accuracy of the eccentric wheel 6 is relatively low, the reciprocating movement of the thimble base 1 can still maintain a high accuracy, and the traveling speed and traveling amount of the thimble base 1 can be adjusted.

[0051] In addition, the setting of the guide plate 66 can further improve the buffering effect of the buffer block 62. Through the guide plate 66, the stability of the eccentric wheel 6 can be achieved, and together with the buffer plate, it can prevent the eccentric wheel 6 from vibrating or being mispositioned during starting and stopping.

[0052] Furthermore, the surface of the eccentric wheel 6 is stepped, so that the eccentric wheel 6 has a certain distance when driving the guide rod 64 to the highest and lowest positions, preventing the situation that the contact stroke between the needle head 11 and the spiral contact line is too short and the contact is poor due to a slight difference in the rotation angle of the eccentric wheel 6 during rotation. It can also prevent the situation of errors when the power of the eccentric wheel 6 is insufficient.

[0053] The above-described embodiments have elaborated on the technical solutions of the present invention. It should be understood that the above are only specific embodiments of the present invention and do not limit the present invention. Any modifications, supplements, or substitutions in a similar manner within the scope of the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor package electronic component test thimble, comprising a thimble base body (1), wherein a needle head (11) is received at the end of the thimble base body (1), and is characterized in that, On one side of the thimble base body (1) facing the needle head (11), there is a first buffer cavity (12). A buffer component is arranged in the first buffer cavity (12). The buffer component includes a first plate body (21) and a second plate body (22) which are oppositely arranged. A weight ring (23) is arranged between the first plate body (21) and the second plate body (22). The first plate body (21), the weight ring (23) and the second plate body (22) are sequentially connected by no less than three first springs (24). The second plate body (22) is connected to the inner wall of the first buffer cavity (12), and the first plate body (21) is connected to the needle head (11). An adsorption sleeve (3) is coaxially sleeved outside the thimble base body (1). A first air path (31) is provided inside the adsorption sleeve (3). An adsorption cavity (32) is provided at the end of the adsorption sleeve (3). The adsorption cavity (32) and the first air path (31) are connected by a first valve (33). An adsorption component (4) is accommodated in the adsorption cavity (32). The adsorption component (4) includes no less than two adsorption bent ring plates (41). The adsorption bent ring plates (41) are sequentially sleeved. Adjacent adsorption bent ring plates (41) are connected by a second spring (42). The adsorption component (4) further includes an adsorption ring (43). The adsorption ring (43) is sleeved inside the innermost adsorption bent ring plate (41). An adsorption channel (44) is provided inside the adsorption ring (43). The adsorption ring (43) is connected to the adsorption bent ring plate (41) by a third spring (45).

2. The semiconductor package electronic component test thimble according to claim 1, characterized in that, One end of the adsorption bent ring plate (41) away from the first valve (33) is provided with a buffer pad (46).

3. The semiconductor package electronic component test thimble according to claim 1, wherein A positioning protrusion (34) is provided inside the adsorption sleeve (3). The positioning protrusion (34) is arranged corresponding to the first valve (33).

4. The semiconductor package electronic component test thimble according to claim 1, wherein An air outlet cavity (5) is laterally and circumferentially extended and arranged on the adsorption sleeve (3). The air outlet cavity (5) and the first air path (31) are connected by a second valve (35). A one-way valve (51) is provided on the air outlet cavity (5).

5. The semiconductor package electronic component test thimble according to claim 4, wherein An annular filter plate (52) is arranged between the one-way valve (51) and the second valve (35) provided inside the air outlet cavity (5).

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