Thermal management component, power module system, and energy storage system

Abstract

The application relates to the field of energy storage devices, and discloses a heat management component, a power module system and an energy storage system. The heat management component comprises a first heat management component, a containing cavity is arranged in the first heat management component, the containing cavity comprises an evaporation section and a condensation section which are connected in communication, and the containing cavity is used for containing a first cooling medium; and a second heat management component is contained in the condensation section, and a flow channel for flowing of a second cooling medium is arranged in the second heat management component. The heat management component provided by the application can effectively dissipate heat of a power module, can reduce the risk of generation of condensed water outside the power module, and can further reduce the risk of short circuit caused by the condensed water.

Description

Technical Field

[0001] This application relates to the field of energy storage devices, and in particular to a thermal management component, a power module system, and an energy storage system. Background Technology

[0002] With the development of power systems and power electronics technology, the rapid development of flexible DC transmission projects has led to an increasing demand for high-voltage, high-power IGBT (Insulated Gate Bipolar Transistor) devices, and higher requirements for their capacity and reliability.

[0003] Power modules generate a significant amount of heat during operation. Heat dissipation not only affects their efficiency but also directly impacts their lifespan. Water cooling is an effective way to remove this heat. However, in new energy storage projects, low-temperature water-cooling can easily lead to condensation on the outside of the power module, posing a risk of short circuits. Summary of the Invention

[0004] In view of this, this application provides a thermal management component, a power module system, and an energy storage system, which can alleviate the problem of condensation caused by heat dissipation in the power module.

[0005] An embodiment of the first aspect of this application provides a thermal management component, comprising:

[0006] A first thermal management component has a receiving cavity, which includes an evaporation section and a condensation section connected to each other, and is used to receive a first cooling medium.

[0007] A second thermal management component is housed within the condensation section, and the second thermal management component has a flow channel for supplying a second cooling medium.

[0008] The thermal management component provided in this application includes a first thermal management component and a second thermal management component. The evaporation section of the first thermal management component can be attached to the power module for heat exchange, causing the first cooling medium to evaporate into a gas. The second thermal management component is used to exchange heat with the first cooling medium, causing the first cooling medium to condense into a liquid in the condensation section. The first cooling medium absorbs a large amount of latent heat of phase change during the gas-liquid phase change process, thereby enabling the thermal management component to effectively dissipate heat from the power module. Since the second thermal management component is located inside the first thermal management component and far from the evaporation section, even if the temperature of the second cooling medium is lower than the valve hall temperature, condensation is unlikely to form on the surface of the power module. When the power module is started, the housing cavity of the thermal management component can serve as a superconducting heat transfer channel to dissipate heat from the power module; when the power module is not started, the first cooling medium does not undergo a large-scale phase change, and the housing cavity can serve as an insulating channel to reduce the probability of condensation forming outside the power module. Therefore, the thermal management component provided in this application can effectively dissipate heat from the power module while reducing the risk of condensation forming outside the power module, thereby reducing the risk of short circuits caused by condensation.

[0009] In some embodiments, at least one surface of the second thermal management component is spaced apart from the inner wall of the receiving cavity.

[0010] By adopting the above technical solution, the heat exchange between the outer shell of the second thermal management component and the outer shell of the first thermal management component is reduced, making it less likely for condensation to form on the outer surface of the first thermal management component.

[0011] In some embodiments, each outer surface of the second thermal management component is spaced apart from the inner wall of the receiving cavity.

[0012] By adopting the above technical solution, the second thermal management component is thermally insulated from the first thermal management component, and the heat transfer between the outer shell of the second thermal management component and the outer shell of the first thermal management component is extremely low. Therefore, after the second cooling medium enters the second thermal management component, it is not easy for condensation to form on the outer surface of the first thermal management component.

[0013] In some embodiments, the distance between the outer surface of the second thermal management component and the inner wall of the receiving cavity is greater than 2 mm.

[0014] By adopting the above technical solution, the second thermal management component is less likely to come into contact with the inner wall of the cavity, thus isolating the cooling medium from the power module and reducing the probability of condensation in the power module and the first thermal management component.

[0015] In some embodiments, the first thermal management component has a first hole, and the thermal management component further includes a connecting pipe that is connected to the flow channel and extends through the first hole to the outside of the first thermal management component.

[0016] By adopting the above technical solution, the connecting pipe can introduce the external second cooling medium flow channel into the flow channel and / or export the second cooling medium in the flow channel to the outside, so that the second cooling medium can flow continuously in the flow channel of the second thermal management component.

[0017] In some embodiments, the thermal management component further includes a seal located within the first hole to seal the first hole; the seal has a second hole through which the connecting pipe passes.

[0018] By adopting the above technical solution, the thermal management component can use a sealant to seal the first hole, keeping the sealing cavity in a sealed state.

[0019] In some embodiments, the first thermal management component includes a first housing having the receiving cavity, the second thermal management component includes a second housing having the flow channel, and the thermal conductivity of the seal is less than the thermal conductivity of the first housing and the thermal conductivity of the second housing.

[0020] By adopting the above technical solution, the combination of the sealing element and the connecting pipe can fix the position of the second thermal management component inside the receiving cavity; the low thermal conductivity of the sealing element can increase the temperature difference between the inlet temperature of the second cooling medium of the second thermal management component and the receiving cavity.

[0021] In some embodiments, the seal includes a first part and a second part connected to each other, and the second hole passes through the first part and the second part;

[0022] The first part is inserted into the first hole, and the second part is located outside the first thermal management component.

[0023] By adopting the above technical solution, the first part extends to one end of the receiving cavity and covers the connecting pipe, reducing the probability of the connecting pipe contacting the first outer shell; the second part is located outside the first thermal management component, which facilitates the installation and removal of the seal.

[0024] In some embodiments, the second thermal management component is provided with two connecting pipes, which are respectively used for the inflow and outflow of the second cooling medium.

[0025] By adopting the above technical solution, the flow channel in the second thermal management component can continuously circulate the second cooling medium, and the power module can share the water cooling system with the battery module.

[0026] In some embodiments, the connecting pipe is a rigid pipe, which is used to support the second thermal management component, thereby spacing the second thermal management component from the first thermal management component.

[0027] Since the second thermal management component is suspended in the receiving cavity through a connecting pipe and a seal, and the connecting pipe is a rigid pipe, the connecting pipe can effectively support the second thermal management component, keeping the second thermal management component separated from the first thermal management component and preventing the second thermal management component from contacting the first thermal management component.

[0028] In some embodiments, the second thermal management component has a layer of the flow channel along its thickness direction, the flow channel including a plurality of sub-flow channels, the plurality of sub-flow channels being connected in series and / or in parallel.

[0029] By adopting the above technical solution, the second thermal management component can make full use of the single-layer flow channel for centralized heat dissipation. The condensation cavity and the area where the second thermal management component is located are not limited by the hole position and size of the power module area, and the size and form of the flow channel can be designed freely.

[0030] In some embodiments, the first thermal management component is provided with an enhanced heat dissipation structure, which is disposed on the outer surface of the first thermal management component and / or within the receiving cavity.

[0031] By adopting the above technical solution, the heat dissipation structure can be enhanced to further improve the heat dissipation efficiency of the first thermal management component.

[0032] In some embodiments, the enhanced heat dissipation structure includes heat dissipation fins disposed on the outer surface of the second thermal management system.

[0033] By adopting the above technical solution, the heat dissipation fins increase the surface area of ​​the second thermal management component, improve its heat exchange efficiency, and enhance the phase change heat efficiency of the first cooling medium. When the power module is shut down, the heat dissipation fins increase the heat exchange between the second thermal management component and the environment, thereby raising the surface temperature of the second thermal management component and preventing condensation from forming at the power module.

[0034] In some embodiments, the materials of the first thermal management component and the second thermal management component include at least one of aluminum alloy, copper, plastic, and ceramic.

[0035] By adopting the above technical solution, the first thermal management component and the second thermal management component can serve as carriers for the first cooling medium and the second cooling medium, respectively, by selecting appropriate materials.

[0036] In some embodiments, the thermal management component further includes a water collector attached to the outer surface of the first thermal management component, wherein one end of the water collector has a water collection trough for collecting condensate.

[0037] By adopting the above technical solution, the water collector can collect the condensate on the outside of the first thermal management component, further reducing the impact of condensate on the power module.

[0038] In some embodiments, the water collector includes a water collecting body and a connecting pipe connected to the water collecting body. The water collecting tank is formed on the water collecting body, and the water collecting body surrounds the outside of the condensation section. One end of the connecting pipe is connected to the water collecting tank, and the other end is used to discharge condensate.

[0039] The main water collection unit surrounds the outside of the condensation section, thus preventing condensate from flowing into the evaporation section and affecting the power module; the connecting pipe is located below the water collection tank, which can discharge the condensate collected in the water collection tank to the outside.

[0040] In some embodiments, the thermal management component further includes a liquid filling connector, which is disposed on the first thermal management component and communicates with the receiving cavity. The liquid filling connector is used to fill the receiving cavity with the first cooling medium.

[0041] The filling connector allows the first cooling medium to be filled into the housing cavity, enabling the thermal management components to be used for a longer period of time and extending their service life.

[0042] In some embodiments, the filling connector is detachably connected to the first thermal management component.

[0043] By adopting the above technical solution, a detachable liquid filling connector is designed on the first thermal management component, which enables periodic replacement of the liquid filling connector and repeated liquid filling, thereby improving the service life of the thermal management component.

[0044] In some embodiments, the fluid-filled connector includes a connecting section, a welding section, and a cutting section connected in sequence. The connecting section is detachably connected to the first thermal management component. The welding section and the cutting section are both tubular and separable.

[0045] By adopting the above technical solution, the filling connector is easy to replace and can be resealed after filling without damaging the sealing performance of the first thermal management component.

[0046] In some embodiments, the inner wall of the first thermal management component is provided with a plurality of support structures within the evaporation section, the support structures extending from an inner surface of the first thermal management component into the interior of the receiving cavity.

[0047] By adopting the above technical solution, the support structure increases the heat transfer area from the heat source to the first cooling medium, and also enhances the support force of the first thermal management component pressed on both sides.

[0048] In some embodiments, the support structure is in the shape of an arc-shaped plate, and multiple support structures are arranged in multiple rings.

[0049] The support structure provided in this application embodiment can be adapted to the shape and size of the power module, thereby improving the contact area and heat transfer efficiency of the support structure.

[0050] In some embodiments, the inner wall of the receiving cavity is provided with a capillary structure; and / or, along the direction of gravity, the condensation section is located above the evaporation section.

[0051] By adopting the above technical solution, the thermal management component can use the capillary force and / or gravity of the capillary structure to return the first cooling medium, which has been condensed into a liquid state, to the evaporation section, thereby realizing the circulation of the first cooling medium in the containment cavity.

[0052] An embodiment of the second aspect of this application provides a power module system, comprising:

[0053] The thermal management components as described in the first aspect;

[0054] The power module is configured to correspond to the evaporation section of the first thermal management component.

[0055] By adopting the above technical solution, the thermal management component can dissipate heat from the power module, reducing the probability of condensation on the power module and the thermal management component, thereby reducing the risk of short circuit caused by condensation.

[0056] In some embodiments, the number of thermal management components is multiple, and the power module system further includes heat exchange pipelines that connect the flow channels of the multiple thermal management components.

[0057] By adopting the above technical solution, the heat exchange pipeline can enable the second cooling medium to circulate within multiple second heat management components, forming a heat dissipation circuit with high heat dissipation efficiency.

[0058] An embodiment of the third aspect of this application proposes an energy storage system including the power module system as described in the second aspect.

[0059] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0060] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0061] Figure 1 A perspective view of a thermal management component and a power device provided in an embodiment of this application;

[0062] Figure 2 A perspective view of a thermal management component provided in an embodiment of this application;

[0063] Figure 3 for Figure 2 The exploded 3D view of the thermal management component after the cover plate has been removed;

[0064] Figure 4 for Figure 2 A three-dimensional schematic diagram of the first thermal management component in the thermal management assembly after the cover plate has been removed;

[0065] Figure 5 for Figure 3 A top view of the second thermal management component in the thermal management assembly shown;

[0066] Figure 6 for Figure 5 The second thermal management component shown is a cross-sectional view along line AA.

[0067] Figure 7 for Figure 5 The second thermal management component shown is a cross-sectional view along line BB.

[0068] Figure 8 for Figure 2 A three-dimensional schematic diagram of the seal in the thermal management component shown;

[0069] Figure 9 for Figure 2 A three-dimensional schematic diagram of the liquid filling joint in the thermal management component shown;

[0070] Figure 10 This is a schematic diagram of the structure of a power module system provided in an embodiment of this application;

[0071] Figure 11 for Figure 10 A schematic diagram of the power module system from another angle;

[0072] Figure 12 for Figure 10 A magnified view of part C in the power module system shown.

[0073] The markings in the diagram mean:

[0074] 100. Thermal management components;

[0075] 10. First thermal management component; 101. Receiving cavity; 1011. Evaporation section; 1012. Condensation section; 102. First hole; 11. First shell; 111. Receiving shell; 112. Cover plate; 12. Support structure;

[0076] 20. Second thermal management component; 21. Flow channel; 211. First sub-flow channel; 212. Second sub-flow channel; 22. Second housing; 221. Heat dissipation fins;

[0077] 30. Connecting pipe;

[0078] 40. Seal; 401. Second hole; 41. First part; 42. Second part;

[0079] 50. Water collector; 51. Water collection body; 511. Water collection tank; 52. Connecting pipe;

[0080] 60. Fluid filling connector; 61. Connecting section; 62. Welding section; 63. Cutting section; 64. Sealing ring; 601. Cutting surface;

[0081] 200. Power module;

[0082] 300. Heat exchange piping; 311. Main inlet pipe; 3111. Medium inlet; 312. Sub-pipe; 321. Main outlet pipe; 3211. Medium outlet; 322. Sub-pipe;

[0083] 1000, Power Module System. Detailed Implementation

[0084] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0085] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0086] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0087] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0088] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0089] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0090] In the description of the embodiments of this application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0091] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0092] Currently, power devices generate a lot of heat when they are working. In addition to affecting their working efficiency, heat dissipation problems also directly affect their service life. Water cooling can effectively remove the heat, but it is easy for condensation to form on the outside of the power module, which can lead to the risk of short circuit.

[0093] Research has found that when the power module is started, condensation is easily generated at the inlet of the liquid cooling plate of the power module when the inlet water temperature is lower than the air dew point temperature; when the power module is not started, the inlet water temperature is more easily conducted to the power module due to the absence of the heating effect of the power module, resulting in the generation of a large area of ​​condensation.

[0094] In view of this, this application provides a thermal management component, a power module system, and an energy storage system. The thermal management component includes a first thermal management component and a second thermal management component. The first thermal management component has a receiving cavity, which includes an evaporation section and a condensation section that are connected to each other. The receiving cavity is used to receive a first cooling medium. The second thermal management component is received in the condensation section and has a flow channel for the flow of the second cooling medium.

[0095] The evaporation section of the first thermal management component is used to adhere to the power module, and the evaporation section can exchange heat with the power module, causing the first cooling medium to evaporate into a gas. The second thermal management component is used to exchange heat with the first cooling medium, causing the first cooling medium to condense into a liquid. The first cooling medium absorbs a large amount of latent heat of phase change during the gas-liquid phase change process, thus the thermal management component can effectively dissipate heat from the power module. Since the second thermal management component is located inside the first thermal management component and far from the evaporation section, even if the temperature of the second cooling medium is lower than the valve hall temperature, condensation is unlikely to form on the surface of the power module. The thermal management component provided in this application can effectively dissipate heat from the power module while reducing the risk of condensation forming on the outside of the power module, thereby reducing the risk of short circuits caused by condensation. The "valve hall" is the building where the converter valve is installed, which is the external environment of the power module.

[0096] Please refer to Figure 1 This application provides a thermal management component 100 for dissipating heat from a heat-generating structure. In this embodiment, the heat-generating structure is a power module 200, which is a module composed of power electronic devices combined according to certain functions and then encapsulated. It is understood that the heat-generating structure may also be other components or modules.

[0097] Please refer to Figures 1 to 4 The thermal management component 100 includes a first thermal management component 10 and a second thermal management component 20. The first thermal management component 10 has a receiving cavity 101, which includes an evaporation section 1011 and a condensation section 1012 that are connected to each other. The receiving cavity 101 is used to receive a first cooling medium. Please refer to... Figure 3 , Figures 5 to 7 The second thermal management component 20 is housed within the condensation section 1012, and the second thermal management component 20 is provided with a flow channel 21 for supplying the second cooling medium.

[0098] The first thermal management component 10 provides a mounting base for the second thermal management component 20. The first thermal management component 10 may be a cuboid, or in other embodiments, it may be a cylinder or other shapes. The first thermal management component 10 has a receiving cavity 101 for receiving a first cooling medium. The first cooling medium may be water or other cooling media capable of phase change.

[0099] The receiving cavity 101 includes an evaporation section 1011 and a condensation section 1012. The evaporation section 1011 is correspondingly disposed to the power module 200; for example, the evaporation section 1011 can be attached to the power module 200. The second thermal management component 20 is disposed within the condensation section 1012. The evaporation section 1011 and the condensation section 1012 are two parts of the same receiving cavity 101 divided according to function. In some embodiments, within the receiving cavity 101, the "condensation section" is the end where the second thermal management component 20 is located, and the "evaporation section" is the remaining part of the receiving cavity 101. The evaporation section 1011 and the condensation section 1012 can also be divided in other ways.

[0100] The second heat management component 20 is disposed within the condensation section 1012. The second heat management component 20 may be cuboid or other shapes. A flow channel 21 is provided within the second heat management component 20 for the flow of the second cooling medium. The second cooling medium may be water or other media. Since the second heat management component 20 is disposed within the receiving cavity 101 and located within the condensation section 1012, the second cooling medium can exchange heat with the first cooling medium, reducing the temperature of the receiving cavity 101 and promoting the condensation of the first cooling medium. It can be understood that the receiving cavity 101 is a closed cavity disposed within the first heat management component 10, and the flow channel 21 is disposed within the second heat management component 20. The flow channel 21 and the receiving cavity 101 are independent and not connected.

[0101] In use, the first cooling medium absorbs heat from the power module 200 in the evaporation section 1011 and evaporates into gas. During the phase change process, it absorbs a large amount of latent heat of phase change. The evaporated gas causes the internal gas pressure of the evaporation section 1011 to increase. The gas reaches the condensation section 1012 and undergoes sufficient heat exchange and condensation with the second thermal management component 20 in the condensation section 1012. It then flows back to the evaporation section 1011 through gravity or capillary action to continue the next cycle.

[0102] The thermal management component 100 provided in this embodiment includes a first thermal management component 10 and a second thermal management component 20. The evaporation section 1011 of the first thermal management component 10 can be attached to the power module 200 for heat exchange, causing the first cooling medium to evaporate into a gas. The second thermal management component 20 is used to exchange heat with the first cooling medium, causing the first cooling medium to condense into a liquid in the condensation section 1012. The first cooling medium absorbs a large amount of latent heat of phase change during the gas-liquid phase change process, thereby enabling the thermal management component 100 to effectively dissipate heat from the power module 200. Since the second thermal management component 20 is located inside the first thermal management component 10 and far away from the evaporation section 1011, even if the temperature of the second cooling medium is lower than the valve hall temperature, condensation is unlikely to occur at the medium inlet and on the surface of the power module 200. When the power module 200 is started, the housing cavity 101 of the thermal management component 100 can serve as a superconducting heat transfer channel to dissipate heat from the power module 200. When the power module 200 is not started, the first cooling medium does not undergo a large-scale phase change, and the housing cavity 101 can serve as an insulating channel to isolate heat transfer between the second thermal management component 20 and the power module 200, reducing the probability of condensation forming outside the power module 200. Therefore, the thermal management component 100 provided in this application can effectively dissipate heat from the power module 200 while reducing the risk of condensation forming outside the power module 200, thereby reducing the risk of short circuits caused by condensation.

[0103] In some embodiments, at least one surface of the second thermal management component 20 is spaced apart from the inner wall of the receiving cavity 101.

[0104] At least one outer surface of the second thermal management component 20 is spaced apart from the inner wall of the receiving cavity 101, that is, there is a gap between the outer surface and the interior of the receiving cavity 101 and the two do not contact each other. In this way, there is less heat exchange between the outer shell of the second thermal management component 20 and the outer shell of the first thermal management component 10, and it is not easy for condensation to form on the outer surface of the first thermal management component 10.

[0105] like Figure 3 As shown, in some embodiments, each outer surface of the second thermal management component 20 is spaced apart from the inner wall of the receiving cavity 101.

[0106] The second heat management component 20 may include multiple outer surfaces; for example, the second heat management component 20 may be a cuboid with six outer surfaces. The receiving cavity 101 may be a cuboid wall with six inner walls, and each outer surface of the second heat management component 20 corresponds to one inner wall and is spaced apart. Of course, the second heat management component 20 and the receiving cavity 101 may also be other shapes.

[0107] Each outer surface of the second heat management component 20 is spaced apart from the inner wall of the receiving cavity 101, that is, there is a gap between each outer surface of the second heat management component 20 and the inner wall of the receiving cavity 101. In this way, the second heat management component 20 is suspended in the receiving cavity 101, and there is no heat exchange between the outer shell of the second heat management component 20 and the outer shell of the first heat management component 10. Therefore, after the second cooling medium enters the second heat management component 20, it is not easy for condensation to form on the outer surface of the first heat management component 10.

[0108] In some embodiments, the distance between the outer surface of the second thermal management component 20 and the inner wall of the receiving cavity 101 is greater than 2 mm.

[0109] In some embodiments, the outer surface of the second thermal management component 20 may be arranged parallel to and spaced apart from the inner wall of the receiving cavity 101, in which case the distance between the outer surface of the second thermal management component 20 and the inner wall of the receiving cavity 101 is equal everywhere. In some embodiments, the outer surface of the second thermal management component 20 is inclined to the corresponding inner wall of the receiving cavity 101, then the minimum distance between the outer surface and the inner wall is greater than 2 mm.

[0110] By adopting the above technical solution, the second thermal management component 20 does not contact the inner wall of the receiving cavity 101, thus isolating the cooling capacity of the second cooling medium from being transferred to the power module 200 and reducing the probability of condensation in the power module 200 and the first thermal management component 10.

[0111] Furthermore, in order to reduce the probability of the second thermal management component 20 coming into contact with the receiving cavity 101, the distance between the outer surface of the second thermal management component 20 and the inner wall of the receiving cavity 101 is greater than 3 mm.

[0112] In other embodiments, the distance between the outer surface of the second thermal management component 20 and the inner wall of the receiving cavity 101 may be less than or equal to 2 mm, and a heat insulation film may be attached between the outer surface of the second thermal management component 20 and the inner wall of the receiving cavity 101.

[0113] The first thermal management component 10 has a first hole 102. The thermal management component 100 also includes a connecting pipe 30, which is connected to the flow channel 21. The connecting pipe 30 extends to the outside of the first thermal management component 10 through the first hole 102.

[0114] The connecting pipe 30 is connected to the flow channel 21. Specifically, one end of the connecting pipe 30 is connected to the second heat management component 20 and communicates with the flow channel 21, while the other end extends to the outside of the first heat management component 10 through the first hole 102. The connecting pipe 30 is used to introduce the external second cooling medium flow channel 21 into the flow channel 21 and / or to discharge the second cooling medium in the flow channel 21 to the outside, so that the second cooling medium flows continuously in the flow channel 21 of the second heat management component 20, resulting in better heat dissipation of the second heat management component 20.

[0115] In some embodiments, the thermal management component 100 further includes a seal 40 located within a first hole 102 to seal the first hole 102; the seal 40 has a second hole 401, through which the connecting pipe 30 passes.

[0116] Since the first cooling medium is located in the receiving cavity 101, the receiving cavity 101 needs to be a sealed cavity with a certain degree of vacuum. Meanwhile, since the flow channel 21 in the second thermal management component 20 needs to be connected to the outside through the connecting pipe 30, the embodiment of this application provides a first hole 102 on the first thermal management component 10 and a sealing element 40 is provided in the first hole 102.

[0117] By adopting the above technical solution, the thermal management component 100 can use the sealing element 40 to seal the first hole 102, so that the receiving cavity 101 remains in a sealed state.

[0118] Please refer to Figures 1 to 7 In some embodiments, the first thermal management component 10 includes a first housing 11 with a receiving cavity 101, the second thermal management component 20 includes a second housing 22 with a flow channel 21, and the thermal conductivity of the sealing component 40 is less than that of the first housing 11, the second housing 22 and the connecting pipe 30.

[0119] The first housing 11 includes a receiving shell 111 and a cover plate 112 connected together, and the receiving shell 111 and the cover plate 112 together form a receiving cavity 101. The receiving shell 111 and the cover plate 112 can be connected by welding or by fasteners or other means.

[0120] Since the connecting pipe 30 is located within the second hole 401 of the sealing element 40, and the sealing element 40 is located within the first hole 102 of the first thermal management element 10, the sealing element 40 is located between the connecting pipe 30 and the first thermal management element 10. To reduce heat transfer between the second housing 22 and the first housing 11, the sealing element 40 in this embodiment is made of a material with low thermal conductivity. Specifically, the thermal conductivity of the sealing element 40 is lower than that of the first housing 11, the second housing 22, and the connecting pipe 30. The sealing element 40 is the only part that contacts the second thermal management element 20 and the first thermal management element 10. It supports the second thermal management element 20 suspended inside the first thermal management element 10, provides thermal insulation, and also seals the receiving cavity.

[0121] By adopting the above technical solution, the combination of the sealing element 40 and the connecting pipe 30 can fix the position of the second thermal management element 20 inside the receiving cavity 101; the low thermal conductivity of the sealing element 40 can increase the temperature difference between the second cooling medium inlet of the second thermal management element 20 and the receiving cavity 101.

[0122] In some embodiments, the seal 40 is one of a rubber component, a plastic component, or a resin component. The material of the seal 40 should be compatible with the first cooling medium. Thus, the seal 40 is made of an elastic material that is easy to deform, and the seal 40, being one of a rubber component, a plastic component, or a resin component, has a low thermal conductivity. In other embodiments, the seal 40 may also be made of other materials compatible with the first cooling medium.

[0123] Please refer to Figures 1 to 3 , Figure 8 In some embodiments, the seal 40 includes a first part 41 and a second part 42 connected together, a second hole 401 passing through the first part 41 and the second part 42, the first part 41 passing through the first hole 102, and the second part 42 located outside the first thermal management component 10.

[0124] Optionally, the cross-sectional dimension of the second part 42 is larger than that of the first part 41, and the cross-sectional dimension of the first part 41 matches the dimension of the first hole 102, so that the second part 42 can be stopped outside the first thermal management component 10.

[0125] Optionally, the second part 42 is hexagonal and the first part 41 is cylindrical, which facilitates placing the second part 42 on the outside of the first thermal management component 10 and placing the first part 41 in the first hole 102. It is understood that the first part 41 and the second part 42 may also be cylindrical or other shapes.

[0126] The first part 41 extends to one end of the receiving cavity 101 and covers the connecting pipe 30, reducing the probability of the connecting pipe 30 contacting the first outer shell; the second part 42 is located outside the first thermal management component 10, facilitating the installation and removal of the sealing component 40.

[0127] In other embodiments, the seal 40 may also consist only of the first part 41.

[0128] Since the second thermal management component 20 is suspended in the receiving cavity 101, at least one of the seal 40 and the connecting pipe 30 needs to support the second thermal management component 20. Therefore, at least one of the seal 40 and the connecting pipe 30 is made of a rigid material.

[0129] In some embodiments, the second thermal management component 20 is provided with two connecting pipes 30, which are respectively used for the inflow and outflow of the second cooling medium; there are two sealing elements 40 and two first holes 102, and each sealing element 40 is installed in the corresponding first hole 102 and allows one connecting pipe 30 to pass through.

[0130] Specifically, one connecting pipe 30 is used to supply the second cooling medium into the flow channel 21, and the other connecting pipe 30 is used to discharge the second cooling medium from the flow channel 21, so that the second cooling medium in the flow channel 21 flows continuously.

[0131] By adopting the above technical solution, the flow channel 21 in the second thermal management component 20 can continuously circulate the second cooling medium, and the power module 200 can share the water cooling system with the battery module.

[0132] In some embodiments, the connecting pipe 30 is a rigid pipe, which is used to support the second thermal management component 20, thereby spacing the second thermal management component 20 from the first thermal management component 10.

[0133] The connecting pipe 30 is a rigid pipe. For example, the connecting pipe 30 can be a metal pipe, a plastic pipe, or a pipe body made of other materials. It has a certain degree of hardness and strength and is not easily deformed.

[0134] Since the second thermal management component 20 is suspended in the receiving cavity 101 through the connecting pipe 30 and the sealing element 40, and the connecting pipe 30 is a rigid pipe, the connecting pipe 30 can effectively support the second thermal management component 20, so that the second thermal management component 20 is separated from the first thermal management component 10, and avoids the second thermal management component 20 from contacting the first thermal management component 10.

[0135] Within the receiving cavity of the first thermal management component 10, there may be one or more second thermal management components 20; the second thermal management components 20 are detachable, and if structural compatibility or aging problems occur with the second thermal management components 20, they can be disassembled for maintenance or replacement, thereby improving the reliability and lifespan of the thermal management components 100.

[0136] In another embodiment, the second thermal management component 20 can also be suspended within the receiving cavity 101 using support columns. For example, one end of the support column is fixed to the inner wall of the receiving cavity 101 and the other end is connected to the outer surface of the second thermal management component 20; the number of support columns can be one or more.

[0137] Please refer to Figures 5 to 7 The second thermal management component 20 has a flow channel 21 along its thickness direction. The flow channel 21 includes multiple sub-flow channels, which are connected in series and / or in parallel.

[0138] The second thermal management component 20 has a flow channel 21 along its thickness direction, meaning the sub-flow channels are located on the same layer. The charging and discharging characteristics of high-voltage energy storage projects result in a significant difference in heat dissipation on both sides of existing liquid cooling plates. Existing liquid cooling plates are typically designed with symmetrical upper and lower flow channels, resulting in an average flow distribution on both sides, which fails to fully utilize sufficient flow for effective heat dissipation. In this embodiment, since the second thermal management component 20 does not need to directly contact the power module 200, it does not require double-sided flow channels; a single flow channel 21 is sufficient. Therefore, the second thermal management component 20 can fully utilize the single-layer flow channel 21 for concentrated heat dissipation, improving heat dissipation efficiency.

[0139] Multiple sub-channels can be connected in series, parallel, or in a mixed configuration. A mixed configuration refers to multiple sub-channels that are connected in both series and parallel configurations. Each sub-channel can be strip-shaped, square, circular, or a microchannel. For example, in some embodiments, channel 21 includes multiple first sub-channels 211 connected in parallel, and a second sub-channel 212 connected in series with multiple first sub-channels 211. The channel 21 is configured by first connecting in parallel and then in series, which enhances the heat exchange effect of channel 21 and reduces the flow rate of the second cooling medium.

[0140] Since the second thermal management component 20 is arranged far away from the power module 200 in this embodiment, the area where the condensation section 1012 and the second thermal management component 20 are located is not limited by the position and size of the holes in the power module 200 area. Therefore, the size and form of the flow channel 21 can be freely designed. It can be a fully series structure, a fully parallel structure, or a series-parallel structure. Any design that can enhance its heat exchange efficiency and reduce flow resistance is acceptable.

[0141] In some embodiments, the first thermal management component 10 is provided with an enhanced heat dissipation structure, which is disposed on the outer surface of the first thermal management component 10 and / or within the receiving cavity 101.

[0142] The enhanced heat dissipation structure is used to enhance the heat dissipation performance of the first thermal management component 10. The enhanced heat dissipation structure can be a protruding structure that increases the heat dissipation surface area of ​​the first thermal management component 10, or it can be a capillary structure disposed within the receiving cavity 101. The first cooling medium can flow back to the evaporation heat source through the capillary structure, and the capillary structure improves the heat transfer coefficient of the first thermal management component 10. It is understood that the enhanced heat dissipation structure can also be other structures that can improve heat dissipation performance.

[0143] By adopting the above technical solution, the heat dissipation structure can be enhanced to further improve the heat dissipation efficiency of the first thermal management component 10.

[0144] In some embodiments, the enhanced heat dissipation structure is a heat dissipation fin 221 disposed on the outer surface of the second thermal management component 20.

[0145] The heat dissipation fins 221 are used to increase the heat exchange area of ​​the outer surface of the second thermal management component 20. Optionally, there are multiple heat dissipation fins 221, which are arranged in parallel and spaced apart on the outer surface of the second thermal management component 20.

[0146] Optionally, the second thermal management component 20 has multiple heat dissipation fins 221 on both opposite sides, that is, the second thermal management component 20 has multiple heat dissipation fins 221 on both opposite sides of the flow channel 21. It can be understood that the heat dissipation fins 221 may also be provided on only one or more sides of the second thermal management component 20.

[0147] By adopting the above technical solution, the heat dissipation fins 221 increase the surface area of ​​the second thermal management component 20, improve the heat exchange efficiency of the second thermal management component 20, and also improve the phase change heat transfer efficiency of the first cooling medium. When the power module 200 is shut down, the heat dissipation fins 221 increase the heat exchange between the second thermal management component 20 and the environment, thereby increasing the surface temperature of the second thermal management component 20 and preventing condensation from forming at the power module 200.

[0148] In some embodiments, the first cooling medium includes at least one of water, methanol, propane, ethylene glycol solution, R134a, R1233zd, R11, RE245fa2, and liquid metal.

[0149] The first cooling medium is contained in the receiving cavity 101 of the first thermal management component 10. It is a fluid medium connecting the evaporation section 1011 and the condensation section 1012, and is capable of heat exchange through phase change. The first cooling medium may include at least one of water (distilled water), methanol, propane, ethylene glycol solution, R134a, R1233zd, R11, RE245fa2, and liquid metal. It is understood that the first cooling medium may also be other types of refrigerants. It is understood that the first cooling medium may include one of the above-mentioned refrigerants, or at least two of the above-mentioned refrigerants, that is, the first cooling medium may be a mixture of multiple refrigerants mixed in a certain proportion.

[0150] By adopting the above technical solution, the first cooling medium can be a variety of refrigerants, which have a better heat exchange effect.

[0151] In some embodiments, the second cooling medium includes at least one of water and ethylene glycol solution.

[0152] The second cooling medium flows in the flow channel 21 of the second thermal management component 20. The second cooling medium can be at least one of water and ethylene glycol solution, and the second cooling medium can be shared with the water cooling system of the battery module.

[0153] By adopting the above technical solution, the second cooling medium can remove the heat from the condensation section 1012.

[0154] Optionally, the materials of the first thermal management component 10 and the second thermal management component 20 include at least one of aluminum alloy, copper, plastic, and ceramic.

[0155] In the thermal management component 100 provided in this application embodiment, the first thermal management component 10 and the second thermal management component 20 form a dual channel to respectively accommodate the first cooling medium and the second cooling medium. That is, the first cooling medium and the second cooling medium each have an independent carrier material. The carrier material may include, but is not limited to, at least one of aluminum alloy, copper, plastic and ceramic.

[0156] By adopting the above technical solution, the first thermal management component 10 serves as the carrier of the first cooling medium, and the second thermal management component 20 serves as the carrier of the second cooling medium, and appropriate materials can be selected for each.

[0157] Please refer to this again. Figure 1 The thermal management component 100 also includes a water collector 50 that is attached to the outer surface of the first thermal management component 10. One end of the water collector 50 has a water collection groove 511 for collecting condensate. The water collection groove 511 may be an annular groove with its opening facing upward.

[0158] In some cases, the temperature of the second cooling medium is too low when it is introduced, below the water vapor dew point temperature in the environment, causing condensation to form on the outer surface of the first thermal management component 10. The water collector 50 is used to collect the condensation formed on the outside of the thermal management component 100.

[0159] In order to collect condensate, the water collector 50 is attached to and in close contact with the outer surface of the first thermal management component 10, so that the condensate can fall into the water collection tank 511 and is not easily backflowed to the power module 200.

[0160] By setting up a water collector 50, the water collector 50 can collect the condensate on the outside of the first thermal management component 10, further reducing the impact of the condensate on the power module 200.

[0161] The water collector 50 includes a water collecting body 51 and a connecting pipe 52 connected to the water collecting body 51. A water collecting tank 511 is opened on the water collecting body 51. The water collecting body 51 surrounds the outside of the condensation section 1012. One end of the connecting pipe 52 is connected to the water collecting tank 511, and the other end is used to discharge condensate.

[0162] The water collection body 51 surrounds the outside of the condensation section 1012, so that the condensate is not easily flowed to the evaporation section 1011 and affects the power module 200; the connecting pipe 52 is located below the water collection tank 511 and can discharge the condensate collected in the water collection tank 511 to the outside.

[0163] Please refer to Figure 3 , Figure 9 The thermal management component 100 also includes a liquid filling connector 60, which is disposed on the first thermal management component 10 and connected to the receiving cavity 101. The liquid filling connector 60 is used to fill the receiving cavity 101 with a first cooling medium.

[0164] The first heat management component 10 is also provided with a through hole for installing the liquid filling connector 60, so that the liquid filling connector 60 can be inserted into the first heat management component 10 through the through hole. The liquid filling volume of the first cooling medium is generally 50% to 60% of the total volume capacity. The material of the liquid filling connector 60 can be aluminum, copper, stainless steel, or other metals, but it should be compatible with the first cooling medium.

[0165] The filling connector 60 can fill the receiving cavity 101 with a first cooling medium so that the thermal management component 100 can be used for a long time and the service life of the thermal management component 100 can be improved.

[0166] In some embodiments, the filling connector 60 is detachably connected to the first thermal management component 10.

[0167] The filling connector 60 can be detachably connected to the first thermal management component 10 through various connection methods. For example, the filling connector 60 can be threaded to the first thermal management component 10, or it can be connected to the first thermal management component 10 through detachable fasteners. The filling connector 60 can be removed from the first thermal management component 10 after filling and installed again when filling is required next time; the filling connector 60 can also be easily replaced.

[0168] By adopting the above technical solution, a detachable liquid filling connector 60 is designed on the first thermal management component 10, which realizes the periodic replacement of the liquid filling connector 60 and the repeated liquid filling, thereby improving the service life of the thermal management component 100.

[0169] In other embodiments, the filling connector 60 can also be fixedly connected to the first thermal management component 10. When it is necessary to refill, the filling connector 60 can be reopened.

[0170] The liquid filling connector 60 includes a connecting section 61, a welding section 62 and a cutting section 63 connected in sequence. The connecting section 61 is detachably connected to the first thermal management component 10. The welding section 62 and the cutting section 63 are both tubular and can be separated.

[0171] The connecting section 61 is detachably connected to the first thermal management component 10, thereby facilitating the replacement of the filling connector 60. Optionally, the filling connector 60 and the first thermal management component 10 can be connected by threads, or by snap-fit, fasteners, or other means.

[0172] The welding section 62 and the cutting section 63 are separable. The welding section 62 is then sealed by welding to keep the receiving cavity 101 sealed. Optionally, a cutting surface 601 is provided between the welding section 62 and the cutting section 63 to facilitate cutting of the welding section 62 and the cutting section 63 from the cutting surface 601.

[0173] In use, the filling connector 60 is installed on the first thermal management component 10. The connecting section 61 is connected to the receiving cavity 101. The welding section 62 and the cutting section 63 are both located outside the first thermal management component 10. The cutting section 63 is connected to an external fluid source, so that the filling connector 60 can fill the receiving cavity 101 with the first cooling medium. After filling, the welding section 62 and the cutting section 63 are cut off, and then the welding section 62 is sealed by welding, so that the receiving cavity 101 can be resealed.

[0174] When the next filling is required, disconnect the connecting section 61 from the first thermal management component 10, replace the new filling connector 60, and repeat the above filling steps.

[0175] Optionally, the filling connector 60 is located on the side of the first thermal management component 10. The structure of the filling connector 60 is not limited to this; optionally, the filling connector 60 can guarantee a service life of more than 35 to 40 years.

[0176] By adopting the above technical solution, the filling connector 60 is easy to replace and can be resealed after filling without compromising the sealing performance of the first thermal management component 10. In some embodiments, a sealing ring 64 is provided between the filling connector 60 and the surface of the first thermal management component 10.

[0177] The sealing ring 64 may be disposed between the connecting section 61 and the outer surface of the first thermal management component 10, or the sealing ring 64 may also be disposed between the connecting section 61 and the inner surface of the first thermal management component 10.

[0178] By providing a sealing ring 64 between the filling connector 60 and the first thermal management component 10, the sealing effect of the filling connector 60 after installation is further improved.

[0179] Please refer to this again. Figure 3 In some embodiments, the inner wall of the first thermal management component 10 is provided with a plurality of support structures 12 in the evaporation section 1011, and the support structures 12 extend from an inner surface of the first thermal management component 10 into the interior of the receiving cavity 101.

[0180] The support structure 12 extends along the thickness direction of the first thermal management component 10. The support structure 12 is used to support the first thermal management component 10 and to increase the heat dissipation surface area of ​​the evaporation section 1011. Optionally, the two ends of the support structure 12 are respectively connected to two opposing inner surfaces of the first thermal management component 10.

[0181] Optionally, the surface of the support structure 12 can also be improved by increasing the surface area and capillary structure through electrical discharge machining, surface-attached metal powder, metal fibers, or special processes to enhance its heat transfer performance.

[0182] By adopting the above technical solution, the support structure 12 increases the heat transfer area from the heat source to the first cooling medium, improves the area and heat transfer efficiency of heat flux density conduction to the interior, and also enhances the support force of the first thermal management component 10 pressed on both sides.

[0183] Please refer to Figure 1 and Figure 3 In some embodiments, the support structure 12 is in the shape of an arc plate, and multiple support structures 12 are arranged in multiple rings.

[0184] The support structure 12 is in the shape of an arc plate, and multiple support structures 12 in each ring are spaced apart to facilitate steam flow; the multiple rings of multiple support structures 12 can be arranged concentrically.

[0185] Since the power module 200 is circular, the support structure 12 provided in this embodiment can be adapted to the shape and size of the power module 200, thereby improving the contact area and heat transfer efficiency of the support structure 12.

[0186] The structure and arrangement of the support structure 12 can be varied. For example, the support structure 12 can also be cylindrical and arranged in an array.

[0187] In some embodiments, the inner wall of the receiving cavity 101 is provided with a capillary structure; and / or, along the direction of gravity, the condensation section 1012 is located above the evaporation section 1011.

[0188] The capillary structure is used to transport the liquid first cooling medium formed in the condensation section 1012 to the evaporation section 1011 by capillary force. The capillary structure can be a porous structure formed by sintering metal powder or metal mesh.

[0189] The thermal management component 100 can be placed vertically, along the direction of gravity. The condensing section 1012 is located above the evaporating section 1011, and the liquid first cooling medium formed in the condensing section 1012 can flow into the evaporating section 1011 under the action of gravity. The thermal management component 100 is placed vertically, meaning that the long side of the first thermal management component 10 is placed vertically, so that the condensing section 1012 is located above the evaporating section 1011, and the second thermal management component 20 is located above the first thermal management component 10.

[0190] It is understood that if the cavity 101 is provided with a capillary structure, the thermal management component 100 is not limited to being placed in the vertical direction.

[0191] By adopting the above technical solution, the thermal management component 100 can return the first cooling medium, which has been condensed into a liquid state, to the evaporation section 1011 through the capillary force and / or gravity of the capillary structure, thereby realizing the circulation of the first cooling medium in the receiving cavity 101.

[0192] Please refer to Figures 1 to 9In some embodiments, the thermal management component 100 includes a first thermal management component 10, a second thermal management component 20, two connecting pipes 30, and two seals 40. The seals 40 and connecting pipes 30 suspend the second thermal management component 20 in a receiving cavity 101, and the second outer shell of the second thermal management component 20 does not contact the first outer shell of the first thermal management component. The thermal management component 100 also includes a water collector 50 fitted to the outer surface of the first thermal management component 10, and a filling connector 60 detachably connected to the first thermal management component.

[0193] In some embodiments, the anisotropic equivalent thermal conductivity of the first thermal management component 10 can reach approximately 5000–20000 W / mK in both planar directions and approximately 140–160 W / mK in the longitudinal direction. The longitudinal direction refers to the thickness direction of the first thermal management component 10.

[0194] Please refer to Figures 1 to 12 The second aspect of this application provides a power module system 1000, including a thermal management component 100 as provided in the first aspect and a power module 200, wherein the power module 200 is configured correspondingly to the evaporation section 1011 of the first thermal management component 10.

[0195] The thermal management component 100 can dissipate heat from the power module 200, reducing the probability of condensation on the power module 200 and the thermal management component 100, thereby reducing the risk of short circuit caused by condensation.

[0196] In some embodiments, the number of thermal management components 100 is multiple, and the power module system 1000 further includes a heat exchange pipeline 300, which connects the flow channels 21 of the multiple thermal management components 100.

[0197] Optionally, the power module 200 and the thermal management component 100 are arranged alternately, with each power module 200 located between two adjacent thermal management components 100, and the two thermal management components 100 can dissipate heat from both sides of the power module 200.

[0198] The heat exchange pipeline 300 is connected to the flow channels 21 of multiple thermal management components 100, that is, the heat exchange pipeline 300 enables the second cooling medium to circulate within multiple second thermal management components 20 to form a heat dissipation circuit.

[0199] By adopting the above technical solution, the power module system 1000 can simultaneously dissipate heat from multiple power modules 200, resulting in high heat dissipation efficiency.

[0200] The heat exchange pipeline 300 includes an inlet main pipe 311, multiple inlet sub-pipes 312, an outlet main pipe 321, and multiple outlet sub-pipes 322. One end of the inlet sub-pipe 312 is connected to the inlet main pipe 311, and the other end is connected to a flow channel 21 in a corresponding second heat management component 20. One end of the inlet main pipe 311 is provided with a medium inlet 3111. The inlet main pipe 311 and the inlet sub-pipes 312 are used to input a second cooling medium into the flow channel 21. One end of the outlet sub-pipe 322 is connected to the outlet main pipe 321, and the other end is connected to a flow channel 21 in a corresponding second heat management component 20. One end of the outlet main pipe 321 is provided with a medium outlet 3211. The outlet main pipe 321 and the outlet sub-pipes 322 are used to discharge the second cooling medium from the flow channel 21.

[0201] By adopting the above technical solution, the heat exchange pipeline 300 can simultaneously connect multiple flow channels 21. The structure of the heat exchange pipeline 300 is simple and the transmission efficiency is high.

[0202] An embodiment of the third aspect of this application provides an energy storage system including a power module system 1000 as provided in the second aspect.

[0203] In some embodiments, the energy storage system further includes a battery module. Optionally, a second cooling medium circulates between the battery module and the power module system 1000, meaning the battery module and the power module 200 may share a water-cooling system. Of course, the battery module and the power module system 1000 may also not share a water-cooling system.

[0204] In new energy storage projects, due to the design requirement of sharing the water cooling system between the battery module and the power module 200, the inlet water temperature range of the power module 200 is approximately 18 to 21°C. However, with an ambient temperature of 55°C and relative humidity of 60% in the valve hall, traditional heat dissipation structures struggle to meet these requirements to ensure the normal operation of the power module 200 and prevent condensation risks. Controlling the valve hall temperature and humidity to ensure shared water cooling for both the power module 200 and the battery module results in very high system operating costs. Furthermore, even when the power module 200 is not running, the system's cooling flow continues, leading to condensation on the surface of the power module 200 and its heat dissipation components, potentially causing short circuits and other risks. The energy storage system provided in this application includes the thermal management component 100 provided in the first aspect. Through dual-path spatial coupling, it can perform superconducting heat transfer when the power module 200 is started, and play a thermal insulation role when the power module 200 is not started. While meeting the requirement that the battery module and the power module 200 share the water cooling system, it alleviates the problem of condensation at the liquid cooling inlet of the power module 200 and reduces the risk of system short circuit.

[0205] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A thermal management component, characterized in that, include: A first thermal management component has a receiving cavity, which includes an evaporation section and a condensation section connected to each other, and is used to receive a first cooling medium. The second thermal management component is housed within the condensation section. The second thermal management component has a flow channel for the flow of the second cooling medium. Each outer surface of the second thermal management component is spaced apart from the inner wall of the housing cavity.

2. The thermal management component as claimed in claim 1, characterized in that, The distance between the outer surface of the second thermal management component and the inner wall of the receiving cavity is greater than 2 mm.

3. The thermal management component as claimed in claim 1, characterized in that, The first thermal management component has a first hole, and the thermal management component also includes a connecting pipe, which is connected to the flow channel and extends through the first hole to the outside of the first thermal management component.

4. The thermal management component as claimed in claim 3, characterized in that, The thermal management component further includes a seal, which passes through the first hole to seal the first hole; the seal has a second hole, and the connecting pipe passes through the second hole.

5. The thermal management component as claimed in claim 4, characterized in that, The first thermal management component includes a first housing with the receiving cavity, and the second thermal management component includes a second housing with the flow channel. The thermal conductivity of the sealing element is less than the thermal conductivity of the first housing and the thermal conductivity of the second housing.

6. The thermal management component as claimed in claim 4, characterized in that, The sealing element includes a first part and a second part connected to each other, and the second hole passes through the first part and the second part; The first part is inserted into the first hole, and the second part is located outside the first thermal management component.

7. The thermal management component as claimed in claim 4, characterized in that, The second thermal management component is provided with two connecting pipes, which are respectively used for the inflow and outflow of the second cooling medium.

8. The thermal management component as claimed in claim 3, characterized in that, The connecting pipe is a rigid pipe, which is used to support the second thermal management component, thereby spacing the second thermal management component from the first thermal management component.

9. The thermal management component as claimed in any one of claims 1-8, characterized in that, The second thermal management component has a layer of the flow channel along its thickness direction, the flow channel including a plurality of sub-flow channels, the plurality of sub-flow channels being connected in series and / or in parallel.

10. The thermal management component as claimed in any one of claims 1-8, characterized in that, The first thermal management component is provided with an enhanced heat dissipation structure, which is located on the outer surface of the first thermal management component and / or inside the receiving cavity.

11. The thermal management component as claimed in claim 10, characterized in that, The enhanced heat dissipation structure includes heat dissipation fins disposed on the outer surface of the second thermal management system.

12. The thermal management component as claimed in any one of claims 1-8, characterized in that, The materials of the first thermal management component and the second thermal management component include at least one of aluminum alloy, copper, plastic, and ceramic.

13. The thermal management component as claimed in any one of claims 1-8, characterized in that, The thermal management component also includes a water collector attached to the outer surface of the first thermal management component. One end of the water collector has a water collection tank for collecting condensate.

14. The thermal management component as claimed in claim 13, characterized in that, The water collector includes a water collecting body and a connecting pipe connected to the water collecting body. The water collecting tank is opened on the water collecting body, and the water collecting body surrounds the outside of the condensation section. One end of the connecting pipe is connected to the water collecting tank, and the other end is used to discharge condensate.

15. The thermal management component as claimed in any one of claims 1-8, characterized in that, The thermal management component further includes a liquid filling connector, which is disposed on the first thermal management component and is connected to the receiving cavity. The liquid filling connector is used to fill the receiving cavity with the first cooling medium.

16. The thermal management component as claimed in claim 15, characterized in that, The filling connector is detachably connected to the first thermal management component.

17. The thermal management component as claimed in claim 16, characterized in that, The liquid filling connector includes a connecting section, a welding section and a cutting section connected in sequence. The connecting section is detachably connected to the first thermal management component, and the welding section and the cutting section are separable.

18. The thermal management component as claimed in any one of claims 1-8, characterized in that, The inner wall of the first thermal management component is provided with a plurality of support structures within the evaporation section, and the support structures extend from an inner surface of the first thermal management component into the interior of the receiving cavity.

19. The thermal management component as claimed in claim 18, characterized in that, The support structure is in the shape of an arc plate, and multiple support structures are arranged in multiple rings.

20. The thermal management component as claimed in any one of claims 1-8, characterized in that, The inner wall of the receiving cavity is provided with a capillary structure; and / or, Along the direction of gravity, the condensation section is located above the evaporation section.

21. A power module system, characterized in that, include: Thermal management component as described in any one of claims 1-20; The power module is configured to correspond to the evaporation section of the first thermal management component.

22. The power module system as described in claim 21, characterized in that, The number of thermal management components is multiple, and the power module system also includes heat exchange pipelines that connect the flow channels of multiple thermal management components.

23. An energy storage system, characterized in that, Includes the power module system as described in any one of claims 21-22.

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