Chip triode with high heat dissipation performance and preparation method thereof

Abstract

The present invention relates to the field of transistors, and in particular to a patch transistor with high heat dissipation performance and a preparation method thereof. It comprises an upper package, a lower package, pins and a movable block; a heat-conducting pipe and a heat-conducting frame are arranged inside the upper package, the end of the heat-conducting pipe passes through the side of the upper package, and the surface of the heat-conducting frame is located on the top surface of the upper package; the lower package is located below the upper package and is integrally formed with the upper package; the pins are movably mounted on the side of the lower package and connected to the electrical components in the lower package, and the pins can be moved laterally along the side of the lower package; the movable block is movably mounted on the side of the lower package, and the end of the movable block can be moved longitudinally and abut against the back of the pin to limit the pin. Compared with the traditional patch transistor, the heat dissipation effect is better, and the structural design can realize the adjustment of the pin position, so that the patch transistor can be used in various situations with limited specifications.

Description

Technical Field

[0001] The invention relates to the field of triodes, and in particular to a patch triode with high heat dissipation performance and a preparation method thereof. Background Art

[0002] The basic function of the SMD transistor is amplification. It can amplify weak electrical signals to a certain intensity.

[0003] The structure of current SMD transistors usually only includes a fully enclosed package and a pin with one end fixed inside the package and one end exposed outside the package for wiring. This enclosed structural design makes the heat dissipation effect of the SMD transistor poor, and after long-term use, it will generate heat, affecting the use effect and service life.

[0004] In addition, the current SMD transistors are affected by the above-mentioned closed structural design, and the pin positions are fixed. When connecting different contact positions, only SMD transistors of different specifications can be used, which is very inconvenient. Summary of the invention

[0005] Based on this, it is necessary to provide a chip transistor with high heat dissipation performance and a preparation method thereof to address the above technical problems. Compared with traditional chip transistors, the heat dissipation effect is better and the pin position can be adjusted, so that the chip transistor can be used in various situations with limited specifications.

[0006] The present invention provides a chip triode with high heat dissipation performance, comprising:

[0007] The upper package body is provided with a heat-conducting pipe and a heat-conducting frame inside, the end of the heat-conducting pipe penetrates to the side surface of the upper package body, and the surface of the heat-conducting frame is located on the top surface of the upper package body;

[0008] A lower packaging body, located below the upper packaging body and formed integrally with the upper packaging body;

[0009] A pin is movably mounted on the side of the lower package body and connected to the electrical component in the lower package body, and the pin can move laterally along the side of the lower package body;

[0010] The movable card block is movably mounted on the side of the lower packaging body, and the end of the movable card block can move in the longitudinal direction and abut against the back of the pin to limit the pin.

[0011] In one embodiment, a transverse through hole, a longitudinal through hole and a first mounting groove are formed inside the upper packaging body;

[0012] The transverse through hole is located in the upper packaging body, and both ends of the transverse through hole penetrate to the same side of the upper packaging body. There are multiple longitudinal through holes, and one end of the multiple longitudinal through holes penetrates to the transverse through hole, and the other end penetrates to the top surface of the upper packaging body. The first mounting groove is opened on the top surface of the upper packaging body.

[0013] In one embodiment, the heat-conducting pipes include transverse heat-conducting pipes, arc-shaped heat-conducting pipes and longitudinal heat-conducting pipes;

[0014] The two transverse heat-conducting pipes are arranged opposite to each other and fixed at the part of the transverse through hole that passes through to the same side of the upper packaging body. The arcuate heat-conducting pipe is arranged at the part of the transverse through hole that is located inside the upper packaging body, and the two ends of the arcuate heat-conducting pipe are respectively connected to one end of the two transverse heat-conducting pipes. The plurality of longitudinal heat-conducting pipes are arranged, and the plurality of longitudinal heat-conducting pipes are distributed in the plurality of longitudinal through holes along the bending direction of the arcuate heat-conducting pipes and are connected to the inside of the arcuate heat-conducting pipes.

[0015] In one embodiment, the heat-conducting frame is fixed in the first mounting groove, and the heat-conducting frame includes a longitudinal heat-conducting sheet, an arc-shaped heat-conducting sheet, and a transverse heat-conducting sheet;

[0016] There are multiple longitudinal heat conductive sheets arranged at intervals along the direction of the transverse heat conductive tube, and an arc-shaped heat conductive sheet is fixed at both ends of the bottom surface of each longitudinal heat conductive sheet. The inner surface of the arc-shaped heat conductive sheet is attached to the transverse heat conductive tube, and the transverse heat conductive sheet is horizontally arranged on the top surface of the longitudinal heat conductive sheet.

[0017] In one embodiment, a first cutout is formed in the middle of the bottom surface of the longitudinal heat conductive sheet, second cutouts are formed on both sides of the bottom surface of the longitudinal heat conductive sheet, and heat conductive glue is filled between the arc-shaped heat conductive sheet and the transverse heat conductive pipe.

[0018] In one embodiment, the lower package body is provided with second mounting grooves on two opposite sides, and an anisotropic through groove is provided on the bottom surface of the second mounting groove, and the other end of the anisotropic through groove passes through to the side surface of the lower package body, and one end of the pin is movably installed in the second mounting groove, and the movable card block is installed in the anisotropic through groove, and the length of the movable card block is greater than the length of the anisotropic through groove.

[0019] In one embodiment, a plurality of the anisotropic through grooves are spaced apart along the length direction of the second mounting groove, and the angle between the two ends of the anisotropic through grooves is greater than 90 degrees.

[0020] In one embodiment, a first card slot is provided on the bottom surface of the pin, two ends of the first card slot pass through two side surfaces of the pin, a plurality of limit protrusions are provided at intervals on one side of the first card slot, a plurality of second card slots are provided at intervals on the surface of the movable card block, and when the end of the movable card block is inserted into the first card slot, the limit protrusion is located in the second card slot.

[0021] In one embodiment, a third mounting groove is further formed on the upper surface of the lower packaging body, and a certain interval exists between the third mounting groove and the second mounting groove, and the packaging body portion at the interval can bend when subjected to force.

[0022] The present invention also provides a method for preparing a patch triode with high heat dissipation performance, which is applied to the patch triode with high heat dissipation performance described in any one of the above embodiments, and the method comprises:

[0023] Presetting the heat-conducting pipe and the heat-conducting frame on the upper package molding part;

[0024] After the upper package body and the lower package body are formed, the pins are inserted into the side of the lower package body;

[0025] The movable card block is synchronously installed on the side of the lower packaging body, and the movable card block is pushed so that the end of the movable card block limits the pin.

[0026] The above-mentioned SMD triode with high heat dissipation performance and its preparation method, when preparing the SMD triode, firstly, the heat-conducting pipe fittings and the heat-conducting frame are preset in the molding part of the upper package body, and the required limiting structure is set at the lower package body, so that the upper package body and the lower package body after molding meet the structural requirements, and the heat dissipation effect is better than that of the traditional SMD triode, and then one end of the pin is inserted into the side of the lower package body, and the pin is connected to the electrical component in the lower package body. In this process, according to the actual installation needs of the SMD triode, the position of the pin on the side of the lower package body can be pushed so that the pin position meets the specific installation needs. At this time, the movable card block is synchronously installed on the side of the lower package body, and the movable card block is pushed so that the end of the movable card block abuts against the back of the pin to limit the pin. This structural design can realize the adjustment of the pin position, so that the SMD triode can be used in various specification restrictions. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1A schematic diagram of the three-dimensional structure of the triode provided by the present invention;

[0029] Figure 2 A schematic diagram of the disassembled structure of the package provided by the present invention;

[0030] Figure 3 A schematic diagram of the structure of the heat-conducting pipe and the heat-conducting frame provided by the present invention;

[0031] Figure 4 A schematic diagram of the overall structure of the lower package provided by the present invention;

[0032] Figure 5 A schematic diagram of the partial structure of the lower package provided by the present invention;

[0033] Figure 6 This is a schematic diagram of the back structure of the pin provided by the present invention.

[0034] Reference numerals:

[0035] 110, upper package body; 111, transverse through hole; 112, longitudinal through hole; 113, first mounting groove; 120, lower package body; 121, second mounting groove; 122, opposite through groove; 123, third mounting groove; 200, pin; 210, first card slot; 220, limit protrusion; 300, heat-conducting pipe; 310, transverse heat-conducting pipe; 320, arc-shaped heat-conducting pipe; 330, longitudinal heat-conducting pipe; 400, heat-conducting frame; 410, longitudinal heat-conducting sheet; 411, first incision; 412, second incision; 420, arc-shaped heat-conducting sheet; 430, transverse heat-conducting sheet; 500, movable card block; 510, second card slot. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] Combine the following Figures 1 to 6 The invention describes a chip triode with high heat dissipation performance and a preparation method thereof.

[0038] like Figure 1 and Figure 2As shown, in one embodiment, a chip transistor with high heat dissipation performance and a preparation method thereof include an upper package body 110, a lower package body 120, a pin 200 and an active block 500; a heat-conducting pipe 300 and a heat-conducting frame 400 are arranged inside the upper package body 110, the end of the heat-conducting pipe 300 passes through the side of the upper package body 110, and the surface of the heat-conducting frame 400 is located on the top surface of the upper package body 110; the lower package body 120 is located below the upper package body 110 and is integrally formed with the upper package body 110; the pin 200 is movably installed on the side of the lower package body 120 and connected to the electrical component in the lower package body 120, and the pin 200 can move laterally along the side of the lower package body 120; the active block 500 is movably installed on the side of the lower package body 120, and the end of the active block 500 can move longitudinally and abut against the back of the pin 200 to limit the pin 200.

[0039] Specifically, when preparing the SMD transistor, firstly, the heat-conducting pipe 300 and the heat-conducting frame 400 are preset at the molding part of the upper package 110, and the required limiting structure is set at the lower package 120, so that the molded upper package 110 and the lower package 120 meet the structural requirements, and then one end of the pin 200 is inserted into the side of the lower package 120, and the pin 200 is connected to the electrical component in the lower package 120. In this process, according to the actual installation needs of the SMD transistor, the position of the pin 200 on the side of the lower package 120 can be pushed so that the position of the pin 200 meets the specific installation needs. At this time, the movable card block 500 is synchronously installed on the side of the lower package 120, and the movable card block 500 is pushed so that the end of the movable card block 500 abuts against the back of the pin 200 to limit the pin 200.

[0040] When preparing the SMD transistor with high heat dissipation performance, the heat-conducting pipe 300 and the heat-conducting frame 400 are firstly preset at the molding part of the upper package 110, and the required limiting structure is set at the lower package 120, so that the upper package 110 and the lower package 120 after molding meet the structural requirements, and the heat dissipation effect is better than that of the traditional SMD transistor. Then, one end of the pin 200 is inserted into the side of the lower package 120, and the pin 200 is connected to the electrical component in the lower package 120. In this process, According to the actual installation needs of the chip transistor, the position of the pin 200 on the side of the lower package body 120 can be pushed so that the position of the pin 200 meets the specific installation needs. At this time, the movable card block 500 is synchronously installed on the side of the lower package body 120, and the movable card block 500 is pushed so that the end of the movable card block 500 abuts against the back of the pin 200 to limit the pin 200. This structural design can adjust the position of the pin 200, so that the chip transistor can be used in various specification restrictions.

[0041] In one embodiment, a transverse through hole 111, a longitudinal through hole 112 and a first mounting groove 113 are opened inside the upper packaging body 110; the transverse through hole 111 is located inside the upper packaging body 110, and both ends of the transverse through hole 111 pass through to the same side of the upper packaging body 110, a plurality of longitudinal through holes 112 are provided, and one end of the plurality of longitudinal through holes 112 passes through the transverse through hole 111, and the other end passes through to the top surface of the upper packaging body 110, and the first mounting groove 113 is opened on the top surface of the upper packaging body 110.

[0042] Specifically, Figure 3 As shown, the heat-conducting pipe fitting 300 includes a transverse heat-conducting pipe 310, an arcuate heat-conducting pipe 320 and a longitudinal heat-conducting pipe 330; two transverse heat-conducting pipes 310 are arranged opposite to each other and fixed at the part where the transverse through hole 111 penetrates to the same side of the upper packaging body 110, the arcuate heat-conducting pipe 320 is arranged at the part where the transverse through hole 111 is located inside the upper packaging body 110, and the two ends of the arcuate heat-conducting pipe 320 are respectively connected to one end of the two transverse heat-conducting pipes 310, and a plurality of longitudinal heat-conducting pipes 330 are arranged, and the plurality of longitudinal heat-conducting pipes 330 are distributed in the plurality of longitudinal through holes 112 along the bending direction of the arcuate heat-conducting pipe 320, and are connected to the interior of the arcuate heat-conducting pipe 320.

[0043] The SMD transistor will generate heat during use. Since the heat-conducting pipe fitting 300 is preset and packaged in the upper package body 110, the heat-conducting pipe fitting 300 will absorb the heat generated by the package body. When the airflow enters from a transverse heat-conducting pipe 310, it will flow out through the arc-shaped heat-conducting pipe 320 and another transverse heat-conducting pipe 310 in sequence. Similarly, since the arc-shaped heat-conducting pipe 320 occupies a large space, in order to enhance the heat dissipation effect of the area where it is located, a plurality of longitudinal heat-conducting pipes 330 are arranged at the arc-shaped heat-conducting pipe 320. When the airflow passes through, it will also be discharged along the plurality of longitudinal heat-conducting pipes 330, thereby discharging the heat in the area of ​​the longitudinal heat-conducting pipes 330.

[0044] In one embodiment, the heat-conducting frame 400 is fixed in the first mounting groove 113, and the heat-conducting frame 400 includes a longitudinal heat-conducting sheet 410, an arcuate heat-conducting sheet 420 and a transverse heat-conducting sheet 430; a plurality of longitudinal heat-conducting sheets 410 are arranged at intervals along the direction of the transverse heat-conducting pipe 310, and an arcuate heat-conducting sheet 420 is fixed at both ends of the bottom surface of each longitudinal heat-conducting sheet 410, and the inner surface of the arcuate heat-conducting sheet 420 is attached to the transverse heat-conducting pipe 310, and the transverse heat-conducting sheet 430 is horizontally arranged on the top surface of the longitudinal heat-conducting sheet 410.

[0045] Specifically, a first cutout 411 is opened in the middle of the bottom surface of the longitudinal heat conductive sheet 410 , second cutouts 412 are opened on both sides of the bottom surface of the longitudinal heat conductive sheet 410 , and heat conductive glue is filled between the arc-shaped heat conductive sheet 420 and the transverse heat conductive pipe 310 .

[0046] like Figure 4 and Figure 5 As shown, in one embodiment, second mounting grooves 121 are provided on opposite sides of the lower package body 120, and an anisotropic through groove 122 is provided on the bottom surface of the second mounting groove 121, and the other end of the anisotropic through groove 122 passes through to the side surface of the lower package body 120, one end of the pin 200 is movably installed in the second mounting groove 121, and the movable card block 500 is installed in the anisotropic through groove 122, and the length of the movable card block 500 is greater than the length of the anisotropic through groove 122.

[0047] Specifically, when adjusting the position of the pin 200, the pin 200 is moved along the length direction of the second mounting groove 121. When it moves to a suitable position, the movable block 500 is pushed to make the end of the movable block 500 move along the axial through groove 122 and finally abut against the back side of one end of the pin 200 located in the second mounting groove 121.

[0048] In one embodiment, a plurality of the anisotropic through grooves 122 are arranged at intervals along the length direction of the second mounting groove 121 , and the angle between the two ends of the anisotropic through grooves 122 is greater than 90 degrees.

[0049] Specifically, by setting the included angles of the two ends of the non-directional through groove 122 to be greater than 90 degrees, it is more convenient to push the movable block 500 without causing jamming.

[0050] like Figure 6 As shown, in one embodiment, a first card slot 210 is provided on the bottom surface of the pin 200, and two ends of the first card slot 210 pass through two side surfaces of the pin 200. A plurality of limiting protrusions 220 are provided at intervals on one side of the first card slot 210, and a plurality of second card slots 510 are provided at intervals on the surface of the movable card block 500. When the end of the movable card block 500 is inserted into the first card slot 210, the limiting protrusion 220 is located in the second card slot 510.

[0051] Furthermore, a third mounting groove 123 is formed on the upper surface of the lower packaging body 120 . There is a certain interval between the third mounting groove 123 and the second mounting groove 121 , and the packaging body portion at the interval can bend when subjected to force.

[0052] Specifically, by providing the third installation groove 123 , when the pin 200 is pushed into the second installation groove 121 for installation, its end can tightly abut against the electrical component provided on the inner surface of the second installation groove 121 and complete electrical connection with the electrical component.

[0053] In one embodiment, a method for preparing a patch triode with high heat dissipation performance is applied to the patch triode with high heat dissipation performance in any of the above embodiments, comprising the following steps:

[0054] The heat-conducting pipe and the heat-conducting frame are preset on the upper package molding part.

[0055] After the upper package body and the lower package body are formed, the leads are inserted into the side surface of the lower package body.

[0056] The movable card block is synchronously installed on the side of the lower packaging body, and the movable card block is pushed so that the end of the movable card block limits the pin.

[0057] The preparation method of the above-mentioned patch transistor with high heat dissipation performance, when preparing the patch transistor, firstly, the heat-conducting pipe fittings and the heat-conducting frame are preset in the molding part of the upper package body, and the required limiting structure is set at the lower package body, so that the upper package body and the lower package body after molding meet the structural requirements, and the heat dissipation effect is better than that of the traditional patch transistor, and then one end of the pin is inserted into the side of the lower package body, and the pin is connected to the electrical component in the lower package body. In this process, according to the actual installation needs of the patch transistor, the position of the pin on the side of the lower package body can be pushed so that the pin position meets the specific installation needs. At this time, the movable card block is synchronously installed on the side of the lower package body, and the movable card block is pushed so that the end of the movable card block abuts against the back of the pin to limit the pin. This structural design can realize the adjustment of the pin position, so that the patch transistor can be used in various specification restrictions.

[0058] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A chip transistor with high heat dissipation performance, characterized in that: include: The upper package body is provided with a heat-conducting pipe and a heat-conducting frame inside, the end of the heat-conducting pipe penetrates to the side surface of the upper package body, and the surface of the heat-conducting frame is located on the top surface of the upper package body; A lower packaging body, located below the upper packaging body and formed integrally with the upper packaging body; A pin is movably mounted on the side of the lower package body and connected to the electrical component in the lower package body, and the pin can move laterally along the side of the lower package body; The movable card block is movably mounted on the side of the lower packaging body, and the end of the movable card block can move in the longitudinal direction and abut against the back of the pin to limit the pin.

2. The chip transistor with high heat dissipation performance according to claim 1, characterized in that: The upper packaging body is provided with a transverse through hole, a longitudinal through hole and a first mounting groove; The transverse through hole is located in the upper packaging body, and both ends of the transverse through hole penetrate to the same side of the upper packaging body. There are multiple longitudinal through holes, and one end of the multiple longitudinal through holes penetrates to the transverse through hole, and the other end penetrates to the top surface of the upper packaging body. The first mounting groove is opened on the top surface of the upper packaging body.

3. The chip transistor with high heat dissipation performance according to claim 2, characterized in that: The heat-conducting pipes include transverse heat-conducting pipes, arc-shaped heat-conducting pipes and longitudinal heat-conducting pipes; The two transverse heat-conducting pipes are arranged opposite to each other and fixed at the part of the transverse through hole that passes through to the same side of the upper packaging body. The arcuate heat-conducting pipe is arranged at the part of the transverse through hole located inside the upper packaging body, and the two ends of the arcuate heat-conducting pipe are respectively connected to one end of the two transverse heat-conducting pipes. The plurality of longitudinal heat-conducting pipes are arranged, and the plurality of longitudinal heat-conducting pipes are distributed in the plurality of longitudinal through holes along the bending direction of the arcuate heat-conducting pipes and are connected to the inside of the arcuate heat-conducting pipes.

4. The chip transistor with high heat dissipation performance according to claim 3, characterized in that: The heat-conducting frame is fixed in the first mounting groove, and the heat-conducting frame includes a longitudinal heat-conducting sheet, an arc-shaped heat-conducting sheet and a transverse heat-conducting sheet; There are multiple longitudinal heat conductive sheets arranged at intervals along the direction of the transverse heat conductive tube, and an arc-shaped heat conductive sheet is fixed at both ends of the bottom surface of each longitudinal heat conductive sheet. The inner surface of the arc-shaped heat conductive sheet is attached to the transverse heat conductive tube, and the transverse heat conductive sheet is horizontally arranged on the top surface of the longitudinal heat conductive sheet.

5. The chip transistor with high heat dissipation performance according to claim 4, characterized in that: A first cutout is provided in the middle of the bottom surface of the longitudinal heat conductive sheet, and second cutouts are provided on both sides of the bottom surface of the longitudinal heat conductive sheet. Heat conductive glue is filled between the arc-shaped heat conductive sheet and the transverse heat conductive pipe.

6. The chip transistor with high heat dissipation performance according to claim 5, characterized in that: The lower package body is provided with second mounting grooves on opposite sides, and an anisotropic through groove is provided on the bottom surface of the second mounting groove. The other end of the anisotropic through groove passes through to the side surface of the lower package body. One end of the pin is movably installed in the second mounting groove, and the movable card block is installed in the anisotropic through groove. The length of the movable card block is greater than the length of the anisotropic through groove.

7. The chip transistor with high heat dissipation performance according to claim 6, characterized in that: A plurality of the anisotropic through grooves are arranged at intervals along the length direction of the second mounting groove, and the angle between the two ends of the anisotropic through grooves is greater than 90 degrees.

8. The chip transistor with high heat dissipation performance according to claim 7, characterized in that: A first card slot is provided on the bottom surface of the pin, two ends of the first card slot pass through two side surfaces of the pin, a plurality of limit protrusions are arranged at intervals on one side of the first card slot, a plurality of second card slots are arranged at intervals on the surface of the movable card block, and when the end of the movable card block is inserted into the first card slot, the limit protrusion is located in the second card slot.

9. The chip transistor with high heat dissipation performance according to claim 8, characterized in that: A third mounting groove is further formed on the upper surface of the lower packaging body. There is a certain interval between the third mounting groove and the second mounting groove, and the packaging body portion at the interval can bend when subjected to force.

10. A method for preparing a SMD triode with high heat dissipation performance, applied to the SMD triode with high heat dissipation performance as claimed in any one of claims 1 to 9, characterized in that: The method comprises: Presetting the heat-conducting pipe and the heat-conducting frame on the upper package molding part; After the upper package body and the lower package body are formed, the pins are inserted into the side of the lower package body; The movable card block is synchronously installed on the side of the lower packaging body, and the movable card block is pushed so that the end of the movable card block limits the pin.

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