A method for improving the R corner edge collapse of a target

Abstract

The present application relates to a kind of methods for improving target outer circle R angle edge collapse, the method comprises the following steps: the outer circle structure of target is ground processing, the outer circle structure of target includes bevel, and the straight stage connected with the bevel and the straight stage connected with the inverted R angle;The grinding processing includes: first using straight grinding head to carry out the first grinding of the outer circle of target, and the outer circle of target is machined to product diameter, and the straight stage is obtained by processing;Then using bevel grinding head carries out the second grinding of the bevel of target;Afterwards, the junction of bevel and straight stage is ground by using straight grinding head, and the inverted R angle is obtained by processing.The method provided by the present application is for the target machining with large bevel and the outer circle setting inverted R angle structure, can greatly reduce the scrap rate of hard and brittle target in the case where guaranteeing keeping target machining efficiency, avoid target edge collapse problem.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of target material processing, in particular to a method for improving the R-angle edge collapse of a target material. BACKGROUND

[0002] Target materials are key materials used in sputtering coating processes and are widely used in the fields of integrated circuits, flat panel displays, solar cells, etc.

[0003] Grinding head processing of target materials is an important link in the preparation process of target materials, mainly used to improve the surface roughness of target materials, reduce particle generation during the coating process, accurately control the size and shape of target materials to adapt to specific sputtering equipment and process requirements, and perform beveling on the edges of target materials to reduce edge effects during coating, etc. Among them, hard and brittle target materials such as chromium silicon and tungsten silicon have high hardness and low toughness, which leads to damage during grinding head processing. Especially for target materials with an inclined plate structure and a reverse R-angle, this structure can improve the magnetic field strength, promote the resputtering of the anti-sputtering layer, improve the problem of too high particles at the end of use, and avoid abnormal discharge caused by sharp corners on the surface of the target material. However, hard and brittle target materials with this structure will have the R-angle squeezed by the grinding head during grinding head processing, causing the weak tip to break to varying degrees. However, the product size has been processed at this time, and the collapsed edge will be bonded with the solder, making it difficult to remove debris, which will cause serious particle and abnormal discharge problems during physical vapor deposition, causing the target material to be unusable.

[0004] Therefore, it is a technical problem in the current field to provide a method for improving the R-angle edge collapse of a target material. SUMMARY

[0005] To solve the above problems, the purpose of the present application is to provide a method for improving the R-angle edge collapse of a target material. Compared with the prior art, the method provided by the present application is suitable for processing target materials with large bevels and reverse R-angle structures on the outer circle, which can greatly reduce the scrap rate of hard and brittle target materials while ensuring the processing efficiency of the target material, and avoid the problem of target material edge collapse.

[0006] To achieve the purpose of the present application, the following technical solutions are adopted:

[0007] The present application provides a method for improving the R-angle edge collapse of a target material, which comprises the following steps:

[0008] Grinding treatment is performed on the outer circle structure of the target material, wherein the outer circle structure of the target material comprises a bevel, a reverse R-angle connected to the bevel, and a straight step connected to the reverse R-angle;

[0009] The grinding process includes: firstly, using a straight grinding head to perform first grinding on the outer circle of the target material, so that the outer circle of the target material is machined to a product diameter, and a straight step is obtained;

[0010] Then, using an inclined grinding head to perform second grinding on the bevel of the target material;

[0011] Then, using a straight grinding head to perform third grinding on the connection between the bevel and the straight step, so that a reverse R corner is obtained.

[0012] In the method provided by the application, the outer circle structure of the hard and brittle target material is optimally designed, on the one hand, compared with the existing target material structure, the straight step is additionally arranged, so that the thickness increase of the target material can be controlled, since the straight step is connected with the reverse R corner of the outer circle of the target material, the reverse R corner can bear higher grinding head pressure; on the other hand, compared with the existing target material structure, the radius of the reverse R corner is controlled to be smaller, so that the grinding amount during machining of the reverse R corner is smaller, and the pressure of the grinding head on the reverse R corner of the target material is reduced; on the other hand, by controlling the rotation speed and the feed amount of the first grinding, the second grinding and the third grinding, the grinding degree of the grinding head on the target material is further controlled, so that the effect of preventing the target material from edge collapse is finally achieved, the yield of the target material is improved, and the scrap rate of the target material is reduced.

[0013] Preferably, the material of the target material includes any one of chromium silicon, tungsten silicon, aluminum oxide, quartz or silicon carbide.

[0014] Preferably, the thickness of the straight step is 0.5-3mm, for example, can be 0.5mm, 0.6mm, 0.8mm, 1mm, 1.2mm, 1.4mm, 1.6mm, 1.8mm, 2mm, 2.2mm, 2.4mm, 2.6mm, 2.8mm or 3mm, but is not limited to the listed values, and other values not listed in the value range are also applicable.

[0015] In the application, by preferably controlling the thickness of the straight step in a specific range, the bearing capacity of the target material to the grinding head is improved by appropriately increasing the thickness, since the thickness of the back plate is correspondingly reduced by arranging the straight step to increase the thickness of the side of the target material, so that the overall thickness of the product is basically unchanged.

[0016] Preferably, the radius of the reverse R corner is 0.5-2mm, for example, can be 0.5mm, 1mm, 1.2mm, 1.4mm, 1.6mm, 1.8mm or 2mm, but is not limited to the listed values, and other values not listed in the value range are also applicable.

[0017] In the present application, by preferably controlling the radius of the inverse R angle in a certain range, appropriately reducing the radius of the inverse R angle, the cutting amount can be reduced, the pressure of grinding on the inverse R angle of the target material is reduced, since the straight step is tangent to the inverse R angle, the thickness of the straight step will increase when the inverse R angle is reduced without changing other dimensions, so that the straight step can be generated without increasing the thickness of the target material, thereby reducing the risk of edge collapse.

[0018] In the present application, the angle of the bevel grinding head is consistent with the angle of the bevel, and the angle of the bevel is generally 10-45°, and a suitable bevel grinding head can be selected according to the angle.

[0019] Preferably, the material of the straight grinding head or the bevel grinding head comprises diamond.

[0020] Preferably, the grinding head rotation speed of the first grinding is 3000-4000 rpm, for example, it can be 3000 rpm, 3100 rpm, 3200 rpm, 3300 rpm, 3400 rpm, 3500 rpm, 3600 rpm, 3700 rpm, 3800 rpm, 3900 rpm or 4000 rpm, but not limited to the listed values, other values not listed in the value range are also applicable.

[0021] Preferably, the feed amount of the first grinding is 0.005-0.05 mm, for example, it can be 0.005 mm, 0.01 mm, 0.04 mm, 0.042 mm, 0.044 mm, 0.046 mm, 0.048 mm or 0.05 mm, but not limited to the listed values, other values not listed in the value range are also applicable.

[0022] Preferably, the grinding head rotation speed of the second grinding is 3000-4000 rpm, for example, it can be 3000 rpm, 3100 rpm, 3200 rpm, 3300 rpm, 3400 rpm, 3500 rpm, 3600 rpm, 3700 rpm, 3800 rpm, 3900 rpm or 4000 rpm, but not limited to the listed values, other values not listed in the value range are also applicable.

[0023] Preferably, the feed amount of the second grinding is 0.005-0.05 mm, for example, it can be 0.005 mm, 0.01 mm, 0.04 mm, 0.042 mm, 0.044 mm, 0.046 mm, 0.048 mm or 0.05 mm, but not limited to the listed values, other values not listed in the value range are also applicable.

[0024] In the present application, by preferably controlling the grinding head rotation speed and the feed amount in the first grinding and the second grinding in a certain range, the processing efficiency of the target material can be improved, the roughness of the target material surface is reduced, so that the shape of the target material meets the requirements.

[0025] Preferably, the third grinding head rotation speed is 1000-2000 rpm, for example, it can be 1000 rpm, 1100 rpm, 1200 rpm, 1300 rpm, 1400 rpm, 1500 rpm, 1600 rpm, 1700 rpm, 1800 rpm, 1900 rpm or 2000 rpm, but not limited to the listed values, other values not listed in the value range are also applicable.

[0026] Preferably, the third grinding feed amount is 0.01-0.02 mm, for example, it can be 0.01 mm, 0.012 mm, 0.014 mm, 0.015 mm, 0.016 mm, 0.018 mm or 0.02 mm, but not limited to the listed values, other values not listed in the value range are also applicable.

[0027] In the present application, by preferably controlling the third grinding head rotation speed and feed amount in a certain range, the risk of edge collapse of the inverted R angle can be reduced.

[0028] As a preferred technical solution of the present application, the method comprises the following steps:

[0029] The outer circular structure of the target material comprises an inclined edge, an inverted R angle connected to the inclined edge, and a straight step connected to the inverted R angle, and the material of the target material comprises any one of chromium silicon, tungsten silicon, aluminum oxide, quartz or silicon carbide.

[0030] The grinding process comprises: first, using a straight grinding head to grind the outer circle of the target material at a rotation speed of 3000-4000 rpm and a feed amount of 0.005-0.05 mm to perform first grinding, so that the outer circle of the target material is machined to the product diameter, and a straight step with a thickness of 0.5-3 mm is obtained; then using an inclined grinding head with an inclination angle of 10-40° to grind the inclined edge of the target material at a rotation speed of 3000-4000 rpm and a feed amount of 0.005-0.05 mm to perform second grinding; and then using a straight grinding head to grind the connection between the inclined edge and the straight step at a rotation speed of 1000-2000 rpm and a feed amount of 0.01-0.02 mm to perform third grinding to obtain an inverted R angle with a radius of 0.5-2 mm, and the material of the straight grinding head or the inclined grinding head comprises diamond.

[0031] Compared with the prior art, the present application has the following beneficial effects:

[0032] (1) The present application increases the straight step compared with the existing target material structure, so that the thickness of the target material can be controlled to increase, and since the straight step is connected to the inverted R angle of the outer circle of the target material, the inverted R angle can withstand higher grinding head pressure.

[0033] (2) The present application controls the radius of the reduced R angle compared to the existing target material structure, thereby making the grinding amount smaller when the R angle is processed, and reducing the pressure of the grinding head on the R angle of the target material.

[0034] (3) On the basis of the optimization of the outer circle structure of the target material, the present application further controls the grinding degree of the grinding head on the target material by controlling the grinding head rotating speed and the feed rate and other parameter conditions of the first grinding, the second grinding and the third grinding, and finally effectively achieves the effect of preventing the edge collapse of the target material, improves the yield of the target material, reduces the scrap rate of the target material, and can make the yield of the target material reach more than 80.1%, and under the more optimal conditions, can reach more than 90.2%. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 It is a schematic diagram of the outer circle structure of the target material in Example 1.

[0036] Figure 2 It is a schematic diagram of the outer circle structure of the target material in Comparative Example 1. DETAILED DESCRIPTION

[0037] The technical solutions of the present application will be further illustrated by specific embodiments. Those skilled in the art should understand that the embodiments are only to help understand the present application, and should not be regarded as specific limitations of the present application.

[0038] Example 1

[0039] The present embodiment provides a method for improving the edge collapse of the R angle of the outer circle of the target material, which comprises the following steps:

[0040] The outer circle structure of the target material is subjected to grinding treatment, the outer circle structure of the target material comprises a bevel, a R angle connected with the bevel and a straight step connected with the R angle, and the target material is a chromium-silicon target material;

[0041] The grinding treatment comprises: first, using a straight grinding head to grind the outer circle of the target material under the conditions of a rotating speed of 3500 rpm and a feed rate of 0.045 mm for the first grinding, so as to process the outer circle of the target material to the product diameter and obtain a straight step with a thickness of 1 mm; then using a bevel grinding head with an inclination angle of 15° to grind the bevel of the target material under the conditions of a rotating speed of 3500 rpm and a feed rate of 0.045 mm for the second grinding; and then using a straight grinding head to grind the connection between the bevel and the straight step under the conditions of a rotating speed of 1500 rpm and a feed rate of 0.015 mm for the third grinding, so as to obtain a R angle with a radius of 1.5 mm, the material of the straight grinding head or the bevel grinding head is diamond, and the outer circle structure of the obtained target material is as shown in Figure 1

[0042] Example 2

[0043] ​The embodiment provides a method for improving the R corner edge collapse of a target outer circle, and the method comprises the following steps.

[0044] The outer circle structure of the target is subjected to grinding treatment, the outer circle structure of the target comprises a bevel, a reverse R corner connected with the bevel, and a straight step connected with the reverse R corner, and the target is a chromium-silicon target;

[0045] The grinding treatment comprises the following steps: first, the outer circle of the target is subjected to first grinding by using a straight grinding head under the condition that the rotating speed is 3000 rpm and the feeding amount is 0.04 mm, so that the outer circle of the target is machined to a product diameter, and a straight step with a thickness of 2 mm is obtained; then, the bevel of the target is subjected to second grinding by using an inclined grinding head with an inclination angle of 10° under the condition that the rotating speed is 4000 rpm and the feeding amount is 0.04 mm; and finally, the connection between the bevel and the straight step is subjected to third grinding by using a straight grinding head under the condition that the rotating speed is 2000 rpm and the feeding amount is 0.01 mm, so that a reverse R corner with a radius of 1.2 mm is obtained, and the material of the straight grinding head or the inclined grinding head is diamond.

[0046] Embodiment 3

[0047] The embodiment provides a method for improving the R corner edge collapse of a target outer circle, and the method comprises the following steps.

[0048] The outer circle structure of the target is subjected to grinding treatment, the outer circle structure of the target comprises a bevel, a reverse R corner connected with the bevel, and a straight step connected with the reverse R corner, and the target is a tungsten-silicon target;

[0049] The grinding treatment comprises the following steps: first, the outer circle of the target is subjected to first grinding by using a straight grinding head under the condition that the rotating speed is 4000 rpm and the feeding amount is 0.05 mm, so that the outer circle of the target is machined to a product diameter, and a straight step with a thickness of 3 mm is obtained; then, the bevel of the target is subjected to second grinding by using an inclined grinding head with an inclination angle of 20° under the condition that the rotating speed is 3000 rpm and the feeding amount is 0.05 mm; and finally, the connection between the bevel and the straight step is subjected to third grinding by using a straight grinding head under the condition that the rotating speed is 1000 rpm and the feeding amount is 0.02 mm, so that a reverse R corner with a radius of 1 mm is obtained, and the material of the straight grinding head or the inclined grinding head is diamond.

[0050] Embodiment 4

[0051] The embodiment provides a method for improving the R corner edge collapse of a target outer circle, and the method is different from the method in the embodiment 1 only in that the thickness of the straight step is 0.1 mm.

[0052] Embodiment 5

[0053] The embodiment provides a method for improving the R corner edge collapse of the outer circle of a target material, and the difference between the method and the embodiment 1 is that the radius of the inverted R corner is 2.5 mm.

[0054] Embodiment 6

[0055] The embodiment provides a method for improving the R corner edge collapse of the outer circle of a target material, and the difference between the method and the embodiment 1 is that the rotating speed of the grinding head of the third grinding is 800 rpm.

[0056] Embodiment 7

[0057] The embodiment provides a method for improving the R corner edge collapse of the outer circle of a target material, and the difference between the method and the embodiment 1 is that the rotating speed of the grinding head of the third grinding is 2500 rpm.

[0058] Embodiment 8

[0059] The embodiment provides a method for improving the R corner edge collapse of the outer circle of a target material, and the difference between the method and the embodiment 1 is that the feeding amount of the third grinding is 0.06 mm.

[0060] Comparative Example 1

[0061] The comparative example provides a method for improving the R corner edge collapse of the outer circle of a target material, and the difference between the method and the embodiment 1 is that no straight step is arranged, and the inverted R corner is directly connected with the back plate, and the outer circle structure of the obtained target material is as shown in Figure 2

[0062] The target materials obtained by the methods in the embodiments 1-8 and the comparative example 1 are subjected to full inspection, and the yield rate of the target material is obtained, and the results are shown in Table 1.

[0063] Table 1

[0064] Yield / % Example 1 95.3 Example 2 92.5 Example 3 90.2 Example 4 81.5 Example 5 83.2 Example 6 86.7 Example 7 88.3 Example 8 80.1 Comparative Example 1 0

[0065] From the data in Table 1, it can be seen that:

[0066] (1) The yield rate of the target material can reach more than 80.1% by using the method provided by the application, and can reach more than 90.2% under the more optimal conditions.

[0067] (2) According to the data of the embodiment 1, the embodiments 4-5 and the comparative example 1, it can be seen that the yield rate of the embodiment 1 is obviously higher than that of the embodiments 4-5 and the comparative example 1, and thus it can be seen that the yield rate of the target material can be further improved by optimizing the outer circle structure and controlling the thickness of the straight step and the radius of the inverted R corner in a specific range.

[0068] ​(3) By comparing the data of example 1 and examples 6-8, it can be seen that the yield of example 1 is obviously higher than that of examples 6-8, so it can be seen that by preferably controlling the grinding head rotating speed and the feed amount of the third grinding, the yield of the target material can be further improved.

[0069] In summary, the method provided by the present application is suitable for processing target material with large bevel and outer circle with inverted R corner structure, which can greatly reduce the rejection rate of hard and brittle target material and avoid the problem of target material edge collapse while ensuring the processing efficiency of the target material.

[0070] The applicant declares that the above description is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. It should be understood by those skilled in the art that any changes or replacements within the technical scope disclosed by the present application can be easily thought out by any person skilled in the art, and all of them fall within the protection scope and disclosure scope of the present application.

Claims

1. A method for improving R corner edge collapse of a target material, the method comprising: The method includes the following steps: The outer circular structure of the target material is ground, and the outer circular structure of the target material includes a bevel, a chamfer connected to the bevel, and a straight step connected to the chamfer. The grinding process includes: firstly, using a straight grinding head to perform a first grinding on the outer circle of the target material, so that the outer circle of the target material is machined to the product diameter, and a straight step is obtained; Then, a slant grinding head is used to perform a second grinding on the slant edge of the target material; Then, a straight grinding head is used to perform a third grinding on the connection between the bevel and the straight step to obtain the chamfer.

2. The method of claim 1, wherein, The target material includes any one of chromium silicon, tungsten silicon, alumina, quartz, or silicon carbide.

3. The method of claim 1, wherein, The thickness of the straight step is 0.5-3mm.

4. The method of claim 1, wherein, The radius of the chamfer is 0.5-2mm.

5. The method of claim 1, wherein, The material of the straight or slanted grinding head includes diamond.

6. The method of claim 1, wherein, The grinding head of the first grinding process rotates at 3000-4000 rpm.

7. The method of claim 1, wherein, The feed rate for the first grinding is 0.005-0.05 mm.

8. The method of claim 1, wherein, The grinding head speed for the second grinding is 3000-4000 rpm.

9. The method of claim 1, wherein, The feed rate for the second grinding is 0.005-0.05 mm.

10. The method according to claim 1, characterized in that, The grinding head of the third grinding process rotates at a speed of 1000-2000 rpm.

11. The method according to claim 1, characterized in that, The feed rate for the third grinding step is 0.01-0.02 mm.

12. The method according to claim 1, characterized in that, The method includes the following steps: The outer circular structure of the target material is ground. The outer circular structure of the target material includes a bevel, a chamfer connected to the bevel, and a straight step connected to the chamfer. The material of the target material includes any one of chromium silicon, tungsten silicon, alumina, quartz, or silicon carbide. The grinding process includes: firstly, using a straight grinding head, the outer circle of the target material is ground at a speed of 3000-4000 rpm and a feed rate of 0.005-0.05 mm to achieve the target material's outer circle diameter and obtain a straight step with a thickness of 0.5-3 mm; then, using an inclined grinding head with a tilt angle of 10-40°, the inclined edge of the target material is ground at a speed of 3000-4000 rpm and a feed rate of 0.005-0.05 mm; finally, using a straight grinding head, the connection between the inclined edge and the straight step is ground at a speed of 1000-2000 rpm and a feed rate of 0.01-0.02 mm to obtain a chamfer with a radius of 0.5-2 mm. The material of the straight grinding head or the inclined grinding head includes diamond.

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