A damage-resistant chip packaging device

Abstract

The present application relates to the field of chip processing, and specifically, to an anti-damage chip packaging device, comprising a base plate and a shell, wherein the base plate is connected to the chip through bonding wires; further comprising a fixed U-shaped frame and a feed belt arranged inside the fixed U-shaped frame; a plurality of fixing plates are arranged on the feed belt, and each fixing plate is provided with a fixing mechanism for fixing the base plate and the shell; an injection hole connected to the interior is arranged at the edge of each side wall of the shell, and the axis of the injection hole is located between the corresponding bonding wire, the fixing plate and the chip; a gantry is arranged at the center of the top of the U-shaped frame, and a hydraulic rod is arranged at the center of the gantry, the hydraulic rod is arranged in a vertical state, the actuator of the hydraulic rod passes through the gantry and is provided with a glue injection box; the packaging mechanism is arranged at the center of the bottom of the glue injection box and can package the chip through a plurality of injection holes; the present application performs packaging by infiltration from bottom to top through a plurality of syringes, thereby ensuring the integrity of the bonding wires and improving the packaging effect.

Description

Technical Field

[0001] The present application relates to the field of chip processing, and in particular, to a damage-resistant chip packaging device. Background Art

[0002] Packaging refers to the shell used to install semiconductor integrated circuit chips. Using a series of technologies, the chip is laid out, pasted, fixed and connected on the frame, and the wiring terminals are led out and fixed by encapsulation with a plastic insulating medium to form an overall three-dimensional structure. This concept is a narrow definition of packaging. In layman's terms, it means adding a shell to the chip and fixing it on the circuit board.

[0003] Chinese patent: CN118213302A discloses a chip packaging device including a base plate, a positioning mechanism is provided at one end of the base plate, a placement table is provided at the other end of the base plate, a transfer mechanism is provided between the positioning mechanism and the placement table, and a packaging mechanism is provided on the base plate. The positioning mechanism can position the packaging substrate.

[0004] In this application, when injecting glue through the second glue injection hole, since the bonding wire is located below the second glue injection hole, the glue will directly impact the bonding wire, which may cause the bonding wire to bend or deform, thereby affecting the packaging effect. Summary of the invention

[0005] The main purpose of the present application is to provide a damage-resistant chip packaging device, which uses multiple injection barrels to perform packaging from bottom to top infiltration, thereby ensuring the integrity of the bonding wire and improving the packaging effect.

[0006] To achieve the above object, the present application provides an anti-damage chip packaging device, including a bottom plate and a housing; the bottom plate is connected with a chip through a plurality of bonding wires, and the housing is arranged on the bottom plate to protect the chip; it further includes a fixed U-shaped frame, a positioning mechanism and a packaging mechanism; a feeding belt is arranged inside the U-shaped frame, and a plurality of fixing plates are equidistantly arranged on the feeding belt. The positioning mechanism is arranged on the fixing plates and is used to fix the bottom plate and the housing; injection holes communicating with the inside are arranged at the edge of each side wall of the housing, and the axis of the injection hole is located between the corresponding bonding wire, the fixing plate and the chip; a gantry is arranged at the center of the top of the U-shaped frame, and a hydraulic rod is arranged at the center of the gantry. The hydraulic rod is arranged vertically, and the execution part of the hydraulic rod passes through the gantry and is provided with a glue injection box; the packaging mechanism is arranged at the center of the bottom of the glue injection box and can package the chip through a plurality of injection holes; the packaging mechanism includes a mounting plate, an adjusting rack and an injection cylinder; the mounting plate is arranged horizontally at the center of the bottom of the glue injection box, a mounting groove is arranged at the center of the mounting plate, a driving motor is arranged in the mounting groove vertically, two driving gears are equidistantly arranged on the motor shaft of the driving motor, positioning parts are arranged on the four sides of the bottom of the mounting plate, there are four adjusting racks, each adjusting rack is provided with a strip-shaped chute, and the positioning parts can slide in the corresponding strip-shaped chute. The four adjusting racks are in a cross shape and two adjacent adjusting racks are arranged up and down in sequence. The adjusting racks are respectively meshed with the corresponding driving gears; a vertical plate is arranged at one end of each adjusting rack away from the center of the mounting plate, a mounting hole is arranged on each vertical plate, and an injection cylinder is arranged in each mounting hole. The injection cylinder, the vertical plate and the adjusting rack are in a U-shaped shape, and the opening direction of the injection cylinder faces away from the vertical plate. One end of each injection cylinder close to the vertical plate is communicated with the glue injection box through a connecting hose, and a plurality of semi-circular notches are arranged along the axial direction of each injection cylinder.

[0007] Preferably, a semi-circular blocking plate for blocking the semi-circular notch is hinged in each semi-circular notch. A guiding hole is arranged at the center of the inner wall of the bottom of the injection cylinder. A guiding rod is slidably arranged in each guiding hole. A plurality of conical guiding parts for opening the semi-circular notch are equidistantly arranged along the axial direction of the guiding rod. A guiding post matching with the conical guiding part is arranged on the inner wall of one side of each semi-circular blocking plate close to the guiding rod; a transverse plate is arranged at one end of each guiding rod away from the opening of the injection cylinder. The transverse plate is located outside the injection cylinder. Reset rods extending towards the opening direction of the injection cylinder are arranged at both ends of the transverse plate. Extension blocks are arranged on both sides of each vertical plate, and reset holes for the reset rods to pass through are arranged on each extension block. The reset rods pass through the corresponding reset holes and are provided with limiting discs. A reset spring is sleeved on each reset rod.

[0008] Preferably, one end of each guiding post away from the semi-circular blocking plate is set to be a rounded corner.

[0009] Preferably, the four walls of the shell are provided with rectangular grooves connected to the corresponding injection holes, and a sealing plate for sealing the injection hole is slidably arranged in each rectangular groove. The outer wall of each sealing plate away from the rectangular groove is provided with a triangular section, and the opening end of each injection barrel is provided with a triangular guide portion matching the triangular section.

[0010] Preferably, each group of positioning mechanisms includes a rectangular bar and a positioning bar; a rectangular groove is provided at the center of each fixed plate, and the rectangular bar is slidably arranged in the corresponding rectangular groove; a supporting plate for placing the bottom plate is provided on the top of each rectangular bar, and a cross slide groove is also provided on each fixed plate, and the cross slide groove is connected to the corresponding rectangular groove; there are four positioning bars, and the positioning bars can be slidably arranged at the corresponding ends of the cross slide groove, and a traction rope is provided on the side of each positioning bar close to the rectangular groove, and each outer wall of the rectangular bar is provided with a strip avoidance groove for avoiding the traction rope, and the end of each traction rope away from the corresponding positioning bar is arranged in the corresponding strip avoidance groove.

[0011] Preferably, each traction rope is sleeved with a separation spring, and four guide plates are arranged in each cross slide groove. The four guide plates are distributed in a rectangular shape, and each guide plate is provided with a rope guide hole. The separation spring is located between the corresponding guide plate and the positioning strip.

[0012] Preferably, a feeding motor for driving the feeding belt is also provided on one side of the U-shaped frame.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. In the present application, through the cooperation of the injection cylinder and the adjustment rack, with the cooperation of the driving motor, the four adjustment racks are arranged in a tic-tac-toe formation, so that the four injection cylinders can be synchronously extended into the shell, and the injection cylinder is located between the bonding wire and the chip. By filling from the inside out, the damage to the bonding wire can be avoided, ensuring the chip packaging effect.

[0015] 2. In the present application, through the cooperation of the semicircular sealing plate and the guide rod, when the injection barrel is extended into the shell, the semicircular sealing plate can rotate along the hinge position with the cooperation of the conical guide portion on the corresponding guide rod. At this time, the semicircular sealing plate is located between two adjacent bonding wires, thereby preventing the adjacent bonding wires from sticking to each other during the injection process, causing damage to the chip.

[0016] 3. The present application is provided with a sealing plate. As the syringe moves, the triangular guiding portion provided at the opening of the syringe can contact the triangular cross-section on the corresponding sealing plate, so that the sealing plate can move in the direction away from the injection hole, so that the syringe can extend into the shell through the injection hole. After the injection is completed, the syringe moves in the direction away from the shell. When the syringe completely leaves the shell, the sealing plate can seal the injection hole under the action of gravity to prevent the packaging glue from overflowing, and at the same time, it can facilitate the subsequent processing of the packaged shell and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting a part of this application are used to provide a further understanding of this application, so that other features, purposes and advantages of this application become more obvious. The schematic embodiment drawings and their descriptions of this application are used to explain this application and do not constitute an improper limitation on this application. In the drawings:

[0018] Figure 1 is a stereogram of the present invention;

[0019] Figure 2 The local stereo decomposition of the present invention Figure 1 ;

[0020] Figure 3 It is the local stereoscopic Figure 1 ;

[0021] Figure 4 yes Figure 3 A partial enlarged view of the middle part;

[0022] Figure 5 The local stereo decomposition of the present invention Figure 2 ;

[0023] Figure 6 yes Figure 5 A partial enlarged view of point B in the middle;

[0024] Figure 7 It is the local stereoscopic Figure 2 ;

[0025] Figure 8 The local stereo decomposition of the present invention Figure 3 ;

[0026] Fig. 9 The local stereo decomposition of the present invention Figure 4 ;

[0027] Fig.10 yes Fig. 9 A partial enlarged view of point C in the middle.

[0028] The numbers in the above figure are:

[0029] 1 - Base plate; 11 - Bonding wire; 12 - Chip;

[0030] 2 - Housing; 21 - Injection hole; 22 - Rectangular notch; 23 - Sealing plate; 231 - Triangular section;

[0031] 3 - U - shaped frame; 31 - Feeding belt; 32 - Fixed plate; 321 - Rectangular groove; 322 - Cross chute; 323 - Guide plate; 324 - Rope guiding hole; 33 - Gantry; 34 - Hydraulic rod; 341 - Glue injection box; 35 - C - shaped mounting part; 351 - Temporary storage plate; 352 - Arc - shaped lifting strip; 36 - Feeding motor;

[0032] 4 - Positioning mechanism; 41 - Rectangular bar; 411 - Supporting plate; 412 - Strip - shaped avoidance groove; 42 - Positioning bar; 421 - Towing rope; 422 - Separation spring;

[0033] 5 - Encapsulation mechanism; 51 - Mounting plate; 511 - Mounting groove; 512 - Driving motor; 513 - Driving gear; 514 - Positioning part; 52 - Adjusting rack; 521 - Strip - shaped chute; 522 - Vertical plate; 5221 - Mounting hole; 523 - Extension block; 5231 - Reset hole; 53 - Syringe; 531 - Connecting hose; 532 - Semi - circular notch; 533 - Semi - circular sealing plate; 5331 - Guide post; 534 - Guide hole; 535 - Guide rod; 5351 - Conical guiding part; 5352 - Horizontal plate; 5353 - Reset rod; 5354 - Limiting disc; 5355 - Reset spring; 536 - Triangular guiding part. Detailed implementation manners

[0034] In order to enable those skilled in the art of this technology to better understand the solution of this application, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this application.

[0035] See Figures 1 to 10As shown in the figure, an anti-damage chip packaging device includes a bottom plate 1 and a housing 2; the bottom plate 1 is connected to a chip 12 through a plurality of bonding wires 11, and the housing 2 is arranged on the bottom plate 1 to protect the chip 12; it also includes a fixed U-shaped frame 3, a positioning mechanism 4 and a packaging mechanism 5; a feeding belt 31 is arranged inside the U-shaped frame 3, and a plurality of fixing plates 32 are equidistantly arranged on the feeding belt 31, and the positioning mechanism 4 is arranged on the fixing plate 32 and is used to fix the bottom plate 1 and the housing 2; injection holes 21 communicating with the inside are arranged at the edge of each side wall of the housing 2, and the axis of the injection hole 21 is located between the corresponding bonding wire 11, the fixing plate 32 and the chip 12; a gantry 33 is arranged at the center of the top of the U-shaped frame 3, a hydraulic rod 34 is arranged at the center of the gantry 33, the hydraulic rod 34 is arranged in a vertical state, and the actuator of the hydraulic rod 34 passes through the gantry 33 and is provided with a glue injection box 341; the packaging mechanism 5 is arranged at the center of the bottom of the glue injection box 341 and can package the chip 12 through a plurality of injection holes 21; the packaging mechanism 5 includes a mounting plate 51, an adjusting rack 52 and an injection cylinder 53; the mounting plate 51 is arranged horizontally at the center of the bottom of the glue injection box 341, a mounting groove 511 is arranged at the center of the mounting plate 51, a driving motor 512 is arranged in the mounting groove 511, the driving motor 512 is arranged in a vertical state, and two driving gears 513 are equidistantly arranged on the motor shaft of the driving motor 512, positioning members 514 are arranged on the four sides of the bottom of the mounting plate 51, there are four adjusting racks 52, a strip-shaped chute 521 is arranged on each adjusting rack 52, and the positioning member 514 can slide in the corresponding strip-shaped chute 521. The four adjusting racks 52 are in a cross shape and the adjacent two adjusting racks 52 are arranged up and down in sequence, and the adjusting racks 52 are respectively engaged with the corresponding driving gears 513; a vertical plate 522 is arranged at one end of each adjusting rack 52 away from the center of the mounting plate 51, a mounting hole 5221 is arranged on each vertical plate 522, an injection cylinder 53 is arranged in each mounting hole 5221, the injection cylinder 53, the vertical plate 522 and the adjusting rack 52 are in a C shape, the opening direction of the injection cylinder 53 faces away from the vertical plate 522, one end of each injection cylinder 53 close to the vertical plate 522 is communicated with the glue injection box 341 through a connecting hose 531, and a plurality of semi-circular notches 532 are arranged along the axis direction of each injection cylinder 53.

[0036] The chip 12 is fixed on the base plate 1 by soldering, and then a plurality of bonding wires 11 are welded to the chip 12 and the base plate 1 by welding. Then, the staff places the base plate 1 and the shell 2 from bottom to top on the fixing plate 32 of the feeding belt 31 through a feeding mechanism (not shown in the figure), and fixes the positions of the base plate 1 and the shell 2 through the positioning mechanism 4 to ensure the connection accuracy between the shell 2 and the base plate 1 during the packaging process; then, the feeding belt 31 transports the base plate 1 to the bottom of the hydraulic rod 34. At this time, by adjusting the hydraulic rod 34, the injection box 341 can be moved toward the base plate 1. At this time, the plurality of adjustment racks 52 are located away from the center of the mounting plate 51, so that the syringes 53 connected to the adjustment racks 52 can be moved away from each other, thereby avoiding the volume collision between the syringe 53 and the shell 2; then, the two driving gears 513 are driven to rotate by the driving motor 512, and the two driving gears 513 are respectively The corresponding adjustment rack 52 is driven to move along the length direction of the corresponding positioning member 514, so that the four injection cylinders 53 can extend into the shell 2 through the injection hole 21 on the side wall of the shell 2, and the ends of the four injection cylinders 53 extending into the shell 2 are in conflict with each other, and the axis of the injection hole 21 is located between the corresponding bonding wire 11, the fixing plate 32 and the chip 12, so that the injection cylinder 53 can be inserted between the bonding wire 11 and the chip 12. The glue injection box 341 simultaneously transports packaging glue to multiple injection cylinders 53 through multiple connecting hoses 531, and the packaging glue passes through the injection cylinder 53 so that the packaging glue can overflow from the multiple semicircular notches 532 on the injection cylinder 53, thereby preferentially filling the space between the bonding wire 11 and the chip 12. Not only can it provide a certain support force for the bonding wire 11 during the filling process, but it can also prevent the packaging glue from impacting the bonding wire 11, causing the bonding wire 11 to stick or be squeezed and bent, thereby ensuring the integrity of the bonding wire 11 and improving the packaging effect.

[0037] See also Figures 5 to 8As shown, a semicircular blocking plate 533 for blocking the semicircular notch 532 is hinged in each semicircular notch 532, a guide hole 534 is provided at the center of the inner wall at the bottom of the injection barrel 53, a guide rod 535 is slidably provided in each guide hole 534, and the guide rod 535 is equidistantly provided with a plurality of conical guide portions 5351 for opening the semicircular notch 532 along the axial direction, and a guide column 5331 cooperating with the conical guide portion 5351 is provided on the inner wall of one side of each semicircular blocking plate 533 close to the guide rod 535; each guide rod 53 A transverse plate 5352 is provided at one end away from the opening of the injection cylinder 53. The transverse plate 5352 is located outside the injection cylinder 53. Reset rods 5353 extending toward the opening of the injection cylinder 53 are provided at both ends of the transverse plate 5352. Extension blocks 523 are provided at both sides of each vertical plate 522. A reset hole 5231 for the reset rod 5353 to pass through is provided on each extension block 523. The reset rod 5353 passes through the corresponding reset hole 5231 and is provided with a limit plate 5354. A reset spring 5355 is sleeved on each reset rod 5353.

[0038] In order to avoid the overflow of the packaging glue and further ensure the integrity of the bonding wire 11, a plurality of semicircular sealing plates 533 are set, and the semicircular sealing plates 533 are hinged in the corresponding semicircular notches 532 through reset hinges. When the syringe 53 is extended into the shell 2, under the elastic force of the reset spring 5355, the guide rod 535 can move toward the opening direction of the syringe 53, and the guide column 5331 on the semicircular sealing plate 533 does not contact the conical guide portion 5351. At this time, the semicircular sealing plate 533 can block the semicircular notch 532, which can not only avoid the leakage of the packaging glue, but also avoid the volume collision between the semicircular sealing plate 533 and the shell 2. When the syringe 53 is extended to a certain distance, as the syringe 53 continues to move, the shell 2 contacts the limit plate 5354, so that the syringe 53 can overcome the reset spring 5355. The elastic force continues to penetrate into the shell 2. At this time, the guide column 5331 on the semicircular sealing plate 533 can contact the conical guide part 5351 on the guide rod 535, so that the multiple semicircular notches 532 are opened synchronously, and the opened semicircular packaging plate is located between two adjacent bonding wires 11. When the packaging glue fills the inside of the shell 2, the semicircular sealing plate 533 can further play an isolation role to avoid the two adjacent bonding wires 11 from contacting each other, causing damage to the chip 12. After the injection is completed, as the injection barrel 53 moves away from the shell 2, under the action of the elastic force of the reset spring 5355, the multiple semicircular sealing plates 533 can be re-sealed in the corresponding semicircular notches 532. At this time, the packaging glue can still fill the notches on the moving trajectory of the injection barrel 53 through the open end of the injection barrel 53, thereby ensuring the density of the packaging glue inside the shell 2 and improving the overall packaging effect.

[0039] See also Figures 6 to 8 As shown, one end of each guide column 5331 away from the semicircular blocking plate 533 is set to be rounded.

[0040] By providing the rounded corners, the friction between the guide column 5331 and the tapered guide portion 5351 can be reduced, so that the movement of the semicircular blocking plate 533 is smoother.

[0041] See also Figure 2 and Figure 8 As shown, the four walls of the shell 2 are provided with rectangular grooves 22 connected to the corresponding injection holes 21, and a sealing plate 23 for sealing the injection hole 21 is slidably arranged in each rectangular groove 22. The outer wall of each sealing plate 23 on one side away from the rectangular groove 22 is provided with a triangular section 231, and the opening end of each injection barrel 53 is provided with a triangular guide portion 536 that cooperates with the triangular section 231.

[0042] In order to improve the packaging efficiency, a sealing plate 23 is provided. When the shell 2 moves to the bottom of the gantry 33, as the injection cylinder 53 moves, the triangular guide portion 536 provided at the opening of the injection cylinder 53 can contact the triangular section 231 on the corresponding sealing plate 23, so that the sealing plate 23 can move in a direction away from the injection hole 21, so that the injection cylinder 53 can extend into the shell 2 through the injection hole 21. After the injection is completed, the injection cylinder 53 moves in a direction away from the shell 2. When the injection cylinder 53 completely leaves the shell 2, under the action of gravity, the sealing plate 23 can block the injection hole 21 (secondary compaction is performed through the hydraulic rod 34 to ensure that the sealing plate 23 can move into place). While avoiding overflow of the packaging glue, the packaged shell 2 can also be subsequently processed to improve production efficiency.

[0043] See also Figures 9 and 10 As shown, each group of positioning mechanisms 4 includes a rectangular bar 41 and a positioning bar 42; a rectangular groove 321 is provided at the center of each fixed plate 32, and the rectangular bar 41 is slidably arranged in the corresponding rectangular groove 321; a supporting plate 411 for placing the base plate 1 is provided on the top of each rectangular bar 41, and a cross slide groove 322 is also provided on each fixed plate 32, and the cross slide groove 322 is connected to the corresponding rectangular groove 321; there are four positioning bars 42, and the positioning bars 42 can be slidably arranged at the corresponding ends of the cross slide groove 322, and a traction rope 421 is provided on the side of each positioning bar 42 close to the rectangular groove 321, and each outer wall of the rectangular bar 41 is provided with a strip avoidance groove 412 for avoiding the traction rope 421, and the end of each traction rope 421 away from the corresponding positioning bar 42 is arranged in the corresponding strip avoidance groove 412.

[0044] The staff places the bottom plate 1 on the supporting plate 411. Subsequently, under the action of gravity, the supporting plate 411 moves towards the direction close to the rectangular groove 321. During this process, through multiple traction ropes 421, the four positioning strips 42 can move towards the direction close to the bottom plate 1. At this time, under the action of the traction ropes 421, the multiple positioning strips 42 can move synchronously towards the direction close to the bottom plate 1, so as to adjust the position of the housing 2 placed on the bottom plate 1, making it located at the center of the fixing plate 32, and ensuring the stability of the bottom plate 1 during the subsequent glue injection process.

[0045] See Figures 9 and 10 As shown, a separating spring 422 is sleeved on each traction rope 421. Four guiding plates 323 are arranged in each cross-shaped chute 322. The four guiding plates 323 are distributed in a rectangular shape. A rope guiding hole 324 is provided on each guiding plate 323. The separating spring 422 is located between the corresponding guiding plate 323 and the positioning strip 42.

[0046] By providing the separating spring 422, the positioning strip 42 can be reset, so that the positioning strip 42 can be located at a position far from the center of the fixing plate 32, ensuring that the bottom plate 1 can be placed on the supporting plate 411; and by providing the guiding plate 323, while guiding the traction rope 421, it can also ensure that the separating spring 422 provides sufficient elastic force to ensure the stability of the bottom plate 1.

[0047] See Figure 1 As shown, a U-shaped mounting member 35 is further provided at the end of the U-shaped frame 3. A temporary storage plate 351 is provided at the center of the U-shaped mounting member 35. Two arc-shaped lifting strips 352 are provided on the side of the temporary storage plate 351 close to the feeding belt 31.

[0048] As the feeding belt 31 rotates, through the two arc-shaped lifting strips 352, the encapsulated housing 2 can be removed from the feeding belt 31. And as the feeding belt 31 continues to convey, the encapsulated chips 12 can be sequentially pushed and moved onto the temporary storage plate 351, which can not only enable the feeding belt 31 to work continuously, but also facilitate the subsequent processing by the staff.

[0049] See Figure 1 As shown, a feeding motor 36 for driving the feeding belt 31 is further provided on one side of the U-shaped frame 3.

[0050] By providing the feeding motor 36, the feeding belt 31 can be rotated. As the feeding belt 31 rotates, the chips 12 can be continuously encapsulated, thereby improving the encapsulation efficiency.

[0051] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A damage-resistant chip packaging device, comprising a base plate and a shell; the base plate is connected to the chip through a plurality of bonding wires, and the shell is arranged on the base plate to protect the chip; characterized in that: It also includes a fixed U-shaped frame, a positioning mechanism and a packaging mechanism; A feeding belt is arranged inside the U-shaped frame, and a plurality of fixed plates are arranged at equal intervals on the feeding belt. The positioning mechanism is arranged on the fixed plates and is used for fixing the bottom plate and the housing; Each group of positioning mechanisms includes a rectangular strip and a positioning strip; A rectangular groove is arranged at the center of each fixed plate, and the rectangular strip is slidably arranged in the corresponding rectangular groove; A supporting plate for placing the bottom plate is arranged at the top of each rectangular strip, and a cross chute is also arranged on each fixed plate. The cross chute communicates with the corresponding rectangular groove; There are four positioning strips, and the positioning strips are slidably arranged at the corresponding ends of the cross chute. A traction rope is arranged on one side of each positioning strip close to the rectangular groove, and a strip-shaped avoidance groove for avoiding the traction rope is arranged on each outer wall of the rectangular strip. One end of each traction rope far from the corresponding positioning strip is arranged in the corresponding strip-shaped avoidance groove; An injection hole communicating with the inside is arranged at the edge of each side wall of the housing, and the axis of the injection hole is located between the corresponding bonding wire, the fixed plate and the chip; A gantry is arranged at the center of the top of the U-shaped frame, and a hydraulic rod is arranged at the center of the gantry. The hydraulic rod is arranged vertically, and the execution part of the hydraulic rod passes through the gantry and is provided with a glue injection box; The packaging mechanism is arranged at the center of the bottom of the glue injection box and can package the chip through a plurality of injection holes; The packaging mechanism includes a mounting plate, an adjusting rack and an injection cylinder; The mounting plate is arranged horizontally at the center of the bottom of the glue injection box. An installation groove is arranged at the center of the mounting plate, and a driving motor is arranged in the installation groove. The driving motor is arranged vertically, and two driving gears are arranged at equal intervals on the motor shaft of the driving motor. Positioning parts are arranged on the four sides of the bottom of the mounting plate. There are four adjusting racks, and a strip-shaped chute is arranged on each adjusting rack. The positioning parts are slidably arranged in the corresponding strip-shaped chutes. The four adjusting racks are in a cross shape and two adjacent adjusting racks are arranged up and down in sequence. The adjusting racks are respectively meshed with the corresponding driving gears; One end of each adjusting rack far from the center of the mounting plate is provided with a vertical plate, and an installation hole is arranged on each vertical plate. An injection cylinder is arranged in each installation hole. The injection cylinder, the vertical plate and the adjusting rack are in a U shape. The opening direction of the injection cylinder faces away from the vertical plate. One end of each injection cylinder close to the vertical plate is communicated with the glue injection box through a connecting hose. A plurality of semicircular notches are arranged along the axis direction of each injection cylinder; A semicircular sealing plate for sealing the semicircular notch is hinged in each semicircular notch. A guide hole is arranged at the center of the inner wall of the bottom of each injection cylinder, and a guide rod is slidably arranged in each guide hole. A plurality of conical guiding parts for opening the semicircular notch are arranged at equal intervals along the axis direction of the guide rod. A guiding column matched with the conical guiding part is arranged on the inner wall of one side of each semicircular sealing plate close to the guide rod; One end of each guide rod far from the opening of the injection cylinder is provided with a transverse plate. The transverse plate is located outside the injection cylinder. Two ends of the transverse plate are provided with reset rods extending towards the opening direction of the injection cylinder. Extension blocks are arranged on both sides of each vertical plate, and a reset hole for the reset rod to pass through is arranged on each extension block. The reset rod passes through the corresponding reset hole and is provided with a limit disk. A reset spring is sleeved on each reset rod.

2. The damage-resistant chip packaging device according to claim 1, characterized in that: One end of each guiding post away from the semi-circular sealing plate is set as a rounded corner.

3. The damage-resistant chip packaging device according to claim 1, characterized in that: Rectangular notches communicating with the corresponding injection holes are provided on the four walls of the housing. A sealing plate for sealing the injection hole is slidably arranged in each rectangular notch. A triangular cutting surface is arranged on the outer wall of one side of each sealing plate away from the rectangular notch. A triangular guiding part cooperating with the triangular cutting surface is arranged at the opening end of each syringe barrel.

4. The damage-resistant chip packaging device according to claim 1, characterized in that: A separating spring is sleeved on each towing rope. Four guiding plates are arranged in each cross-shaped chute. The four guiding plates are distributed in a rectangle. A rope guiding hole is arranged on each guiding plate. The separating spring is located between the corresponding guiding plate and the positioning strip.

5. The damage-resistant chip packaging device according to claim 1, characterized in that: A U-shaped mounting member is further arranged at the end of the U-shaped frame. A temporary storage plate is arranged at the center of the U-shaped mounting member. Two arc-shaped lifting strips are arranged on one side of the temporary storage plate close to the feeding belt.

6. The damage-resistant chip packaging device according to claim 1, characterized in that: A feeding motor for driving the feeding belt is further arranged on one side of the U-shaped frame.

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