Laser processing equipment

Abstract

The present application provides a laser processing device, which includes a laser module, a motion axis driving module, a thickness detection module, a host computer, and a slave computer. The laser module includes a laser light source module, a focusing lens, and a zoom driving module. The laser light source module is configured to emit a laser beam, and the zoom driving module is configured to drive the focusing lens to move; the motion axis driving module is configured to drive the laser module to move; the thickness detection module is configured to collect thickness information of a substrate to be processed; the host computer is configured to obtain material information of the substrate to be processed and receive thickness information of the substrate to be processed collected from the thickness detection module, and generate a file to be processed according to the material information, thickness information and a pattern to be processed; the slave computer is configured to receive the file to be processed from the host computer, and control the laser power, zoom parameters, and motion axis parameters according to the file to be processed, with a higher degree of automation.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a laser processing device. Background Art

[0002] With the development of laser technology, the application field and market scope of laser processing equipment have been expanding in recent years, and the performance and operator experience of laser processing equipment have also attracted more and more attention from the industry. How to provide a laser processing equipment with a higher degree of automation has become a technical problem that needs to be solved. Summary of the invention

[0003] The present application provides a laser processing device with a higher degree of automation.

[0004] The present application provides a laser processing device, the laser processing device comprising:

[0005] A laser module, the laser module comprising a laser light source module, a focusing lens, and a zoom driving module, the laser light source module being configured to emit a laser beam, the focusing lens being located on an optical path of the laser beam, the zoom driving module being connected to the focusing lens, and the zoom driving module being configured to drive the focusing lens to move so as to change a focal spot position and / or a beam angle of the laser beam;

[0006] A motion axis driving module, the motion axis driving module is connected to the laser module, and the motion axis driving module is configured to drive the laser module to move;

[0007] A thickness detection module, wherein the thickness detection module is configured to collect thickness information of the substrate to be processed;

[0008] A host computer, wherein the host computer is configured to obtain material information of the substrate to be processed and receive thickness information of the substrate to be processed collected by the thickness detection module, and generate a file to be processed according to the material information, the thickness information and the pattern to be processed, wherein the file to be processed includes a target power of a laser light source module, a target zoom motion parameter of the zoom driving module, and a target motion axis parameter of the motion axis driving module;

[0009] The lower computer is configured to receive the file to be processed from the upper computer, and control the power of the laser light source module to be the target power, control the zoom motion parameters of the zoom drive module to be the target zoom parameters, and control the motion axis parameters of the motion axis drive module to be the target motion axis parameters according to the file to be processed.

[0010] The present application provides a laser processing device, which includes a laser module, a motion axis drive module, a thickness detection module, a host computer, and a slave computer through design, wherein the laser module includes a laser light source module, a focusing lens, and a zoom drive module, the laser light source module is configured to emit a laser beam, the focusing lens is located on the optical path of the laser beam, the zoom drive module is connected to the focusing lens, and the zoom drive module is configured to drive the focusing lens to move to change the focal spot position and / or beam angle of the laser beam; the motion axis drive module is connected to the laser module, and the motion axis drive module is configured to drive the laser module to move; the thickness detection module is configured to collect thickness information of the substrate to be processed; the host computer is configured to obtain material information of the substrate to be processed and receive the thickness of the substrate to be processed collected from the thickness detection module. The information is obtained, and a file to be processed is generated according to the material information, the thickness information and the pattern to be processed, wherein the file to be processed includes the target power of the laser light source module, the target zoom motion parameters of the zoom drive module and the target motion axis parameters of the motion axis drive module; the lower computer is configured to receive the file to be processed from the upper computer, and control the power of the laser light source module to be the target power, the zoom motion parameters of the zoom drive module to be the target zoom parameters, and the motion axis parameters of the motion axis drive module to be the target motion axis parameters according to the file to be processed; it can be seen that the laser processing equipment provided by the present application can automatically identify the material and thickness of the substrate to be processed, and determine the suitable laser processing parameters according to the material and thickness of the substrate to be processed and the pattern to be processed, without manually inputting or selecting the material of the substrate to be processed, and has a higher degree of automation. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments are briefly introduced below.

[0012] Figure 1 It is a schematic diagram of the appearance structure of a laser processing device provided in an embodiment of the present application;

[0013] Figure 2 It is a schematic diagram of a partially disassembled structure of a laser processing device provided in an embodiment of the present application;

[0014] Figure 3 is a schematic structural diagram of a first laser module provided in an embodiment of the present application;

[0015] Figure 4 This is a first circuit block diagram of the laser processing equipment provided by the embodiment of the present application;

[0016] Figure 5 This is a schematic diagram of a first processing flow of the laser processing equipment provided in an embodiment of the present application;

[0017] Figure 6This is a second circuit block diagram of the laser processing equipment provided in the embodiment of the present application;

[0018] Figure 7 This is a schematic diagram of a second processing flow of the laser processing equipment provided in an embodiment of the present application;

[0019] Figure 8 is a schematic structural diagram of a second laser module provided in an embodiment of the present application;

[0020] Fig. 9 This is a third circuit block diagram of the laser processing equipment provided in the embodiment of the present application;

[0021] Fig.10 This is a schematic diagram of a third processing flow of the laser processing equipment provided in an embodiment of the present application;

[0022] Fig.11 This is a schematic diagram of a fourth processing flow of the laser processing equipment provided in an embodiment of the present application;

[0023] Fig.12 This is a fifth circuit block diagram of the laser processing equipment provided in the embodiment of the present application;

[0024] Fig.13 This is a fifth processing flow diagram of the laser processing equipment provided in the embodiment of the present application;

[0025] Fig.14 It is a partial structural schematic diagram of a laser processing device provided in an embodiment of the present application;

[0026] Fig.15 This is a sixth circuit block diagram of the laser processing equipment provided in the embodiment of the present application;

[0027] Fig.16 This is a sixth processing flow diagram of the laser processing equipment provided in the embodiment of the present application;

[0028] Fig.17 This is the internal view of the laser processing equipment provided by the embodiment of the present application. Figure 1 ;

[0029] Fig.18 This is the seventh circuit block diagram of the laser processing equipment provided in the embodiment of the present application;

[0030] Fig.19 This is a seventh processing flow diagram of the laser processing equipment provided in the embodiment of the present application;

[0031] Fig. 20 This is the internal view of the laser processing equipment provided by the embodiment of the present application. Figure 2 ;

[0032] Fig.21This is the internal view of the laser processing equipment provided by the embodiment of the present application. Figure 3 ;

[0033] Fig. 22 This is the internal view of the laser processing equipment provided by the embodiment of the present application. Figure 4 ;

[0034] Fig.23 is a cross-sectional schematic diagram of a laser module when a focusing lens provided in an embodiment of the present application is located at a certain position;

[0035] Fig.24 is a cross-sectional schematic diagram of a laser module when the focusing lens provided in an embodiment of the present application is located at another position;

[0036] Fig.25 This is a light path diagram when the focusing lens provided in an embodiment of the present application is located at a different position than the concave lens.

[0037] Description of Figure Numbers:

[0038] Laser processing equipment 1000; housing 900; laser module 100; motion axis drive module 200; thickness detection module 300; upper computer 400; lower computer 500; laser light source module 10; focusing lens 20; zoom drive module 30; lens holder 40; image acquisition module 600; material recognition module 700; position probe 310; lifting drive module 210; substrate to be processed 260; camera module 610; smoke exhaust component 220; smoke detection module 230; first smoke exhaust module 221; second smoke exhaust module 222; first smoke detector 231; engraved honeycomb panel 240; second smoke detector 232; drive motor 31; transmission rod 32; connecting nut 33; guide rod 34; position sensor 35; concave lens 60. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. In addition, the reference to "embodiment" or "implementation method" in the present application means that the specific features, structures or characteristics described in conjunction with the embodiments or implementation methods may be included in at least one embodiment of the present application. The appearance of the phrase in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in the present application can be combined with other embodiments.

[0040] The present application provides a laser processing device 1000. Applications of the laser processing device 1000 include, but are not limited to, engraving, cutting, welding, drilling, marking, 3D printing, etc. In this embodiment, the laser processing device 1000 takes the engraving mode or the cutting mode as an example to illustrate the structure, connection relationship, position relationship, mutual coordination relationship of electrical signals, etc. of each module in the laser processing device provided by the present application.

[0041] See also Figure 1-2 The laser processing equipment 1000 includes a housing 900 , a laser module 100 , a motion axis driving module 200 , a thickness detection module 300 , a host computer 400 and a slave computer 500 .

[0042] In some embodiments, the laser processing apparatus 1000 may not be provided with the housing 900 .

[0043] Among them, see Figure 3 The laser module 100 includes a laser light source module 10 , a focusing lens 20 , and a zoom driving module 30 .

[0044] Optionally, the laser light source module 10, the focusing lens 20, and the zoom driving module 30 can be packaged in the same housing to form a laser head.

[0045] The laser light source module 10 is located at a side away from the light outlet of the laser head (along the light path).

[0046] The laser light source module 10 is configured to emit a laser beam. The present application does not specifically limit the power of the laser light source module 10 to emit a laser beam. Optionally, the power emitted by the laser light source module 10 is 0 to 200w. Further, the power emitted by the laser light source module 10 is any one of 0 to 190w, 0 to 180w, 0 to 170w, 0 to 160w, 0 to 150w, 0 to 140w, 0 to 130w, 0 to 120w, 0 to 110w, 0 to 100w, 0 to 90w, 0 to 80w, 0 to 70w, 0 to 60w, 0 to 50w, 0 to 40w, 0 to 30w, 0 to 20w, 0 to 10w, and 0 to 5w. Of course, the rated power emitted by the laser light source module 10 can also be any vertical between less than 200w and greater than 0w, for example, the adjustable power range is 0 to 33w.

[0047] Alternatively, the power emitted by the laser light source module 10 is continuously adjustable within a rated power range. The structure of the laser light source module 10 is described below with examples.

[0048] There are many lenses in the laser module 100, and this application illustrates the lenses that are crucial to the concept of the present invention. However, this does not mean that the laser processing device 1000 in this application only includes the lenses described as examples. There are also some lenses, reflectors and other lenses required in the actual design process that can be adaptively added to the laser processing device 1000 in this application.

[0049] In the present application, the focusing lens 20 is located on the optical path of the laser beam. The focusing lens 20 is used to converge the laser beam on the optical path. Optionally, the focusing lens 20 is located between the laser light source module 10 and the light outlet of the laser head.

[0050] Optionally, the surface of the focusing lens 20 facing the image side in the optical axis direction is a convex surface. Optionally, the surface of the focusing lens 20 facing the image side in the optical axis direction may be a plane, a convex surface, or a concave surface. When the object side surface of the focusing lens 20 is a concave surface, the image side surface of the focusing lens 20 is a convex surface with a smaller curvature radius to achieve a focusing effect. In this embodiment, the object side surface of the focusing lens 20 is a plane, and the image side surface of the focusing lens 20 is a convex surface.

[0051] The present application is not limited to one or more focusing lenses 20. This embodiment takes one focusing lens 20 as an example. Other numbers of focusing lenses 20 refer to the inventive concept of moving one focusing lens 20 in this embodiment to achieve the focal spot position and / or beam angle, which also falls within the protection scope of the present application.

[0052] Optional, see Figure 3 , the zoom driving module 30 is connected to the focusing lens 20.

[0053] For details, please refer to Figure 3 The laser module 100 further includes a lens holder 40, and the focusing lens 20 is mounted on the lens holder 40. The lens holder 40 is arranged at the periphery of the focusing lens 20, and is used to protect the focusing lens 20 and to be assembled and connected with other structures. The zoom driving module 30 can be arranged on the side of the laser beam optical path to avoid blocking the laser beam optical path. Further, the zoom driving module 30 is arranged on one side of the lens holder 40 and connected to the lens holder 40.

[0054] See also Figure 3 The zoom driving module 30 is configured to drive the focusing lens 20 to move so as to change the focal spot position and / or beam angle of the laser beam.

[0055] Specifically, the zoom drive module 30 is configured to drive the focusing lens 20 to move along the optical axis. Taking the optical axis direction of the focusing lens 20 as the Y direction as an example, the zoom drive module 30 can drive the focusing lens 20 to move along the Y-axis direction, and this movement can be along the +Y direction and the -Y direction. When the position of the focusing lens 20 moves, the focal spot position of the laser beam changes accordingly, and the focal spot of the laser beam can be projected onto the surface of the substrate 260 to be processed with different thicknesses. When the position of the focusing lens 20 moves, the focal spot position of the laser beam changes accordingly, and when different modes are switched, the focal spot of the laser beam can be moved from the surface of the substrate 260 to be processed to a certain depth position inside the substrate 260 to be processed. When the position of the focusing lens 20 moves, the focal spot position of the laser beam changes accordingly, and the size of the beam angle can be changed when the height of the focal spot of the laser beam remains unchanged, so as to achieve the switching of different modes when the height of the focal spot of the laser beam remains unchanged. When the position of the focusing lens 20 is moved, the focal spot position of the laser beam changes accordingly. The height of the focal spot of the laser beam and the size of the beam angle can also be changed to achieve switching of different processing modes on the substrate 260 to be processed with different thicknesses / materials.

[0056] The driving mode of the zoom driving module 30 includes but is not limited to magnetic driving, electric driving, manual driving, etc. Specific examples will be given later.

[0057] See also Figure 2 , the motion axis driving module 200 is connected to the laser module 100. The motion axis driving module 200 is configured to drive the laser module 100 to move. Among them, the motion axis driving module 200 includes but is not limited to a unidirectional guide rail, a bidirectional guide rail, a three-directional guide rail, or a guide rail in more than three directions. Among them, the unidirectional guide rail is not limited to a guide rail in any one direction of multiple directions such as X, Y, Z, R (rotation), etc. In this embodiment, guide rails in other directions can also be set on the processing platform to achieve relative movement between the laser module 100 and the substrate to be processed in multiple directions such as X, Y, Z, R (rotation), etc.

[0058] The two-way guide rails include but are not limited to guide rails in any two directions of multiple directions such as X, Y, Z, and R (rotation). In this embodiment, guide rails in other directions can also be set on the processing platform in combination to achieve relative movement of the laser module 100 and the substrate to be processed in multiple directions such as X, Y, Z, and R (rotation). Three-way guide rails or guide rails in more than three directions can refer to the invention concept of setting guide rails in other directions on the processing platform in combination with a single-way guide rail to achieve relative movement of the laser module 100 and the substrate to be processed in multiple directions such as X, Y, Z, and R (rotation).

[0059] See also Figure 4 and Figure 5 , step S110, the thickness detection module 300 is configured to collect thickness information of the substrate to be processed.

[0060] The thickness detection module 300 may be entirely disposed in the laser module 100, or a portion may be disposed in the laser module 100 and another portion may be independent of the laser module 100, or the thickness detection module 300 may be entirely disposed outside the laser module 100. The thickness detection module 300 is electrically connected to the host computer 400. The thickness detection module 300 is configured to collect thickness information of the substrate to be processed, and transmit the thickness information of the substrate to be processed to the host computer 400, which forms the processing parameters after analyzing the data.

[0061] The host computer 400 refers to a terminal that can directly issue a control command. For example, the host computer 400 includes but is not limited to a terminal with a display screen such as a computer, a laptop computer, and a mobile phone.

[0062] The upper computer 400 displays various processing parameters on its screen. The upper computer 400 communicates with the lower computer 500 through various communication protocols (such as RS232, RS485, Ethernet, etc.), obtains the operating status of the lower computer 500, sends control commands to the lower computer 500, etc. The upper computer 400 runs specific software, controls and monitors the lower computer 500 by inputting instructions or parameters, performs complex data processing, decision-making and analysis, and presents it in an operator-friendly interface. The upper computer 400 can also monitor the data collected by sensors on the production line, grasp the production status in real time, and make adjustments and optimizations as needed.

[0063] The lower computer 500 directly controls the operation of the laser module 100 and monitors the working state of the laser module 100. The lower computer 500 includes but is not limited to a control board such as a programmable logic controller, a single chip microcomputer, etc. The lower computer 500 can be installed in the laser module 100.

[0064] The lower computer 500 is configured to receive instructions or parameters sent by the upper computer 400 and perform corresponding control operations. In the laser processing equipment 1000, the lower computer 500 controls the switching and power adjustment of the laser light source module 10 according to the instructions of the upper computer 400, and feeds back the status information of the laser module 100 to the upper computer 400, such as key parameters such as processing speed to the upper computer 400 for real-time monitoring.

[0065] See also Figure 4 and Figure 5 In this embodiment, the host computer 400 is electrically connected to the thickness detection module 300 .

[0066] Step S120, the host computer 400 is configured to obtain the material information of the substrate to be processed and receive the thickness information of the substrate to be processed collected by the thickness detection module 300, and generate a file to be processed according to the material information, the thickness information and the pattern to be processed, wherein the file to be processed includes the target power of the laser light source module 10, the target zoom motion parameters of the zoom drive module 30, and the target motion axis parameters of the motion axis drive module 200.

[0067] The target power of the laser light source module 10 includes the laser beam power during the current processing operation. This parameter can be a fixed value or a variable value that changes with time.

[0068] The target zoom motion parameters of the zoom driving module 30 include, but are not limited to, parameters such as the target moving stroke of the zoom driving module 30. Among them, the host computer 400 determines the laser spot position and the beam angle according to the material information, thickness information and the pattern mode to be processed. Among them, the laser spot position and the beam angle correspond to the target position of the focusing lens 20 one by one. In this way, the host computer 400 determines the target position of the focusing lens 20 according to the material information, thickness information and the pattern mode to be processed. According to the current position of the focusing lens 20 fed back by the lower computer 500 and the target moving stroke required for the focusing lens 20 to move from the current position to the target position, the host computer 400 sends the moving stroke instruction to the zoom driving module 30, and controls the stroke of the zoom driving module 30 to be the target moving stroke.

[0069] The target motion axis parameters of the motion axis driving module 200 may be formed according to the pattern to be processed.

[0070] Specifically, before laser processing, the host computer 400 is configured to obtain material information of the substrate to be processed. In an optional embodiment, the material information of the substrate to be processed includes but is not limited to being input to the host computer 400 by the operator selecting an option on the screen display interface of the host computer 400. In another optional embodiment, the host computer 400 receives an image of the substrate to be processed transmitted by other terminals of the operator or an image of the substrate to be processed obtained from an image library. The host computer 400 obtains the material information of the substrate to be processed from the image of the substrate to be processed.

[0071] Generally, in the cutting mode, the high temperature generated by the laser focusing causes the substrate to be processed to vaporize instantly, so as to achieve the cutting of the substrate to be processed. Since the ignition points of substrates of different materials are different, the heat-affected zones of the laser beam around the incision are different. For substrates with a lower ignition point, if the laser power is too high and / or the focal spot position is too low, the high temperature generated by the laser focusing causes the substrate with a lower ignition point to be processed to vaporize instantly, and at the same time, the heat-affected zone around the incision is expanded, causing burn marks and carbonization in the processing area of ​​the substrate with a lower ignition point, which seriously affects the processing accuracy and molding quality. If the laser power is too low and / or the focal spot position is too high, the cutting effect will be poor.

[0072] Therefore, based on this, the laser processing equipment 1000 with a high degree of automation provided in the present application, by setting the host computer 400 to obtain the material information of the substrate to be processed and receive the thickness information of the substrate to be processed collected by the thickness detection module 300 before processing, and generate the file to be processed according to the material information, thickness information and the pattern mode to be processed, so that the generated laser power and focal spot position are suitable, will not cause serious burn marks and carbonization, and will not cause poor cutting effect.

[0073] See also Figure 4 and Figure 5 , step S130, the lower computer 500 is configured to receive the to-be-processed file from the upper computer 400, and control the power of the laser light source module 10 to be the target power, control the zoom motion parameters of the zoom driving module 30 to be the target zoom parameters, and control the motion axis parameters of the motion axis driving module 200 to be the target motion axis parameters according to the to-be-processed file.

[0074] In other words, the lower computer 500 controls the laser light source module 10, the zoom driving module 30, and the motion axis driving module 200 to execute one-to-one according to the target parameters in the file to be processed.

[0075] The laser processing equipment 1000 provided in the present application can automatically identify the material and thickness of the substrate to be processed, and determine suitable laser processing parameters according to the material and thickness of the substrate to be processed and the pattern mode to be processed. There is no need to manually input or select the material of the substrate to be processed, and the degree of automation is higher and more intelligent.

[0076] The structure and method of the host computer 400 to obtain the material information of the substrate to be processed include but are not limited to the following implementation methods.

[0077] In a first alternative implementation, see Figure 3 , Figure 6 and Figure 7, the laser processing equipment 1000 further includes an image acquisition module 600. The image acquisition module 600 includes but is not limited to a camera module, a scanner, etc. This embodiment takes a camera module as an example. The camera module (i.e., the image acquisition module 600) can be arranged in the laser module 100. The camera module can also be arranged outside the laser module 100. That is, the camera module and the laser module 100 are independent of each other in structure and position.

[0078] See also Figure 6 and Figure 7 , step S210, the thickness detection module 300 is configured to collect thickness information of the substrate to be processed.

[0079] Step S220: The image acquisition module 600 is configured to acquire an image of the substrate to be processed.

[0080] The camera module is arranged above the platform to be processed, and the shooting area of ​​the camera module is a part or the whole area on the platform to be processed. Specifically, the substrate to be processed is arranged on the platform to be processed. Part or the whole of the substrate to be processed is arranged within the shooting area of ​​the camera module. Before processing, the camera module takes an image of the substrate to be processed in response to a shooting instruction, and transmits the image of the substrate to be processed to the host computer 400. The shooting instruction may come from the host computer 400 or may be generated when the laser processing equipment 1000 is turned on or in other ways.

[0081] Step S230: The host computer 400 is further configured to receive the image of the substrate to be processed, and determine the material information of the substrate to be processed according to whether the matching degree between the image of the substrate to be processed and the reference image is greater than or equal to a preset matching degree threshold.

[0082] Specifically, the material reference image library of the host computer 400 stores data of reference images of multiple known materials. For example, the multiple reference images include but are not limited to reference images of poplar plywood, or reference images of endwood plywood, or reference images of acrylic boards, or reference images of leather.

[0083] The host computer 400 is further configured to compare the image of the substrate to be processed received from the camera module with a plurality of reference images of different materials.

[0084] The present application does not specifically limit the preset matching degree threshold. The preset matching degree threshold is related to the matching degree of each different feature, such as color feature and surface texture feature.

[0085] When the image of the substrate to be processed is similar to the color, surface texture and other features of a reference image among multiple reference images, for example, the preset matching degree threshold is greater than or equal to 80% (this value is an example value and is not limited to this value), the upper computer 400 can determine that the material of the substrate to be processed at this time is the material corresponding to the currently compared reference image, and then determine the material of the substrate to be processed.

[0086] The process of comparing the image of the substrate to be processed with multiple reference images in the material reference image library includes but is not limited to image preprocessing, feature extraction, classification and recognition. Image acquisition and preprocessing include adjusting the brightness and contrast of the image, as well as possible noise removal to ensure that the image quality is suitable for subsequent analysis. Feature extraction includes extracting features that can represent the material of the object through an algorithm on the preprocessed image. These features may include visual features such as color, texture, shape, or frequency domain features extracted by mathematical methods such as Fourier transform. The specific steps of classification and recognition include but are not limited to comparing the extracted features with a database of reference images of known materials, and determining the material of the object through some form of matching algorithm (such as the nearest neighbor method, etc.).

[0087] If the image of the substrate to be processed does not match any reference image in the material reference image library, the operator can directly input the material of the substrate to be processed in the screen editing page of the host computer 400 .

[0088] Step S240, the host computer 400 is configured to receive the thickness information of the substrate to be processed collected by the thickness detection module 300, and generate a file to be processed according to the material information, the thickness information and the pattern to be processed, wherein the file to be processed includes the target power of the laser light source module 10, the target zoom motion parameters of the zoom drive module 30, and the target motion axis parameters of the motion axis drive module 200.

[0089] Step S250, the lower computer 500 is configured to receive the file to be processed from the upper computer 400, and control the power of the laser light source module 10 to be the target power, control the zoom motion parameters of the zoom drive module 30 to be the target zoom parameters, and control the motion axis parameters of the motion axis drive module 200 to be the target motion axis parameters according to the file to be processed.

[0090] Generally, when the operator is not sure about the material of the substrate to be processed, the operator needs to determine the type of the substrate to be processed or the various parameters of the laser module 100 on the host computer 400. In this process, it is easy to make the wrong type or parameter selection, resulting in the inability to process the expected graphics on the substrate to be processed or the failure of processing the graphics. Based on this, the laser processing equipment 1000 provided in this embodiment can receive the image of the substrate to be processed through the image of the substrate to be processed acquired by the image acquisition module 600, and determine the material information of the substrate to be processed according to the matching degree between the image of the substrate to be processed and the reference image being greater than or equal to the preset matching degree threshold, so that the operator does not need to determine the material of the substrate to be processed by himself, but the laser processing equipment 1000 intelligently determines the material of the substrate to be processed, and generates a suitable file to be processed according to the material of the substrate to be processed, so as to process the expected graphics on the substrate to be processed, avoid the problem of graphics processing failure, reduce the operation of the operator, and increase the automation and intelligence of the laser processing equipment 1000.

[0091] In a second alternative implementation, see Figure 8 , Fig. 9 and Fig.10 , step S310, the thickness detection module 300 is configured to collect thickness information of the substrate to be processed.

[0092] The laser processing device 1000 further includes a material recognition module 700. The material recognition module 700 includes but is not limited to a photoelectric sensor or a color recognition sensor.

[0093] Step S320 : The material identification module 700 is configured to determine the material information of the substrate to be processed according to at least one of the intensity, reflection angle, and spectrum information of the reflection signal of the substrate to be processed.

[0094] Optionally, a photoelectric sensor is arranged above the processing platform, and the photoelectric sensor emits a light signal toward the surface of the substrate to be processed. Due to different materials, the reflectivity of the object to light is also different. The photoelectric sensor can judge the material of the substrate to be processed based on the light reflection intensity and emission angle of the surface of the substrate to be processed. For example, the photoelectric sensor can obtain the light reflection intensity and emission angle of the surface of the substrate to be processed, and send the light reflection intensity and emission angle to the host computer 400. The host computer 400 compares the light reflection intensity and emission angle of the substrate to be processed with the database of light reflection intensity and emission angle of a variety of known materials, and then quickly identifies the material of the substrate to be processed.

[0095] Optionally, a color recognition sensor is disposed above the processing platform, and the color recognition sensor emits a light signal toward the surface of the substrate to be processed. The color recognition sensor identifies the color of the substrate to be processed by collecting spectral information reflected by the surface of the substrate to be processed. Generally, the color recognition sensor can output different electrical signals to the host computer 400 according to the color. The host computer 400 compares the electrical signal of the color recognition sensor carrying material information with a database of electrical signals of a variety of known materials, thereby quickly identifying the material of the substrate to be processed.

[0096] When the color of the substrate to be processed corresponds to the material one by one, the material information of the substrate to be processed can be obtained through the color recognition sensor.

[0097] Step S330, the host computer 400 is configured to receive the thickness information of the substrate to be processed collected by the thickness detection module 300, and generate a file to be processed according to the material information, the thickness information and the pattern to be processed, wherein the file to be processed includes the target power of the laser light source module 10, the target zoom motion parameters of the zoom drive module 30, and the target motion axis parameters of the motion axis drive module 200.

[0098] Step S340, the lower computer 500 is configured to receive the file to be processed from the upper computer 400, and control the power of the laser light source module 10 to be the target power, control the zoom motion parameters of the zoom drive module 30 to be the target zoom parameters, and control the motion axis parameters of the motion axis drive module 200 to be the target motion axis parameters according to the file to be processed.

[0099] Generally, when the operator is not sure about the material of the substrate to be processed, the operator needs to determine the type of the substrate to be processed or the various parameters of the laser module 100 on the host computer 400. In this process, it is easy to make the wrong type or parameter selection, resulting in the inability to process the expected graphics on the substrate to be processed or the failure of processing the graphics. Based on this, the laser processing equipment 1000 provided in this embodiment can receive the image of the substrate to be processed through the image of the substrate to be processed collected by the material recognition module 700, and determine the material information of the substrate to be processed according to the matching degree between the image of the substrate to be processed and the reference image being greater than or equal to the preset matching degree threshold, so that the operator does not need to determine the material of the substrate to be processed by himself, but the laser processing equipment 1000 intelligently determines the material of the substrate to be processed, and generates a suitable file to be processed according to the material of the substrate to be processed, so as to process the expected graphics on the substrate to be processed, avoid the problem of processing graphics failure, reduce the operation of the operator, and increase the automation and intelligence of the laser processing equipment 1000.

[0100] In a third optional embodiment, the image of the substrate to be processed can be taken by the operator's mobile terminal. In other words, the host computer 400 establishes communication with the operator's mobile terminal and receives the image of the substrate to be processed from the operator's mobile terminal, and then compares the image of the substrate to be processed with a plurality of reference images of different materials, thereby determining the material information of the substrate to be processed.

[0101] In a fourth optional embodiment, the image of the substrate to be processed can be directly obtained from the image library of the host computer 400. Specifically, the operator selects the image of the substrate to be processed from the image library of known materials provided by the host computer 400, thereby the host computer 400 directly determines the material information of the substrate to be processed.

[0102] Optional, see Fig.11 The host computer 400 further includes an editable display module (not shown). The editable display module includes but is not limited to a display screen. The display page on the display screen is editable.

[0103] See also Fig.11 In step S410, the editable display module of the host computer is configured to cover the image of the substrate to be processed as a covering layer in the processing area of ​​the editing page of the editable display module, and to cover the image of the substrate to be processed with the pattern to be processed.

[0104] Step S420 : The host computer 400 generates the to-be-processed file according to the image of the to-be-processed substrate, the material information, the thickness information and the to-be-processed pattern mode.

[0105] Specifically, this embodiment can be combined with the first, third, and fourth embodiments in which the host computer 400 obtains material information of the substrate to be processed, and the editable display module is configured to use the image acquisition module 600 or the image of the substrate to be processed transmitted from the operator's mobile terminal or from the image library of the host computer 400 as a covering layer over the processing area of ​​the editing page of the editable display module.

[0106] For example, before the image information is covered, the processing area of ​​the editing page is a blank page. After the image of the substrate to be processed is covered on the processing area of ​​the editing page, the image of the substrate to be processed is presented in the processing area of ​​the editing page.

[0107] Among them, before covering the image of the substrate to be processed, the image of the substrate to be processed can be preprocessed so that the boundary of the substrate to be processed corresponds to the boundary of the processing area of ​​the editing page; or, the boundary of the substrate to be processed on the editing page is aligned with the local boundary of the processing area of ​​the editing page.

[0108] Furthermore, the pattern to be processed is overlaid on the image of the substrate to be processed, and the operator can adjust the area of ​​the actual processed image on the substrate to be processed by moving the relative position of the pattern to be processed on the image surface of the substrate to be processed.

[0109] Furthermore, the host computer 400 generates a target power of the laser light source module 10 and a target zoom motion parameter of the zoom driving module 30 according to the image of the substrate to be processed, the material information, the thickness information and the pattern to be processed.

[0110] The host computer 400 can determine the starting point position and laser beam path of the laser beam emitted by the laser module according to the relative position of the pattern to be processed on the image surface of the substrate to be processed, and then generate the target motion axis parameters of the motion axis driving module 200.

[0111] This embodiment configures the editable display module to cover the processing area of ​​the editing page of the editable display module with the image of the substrate to be processed transmitted from the operator's mobile terminal or from the image library of the host computer 400 as a cover layer, so that the operator can adjust the area of ​​the actual processed image on the substrate to be processed by moving the relative position of the pattern to be processed on the image surface of the substrate to be processed to determine the pattern size and pattern position desired by the operator. In addition, it is also convenient for the host computer 400 to determine the starting position and laser beam path of the laser beam emitted by the laser module according to the relative position of the pattern to be processed on the image surface of the substrate to be processed, and then generate the target motion axis parameters of the motion axis driving module 200.

[0112] In this embodiment, the host computer 400 further determines the target zoom motion parameters of the zoom driving module 30 according to the pattern mode to be processed.

[0113] Optionally, when the pattern to be processed is a line, the focal spot position is below the surface of the substrate to be processed, and the beam angle is small to form a narrow and deep processing mark. This embodiment defines the laser processing mode when the pattern to be processed is a line as a telephoto mode or a cutting mode.

[0114] Optionally, when the pattern mode to be processed is fill or image, the focal spot position is located on the surface of the substrate to be processed, and the beam angle is large to form a wide and shallow processing mark with a relatively large processing area to improve processing efficiency. This embodiment defines the laser processing mode when the pattern mode to be processed is fill or image as a short-focus mode or engraving mode.

[0115] The requirements for the beam in the engraving mode and the cutting mode are different. For example, the laser engraving mode requires that the focal spot focused on the surface of the substrate to be processed is small enough. The smaller the spot, the finer the processing. The laser cutting mode requires a longer beam Rayleigh length or a smaller beam angle to achieve a certain cutting depth. The beam angle in the cutting mode is smaller than the beam angle in the engraving mode.

[0116] The target zoom motion parameters when the laser processing mode is the cutting mode are different from the target zoom motion parameters when the laser processing mode is the engraving mode. In other words, the position of the focusing lens 20 when the laser processing mode is the cutting mode is different from the position of the focusing lens 20 when the laser processing mode is the engraving mode.

[0117] The structure and detection process of the thickness detection module 300 are described below with reference to the accompanying drawings.

[0118] For the first optional implementation, please refer to Fig.12 , Fig.13 and Fig.14 The thickness detection module 300 includes a position probe 310. The position probe 310 includes but is not limited to being a position sensor. The position probe 310 includes but is not limited to being a capacitive or magnetic induction type.

[0119] See also Fig.12 , Fig.13 and Fig.14 The motion axis driving module 200 includes a lifting driving module 210 .

[0120] Optional, see Fig.12 , the lifting driving module 210 is connected to the position probe 310 .

[0121] See also Fig.12 and Fig.13 , step S510, the lifting driving module 210 is configured to drive the position probe 310 to descend to the surface of the substrate 260 to be processed.

[0122] In step S520 , the position probe 310 is configured to detect a first height coordinate of the surface of the substrate 260 to be processed.

[0123] Step S530 : The host computer 400 is configured to determine the thickness information of the substrate 260 to be processed according to the first height coordinate and the preset reference height coordinate.

[0124] Specifically, the driving structure of the lifting drive module 210 includes but is not limited to a cylinder, a motor, etc. The transmission structure of the lifting drive module 210 includes but is not limited to a screw rod, a gear, etc. The guide structure of the lifting drive module 210 includes but is not limited to a guide rail, a slider, a guide slide bar, etc.

[0125] In this embodiment, the lifting drive module 210 drives the position probe 310 to rise and fall relative to the processing platform. In other embodiments, the lifting drive module 210 can also be connected to the processing platform to drive the processing platform to rise and fall relative to the position probe 310. In this embodiment, the lifting drive module 210 and the Z-axis motion axis drive module 200 of the processing platform are the same drive module, so that one object can be used for multiple purposes and the number of structural parts of the laser processing equipment 1000 can be reduced, thereby reducing the weight.

[0126] When the position probe 310 descends with the lifting drive module 210 to contact the surface of the substrate 260 to be processed, an electrical signal is generated inside the position probe 310 and fed back to the host computer 400. The host computer 400 obtains the second position parameter of the lifting drive module 210 when the position probe 310 contacts the surface of the substrate 260 to be processed. At the same time, the host computer 400 obtains the first position parameter (corresponding to the Z-axis zero position) of the lifting drive module 210 when the position probe 310 contacts the surface of the processing platform. The host computer 400 determines the thickness of the substrate 260 to be processed based on the first position parameter and the second position parameter.

[0127] In a second optional embodiment, the thickness detection module 300 includes but is not limited to a light sensor. Wherein, when the substrate 260 to be processed is not set on the processing platform, the light sensor emits a detection signal toward the surface of the processing platform and receives a signal reflected by the surface of the processing platform to obtain the distance between the light sensor and the processing platform, which is defined as the first distance. After the substrate 260 to be processed is set on the processing platform, the light sensor emits a detection signal toward the surface of the substrate 260 to be processed and receives a signal reflected by the surface of the substrate 260 to be processed to obtain the distance between the light sensor and the substrate 260 to be processed, which is defined as the second distance. The difference between the first distance and the second distance is the thickness of the substrate 260 to be processed.

[0128] Generally, when setting processing parameters for household laser processing equipment 1000, the laser processing equipment 1000 does not set different processing parameters according to different thicknesses because the thickness difference of the substrate 260 to be processed is relatively small. However, the technicians of this application found in their research that in the cutting mode, the energy distribution of the laser beam in the substrates 260 to be processed with different thicknesses is different, thereby forming different line processing effects or different incision marks. For substrates 260 to be processed with a thinner thickness, it is easy to cause heavier incision marks, and obvious burn marks and carbonized areas. For substrates 260 to be processed with a thicker thickness, it is easy to cause problems such as insufficient incision depth.

[0129] In this embodiment, by setting a thickness detection module 300, before the file to be processed is formed, the thickness detection module 300 detects the thickness of the substrate 260 to be processed, so as to generate different focal spot positions according to the thickness of the substrate 260 to be processed, so as to obtain more accurate files to be processed for different thicknesses, so as to form surface image processing or filling, or form lines with good cutting marks. In this embodiment, there is no need for the operator to manually detect the thickness of the substrate 260 to be processed, which improves the surface image processing effect or filling effect of the laser processing equipment 1000, or the line effect of forming good cutting marks, and also increases the automation and intelligence of the laser processing equipment 1000.

[0130] In this embodiment, an input port for thickness selection or input is reserved on the editing page of the host computer 400, so that the operator can also input the thickness of the substrate 260 to be processed in the editing page, so as to correct the thickness detected by the thickness detection module 300, or the operator can directly input the thickness of the substrate 260 to be processed in the editing page to generate a file to be processed.

[0131] Optional, see Fig.15 and Fig.16 In step S610, the lower computer 500 is configured to form a pre-processing trace on the substrate 260 to be processed according to the target power and the target zoom motion parameters in the file to be processed.

[0132] In other words, after generating the file to be processed, the laser processing equipment 1000 first pre-processes the substrate 260 to be processed according to the target power and the target zoom motion parameters in the file to be processed. The pre-processing includes but is not limited to dotting, drawing lines, etc., so as to verify whether the target power and the target zoom motion parameters in the file to be processed are appropriate.

[0133] See also Fig.15 and Fig.16 , the laser processing equipment 1000 also includes a camera module 610.

[0134] Step S620: The camera module 610 is configured to obtain an image of the pre-processing trace.

[0135] Optionally, the camera module 610 may be the aforementioned image acquisition module 600. In other words, the aforementioned image acquisition module 600 can not only acquire an image of the substrate 260 to be processed, but also acquire whether the pre-processing traces are within a suitable range to determine whether the target power in the current file to be processed and the target zoom motion parameters are suitable. Fig.16 Steps S610-S630 in .

[0136] In the first embodiment, in step S630, the host computer 400 is used to receive the image of the pre-processing trace from the camera module 610, obtain the parameters of the pre-processing trace according to the image of the pre-processing trace, and when the parameters of the pre-processing trace are outside the preset parameter range, calibrate the target power and / or the target zoom motion parameters in the file to be processed.

[0137] Optionally, the parameters of the pre-processing trace include, but are not limited to, the width of the heat affected zone of the cut, etc. If the parameters of the pre-processing trace are less than the minimum value in the preset parameter range, it means that the pre-processing trace is too narrow or too shallow, and the host computer 400 can calibrate the target power and / or the target zoom motion parameter in the file to be processed, for example, increase the target power in the file to be processed by a preset power, or adjust the target zoom motion parameter to move the laser focus spot down by a preset distance. If the parameters of the pre-processing trace are greater than the maximum value in the preset parameter range, it means that the pre-processing trace is too wide or too deep, and the host computer 400 can calibrate the target power and / or the target zoom motion parameter in the file to be processed, for example, reduce the target power in the file to be processed by a preset power, or adjust the target zoom motion parameter to move the laser focus spot up by a preset distance. If the parameters of the pre-processing trace are within the preset parameter range, the processing can be performed according to the current file to be processed.

[0138] Then, according to the file to be processed after calibration, a second pre-processing mark is formed on the substrate to be processed 260, the camera module 610 captures an image of the second pre-processing mark, obtains parameters of the second pre-processing mark based on the image of the second pre-processing mark, and when the parameters of the second pre-processing mark are outside the preset parameter range, calibrate the target power and / or the target zoom motion parameters in the file to be processed again until the parameters of the pre-processing mark are within the preset parameter range.

[0139] In the second embodiment, the operator determines whether the pre-processing traces are the expected pre-processing traces based on the pre-processing traces. The editing page of the upper computer 400 has reserved input ports for selecting or inputting various parameters in the file to be processed, so that the operator can also input various parameters in the file to be processed in the editing page, so that the operator can modify the file to be processed according to the pre-processing traces or the operator directly generates the file to be processed by inputting parameters in the editing page.

[0140] In a third embodiment, the operator pre-sets a line width, for example 2 mm, on the host computer 400. The host computer 400 is used to receive an image of the pre-processing trace from the camera module 610, and obtain parameters of the pre-processing trace (including but not limited to the incision width, etc.) according to the image of the pre-processing trace. When the parameters of the pre-processing trace are equal to the pre-set line width, if not, the target power and / or the target zoom motion parameters in the file to be processed can be calibrated according to the contents described in the first embodiment.

[0141] In this embodiment, the laser processing equipment 1000 can verify whether the target power and / or the target zoom motion parameters in the file to be processed are appropriate according to the line width pre-set by the operator, thereby improving the intelligence of the laser processing equipment 1000 and more accurately obtaining the processing pattern desired by the operator.

[0142] The working process of the above laser processing equipment 1000 includes but is not limited to the following operations:

[0143] Step 1: Turn on the laser processing device 1000, the operator places the substrate 260 to be processed on the processing platform, the camera module automatically takes a photo of the substrate 260 to be processed, and the photo is transmitted back to the host computer 400. The host computer 400 determines and identifies wood, plastic, leather, etc. according to the surface texture, color and other information of the substrate 260 to be processed. The host computer 400 processes the surface of the substrate 260 to be processed and covers it as a covering layer in the processing area of ​​the editing page.

[0144] Step 2: The XY-axis driving module drives the laser module 100 to move above the surface of the substrate 260 to be processed, and then the Z-axis driving module drives the laser module 100 to sink so that the position probe 310 contacts the surface of the substrate 260 to be processed, and the thickness of the substrate 260 to be processed is calculated according to the Z-axis zero point position preset by the lower computer 500 and the measurement position of the position probe 310.

[0145] Step 3: The operator adds an engraving pattern on the editing page of the host computer 400 and clicks to start processing. The host computer 400 determines the zoom mode (telephoto mode, short focal mode) based on the engraving pattern mode (line, fill and picture) added by the operator in combination with the first preset mapping relationship table, and then generates corresponding processing parameters based on the material and thickness of the substrate 260 to be processed determined in steps 1 and 2 in combination with the second preset mapping relationship table. If the operator is not satisfied with the preset parameters, the host computer 400 display interface can modify them. Click the confirm processing button of the host computer 400, and the host computer 400 will send the engraving file to the slave computer 500 to execute the engraving task.

[0146] Step 4: The lower computer 500 receives the engraving task sent by the upper computer 400, reads the processing mode instruction, controls the XYZ axis moving speed and distance, the laser beam power and the zoom drive module 30 to complete the engraving task. Among them, the duty cycle of each laser light source in the laser light source module 10 is controlled according to the laser power determined above, the target position of the focusing lens 20 is determined according to the spot size, Rayleigh length and focal spot position in step 3, and the zoom drive module 30 is controlled to move the focusing lens 20 to the target position.

[0147] The following steps may also be included between step 3 and step 4:

[0148] Pre-processing step: the laser light source module 10 emits laser according to the set power, and controls the pre-processing according to the preset processing trajectory (such as dotting or routing), forming pre-processing traces; the camera module collects the preset processing trajectory (collects dotting or routing traces), and feeds back the feedback signal of the collected dotting or routing traces to the host computer 400, and the host computer 400 adjusts the laser power or the focus spot position and other parameters according to the pre-processing traces. In addition, the operator can adjust the laser power or the focus spot position and other parameters according to the pre-processing traces.

[0149] The following embodiments of the present application also determine different zoom modes according to different pattern modes, which correspond to different positions of the focusing lens 20 (zoom control methods).

[0150] Please refer to Table 1, which is the first preset mapping relationship table provided by this application:

[0151] Table 1

[0152] Pattern Mode Processing method Zoom control line Cutting Mode Telephoto mode filling Sculpting Mode Short focus mode picture Sculpting Mode Short focus mode

[0153] When the host computer 400 receives the image mode to be processed as a line, the host computer 400 determines that the processing mode is a cutting mode, at which time the zoom control mode of the focusing lens 20 is a telephoto mode, at which time the length between the focusing lens 20 and the focal spot is a first length, and the beam angle is a first beam angle. When the host computer 400 receives the image mode to be processed as a fill or picture, the host computer 400 determines that the processing mode is an engraving mode, at which time the zoom control mode of the focusing lens 20 is a short-focus mode, at which time the length between the focusing lens 20 and the focal spot is a second length, and the beam angle is a second beam angle. The second beam angle is greater than the first beam angle, and the second length is less than the first length.

[0154] When the pattern mode to be processed includes an engraving mode, the host computer 400 is configured to determine that the target zoom motion parameter corresponds to the object distance of the focusing lens 20 as a first coordinate height according to the thickness information of the substrate to be processed 260. When the object distance of the focusing lens 20 is the first coordinate height, the focal spot height of the laser beam is the thickness of the substrate to be processed 260.

[0155] Specifically, when the host computer 400 receives that the pattern mode to be processed includes a fill or picture mode, the host computer 400 determines that the current processing mode is an engraving mode. In the engraving mode, the focal spot height of the laser beam is the thickness of the substrate 260 to be processed. In other words, in the engraving mode, the laser beam processes the surface of the substrate 260 to be processed, so the focal spot height of the laser beam is the thickness of the substrate 260 to be processed, so as to ensure the engraving accuracy and the highest energy density.

[0156] Furthermore, the host computer 400 is configured to determine the focal spot height of the laser beam according to the thickness of the substrate 260 to be processed obtained in the aforementioned manner, and then configure the target zoom motion parameters. The zoom drive module 30 adjusts the position of the focusing lens 20 to be located at the target position after moving according to the target zoom motion parameters, so that the focal spot height of the laser beam is the thickness of the substrate 260 to be processed, and the focal spot of the laser beam is located on the surface of the substrate 260 to be processed, so as to ensure the engraving accuracy and the highest energy density.

[0157] Since the properties and densities of the substrates 260 to be processed are different from those of different materials, after the host computer 400 obtains the material information of the substrates 260 to be processed in the above manner, it configures different laser powers for the substrates 260 to be processed of different materials to generate corresponding files to be processed.

[0158] Please refer to Table 2, which is a table of some parameters in the files to be processed under different materials, different thicknesses, and different processing modes:

[0159] Table 2

[0160]

[0161]

[0162] Please refer to rows 1, 5, 9, and 10 in Table 2. The host computer 400 is further configured to determine that the target power is the first power based on the material information of the substrate 260 to be processed being the first material.

[0163] The material information of the substrate 260 to be processed is the second material, and the target power is determined to be the second power.

[0164] The material information of the substrate 260 to be processed is the third material, and the target power is determined to be the third power.

[0165] The material information of the substrate 260 to be processed is the fourth material, and the target power is determined to be the fourth power.

[0166] The ignition point of the fourth material, the ignition point of the third material, the ignition point of the second material, and the ignition point of the first material increase in sequence. The first power, the second power, the third power, and the fourth power decrease in sequence.

[0167] Optionally, the first power includes but is not limited to 90% to 100% of the total power of the laser light source module 10. Specifically, the laser light source control signal input by the lower computer 500 to the laser light source module 10 is a pulse signal, and the duty cycle of the laser light source control signal is controlled to be 90% to 100%, so as to control the first power to be 90% to 100% of the total power of the laser light source module 10.

[0168] For example, referring to row 1 in Table 2, the substrate 260 to be processed of the first material is basswood plywood. After the host computer 400 obtains that the substrate 260 to be processed is basswood plywood in the above manner, the laser power configured for the basswood plywood is the first power to generate the corresponding file to be processed. For example, the first power is 100% of the total power. The total power includes but is not limited to 20w.

[0169] Optionally, the second power includes but is not limited to 70% to 90% of the total power of the laser light source module 10. Specifically, the laser light source control signal input by the lower computer 500 to the laser light source module 10 is a pulse signal, and the duty cycle of the laser light source control signal is controlled to be 70% to 90%, so as to control the second power to be 70% to 90% of the total power of the laser light source module 10.

[0170] For example, referring to row 5 in Table 2, the second material substrate 260 to be processed is poplar plywood. After the host computer 400 obtains that the substrate 260 to be processed is poplar plywood in the above manner, the laser power configured for the poplar plywood is the second power to generate the corresponding file to be processed. For example, the second power is 80% of the total power.

[0171] Optionally, the third power includes but is not limited to 40% to 70% of the total power of the laser light source module 10. Specifically, the laser light source control signal input by the lower computer 500 to the laser light source module 10 is a pulse signal, and the duty cycle of the laser light source control signal is controlled to be 40% to 70%, so as to control the third power to be 40% to 70% of the total power of the laser light source module 10.

[0172] For example, referring to row 9 in Table 2, the substrate 260 of the third material to be processed is an acrylic plate. After the host computer 400 obtains that the substrate 260 to be processed is an acrylic plate in the above manner, the laser power configured for the acrylic plate is the third power to generate a corresponding file to be processed. For example, the third power is 50% of the total power.

[0173] Optionally, the fourth power includes but is not limited to 10% to 40% of the total power of the laser light source module 10. Specifically, the laser light source control signal input by the lower computer 500 to the laser light source module 10 is a pulse signal, and the duty cycle of the laser light source control signal is controlled to be 10% to 40%, so as to control the fourth power to be 10% to 40% of the total power of the laser light source module 10.

[0174] For example, referring to row 10 in Table 2, the fourth material substrate 260 to be processed is leather. After the host computer 400 obtains that the substrate 260 to be processed is leather in the above manner, the laser power configured for the leather is the fourth power to generate a corresponding file to be processed. For example, the fourth power is 30% of the total power.

[0175] In the present application, the duty cycle of the laser light source module 10 can be adjusted to adjust the output power of the laser light source module 10, thereby processing the surface of the substrate 260 to be processed of different materials for engraving. The laser processing equipment 1000 provided in the present application can automatically detect the material and thickness of the substrate 260 to be processed, and generate the target power of the laser light source module 10 correspondingly according to the material of the substrate 260 to be processed, and then determine the target zoom motion parameter of the zoom drive module 30 correspondingly according to the thickness of the substrate 260 to be processed, and then determine the position of the focusing lens 20 correspondingly, so that the focal spot height of the laser beam is the thickness of the substrate 260 to be processed, and the focal spot of the laser beam is located on the surface of the substrate 260 to be processed, so as to ensure the engraving accuracy and the highest energy density.

[0176] Furthermore, in the engraving mode, before the host computer 400 generates the substrate 260 to be processed, the host computer 400 also determines whether the thickness of the substrate 260 to be processed is greater than or equal to the first preset thickness value. If so, the file to be processed is generated in the above manner. Among them, for the substrate 260 to be processed of the first material, the second material, and the third material, the first preset thickness value is 1mm (this data is for example). For the substrate 260 to be processed of the fourth material, the second preset thickness value is 0.5mm (this data is for example).

[0177] The file to be processed in engraving mode also includes the engraving speed.

[0178] In this embodiment, the engraving speed in the engraving mode is not specifically limited. For example, the engraving speed in this embodiment may be different according to different materials. For example, for the substrate 260 to be processed of the first material, the second material, and the third material, the engraving speed is 15000-25000 mm / min, for example, 20000 mm / min (this data is for example). For the substrate 260 to be processed of the fourth material, the engraving speed is 5000-7000 mm / min, for example, 6000 mm / min (this data is for example).

[0179] The file to be processed in engraving mode also includes engraving gap.

[0180] In this embodiment, the engraving gap in the engraving mode is not specifically limited. For the substrate 260 to be processed of the first material, the second material, the third material, and the fourth material, the engraving gap is 0.05-0.2 mm, for example, 0.1 mm (this data is for example).

[0181] The parameters in the file to be processed in the engraving mode also include the air auxiliary gas flow rate.

[0182] In this embodiment, the air assist gas flow rate in the engraving mode is not specifically limited. For the substrate 260 to be processed of the first material, the second material, the third material, and the fourth material, the air assist gas flow rate is 2 to 4 L / min, for example, 3 L / min (this data is for example).

[0183] Please refer to rows 2, 6, and 11 in Table 2. In the cutting mode, when the laser beam cuts the substrate 260 to be processed, the substrate 260 to be processed with a lower ignition point is instantly vaporized by the high temperature generated by the laser focusing, which causes the heat-affected zone around the incision to expand, causing burn marks and carbonization in the processing area of ​​the substrate 260 to be processed with a lower ignition point, seriously affecting the processing accuracy and molding quality, and limiting the promotion and application of laser cutting technology.

[0184] In response to the above problems, the laser processing equipment 1000 provided in the present application performs optical simulation from the perspective of the energy distribution of the spatial light beam according to the different materials of the substrate 260 to be processed, and finally obtains the light beam energy distribution in the optimal cutting scenario corresponding to the substrate 260 to be processed of different materials by balancing the focal spot and the Rayleigh length, and completes the optical design, which is explained below through a specific implementation method.

[0185] Optionally, when the pattern mode to be processed includes a cutting mode, the host computer 400 is configured to determine that the target power is greater than or equal to a preset power. The preset power includes but is not limited to 100% to 70% of the total power, so that the laser beam has a stronger intensity, thereby improving the cutting effect, reducing the heat affected zone of the incision and the cutting rate. In this embodiment, the preset power is 100%.

[0186] In an optional embodiment, the host computer 400 is configured to determine that the target zoom motion parameter corresponds to the object distance of the focusing lens 20 being the second coordinate height according to the material information of the substrate 260 to be processed being the target material and the thickness of the substrate 260 to be processed being less than or equal to the first thickness. When the object distance of the focusing lens 20 is the second coordinate height, the focal spot height of the laser beam is the thickness of the substrate 260 to be processed.

[0187] Optionally, the target material includes any one of the first material, the second material and the fourth material. In other words, when the host computer 400 detects that the material information of the substrate 260 to be processed is basswood plywood, poplar plywood or leather, in the cutting mode, according to the thickness of the substrate 260 to be processed being less than or equal to the first thickness, the target zoom motion parameter is determined to correspond to the object distance of the focusing lens 20 being the second coordinate height. When the object distance of the focusing lens 20 is the second coordinate height, the focal spot height of the laser beam is the thickness of the substrate 260 to be processed.

[0188] Among them, the first thickness is a relatively thin thickness. According to the angle of energy distribution of the spatial beam, when the laser beam is used to cut the thin substrate 260 to be processed, when the laser power is 100% of the total power, the host computer 400 controls the target zoom motion parameter to correspond to the object distance of the focusing lens 20 as the second coordinate height, so that the focal spot of the laser beam is located on the surface of the substrate 260 to be processed. The heat-affected zone when the laser beam is irradiated on the surface of the substrate 260 to be processed can cover the entire thickness. Therefore, when the thickness of the substrate 260 to be processed is less than or equal to the first thickness, the laser beam is irradiated on the surface of the substrate 260 to be processed to increase the cutting efficiency and avoid carbonization of the cut or reduce the carbonization mark of the cut.

[0189] Optionally, please refer to the serial number 2 and 6 rows in Table 2. For the first material and the second material, the first thickness is 3 mm. In other words, when the host computer 400 detects that the material information of the substrate 260 to be processed is basswood plywood or poplar plywood, in the cutting mode, according to the thickness of the substrate 260 to be processed being 2 mm (less than 3 mm), the target zoom motion parameter is determined to correspond to the object distance of the focusing lens 20 being the second coordinate height. When the object distance of the focusing lens 20 is the second coordinate height, the focal spot height of the laser beam is the thickness of the substrate 260 to be processed, that is, when the object distance of the focusing lens 20 is the second coordinate height, the focal spot height of the laser beam is 2 mm.

[0190] Optionally, please refer to row 11 in Table 2. For the fourth material, the first thickness is 2 mm. In other words, when the host computer 400 detects that the material information of the substrate 260 to be processed is leather, in the cutting mode, according to the thickness of the substrate 260 to be processed being 1.5 mm (less than 2 mm), the target zoom motion parameter is determined to correspond to the object distance of the focusing lens 20 being the second coordinate height. When the object distance of the focusing lens 20 is the second coordinate height, the focal spot height of the laser beam is the thickness of the substrate 260 to be processed, that is, when the object distance of the focusing lens 20 is the second coordinate height, the focal spot height of the laser beam is 1.5 mm.

[0191] The laser processing device 1000 provided in this embodiment can form a file to be processed based on the automatically acquired material, thickness, pattern mode, etc., because the file to be processed takes into account that different materials have different ignition points and different requirements for laser power; and takes into account that different pattern modes on different materials have different processing requirements, so the laser power and focal spot height are different; it also takes into account that different pattern modes on different materials have different processing requirements at different thicknesses, thereby forming a file to be processed that can be generated based on multiple considerations such as different materials, thicknesses, and pattern modes. The file to be processed enables the laser processing device 1000 to determine a better laser power and a suitable position of the focusing lens 20 corresponding to three factors such as different materials, different thicknesses, and different pattern modes, thereby forming a file to be processed.

[0192] During the switching between the engraving mode and the cutting mode, for the substrate 260 to be processed of the first material and the second material, the laser power can remain unchanged, and the position of the focusing lens 20 is adjusted from the first coordinate height to the second coordinate height to achieve a smaller beam angle while keeping the focal position unchanged.

[0193] Further, with the processing platform as a reference, the first coordinate height is smaller than the second coordinate height.

[0194] The parameters in the file to be processed in the cutting mode also include the cutting speed.

[0195] In this embodiment, the cutting speed in the cutting mode is not specifically limited. For example, the cutting speed in this embodiment may vary according to the material. For example, for the substrate 260 to be processed of the first material, the cutting speed is 800-1200 mm / min, for example, 1000 mm / min (this data is for example). For the substrate 260 to be processed of the second material, the cutting speed is 400-800 mm / min, for example, 600 mm / min (this data is for example). For the substrate 260 to be processed of the fourth material, the cutting speed is 1800-2200 mm / min, for example, 2000 mm / min (this data is for example).

[0196] The parameters in the file to be processed in the cutting mode also include the air auxiliary gas flow rate.

[0197] In this embodiment, the air assist gas flow rate in the cutting mode is not specifically limited. For the substrate 260 to be processed of the first material, the second material, and the fourth material, the air assist gas flow rate is 20-22 L / min, for example, 21 L / min (this data is for example).

[0198] In a second optional implementation, the host computer 400 is configured to determine that the target zoom motion parameter corresponds to the object distance of the focusing lens 20 being a third coordinate height, based on the material information of the substrate 260 to be processed being the target material and the thickness of the substrate 260 to be processed being greater than the first thickness and less than or equal to the second thickness. When the object distance of the focusing lens 20 is the third coordinate height, the distance between the focal spot height of the laser beam and the surface of the substrate 260 to be processed is the first distance difference.

[0199] Optionally, the target material includes any one of the first material and the second material. In other words, when the host computer 400 detects that the material information of the substrate 260 to be processed is basswood plywood or poplar plywood, in the cutting mode, according to the thickness of the substrate 260 to be processed being greater than the first thickness and less than or equal to the second thickness, the target zoom motion parameter is determined to correspond to the object distance of the focusing lens 20 being the third coordinate height. When the object distance of the focusing lens 20 is the third coordinate height, the distance between the focal spot height of the laser beam and the surface of the substrate 260 to be processed is the first distance difference. The first distance difference is greater than or equal to 1 mm. In this embodiment, the first distance difference is 2 mm, and when the thickness of the substrate 260 to be processed is of medium thickness, the focal spot height of the laser beam sinks.

[0200] This application determines the sinking depth based on the Rayleigh length of the laser beam after focusing. The distance from the focus to the cross section whose area is twice the focus area along the direction of the beam's travel (generally 3mm) is the distance at which the beam has a stronger energy distribution. When the thickness of the processed material is greater than 3mm, if the laser focus is still on the surface, the laser energy is weaker where the thickness is greater than 3mm, resulting in the inability to cut through the material, and the cutting depth is only 3mm. In order to cut through materials greater than 3mm, the focus must be lowered a certain distance so that the Rayleigh length of the beam covers the thickness of the material.

[0201] The thickness of the substrate 260 to be processed is greater than the first thickness and less than or equal to the second thickness, and the thickness of the substrate 260 to be processed is medium thickness. When using a laser beam to cut a substrate 260 to be processed of medium thickness, when the laser power is 100% of the total power, the host computer 400 controls the target zoom motion parameter to correspond to the object distance of the focusing lens 20 as the third coordinate height, so that the focal spot of the laser beam is located at the first distance difference below the surface of the substrate 260 to be processed, so that the heat-affected zone after the laser beam irradiates the substrate 260 to be processed can cover the thickness of the entire substrate 260 to be processed. Therefore, when the thickness of the substrate 260 to be processed is greater than the first thickness and less than or equal to the second thickness, the laser beam irradiates the first distance difference below the surface of the substrate 260 to be processed to increase the cutting efficiency and avoid carbonization of the cut or reduce the carbonization mark of the cut.

[0202] Optionally, please refer to the serial number 3 and 7 rows in Table 2. For the first material and the second material, the second thickness is 4.5 mm. In other words, when the host computer 400 detects that the material information of the substrate 260 to be processed is basswood plywood or poplar plywood, in the cutting mode, according to the thickness of the substrate 260 to be processed being 4 mm (greater than 3 mm and less than 4.5 mm), it is determined that the target zoom motion parameter corresponds to the object distance of the focusing lens 20 being the third coordinate height. When the object distance of the focusing lens 20 is the third coordinate height, the focal spot height of the laser beam is 2 mm below the surface of the substrate 260 to be processed, that is, when the object distance of the focusing lens 20 is the third coordinate height, the focal spot height of the laser beam is 2 mm.

[0203] The laser processing device 1000 provided in this embodiment can form a file to be processed based on the automatically acquired material, thickness, pattern mode, etc., because the file to be processed takes into account that different materials have different ignition points and different requirements for laser power; and takes into account that different pattern modes on different materials have different processing requirements, so the laser power and focal spot height are different; it also takes into account that different pattern modes on different materials have different processing requirements at different thicknesses, thereby forming a file to be processed that can be generated based on multiple considerations such as different materials, thicknesses, and pattern modes. The file to be processed enables the laser processing device 1000 to determine a better laser power and a suitable position of the focusing lens 20 corresponding to three factors such as different materials, different thicknesses, and different pattern modes, thereby forming a file to be processed.

[0204] During the switching between the engraving mode and the cutting mode, for the substrate 260 to be processed of the first material or the second material, the laser power may remain unchanged, and the position of the focusing lens 20 is adjusted from the first coordinate height to the third coordinate height. For example, if the thickness of the substrate 260 to be processed is 4 mm, the first coordinate height is 4 mm, and the third coordinate height is 2 mm, so as to achieve a 2 mm drop in the focus position.

[0205] The parameters in the file to be processed in the cutting mode also include the cutting speed.

[0206] In this embodiment, the cutting speed in the cutting mode is not specifically limited. For example, the cutting speed in this embodiment may be different according to different materials. For example, for the substrate 260 to be processed of the first material, the cutting speed is 800-1200 mm / min, for example, 1000 mm / min (this data is for example). For the substrate 260 to be processed of the second material, the cutting speed is 400-800 mm / min, for example, 600 mm / min (this data is for example).

[0207] The parameters in the file to be processed in the cutting mode also include the air auxiliary gas flow rate.

[0208] In this embodiment, the air assist gas flow rate in the cutting mode is not specifically limited. For the substrate 260 to be processed of the first material or the second material, the air assist gas flow rate is 20-22 L / min, for example, 21 L / min (this data is for example).

[0209] In a third optional implementation, the host computer 400 is configured to determine that the target zoom motion parameter corresponds to the fourth coordinate height of the object distance of the focusing lens 20 according to the material information of the substrate 260 to be processed being the target material and the thickness of the substrate 260 to be processed being greater than the second thickness and less than or equal to the third thickness. When the object distance of the focusing lens 20 is the fourth coordinate height, the distance between the focal spot height of the laser beam and the surface of the substrate 260 to be processed is the second distance difference.

[0210] Optionally, the target material includes any one of the first material and the second material. In other words, when the host computer 400 detects that the material information of the substrate 260 to be processed is basswood plywood or poplar plywood, in the cutting mode, according to the thickness of the substrate 260 to be processed being greater than the second thickness and less than or equal to the third thickness, the target zoom motion parameter is determined to correspond to the object distance of the focusing lens 20 being the third coordinate height. When the object distance of the focusing lens 20 is the third coordinate height, the distance between the focal spot height of the laser beam and the surface of the substrate 260 to be processed is the second distance difference. The second distance difference is greater than or equal to 1 mm. The second distance difference is less than the thickness of the substrate 260 to be processed. In the present embodiment, the second distance difference is 2.5 mm. When the thickness of the substrate 260 to be processed is a higher thickness, the focal spot height of the laser beam further sinks.

[0211] The thickness of the substrate 260 to be processed is greater than the second thickness and less than or equal to the third thickness, and the thickness of the substrate 260 to be processed is a relatively high thickness. When a laser beam is used to cut a substrate 260 to be processed with a relatively high thickness, when the laser power is 100% of the total power, the host computer 400 controls the target zoom motion parameter to correspond to the object distance of the focusing lens 20 as the fourth coordinate height, so that the focal spot of the laser beam is located at the second distance difference below the surface of the substrate 260 to be processed, so that the heat-affected zone after the laser beam irradiates the substrate 260 to be processed basically covers the thickness of the entire substrate 260 to be processed. Therefore, when the thickness of the substrate 260 to be processed is greater than the second thickness and less than or equal to the third thickness, the laser beam irradiates the second distance difference below the surface of the substrate 260 to be processed to increase the cutting efficiency and avoid carbonization of the cut or reduce the carbonization mark of the cut.

[0212] Optionally, please refer to the serial number 4 and 8 rows in Table 2. For the first material and the second material, the third thickness is 8 mm. In other words, when the host computer 400 detects that the material information of the substrate 260 to be processed is basswood plywood or poplar plywood, in the cutting mode, according to the thickness of the substrate 260 to be processed being 5 mm (greater than 4.5 mm and less than 8 mm), it is determined that the target zoom motion parameter corresponds to the object distance of the focusing lens 20 being the fourth coordinate height. When the object distance of the focusing lens 20 is the fourth coordinate height, the focal spot height of the laser beam is 2.5 mm below the surface of the substrate 260 to be processed, that is, when the object distance of the focusing lens 20 is the fourth coordinate height, the focal spot height of the laser beam is 2.5 mm.

[0213] The laser processing device 1000 provided in this embodiment can form a file to be processed based on the automatically acquired material, thickness, pattern mode, etc., because the file to be processed takes into account that different materials have different ignition points and different requirements for laser power; and takes into account that different pattern modes on different materials have different processing requirements, so the laser power and focal spot height are different; it also takes into account that different pattern modes on different materials have different processing requirements at different thicknesses, thereby forming a file to be processed that can be generated based on multiple considerations such as different materials, thicknesses, and pattern modes. The file to be processed enables the laser processing device 1000 to determine a better laser power and a suitable position of the focusing lens 20 corresponding to three factors such as different materials, different thicknesses, and different pattern modes, thereby forming a file to be processed.

[0214] During the switching between the engraving mode and the cutting mode, for the substrate 260 to be processed of the first material or the second material, the laser power may remain unchanged, and the position of the focusing lens 20 is adjusted from the first coordinate height to the fourth coordinate height. For example, if the thickness of the substrate 260 to be processed is 5 mm, the first coordinate height is 5 mm, and the fourth coordinate height is 2.5 mm, so as to achieve a 2.5 mm drop in the focus position.

[0215] In the process of switching the cutting mode of the substrate 260 to be processed with different thicknesses, for the substrate 260 to be processed with the first material or the second material, the laser power may remain unchanged, and the position of the focusing lens 20 may remain unchanged when switching between the substrates 260 to be processed with a thickness greater than the first thickness and less than or equal to the second thickness. The position of the focusing lens 20 may remain unchanged when switching between the substrates 260 to be processed with a thickness greater than the second thickness and less than or equal to the third thickness.

[0216] The parameters in the file to be processed in the cutting mode also include the cutting speed.

[0217] In this embodiment, the cutting speed in the cutting mode is not specifically limited. For example, the cutting speed in this embodiment may be different according to different materials. For example, for the substrate 260 to be processed of the first material, the cutting speed is 800-1200 mm / min, for example, 1000 mm / min (this data is for example). For the substrate 260 to be processed of the second material, the cutting speed is 400-800 mm / min, for example, 600 mm / min (this data is for example).

[0218] The parameters in the file to be processed in the cutting mode also include the air auxiliary gas flow rate.

[0219] In this embodiment, the air assist gas flow rate in the cutting mode is not specifically limited. For the substrate 260 to be processed of the first material or the second material, the air assist gas flow rate is 20-22 L / min, for example, 21 L / min (this data is for example).

[0220] The embodiment of the present application proposes that the optimal balance value of the focal spot and the Rayleigh length in the laser cutting scene is concentrated at 3 to 8 mm in combination with the thickness of the substrate 260 to be processed. In the cutting mode, the focal position is determined to be 2 mm to 2.5 mm below the upper surface of the substrate 260 to be processed, which is the optimal position for a substrate 260 with a thickness of 3 to 8 mm to be processed.

[0221] In the embodiment of the present application, in order to realize the intelligent switching of the two beam modes in the engraving and cutting scenes, the upper computer 400 allows the operator to realize quick advance editing and selection, and the upper computer 400 sends the execution information to the lower computer 500. The lower computer 500 controls the intelligent switching of the two beam modes through instructions, thereby realizing the change of the beam mode through intelligent zoom to adapt to the requirements of different scenes.

[0222] The laser processing device 1000 has two scenes, engraving and cutting, when processing the substrate 260 to be processed. The engraving scene acts on the upper surface of the substrate 260 to be processed. To ensure the engraving accuracy and the highest energy density, the focus position needs to be accurately located on the upper surface of the substrate 260 to be processed; the cutting scene has a large action distance in the Z-axis direction, and it is necessary to comprehensively consider the focus spot of the light beam, the Rayleigh length, and the thickness of the substrate 260 to be processed to obtain the best spot position, so as to improve the cutting efficiency and cutting effect.

[0223] When the laser processing equipment 1000 is engraving a substrate 260 of different materials, the operator is required to manually set the engraving parameters. Improper setting of the engraving parameters will affect the engraving effect of the material, which can easily cause the material to be scrapped. When the engraving effect is not ideal, the operator is required to re-adjust the parameters of the laser processing equipment 1000, which brings great inconvenience to the operator.

[0224] Based on the above questions, please refer to Fig.17 and Fig.18 The present application embodiment provides a laser processing device 1000, the laser processing device 1000 also includes at least one smoke exhaust component 220 (see Fig.17 221 and 222) and at least one smoke detection module 230 (see Fig.17 231 and 232 in the figure). The housing 900 surrounds and forms a processing space 910 for laser processing. The smoke exhaust channel of the smoke exhaust component 220 is connected to the processing space 910. The smoke detection module 230 is located in the processing space 910. The smoke detection module 230 is used to detect the smoke concentration value in the processing space 910, such as the concentration of PM10. Generally, during the laser processing process, the smoke exhaust component 220 is turned on, and the smoke exhaust component 220 extracts the smoke generated during the processing. On the path of smoke exhaust, the smoke detection module 230 is used to detect the smoke concentration value in the processing space 910.

[0225] The smoke detection module 230 is electrically connected to the host computer 400 .

[0226] See also Fig.18 and Fig.19 In step S710, the smoke detection module 230 sends the detected smoke concentration value generated during the laser processing to the host computer 400.

[0227] Step S720 : The host computer 400 is configured to adjust the target power and / or target processing speed of the laser light source module 10 according to the smoke concentration value detected by the smoke detection module 230 .

[0228] The target processing speed can be controlled by the motion axis driving module 200 .

[0229] Different materials will produce different smoke density values ​​in the same processing mode (such as engraving mode).

[0230] In this embodiment, the smoke detection module 230 detects the smoke concentration value of the substrate 260 to be processed of the current material in real time during processing, and compares the smoke concentration value with the preset smoke concentration range, and intelligently adjusts the target power and / or target processing speed of the laser light source module 10 in real time according to the comparison result. For example, when the detected smoke concentration value is less than the preset smoke concentration range, the target power of the laser light source module 10 is increased, or the processing speed is reduced, or the target power of the laser light source module 10 is increased and the processing speed is reduced, so that the target power and / or target processing speed of the laser light source module 10 are controlled to suitable parameters without manual adjustment, and real-time intelligent monitoring and timely adjustment can be achieved.

[0231] In a first alternative implementation, see Fig.17 At least one of the smoke exhaust components 220 includes a first smoke exhaust module 221. The first smoke exhaust module 221 and the laser module 100 are located on the same side of the substrate 260 to be processed. In other words, the first smoke exhaust module 221 is disposed at a position biased toward the top of the housing 900, for example, the first smoke exhaust module 221 is disposed at a position of the side wall of the housing 900 close to the top wall, or is disposed at the top wall. The first smoke exhaust module 221 is used to generate an upward suction force on the processing table to draw the smoke in the processing process upward.

[0232] See also Fig.17 At least one of the smoke detection modules 230 includes a first smoke detector 231. The first smoke detector 231 is disposed between the laser module 100 and the substrate to be processed 260. Further, the first smoke detector 231 is disposed near the laser beam outlet of the laser module 100 to detect a more accurate smoke concentration.

[0233] The host computer 400 is configured to adjust the target power and / or target processing speed of the laser light source module 10 according to the material of the substrate 260 to be processed and the smoke concentration value detected by the first smoke detector 231 in the engraving mode.

[0234] Specifically, a mapping relationship table between the substrates 260 to be processed of different materials and the preset smoke concentration range is generated and stored in advance.

[0235] Please refer to Table 3, which is a mapping table of different materials of the substrate 260 to be processed and the preset smoke concentration range:

[0236] Table 3

[0237]

[0238]

[0239] Different substrates 260 to be processed have better engraving effects within the corresponding preset smoke concentration range.

[0240] After the engraving starts, the image acquisition module 600 (camera module) determines the type (material) of the substrate 260 to be processed according to the texture and color recognition of the substrate 260 to be processed. The zoom drive module 30 switches the position of the focus lens 20 to the short focus mode. The first smoke detector 231 located at the laser light outlet detects the PM10 concentration in the smoke generated by the laser burning the substrate 260 to be processed in the working space in real time and dynamically adjusts the engraving speed and laser power in real time according to the smoke concentration.

[0241] The slower the engraving speed, the deeper the laser burns, the more smoke is generated, and the higher the PM10 concentration is; the greater the engraving power, the deeper the laser burns, the more smoke is generated, and the higher the PM10 concentration is. The laser processing equipment 1000 can adjust the engraving parameters in real time according to the material of the substrate 260 to be processed obtained by the image acquisition module 600 (camera module) and the PM10 concentration value corresponding to the optimal engraving parameters of the substrate 260 to be processed.

[0242] For example, taking basswood plywood as an example, when the first smoke detector 231 detects that the PM10 concentration in the smoke is 30ug / m 3 (less than 45ug / m3), it means that the engraving speed is too fast or the laser power is insufficient. The first smoke detector 231 feeds back the PM10 concentration in the detected smoke to the host computer 400, and the host computer 400 compares the PM10 concentration in the detected smoke with 45ug / m 3 A comparison is made and it is found that the PM10 concentration in the current smoke is less than the preset smoke concentration range, so the laser power is controlled to increase and / or the engraving speed is controlled to decrease until the PM10 concentration in the smoke detected by the first smoke detector 231 is within the preset smoke concentration range.

[0243] In a second alternative implementation, see Fig. 20 At least one of the smoke exhaust components 220 includes a second smoke exhaust module 222. The second smoke exhaust module 222 is located on the side of the substrate 260 to be processed away from the laser module 100. Optionally, the second smoke exhaust module 222 is arranged on the lower side of the engraved honeycomb plate 240. The second smoke exhaust module 222 is used to generate a downward suction force on the processing space 910 to draw the smoke in the processing process downward.

[0244] At least one of the smoke detection modules 230 includes a second smoke detector 232 .

[0245] The second smoke detector 232 is disposed on a side of the substrate 260 to be processed that is away from the laser module 100. Optionally, the second smoke detector 232 may be disposed at an air outlet of the second smoke exhaust module 222.

[0246] The host computer 400 is configured to adjust the target power and / or target processing speed of the laser light source module 10 in the cutting mode according to the smoke concentration value detected by the second smoke detector 232 being less than a preset smoke concentration range.

[0247] In other words, after the cutting starts, the zoom drive module 30 switches the position of the focusing lens 20 to be in telephoto mode. The second smoke detector 232 located at the bottom of the engraved honeycomb plate 240 detects the PM10 concentration (smoke concentration value) at the bottom of the engraved honeycomb plate 240 in real time, and adjusts the cutting speed and power in real time according to the PM10 concentration threshold. This application does not limit the PM10 concentration threshold. Optionally, the PM10 concentration threshold range is 50-80ug / m 3 At this time, the substrate 260 to be processed has a relatively good cutting effect.

[0248] Generally, the deeper the laser burns the material, the greater the PM10 concentration in the smoke. The PM10 concentration can be converted to obtain the cutting depth information, so the cutting parameters can be identified and adjusted by detecting the PM10 concentration. If the substrate 260 to be processed is not cut through, the smoke will run upwards, and the upper high-power exhaust fan will extract the smoke in time to prevent the smoke generated by the substrate 260 not being cut through from running under the engraved honeycomb panel 240 to affect the recognition accuracy; if the PM10 concentration detected by the second smoke detector 232 at the bottom of the engraved honeycomb panel 240 does not reach the preset value (50-80ug / m 3 ), the laser processing equipment 1000 automatically adjusts the cutting parameters (for example, increases the cutting power and / or decreases the cutting speed) to increase the PM10 concentration at the bottom of the engraved honeycomb panel 240.

[0249] In a third alternative implementation, see Fig.17 and Fig. 20 , this embodiment is a combination of the first optional embodiment and the second optional embodiment, and at least one of the smoke exhaust components 220 includes a first smoke exhaust module 221 and a second smoke exhaust module 222. The first smoke exhaust module 221 and the laser module 100 are located on the same side of the substrate to be processed 260. The second smoke exhaust module 222 is located on the side of the substrate to be processed 260 away from the laser module 100. At least one of the smoke detection modules 230 includes a first smoke detector 231 and a second smoke detector 232. The first smoke detector 231 is arranged between the laser module 100 and the substrate to be processed 260. The second smoke detector 232 is arranged on the side of the substrate to be processed 260 away from the laser module 100.

[0250] The specific implementation process of this embodiment includes the intelligent real-time adjustment of laser parameters according to the smoke detection module 230 in the engraving mode in the first optional embodiment, and also includes the intelligent real-time adjustment of laser parameters according to the smoke detection module 230 in the cutting mode in the first optional embodiment.

[0251] In general technology, when laser is cutting different materials and materials of different thicknesses, the operator needs to manually set the cutting parameters and adjust the laser spot position. If the cutting parameters and the spot position are not set appropriately, it will affect the processing effect and easily cause the substrate 260 to be scrapped. For example, the operator wants to cut a complex pattern on a 5mm thick wooden board, and randomly sets a cutting parameter. After the machine is finished running, the cutting parameters set by the operator can only allow the laser to cut 2mm of the wooden board, and the remaining 3mm is not cut. Then the operator takes the workpiece out directly without knowing it. At this time, it is very difficult to make a second cut along the original cutting trace, and the trajectory of the second cutting is difficult to overlap with the trajectory of the first cutting.

[0252] Based on the above questions, please refer to Fig.21 and Fig. 22 In the laser processing equipment 1000 provided in the present application, at least one smoke exhaust component 220 is located on a side of the substrate 260 to be processed away from the laser module 100. For example, the second smoke exhaust module 222 in the aforementioned embodiment.

[0253] The smoke detection module 230 is disposed on a side of the substrate 260 to be processed away from the laser module 100 , for example, the second smoke detector 232 mentioned above.

[0254] The host computer 400 is configured to control the zoom drive module 30 to drive the focusing lens 20 to move from the short focus mode to the long focus mode in the cutting mode, and determine the zoom motion parameters of the zoom drive module 30 according to whether the smoke concentration value detected by the smoke detection module 230 is greater than or equal to a preset smoke concentration range.

[0255] The present application does not specifically limit the preset smoke concentration range. Optionally, the preset smoke concentration range includes but is not limited to 50-80ug / m 3 The preset smoke concentration range corresponds to a better cutting effect.

[0256] After the cutting starts, the laser light source module 10 starts to work at full power and maximum engraving speed, and the zoom drive module 30 drives the focusing lens 20 to move from the short focus mode to the long focus mode until the smoke concentration detected by the smoke detection module 230 at the bottom of the substrate 260 to be processed reaches the set threshold value (50-80ug / m 3 ), the zoom driving module 30 stops driving the focusing lens 20 to move, indicating that the light spot position is relatively good at this time and the cutting effect is good.

[0257] In this embodiment, when the zoom drive module 30 drives the focusing lens 20 to move from the short focus mode to the long focus mode, the movement of the focusing lens changes the Rayleigh length of the laser beam, and the laser beam has a larger energy density within the Rayleigh length. In the short focus mode, the focusing lens 20 is relatively far away from the laser light outlet. In the long focus mode, the focusing lens 20 is relatively close to the laser light outlet. In the long focus mode, the laser beam is narrower and has a higher energy density.

[0258] When the thickness of the substrate 260 to be processed is within the Rayleigh length range, the problem of the operator setting the spot position sinking depth incorrectly can be effectively avoided. In this embodiment, the operator does not need to manually determine the spot position, and does not need to repeatedly try the optimal spot position, thereby avoiding damage to the substrate 260 to be processed. In the cutting mode, the laser parameters are intelligently adjusted in real time according to the smoke concentration fed back by the smoke detection module 230.

[0259] The present application does not limit the specific structure of the zoom driving module 30 .

[0260] Optional, see Figure 23 to Figure 24 The zoom driving module 30 includes a driving motor 31, a transmission rod 32 and a connecting nut 33. The output shaft of the driving motor 31 is connected to one end of the transmission rod 32. The transmission rod 32 is a screw rod. The connecting nut 33 is threadedly connected to the outer periphery of the transmission rod 32. The focusing lens 20 is located on one side of the transmission rod 32. The focusing lens 20 is connected to the transmission rod 32 via the connecting nut 33. Further, the lens holder 40 of the focusing lens 20 is connected to the transmission rod 32 via the connecting nut 33. The extending direction of the transmission rod 32 is parallel to the optical axis direction of the focusing lens 20.

[0261] Specifically, the driving motor 31 drives the transmission rod 32 to rotate, thereby driving the connecting nut 33 to move along the optical axis direction of the focusing lens 20, specifically to move upward or downward, thereby driving the focusing lens 20 to move along the optical axis direction. When the focusing lens 20 moves along the optical axis direction, the optical imaging system changes, thereby changing the position of the focal spot or changing the position of the focal spot but changing the beam angle, so as to switch to the short-focus mode or the long-focus mode.

[0262] See also Figure 23 to Figure 24 The zoom driving module 30 includes a guide rod 34. The focusing lens 20 is mounted on the lens holder 40. The lens holder 40 slides along the guide rod 34. The guide rod 34 is parallel to the optical axis of the focusing lens 20. The guide rod 34 is used to provide guidance for the focusing lens 20 to move along the optical axis, so that the center of the focusing lens 20 is aligned with the center of the laser beam, and the linear motion is ensured to be more accurate, avoiding errors in the linear motion.

[0263] In an optional implementation, the connection nut 33 may be fixedly connected to the lens holder 40 by means of screws.

[0264] See also Figure 23 to Figure 24 The zoom driving module 30 includes at least one position sensor 35. At least one position sensor 35 is configured to generate a feedback signal when the focusing lens 20 is in the starting position. The position sensor 35 abuts against the lens holder 40 when it is in the starting position. After each processing is completed, the lens holder 40 returns to the starting position, and the lens holder 40 starts to move from the starting position at the beginning of each processing to ensure the accuracy of each movement and reduce repeated motion errors.

[0265] The driving motor 31 includes but is not limited to a stepper motor. The stepper motor can achieve micron-level positioning accuracy through precise pulse signal control. The transmission rod 32 includes but is not limited to a screw. The screw is integrated in the stepper motor to form a screw stepper motor. By directly integrating the screw into the stepper motor, additional transmission components are reduced, the transmission efficiency is improved, thereby simplifying the mechanical design and reducing the transmission error. In addition, the transmission method of the screw and the stepper motor has a simple structure, is easy to produce, and is easy to maintain later, and the screw and the connecting nut 33 have high wear resistance and long service life. In addition, the screw stepper motor also has a self-locking ability. When the control pulse stops inputting, the stepper motor can remain in a fixed position to achieve positioning when the focusing lens 20 stops moving, with high positioning accuracy, so that the focusing lens 20 is accurately located at the target position, and then the focal spot is located at the desired height.

[0266] Figure 23 to Figure 24 In this embodiment, the position of the focusing lens 20 is changed to adjust the laser spot position, while the beam angle changes. In other embodiments, the position of the laser spot and the Rayleigh length of the beam are adjusted by moving the focusing lens 20 .

[0267] In another embodiment, the zoom drive module 30 includes a linear motor and a magnetic spring. The electromagnetic spring includes a magnetic shaft and a sleeve, the sleeve is connected to the mover of the linear motor, and the magnetic shaft is connected to the base of the linear motor. The magnetic shaft can magnetically absorb the sleeve, the sleeve is slidably sleeved on the magnetic shaft, the sleeve is provided with a groove along the axial direction, and the sleeve can rotate around the magnetic shaft to adjust the relative position between the groove and the magnetic shaft. By providing a groove on the sleeve of the electromagnetic spring, the volume of the sleeve at the groove will be inconsistent with the rest of the sleeve, and by adjusting the relative position between the groove and the magnetic shaft, the magnetic attraction of the magnetic shaft to the sleeve at the groove can be changed, so that the magnetic attraction of the magnetic shaft to the sleeve as a whole is consistent with the force required in the actual application scenario of the electromagnetic spring. Among them, a constant thrust or pulling force is provided within the entire stroke range of the linear motor to drive the stable movement of the focusing lens 20, and reduce the jitter and other problems caused by the change of acceleration during the movement of the focusing lens 20.

[0268] For optional reference, see Figure 23 to Figure 24 The laser module 100 further includes a concave lens 60. The concave lens 60 is disposed on an optical path between the laser light source module 10 and the focusing lens 20. The concave lens 60 is used to expand the laser beam.

[0269] The incident light beam emitted by the laser light source module 10 is reflected by the reflective prism and then enters the concave lens 60 for beam expansion. The beam expanded by the concave lens 60 is emitted into the focusing lens 20. The zoom driving module 30 (such as a lead screw stepping motor) moves the focusing lens 20 to obtain the spot size at the focal position.

[0270] Optionally, the zoom part uses a concave lens 60 for beam expansion and a convex lens for focusing, and the focal size, beam angle and focal depth change before and after zooming, so that the position of the focal point remains unchanged, so as to switch between the engraving mode and the cutting mode when the focal spot position remains unchanged. In other embodiments, the zoom part uses a concave lens 60 for beam expansion and a convex lens for focusing, and the focal size, beam angle, focal depth and focal position all change before and after zooming.

[0271] See also Fig.25 , Fig.25 1 is a light path diagram when the focusing lens 20 provided in the embodiment of the present application is located at different positions compared to the concave lens 60 .

[0272] Taking the unchanged focal spot position as an example, let the object distance of the optical system in short-focus mode be U, the image distance be V, the focal length of the convex lens be f, and the travel of the convex lens when switching the focal length be X. To keep the image point position unchanged before and after zooming, according to the Gaussian object-image distance formula:

[0273]

[0274]

[0275] From formula (1) and (2), we can get:

[0276]

[0277] After the focal length f of the convex lens is preliminarily calculated according to formula (3), the corresponding curvature radius of the concave lens 60 can be deduced according to the structure, the initial optical model can be determined, and then further optimized using computer software.

[0278] Pattern engraving (first layer) - air-assisted (weak air mode) - short focus (the focus of the engraving mode is located on the surface of the substrate 260 to be processed);

[0279] Pattern outer contour cutting (second layer) - air assist (strong air mode) - long focus (the focus in the cutting mode is located on the surface of the substrate 260 to be processed) - Z-axis lifting and lowering control focus to the position of 1 / 2 thickness of the substrate 260 to be processed (2mm);

[0280] The command execution is executed according to the layer, and the second layer is executed after the first layer is executed. When each layer is executed, the control assistance, beam mode and the thickness of the substrate 260 to be processed need to be edited in advance. After the editing is completed, the information is sent to the lower computer 500, and the lower computer 500 sends a command to the laser head control board. After receiving the command, the laser head control board drives the motor 31 to drive the focusing lens to move, thereby realizing zooming.

[0281] The laser processing device 1000 provided in the present application includes but is not limited to the following control method steps. For scenes that require engraving and cutting at the same time, such as engraving a high-resolution picture on a 5mm plywood, and then cutting the pattern according to the outer contour. The zoom drive module 30 includes but is not limited to a screw stepper motor.

[0282] The following is an example of the working process of the laser processing equipment 1000.

[0283] In the first step, the host computer 400 identifies the material of the substrate 260 to be processed and obtains the thickness and processing pattern of the substrate 260 to be processed. The parameters for engraving the substrate 260 to be processed are set to generate a file to be processed. The parameters of the file to be processed include the percentage of engraving light source power, speed, the distance from the focal point to the surface of the substrate 260 to be processed (positive on the substrate 260 to be processed, negative inside the substrate 260 to be processed), air pressure and air volume, and the contents of the engraving work are set at the same time.

[0284] The second step is to start the start command on the host computer 400, and pass the above parameters to the slave computer 500, receive the work instructions of the host computer 400, and control the stepper motors of the laser module 100, the motion axis drive module 200, and the zoom drive module 30. According to the corresponding instructions, turn on the laser to a fixed current, drive the x, y, and z three motion axis motors to operate, and drive the stepper motor to control the lead screw to drive the focusing lens 20 to move until the focal spot is located on the surface of the substrate 260 to be processed, that is, the height from the processing platform is 5mm.

[0285] The third step is to switch to the cutting mode after the engraving mode is finished. When the focus spot position needs to be readjusted, the lower computer 500 can control the laser module 100 to stop outputting the laser. During this period, the z-axis drive module is controlled to adjust the height of the laser module 100 according to the thickness of the substrate 260 to be processed to make the focus at a suitable position, for example, 2.5mm below the surface of the substrate 260 to be processed. The lead screw is controlled by the lead screw stepper motor to start running until the focusing lens 20 reaches the target position. After the system switches to the cutting mode, the z-axis drive module gives the lower computer 500 a feedback that the switching is completed. After receiving all the feedback, the lower computer 500 starts to output the laser according to the instruction, and starts cutting after controlling the air pressure and air flow to the corresponding value.

[0286] Step 4: Engraving and cutting can be switched automatically and flexibly at any time according to the above steps. After completing the engraving or cutting work, turn off the laser module 100 and the system returns to the default state, which can be the engraving or cutting state. The air nozzle stops working after a few minutes of continuous work, and the laser fan stops working after a few minutes of continuous work. The system is in a waiting state, waiting for the next work.

[0287] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present application, and these improvements and modifications are also regarded as the scope of protection of the present application.

Claims

1. A laser processing device, characterized in that: The laser processing equipment comprises: A laser module, the laser module comprising a laser light source module, a focusing lens, and a zoom driving module, the laser light source module being configured to emit a laser beam, the focusing lens being located on an optical path of the laser beam, the zoom driving module being connected to the focusing lens, and the zoom driving module being configured to drive the focusing lens to move so as to change a focal spot position and / or a beam angle of the laser beam; A motion axis driving module, the motion axis driving module is connected to the laser module, and the motion axis driving module is configured to drive the laser module to move; A thickness detection module, wherein the thickness detection module is configured to collect thickness information of the substrate to be processed; A host computer, wherein the host computer is configured to obtain material information of the substrate to be processed and receive thickness information of the substrate to be processed collected by the thickness detection module, and generate a file to be processed according to the material information, the thickness information and the pattern to be processed, wherein the file to be processed includes a target power of a laser light source module, a target zoom motion parameter of the zoom driving module, and a target motion axis parameter of the motion axis driving module; and A lower computer, wherein the lower computer is configured to receive the to-be-processed file from the upper computer, and control the power of the laser light source module to be the target power, control the zoom motion parameters of the zoom driving module to be the target zoom parameters, and control the motion axis parameters of the motion axis driving module to be the target motion axis parameters according to the to-be-processed file; The laser processing equipment further includes an image acquisition module, which is configured to acquire an image of the substrate to be processed; the host computer is further configured to receive the image of the substrate to be processed, and determine the material information of the substrate to be processed according to the matching degree between the image of the substrate to be processed and the reference image being greater than or equal to a preset matching degree threshold; and / or, The laser processing equipment further includes a material identification module, which is configured to determine material information of the substrate to be processed according to at least one of the intensity, reflection angle, and spectrum information of the reflection signal of the substrate to be processed.

2. The laser processing equipment according to claim 1, characterized in that: The host computer also includes an editable display module, which is configured to cover the image of the substrate to be processed as a covering layer in the processing area of ​​the editing page of the editable display module, and cover the image of the substrate to be processed with the pattern to be processed. The host computer generates the file to be processed based on the image of the substrate to be processed, the material information, the thickness information and the pattern to be processed.

3. The laser processing equipment according to claim 1, characterized in that: The thickness detection module includes a position probe, the motion axis drive module includes a lifting drive module, the lifting drive module is connected to the position probe, the lifting drive module is configured to drive the position probe to descend to the surface of the substrate to be processed, the position probe is configured to detect a first height coordinate descending to the surface of the substrate to be processed, and the host computer is configured to determine the thickness information of the substrate to be processed according to the first height coordinate and a preset reference height coordinate.

4. The laser processing equipment according to claim 1, characterized in that: When the pattern mode to be processed includes an engraving mode, the host computer is configured to determine, according to the thickness information of the substrate to be processed, that the target zoom motion parameter corresponds to the object distance of the focusing lens as a first coordinate height, and the focal spot height of the laser beam when the object distance of the focusing lens is the first coordinate height is the thickness of the substrate to be processed; The host computer is also configured to determine that the target power is a first power when the material information of the substrate to be processed is a first material, determine that the target power is a second power when the material information of the substrate to be processed is a second material, determine that the target power is a third power when the material information of the substrate to be processed is a third material, and determine that the target power is a fourth power when the material information of the substrate to be processed is a fourth material, and the first power, the second power, the third power and the fourth power decrease in sequence.

5. The laser processing equipment according to claim 1, characterized in that: When the pattern mode to be processed includes a cutting mode, the host computer is configured to determine that the target power is greater than or equal to a preset power; The host computer is configured to determine that the object distance of the focusing lens corresponding to the target zoom motion parameter is a second coordinate height according to the material information of the substrate to be processed being the target material and the thickness of the substrate to be processed being less than or equal to the first thickness, and the focal spot height of the laser beam when the object distance of the focusing lens is the second coordinate height is the thickness of the substrate to be processed; or, The host computer is configured to determine that the target zoom motion parameter corresponds to the object distance of the focusing lens being a third coordinate height, and the distance between the focal spot height of the laser beam and the surface of the substrate to be processed is a first distance difference when the object distance of the focusing lens is the third coordinate height, based on the material information of the substrate to be processed being the target material and the thickness of the substrate to be processed being greater than the first thickness and less than or equal to the second thickness; or The host computer is configured to determine that the target zoom motion parameter corresponds to the object distance of the focusing lens as a fourth coordinate height based on the material information of the substrate to be processed being the target material and the thickness of the substrate to be processed being greater than the second thickness and less than or equal to the third thickness, and that when the object distance of the focusing lens is the fourth coordinate height, the distance between the focal spot height of the laser beam and the surface of the substrate to be processed is the second distance difference.

6. The laser processing equipment according to any one of claims 1 to 5, characterized in that: The lower computer is configured to form a pre-processing trace on the substrate to be processed according to the target power and the target zoom motion parameter in the file to be processed; The laser processing equipment also includes a camera module, which is configured to obtain an image of the pre-processing trace; the host computer is used to receive the image of the pre-processing trace from the camera module, obtain parameters of the pre-processing trace according to the image of the pre-processing trace, and calibrate the target power and / or the target zoom motion parameters in the file to be processed when the parameters of the pre-processing trace are outside a preset parameter range.

7. The laser processing equipment according to any one of claims 1 to 5, characterized in that: The laser processing equipment also includes a shell, at least one smoke exhaust component and at least one smoke detection module; the shell surrounds a processing space for laser processing, the smoke exhaust channel of the smoke exhaust component is connected to the processing space, the smoke detection module is located in the processing space, the smoke detection module is used to detect the smoke concentration value in the processing space, the smoke detection module is electrically connected to the host computer, and the host computer is configured to adjust the target power and / or target processing speed of the laser light source module according to the smoke concentration value detected by the smoke detection module.

8. The laser processing equipment according to claim 7, characterized in that: At least one of the smoke exhaust components includes a first smoke exhaust module, the first smoke exhaust module and the laser module are located on the same side of the substrate to be processed, at least one of the smoke detection modules includes a first smoke detector, the first smoke detector is arranged between the laser module and the substrate to be processed, and the host computer is configured to adjust the target power and / or target processing speed of the laser light source module according to the material of the substrate to be processed and the smoke concentration value detected by the first smoke detector in the engraving mode; and / or, At least one of the smoke exhaust components includes a second smoke exhaust module, which is located on the side of the substrate to be processed away from the laser module. At least one of the smoke detection modules includes a second smoke detector, which is located on the side of the substrate to be processed away from the laser module. The host computer is configured to adjust the target power and / or target processing speed of the laser light source module in the cutting mode according to the smoke concentration value detected by the second smoke detector being less than a preset smoke concentration range.

9. The laser processing equipment according to claim 7, characterized in that: The smoke exhaust component is located on a side of the substrate to be processed away from the laser module, the smoke detection module is arranged on a side of the substrate to be processed away from the laser module, and the host computer is configured to control the zoom drive module to drive the focusing lens to move from the short focus mode to the long focus mode in the cutting mode, and determine the zoom motion parameters of the zoom drive module according to whether the smoke concentration value detected by the smoke detection module is greater than or equal to a preset smoke concentration range.

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