LED chip packaging module

Abstract

The present invention discloses an LED patch type packaging module, including a shell, a cover, a circuit board and two mounting plates, a plurality of patch type LED lamp beads with equal spacing are arranged in the middle of the circuit board, two electrode wires are arranged at both ends of the circuit board, two heat dissipation ports are respectively penetrated on both sides of the outer surface of the shell, and also includes: an adsorption and discharge mechanism, the adsorption and discharge mechanism includes two symmetrically distributed opening and closing parts, and a first transmission shaft arranged in the middle of the shell, two first cams are respectively fixed on both sides of the outer surface of the first transmission shaft, and the first transmission shaft is rotatably arranged with the shell. By arranging the adsorption and discharge mechanism inside the shell, when in use, the first cam is driven by the rotating first transmission shaft to open the opening and closing parts at both ends, and then the adsorbed hot air is discharged synchronously by each adsorbing part, and when the opening and closing parts are closed, each adsorbing part will adsorb and store the hot air again for secondary discharge.

Description

Technical Field

[0001] The invention belongs to the technical field of LED patch modules, and in particular relates to an LED patch type packaging module. Background Art

[0002] A light emitting diode, or LED for short, is a commonly used light emitting device that emits light by releasing energy through the recombination of electrons and holes. It can efficiently convert electrical energy into light energy and is widely used in the field of lighting.

[0003] LED chip modules are components composed of chip-type LED lamp beads mounted on a PCB and then soldered with wires.

[0004] At present, during the frequent use of LED lamps, the circuit board and each LED lamp will continue to generate high temperature. If the accumulated heat cannot be discharged in time, the circuit board and the LED lamp are easily damaged due to high load operation. In addition, the existing LED chip modules generally use openings to dissipate heat, which has poor heat dissipation effect and slow heat dissipation speed. Therefore, an LED chip packaging module is provided. Summary of the invention

[0005] The present invention aims to provide an LED chip packaging module to solve the technical problems raised in the background technology.

[0006] To achieve the above-mentioned purpose, the specific technical scheme of the present invention is as follows: an LED chip packaging module, comprising a shell, a cover, a circuit board and two mounting plates, the two mounting plates are respectively fixed at the two ends of the bottom of the shell, a plurality of chip LED lamp beads distributed at equal intervals are arranged in the middle of the circuit board, two electrode wires are respectively arranged at both ends of the circuit board, two heat dissipation ports are respectively opened on both sides of the outer surface of the shell, and also includes: an adsorption and emission mechanism, the adsorption and emission mechanism includes two symmetrically distributed opening and closing parts, and a first transmission shaft arranged in the middle of the shell, two first cams are respectively fixed on both sides of the outer surface of the first transmission shaft, and the first transmission shaft is rotatably arranged with the shell.

[0007] Preferably, the opening and closing part includes two flaps respectively arranged on both sides of the inner surface of the heat dissipation port, and two movable blocks respectively arranged on both sides of the outer surface of the shell, and also includes two fixed blocks respectively installed on both sides of the outer surface of the shell, and a V-shaped structure is distributed between the two flaps, and the flaps are rotatably arranged with the shell through a second transmission shaft, and the flaps are connected to the second transmission shaft. A rubber strip is arranged in the middle of the outer end of the flap, and the cross-section of the rubber strip is designed as a semicircular structure, and two gears are fixed on both sides of the outer surface of the second transmission shaft.

[0008] Preferably, the fixed block and the movable block correspond in position, the movable block and the fixed block are elastically arranged by a first return spring, a guide rod is fixedly arranged on the outer surface of the movable block and located on one side of the first return spring, the guide rod and the fixed block are slidably arranged, and two racks are respectively fixed on the outer surface of the movable block and located on both ends of one side of the gear, and the rack is meshed with the gear.

[0009] Preferably, the adsorption and discharge mechanism also includes a fixed seat arranged at the bottom end of the inner surface of the shell, and a plurality of adsorption parts distributed at equal intervals are arranged on both sides of the upper surface of the fixed seat, and a second cam is fixedly installed on the outer surface of the first transmission shaft and at the position of each adsorption part.

[0010] Preferably, the adsorption part includes an air cylinder, the inner surface of which is slidably provided with a rubber plug, a push rod is provided in the middle of the outer end of the rubber plug, the outer end of the push rod passes through the inner surface of the air cylinder and extends to the second cam position, the push rod and the air cylinder are elastically arranged by a second return spring, the push rod is connected to the rubber plug, and the outer surface of the push rod and one end of the second cam are provided with a rounded corner.

[0011] Preferably, an air nozzle is fixedly provided in the middle part of the outlet end of the air cylinder, and the air nozzle is designed in a conical structure. The outlet end of the air nozzle is elastically provided with a second intercepting piece through a fourth return spring, an air intake pipe is fixedly provided at the top of the outer surface of the air cylinder, and the top of the inner surface of the air intake pipe is elastically provided with a first intercepting piece through a third return spring.

[0012] Preferably, the cover body is arranged on the top of the shell, and the cover body includes an inner transparent glass cover and an outer transparent glass cover, the outer transparent glass cover is located outside the inner transparent glass cover, and the outer transparent glass cover and the inner transparent glass cover are both connected to the shell, a conductive film layer is arranged on the outside of the outer transparent glass cover, an electrochromic layer is arranged between the outer transparent glass cover and the inner transparent glass cover, a positive electrode sheet and a negative electrode sheet are respectively arranged on both sides of the conductive film layer, the conductive film layer is an indium tin oxide transparent conductive film, and the electrochromic layer is a polyaniline film.

[0013] The LED chip packaging module of the present invention has the following advantages:

[0014] 1. The present invention arranges an adsorption and discharge mechanism inside the shell. When in use, the first cam is driven by the rotating first transmission shaft to open the opening and closing parts at both ends, and then the adsorbed hot air is discharged synchronously by each adsorption part. When the opening and closing parts are closed, each adsorption part will adsorb and store the hot air again for secondary discharge. In this way, the heat can be discharged quickly during the opening of the heat dissipation port, ensuring rapid heat dissipation while avoiding hot air backflow, thereby improving the heat dissipation effect and heat dissipation speed.

[0015] 2. The present invention provides a color-changing cover body, which can gently process the strong light emitted by each SMD LED lamp bead and improve the anti-glare effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0018] Figure 2 It is an exploded view of the overall structure of the present invention;

[0019] Figure 3 It is a side view of the local structure of the present invention Figure 1 ;

[0020] Figure 4 It is a local structural plan view of the present invention;

[0021] Figure 5 It is a side view of the local structure of the present invention Figure 2 ;

[0022] Figure 6 It is a partial cross-sectional view of the plane of the present invention;

[0023] Figure 7 It is a partial enlarged view of the plane of the present invention.

[0024] Explanation of the symbols in the figure: 100, housing; 200, mounting plate; 300, adsorption and discharge mechanism; 301, fixing seat; 302, air cylinder; 303, first transmission shaft; 304, first cam; 305, movable block; 306, second transmission shaft; 307, fixing block; 308, flap; 309, rubber strip; 310, first return spring; 311, rack; 312, gear; 313, guide rod; 314, second cam; 315, rubber plug; 316, push rod; 317, rubber plug; 318, rubber plug; 319, rubber plug; 320, rubber plug; 321, rubber plug; 322, rubber plug; 323, rubber plug; 324, rubber plug; 325, rubber plug; 326, rubber plug; 327, rubber plug; 328, rubber plug; 329, rubber plug; 330, rubber plug; 331, rubber plug; 332, rubber plug; 333, rubber plug; 334, rubber plug; 335, rubber plug; 336, rubber plug; 337, rubber plug; 338, rubber plug; 339, rubber plug; 340, rubber plug; 341, rubber plug; 342, rubber plug; 343, rubber plug; 344, rubber plug; 345, rubber plug; 346, rubber plug; 347, rubber plug; 348, rubber plug; 349, rubber plug; 350, rubber plug; 351, rubber plug; 352, rubber plug; 353, rubber plug; 354, rubber plug; 355, rubber plug; 356, rubber plug; 357, rubber plug; 358, rubber plug; 359, rubber plug; 7. Second return spring; 318. First intercepting plate; 319. Third return spring; 320. Inlet pipe; 321. Air nozzle; 322. Second intercepting plate; 323. Fourth return spring; 400. Heat dissipation port; 500. Cover; 501. Positive electrode; 502. Negative electrode; 503. Electrochromic layer; 504. Outer transparent glass cover; 505. Conductive film layer; 506. Inner transparent glass cover; 600. Electrode wire; 700. Circuit board; 800. SMD LED lamp beads. DETAILED DESCRIPTION

[0025] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the embodiments of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0026] In the description of the embodiments of the present invention, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom", etc. indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0028] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0029] The disclosure below provides many different embodiments or examples to implement different structures of the embodiments of the present invention. In order to simplify the disclosure of the embodiments of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the embodiments of the present invention. In addition, the embodiments of the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0030] In order to better understand the purpose, structure and function of the present invention, the LED surface mount packaging module of the present invention is further described in detail below with reference to the accompanying drawings.

[0031] like Figure 1-7As shown, an LED SMD packaging module of the present invention includes a housing 100, a cover 500, a circuit board 700 and two mounting plates 200, the two mounting plates 200 are respectively fixed at the two ends of the bottom of the housing 100, the circuit board 700 is installed inside the housing 100, a plurality of SMD LED lamp beads 800 distributed at equal intervals are arranged in the middle of the circuit board 700, each SMD LED lamp bead 800 emits a different light color, and the whole presents a colorful light, two electrode wires 600 are respectively arranged at both ends of the circuit board 700, and the two electrode wires 600 are respectively connected to the positive pole and the negative pole, and the cover 500 is arranged on the top of the housing 100 for connecting each SMD LED lamp bead 800. The emitted light changes color. In the device, two heat dissipation ports 400 are respectively provided on both sides of the outer surface of the shell 100, and the device also includes: an adsorption and emission mechanism 300 for dissipating the hot air inside the shell 100, wherein the adsorption and emission mechanism 300 includes two symmetrically distributed opening and closing parts for unidirectionally discharging the hot air, and a first transmission shaft 303 arranged in the middle of the shell 100, two first cams 304 are respectively fixed on both sides of the outer surface of the first transmission shaft 303, for driving the two set opening and closing parts to open and close synchronously, the first transmission shaft 303 is rotatably arranged with the shell 100, and the outer end of the first transmission shaft 303 is connected and assembled with the output end of the external driving member, and the driving member is a motor.

[0032] Specifically, the opening and closing member includes two flaps 308 respectively arranged on both sides of the inner surface of the heat dissipation port 400, and two movable blocks 305 respectively arranged on both sides of the outer surface of the shell 100, and also includes two fixed blocks 307 respectively installed on both sides of the outer surface of the shell 100, and the fixed blocks 307 correspond to the positions of the movable blocks 305. The flaps 308 and the shell 100 are rotatably arranged through the second transmission shaft 306. The flaps 308 are connected to the second transmission shaft 306, and a V-shaped structure is distributed between the two flaps 308. A rubber strip 309 is arranged in the middle of the outer end of the flap 308. The cross section of the rubber strip 309 is designed in a semicircular structure. Two rubber strips 309 are respectively fixed on both sides of the outer surface of the second transmission shaft 306. A gear 312 is used to drive the second transmission shaft 306 and the flap 308 to rotate synchronously. The movable block 305 and the fixed block 307 are elastically arranged by the first return spring 310. A guide rod 313 is fixedly arranged on the outer surface of the movable block 305 and located on one side of the first return spring 310. The guide rod 313 penetrates the fixed block 307. The guide rod 313 and the fixed block 307 are slidably arranged. The first return spring 310 is wound around the outer surface of the guide rod 313. Two racks 311 are respectively fixed on the outer surface of the movable block 305 and located on one side of the gear 312. The rack 311 is meshed with the gear 312. The outer surface of the first cam 304 contacts the outer surface of the movable block 305.

[0033] Furthermore, the adsorption and discharge mechanism 300 also includes a fixed seat 301 arranged at the bottom end of the inner surface of the shell 100, and a plurality of adsorption members distributed at equal intervals are arranged on both sides of the upper surface of the fixed seat 301, which are used to adsorb and store hot air and discharge the hot air when the opening and closing member is opened. The outer surface of the first transmission shaft 303 is fixedly installed with a second cam 314 at the position of each adsorption member, which is used to drive the adsorption member. Specifically, the adsorption member includes an air cylinder 302, and a rubber plug 315 is slidably arranged on the inner surface of the air cylinder 302. A push rod 316 is arranged in the middle of the outer end of the rubber plug 315, and the outer end of the push rod 316 passes through the inner surface of the air cylinder 302 and extends to the second cam 31 4 position, the push rod 316 and the air cylinder 302 are elastically arranged by the second return spring 317, the push rod 316 is connected to the rubber plug 315, the outer surface of the push rod 316 contacts the outer surface of the second cam 314, the outer surface of the push rod 316 and one end of the second cam 314 are provided with a rounded corner, an air nozzle 321 is fixedly arranged in the middle of the outlet end of the air cylinder 302, the air nozzle 321 is designed in a conical structure, and the outlet end of the air nozzle 321 is elastically arranged with a second intercepting piece 322 by a fourth return spring 323, an air inlet pipe 320 is fixedly arranged on the top of the outer surface of the air cylinder 302, and a first intercepting piece 318 is elastically arranged on the top of the inner surface of the air inlet pipe 320 by a third return spring 319.

[0034] Furthermore, the cover body 500 includes an inner transparent glass cover 506 and an outer transparent glass cover 504, the outer transparent glass cover 504 is located outside the inner transparent glass cover 506, and both the outer transparent glass cover 504 and the inner transparent glass cover 506 are connected to the shell 100, a conductive film layer 505 is arranged on the outside of the outer transparent glass cover 504, an electrochromic layer 503 is arranged between the outer transparent glass cover 504 and the inner transparent glass cover 506, a positive electrode sheet 501 and a negative electrode sheet 502 are arranged on both sides of the conductive film layer 505, the conductive film layer 505 is an indium tin oxide transparent conductive film, and the electrochromic layer 503 is a polyaniline film. When current passes between the positive electrode sheet 501 and the negative electrode sheet 502, the electrochromic layer 503 turns green.

[0035] According to the above, the present invention sets an adsorption and discharge mechanism 300 inside the shell 100. When in use, the rotating first transmission shaft 303 is first used to drive the first cam 304 to open the opening and closing parts at both ends, and then the adsorbed hot air is discharged synchronously by each adsorption part. When the opening and closing parts are closed, each adsorption part will adsorb and store the hot air again for secondary discharge. In this way, the heat can be quickly discharged during the opening of the heat dissipation port 400, ensuring rapid heat dissipation while avoiding hot air backflow, thereby improving the heat dissipation effect and heat dissipation speed; the present invention sets a color-changing cover 500, which can gently process the strong light emitted by each SMD LED lamp bead 800 and improve the anti-glare effect.

[0036] It is to be understood that the present invention is described by some embodiments, and it is known to those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the scope of protection of the present invention.

Claims

1. An LED surface mount packaging module, comprising a housing (100), a cover (500), a circuit board (700) and two mounting plates (200), wherein the two mounting plates (200) are respectively fixed to two ends of the bottom of the housing (100), a plurality of surface mount LED lamp beads (800) distributed at equal intervals are arranged in the middle of the circuit board (700), and two electrode wires (600) are respectively arranged at two ends of the circuit board (700), characterized in that: The shell (100) has two heat dissipation openings (400) respectively formed on both sides of the outer surface thereof, and further comprises: an adsorption and discharge mechanism (300), the adsorption and discharge mechanism (300) comprising two symmetrically distributed opening and closing parts, and a first transmission shaft (303) arranged in the middle of the shell (100), two first cams (304) respectively fixed on both sides of the outer surface of the first transmission shaft (303), and the first transmission shaft (303) and the shell (100) are rotatably arranged; The opening and closing member comprises two flaps (308) respectively arranged on both sides of the inner surface of the heat dissipation port (400), and two movable blocks (305) respectively arranged on both sides of the outer surface of the shell (100), and also comprises two fixed blocks (307) respectively installed on both sides of the outer surface of the shell (100), the two flaps (308) are arranged in a V-shaped structure, the flaps (308) and the shell (100) are rotatably arranged via a second transmission shaft (306), the flaps (308) are connected to the second transmission shaft (306), a rubber strip (309) is arranged in the middle of the outer end of the flap (308), the cross section of the rubber strip (309) is designed in a semicircular structure, and two gears (312) are respectively fixed on both sides of the outer surface of the second transmission shaft (306); The fixed block (307) and the movable block (305) are positioned correspondingly, the movable block (305) and the fixed block (307) are elastically arranged via a first return spring (310), a guide rod (313) is fixedly arranged on the outer surface of the movable block (305) and located on one side of the first return spring (310), the guide rod (313) and the fixed block (307) are slidably arranged, and two racks (311) are respectively fixed on the outer surface of the movable block (305) and located on one side of the gear (312), and the racks (311) are meshed with the gear (312); The adsorption and discharge mechanism (300) further comprises a fixing seat (301) arranged at the bottom end of the inner surface of the shell (100), a plurality of adsorption members distributed at equal intervals are arranged on both sides of the upper surface of the fixing seat (301), and a second cam (314) is fixedly mounted on the outer surface of the first transmission shaft (303) and located at the position of each adsorption member; The adsorption component comprises an air cylinder (302), the inner surface of which is slidably provided with a rubber plug (315), a push rod (316) being provided in the middle of the outer end of the rubber plug (315), the outer end of the push rod (316) penetrating the inner surface of the air cylinder (302) and extending to the position of the second cam (314), the push rod (316) and the air cylinder (302) being elastically provided via a second return spring (317), the push rod (316) being connected to the rubber plug (315), and a rounded corner being provided on the outer surface of the push rod (316) and at one end of the second cam (314).

2. The LED SMD package module according to claim 1, characterized in that: An air nozzle (321) is fixedly arranged in the middle of the outlet end of the air cylinder (302); the air nozzle (321) is designed to be conical in structure; a second intercepting piece (322) is elastically arranged at the outlet end of the air nozzle (321) via a fourth return spring (323); an air intake pipe (320) is fixedly arranged at the top of the outer surface of the air cylinder (302); and a first intercepting piece (318) is elastically arranged at the top of the inner surface of the air intake pipe (320) via a third return spring (319).

3. The LED SMD package module according to claim 1, characterized in that: The cover body (500) is arranged on the top of the housing (100), and the cover body (500) comprises an inner transparent glass cover (506) and an outer transparent glass cover (504), wherein the outer transparent glass cover (504) is located outside the inner transparent glass cover (506), and both the outer transparent glass cover (504) and the inner transparent glass cover (506) are connected to the housing (100), a conductive film layer (505) is arranged outside the outer transparent glass cover (504), an electrochromic layer (503) is arranged between the outer transparent glass cover (504) and the inner transparent glass cover (506), a positive electrode sheet (501) and a negative electrode sheet (502) are arranged on both sides of the conductive film layer (505), the conductive film layer (505) is an indium tin oxide transparent conductive film, and the electrochromic layer (503) is a polyaniline film.

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