A TOPCon battery front poly passivation layer cleaning equipment

Abstract

The present invention discloses a TOPCon cell front poly passivation layer cleaning device, which relates to the technical field of solar photovoltaic cell production, and aims to optimize the technical problem of relatively uneven erosion cleaning, including an operating platform; a screw displacement assembly is arranged inside the operating platform; a laser sintering assembly is arranged on the side of the screw displacement assembly relatively far from the operating platform; an atomizing spray assembly is arranged on the side of the screw displacement assembly relatively located inside the operating machine. The present invention is based on the reciprocating left and right swinging operation of the dual-mode assembly in conjunction with the gap spraying on both sides of the atomizing spray assembly, so that the chemical cleaning reagent flows and falls off along the jagged edge produced by the texturing, resulting in a short residence time effect. By repeating the above operation many times, a relatively uniform cleaning situation is achieved, and the situation of cleaning thickness caused by different contact depths between the later prepared layers and the chemical reagents due to the jagged edge produced by the texturing of the N-type single crystal silicon substrate is effectively reduced.

Description

Technical Field

[0001] The invention relates to the technical field of solar photovoltaic cell production, and more specifically to a TOPCon cell front poly passivation layer cleaning device. Background Art

[0002] TOPCon battery front poly passivation layer cleaning equipment is one of the key equipment in the TOPCon battery production line. It is mainly responsible for removing impurities, residues and pollutants generated in the process of preparing the poly passivation layer on the front of the battery to ensure the smooth progress of subsequent process steps and the stability of battery performance.

[0003] In the preparation process of TOPCon cells, the cleaning and texturing steps will form a serrated (pyramid-shaped) structure on the surface of the cell, but this is mainly on the front surface of the cell.

[0004] Nevertheless, if we associate the "serrated" feature with the front surface structure of the TOPCon cell and explore its advantages, we can summarize it as follows: Increase light absorption: The sawtooth (pyramid-shaped) surface structure can increase the number of light reflections on the cell surface, thereby extending the optical path of light in the silicon material and improving the light absorption efficiency. This is crucial to improving the photoelectric conversion efficiency of solar cells. Reduce reflection loss: Compared with the planar structure, the sawtooth structure can more effectively reduce the direct reflection loss of light, allowing more light to enter the silicon material and be absorbed. Improve light trapping ability: The sawtooth structure also has good light trapping ability, which can better confine the incident light inside the cell and reduce light escape and scattering losses.

[0005] The existing conventional equipment for cleaning the poly passivation layer on the front of TOPCon batteries is mostly direct immersion cleaning. This operation method is based on the surface texturing structure characteristics in the preparation process of OPCon batteries, which easily leads to different corrosion levels and cleaning levels. In other words, the corrosion cleaning produces relatively uneven conditions. Therefore, how to propose a TOPCon battery front poly passivation layer cleaning equipment with good cleaning uniformity effect is particularly important. In view of this, we propose a TOPCon battery front poly passivation layer cleaning equipment. Summary of the invention

[0006] The object of the present invention is to provide a TOPCon battery front poly passivation layer cleaning device to optimize the relatively uneven technical problem of erosion cleaning.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: a TOPCon battery front poly passivation layer cleaning device, comprising an operating machine; a screw displacement assembly is arranged inside the operating machine; a laser sintering assembly is arranged on the side of the screw displacement assembly relatively away from the operating machine; an atomizing spray assembly is arranged on the side of the screw displacement assembly relatively located inside the operating machine; an auxiliary mechanism is arranged at the lower end of the atomizing spray assembly relative to the movable end of the screw displacement assembly; the auxiliary mechanism comprises a base frame fixedly arranged on the sliding end of the screw displacement assembly; double adjustment frame assemblies are symmetrically arranged on both sides of the base frame; a double-mode assembly is arranged between the double adjustment frame assemblies; a connecting platform movably connected to the double adjustment frame assembly is arranged above the double-mode assembly.

[0008] The present invention is based on the reciprocating left and right swinging operation of the dual-mode component in conjunction with the gap spraying work on both sides of the atomizing spray component, which causes the chemical cleaning reagent to flow and fall off along the jagged edges produced by the texturing, resulting in a short residence time effect. By repeating the above operation many times, relatively uniform cleaning is achieved, and the cleaning thickness caused by the different contact depths between the later prepared layers and the chemical reagents due to the jagged edges produced by the texturing of the N-type single crystal silicon substrate is effectively reduced.

[0009] Preferably, the atomizing spray assembly includes an arch frame arranged at one end of the screw displacement assembly; two groups of axially arranged atomizing spray pipes are provided at the bottom of the arch frame; the atomizing spray pipes are connected to the pumping equipment through pipes, and the two groups of atomizing spray pipes perform staggered intermittent spraying; a wrapping strip is provided at the bottom of the arch frame relatively below the atomizing spray pipes.

[0010] Preferably, the dual-adjustment frame assembly includes two flip-connecting frames symmetrically arranged on both sides of the base frame; limited elastic vibration seats are provided on the opposite surfaces of the two flip-connecting frames; two sections of grooves are provided on the surface of the flip-connecting frames; a synchronous adjustment frame is provided on the side of the flip-connecting frame opposite to the dual-mode assembly; and an auxiliary groove is provided on the surface of the synchronous adjustment frame.

[0011] Preferably, the dual-mode assembly includes a connecting seat fixed on the opposite surfaces of the two flip connecting frames; a driving motor is arranged on the top of the connecting seat; a screw is arranged at the output end of the driving motor; a slide rail frame is arranged on one side of the connecting seat; a lifting seat is arranged on one side of the slide rail frame through a slider; a threaded sleeve threadedly connected to the screw is arranged on one side of the lifting seat; a flip shaft assembly is rotatably arranged on the high end of the lifting seat through a bearing; and an outer sleeve of the flip shaft assembly is provided with an engaging limit sleeve fixedly connected to the connecting seat.

[0012] Preferably, the flip shaft assembly includes an extension shaft; a one-way flip groove is provided on the upper surface of the extension shaft, wherein the one-way flip groove is composed of two spiral grooves and two linear grooves connected end to end, and a vertical force-bearing moving groove is provided inside the linear groove; a sliding adjustment groove is provided at the top of the extension shaft; a lifting arm is slidingly provided inside the sliding adjustment groove; and meshing teeth are provided on the side of the lifting arm; toggle teeth are provided at the bottom of the lifting arm; an adjusting motor is provided at the top of the extension shaft; and a driving gear meshing with the meshing teeth is provided at the output end of the adjusting motor.

[0013] Preferably, a limit guide column A and a limit guide column B are respectively arranged on both sides of the inside of the engaging limit sleeve through springs; the limit guide column A is adapted to the size of the one-way flip groove, and the limit guide column B is adapted to the size of the vertical force-bearing movable groove, and the groove diameter of the one-way flip groove is larger than the groove diameter of the vertical force-bearing movable groove; the limit guide column A and the limit guide column B are both provided with a plurality of elastic buckles with hollow structures at the far ends; wherein, the surface of the engaging limit sleeve is provided with hook teeth relative to the position of the elastic buckle.

[0014] Preferably, the dual-mode assembly also includes a force-bearing central axis column; a force arm distributed in an "X" structure is fixedly arranged on the surface of the force-bearing central axis column; and, one side of the force-bearing central axis column penetrates into two sections of grooves and auxiliary grooves, and, the force-bearing central axis column is slidingly matched with the two sections of grooves and auxiliary grooves through bearing limiting sleeves; auxiliary twisted axis arms are arranged at both ends of the force-bearing central axis column relative to the limiting elastic oscillation seat; and, the auxiliary twisted axis arm is provided with a limiting column through a hinge column; the end of the limiting column is in an arc-shaped structure, and a compensation groove is arranged on the surface of the limiting column relative to the position of the hinge column; and, the limiting column is elastically connected to the hinge column through a spring.

[0015] Preferably, the dual-mode assembly also includes a quadrilateral synchronization assembly arranged inside the dual-adjustment frame assembly; the quadrilateral synchronization assembly includes two force-bearing curved arms hingedly arranged in a parallel structure on the flip connecting stand; the surfaces of the force-bearing curved arms are provided with accommodating grooves; the other ends of the two force-bearing curved arms are hingedly connected through a connecting shaft; and a push rod for rotating the base frame is hingedly provided at the end of the connecting shaft.

[0016] A method for using a TOPCon battery front poly passivation layer cleaning device, comprising the following steps:

[0017] S100, pretreatment: texturing the selected N-type single crystal silicon substrate, obtaining a passivation layer on the surface of the silicon wafer after texturing to form a sawtooth-shaped texturing layer, selecting BCl3 as a raw material gas to prepare a boron-doped polysilicon layer, cleaning and polishing the back side after boron diffusion, depositing a SiO2 tunneling layer on the back side, and depositing a phosphorus-doped amorphous silicon layer, and annealing the deposited doped silicon wafer, and depositing a front intrinsic amorphous silicon layer by PECVD;

[0018] S200, partial preservation of the poly layer:

[0019] S201. One of the processing methods: drive the N-type single crystal silicon substrate to move to the laser sintering component through the screw displacement component, use laser to process the surface of the intrinsic amorphous silicon layer in a specific area on the front side, so that a SiO2 layer is formed on the surface of the amorphous silicon layer in the processed area, and then adjust the screw displacement component to move it to the bottom of the atomizing spray component, and then adjust the motor to drive the driving gear to rotate, so that the lifting arm moves axially, which can be adjusted to the following Figure 5 In the state shown, the limit guide column B is separated from the vertical force-bearing movable groove, and the limit guide column A is slidably plugged into the one-way flip groove. Under the limit of the limit guide column A, the drive motor rotates to drive the screw rod, causing the threaded sleeve, the lifting seat and the flip shaft rod assembly to perform a relatively small lifting and lowering work as a whole. The lifting seat simultaneously drives the extension shaft and the lifting arm to rotate, and the lifting and lowering arm is rotated 180 degrees through the locked state, causing the lifting arm to alternately apply an inclined rotational force to the force arm, and the connection carrier is squeezed and rotated by the rotation of the force arm, and then the silicon wafer is corroded by alkali solution through the atomizing spray component. The area covered with the SiO2 layer, the SiO2 layer blocks the corrosion of the amorphous silicon layer by the alkali solution and is retained, and the silicon wafer treated with alkali solution is pickled by the atomizing spray component to remove the SiO2 layer on the surface;

[0020] S202, another processing method: then adjust the motor to drive the driving gear to rotate, so that the lifting arm performs axial sliding movement, adjust the lifting arm to the same central axis position of the meshing limit sleeve, the limit guide column B is slidably inserted into the vertical force-bearing moving groove, and the limit guide column A is separated from the one-way flip groove, and the driving motor is driven to rotate the screw rod to cause the threaded sleeve, the lifting seat and the flip shaft rod assembly to perform a relatively small rise as a whole, so that the lifting arm is located between the two force arms at the lower end, and then the driving motor is continuously rotated to perform a relatively large rise, and the push rod is synchronously connected to perform a stroke to realize the horizontal rise of the connected carrier, so that the surface of the N-type single crystal silicon substrate and the upper surface and the end of the wrapping strip are separated to protect the poly layer at the required position, and then the silicon wafer is corroded by alkaline solution through the atomizing spray component, and the area covered with the SiO2 layer can retain the poly layer protected by the wrapping strip;

[0021] S300, printing and sintering treatment: use ALD to deposit Al2O3 on both sides, use PECVD equipment to deposit SiNx on both sides of the silicon wafer, and print and sinter the processed silicon wafer to form a conductive gate line.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. The present invention is based on the reciprocating left and right swinging operation of the dual-mode component and the gap spraying work on both sides of the atomizing spray component, which causes the chemical cleaning reagent to flow and fall off along the jagged edges produced by the texturing, resulting in a short residence time effect. By repeating the above operation many times, a relatively uniform cleaning situation is achieved, which effectively reduces the cleaning thickness caused by the different contact depths between the later prepared layers and the chemical reagents due to the jagged edges produced by the texturing of the N-type single crystal silicon substrate.

[0024] 2. The present invention uses two sets of atomizing spray pipes to perform staggered gap spraying work, and the dual-mode assembly swings back and forth left and right, and performs bidirectional tilting, so that the N-type single crystal silicon substrate can effectively perform a single left and right swing and two tilting processes to simultaneously perform two chemical reagent cleaning operations, effectively improving the operational efficiency of multiple cleanings.

[0025] 3. The present invention synchronously adjusts the stand to maintain a vertical upward trajectory of the dual-mode assembly during the overall upward movement of the dual-mode assembly, thereby compensating for the instability of the upward sliding of the two-section grooves and achieving operational accuracy.

[0026] 4. The present invention is based on adjusting the motor to drive the driving gear to rotate, so that the lifting arm can slide axially and can be adjusted to Figure 5 In the state shown, or by adjusting the lifting arm to the same central axis position as the engaging limiting sleeve, two different operation modes are realized to retain the poly layer located at the metal grid line.

[0027] 5. The present invention is based on adjusting the motor to drive the driving gear to rotate, so that the lifting arm can slide axially. The toggle teeth at the bottom of the lifting arm can synchronously toggle the limit guide column A and the elastic buckle on the limit guide column B in the forward direction, so that the limit guide column A and the limit guide column B can move, and the limit guide column A and the limit guide column B are adjusted and limited under the limit of the hook teeth. At the same time, the elastic buckle keeps the limit guide column A and the limit guide column B from causing movement interference to the axial sliding of the lifting arm during excessive movement. When the lifting arm is adjusted to the same central axis position as the meshing limit sleeve, the limit guide column B is slidably inserted into the vertical force-bearing moving groove, and the limit guide column A is separated from the one-way flip groove, so that the lifting seat can only perform lifting and lowering movements synchronously. The lifting arm can be adjusted to the following: Figure 5In the state shown, the limit guide column B is separated from the vertical force-bearing moving groove, and the limit guide column A is slidably plugged into the one-way flip groove. Under the limit of the limit guide column A, the lifting and lowering movement of the lifting seat can synchronously drive the extension shaft and the jacking lifting arm to rotate. Through the locked state, the lifting and lowering rotation is 180 degrees, causing the jacking lifting arm to alternately apply an inclined rotational force to the force arm.

[0028] 6. The present invention adjusts the lifting arm to Figure 5 In the state shown, the force arm is made to perform left and right staggered tilt and rotation movements, so that the stressed central axis column synchronously drives the auxiliary twist axis arm to rotate, and the auxiliary twist axis arm rotates to squeeze the spring, causing the hinge column to slide along the compensation groove. When the auxiliary twist axis arm rotates beyond the central axis position of the stressed central axis column, the limit column slides along one end of the limit elastic vibration seat to the other end, forming an elastic impact vibration, and the force arm is used to knock the connecting platform, thereby effectively making the chemical reagents on the surface of the N-type single crystal silicon substrate installed on the connecting platform fall off, thereby reducing excessive and uneven cleaning caused by excessive contact of chemical reagent residues.

[0029] 7. The present invention adjusts the lifting arm to the following Figure 5 In the state shown, the force arm is made to perform left and right staggered tilt and rotation movements, and the required swinging work can be achieved by adjusting the lifting seat with a relatively small lifting and lowering adjustment. When the jacking lifting arm is adjusted to the same central axis position of the engaging limit sleeve, the horizontal rising work of the connected carrier can be achieved by adjusting the lifting seat with a relatively large lifting and lowering adjustment and synchronously connecting the push rod, until the upper surface of the N-type single crystal silicon substrate and the end of the wrapping strip are connected to protect the poly layer at the required position and directly chemically clean the poly layer at the non-required position, thereby realizing another preparation method. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention;

[0031] Figure 2 It is a schematic diagram of the three-dimensional structure of the atomizing spray assembly of the present invention;

[0032] Figure 3 It is a three-dimensional structural schematic diagram of the atomizing spray assembly of the present invention from another perspective;

[0033] Figure 4 It is a schematic diagram of the overall three-dimensional structure of the auxiliary mechanism of the present invention;

[0034] Figure 5 It is a schematic diagram of the three-dimensional structure of the dual-mode assembly of the present invention;

[0035] Figure 6 It is a schematic diagram of the three-dimensional split structure of the flip shaft rod assembly of the present invention;

[0036] Figure 7 It is a schematic diagram of the three-dimensional structure of the limiting guide column B of the present invention;

[0037] Figure 8 It is a schematic diagram of the three-dimensional structure of the one-way flip groove and the vertical force-bearing moving groove of the present invention;

[0038] Fig. 9 For the present invention Figure 5 A schematic diagram of the partially enlarged structure at center A;

[0039] Fig.10 It is a schematic diagram of the three-dimensional split structure of the double-adjustable frame assembly of the present invention;

[0040] Fig.11 The figure is a process flow chart of the battery surface preparation process in the present invention.

[0041] Description of the numbers in the figure:

[0042] 1. Operating machine; 2. Screw displacement assembly; 3. Laser sintering assembly; 4. Atomizing spray assembly; 5. Auxiliary mechanism; 6. Double adjustment frame assembly; 7. Double-mode assembly;

[0043] 401, arch frame; 402, atomizing spray pipe; 403, wrapping strip;

[0044] 601, flip connection stand; 6011, limit elastic vibration seat; 6012, two-stage slot; 602, synchronous adjustment stand; 6021, auxiliary slot;

[0045] 701, connecting seat; 702, driving motor; 7021, screw rod; 703, slide rail frame; 704, lifting seat; 705, turning shaft assembly; 7051, extension shaft; 7052, one-way turning groove; 7053, spiral groove; 7054, linear groove; 7055, vertical force moving groove; 7056, sliding adjustment groove; 7057, lifting arm; 7058, meshing teeth; 7059, toggle teeth; 70510, adjustment motor;

[0046] 706, engagement limit sleeve; 7061, limit guide column A; 7062, limit guide column B; 7063, hook tooth;

[0047] 707, load-bearing central axis column; 7071, force arm; 708, auxiliary twist axis arm; 709, limit column; 7091, compensation groove; 7010, load-bearing curved arm; 7011, receiving groove; 7012, push rod; 8, connecting platform. DETAILED DESCRIPTION

[0048] like Figures 1 to 10As shown, the present invention relates to a TOPCon battery front poly passivation layer cleaning device, including an operating machine 1; a screw displacement assembly 2 is arranged inside the operating machine 1; a laser sintering assembly 3 is arranged on the side of the screw displacement assembly 2 relatively away from the operating machine 1; an atomizing spray assembly 4 is arranged on the side of the screw displacement assembly 2 relatively located inside the operating machine 1; an auxiliary mechanism 5 is arranged at the lower end of the atomizing spray assembly 4 relative to the movable end of the screw displacement assembly 2; the auxiliary mechanism 5 includes a base frame fixedly arranged on the sliding end of the screw displacement assembly 2; double adjustment frame assemblies 6 are symmetrically arranged on both sides of the base frame; a double-mode assembly 7 is arranged between the double adjustment frame assemblies 6; a connecting platform 8 movably connected to the double adjustment frame assembly 6 is arranged above the double-mode assembly 7. The present invention is based on the reciprocating left and right swinging operation of the dual-mode component 7 and the gap spraying work on both sides of the atomizing spray component 4, which causes the chemical cleaning reagent to flow and fall off along the jagged edges produced by the texturing, resulting in a short residence time effect. By repeating the above operation many times, a relatively uniform cleaning situation is achieved, and the cleaning thickness caused by the different contact depths between the later prepared layers and the chemical reagents due to the jagged edges produced by the texturing of the N-type single crystal silicon substrate is effectively reduced.

[0049] In the embodiment of the present invention, the atomizing spray assembly 4 includes an arch 401 arranged at one end of the screw displacement assembly 2; two groups of axially arranged atomizing spray pipes 402 are arranged at the bottom of the arch 401; the atomizing spray pipes 402 are connected to the pumping equipment through pipes, and the two groups of atomizing spray pipes 402 perform staggered gap spraying; and a wrapping strip 403 is arranged at the bottom of the arch 401 relatively below the atomizing spray pipes 402. The present invention uses two groups of atomizing spray pipes 402 to perform staggered gap spraying when the dual-mode assembly 7 swings back and forth, and performs bidirectional tilting, so that the N-type monocrystalline silicon substrate can effectively perform two chemical reagent cleaning operations simultaneously during the single left and right swing and two tilting processes, effectively improving the operating efficiency of multiple cleanings.

[0050] In the embodiment of the present invention, the dual-adjustment frame assembly 6 includes two flip connection frames 601 symmetrically arranged on both sides of the base frame; the two flip connection frames 601 are provided with limited elastic oscillation seats 6011 on opposite surfaces; the flip connection frames 601 are provided with two sections of grooves 6012 on their surfaces; the flip connection frames 601 are provided with a synchronous adjustment frame 602 on one side of the flip connection frame 601 opposite to the dual-mode assembly 7; and the surface of the synchronous adjustment frame 602 is provided with an auxiliary groove 6021. The present invention maintains the vertical upward motion trajectory of the dual-mode assembly 7 during the overall upward motion of the dual-mode assembly 7 through the synchronous adjustment frame 602, thereby compensating for the instability of the upward sliding of the two sections of grooves 6012 and achieving operational accuracy.

[0051] In an embodiment of the present invention, the dual-mode assembly 7 includes a connecting seat 701 fixed on the opposite surfaces of two flip connecting frames 601; a driving motor 702 is arranged on the top of the connecting seat 701; a screw rod 7021 is arranged at the output end of the driving motor 702; a slide rail frame 703 is arranged on one side of the connecting seat 701; a lifting seat 704 is arranged on one side of the slide rail frame 703 through a slider; a threaded sleeve threadedly connected to the screw rod 7021 is arranged on one side of the lifting seat 704; a flip shaft assembly 705 is rotatably arranged at the high end of the lifting seat 704 through a bearing; the outer sleeve of the flip shaft assembly 705 is provided with an engaging limit sleeve 706 fixedly connected to the connecting seat 701.

[0052] In an embodiment of the present invention, the flip shaft assembly 705 includes an extension shaft 7051; a one-way flip groove 7052 is arranged on the upper surface of the extension shaft 7051, wherein the one-way flip groove 7052 is composed of two spiral grooves 7053 and two linear grooves 7054 connected end to end, and a vertical force-bearing moving groove 7055 is arranged inside the linear groove 7054; a sliding adjustment groove 7056 is arranged on the top of the extension shaft 7051; a lifting arm 7057 is slidingly arranged inside the sliding adjustment groove 7056; and meshing teeth 7058 are arranged on the side of the lifting arm 7057; a toggle tooth 7059 is arranged on the bottom of the lifting arm 7057; an adjusting motor 70510 is arranged on the top of the extension shaft 7051; and a driving gear meshing with the meshing teeth 7058 is arranged at the output end of the adjusting motor 70510. The present invention is based on adjusting the motor 70510 to drive the driving gear to rotate, so that the lifting arm 7057 can slide axially and can be adjusted to Figure 5 In the state shown, or by adjusting the lifting arm 7057 to the same central axis position as the engagement limiting sleeve 706, two different operation modes are implemented to retain the poly layer located at the metal grid line.

[0053] In an embodiment of the present invention, a limit guide column A7061 and a limit guide column B7062 are respectively arranged on both sides of the inside of the engaging limit sleeve 706 through springs; the limit guide column A7061 is adapted to the size of the one-way flip groove 7052, and the limit guide column B7062 is adapted to the size of the vertical force-bearing movable groove 7055, and the groove diameter of the one-way flip groove 7052 is larger than the groove diameter of the vertical force-bearing movable groove 7055; the limit guide column A7061 and the limit guide column B7062 are both provided with a plurality of elastic buckles with hollow structures at the distal ends; wherein, a hook tooth 7063 is provided on the surface of the engaging limit sleeve 706 relative to the elastic buckle. The present invention is based on the adjustment motor 70510 driving the driving gear to rotate, so that the lifting arm 7057 can slide axially, and the elastic buckle on the limit guide column A7061 and the limit guide column B7062 can be synchronously moved in the forward direction through the toggle tooth 7059 at the bottom of the lifting arm 7057, so that the limit guide column A7061 and the limit guide column B7062 move, and the limit guide column A7061 and the limit guide column B7062 are adjusted and limited under the limit of the hook tooth 7063, and the elastic buckle on the limit guide column A7061 and the limit guide column B7062 is elastically moved. The buckle ring keeps the limit guide column A7061 and the limit guide column B7062 from interfering with the axial sliding of the lifting arm 7057 during excessive movement. When the lifting arm 7057 is adjusted to the same central axis position as the engaging limit sleeve 706, the limit guide column B7062 is slidably inserted into the vertical force-bearing moving groove 7055, and the limit guide column A7061 is separated from the one-way flip groove 7052, so that the lifting seat 704 can only perform the lifting movement synchronously. The lifting arm 7057 can be adjusted to the same central axis position as the engaging limit sleeve 706. Figure 5 In the state shown, the limit guide column B7062 is separated from the vertical force-bearing movable groove 7055, and the limit guide column A7061 is slidably plugged into the one-way flip groove 7052. Under the limit of the limit guide column A7061, the lifting and lowering movement of the lifting seat 704 can synchronously drive the extension shaft 7051 and the lifting arm 7057 to rotate, and rise and fall 180 degrees through the locked state, causing the lifting arm 7057 to alternately apply an inclined rotational force to the force arm 7071.

[0054] In an embodiment of the present invention, the dual-mode assembly 7 also includes a force-bearing central axis column 707; a force arm 7071 distributed in an "X" structure is fixedly arranged on the surface of the force-bearing central axis column 707; and, one side of the force-bearing central axis column 707 penetrates into the two-section groove 6012 and the auxiliary groove 6021, and the force-bearing central axis column 707 is respectively limited and slidably matched with the two-section groove 6012 and the auxiliary groove 6021 through the bearing limiting sleeve; auxiliary twisting shaft arms 708 are arranged at both ends of the force-bearing central axis column 707 relative to the limiting elastic oscillation seat 6011; and, the auxiliary twisting shaft arm 708 is provided with a limiting column 709 through a hinge column; the end of the limiting column 709 is an arc-shaped structure, and a compensation groove 7091 is arranged on the surface of the limiting column 709 relative to the position of the hinge column; and, the limiting column 709 is elastically connected to the hinge column through a spring. The present invention adjusts the lifting arm 7057 to such a position. Figure 5 In the state shown, the force arm 7071 is made to perform left and right staggered tilt rotational movement, so that the force-bearing central axis column 707 synchronously drives the auxiliary hinge arm 708 to rotate, and the auxiliary hinge arm 708 rotates to squeeze the spring, causing the hinge column to slide along the compensation groove 7091. When the auxiliary hinge arm 708 rotates beyond the central axis position of the force-bearing central axis column 707, the limit column 709 slides along one end of the limit elastic vibration seat 6011 to the other end, forming an elastic impact vibration, and the force arm 7071 is used to knock the connecting platform 8, so that the chemical reagents on the surface of the N-type single crystal silicon substrate installed on the connecting platform 8 are effectively removed, thereby reducing excessive and uneven cleaning caused by excessive contact of chemical reagent residues.

[0055] In the embodiment of the present invention, the dual-mode assembly 7 also includes a quadrilateral synchronization assembly arranged inside the dual-adjustment frame assembly 6; the quadrilateral synchronization assembly includes two force-bearing curved arms 7010 that are hingedly arranged on the flip connection stand 601 in a parallel structure; the surfaces of the force-bearing curved arms 7010 are provided with receiving grooves 7011; the other ends of the two force-bearing curved arms 7010 are hingedly connected by a connecting shaft; and the end of the connecting shaft is hingedly provided with a push rod 7012 for rotating the base frame. The present invention adjusts the lifting arm 7057 to the position as shown in the figure. Figure 5 In the state shown, the force arm 7071 is made to perform left and right staggered tilt and rotation movements, and the required swinging operation can be achieved by adjusting the lifting seat 704 by a relatively small lifting and lowering adjustment. When the jacking lifting arm 7057 is adjusted to the same central axis position of the engaging limit sleeve 706, the horizontal rising operation of the connection carrier 8 can be achieved by adjusting the lifting seat 704 by a relatively large lifting and lowering adjustment and synchronously connecting the push rod 7012, until the upper surface of the N-type single crystal silicon substrate is connected to the end of the wrapping strip 403, so as to protect the poly layer at the required position and directly chemically clean the poly layer at the non-required position, thereby realizing another preparation method.

[0056] Working principle: This embodiment provides a TOPCon battery front poly passivation layer cleaning device, using steps:

[0057] S100, pretreatment: texturing the selected N-type single crystal silicon substrate, obtaining a passivation layer on the surface of the silicon wafer after texturing to form a sawtooth-shaped texturing layer, selecting BCl3 as a raw material gas to prepare a boron-doped polysilicon layer, cleaning and polishing the back side after boron diffusion, depositing a SiO2 tunneling layer on the back side, and depositing a phosphorus-doped amorphous silicon layer, and annealing the deposited doped silicon wafer, and depositing a front intrinsic amorphous silicon layer by PECVD;

[0058] S200, partial preservation of the poly layer:

[0059] S201. One of the processing methods: the N-type single crystal silicon substrate is driven to move to the laser sintering component 3 by the screw displacement component 2, and the intrinsic amorphous silicon layer surface in the specific area of ​​the front side is processed by laser to form a SiO2 layer on the surface of the amorphous silicon layer in the processed area, and then the screw displacement component 2 is adjusted to move to the bottom of the atomizing spray component 4, and then the driving gear is driven to rotate by adjusting the motor 70510, so that the lifting arm 7057 is axially slid and moved, which can be adjusted to the following positions: Figure 5 In the state shown, the limit guide column B7062 is separated from the vertical force-bearing movable groove 7055, and the limit guide column A7061 is slidably plugged into the one-way flip groove 7052. Under the limit of the limit guide column A7061, the drive motor 702 is used to rotate the screw rod 7021 to cause the threaded sleeve, the lifting seat 704 and the flip shaft assembly 705 to perform a relatively small lifting and lowering operation as a whole. The lifting seat 704 simultaneously drives the extension shaft 7051 and the jacking lifting arm 7057 to rotate, and the locking mechanism is locked. The state rises and falls and rotates 180 degrees, so that the lifting arm 7057 alternately applies an inclined rotation force to the force arm 7071, and the connection carrier 8 is squeezed and rotated by the rotation of the force arm 7071, and then the silicon wafer is corroded by alkali solution through the atomizing spray component 4, and the area covered with the SiO2 layer is retained because the SiO2 layer blocks the corrosion of the amorphous silicon layer by the alkali solution, and the silicon wafer treated with alkali solution is pickled by the atomizing spray component 4 to remove the SiO2 layer on the surface;

[0060] S202, another processing method: Then, by adjusting the motor 70510 to drive the driving gear to rotate, the lifting arm 7057 is caused to slide axially, and the lifting arm 7057 is adjusted to the same central axis position as the meshing limit sleeve 706. The limit guide column B7062 is slidably inserted into the vertical force-bearing moving groove 7055, and the limit guide column A7061 is separated from the one-way flip groove 7052. The driving motor 702 is used to rotate the driving screw 7021, so that the threaded sleeve, the lifting seat 704 and the flip shaft assembly 705 are moved relatively slightly as a whole. The lifting arm 7057 is lifted up to a certain degree, so that the lifting arm 7057 is located between the two force arms 7071 at the lower end, and then the driving motor 702 is continuously rotated to perform a relatively large lifting work, and the push rod 7012 is synchronously connected to perform a stroke work to realize the horizontal lifting work of the connection carrier 8, so that the surface of the N-type single crystal silicon substrate and the upper surface and the end of the wrapping strip 403 are separated to protect the poly layer at the required position, and then the silicon wafer is corroded by alkaline solution through the atomizing spray component 4, and the area covered with the SiO2 layer can retain the poly layer protected by the wrapping strip 403;

[0061] S300, printing and sintering treatment: use ALD to deposit Al2O3 on both sides, use PECVD equipment to deposit SiNx on both sides of the silicon wafer, and print and sinter the processed silicon wafer to form a conductive gate line.

[0062] The embodiments of the present invention disclose preferred embodiments, but are not limited thereto. A person skilled in the art can easily understand the spirit of the present invention based on the above embodiments and make different extensions and changes. However, as long as they do not deviate from the spirit of the present invention, they are all within the protection scope of the present invention.

Claims

1. A TOPCon battery front poly passivation layer cleaning equipment, characterized in that: The invention comprises an operating platform (1); a screw displacement assembly (2) is arranged inside the operating platform (1); a laser sintering assembly (3) is arranged on a side of the screw displacement assembly (2) relatively away from the operating platform (1); an atomizing spray assembly (4) is arranged on a side of the screw displacement assembly (2) relatively located inside the operating platform (1); an auxiliary mechanism (5) is arranged at the lower end of the atomizing spray assembly (4) relative to the movable end of the screw displacement assembly (2); The auxiliary mechanism (5) comprises a base frame fixedly arranged on the sliding end of the screw displacement assembly (2); dual-adjustment frame assemblies (6) are symmetrically arranged on both sides of the base frame; a dual-mode assembly (7) is arranged between the dual-adjustment frame assemblies (6); and a connecting platform (8) movably connected to the dual-adjustment frame assembly (6) is arranged above the dual-mode assembly (7); The double-adjustable frame assembly (6) comprises two flip connection frames (601) symmetrically arranged on both sides of the base frame; the two flip connection frames (601) are provided with limited elastic vibration seats (6011) on opposite surfaces; and the flip connection frames (601) are provided with two grooves (6012) on their surfaces; The flip connection stand (601) is provided with a synchronous adjustment stand (602) on one side opposite to the dual-mode assembly (7); an auxiliary groove (6021) is provided on the surface of the synchronous adjustment stand (602). The dual-mode assembly (7) comprises a connecting seat (701) fixed on opposite surfaces of the two flip connecting frames (601); a driving motor (702) is arranged on the top of the connecting seat (701); a screw rod (7021) is arranged at the output end of the driving motor (702); a slide rail frame (703) is arranged on one side of the connecting seat (701); a lifting seat (704) is arranged on one side of the slide rail frame (703) through a slider; a threaded sleeve threadedly connected to the screw rod (7021) is arranged on one side of the lifting seat (704); a flip shaft assembly (705) is rotatably arranged at the high end of the lifting seat (704) through a bearing; an engaging limit sleeve (706) fixedly connected to the connecting seat (701) is arranged on the outer sleeve of the flip shaft assembly (705); The flip shaft assembly (705) comprises an extension shaft (7051); a one-way flip groove (7052) is arranged on the upper surface of the extension shaft (7051), wherein the one-way flip groove (7052) is composed of two spiral grooves (7053) and two linear grooves (7054) connected end to end, and a vertical force-bearing moving groove (7055) is arranged inside the linear groove (7054); a sliding adjustment groove (7056) is arranged on the top of the extension shaft (7051); ); a lifting arm (7057) is slidably arranged inside the sliding adjustment groove (7056); and a meshing tooth (7058) is arranged on the side of the lifting arm (7057); a toggle tooth (7059) is arranged at the bottom of the lifting arm (7057); an adjustment motor (70510) is arranged at the top of the extension shaft (7051); and a driving gear meshing with the meshing tooth (7058) is arranged at the output end of the adjustment motor (70510); A limit guide column A (7061) and a limit guide column B (7062) are respectively arranged on both sides of the inside of the engagement limit sleeve (706) through springs; the limit guide column A (7061) is adapted to the size of the one-way flip groove (7052), and the limit guide column B (7062) is adapted to the size of the vertical force-bearing movable groove (7055), and the groove diameter of the one-way flip groove (7052) is larger than the groove diameter of the vertical force-bearing movable groove (7055); the limit guide column A (7061) and the limit guide column B (7062) are both arranged at the distal ends thereof with a plurality of elastic buckles of a hollow structure; wherein, a hooking tooth (7063) is arranged on the surface of the engagement limit sleeve (706) relative to the elastic buckle; The dual-mode assembly (7) also includes a force-bearing central axis column (707); a force arm (7071) distributed in an "X" structure is fixedly arranged on the surface of the force-bearing central axis column (707); and one side of the force-bearing central axis column (707) penetrates into the two-section groove (6012) and the auxiliary groove (6021), and the force-bearing central axis column (707) is respectively limited and slidably matched with the two-section groove (6012) and the auxiliary groove (6021) through a bearing limit sleeve; Auxiliary twist shaft arms (708) are arranged at both ends of the force-bearing central axis column (707) relative to the limit elastic oscillation seat (6011); and the auxiliary twist shaft arm (708) is provided with a limit column (709) through a hinge column; the end of the limit column (709) is an arc-shaped structure, and a compensation groove (7091) is arranged on the surface of the limit column (709) relative to the position of the hinge column; and the limit column (709) is elastically connected to the hinge column through a spring; The dual-mode component (7) also includes a quadrilateral synchronization component arranged inside the dual-adjustment frame component (6); the quadrilateral synchronization component includes two force-bearing curved arms (7010) hingedly arranged in a parallel structure on the flip connection stand (601); the surfaces of the force-bearing curved arms (7010) are provided with accommodating grooves (7011); the other ends of the two force-bearing curved arms (7010) are hingedly connected through a connecting shaft; and the end of the connecting shaft is hingedly provided with a push rod (7012) for rotating the base frame.

2. A TOPCon battery front poly passivation layer cleaning device according to claim 1, characterized in that: The atomizing spray assembly (4) comprises an arch frame (401) arranged at one end of the screw displacement assembly (2); two groups of axially arranged atomizing spray pipes (402) are arranged at the bottom of the arch frame (401); the atomizing spray pipes (402) are connected to a pump supply device through pipes, and the two groups of atomizing spray pipes (402) perform staggered intermittent spraying; and a wrapping strip (403) is arranged at the bottom of the arch frame (401) relatively below the atomizing spray pipes (402).

3. The method for using a TOPCon battery front poly passivation layer cleaning device according to claim 2, characterized in that: The following steps are involved: S100, pretreatment: texturing the selected N-type single crystal silicon substrate, obtaining a passivation layer on the surface of the silicon wafer after texturing to form a sawtooth-shaped texturing layer, selecting BCl3 as a raw material gas to prepare a boron-doped polysilicon layer, cleaning and polishing the back side after boron diffusion, depositing a SiO2 tunneling layer on the back side, and depositing a phosphorus-doped amorphous silicon layer, and annealing the deposited doped silicon wafer, and depositing a front intrinsic amorphous silicon layer by PECVD; S200, partial preservation of the poly layer: S201. One of the processing methods: driving the N-type single crystal silicon substrate to move to the laser sintering component (3) through the screw displacement component (2), using laser to process the surface of the intrinsic amorphous silicon layer in a specific area of ​​the front side, so that a SiO2 layer is formed on the surface of the amorphous silicon layer in the processed area, and then adjusting the screw displacement component (2) to move it to the bottom of the atomizing spray component (4), and then driving the driving gear to rotate by adjusting the motor (70510), so that the lifting arm (7057) slides axially, and is adjusted to the limit guide column B (7062) and the vertical force moving groove (7055) are separated, and the limit guide column A (7061) and the one-way flip groove (7052) are slidably plugged, and the limit guide column A (7061) is driven by the driving motor (702) to rotate and drive the lifting arm (7057) under the limit of the limit guide column A (7061). The movable screw (7021) causes the threaded sleeve, the lifting seat (704) and the flip shaft assembly (705) to perform a relatively small lifting and lowering operation as a whole. The lifting seat (704) synchronously drives the extension shaft (7051) and the lifting arm (7057) to perform a rotational movement. The lifting and lowering arm (7057) is rotated 180 degrees through the locked state, causing the lifting arm (7057) to alternately apply an inclined rotational force to the force arm (7071). The connection carrier (8) is squeezed and rotated by the rotation of the force arm (7071). Then, the silicon wafer is corroded by alkali solution through the atomizing spray assembly (4). The area covered with the SiO2 layer is retained because the SiO2 layer blocks the corrosion of the amorphous silicon layer by the alkali solution. The silicon wafer treated with alkali solution is pickled by the atomizing spray assembly (4) to remove the SiO2 layer on the surface. S202, another processing method: then the motor (70510) is adjusted to drive the driving gear to rotate, so that the lifting arm (7057) is axially slidable, and the lifting arm (7057) is adjusted to the same central axis position of the meshing limit sleeve (706), and the limit guide column B (7062) is slidably inserted into the vertical force-bearing moving groove (7055), and the limit guide column A (7061) is separated from the one-way flip groove (7052), and the driving motor (702) is used to rotate the driving screw (7021) so that the threaded sleeve, the lifting seat (704) and the flip shaft assembly (705) are integrally moved. A relatively small rise is performed, so that the lifting arm (7057) is located between the two force arms (7071) at the lower end, and then the driving motor (702) is continuously rotated to perform a relatively large rise, and the push rod (7012) is synchronously connected to perform a stroke operation to achieve a horizontal rise of the connection carrier (8), so that the surface of the N-type single crystal silicon substrate and the upper surface and the end of the wrapping strip (403) are connected to protect the poly layer at the required position, and then the silicon wafer is corroded by alkaline solution through the atomizing spray component (4), and the area covered with the SiO2 layer can retain the poly layer protected by the wrapping strip (403); S300, printing and sintering treatment: use ALD to deposit Al2O3 on both sides, use PECVD equipment to deposit SiNx on both sides of the silicon wafer, and print and sinter the processed silicon wafer to form a conductive gate line.

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