A high-precision electroplating method for blind holes in high-density circuit boards

Abstract

The present invention discloses a high-precision electroplating method for blind holes in high-density circuit boards, comprising the following steps: after the blind holes of the first layer of circuit boards are processed, the circuit boards are fixed to a clamping assembly of an electroplating device, the circuit boards are moved by a lateral moving assembly of the electroplating device to a position directly above a primary electroplating tank of the electroplating device for copper flash plating, the circuit boards are driven by a vertical moving assembly of the electroplating device to move into the primary electroplating tank, and the circuit boards are subjected to copper flash plating by a rotating stirring assembly of the electroplating device. The electroplating device includes a workbench, a lateral moving assembly, a vertical moving assembly, a clamping assembly, a rotating stirring assembly, and a primary and secondary electroplating tanks disposed on the workbench. The high-precision electroplating method of the present invention improves the electroplating efficiency of blind holes in multi-layer circuit boards. After each layer of circuit boards is pressed together, blind holes are drilled, and the copper flash plating and hole-filling operations are repeated, thereby saving electroplating time and improving the efficiency of blind hole electroplating.

Description

Technical Field

[0001] The present invention relates to the field of circuit board manufacturing, and in particular to a high-precision electroplating method for blind holes in high-density circuit boards. Background Art

[0002] High-density circuit board, or HDI circuit board, is a circuit board with a higher line distribution density that uses micro blind via technology. During the manufacturing process of high-density circuit boards, blind vias are produced. Blind vias are ablated by a laser drilling machine. Blind vias are used to achieve conductive interconnection between the outer and inner layers of multilayer boards.

[0003] Blind hole plating for high-density circuit boards usually adopts a multiple-step continuous electroplating method, that is, blind holes are obtained by laser drilling, and then the blind holes are flash-plated with copper once, and then the holes are filled with electroplating again after the flash plating. Since high-density circuit boards are often made of multiple layers pressed together, after one layer of blind holes is opened, the first layer is electroplated and filled, and then the second layer is pressed with the first layer, and then the second layer is processed with blind holes. After each layer of blind holes is processed, copper electroplating is required, which is cumbersome and reduces the efficiency of blind hole plating. Summary of the Invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a high-precision electroplating method for blind holes in high-density circuit boards.

[0005] The object of the present invention is achieved through the following technical solutions:

[0006] A high-precision electroplating method for blind vias in high-density circuit boards comprises the following steps:

[0007] S1. After the blind hole processing of the first layer of circuit board is completed, the circuit board is fixed on the clamping component of the electroplating device. The circuit board is moved by the lateral moving component of the electroplating device to the top of the primary electroplating tank of the electroplating device for copper flash plating.

[0008] S2. The circuit board is moved into the primary electroplating tank by the vertical moving component of the electroplating device, and the circuit board is flash-plated with copper under the action of the rotating stirring component of the electroplating device.

[0009] S3. After the flash copper plating is completed, the circuit board is moved by the lateral moving component of the electroplating device to the top of the secondary electroplating tank of the electroplating device for electroplating and hole filling.

[0010] S4. The circuit board is moved into the secondary electroplating tank by the vertical moving component of the electroplating device. The circuit board is electroplated and filled with holes by the rotating stirring component of the electroplating device.

[0011] S5. After the blind hole plating operation of the first layer circuit board is completed, it is pressed together with the second layer circuit board, and steps S1 to S4 are repeated. The blind hole plating operation of the multi-layer circuit board is similar.

[0012] The electroplating device described in steps S1 to S4 of the high-precision electroplating method for blind vias in high-density circuit boards includes:

[0013] A workbench, a transverse moving component, a vertical moving component, a clamping component, a rotating stirring component and a primary electroplating pool and a secondary electroplating pool arranged on the workbench, the transverse moving component includes a first movable slide and a second movable slide symmetrically arranged on the upper surface of the workbench, a gantry is arranged between the first movable slide and the second movable slide, the vertical moving component is arranged below the gantry, the vertical moving component includes a number of vertical movable push rods, and a fixed platform is arranged below the number of the vertical movable push rods, the rotating stirring component includes a rotating disk arranged on the lower surface of the fixed platform, the clamping component includes a manipulator arranged on the lower surface of the rotating disk, and the manipulator clamps the circuit board and rotates driven by the rotating disk.

[0014] The first movable slide and the second movable slide are any one of a synchronous belt linear slide and a ball screw linear slide.

[0015] The vertically movable push rod is any one of an electric push rod, a hydraulic push rod and a pneumatic push rod.

[0016] There are two manipulators.

[0017] The beneficial effects of the present invention are:

[0018] The high-precision electroplating method of the present invention improves the electroplating efficiency of blind holes in multi-layer circuit boards. After each layer of circuit boards is pressed together and the blind holes are laser drilled, the circuit boards are moved to the primary electroplating tank under the drive of the lateral moving component of the electroplating device. The robot clamps the circuit boards and enters the primary electroplating tank under the drive of the vertical moving component. The rotating disk drives the circuit boards to rotate in the primary electroplating tank, fully contacting with the electroplating solution to complete the copper flash plating operation. Then the lateral moving component drives the circuit boards to the secondary electroplating tank to complete the electroplating and filling the holes. After each layer of circuit boards is pressed together, the blind holes are drilled, and the copper flash plating and electroplating and filling the holes are repeated, which saves electroplating time and improves the working efficiency of blind hole electroplating. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the structure of the electroplating device of the present invention;

[0020] Figure 2 is a top view of the electroplating device of the present invention;

[0021] Figure 3is a side view of the electroplating device of the present invention;

[0022] In the figure, 1-workbench, 2-primary electroplating tank, 3-secondary electroplating tank, 4-first movable slide, 5-second movable slide, 6-gantry, 7-vertical movable push rod, 8-fixed table, 9-rotating disk, 10-manipulator. DETAILED DESCRIPTION

[0023] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0024] like Figures 1 to 3 As shown, a high-precision electroplating method for blind holes in high-density circuit boards includes the following steps:

[0025] S1. After the blind hole processing of the first layer of circuit board is completed, the circuit board is fixed on the clamping component of the electroplating device. The circuit board is moved by the lateral moving component of the electroplating device to the top of the primary electroplating tank of the electroplating device for copper flash plating.

[0026] S2. The circuit board is moved into the primary electroplating tank by the vertical moving component of the electroplating device, and the circuit board is flash-plated with copper under the action of the rotating stirring component of the electroplating device.

[0027] S3. After the flash copper plating is completed, the circuit board is moved by the lateral moving component of the electroplating device to the top of the secondary electroplating tank of the electroplating device for electroplating and hole filling.

[0028] S4. The circuit board is moved into the secondary electroplating tank by the vertical moving component of the electroplating device. The circuit board is electroplated and filled with holes by the rotating stirring component of the electroplating device.

[0029] S5. After the blind hole plating operation of the first layer circuit board is completed, it is pressed together with the second layer circuit board, and steps S1 to S4 are repeated. The blind hole plating operation of the multi-layer circuit board is similar.

[0030] The electroplating device described in steps S1 to S4 of the high-precision electroplating method for blind vias in high-density circuit boards includes:

[0031] A workbench, a transverse moving component, a vertical moving component, a clamping component, a rotating stirring component and a primary electroplating pool and a secondary electroplating pool arranged on the workbench, the transverse moving component includes a first movable slide and a second movable slide symmetrically arranged on the upper surface of the workbench, a gantry is arranged between the first movable slide and the second movable slide, the vertical moving component is arranged below the gantry, the vertical moving component includes a number of vertical movable push rods, and a fixed platform is arranged below the number of the vertical movable push rods, the rotating stirring component includes a rotating disk arranged on the lower surface of the fixed platform, the clamping component includes a manipulator arranged on the lower surface of the rotating disk, and the manipulator clamps the circuit board and rotates driven by the rotating disk.

[0032] The first movable slide and the second movable slide are any one of a synchronous belt linear slide and a ball screw linear slide.

[0033] The vertically movable push rod is any one of an electric push rod, a hydraulic push rod and a pneumatic push rod.

[0034] There are two manipulators.

[0035] The high-precision electroplating method of the present invention improves the electroplating efficiency of blind holes in multi-layer circuit boards. After each layer of circuit boards is pressed together and the blind holes are laser drilled, the circuit boards are moved to the primary electroplating tank under the drive of the lateral moving component of the electroplating device. The robot clamps the circuit boards and enters the primary electroplating tank under the drive of the vertical moving component. The rotating disk drives the circuit boards to rotate in the primary electroplating tank, fully contacting with the electroplating solution to complete the copper flash plating operation. Then the lateral moving component drives the circuit boards to the secondary electroplating tank to complete the electroplating and filling the holes. After each layer of circuit boards is pressed together, the blind holes are drilled, and the copper flash plating and electroplating and filling the holes are repeated, which saves electroplating time and improves the working efficiency of blind hole electroplating.

[0036] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or substitute equivalents for some of the technical features. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A high-precision electroplating method for blind vias in high-density circuit boards, characterized by: The following steps are involved: S1. After the blind hole processing of the first layer of PCB is completed, the PCB is fixed to the clamping assembly of the electroplating device. The PCB is moved by the lateral movement assembly of the electroplating device to the top of the primary electroplating tank of the electroplating device for copper flash plating. S2. The circuit board is moved into the primary electroplating tank by the vertical moving component of the electroplating device, and the circuit board is flash-plated with copper under the action of the rotating stirring component of the electroplating device; S3. After the copper flash plating is completed, the circuit board is moved to the secondary plating tank of the electroplating device under the transfer of the lateral moving component of the electroplating device for electroplating and filling holes; S4. The circuit board is moved to the secondary plating tank by the vertical moving component of the electroplating device, and the circuit board is electroplated and filled under the action of the rotating stirring component of the electroplating device; S5. After the blind vias of the first layer of the circuit board are electroplated, they are pressed together with the second layer of the circuit board. Steps S1 to S4 are repeated, and the blind via electroplating operation of the multi-layer circuit board is repeated in the same way. The electroplating device described in steps S1 to S4 of the high-precision electroplating method for blind vias in high-density circuit boards includes: A workbench (1), a transverse moving assembly, a vertical moving assembly, a clamping assembly, a rotary stirring assembly, and a primary electroplating pool (2) and a secondary electroplating pool (3) arranged on the workbench (1); the transverse moving assembly comprises a first movable slide (4) and a second movable slide (5) symmetrically arranged on the upper surface of the workbench (1); a gantry (6) is arranged between the first movable slide (4) and the second movable slide (5); the vertical moving assembly is arranged below the gantry (6); the vertical moving assembly comprises a plurality of vertical movable push rods (7); a fixed platform (8) is arranged below the plurality of vertical movable push rods (7); the rotary stirring assembly comprises a rotating disc (9) arranged on the lower surface of the fixed platform (8); the clamping assembly comprises a manipulator (10) arranged on the lower surface of the rotating disc (9); the manipulator (10) clamps the circuit board and rotates under the drive of the rotating disc (9).

2. The high-precision electroplating method for blind vias in high-density circuit boards according to claim 1, characterized in that: The first movable slide (4) and the second movable slide (5) are any one of a synchronous belt linear slide and a ball screw linear slide.

3. The high-precision electroplating method for blind vias in high-density circuit boards according to claim 1, characterized in that: The vertically movable push rod (7) is any one of an electric push rod, a hydraulic push rod, and a pneumatic push rod.

4. The high-precision electroplating method for blind vias in high-density circuit boards according to claim 1, characterized in that: The number of the manipulators (10) is two.

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