Plating device and cleaning method for cleaning substrate holder

Abstract

Residual cleaning liquid after cleaning a substrate holder in a plating apparatus is removed. The plating apparatus includes: a substrate holder that holds a substrate and has electrical contacts for supplying power to the substrate; a holder cleaning tank for cleaning the substrate holder when not holding the substrate; a holder drying tank for drying the substrate holder after cleaning in the holder cleaning tank; and a transport device for transporting the substrate holder between the holder cleaning tank and the holder drying tank.

Description

Technical Field

[0001] The present application relates to a plating device and a cleaning method for cleaning a substrate holder. Background Art

[0002] In the past, there is a known device for inserting a substrate held on a substrate holder into a plating tank containing a plating solution in a vertical direction to perform electrolytic plating (for example, see Patent Document 1). In addition, there is also a known device for placing a substrate held on a substrate holder in a horizontal direction to perform electrolytic plating (for example, see Patent Document 2). The substrate holder used in such a plating device has: a sealing ring holder having a seal that seals the surface of the substrate and a base plate. The substrate holder seals the surface of the substrate to form a space that the plating solution does not enter. The substrate holder has an electrical contact in this space for contacting the surface of the substrate to allow current to flow to the substrate.

[0003] In such a substrate holder, the surface of the substrate is properly sealed to prevent the plating liquid from entering the above-mentioned space. However, due to abnormalities in the seal, the plating liquid occasionally enters the above-mentioned space. If the plating liquid enters the above-mentioned space, the plating liquid contacts the electrical contacts, which may corrode. Therefore, in the case where the substrate holder produces a so-called leakage and the plating liquid contacts the electrical contacts, it is necessary to clean the electrical contacts. In addition, after the plating process, the substrate and the substrate holder are cleaned together using a flushing module to flush away the residual plating liquid attached to the substrate holder. In addition, if the substrate holder is used repeatedly, there is a situation where foreign matter attaches to the seal or the electrical contacts. Therefore, it is preferred to regularly clean the seal and the electrical contacts of the substrate holder. In connection with this, there is a known cleaning device for cleaning the sealing components of the substrate holder (see patent document 3).

[0004] Patent Document 1: Japanese Patent No. 3979847

[0005] Patent Document 2: U.S. Patent Publication No. 2014 / 0318977

[0006] Patent Document 3: Japanese Patent Application Laid-Open No. 2008-45179

[0007] After cleaning a substrate holder in a cleaning device, if cleaning fluid remains on the holder, this can prevent the holder from being adequately sealed or lead to poor contact between the electrical contacts and the substrate. The aforementioned patent document does not address any measures to address residual cleaning fluid remaining on the holder. This issue is not limited to plating devices that place the electrical contacts in contact with the substrate in a space where the plating solution does not enter. It is also preferable to remove residual cleaning fluid from the holder even when the electrical contacts of the holder are immersed in the plating solution. Summary of the Invention

[0008] In view of the above practical situation, one of the objects of the present application is to remove the cleaning liquid remaining after cleaning the substrate holder in the plating device.

[0009] According to one embodiment, a plating device is proposed, which includes: a substrate holder, which holds a substrate and has an electrical contact for supplying power to the substrate; a holder cleaning tank, which is used to clean the substrate holder when the substrate holder is not holding the substrate; a holder drying tank, which is used to dry the substrate holder after being cleaned by the holder cleaning tank; and a conveying device, which is used to convey the substrate holder between the holder cleaning tank and the holder drying tank.

[0010] According to another embodiment, a cleaning method for cleaning a substrate holder in a plating device is proposed, wherein the substrate holder has an electrical contact for supplying power to the substrate, and the cleaning method includes: a process of transporting the substrate holder that does not hold the substrate to a cleaning tank by a transport device; a process of cleaning the substrate holder in the cleaning tank; a process of transporting the cleaned substrate holder from the cleaning tank to a drying tank; and a process of drying the substrate holder in the drying tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is an overall layout diagram of a plating apparatus according to one embodiment of the present invention.

[0012] Figure 2 It is a front view schematically showing a substrate holder according to one embodiment.

[0013] Figure 3 Observed from the AA-AA direction Figure 2 A cross-sectional view of a substrate holder is shown, with the substrate holder in a locked state.

[0014] Figure 4 Observed from the AA-AA direction Figure 2 A cross-sectional view of a substrate holder is shown, wherein the substrate holder is in a semi-locked state.

[0015] Figure 5 It is a perspective view schematically showing the structure of the holder cleaning module according to the present embodiment.

[0016] Figure 6 It is schematically represented Figure 5 Diagram showing the location of the cleaning fluid nozzles within the cage cleaning module.

[0017] Figure 7 This is a diagram schematically showing the outline of the structure of the fixture drying module according to the present embodiment.

[0018] Figure 8 yes Figure 7 Front view of the cage drying module shown.

[0019] Figure 9 yes Figure 7 A side cross-sectional view of a cage drying module is shown.

[0020] Figure 10 It is a cross-sectional perspective view schematically showing the structures of the holder drying tank and the heating mechanism according to the present embodiment.

[0021] Figure 11 This is a diagram schematically showing a first example of the retainer insertion port of the retainer drying tank according to the present embodiment.

[0022] Figure 12 This is a diagram schematically showing a second example of the retainer insertion port of the retainer drying tank according to the present embodiment.

[0023] Figure 13 This is a flowchart showing an example of a cleaning process of a substrate holder in the plating apparatus according to the present embodiment. DETAILED DESCRIPTION

[0024] An embodiment of the present invention is described below with reference to the accompanying drawings. The drawings are schematic diagrams. Therefore, the size, position, and shape of the components shown may differ from those in actual devices. In the following description and the accompanying drawings, identical reference numerals are used for components that may have the same configuration, and duplicate descriptions are omitted.

[0025] Figure 1 This is an overall configuration diagram of a plating device according to an embodiment of the present invention. The plating object in this embodiment is a substrate such as a semiconductor wafer. The substrate includes a square substrate such as a quadrilateral or hexagonal substrate and a circular substrate. Figure 1 As shown, the plating device 100 is roughly divided into a process of loading a substrate on a substrate holder (in Figure 1 1 and 2. The loading port 110 for unloading substrates from the substrate holder and the processing module 120 for processing the substrates may be configured as follows: FIG.

[0026] The loading port 110 has a configuration adjustment mechanism 26, a handling robot 27 and a fixing station 29. As an example, in the present embodiment, the loading port 110 has two configuration adjustment mechanisms 26, namely a configuration adjustment mechanism 26A for accepting the loading of substrates before processing and a configuration adjustment mechanism 26B for accepting the unloading of substrates after processing. In addition, the configuration adjustment mechanism 26 is not limited to the configuration adjustment mechanisms 26A and 26B for loading and unloading, and can also be used separately without distinguishing between loading and unloading. In addition, in the present embodiment, the loading port 110 has two fixing stations 29. The two fixing stations 29 are the same mechanism, and the idle side (the side that does not accept the substrate) is used. In addition, the configuration adjustment mechanism 26 and the fixing station 29 can also be provided with one or more than three, respectively, according to the space in the plating device 100.

[0027] By the robot 24 from a plurality of (as an example, in Figure 1 The cassette stage 25 (three in total) transports substrates to the configuration adjustment mechanism 26 (the configuration adjustment mechanism 26A for loading). The cassette stage 25 includes a cassette 25a for storing substrates. The cassette is, for example, a front-opening wafer transfer box. The configuration adjustment mechanism 26 is configured to adjust (align) the position and orientation of the loaded substrate. A transport robot 27 is disposed between the configuration adjustment mechanism 26 and the fixed station 29 to transport substrates therebetween. The transport robot 27 is configured to transport substrates between the configuration adjustment mechanism 26 and the fixed station 29. In addition, a stocker 30 for storing substrate holders is provided near the fixed station 29.

[0028] The processing module 120 of the plating device 100 has a storage container 30, a holder drying tank 60 in the holder drying module, a holder cleaning tank 50 in the holder cleaning module, a pre-wetting tank 32, a temporary placement table 34, a pre-preg tank 36, a blowing tank 44, a rinsing tank 42 (42A~42C) and a plating tank 40 (40A~40C) in the plating module.

[0029] The substrate holder is stored and temporarily placed in the storage container 30. In the holder cleaning tank 50, the substrate holder is cleaned without holding the substrate. In the holder drying tank 60, the substrate holder cleaned in the holder cleaning tank 50 is dried. In the pre-wetting tank 32, the substrate is immersed in pure water. The substrate holder is temporarily placed once in the temporary placement table 34. In the pre-preg tank 36, the oxide film on the surface of the conductive layer such as the seed layer formed on the surface of the substrate is etched away. In the blowing tank 44, the substrate is de-liquidated after cleaning. In the rinsing tank 42, the substrate after plating is cleaned together with the substrate holder with the rinsing liquid. In the plating tank 40, the substrate holder holding the substrate is accommodated and the substrate is immersed in the plating liquid held inside to perform copper plating or other plating on the substrate surface. As an example, the stocker 30, the holder drying tank 60, the holder cleaning tank 50, the pre-wetting tank 32, the pre-preg tank 36, the blowing tank 44, the rinsing tank 42 and the plating tank 40 are arranged in this order. In addition, although not limited, in this embodiment, the plating tank 40 is provided with a plurality of (as an example, in Figure 1 There are three in the figure), and a plurality of rinse tanks 42 are provided corresponding to the plating tanks 40A to 40C.

[0030] The plating apparatus 100 includes a transport device 37 located to the side of each of these devices. This transport device 37 uses, for example, a linear motor to transport substrate holders between these devices. The transport device 37 is configured to transport substrate holders between the fixing station 29, the stocker 30, the holder drying tank 60, the holder cleaning tank 50, the pre-wetting tank 32, the temporary placement table 34, the pre-preg tank 36, the blowing tank 44, the rinsing tank 42, and the plating tank 40.

[0031] The plating device 100 has a controller 175 configured to control the above-mentioned parts. The controller 175 has a memory 175B that stores a specified program, a CPU (Central Processing Unit) 175A that executes the program in the memory 175B, and a control module 175C that is implemented by the CPU 175A executing the program. The recording medium constituting the memory 175B may include one or more of any recording media such as ROM, RAM, hard disk, CD-ROM, DVD-ROM, and floppy disk. The programs stored in the memory 175B include, for example, a program for controlling the conveying of the conveying device 37 and a program for controlling the plating process in each plating tank 40. In addition, the controller 175 may also be configured to be able to communicate with an unillustrated upper controller that uniformly controls the plating device 100 and other related devices, and to exchange data with a database possessed by the upper controller.

[0032] An example of a series of plating processes performed by the plating apparatus 100 will be described. First, the robot 24 removes a substrate from the cassette 25a and transports the substrate to the configuration adjustment mechanism 26. The configuration adjustment mechanism 26 aligns the positions of the substrate's orientation flats, notches, and other components in a predetermined direction. The transport robot 27 delivers the substrate, whose configuration has been adjusted by the configuration adjustment mechanism 26, to the fixing station 29. Furthermore, the transport device 37 removes a substrate holder from the stocker 30 to the fixing station 29, where the substrate is held by the substrate holder.

[0033] The substrate held on the substrate holder is transported by the transport device 37 to the pre-wetting tank 32. In the pre-wetting tank 32, the substrate held on the substrate holder is subjected to a pre-wetting treatment. The transport device 37 transports the pre-wetting substrate to the pre-preg tank 36. In the pre-preg tank 36, the substrate held on the substrate holder is subjected to a pre-preg treatment. The transport device 37 transports the pre-preg substrate to the plating tank 40. In the plating tank 40, the substrate held on the substrate holder is subjected to a plating treatment.

[0034] The conveying device 37 conveys the substrate on which the plating treatment has been performed to the rinsing tank 42. In the rinsing tank 42, the substrate held on the substrate holder is subjected to a cleaning treatment. The conveying device 37 conveys the substrate on which the cleaning treatment has been performed to the blowing tank 44. In the blowing tank 44, the substrate held on the substrate holder is subjected to a drying treatment. The conveying device 37 conveys the substrate on which the drying treatment has been performed to the fixing station 29. In the fixing station 29, the substrate is unloaded from the substrate holder. The conveying robot 27 conveys the substrate from the fixing station 29 to the adjustment mechanism 28. Finally, the robot 24 receives the substrate from the adjustment mechanism 28 and conveys it to the box 25a. In addition, the substrate holder from which the substrate has been unloaded is stored in the stocker 30 by the conveying device 37.

[0035] Next, the substrate holder used in the plating apparatus 100 of this embodiment will be described. Figure 2 It is a front view schematically showing a substrate holder according to one embodiment. Figure 3 as well as Figure 4 Observed from the AA-AA direction Figure 2 1 shows a cross-sectional view of a substrate holder. The substrate holder 80 of this embodiment is used to hold a substrate by sandwiching it between frames. Specifically, the substrate holder 80 includes a front frame 802 and a rear frame 804, and is configured to sandwich and hold a substrate WF between the front frame 802 and the rear frame 804. The front frame 802 and the rear frame 804 are clamped by at least one, and preferably a plurality of, clampers 820.

[0036] An arm 812 is provided on the upper portion of the front frame 802. As an example, the transport device 37 is configured to transport the substrate holder 80 by gripping the arm 812. A shoulder electrode 846 may also be provided on the shoulder of the arm 812. Figure 2 In the example of FIG, two shoulder electrodes 846 are provided on both shoulders of the arm portion 812. The shoulder electrodes 846 are connected to electrodes (electrical contacts 840) that are in contact with the substrate WF via conductive paths (wiring or bus bars, etc.) not shown. Figure 3 ) is electrically connected. The plating apparatus 100 supplies the power required for the plating process to the substrate WF via the shoulder electrode 846. Here, "supplying power" may be replaced by "applying voltage" or "flowing current." In addition, in this embodiment, the arm portion 812 is connected to the front frame 802, but the arm portion 812 may be connected to the rear frame 804 instead of or in addition to this.

[0037] The front frame 802 and the rear frame 804 form a wiring accommodating portion 814. The wiring accommodating portion 814 is provided between the main body 803 of the front frame 802 and the main body 805 of the rear frame 804, and the arm portion 812. The wiring accommodating portion 814 is configured to define a space for accommodating wiring for electrically connecting the shoulder electrode 846 to the electrical contact 840 connected to the substrate WF. However, the substrate holder 80 does not necessarily need to include the wiring accommodating portion 814.

[0038] The main bodies 803 and 805 of the front frame 802 and the rear frame 804 are generally plate-shaped components. Openings 803a and 805a are formed in the central portion of each of the main bodies 803 and 805 for exposing the substrate WF to be held. The shape of the openings 803a and 805a preferably corresponds to the shape of the area (area to be plated) in the substrate WF where plating is to be performed. Figure 2 In the example shown, the openings 803a and 805a are square, but the present invention is not limited to this example, and the openings 803a and 805a may be formed in any shape such as a circle. Figure 2 In the illustrated example, the openings 803 a and 805 a are formed in the front frame 802 and the rear frame 804 , respectively. However, the opening 803 a may be formed only in the front frame 802 .

[0039] The front frame 802 and the rear frame 804 are clamped by the clamp 820. Figure 2 In the example shown, four clamps 820 are shown, but any number of clamps 820 may be provided. The front frame 802 and the rear frame 804 are clamped by the clamps 820 so as to be able to clamp and hold the substrate WF (also referred to as the "first state" or "locked state") (see Figure 3). In addition, as an example, the clamp 820 of this embodiment is configured to be able to take a "semi-locked state" (also referred to as a "second state"). The "semi-locked state" is not a locked state, but a state in which the front frame 802 and the rear frame 804 are not separated (refer to Figure 4 ). In the semi-locked state (second state), the front frame 802 and the rear frame 804 are kept apart compared to the locked state (first state). As a specific example, Figure 3 and Figure 4 In the example shown, the clamp 820 includes a pivotable hook 822, a locking claw 824a, and a semi-locking claw 824b. It should be noted that, as an example, the locking claw 824a and the semi-locking claw 824b may be mutually pivoted along the pivot axis of the hook 822 (in the embodiment of FIG. Figure 3 and Figure 4 For easy understanding, Figure 3 and Figure 4 In FIG, the half-locking claw 824b is indicated by a dotted line. Figure 3 As shown in FIG, by hooking the hook 822 on the locking claw 824a, the substrate WF is locked. Figure 4 As shown, the clamp 820 is in a semi-locked state by hooking the hook 822 on the semi-locking claw 824b. Figure 3 as well as Figure 4 In the example shown, it is not necessary to achieve the semi-locked state.

[0040] Next, a holder cleaning module and a holder drying module for cleaning and drying such substrate holders 80 will be described in detail. Figure 5 : is a perspective view schematically showing the structure of the holder cleaning module of this embodiment. Figure 6 It is schematically represented Figure 5 The position of the cleaning fluid nozzle in the cage cleaning module is shown in FIG. Figure 5 In FIG. 1 , the substrate holder 80 is housed in the holder cleaning tank 50. The holder cleaning module includes a holder cleaning tank 50 capable of housing the substrate holder 80 and is disposed in the processing module 120 (see FIG. 1 ). Figure 1 In the present embodiment, the holder cleaning tank 50 is configured to accommodate one substrate holder 80 , but may be configured to accommodate two or more substrate holders 80 .

[0041] The holder cleaning tank 50 includes an arm portion 812 for placing and supporting the substrate holder 80. The holder cleaning tank 50 is configured to include an inner tank 504 with an open upper surface for accommodating the substrate holder 80, and an outer tank 506 disposed around the inner tank 504 to accumulate cleaning liquid that overflows from the upper edge of the inner tank 504. Furthermore, the holder cleaning tank 50 is provided with a plurality of cleaning liquid nozzles 510 configured to spray a cleaning liquid such as pure water (DIW) toward the substrate holder 80. The plurality of cleaning liquid nozzles 510 are connected to a cleaning liquid supply source (not shown) via cleaning liquid piping 512. In this embodiment, the plurality of cleaning liquid nozzles 510 are fixed to a nozzle plate disposed along the front frame 802 and the rear frame 804 of the substrate holder 80. Alternatively, the plurality of cleaning liquid nozzles 510 may be disposed so as to be tilted inwardly or outwardly so as to spray cleaning liquid toward the electrical contacts 840 of the substrate holder 80. Furthermore, a drainage pipe 518 is connected to the bottom surface of the holder cleaning tank 50 , and is configured to be able to discharge the cleaning liquid in the holder cleaning tank 50 to the outside.

[0042] Such a holder cleaning tank 50 can accommodate substrate holders 80 that are not holding substrates WF and perform a cleaning process on the substrate holders 80. Here, the substrate holders 80 can also be accommodated in the holder cleaning tank 50 in the semi-locked state described above. In the holder cleaning tank 50, cleaning liquid is sprayed toward the substrate holders 80 from the cleaning liquid nozzles 510 to clean the substrate holders 80. At this time, the drain pipe 518 can be closed to allow the cleaning liquid to accumulate in the holder cleaning tank 50. Alternatively, the process of filling the inner tank 504 of the holder cleaning tank 50 with cleaning liquid and then opening the drain pipe 518 to drain the cleaning liquid from the holder cleaning tank 50 can be repeated multiple times. Rapidly draining the cleaning liquid from the drain pipe 518 can shorten the cleaning process. However, rapid drainage of the cleaning liquid may leave a large amount of cleaning liquid remaining in the substrate holders 80. Therefore, in the final step of draining the cleaning liquid from the holder cleaning tank 50, the cleaning liquid can be drained more slowly than in the previous drainage step. When the cleaning process in the holder cleaning tank 50 is completed, the substrate holder 80 is transported to the holder drying tank 60 by the transport device 37 .

[0043] Figure 7 Schematically shows the structure of the drying module of the holding rack of this embodiment. Figure 8 yes Figure 7 The front view of the cage drying module is shown, Figure 9 yes Figure 7 The side cross-section of the cage drying module is shown. Figures 7 to 9In FIG. 1 , two substrate holders 80 are stored in the holder drying tank 60. In this embodiment, the holder drying module includes a holder drying tank 60 capable of storing the substrate holders 80 and a heating mechanism 62, and is configured in the processing module 120 (see FIG. 1 ). Figure 1 ). The drying process of the substrate holder 80 tends to take longer than the cleaning process, so the holder drying tank 60 is preferably capable of accommodating a larger number of substrate holders 80 than the holder cleaning tank 50. As an example, in this embodiment, the holder drying tank 60 is configured to accommodate two substrate holders 80. However, this is not limited to such an example, and the holder drying tank 60 may also be configured to accommodate one or more than three substrate holders 80. In addition, the holder drying tank 60 has an arm portion 812 for placing the substrate holder 80 and a holder table 602 for supporting the substrate holder 80.

[0044] A heating mechanism 62 is connected to the holder drying tank 60. In this embodiment, the heating mechanism 62 is arranged in parallel with the holder drying tank 60 in the conveying direction of the substrate holder 80 by the conveying device 37. In addition, in this embodiment, a cover 64 is provided to prevent foreign matter such as liquid from falling from the substrate holder 80 or the conveying device 37 to the heating mechanism 62 (see FIG. Figure 1 However, the present invention is not limited to this example, and the heating mechanism 62 may be installed at any location, and the cover 64 may not be installed.

[0045] Figure 10 This is a cross-sectional perspective view schematically illustrating the structure of the holder drying tank 60 and the heating mechanism 62. The heating mechanism 62 includes a heater 622 for heating a gas such as air and a fan 624 for discharging the gas heated by the heater 622. The heating mechanism 62 is connected to the lower portion of the holder drying tank 60 (connecting chamber 644) via an elbow 626. The heater 622 can be any type of heating method, such as resistance heating. An exhaust duct 650 is connected to the side of the upper portion of the holder drying tank 60.

[0046] The holder drying tank 60 of this embodiment is provided with ventilation holes 648 defining the flow path of the gas supplied from the heating mechanism 62. Figure 9 and Figure 10As shown, the holder drying tank 60 of this embodiment is divided by a horizontally extending plate member 646 into an upper holder chamber 642 for accommodating substrate holders 80 and a lower connection chamber 644 connected to the heating mechanism 62. A ventilation hole 648 is formed in the plate member 646. The ventilation hole 648 is provided at a position corresponding to the vertically downward position between the front frame 802 and the rear frame 804 of the substrate holder 80. As a result, air supplied from the heating mechanism 62 to the holder drying tank 60 flows from the connection chamber 644 through the ventilation hole 648 to the holder chamber 642, being directed particularly between the front frame 802 and the rear frame 804. This allows the air to flow between the front frame 802 and the rear frame 804, where cleaning liquid is likely to remain, thereby promoting drying of the substrate holder 80. Furthermore, the air supplied from the heating mechanism 62 to the holder drying tank 60 is discharged to the outside through an exhaust duct 650 provided in the upper portion of the holder chamber 642. Furthermore, the holder drying tank 60 may include a guide for directing the gas between the front frame 802 and the rear frame 804 instead of the ventilation holes 648 or in addition thereto.

[0047] Figure 11 : is a diagram schematically showing a first example of a holder insertion port of the holder drying tank 60 of the present embodiment. A holder insertion port (opening) 660 for inserting the substrate holder 80 is formed on the upper surface of the holder drying tank 60. The holder insertion port 660 is preferably determined to have a size corresponding to the size of the substrate holder 80. In the present embodiment, the shape of the holder insertion port 660 is determined based on the outer shape of the front frame 802 and the rear frame 804 in the semi-locked state. Thereby, it is possible to suppress gas leakage from the holder insertion port 660 and improve the drying efficiency in the holder drying tank 60. In addition, in Figure 11 In the example shown, the holder insertion port 660 is provided with an elastic body 662 configured to contact the front frame 802 and the rear frame 804 to block the holder insertion port 660. Figure 11 In the example shown, the elastic body 662 includes an elastic body 662a that contacts the front frame 802 and an elastic body 662b that contacts the rear frame 804, but it may also be composed of only one of the two. Furthermore, as an example, the gap between the elastic bodies 662a and 662b may be formed to be smaller than the outer dimensions of the front frame 802 and the rear frame 804 in the semi-locked state. Furthermore, the elastic bodies 662a and 662b may be bent by inserting the substrate holder 80 into the holder insertion port 660, thereby contacting the front frame 802 and the rear frame 804, thereby blocking the holder insertion port 660. Any elastic body, such as resin or rubber, may be used as the elastic body 662. According to such an example, gas leakage from the holder drying tank 60 can be suppressed, thereby improving drying efficiency.

[0048] Figure 12: is a diagram schematically showing a second example of a holder insertion port of the holder drying tank 60 of this embodiment. As in the first example, the shape of the holder insertion port (opening) 660 is determined based on the outer shape of the front frame 802 and the rear frame 804 in the semi-locked state. In addition, the holder insertion port 660 of the second example is configured so that when the substrate holder 80 is accommodated in the holder drying tank 60, it is blocked by the substrate holder 80. In this embodiment, the arm portion 812 has a thickness greater than that of the front frame 802 and the rear frame 804 ( Figure 12 The length in the left-right direction in the substrate holder 80 is greater than the thickness thereof and has a shape that is larger than the holder insertion opening 660. Furthermore, when the substrate holder 80 is accommodated in the holder drying tank 60, the holder insertion opening 660 is blocked by the arm portion 812. In addition, in this case, the upper surface of the holder drying tank 60 in which the holder insertion opening 660 is formed may also constitute a holder stand 602 for supporting the arm portion 812. According to such an example, it is also possible to suppress gas leakage from the holder drying tank 60 and improve the drying efficiency. In addition, in the second example, the holder insertion opening 660 may also be configured to be blocked by other parts of the substrate holder 80 instead of the arm portion 812. As an example, the wiring accommodating portion 814 of the substrate holder 80 may also have a thickness that is greater than the thickness of the main bodies 803 and 805 of the front frame 802 and the rear frame 804 and have a shape that is larger than the holder insertion opening 660. Furthermore, the holder insertion port 660 may be blocked by the wiring accommodating portion 814 when the substrate holder 80 is stored in the holder drying tank 60 .

[0049] The rack drying module includes a temperature sensor 628 for detecting the air temperature of the heating mechanism 62 (see Figure 10 ) and a temperature sensor 632 for detecting the temperature in the holder drying tank 60 (refer to Figure 8 The temperatures detected by the temperature sensors 628 and 632 are sent to the controller 175 of the plating apparatus 100 and used by the controller 175 to control the holder drying module.

[0050] Figure 13 This is a flow chart illustrating an example of a substrate holder cleaning process in the plating apparatus of this embodiment. For example, this process is performed by the controller 175 of the plating apparatus 100. The controller 175 can execute the substrate holder cleaning process at any timing. For example, the controller 175 can also perform the cleaning process on the substrate holder 80 after the substrate holder 80 has been used for plating a predetermined number of times (e.g., several times).

[0051] In the cleaning process of the substrate holder, first, the substrate holder 80 that does not hold the substrate WF is transported to the holder cleaning tank 50 by the transport device 37 (step S12). At this time, the substrate holder 80 can be in a semi-locked state. As an example, the transport device 37 can also transport the substrate holder 80 from which the substrate WF has been unloaded at the fixing station 29 from the fixing station 29 to the holder cleaning tank 50. In addition, the transport device 37 can also transport the substrate holder 80 stored in the storage container 30 to the holder cleaning tank 50. In this case, the controller 175 can also remove the substrate holder 80 from the storage container 30 during the idle time of the transport device 37 to perform the cleaning process. In this embodiment, the substrate holder 80 is transported into the holder cleaning tank 50 by the transport device 37 holding the arm 812, and the arm 812 is placed on the holder table 502 to store the substrate holder 80 in the holder cleaning tank 50. When the substrate holder 80 is accommodated in the holder cleaning tank 50 , the substrate holder 80 is cleaned in the holder cleaning tank 50 (step S14 ).

[0052] When cleaning of the substrate holder 80 in the holder cleaning tank 50 is completed, the transport device 37 transports the substrate holder 80 from the holder cleaning tank 50 to the holder drying tank 60 (step S16). In this embodiment, the transport device 37 grasps the arm 812 to transport the substrate holder 80 from the holder cleaning tank 50 to the holder drying tank 60. The arm 812 is placed on the holder stage 602 to store the substrate holder 80 in the holder drying tank 60. Once the substrate holder 80 is stored in the holder drying tank 60, it is dried in the holder drying tank 60 (step S18).

[0053] Then, when the drying of the substrate holder 80 in the holder drying tank 60 is completed, the transport device 37 transports the substrate holder 80 from the holder drying tank 60 to the stocker 30 (step S20), thereby completing the cleaning process of the substrate holder 80. Alternatively, the transport device 37 may transport the substrate holder 80 to the fixing station 29 instead of the stocker 30, as needed.

[0054] As described above, the plating device 100 of this embodiment includes: a holder cleaning tank 50 for cleaning the substrate holder 80 when the substrate holder 80 does not hold the substrate WF; and a holder drying tank 60 for drying the cleaned substrate holder 80. As a result, the substrate holder 80 can be dried in the holder drying tank 60, and the cleaning liquid remaining after cleaning the substrate holder 80 can be removed. In addition, since the holder cleaning tank 50 and the holder drying tank 60 are provided separately, it is not necessary to remove the cleaning liquid attached to the tank during the cleaning process during the drying process, and the drying efficiency can be improved. In addition, since the holder cleaning tank 50 and the holder drying tank 60 are provided separately, it is possible to prevent the cleaning liquid from scattering toward the heating mechanism 62 and other mechanisms of the holder drying tank 60 during the cleaning process, and the device can be simplified.

[0055] The present invention can also be described in the following aspects.

[0056] [Method 1] According to Method 1, a plating apparatus is provided, comprising: a substrate holder that holds a substrate and has electrical contacts for supplying power to the substrate; a holder cleaning tank for cleaning the substrate holder when the substrate holder is not holding the substrate; a holder drying tank for drying the substrate holder after cleaning in the holder cleaning tank; and a transport device for transporting the substrate holder between the holder cleaning tank and the holder drying tank. According to Method 1, the holder drying tank is provided for drying the substrate holder after cleaning in the holder cleaning tank, thereby removing any residual cleaning liquid from the substrate holder after cleaning.

[0057] [Mode 2] According to Mode 2, in Mode 1, a heating mechanism is provided. The heating mechanism includes a fan and a heater and is configured to supply gas heated by the heater to the holder drying tank.

[0058] [Mode 3] According to Mode 3, in Mode 2, the substrate holder includes a front frame and a rear frame for holding the substrate by clamping the substrate, and the heating mechanism is configured to supply gas between the front frame and the rear frame. According to Mode 3, residual cleaning liquid after cleaning the substrate holder can be further removed.

[0059] [Mode 4] According to Mode 4, in Mode 2 or 3, the drying holder includes a ventilation hole defining a flow path for gas supplied from the heating mechanism, and the ventilation hole is located vertically below between the front frame and the rear frame when the substrate holder is stored in the drying holder. According to Mode 4, residual cleaning liquid after cleaning the substrate holder can be further removed.

[0060] [Mode 5] According to Mode 5, in any of Modes 1 to 4, the substrate holder includes: a front frame and a rear frame for holding the substrate by sandwiching the substrate; and an arm or a wiring accommodating portion connected to at least one of the front frame and the rear frame; the holder drying tank has an opening sized to accommodate the front frame and the rear frame, and the opening is configured to be blocked by the arm or the wiring accommodating portion when the substrate holder is stored in the holder drying tank. According to Mode 5, drying efficiency in the holder drying tank can be improved.

[0061] [Mode 6] According to Mode 6, in any of Modes 1 to 5, the substrate holder includes a front frame and a rear frame for holding the substrate by sandwiching the substrate, and the holder drying tank includes an opening sized to accommodate the front and rear frames, and an elastic member configured to contact at least one of the front and rear frames to close the opening when the substrate holder is housed in the holder drying tank. According to Mode 6, drying efficiency in the holder drying tank can be improved.

[0062] [Mode 7] According to Mode 7, in any of Modes 1 to 6, the substrate holder includes a front frame, a rear frame, and a clamp for clamping the front frame and the rear frame. The clamp is configured to hold the front frame and the rear frame in a first state in which the front frame and the rear frame clamp the substrate, and in a second state in which the distance between the front frame and the rear frame is greater than the first state. The transport device is configured to transport the substrate holder held in the second state to the holder cleaning tank and the holder drying tank. According to Mode 7, residual cleaning liquid after cleaning the substrate holder can be further removed.

[0063] [Mode 8] According to Mode 8, in any one of Modes 1 to 7, there is a storage container capable of storing a plurality of the substrate holders, and the conveying device is configured to convey the substrate holders stored in the storage container to the holder cleaning tank and the holder drying tank.

[0064] [Mode 9] According to Mode 9, in any one of Modes 1 to 8, a plating tank is provided, the substrate holder includes an arm portion mounted on a holder platform of the plating tank, the transport device is configured to transport the substrate holder by gripping the arm portion, and the holder cleaning tank and the holder drying tank each include a holder platform for mounting the arm portion of the substrate holder and supporting the substrate holder. According to Mode 9, the substrate holder can be supported in the holder cleaning tank and the holder drying tank using the arm portion of the holder platform mounted on the plating tank.

[0065] [Method 10] According to Method 10, a method for cleaning a substrate holder having electrical contacts for supplying power to a substrate in a plating apparatus is provided. The method comprises: transporting the substrate holder, which does not hold a substrate, to a cleaning tank using a transport device; cleaning the substrate holder in the cleaning tank; transporting the cleaned substrate holder from the cleaning tank to a drying tank; and drying the substrate holder in the drying tank. According to Method 10, the substrate holder cleaned in the holder cleaning tank can be dried in the holder drying tank, thereby removing any cleaning liquid remaining after cleaning the substrate holder.

[0066] The embodiments of the present invention have been described above, but the embodiments of the invention described above are for easy understanding of the present invention and do not limit the present invention. The present invention can be changed and improved without departing from its main purpose, and the present invention naturally includes its equivalents. In addition, within the scope of at least a part of the above-mentioned problem that can be solved or at least a part of the effect that can be achieved, any combination of the embodiments and modifications can be made, and any combination or omission of the various constituent elements described in the claims and the specification can be made. In addition, as the substrate of the object to be plated, not only a semiconductor wafer can be used, but also a glass substrate and a printed wiring substrate can be used.

[0067] Description of Reference Numerals

[0068] WF…substrate; 30…stocker; 32…pre-wetting tank; 36…pre-preg tank; 37…conveying device; 40, 40A to 40C…plating tank; 42, 42A to 42C…rinsing tank; 44…blowing tank; 50…holder cleaning tank; 60…holder drying tank; 62…heating mechanism; 64…hood; 80…substrate holder; 100…plating device; 175…controller; 502…holder stage; 510…cleaning Washing liquid nozzle; 602…holding frame; 622…heater; 624…fan; 648…ventilation hole; 650…exhaust duct; 660…holder insertion port (opening); 662…elastic body; 802…front frame; 804…rear frame; 812…arm; 814…wiring storage portion; 820…clamp; 822…hook; 824a…locking claw; 824b…semi-locking claw; 840…electrical contact.

Claims

1. A plating device, characterized in that: have: a substrate holder, which holds the substrate and has electrical contacts for supplying power to the substrate; a holder cleaning tank for cleaning the substrate holder when the substrate holder is not holding the substrate; a holder drying tank for drying the substrate holder after being cleaned in the holder cleaning tank; a transport device for transporting the substrate holder between the holder cleaning tank and the holder drying tank; as well as The heating mechanism includes a fan and a heater, and is configured to supply gas heated by the heater to the holder drying tank. The substrate holder includes a front frame and a rear frame for holding the substrate by sandwiching the substrate. The heating mechanism is configured to supply gas between the front frame and the rear frame.

2. The plating device according to claim 1, characterized in that The holder drying tank has ventilation holes defining a flow path of gas supplied from the heating mechanism, and the ventilation holes are located vertically below between the front frame and the rear frame when the substrate holder is accommodated in the holder drying tank.

3. A plating device, characterized in that: have: a substrate holder, which holds the substrate and has electrical contacts for supplying power to the substrate; a holder cleaning tank for cleaning the substrate holder when the substrate holder is not holding the substrate; a holder drying tank for drying the substrate holder after being cleaned in the holder cleaning tank; a transport device for transporting the substrate holder between the holder cleaning tank and the holder drying tank; as well as The heating mechanism includes a fan and a heater, and is configured to supply gas heated by the heater to the holder drying tank. The substrate holder comprises: a front frame and a rear frame for holding the substrate by sandwiching the substrate; and an arm portion or a wiring accommodating portion connected to at least one of the front frame and the rear frame, The holder drying tank has an opening having a size capable of inserting the front frame and the rear frame, and the opening is configured to be blocked by the arm portion or the wiring accommodating portion when the substrate holder is accommodated in the holder drying tank.

4. A plating device, characterized in that have: a substrate holder, which holds the substrate and has electrical contacts for supplying power to the substrate; a holder cleaning tank for cleaning the substrate holder when the substrate holder is not holding the substrate; a holder drying tank for drying the substrate holder after being cleaned in the holder cleaning tank; a transport device for transporting the substrate holder between the holder cleaning tank and the holder drying tank; as well as The heating mechanism includes a fan and a heater, and is configured to supply gas heated by the heater to the holder drying tank. The substrate holder includes a front frame and a rear frame for holding the substrate by sandwiching the substrate. The cage drying tank comprises: an opening having a size capable of inserting the front frame and the rear frame; and The elastic body is configured to contact at least one of the front frame and the rear frame to close the opening when the substrate holder is accommodated in the holder drying tank.

5. The plating device according to any one of claims 1 to 4, characterized in that The substrate holder includes a front frame, a rear frame, and a clamper for clamping the front frame and the rear frame. The clamper is configured to hold the front frame and the rear frame in a first state in which the substrate is clamped by the front frame and the rear frame, and in a second state in which the distance between the front frame and the rear frame is greater than the first state. The transport device is configured to transport the substrate holder held in the second state to the holder cleaning tank and the holder drying tank.

6. The plating device according to any one of claims 1 to 4, characterized in that The plating device includes a stocker capable of storing a plurality of the substrate holders. The transport device is configured to transport the substrate holder stored in the stocker to the holder cleaning tank and the holder drying tank.

7. The plating device according to any one of claims 1 to 4, characterized in that The plating device includes a plating tank, The substrate holder has an arm portion placed on a holder base of the plating tank. The transport device is configured to transport the substrate holder by gripping the arm portion. The holder cleaning tank and the holder drying tank each include a holder stand for placing the arm portion of the substrate holder and supporting the substrate holder.

8. A cleaning method for cleaning a substrate holder having electrical contacts for supplying power to a substrate in a plating apparatus, characterized in that: include: a step of transporting the substrate holder without holding the substrate to a cleaning tank by a transport device; a step of cleaning the substrate holder in the cleaning tank; a step of transporting the cleaned substrate holder from the cleaning tank to a drying tank; and a step of drying the substrate holder in the drying tank, The substrate holder includes a front frame and a rear frame for holding the substrate by sandwiching the substrate. The step of drying the substrate holder in the drying tank includes supplying gas from a heating mechanism including a fan and a heater to a space between the front frame and the rear frame.

9. A cleaning method for cleaning a substrate holder having electrical contacts for supplying power to a substrate in a plating apparatus, characterized in that: include: a step of transporting the substrate holder without holding the substrate to a cleaning tank by a transport device; a step of cleaning the substrate holder in the cleaning tank; a step of transporting the cleaned substrate holder from the cleaning tank to a drying tank; and a step of drying the substrate holder in the drying tank, The substrate holder comprises: a front frame and a rear frame for holding the substrate by sandwiching the substrate; and an arm portion or a wiring accommodating portion connected to at least one of the front frame and the rear frame, The drying tank has an opening of a size capable of inserting the front frame and the rear frame. The step of transferring the cleaned substrate holder from the cleaning tank to the drying tank includes: blocking the opening of the drying tank with the arm portion or the wiring accommodating portion of the substrate holder accommodated in the holder drying tank; The step of drying the substrate holder in the drying tank includes supplying heated gas from a heating mechanism including a fan and a heater to the holder drying tank.

10. A cleaning method for cleaning a substrate holder having electrical contacts for supplying power to a substrate in a plating apparatus, characterized in that: include: a step of transporting the substrate holder without holding the substrate to a cleaning tank by a transport device; a step of cleaning the substrate holder in the cleaning tank; a step of transporting the cleaned substrate holder from the cleaning tank to a drying tank; and a step of drying the substrate holder in the drying tank, The substrate holder includes a front frame and a rear frame for holding the substrate by sandwiching the substrate. The drying tank has an opening of a size capable of inserting the front frame and the rear frame. The step of conveying the cleaned substrate holder from the cleaning tank to the drying tank includes: causing an elastic body provided in the drying tank to contact at least one of the front frame and the rear frame to block the opening; The step of drying the substrate holder in the drying tank includes supplying heated gas from a heating mechanism including a fan and a heater to the holder drying tank.

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