Wafer recycling apparatus

Abstract

The application discloses a wafer recycling treatment device, which comprises a treatment tank with an electric heating pipe inside, a sealing plate for sealing the upper opening of the treatment tank, a plate heat exchanger for heat exchange, and a plurality of automatic pouring units arranged in the inner cavity of the treatment tank; the lower end of the sealing plate is provided with a placing rack for bearing a flower basket and an electric telescopic rod for adjusting the height of the sealing plate; the plate heat exchanger is provided with a first feeding pipe, a first discharging pipe, a second feeding pipe provided with a feeding pump, and a second discharging pipe, and the second discharging pipe is connected with a plurality of liquid feeding pipes. The device exchanges heat between the first mixed acid liquid and the second mixed acid liquid through the plate heat exchanger, so that the exchanged second mixed acid liquid has a certain temperature, the electric energy loss of the subsequent electric heating pipe is reduced, the electric energy is saved, and the occupying space of the device is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and in particular to a wafer recovery and processing device. Background Art

[0002] The removal of molybdenum metal film is crucial in wafer regeneration projects. If the molybdenum metal film remaining on the surface is not completely removed, these metal residues may have an adverse effect on subsequent processing. For example, metal ions may diffuse into the interior of the wafer, affecting the electronic properties of the silicon wafer, resulting in device performance degradation or even damage.

[0003] When processing the molybdenum metal film layer on the wafer, our company adopts a two-step process: S1, the wafer is placed in the first ultrasonic cleaning tank, the temperature is controlled at 120 to 150 degrees Celsius, and the wafer is preliminarily treated with a first mixed acid solution formed by sulfuric acid and hydrogen peroxide to remove organic matter or metal oxides on the wafer surface; S2, after the preliminary treatment is completed, the wafer is moved to the second ultrasonic cleaning tank, the temperature is controlled at 60 to 80 degrees Celsius, and the wafer is treated with a second mixed acid solution formed by nitric acid and hydrochloric acid to finally complete the removal of the molybdenum metal film layer.

[0004] During the actual operation of the above process, the first mixed acid liquid will be directly discharged after treatment, resulting in a large amount of heat loss. At the same time, it is cleaned in two cleaning tanks, which makes the entire processing equipment occupy a large space. Therefore, this application provides a wafer recycling and processing device to meet the needs. Summary of the Invention

[0005] The purpose of this application is to provide a wafer recycling and processing device to solve the technical problems raised in the above background.

[0006] To achieve the above-mentioned objectives, the present application provides the following technical solutions: a wafer recycling and processing device, comprising a processing tank with an electric heating tube inside, the upper end of the processing tank being open, and further comprising a sealing plate for sealing the upper end opening of the processing tank, a plate heat exchanger for heat exchange, and a plurality of automatic unloading units arranged in the inner cavity of the processing tank;

[0007] The lower end of the sealing plate is provided with a placement rack for carrying a flower basket and an electric telescopic rod for adjusting the height of the sealing plate;

[0008] The automatic pouring unit includes a plurality of mounting plates arranged in the inner cavity of the processing tank and arranged opposite to each other in pairs, a pouring bucket is arranged between the two opposite mounting plates via a rotating shaft, the rotating shaft and the pouring bucket are eccentrically arranged, a vertically arranged stopper is fixedly arranged on the rotating shaft, and a first stopper and a second stopper are respectively provided on the mounting plates. In an initial state, the first stopper contacts the stopper to form a block, and a liquid feeding pipe is provided above each of the pouring buckets;

[0009] The plate heat exchanger is provided with a first feed pipe, a first discharge pipe, a second feed pipe equipped with a feed pump, and a second discharge pipe, wherein the second discharge pipe is respectively connected to the plurality of liquid delivery pipes;

[0010] The treatment tank is provided with a liquid inlet pipe and two liquid outlet pipes, and the two liquid outlet pipes are respectively installed with a first discharge pump and a second discharge pump. The liquid outlet end of the first discharge pump is connected to the first feed pipe, and an ultrasonic vibration plate is provided at the bottom of the inner cavity of the treatment tank.

[0011] As a preferred implementation in this embodiment, it also includes an automatic detection unit, which automatically releases the limit lock on the multiple dumping buckets when it detects that the treatment acid in the treatment tank is discharged. When no acid is added to the treatment tank, the automatic detection unit cannot limit lock the multiple dumping buckets.

[0012] As a preferred implementation manner in this embodiment, the automatic detection unit includes a U-shaped floating plate, a plurality of pull ropes, a plurality of guide wheel groups and a plurality of square positioning rods, the U-shaped floating plate is connected to the corresponding plurality of square positioning rods through the cooperation of a plurality of pull ropes and a plurality of guide wheel groups, the square positioning rods slide through the U-shaped plate fixedly arranged on the mounting plate, a retaining ring is fixed on the square positioning rod, and a limiting spring is fixed between the retaining ring and the U-shaped plate, the limiting spring is sleeved on the periphery of the square positioning rod, and a square positioning hole adapted to the square positioning rod is provided on the end of the rotating shaft;

[0013] A baffle is provided on the inner wall of the processing tank, and the baffle is located above the U-shaped floating plate.

[0014] As a preferred implementation in this embodiment, a locking unit is further included. When the pouring bucket pours the acid liquid into the treatment tank, it automatically locks the square positioning rod, and automatically unlocks the square positioning rod after the pouring bucket returns to its original position.

[0015] As a preferred implementation scheme in this embodiment, the locking unit includes an L-shaped rod, a movable rod and a locking rod. The L-shaped rod is installed on the mounting plate. One end of the movable rod slides through the first baffle and contacts the block. The mounting end of the movable rod is connected to the L-shaped rod through a locking spring. The locking rod is fixed on the movable rod. The square positioning rod is provided with a locking hole that is compatible with the locking rod.

[0016] As a preferred implementation manner in this embodiment, when the stopper starts to contact with the first stopper bar and then contacts with the second stopper bar, the rotation angle of the stopper around the rotation axis is set to 120° to 150°.

[0017] As a preferred implementation in this embodiment, the pouring buckets are arranged in four groups, and the two pouring buckets located on the same side are arranged in an eight-shaped shape.

[0018] In summary, the technical effects and advantages of the present invention are as follows:

[0019] The present invention has a reasonable structure. The device uses a plate heat exchanger to exchange heat between the first mixed acid liquid and the second mixed acid liquid, so that the second mixed acid liquid after the exchange has a certain temperature, which can reduce the power loss of the subsequent electric heating pipe and play a role in saving electricity. At the same time, the two acid treatments are carried out in the same treatment tank, which reduces the occupied space of the device.

[0020] In the present invention, an automatic detection unit is provided to ensure that when the dumping bucket containing the second mixed acid solution rotates, the first mixed acid solution in the cleaning tank has been substantially discharged, thereby preventing the concentration of the second mixed acid solution from being affected.

[0021] In the present invention, a locking unit is provided to prevent the square positioning rod from being plugged into the square positioning hole when the dumping bucket is not restored to its original position. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 It is a schematic diagram of the local structure of the present invention;

[0024] Figure 2 for Figure 1 Schematic diagram of the internal structure of the middle processing tank;

[0025] Figure 3 for Figure 2 Schematic diagram of the partially enlarged structure;

[0026] Figure 4 for Figure 3 Schematic diagram of the partially enlarged structure;

[0027] Figure 5 for Figure 4 A in the middle is an enlarged structural diagram;

[0028] Figure 6 It is a schematic diagram of the structure of the processing tank from a top view;

[0029] Figure 7 for Figure 4 Schematic diagram of the position structure of the first stop bar, the second stop bar and the stop block from a side view;

[0030] Figure 8 for Figure 2 Schematic diagram of the partial cross-section structure of the middle shell;

[0031] Figure 9 Schematic diagram of the shaft position structure.

[0032] In the figure: 1. treatment tank; 101. liquid inlet pipe; 102. ultrasonic vibration plate; 2. electric telescopic rod; 3. sealing plate; 4. placement rack; 5. first discharge pump; 6. second discharge pump; 7. plate heat exchanger; 8. first discharge pipe; 9. first feed pipe; 10. second discharge pipe; 11. feeding pump; 12. tipping bucket; 13. rotating shaft; 14. block; 15. first baffle; 16. second baffle; 17. mounting plate; 18. U-shaped floating plate; 19. pull rope; 20. guide wheel group; 21. U-shaped plate; 22. square positioning rod; 23. retaining ring; 24. limit spring; 25. square positioning hole; 26. movable rod; 27. L-shaped rod; 28. locking spring; 29. ​​locking rod; 30. mounting end; 31. liquid feeding pipe; 32. baffle. DETAILED DESCRIPTION

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0034] Example: Reference Figure 1-3 、 Figure 8 、 Figure 9The wafer recycling and processing device shown includes a processing tank 1 with an electric heating tube inside. The upper end of the processing tank 1 is open. It also includes a sealing plate 3 for sealing the upper end opening of the processing tank 1, a plate heat exchanger 7 for heat exchange, and multiple automatic unloading units arranged in the inner cavity of the processing tank 1.

[0035] The lower end of the sealing plate 3 is provided with a placement rack 4 for carrying a flower basket and an electric telescopic rod 2 for adjusting the height of the sealing plate 3;

[0036] The automatic pouring unit includes a plurality of mounting plates 17 arranged in pairs in the inner cavity of the processing tank 1. A pouring bucket 12 is rotatably arranged between the two opposing mounting plates 17 via a rotating shaft 13. The rotating shaft 13 is eccentrically arranged with respect to the pouring bucket 12. A vertical stopper 14 is fixedly provided on the rotating shaft 13. A first stopper 15 and a second stopper 16 are respectively provided on the mounting plates 17. In the initial state, the first stopper 15 contacts the stopper 14 to form a block. A liquid feeding pipe 31 is provided above each pouring bucket 12.

[0037] The plate heat exchanger 7 is provided with a first feed pipe 9, a first discharge pipe 8, a second feed pipe equipped with a feed pump 11, and a second discharge pipe 10. The second discharge pipe 10 is respectively connected to a plurality of liquid delivery pipes 31.

[0038] The treatment tank 1 is provided with a liquid inlet pipe 101 and two liquid outlet pipes, on which the first discharge pump 5 and the second discharge pump 6 are respectively installed. The liquid outlet end of the first discharge pump 5 is connected to the first feed pipe 9, and an ultrasonic vibration plate 102 is provided at the bottom of the inner cavity of the treatment tank 1.

[0039] Before use, the liquid inlet pipe 101 (which is provided with an electric valve) is connected to the first storage tank storing the first mixed acid solution. The first storage tank transports the acid solution into the liquid inlet pipe 101 through the pump body. The second feed pipe (which is provided with an electric valve) is connected to the second storage tank storing the second mixed acid solution. The liquid outlet end of the second discharge pump 6 and the first discharge pipe 8 are both connected to the corresponding waste liquid storage tank. All electrical devices in this device are electrically connected to the PLC controller.

[0040] During use, the pump body is controlled to deliver a certain amount of the first mixed acid liquid into the processing tank 1 (so that the wafers on the flower basket are immersed in the acid liquid). After completion, the electric valves are controlled to close the pipelines, the ultrasonic vibration plate 102 and the electric heating tube are controlled to work, and the first mixed acid liquid is heated to the set temperature and kept at a constant temperature by the electric heating tube. After the first mixed acid liquid has completed the treatment of the outer surface of the wafer, the first discharge pump 5 and the feed pump 11 are controlled to work at the same time, and the treated first mixed acid liquid and the untreated second mixed acid liquid are respectively delivered to the plate heat exchanger 7 for heat exchange. After the heat exchange is completed, the first mixed acid liquid is discharged from the first discharge pipe 8, and the heated second mixed acid liquid is delivered to the corresponding dumping bucket 12 through the liquid feeding pipe 31. As the acid liquid in the dumping bucket 12 increases and rotates (the first mixed acid in the corresponding processing tank 1 is discharged, and as the discharge progresses, less and less, the purpose is to prevent the first mixed acid liquid from being discharged). The first mixed acid liquid is mixed with the second mixed acid liquid to reduce the concentration of the second mixed acid liquid, thereby avoiding extending the processing time of the wafer), the dumping bucket 12 rotates to dump the second mixed acid liquid into the processing tank 1 at the same time. During this process, the first discharge pump 5 and the feed pump 11 both stop working, and the electric valves are closed. The ultrasonic vibration plate 102 is controlled to work, and the second mixed acid liquid is kept at a constant temperature in conjunction with the electric heating tube. After the second mixed acid liquid has completed processing the wafer, the second mixed acid liquid is directly discharged through the second discharge pump 6. The device uses a plate heat exchanger 7 to exchange heat between the first mixed acid liquid and the second mixed acid liquid, so that the second mixed acid liquid after the exchange has a certain temperature, so that the heat in the first mixed acid liquid after the treatment is fully utilized, which can reduce the power loss of the subsequent electric heating tube and save electricity. At the same time, the two acid treatments are carried out in the same processing tank 1, reducing the occupied space of the device.

[0041] It should be noted that, first, the dumping bucket 12 serves as a temporary storage device. When the first mixed acid liquid in the processing tank 1 is almost discharged, the dumping bucket 12 will suddenly rotate (when it rotates, the sum of the total amount of the second mixed acid liquid stored in multiple dumping buckets 12 has reached the value required for processing the wafers). A large amount of second mixed acid liquid is added to the processing tank 1 in a short period of time and submerges the wafers. While avoiding reducing the concentration of the second mixed acid liquid as much as possible, the feeding speed of the second mixed acid liquid is accelerated, thereby improving the overall working efficiency of the device. After dumping, the dumping bucket 12 returns to its original position; second, the dumping bucket 12 dumps and resets due to the imbalance of gravity on both sides of the rotating shaft 13, and its first baffle 15 and second baffle 16 can prevent the dumping bucket 12 from rotating to prevent it from excessive rotation; third, the outer surface of the first baffle 15 and the baffle 14 can be wrapped with an elastic layer, which has a buffering collision effect.

[0042] As a preferred embodiment in the present embodiment, the automatic detection unit is further provided, which automatically releases the position locking of the plurality of pouring barrels 12 when detecting that the processing acid liquid in the processing tank 1 is discharged, and the automatic detection unit cannot position lock the plurality of pouring barrels 12 when no acid liquid is added in the processing tank 1.

[0043] The organic substance or metal oxide on the wafer surface needs a large amount of the first mixed acid liquid, and the molybdenum metal film layer on the wafer surface needs a second mixed acid liquid which is less than the first mixed acid liquid, so that the first mixed acid liquid continues to be discharged after the second mixed acid liquid is added into the pouring barrel 12. In order to ensure that the first mixed acid liquid in the cleaning tank 1 is basically discharged when the pouring barrel 12 containing the second mixed acid liquid rotates, the automatic detection unit is provided.

[0044] As a preferred embodiment in the present embodiment, as shown in Figure 1-7 The automatic detection unit includes a U-shaped floating plate 18, a plurality of pull ropes 19, a plurality of guide wheel sets 20 and a plurality of square positioning rods 22. The U-shaped floating plate 18 is connected with the corresponding plurality of square positioning rods 22 through the cooperation of the plurality of pull ropes 19 and the plurality of guide wheel sets 20. The square positioning rod 22 is slidingly penetrated through the U-shaped plate 21 fixedly arranged on the mounting plate 17. The square positioning rod 22 is fixed with a blocking ring 23, and the blocking ring 23 is fixed with a limiting spring 24 between the U-shaped plate 21. The limiting spring 24 is sleeved on the periphery of the square positioning rod 22. The end of the rotating shaft 13 is provided with a square positioning hole 25 matched with the square positioning rod 22.

[0045] The inner wall of the processing tank 1 is provided with a baffle 32, and the baffle 32 is located above the U-shaped floating plate 18.

[0046] When the first mixed acid solution is not added to the treatment tank 1, the U-shaped float 18 contacts the bottom of the treatment tank 1. Due to the gravity of the U-shaped float 18, its limit spring 24 is in a compressed state, and the square positioning rod 22 is not plugged into the square positioning hole 25. When the first mixed acid solution is added to the treatment tank 1, the U-shaped float 18 moves upward for a short distance and contacts the baffle 32. At this time, the square positioning rod 22 is plugged into the square positioning hole 25 under the action of the limit spring 24 to position the dumping bucket 12. As the liquid level in the treatment tank 1 rises, the position of the U-shaped float 18 remains unchanged. When the first mixed acid solution is discharged, After the required amount of the second mixed acid liquid has been completely delivered to the multiple dumping buckets 12, the feed pump 11 stops working, and the first discharge pump 5 continues to discharge. As the discharge progresses, its U-shaped float 18 moves downward. When the lower end of the U-shaped float 18 contacts the treatment tank (at this time the first mixed acid liquid in the treatment tank 1 is basically discharged, and the PLC controller controls the first discharge pump 5 to stop working), the positioning end of the square positioning rod 22 moves out of the square positioning hole 25 under the action of gravity of the U-shaped float 18. At this time, the multiple dumping buckets 12 rotate to dump and discharge. After the discharge is completed, the dumping bucket 12 returns to its original position due to the action of gravity.

[0047] It should be noted that a liquid level gauge electrically connected to the PLC control may be provided in the treatment tank 1 , and the first discharge pump 5 or the second discharge pump 6 stops working when the liquid level gauge detects that the acid liquid in the treatment tank 1 is completely discharged.

[0048] As a preferred implementation in this embodiment, a locking unit is also included. When the dumping bucket 12 pours the acid liquid into the treatment tank 1, it automatically locks the square positioning rod 22, and automatically unlocks the square positioning rod 22 after the dumping bucket 12 returns to its original position.

[0049] During the period of time when the dumping bucket 12 returns to its original position after dumping the second mixed acid liquid into the treatment tank 1 (the U-shaped float 18 will generate buoyancy and then move upward due to the addition of the second mixed acid liquid), it is easy for the dumping bucket 12 to be plugged into the square positioning rod 22 and the square positioning hole 25 when it has not returned to its original position, thereby making it impossible for the dumping bucket 12 to rotate back to its original position, and it is easy to cause the acid liquid subsequently discharged from the liquid delivery pipe 31 to be unable to enter the dumping bucket 12 and be directly mixed with the first mixed acid liquid and discharged.

[0050] As a preferred implementation in this embodiment, Figure 4 and Figure 5As shown, the locking unit includes an L-shaped rod 27, a movable rod 26 and a locking rod 29. The L-shaped rod 27 is installed on the mounting plate 17. One end of the movable rod 26 slides through the first baffle 15 and contacts the block 14. The mounting end 30 of the movable rod 26 is connected to the L-shaped rod 27 through a locking spring 28. The locking rod 29 is fixed on the movable rod 26. A locking hole adapted for the locking rod 29 is provided on the square positioning rod 22.

[0051] When the first mixed acid liquid is not added to the treatment tank 1, its movable rod 26 contacts the block 14, the locking spring 28 is compressed, and the locking rod 29 is not plugged into the locking hole. When the dumping bucket 12 rotates and the block 14 contacts and separates from the end of the movable rod 26, the second mixed acid liquid in the dumping bucket 12 has not started to pour out, and the lower end of the U-shaped float 18 contacts the bottom of the treatment tank 1. When the movable rod 26 contacts and separates from the baffle 14, the locking spring 28 enables the movable rod 26 to drive the locking rod 29 to move close to the locking hole and finally complete the plug-in locking. At this time, the position of the U-shaped float 18 is locked. After the second mixed acid liquid in the dumping bucket 12 is poured into the treatment tank, the U-shaped float 18 does not move. When the dumping bucket 12 returns to its original position and forms contact and extrusion with the movable rod 26, the positioning end of the locking rod 29 can be moved out of the locking hole. At this time, the U-shaped float 18 floats up and contacts the baffle 32.

[0052] It should be noted that when the block 14 collides with the end of the movable rod 26 and drives it to move, the rotation of the dumping bucket 12 is hindered by the locking spring 28, which is beneficial to the rapid stabilization of the dumping bucket 12 (avoiding multiple collisions between the block 14 and the first baffle 15 when the dumping bucket 12 returns to its original position), and is beneficial to the subsequent precise insertion of the square positioning rod 22 and the square positioning hole 25.

[0053] As a preferred implementation in this embodiment, when the stopper 14 starts to contact the first stopper 15 and then contacts the second stopper 16, the rotation angle of the stopper 14 around the rotating shaft 13 is set to 120° to 150°.

[0054] It can ensure that the dumping bucket 12 is fully tilted during the dumping process, so that all the acid liquid can flow out smoothly. At the same time, it can also avoid a more intense collision or collision damage caused by an excessive rotation angle.

[0055] As a preferred implementation in this embodiment, the dumping buckets 12 are arranged in four groups, and the two dumping buckets 12 located on the same side are arranged in an eight-shaped shape.

[0056] The sudden dumping of the dumping bucket 12 can produce a large impact, which can rinse the wafer and wash away the first mixed liquid and other impurities on it. This helps to improve the cleanliness of the wafer surface and provide a better base for subsequent process steps. The dumping buckets 12 are set at an angle and are set in pairs relative to each other, which can form a good rinse for both sides of the wafer.

[0057] It should be noted that the angle between the tilt angle of the dumping bucket 12 and the horizontal direction is set to 25° to 35°, so that the wafer washing coverage area is wide and the washing effect is good.

[0058] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer recycling device, comprising a processing tank (1) with an electric heating tube inside, wherein the upper end of the processing tank (1) is open, and is characterized in that: It also includes a sealing plate (3) for sealing the upper opening of the processing tank (1), a plate heat exchanger (7) for heat exchange, and a plurality of automatic pouring units arranged in the inner cavity of the processing tank (1); The lower end of the sealing plate (3) is provided with a placement rack (4) for carrying a flower basket and an electric telescopic rod (2) for adjusting the height of the sealing plate (3); The automatic pouring unit comprises a plurality of mounting plates (17) arranged in pairs in the inner cavity of the processing tank (1), a dumping bucket (12) is rotatably arranged between the two mounting plates (17) via a rotating shaft (13), the rotating shaft (13) and the dumping bucket (12) are eccentrically arranged, a vertically arranged stopper (14) is fixedly arranged on the rotating shaft (13), a first stopper (15) and a second stopper (16) are respectively arranged on the mounting plates (17), and in an initial state, the first stopper (15) contacts the stopper (14) to form a block, and a liquid feeding pipe (31) is arranged above each dumping bucket (12); The plate heat exchanger (7) is provided with a first feed pipe (9), a first discharge pipe (8), a second feed pipe equipped with a feed pump (11), and a second discharge pipe (10), wherein the second discharge pipe (10) is respectively connected to the plurality of liquid delivery pipes (31); The treatment tank (1) is provided with a liquid inlet pipe (101) and two liquid outlet pipes, and the two liquid outlet pipes are respectively installed with a first discharge pump (5) and a second discharge pump (6), the liquid outlet end of the first discharge pump (5) is connected to the first feed pipe (9), and an ultrasonic vibration plate (102) is provided at the bottom of the inner cavity of the treatment tank (1); It also includes an automatic detection unit, which automatically releases the limit lock on the multiple dumping buckets (12) when it detects that the treatment acid liquid in the treatment tank (1) is discharged. When the acid liquid is not added to the treatment tank (1), the automatic detection unit cannot limit lock the multiple dumping buckets (12).

2. The wafer recycling device according to claim 1, characterized in that: The automatic detection unit includes a U-shaped floating plate (18), a plurality of pull ropes (19), a plurality of guide wheel groups (20) and a plurality of square positioning rods (22). The U-shaped floating plate (18) is connected to the corresponding plurality of square positioning rods (22) through the cooperation of the plurality of pull ropes (19) and the plurality of guide wheel groups (20). The square positioning rods (22) slide through the U-shaped plate (21) fixedly arranged on the mounting plate (17). A retaining ring (23) is fixed on the square positioning rod (22), and a limiting spring (24) is fixed between the retaining ring (23) and the U-shaped plate (21). The limiting spring (24) is sleeved on the periphery of the square positioning rod (22). A square positioning hole (25) adapted to the square positioning rod (22) is provided on the end of the rotating shaft (13); A baffle (32) is provided on the inner wall of the treatment tank (1), and the baffle (32) is located above the U-shaped floating plate (18).

3. The wafer recycling device according to claim 2, characterized in that: It also includes a locking unit, which automatically locks the square positioning rod (22) when the pouring bucket (12) pours the acid liquid into the treatment tank (1), and automatically unlocks the square positioning rod (22) after the pouring bucket (12) returns to its original position.

4. The wafer recycling device according to claim 3, characterized in that: The locking unit comprises an L-shaped rod (27), a movable rod (26) and a locking rod (29), wherein the L-shaped rod (27) is mounted on the mounting plate (17), one end of the movable rod (26) slides through the first stop bar (15) and contacts the stop block (14), the mounting end (30) of the movable rod (26) is connected to the L-shaped rod (27) via a locking spring (28), the locking rod (29) is fixed on the movable rod (26), and a locking hole adapted to the locking rod (29) is provided on the square positioning rod (22).

5. The wafer recycling device according to claim 1, characterized in that: When the stopper (14) starts to contact the first stopper (15) and then contacts the second stopper (16), the rotation angle of the stopper (14) around the rotating shaft (13) is set to 120° to 150°.

6. The wafer recycling device according to claim 1, characterized in that: The dumping buckets (12) are arranged in four groups, and the two dumping buckets (12) located on the same side are arranged in an eight-shaped shape.

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