Sip system integration package early warning method based on millimeter wave intelligent reflecting surface structure

Abstract

The present disclosure provides a SIP system integration package early warning method based on a millimeter wave intelligent reflecting surface structure. The method comprises obtaining a substrate packaging state parameter of a reflecting surface antenna subarray panel; performing a subarray rule difference differential processing on the substrate packaging state parameter and a preset packaging state parameter to obtain a subarray packaging complex difference component; transmitting a millimeter wave intelligent reflecting surface packaging early warning start-stop signal to a SIP packaging system according to the subarray packaging complex difference component to determine the packaging qualified state of the millimeter wave intelligent reflecting surface structure. By collecting the substrate packaging state parameter, the current packaging condition of the substrate in the reflecting surface antenna subarray panel can be determined, and then it is compared with the specified packaging state to determine the complex difference degree of the substrate packaging of the reflecting surface antenna subarray panel. According to the above difference degree, the current packaging reliability of the millimeter wave intelligent reflecting surface is warned, and the packaging qualification of the millimeter wave intelligent reflecting surface structure is timely warned.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of communication technology, and in particular to a SIP system integration package early warning method based on a millimeter wave intelligent reflecting surface structure. BACKGROUND

[0002] With the development of wireless communication technology, 6G intelligent super surface technology as an important innovation in the future communication field, promotes the further evolution of communication technology. Multi-beam intelligent reflecting surface can simultaneously produce multiple direction-independent beams, and multiple beams with different directions can effectively expand the signal coverage range of the reflecting surface, greatly improve the spectrum multiplexing rate and communication efficiency, and have more extensive application scenarios. Through flexible regulation of the amplitude, phase and transmission direction of electromagnetic waves, intelligent super surface technology can realize more efficient, reliable wireless communication, indoor positioning and Internet of Things connection. And from passive to active innovation, intelligent super surface has more rich functions and broader application prospects. Due to the large millimeter wave loss, a larger antenna array is generally needed to obtain higher array shaping gain to compensate for path loss. Large-scale antenna arrays are limited by cost, power consumption, heat dissipation, etc., and usually use digital-analog hybrid beamforming architecture, which is complex in structure and high in cost. RIS (Reconfigurable Intelligence Surface, Intelligent Reflecting Surface) can realize a large-scale antenna array with smaller size and weight at lower cost and power consumption.

[0003] With the advent of the Internet of Things era, global terminal electronic products are gradually moving towards multi-functional integration and low-power design, so SIP technology that can integrate multiple bare dies in a single package is increasingly attracting attention. The SIP module is a complete functional subsystem that integrates one or more IC chips and passive components in a package. The IC chip can be a Wire bonding chip or a Flip chip, mounted on a substrate or an LTCC substrate. Passive components such as RLC and filters are integrated in a module in the form of separate passive components, integrated passive components, or embedded passive components. The miniaturization advantage of system-in-package SIP is obvious, providing more electromagnetic space for terminal products by changing the module and size, and integrating more functions.

[0004] The intelligent reflecting surface controls the reflected beam by the reflection phase of the regulating unit, and thus the phase regulation performance of the unit is crucial. In order to realize continuous dynamic regulation of the phase of the unit, a varactor is usually loaded. In addition, the phase regulation of the loaded varactor requires an accurate voltage control circuit, and increases the reflection loss, which is not conducive to the design of the intelligent reflecting surface. Therefore, a phase quantization method is adopted to complete the phase regulation by using a PIN diode, which can greatly reduce the hardware cost of the intelligent reflecting surface and reduce the design complexity. However, due to the large number of new large-scale antenna elements of the RIS, there are usually hundreds or even tens of thousands of elements, and at this time each element needs to be loaded with a diode and a corresponding voltage control circuit, which is easy to cause abnormal packaging in the SIP packaging process, such as board warping, uneven structural stress, and poor welding, which directly affects the quality of the finished intelligent reflecting surface. SUMMARY

[0005] The purpose of the present disclosure is to overcome the shortcomings in the prior art and provide a SIP system integration packaging early warning method based on a millimeter wave intelligent reflecting surface structure which can facilitate early warning of the packaging qualified state.

[0006] The purpose of the present disclosure is achieved by the following technical solutions:

[0007] A SIP system integration packaging early warning method based on a millimeter wave intelligent reflecting surface structure, comprising: monitoring the packaging warping in the packaging process of the millimeter wave intelligent reflecting surface structure, wherein the millimeter wave intelligent reflecting surface structure comprises a reflecting surface antenna subarray board and a test assembly; the reflecting surface antenna subarray board has a plurality of radiation units; the test assembly comprises a test board and a plurality of phase quantization units, the plurality of phase quantization units are located between the reflecting surface antenna subarray board and the test board, each phase quantization unit corresponds to a radiation unit, the phase quantization unit comprises two solder balls and two phase regulation diodes, the phase regulation diodes are connected to the reflecting surface antenna subarray board, and the phase regulation diodes correspond to the coupling grooves of the reflecting surface antenna subarray board, the solder balls are respectively soldered to the reflecting surface antenna subarray board and the test board, so that the control circuit of the test board is electrically connected to the control end of the phase regulation diode;

[0008] The SIP system integration packaging early warning method comprises:

[0009] Obtaining a substrate packaging state parameter of the reflecting surface antenna subarray board;

[0010] Performing subarray rule difference processing on the substrate packaging state parameter and a preset packaging state parameter to obtain a subarray packaging complexity difference;

[0011] The subarray packaging complex difference component is sent to a SIP packaging system to send a millimeter wave intelligent reflecting surface packaging early warning start-stop signal to determine a packaging qualified state of the millimeter wave intelligent reflecting surface structure.

[0012] In one of the embodiments, the substrate packaging state parameter of the reflector antenna subarray panel includes a substrate stack number of the reflector antenna subarray panel.

[0013] In one of the embodiments, the subarray packaging complex difference component includes a difference between the substrate stack number and a preset stack number.

[0014] In one of the embodiments, the millimeter wave intelligent reflecting surface packaging early warning start-stop signal is sent according to the subarray packaging complex difference component, which includes detecting whether the subarray packaging stack number difference is greater than or equal to a preset packaging stack number difference; and when the subarray packaging stack number difference is greater than or equal to the preset packaging stack number difference, a millimeter wave intelligent reflecting surface packaging alarm start signal is sent to the SIP packaging system.

[0015] In one of the embodiments, the detecting whether the subarray packaging stack number difference is greater than or equal to the preset packaging stack number difference further includes, when the subarray packaging stack number difference is less than the preset packaging stack number difference, a millimeter wave intelligent reflecting surface packaging alarm stop signal is sent to the SIP packaging system.

[0016] In one of the embodiments, the substrate packaging state parameter of the reflector antenna subarray panel includes a substrate thickness of the reflector antenna subarray panel.

[0017] In one of the embodiments, the subarray packaging complex difference component includes a difference between the substrate thickness and a preset thickness.

[0018] In one of the embodiments, the millimeter wave intelligent reflecting surface packaging early warning start-stop signal is sent according to the subarray packaging complex difference component, which includes detecting whether the subarray packaging thickness difference is greater than or equal to a preset packaging thickness difference; and when the subarray packaging thickness difference is greater than or equal to the preset packaging thickness difference, a millimeter wave intelligent reflecting surface packaging alarm start signal is sent to the SIP packaging system.

[0019] In one of the embodiments, after the detection of whether the subarray packaging thickness difference is greater than or equal to the preset packaging thickness difference, the method further includes: when the subarray packaging thickness difference is less than the preset packaging thickness difference, sending a millimeter wave intelligent reflecting surface packaging alarm closing signal to the SIP packaging system.

[0020] In one of the embodiments, the substrate packaging state parameter includes a substrate area of the reflecting surface antenna subarray board.

[0021] Compared with the prior art, the present disclosure has at least the following advantages:

[0022] By collecting the substrate packaging state parameter, the current packaging condition of the substrate in the reflecting surface antenna subarray board is determined, and then compared with the specified packaging state to determine the substrate packaging complexity difference degree of the reflecting surface antenna subarray board. According to the above difference degree, the current packaging reliability of the millimeter wave intelligent reflecting surface is prewarned, which facilitates the timely prewarning of the packaging qualification of the millimeter wave intelligent reflecting surface structure, and effectively reduces the packaging failure probability of the millimeter wave intelligent reflecting surface structure. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present disclosure, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0024] Figure 1 The flow chart of the SIP system integration packaging prewarning method based on the millimeter wave intelligent reflecting surface structure in an embodiment;

[0025] Figure 2 The exploded view of the reflecting surface antenna subarray board in an embodiment;

[0026] Figure 3 The cross-sectional view of the 4x4 millimeter wave intelligent reflecting surface structure;

[0027] Figure 4 The schematic view of the 4x4 millimeter wave intelligent reflecting surface structure;

[0028] Figure 5 The array distribution diagram of the 10x10 reflecting surface antenna subarray board;

[0029] Figure 6 The cross-sectional view of the 10x10 millimeter wave intelligent reflecting surface structure;

[0030] Figure 7 The schematic view of the 10x10 millimeter wave intelligent reflecting surface structure;

[0031] Figure 8 E-plane pattern for 10x10 mmWave Smart Reflective Surface structure at normal incidence;

[0032] Figure 9 Schematic diagram of 20x20 mmWave Smart Reflective Surface structure;

[0033] Figure 10 Cross-sectional view of 20x20 mmWave Smart Reflective Surface structure;

[0034] Figure 11 Schematic diagram of test board in 20x20 mmWave Smart Reflective Surface structure;

[0035] Figure 12 Exploded view of test board in 20x20 mmWave Smart Reflective Surface structure;

[0036] Figure 13 Solder stress cloud for 1.2mm thick reflector antenna subarray panel;

[0037] Figure 14 Solder stress cloud for 2mm thick reflector antenna subarray panel;

[0038] Figure 15 Thermal deformation distribution for 1.2mm thick reflector antenna subarray panel;

[0039] Figure 16 Thermal deformation distribution for 2mm thick reflector antenna subarray panel;

[0040] Figure 17 Thermal deformation schematic diagram for reflector antenna subarray panel;

[0041] Figure 18 Thermal deformation data distribution for reflector antenna subarray panel;

[0042] Figure 19 100x100 element arrangement of reflector antenna subarray panel in an embodiment;

[0043] Figure 20 Beam scanning diagram corresponding to the reflector antenna subarray panel of Figure 19 DETAILED DESCRIPTION

[0044] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are shown in the drawings. However, the present disclosure can be implemented in many different forms, and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thorough and comprehensive.

[0045] ​It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present. As used herein the terms "vertical", "horizontal", "left", "right", and the like are merely used for the purpose of illustration and are not intended to be limiting.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used in the description of the disclosure herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0047] The present disclosure relates to a millimeter wave smart reflector structure based SIP system integrated packaging early warning method. In one embodiment, the millimeter wave smart reflector structure based SIP system integrated packaging early warning method includes obtaining a substrate packaging state parameter of a reflector antenna subarray panel; performing a subarray rule difference differential processing on the substrate packaging state parameter and a preset packaging state parameter to obtain a subarray packaging complexity difference component; transmitting a millimeter wave smart reflector packaging early warning start-stop signal to a SIP packaging system according to the subarray packaging complexity difference component to determine a packaging qualified state of the millimeter wave smart reflector structure. By collecting the substrate packaging state parameter, the current packaging condition of the substrate in the reflector antenna subarray panel is determined, which is then compared with the specified packaging state to determine the complexity difference degree of the substrate packaging of the reflector antenna subarray panel. According to the above difference degree, the current packaging reliability of the millimeter wave smart reflector is early warned, which facilitates timely early warning of the packaging qualification of the millimeter wave smart reflector structure and effectively reduces the packaging failure probability of the millimeter wave smart reflector structure.

[0048] See Figure 1Fig. 1 is a flowchart of a SIP system integration packaging early warning method based on a millimeter wave intelligent reflecting surface structure according to an embodiment of the present disclosure. The millimeter wave intelligent reflecting surface structure includes a reflecting surface antenna subarray panel and a test assembly. The reflecting surface antenna subarray panel has a plurality of radiation units. The test assembly includes a test board and a plurality of phase quantization components. The plurality of phase quantization components are located between the reflecting surface antenna subarray panel and the test board. Each phase quantization component corresponds to a radiation unit. The phase quantization component includes two solder balls and two phase modulation diodes. The phase modulation diodes are connected to the reflecting surface antenna subarray panel and correspond to coupling grooves of the reflecting surface antenna subarray panel. The solder balls are respectively welded to the reflecting surface antenna subarray panel and the test board to electrically connect control lines of the test board and control ends of the phase modulation diodes.

[0049] The SIP system integration packaging early warning method based on the millimeter wave intelligent reflecting surface structure includes some or all of the following steps.

[0050] S100: Obtain a substrate packaging state parameter of a reflecting surface antenna subarray panel.

[0051] In this embodiment, the substrate packaging state parameter is board body data of a substrate of the reflecting surface antenna subarray panel in a packaging process. That is, the substrate packaging state parameter is a current packaging condition of the substrate of the reflecting surface antenna subarray panel. That is, the substrate packaging state parameter corresponds to a board body form of the substrate of the reflecting surface antenna subarray panel in packaging. Specifically, the reflecting surface antenna subarray panel adopts a PCB substrate process, which is a 3-layer metal plate structure. A first layer metal structure is a radiation patch, which is located on an upper layer of a first dielectric substrate. A second layer metal structure is also a radiation patch, which is located between a first layer dielectric substrate and a second layer dielectric substrate. A third layer metal structure is an antenna ground, which has two mutually perpendicular H-shaped grooves. The lowest layer has vertical polarization and horizontal polarization feed line structures, which are fed through two perpendicular coupled H-shaped grooves. Two phase modulation diodes are respectively connected to the vertical polarization and horizontal polarization feed line links to realize different phases and achieve quasi-3-bit phase control. The structure of a 4x4 reflecting surface antenna subarray panel is shown in Fig. 2. Figure 2 By collecting the substrate packaging state parameter, the real-time board body state of the substrate of the reflecting surface antenna subarray panel in the packaging process can be determined, so that the packaging qualified and unqualified states of the reflecting surface antenna subarray panel can be distinguished in the subsequent process, and timely early warning can be performed.

[0052] S200: Perform subarray rule difference processing on the substrate packaging state parameter and a preset packaging state parameter to obtain a subarray packaging complexity difference component.

[0053] In the embodiment, the substrate packaging state parameter is the board body data of the substrate of the reflector antenna subarray panel in the packaging process, that is, the substrate packaging state parameter is the current packaging condition of the substrate in the reflector antenna subarray panel, that is, the substrate packaging state parameter corresponds to the board body form of the substrate of the reflector antenna subarray panel in the packaging process. By collecting the substrate packaging state parameter, the real-time board body state of the substrate in the packaging process of the reflector antenna subarray panel is determined, so that the packaging qualified and unqualified states of the reflector antenna subarray panel are distinguished in the subsequent process, and timely warning is performed. The preset packaging state parameter is the standard board body data of the substrate of the reflector antenna subarray panel in the packaging process, that is, the preset packaging state parameter is the specified packaging condition of the substrate in the reflector antenna subarray panel, that is, the preset packaging state parameter corresponds to the correct board body form of the substrate of the reflector antenna subarray panel in the packaging process. By performing the subarray rule difference division processing on the substrate packaging state parameter and the preset packaging state parameter, the packaging state difference degree currently existing in the substrate of the reflector antenna subarray panel is determined.

[0054] S300: sending a millimeter wave intelligent reflecting surface packaging warning start-stop signal to a SIP packaging system according to the subarray packaging complexity difference component, to determine a packaging qualified state of the millimeter wave intelligent reflecting surface structure.

[0055] In the embodiment, the complex difference of the subarray packaging is obtained based on the substrate packaging state parameter and the preset packaging state parameter. The substrate packaging state parameter is the plate body data of the substrate of the reflector antenna subarray panel in the packaging process, that is, the substrate packaging state parameter is the current packaging condition of the substrate in the reflector antenna subarray panel, that is, the substrate packaging state parameter corresponds to the correct plate body shape of the substrate of the reflector antenna subarray panel in the packaging process. By collecting the substrate packaging state parameter, the real-time plate body state of the substrate in the packaging process of the reflector antenna subarray panel is determined, so that the packaging qualified and unqualified states of the reflector antenna subarray panel are distinguished in the subsequent process, and timely warning is performed. The preset packaging state parameter is the standard plate body data of the substrate of the reflector antenna subarray panel in the packaging process, that is, the preset packaging state parameter is the specified packaging condition of the substrate in the reflector antenna subarray panel, that is, the preset packaging state parameter corresponds to the correct plate body shape of the substrate of the reflector antenna subarray panel in the packaging process. By performing the complex difference processing of the substrate packaging state parameter and the preset packaging state parameter, the packaging state difference degree of the substrate in the reflector antenna subarray panel is determined. After obtaining the complex difference of the subarray packaging, the difference degree of the substrate packaging state of the reflector antenna subarray panel and the standard substrate packaging state is determined, and the millimeter wave intelligent reflector packaging warning start-stop signal is sent to the SIP packaging system, so as to timely warn the packaging unqualified condition of the millimeter wave intelligent reflector structure.

[0056] In the embodiment, by collecting the substrate packaging state parameter, the current packaging condition of the substrate in the reflector antenna subarray panel is determined, and then it is compared with the specified packaging state to determine the complex difference degree of the substrate packaging of the reflector antenna subarray panel. According to the difference degree, the current packaging reliability of the millimeter wave intelligent reflector is warned, the packaging qualified of the millimeter wave intelligent reflector structure is timely warned, and the packaging unqualified probability of the millimeter wave intelligent reflector structure is effectively reduced.

[0057] In another embodiment, the structure of the 4x4 millimeter wave intelligent reflector structure after packaging is as shown in Figure 3 and 4 .

[0058] In another embodiment, different unit arrangements on the reflector antenna subarray panel have different beam steering performance, so it is necessary to optimize the unit arrangement of the array by using an algorithm. Taking a 10x10 array as an example, the arrangement of four kinds of units obtained by genetic algorithm optimization is as shown in Figure 5 , and the numbers 1, 2, 3 and 4 respectively represent units one, two, three and four, and the four colors are used to distinguish the positions of the four units in the array. Figure 6is a top view of a 10x10 mmWave smart reflectarray structure, Figure 7 is a cross-sectional view of a 10x10 mmWave smart reflectarray structure, also using PCB substrate process, the antenna structure is a 3-layer metal plate structure, the first layer of metal structure is a radiation patch, located on the upper layer of the first dielectric substrate, the second layer of metal structure is also a radiation patch, located between the first layer of dielectric substrate and the second layer of dielectric substrate, the third layer of metal structure is an antenna ground, the ground plate has two H-shaped slots perpendicular to each other, the lowest layer is a vertical polarization and a horizontal polarization feed line structure, respectively, and the antenna is fed through different coupled H-shaped slots. Two diodes are connected to the vertical polarization and horizontal polarization feed line links, respectively, and different phases can be achieved by turning on and off the diodes to achieve quasi-3bit phase control.

[0059] In the case of vertical incidence, the reflectarray subarray boards are arranged as shown in Figure 5 , the reflection angle θr∈[-60°, 60°] is calculated, and the array factor pattern of the mmWave smart reflectarray structure when each beam is spaced by 15° is as follows Figure 8 , the reflection amplitude is kept at 16.0dB-16.5dB, and the sidelobe level is lower than -10dB.

[0060] In another embodiment, Figure 9 and Figure 10 are a top view and a cross-sectional view of a 20x20 mmWave smart reflectarray structure, respectively, composed of 2x2, i.e. 4 10x10 subarrays. Figure 11 is a test board of a 20x20 array, 4 10x10 subarrays are interconnected with the test board through solder balls, and there are respectively 4 10x10 subarrays. Figure 12 is an exploded view of a test board of a 20x20 array, the uppermost layer of blue is a solder ball, the test board 2 is a 6-layer pcb board, providing phase modulation diode power, signal control line, power, etc.

[0061] In one embodiment, obtaining the substrate packaging status parameters of the reflector antenna subarray includes: obtaining the number of substrate stacks of the reflector antenna subarray. In this embodiment, the substrate packaging status parameters are the board body data of the substrate of the reflector antenna subarray during the packaging process, that is, the substrate packaging status parameters are the current packaging status of the substrate in the reflector antenna subarray, and the substrate packaging status parameters correspond to the board body shape of the substrate of the reflector antenna subarray during packaging. By collecting the substrate packaging status parameters, it is convenient to determine the real-time board body status of the substrate in the reflector antenna subarray during the packaging process, thereby facilitating the subsequent differentiation between the qualified and defective packaging status of the reflector antenna subarray and timely early warning. The substrate packaging status parameters include the number of substrate stacks of the reflector antenna subarray, which is the total number of layers of the substrate in the reflector antenna subarray, and the number of substrate stacks is used to reflect the stacking status of each layer of the substrate in the reflector antenna subarray.

[0062] Further, the step of performing subarray recovery differential processing on the substrate packaging state parameters and the preset packaging state parameters to obtain the subarray packaging complexity differential component includes: calculating the difference between the number of substrate stacks and the preset number of stacks to obtain the subarray packaging layer difference. In this embodiment, the substrate packaging state parameters are the board body data of the substrate of the reflective antenna subarray during the packaging process, that is, the substrate packaging state parameters are the current packaging status of the substrate in the reflective antenna subarray, and the substrate packaging state parameters correspond to the board body shape of the reflective antenna subarray when the substrate is packaged. By collecting the substrate packaging state parameters, it is convenient to determine the real-time board body status of the substrate in the reflective antenna subarray during the packaging process, thereby facilitating the subsequent differentiation between the qualified and defective packaging status of the reflective antenna subarray and timely early warning. The preset packaging state parameters are the standard board data of the substrate of the reflective antenna subarray during the packaging process. In other words, the preset packaging state parameters represent the specified packaging condition of the substrate in the reflective antenna subarray, and correspond to the correct board shape of the substrate during packaging. By performing subarray restoration differential processing on the substrate packaging state parameters and the preset packaging state parameters, the degree of difference in the current packaging state of the substrate in the reflective antenna subarray is determined. The substrate packaging state parameters include the number of substrate stacks in the reflective antenna subarray, which is the total number of layers in the substrate. The number of substrate stacks reflects the stacking state of each layer of the substrate in the reflective antenna subarray. By calculating the difference between the number of substrate stacks and the preset number of stacks, the degree of difference in the layer stacking of the substrate in the reflective antenna subarray is easily determined, thereby facilitating the determination of whether the layer stacking state of the substrate in the reflective antenna subarray meets the requirements.

[0063] Further, the step of sending a millimeter wave intelligent reflecting surface packaging early warning start-stop signal to the SIP packaging system according to the subarray packaging complex difference includes: detecting whether the subarray packaging layer difference is greater than or equal to a preset packaging layer difference; and when the subarray packaging layer difference is greater than or equal to the preset packaging layer difference, sending a millimeter wave intelligent reflecting surface packaging alarm start signal to the SIP packaging system. In the embodiment, the subarray packaging complex difference is obtained based on the substrate packaging state parameter and the preset packaging state parameter. The substrate packaging state parameter is the board data of the substrate of the reflecting surface antenna subarray panel in the packaging process, that is, the substrate packaging state parameter is the current packaging state of the substrate in the reflecting surface antenna subarray panel, that is, the substrate packaging state parameter corresponds to the correct board shape when the substrate of the reflecting surface antenna subarray panel is packaged. By collecting the substrate packaging state parameter, the real-time board state of the substrate in the reflecting surface antenna subarray panel in the packaging process is determined, so that the packaging qualified and unqualified states of the reflecting surface antenna subarray panel are distinguished in the subsequent process, and timely warning is performed. The preset packaging state parameter is the standard board data of the substrate of the reflecting surface antenna subarray panel in the packaging process, that is, the preset packaging state parameter is the specified packaging state of the substrate in the reflecting surface antenna subarray panel, that is, the preset packaging state parameter corresponds to the correct board shape when the substrate of the reflecting surface antenna subarray panel is packaged. By performing subarray rule complex difference processing on the substrate packaging state parameter and the preset packaging state parameter, the degree of difference between the current packaging state of the substrate in the reflecting surface antenna subarray panel and the standard substrate packaging state is determined. After obtaining the subarray packaging complex difference, the degree of difference between the substrate packaging state of the reflecting surface antenna subarray panel and the standard substrate packaging state is determined, and a millimeter wave intelligent reflecting surface packaging early warning start-stop signal is sent to the SIP packaging system, so as to timely warn the packaging unqualified state of the millimeter wave intelligent reflecting surface structure. The substrate packaging state parameter includes the substrate stack number of the reflecting surface antenna subarray panel, the substrate stack number is the total number of levels of the substrate in the reflecting surface antenna subarray panel, and the substrate stack number is used to reflect the stacking state of each level of the substrate in the reflecting surface antenna subarray panel. By calculating the difference between the substrate stack number and the preset stack number, the difference degree of the level stacking of the substrate in the reflecting surface antenna subarray panel is determined, so as to determine whether the level stacking state of the substrate in the reflecting surface antenna subarray panel meets the requirements. When the subarray packaging layer difference is greater than or equal to the preset packaging layer difference, it indicates that the level stacking state of the substrate in the reflecting surface antenna subarray panel is abnormal, that is, the number of stacked layers is too large, and at this time, a millimeter wave intelligent reflecting surface packaging alarm start signal is sent to the SIP packaging system, so as to timely warn the unqualified state of the millimeter wave intelligent reflecting surface structure in the packaging process.

[0064] In another embodiment, after the detecting whether the subarray encapsulation layer difference is greater than or equal to the preset encapsulation layer difference, the method further includes: when the subarray encapsulation layer difference is less than the preset encapsulation layer difference, sending a millimeter wave intelligent reflecting surface encapsulation alarm closing signal to the SIP encapsulation system. In this embodiment, when the subarray encapsulation layer difference is less than the preset encapsulation layer difference, it indicates that the level stacking state of the substrate in the reflecting surface antenna subarray board is normal, and at this time, the millimeter wave intelligent reflecting surface encapsulation alarm closing signal is sent to the SIP encapsulation system, thereby avoiding false alarms on the qualified condition of the millimeter wave intelligent reflecting surface structure during the encapsulation process.

[0065] In one embodiment, the obtaining the substrate encapsulation state parameter of the reflecting surface antenna subarray board includes: obtaining the substrate thickness of the reflecting surface antenna subarray board. In this embodiment, the substrate encapsulation state parameter is the board body data of the substrate of the reflecting surface antenna subarray board during the encapsulation process, that is, the substrate encapsulation state parameter is the current encapsulation condition of the substrate in the reflecting surface antenna subarray board, that is, the substrate encapsulation state parameter corresponds to the board body form of the substrate during the encapsulation of the reflecting surface antenna subarray board. By collecting the substrate encapsulation state parameter, the real-time board body state of the substrate in the reflecting surface antenna subarray board during the encapsulation process can be determined, so that the subsequent encapsulation qualified and unqualified states of the reflecting surface antenna subarray board can be distinguished, and timely warning can be performed. The substrate encapsulation state parameter includes the substrate thickness of the reflecting surface antenna subarray board, and the substrate thickness is the total thickness of the levels of the substrate in the reflecting surface antenna subarray board, which is used to reflect the total height of the level stacking of the substrate in the reflecting surface antenna subarray board.

[0066] Further, the subarray rule difference processing of the substrate packaging state parameter and the preset packaging state parameter to obtain a subarray packaging complexity difference component includes: calculating a difference between the substrate thickness and a preset thickness to obtain a subarray packaging thickness difference. In the embodiment, the substrate packaging state parameter is the plate body data of the substrate of the reflector antenna subarray panel in the packaging process, that is, the substrate packaging state parameter is the current packaging condition of the substrate in the reflector antenna subarray panel, that is, the substrate packaging state parameter corresponds to the plate body shape of the substrate of the reflector antenna subarray panel in the packaging process. By collecting the substrate packaging state parameter, the real-time plate body state of the substrate in the packaging process of the reflector antenna subarray panel is determined, so that the packaging qualified and unqualified states of the reflector antenna subarray panel are distinguished in the subsequent process, and timely warning is performed. The preset packaging state parameter is the standard plate body data of the substrate of the reflector antenna subarray panel in the packaging process, that is, the preset packaging state parameter is the specified packaging condition of the substrate in the reflector antenna subarray panel, that is, the preset packaging state parameter corresponds to the correct plate body shape of the substrate of the reflector antenna subarray panel in the packaging process. By performing the subarray rule difference processing of the substrate packaging state parameter and the preset packaging state parameter, the packaging state difference degree of the substrate in the reflector antenna subarray panel is determined. The substrate packaging state parameter includes the substrate thickness of the reflector antenna subarray panel, the substrate thickness is the total thickness of the substrate in the reflector antenna subarray panel, and the substrate thickness is used to reflect the total height of the substrate in the reflector antenna subarray panel. By calculating the difference between the substrate thickness and the preset thickness, the level thickness difference degree of the substrate in the reflector antenna subarray panel is determined, so that whether the level thickness state of the substrate in the reflector antenna subarray panel meets the requirements is determined.

[0067] Further, the sending of the millimeter wave smart reflecting surface packaging early warning start-stop signal to the SIP packaging system according to the subarray packaging complex difference includes: detecting whether the subarray packaging thickness difference is greater than or equal to a preset packaging thickness difference; and when the subarray packaging thickness difference is greater than or equal to the preset packaging thickness difference, sending a millimeter wave smart reflecting surface packaging alarm start signal to the SIP packaging system. In this embodiment, the subarray packaging complex difference is obtained based on the substrate packaging state parameter and the preset packaging state parameter. The substrate packaging state parameter is the board body data of the substrate of the reflecting surface antenna subarray panel in the packaging process, that is, the substrate packaging state parameter is the current packaging condition of the substrate in the reflecting surface antenna subarray panel, that is, the substrate packaging state parameter corresponds to the correct board body shape when the substrate of the reflecting surface antenna subarray panel is packaged. By collecting the substrate packaging state parameter, the real-time board body state of the substrate in the reflecting surface antenna subarray panel during the packaging process is determined, so that the packaging qualified and unqualified states of the reflecting surface antenna subarray panel are distinguished in the subsequent process, and timely warning is performed. The preset packaging state parameter is the standard board body data of the substrate of the reflecting surface antenna subarray panel in the packaging process, that is, the preset packaging state parameter is the specified packaging condition of the substrate in the reflecting surface antenna subarray panel, that is, the preset packaging state parameter corresponds to the correct board body shape when the substrate of the reflecting surface antenna subarray panel is packaged. By performing subarray rule complex difference processing on the substrate packaging state parameter and the preset packaging state parameter, the degree of difference between the current packaging state of the substrate in the reflecting surface antenna subarray panel and the standard substrate packaging state is determined. After obtaining the subarray packaging complex difference, the degree of difference between the substrate packaging state of the reflecting surface antenna subarray panel and the standard substrate packaging state is determined, and the millimeter wave smart reflecting surface packaging early warning start-stop signal is sent to the SIP packaging system, so as to timely warn the packaging unqualified condition of the millimeter wave smart reflecting surface structure. The substrate packaging state parameter includes the substrate thickness of the reflecting surface antenna subarray panel, and the substrate thickness is the total thickness of the substrate in the reflecting surface antenna subarray panel, which is used to represent the total height of the substrate in the reflecting surface antenna subarray panel. By calculating the difference between the substrate thickness and the preset thickness, the difference degree of the substrate thickness in the reflecting surface antenna subarray panel is determined, so that whether the substrate thickness state in the reflecting surface antenna subarray panel meets the requirements is determined. When the subarray packaging thickness difference is greater than or equal to the preset packaging thickness difference, it indicates that the substrate thickness state in the reflecting surface antenna subarray panel is abnormal, that is, the reflecting surface antenna subarray panel is too thick, and at this time, the millimeter wave smart reflecting surface packaging alarm start signal is sent to the SIP packaging system, so as to timely warn the packaging unqualified condition of the millimeter wave smart reflecting surface structure.

[0068] In another embodiment, the detecting whether the subarray packaging thickness difference is greater than or equal to the preset packaging thickness difference further includes: when the subarray packaging thickness difference is less than the preset packaging thickness difference, sending a millimeter wave intelligent reflecting surface packaging alarm closing signal to the SIP packaging system. In this embodiment, the subarray packaging thickness difference is less than the preset packaging thickness difference, indicating that the level thickness of the substrate in the reflecting surface antenna subarray board is normal, and at this time, the millimeter wave intelligent reflecting surface packaging alarm closing signal is sent to the SIP packaging system, avoiding false alarm of the qualified condition of the millimeter wave intelligent reflecting surface structure during the packaging process.

[0069] In another embodiment, the substrate packaging state parameter includes a substrate area of the reflecting surface antenna subarray board, and the substrate area is a substrate size of the reflecting surface antenna subarray board, facilitating determination of the size of the reflecting surface antenna subarray board.

[0070] In the actual SIP system integration and packaging process of the millimeter wave intelligent reflecting surface structure, large-scale millimeter wave intelligent reflecting surface SiP system integration needs to consider many factors: the size of the subarray, the distribution of the BGA solder ball, the size and thickness of the test board, and the like. In particular, the size of the subarray needs to consider the thermal deformation of the subarray, the complexity and difficulty of subarray processing, and cost problems, and the size of the subarray needs to consider the thermal deformation of different array elements under the current layer, thickness, and size. In the case of meeting the requirements of the thermal deformation, when the subarray is used for large-scale array, the stress problem of the solder ball needs to be considered, and the stress change under different temperature cold and hot impact needs to be considered.

[0071] The method further includes the following steps before sending the millimeter wave intelligent reflecting surface packaging pre-alarm opening and closing signal to the SIP packaging system according to the subarray packaging complexity difference:

[0072] Obtaining a maximum stress of a solder ball of the millimeter wave intelligent reflecting surface structure;

[0073] Detecting whether the maximum stress of the solder ball is greater than or equal to a preset stress;

[0074] When the maximum stress of the solder ball is greater than or equal to the preset stress, sending a millimeter wave intelligent reflecting surface ball abnormal thickening signal to the SIP packaging system.

[0075] In the embodiment, the maximum stress of the solder ball is the maximum stress of the solder ball distributed between the reflector antenna subarray panel and the test board. By collecting the stress on the plurality of solder balls distributed between the reflector antenna subarray panel and the test board, specifically, obtaining a solder ball stress cloud map, the stress distribution between the reflector antenna subarray panel and the test board is determined. The maximum stress of the solder ball is greater than or equal to the preset stress, indicating that the maximum stress of the solder ball distributed between the reflector antenna subarray panel and the test board exceeds the safe stress, that is, indicating that the solder ball between the reflector antenna subarray panel and the test board has a stress abnormality. At this time, a millimeter wave intelligent reflector ball abnormal thickening signal is sent to the SIP packaging system, so as to determine that the solder ball in the packaging structure of the millimeter wave intelligent reflector structure has a distribution abnormality, and the thickness of the reflector antenna subarray panel needs to be increased to eliminate the packaging failure caused by the stress distribution abnormality of the solder ball.

[0076] For the solder ball stress cloud map, taking the thickness of the reflector antenna subarray panel as 1.2 mm and 2 mm as an example, different thicknesses correspond to different solder ball stress cloud maps. The solder ball stress cloud map of the thickness of 1.2 mm is as shown in Figure 13 The solder ball stress cloud map of the thickness of 2 mm is as shown in Figure 14 From the two graphs, it can be seen that the maximum solder ball stress of the reflector antenna subarray panel with a thickness of 1.2 mm is 19.8 Mpa, and when the thickness of the reflector antenna subarray panel is 2 mm, the maximum stress of the solder ball is 5.69 Mpa, which is less than 10 Mpa, which is safer in process implementation.

[0077] Further, the detection of whether the maximum stress of the solder ball is greater than or equal to the preset stress further includes: when the maximum stress of the solder ball is less than the preset stress, obtaining a substrate thermal deformation ratio of the reflector antenna subarray panel.

[0078] Detecting whether the substrate thermal deformation ratio is greater than or equal to a preset deformation ratio;

[0079] When the substrate thermal deformation ratio is greater than or equal to the preset deformation ratio, a millimeter wave intelligent reflector warping increase signal is sent to the SIP packaging system.

[0080] In the embodiment, the maximum stress of the tin ball is less than the preset stress, indicating that the stress of the tin ball between the reflector antenna subarray panel and the test board is normal, and the substrate thermal deformation ratio is collected. Specifically, the substrate thermal deformation ratio is collected by collecting the thermal deformation distribution of the reflector antenna subarray panel. The substrate thermal deformation ratio is the deformation degree of the substrate of the reflector antenna subarray panel after temperature cycle. When the substrate thermal deformation ratio is greater than or equal to the preset deformation ratio, it indicates that the thermal deformation degree of the substrate of the reflector antenna subarray panel is too large, that is, it indicates that the reflector antenna subarray panel has a warping problem. At this time, a millimeter wave intelligent reflecting surface warping increase signal is sent to the SIP packaging system to determine that the millimeter wave intelligent reflecting surface structure exists a short circuit or open circuit of tin ball interconnection caused by warping during packaging, and the tin ball distributed in the middle needs to be increased in volume to reduce the probability of product unqualified caused by warping after packaging.

[0081] Wherein, the thermal deformation distribution is a stress change curve of the tin ball after 3 temperature cycles, for example, the temperature of each temperature cycle is from -55 degrees Celsius to 100 degrees Celsius, when the thickness of the reflector antenna subarray panel is 1.2mm, the thermal deformation distribution is as shown in Figure 15 When the thickness of the reflector antenna subarray panel is 2mm, the thermal deformation distribution is as shown in Figure 16 Through the detection of the stress of the tin ball, when the thickness is 1.2mm, the stress change of the tin ball is less than 68Mpa. When the thickness is 2mm, the stress change of the tin ball is less than 10Mpa, which is safer in process implementation. Different tin ball distribution and different subarray substrate distribution will correspond to different optimal test board size, Figure 17 The thermal deformation of the reflector antenna subarray panel is shown in the embodiment. The height of the tin ball is 0.6mm, and the height of the tin ball after tin is limited to 0.4mm. The reflector antenna subarray panel will deform when heated, and the deformation will cause short circuit or open circuit of tin ball interconnection. By setting the thermal deformation under the condition of 260 degrees Celsius stable state, the variable has the size, the number of layers and the thickness of the reflector antenna subarray panel, Figure 18 The thermal deformation data distribution of the reflector antenna subarray panel is shown in the figure. As can be seen from the figure, the total deformation degree is less than 0.2mm, and the warping degree is less than 0.09%, which meets the industry standard and has little effect on performance.

[0082] In another embodiment, when the substrate thermal deformation ratio is less than the preset deformation ratio, step S300 is performed.

[0083] In another embodiment, after the above tin ball stress and thermal deformation test, the antenna function of the large-scale millimeter wave intelligent reflecting surface structure is improved, for example, when the millimeter wave intelligent reflecting surface structure is expanded to 100x100 array, as shown inFigure 19 For 100x100 unit arrangement map, it can be composed of 10x10, i.e. 100 10x10 sub-arrays, or 5x5, i.e. 25 20x20 sub-arrays. The specific needs should be considered in terms of overall size, structural stress and heating condition. Similarly, the arrangement of four units obtained by genetic algorithm optimization is shown in the figure, and the numbers 1, 2, 3 and 4 represent units one, two, three and four, respectively, and the four units are distinguished by four colors. At this time, the beam scanning results are shown in Figure 20 The reflection amplitude is maintained at 36.0dB-36.4dB, and the sidelobe level is lower than -12.1dB.

[0084] The above-described embodiments only express several embodiments of the present disclosure, and the description is relatively specific and detailed, but it cannot be understood as a limitation on the scope of the patent. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present disclosure, several modifications and improvements can be made, which belong to the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure patent should be subject to the appended claims.

Claims

1. A SIP system integration package early warning method based on a millimeter wave intelligent reflecting surface structure, characterized in that, The application relates to a monitoring method for package warping in a package process of a millimeter wave intelligent reflecting surface structure, and the millimeter wave intelligent reflecting surface structure comprises: A reflector antenna subarray board has a plurality of radiation units; A test assembly comprises a test board and a plurality of phase quantization units, the plurality of phase quantization units are located between the reflector antenna subarray board and the test board, each phase quantization unit corresponds to a radiation unit, the phase quantization unit comprises two tin balls and two phase modulation diodes, the phase modulation diodes are connected with the reflector antenna subarray board, the phase modulation diodes correspond to coupling grooves of the reflector antenna subarray board, and the tin balls are welded with the reflector antenna subarray board and the test board respectively so that control lines of the test board are electrically connected with control ends of the phase modulation diodes. The SIP system integrated package early warning method comprises: Obtaining a substrate package state parameter of a reflector antenna subarray board; Performing subarray rule complex difference processing on the substrate package state parameter and a preset package state parameter to determine a package state difference degree currently existing in the substrate of the reflector antenna subarray board, so as to obtain a subarray package complex difference quantity; According to the subarray package complex difference quantity, a millimeter wave intelligent reflecting surface package early warning start-stop signal is sent to an SIP package system to determine a package qualified state of the millimeter wave intelligent reflecting surface structure. The method for obtaining the substrate package state parameter of the reflector antenna subarray board comprises:

2. The millimeter-wave smart reflective surface structure based SIP system integrated package early warning method of claim 1, wherein Obtaining a substrate layer number of the reflector antenna subarray board. The method for performing subarray rule complex difference processing on the substrate package state parameter and a preset package state parameter to obtain a subarray package complex difference quantity comprises:

3. The millimeter-wave smart reflective surface structure based SIP system integrated package early warning method of claim 2, wherein Obtaining a difference between the substrate layer number and a preset layer number to obtain a subarray package layer number difference. The method for sending, according to the subarray package complex difference quantity, a millimeter wave intelligent reflecting surface package early warning start-stop signal to an SIP package system comprises:

4. The millimeter-wave smart reflective surface structure based SIP system integrated package early warning method according to claim 3, characterized in that, Detecting whether the subarray package layer number difference is greater than or equal to a preset package layer number difference; When the subarray package layer number difference is greater than or equal to the preset package layer number difference, a millimeter wave intelligent reflecting surface package alarm start signal is sent to the SIP package system. The method for detecting whether the subarray package layer number difference is greater than or equal to a preset package layer number difference further comprises:

5. The millimeter-wave smart reflective surface structure based SIP system integrated package early warning method according to claim 4, characterized in that, When the subarray package layer number difference is less than the preset package layer number difference, a millimeter wave intelligent reflecting surface package alarm stop signal is sent to the SIP package system. The method for obtaining the substrate package state parameter of the reflector antenna subarray board comprises:

6. The millimeter-wave-intelligent-reflective-surface-structure-based SIP system integrated package early warning method according to claim 1, wherein Obtaining a substrate thickness of the reflector antenna subarray board. The method for performing subarray rule complex difference processing on the substrate package state parameter and a preset package state parameter to obtain a subarray package complex difference quantity comprises:

7. The millimeter-wave-intelligent-reflective-surface structure based SIP system integrated package early warning method according to claim 6, characterized in that, Obtaining a difference between the substrate thickness and a preset thickness to obtain a subarray package thickness difference. The method for sending, according to the subarray package complex difference quantity, a millimeter wave intelligent reflecting surface package early warning start-stop signal to an SIP package system comprises:

8. The millimeter-wave smart reflective surface structure based SIP system integrated package early warning method according to claim 7, characterized in that, Detecting whether the subarray package thickness difference is greater than or equal to a preset package thickness difference; ​ When the subarray packaging thickness difference is greater than or equal to the preset packaging thickness difference, a millimeter wave intelligent reflecting surface packaging alarm opening signal is sent to the SIP packaging system.

9. The millimeter-wave smart reflective surface structure based SIP system integrated package early warning method according to claim 8, characterized in that, The detection of whether the subarray packaging thickness difference is greater than or equal to the preset packaging thickness difference further includes: When the subarray packaging thickness difference is less than the preset packaging thickness difference, a millimeter wave intelligent reflecting surface packaging alarm closing signal is sent to the SIP packaging system.

10. The millimeter-wave smart reflective surface structure based SIP system integrated package early warning method of claim 1, wherein, The substrate packaging state parameter includes the substrate area of the reflecting surface antenna subarray board.

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