Polishing equipment and polishing method

Abstract

The present invention discloses a polishing device and a polishing method, wherein the polishing device includes a polishing wheel, a magnet, a first drive device, and a second drive device. The radial side of the polishing wheel is a polishing surface. The magnetic field generating device includes multiple magnets distributed around a first direction parallel to the axial direction of the polishing wheel. The magnetic field generating device is disposed within the polishing wheel and is used to generate a magnetic field on the polishing surface to adsorb a magnetic composite fluid to the polishing surface. The first drive device is connected to the polishing wheel; the second drive device is connected to the magnet. The first drive device and the second drive device are capable of rotating the polishing wheel and the magnet at different speeds. The magnetic field generating device generates a dynamic magnetic field on the polishing surface, which not only makes the magnetic composite fluid on the polishing surface more uniform, but also makes the magnetic composite fluid more uniform on each flexible grinding head, thereby improving the polishing effect, but also reduces the wear rate of each flexible grinding head, thereby reducing the frequency of fluid replenishment, thereby improving polishing efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of polishing, and in particular to a polishing device and a polishing method. Background Art

[0002] With the development of modern optical technology, the quality requirements for optical components have also increased. Optical components are not only required to have better surface quality and higher surface accuracy, but also to minimize subsurface damage. Currently, there are many polishing methods, such as chemical mechanical polishing, laser polishing, jet polishing, and ion beam polishing. These polishing methods cannot simultaneously achieve both polishing accuracy and polishing efficiency, or are difficult to control polishing removal rate and require high machine tool precision.

[0003] Magnetic Compound Fluid (MCF) polishing technology utilizes a magnetic composite fluid to form a flexible polishing tool under a magnetic field. The magnetic composite fluid is a special fluid containing nanometer-sized ferroferric oxide particles and micrometer-sized iron powder particles. During polishing, the magnetic field generated by the magnetic poles causes the magnetic composite fluid to transform from a Newtonian fluid to a more viscous Bingham fluid, forming a shaped "flexible grinding head." As the workpiece moves, dynamic pressure shearing removes material from the workpiece surface.

[0004] In the related art, the magnet used to generate the magnetic field is fixedly connected to the polishing wheel. Therefore, during the polishing process, the "flexible grinding head" moves synchronously with the polishing wheel. After multiple polishing, the grinding head is easily worn, requiring frequent fluid replenishment, resulting in low polishing efficiency. Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a polishing device that can extend the life of the grinding head and reduce the frequency of fluid replenishment, thereby improving polishing efficiency.

[0006] The invention also provides a polishing method using the polishing device.

[0007] A polishing device according to an embodiment of the first aspect of the present invention includes a polishing wheel, a magnetic field generating device, a first driving device and a second driving device.

[0008] The polishing wheel has a accommodating cavity, and the radial side surface of the polishing wheel is a polishing surface; the magnetic field generating device includes multiple magnets, and the multiple magnets are distributed around a first direction, and the first direction is parallel to the axial direction of the polishing wheel. The magnetic field generating device is arranged in the accommodating cavity, and is used to generate a magnetic field on the polishing surface to adsorb the magnetic composite fluid on the polishing surface; the first driving device is connected to the polishing wheel, and is used to drive the polishing wheel to rotate; the second driving device is connected to the magnet, and is used to drive the magnetic field generating device to rotate around the first direction; wherein, the first driving device and the second driving device can make the polishing wheel and the magnetic field generating device rotate at different speeds.

[0009] The polishing device according to the embodiment of the present invention has at least the following beneficial effects:

[0010] The magnetic field generating device is arranged in the accommodating cavity of the polishing wheel. The magnetic field generating device includes a plurality of magnets evenly distributed around a first direction, and the first direction is parallel to the circumference of the polishing wheel. Therefore, the magnetic field generating device can form a plurality of magnetic field intensive areas on the polishing surface. Therefore, when an appropriate amount of magnetic composite fluid is applied to the polishing wheel, a plurality of magnetic clusters will be formed on the polishing line surface, that is, a plurality of raised flexible grinding heads will be formed on the polishing surface. When the rotation speed of the magnetic field generating device is different from the rotation speed of the polishing wheel, the magnetic field generating device will generate a dynamic magnetic field on the polishing surface, which can not only make the magnetic composite fluid on the polishing surface more uniform, but also make the magnetic composite fluid of each flexible grinding head more uniform, so as to improve the polishing effect, and at the same time can reduce the wear rate of each flexible grinding head, thereby reducing the frequency of fluid replenishment to improve the polishing efficiency.

[0011] According to some embodiments of the present invention, the polishing wheel rotates about its own axis, and the first direction coincides with the axial direction of the polishing wheel.

[0012] According to some embodiments of the present invention, the polishing device further comprises a mounting frame, a first connecting shaft and a second connecting shaft, the mounting frame comprising a first mounting portion and a second mounting portion disposed opposite to each other;

[0013] The polishing wheel has a first end face and a second end face along its own axial direction, one end of the first connecting shaft is rotatably connected to the first mounting portion and connected to the first driving device, and the other end is connected to the first end face, the accommodating cavity extends to the second end face, and an opening is formed on the second end face, one end of the second connecting shaft is rotatably connected to the second mounting portion and connected to the second driving device, and the other end extends from the opening into the accommodating cavity and is connected to the magnetic field generating device.

[0014] According to some embodiments of the present invention, the second connecting shaft includes a rotating portion;

[0015] The radial side surface of the rotating portion is in sliding contact with the polishing wheel; or

[0016] The polishing device further includes a rotating member connected to the rotating portion and the polishing wheel, and configured to enable the rotating portion to be rotatably connected to the polishing wheel.

[0017] According to some embodiments of the present invention, the second connecting shaft includes at least two rotating parts distributed along its axis.

[0018] According to some embodiments of the present invention, along the circumference of the second connecting axis, the magnetic poles of adjacent magnets are arranged in opposite directions.

[0019] According to some embodiments of the present invention, the magnetic field generating device further includes a mounting member having a plurality of mounting grooves distributed around the first direction, the size and shape of the mounting grooves being adapted to the magnets, and each of the magnets being individually arranged in the mounting grooves.

[0020] According to some embodiments of the present invention, the edge of the opening is sealed to the second connecting shaft.

[0021] According to some embodiments of the present invention, the polishing device further includes a shielding member having a first mounting hole, the shielding member being connected to the polishing wheel and covering the opening, and the second connecting shaft passing through the first mounting hole.

[0022] According to some embodiments of the present invention, the polishing surface is a spherical surface.

[0023] According to the polishing method of the second embodiment of the present invention, polishing is performed using the polishing device described in the first embodiment, and the polishing method includes:

[0024] adding a magnetic composite fluid to the polishing surface;

[0025] The first driving device and the second driving device are started to make the polishing wheel and the magnetic field generating device rotate at different speeds.

[0026] The polishing method according to the embodiment of the present invention has at least the following beneficial effects:

[0027] The first driving device and the second driving device are used to rotate the polishing wheel and the magnet at different speeds. The magnetic field generating device will generate a dynamic magnetic field on the polishing surface, which can not only make the magnetic composite fluid on the polishing surface more uniform, but also make the magnetic composite fluid of each flexible grinding head more uniform, so as to improve the polishing effect. At the same time, it can reduce the wear rate of each flexible grinding head, thereby reducing the frequency of fluid replenishment to improve polishing efficiency.

[0028] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0030] Figure 1 A schematic structural diagram of a polishing device according to an embodiment of the first aspect of the present invention;

[0031] Figure 2 for Figure 1 sectional view of

[0032] Figure 3 for Figure 2 Schematic diagram of the structure of the middle polishing wheel, magnetic field generating device, first connecting shaft and second connecting shaft;

[0033] Figure 4 for Figure 2 Schematic diagram of the structure of the medium magnetic field generating device and the polishing wheel;

[0034] Figure 5 The experimental results of dynamic magnetic field and static magnetic field at idling time are shown in the figure;

[0035] Figure 6 Experimental structure diagram for polishing workpieces in dynamic magnetic field and static magnetic field;

[0036] Figure 7 This is a structural schematic diagram of another magnetic field generating device and a polishing wheel according to an embodiment of the first aspect of the present invention;

[0037] Figure 8 for Figure 2 Exploded view of the magnetic field generator.

[0038] Reference numerals:

[0039] Magnetic composite fluid 1000;

[0040] Polishing wheel 100, accommodating cavity 110, polishing surface 120, first end surface 130, second end surface 140, opening 150, rotating hole 160;

[0041] Magnetic field generating device 200, magnet 210, mounting member 220, mounting slot 221;

[0042] A first driving device 300, a second driving device 400;

[0043] Mounting frame 500, first mounting portion 510, second mounting portion 520, third mounting portion 530, mounting cavity 531;

[0044] First connecting shaft 600, first shaft shoulder 610;

[0045] Second connecting shaft 700, rotating portion 710, second shaft shoulder 720;

[0046] Rotating member 800, first bearing 801, second bearing 802;

[0047] Shielding member 900 and mounting hole 910 . DETAILED DESCRIPTION

[0048] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0049] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0050] In the description of the present invention, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0051] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0052] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0053] With the development of modern optical technology, the quality requirements for optical components have also increased. Optical components are not only required to have better surface quality and higher surface accuracy, but also to minimize subsurface damage. Currently, there are many polishing methods, such as chemical mechanical polishing, laser polishing, jet polishing, and ion beam polishing. These polishing methods cannot simultaneously achieve both polishing accuracy and polishing efficiency, or are difficult to control polishing removal rate and require high machine tool precision.

[0054] Magnetic Compound Fluid (MCF) polishing technology utilizes a magnetic composite fluid to form a flexible polishing tool under a magnetic field. The magnetic composite fluid is a special fluid containing nanometer-sized ferroferric oxide particles and micrometer-sized iron powder particles. During polishing, the magnetic field generated by the magnetic poles causes the magnetic composite fluid to transform from a Newtonian fluid to a more viscous Bingham fluid, forming a shaped "flexible grinding head." As the workpiece moves, dynamic pressure shearing removes material from the workpiece surface.

[0055] In the related art, the magnet used to generate the magnetic field is fixedly connected to the polishing wheel. Therefore, during the polishing process, the "flexible grinding head" moves synchronously with the polishing wheel. After multiple polishing, the grinding head is easily worn, resulting in a shorter service life of the polishing equipment.

[0056] Based on the above problems, the present invention proposes a polishing device that can reduce the wear rate of the flexible grinding head, thereby reducing the frequency of fluid replenishment and improving the polishing efficiency. Figures 1 to 6 , Figure 1 This is a schematic structural diagram of a polishing device according to the first embodiment of the present invention. Figure 2 for Figure 1 A cross-sectional view of Figure 3 for Figure 2 Schematic diagram of the structure of the middle polishing wheel, magnetic field generating device, first connecting shaft and second connecting shaft, Figure 4 for Figure 2 Schematic diagram of the structure of the medium magnetic field generating device and the polishing wheel, Figure 5 The experimental results of dynamic magnetic field and static magnetic field at idling are shown in the figure. Figure 6 This is an experimental structure diagram of polishing a workpiece in a dynamic magnetic field and a static magnetic field; the polishing equipment of this embodiment includes a polishing wheel 100, a magnetic field generating device 200, a first driving device 300 and a second driving device 400.

[0057] Specifically, the polishing wheel 100 has a receiving cavity 110, and the radial side surface of the polishing wheel 100 is a polishing surface 120 (such as Figure 3 As shown, the magnetic field generating device 200 includes a plurality of magnets 210 (such as Figure 4As shown in FIG. 1 ), the magnet 210 is, for example, an electromagnet or a permanent magnet 210. The multiple magnets 210 are distributed around a first direction, which is parallel to the axial direction of the polishing wheel 100. The magnetic field generating device 200 is disposed in the accommodating cavity 110 and is used to generate a magnetic field on the polishing surface 120 to adsorb the magnetic composite fluid to the polishing surface 120 (it is not limited to magnetic composite fluids, but can also be any magnetic fluid such as magnetorheological fluid, as long as it can be adsorbed on the polishing surface 120 to form a flexible grinding head). Specifically, the magnetic field generating device 200 includes a plurality of magnets 210 evenly distributed around a first direction, and the first direction is parallel to the circumference of the polishing wheel 100. Therefore, the magnetic field generating device 200 can form multiple dense magnetic field areas on the polishing surface 120. When an appropriate amount of magnetic composite fluid 1000 is applied to the polishing wheel 100, multiple magnetic clusters will form on the polishing surface 120, that is, multiple raised flexible grinding heads will be formed on the polishing surface 120. The first driving device 300 includes, for example, a motor, which is connected to the polishing wheel 100 via a coupling, gears, or belts, and is used to drive the polishing wheel 100 to rotate. The second driving device 400 includes, for example, a motor, which is connected to the magnet 210 via a coupling, gears, or belts, and is used to drive the magnet 210 to rotate. The first driving device 300 and the second driving device 400 can cause the polishing wheel 100 and the magnet 210 to rotate at different speeds, thereby causing the magnetic field generating device 200 to generate a dynamic magnetic field on the polishing surface 120. This not only makes the magnetic composite fluid 1000 on the polishing surface 120 more uniform, but also makes the magnetic composite fluid 1000 on each flexible grinding head more uniform, thereby improving the polishing effect, but also reduces the wear rate of each flexible grinding head, thereby reducing the frequency of fluid replenishment, thereby improving polishing efficiency.

[0058] It should be noted that, in this embodiment, the shape of each magnet 210 is not limited. The magnet 210 can be, for example, a rectangular, triangular, or fan-shaped shape. The magnetization direction of each magnet 210 is also not limited. For example, the magnetization directions of adjacent magnets 210 can be the same or opposite. The magnetization direction of the magnet 210 can be perpendicular to the first direction or along the first direction, as long as a dynamic magnetic field can be achieved on the polishing surface 120 through the cooperation of the first drive device 300 and the second drive device 400. In addition, the polishing wheel 100 and the magnet 210 rotate at different speeds, not limited to different rotation directions, but can also be different in size. For example, the polishing wheel 100 and the magnetic field generating device 200 rotate in opposite directions, or rotate in the same direction at different speeds.

[0059] For example, the experiment was conducted with the polishing wheel 100 rotating at 200 rpm and the magnet 210 rotating at 200 rpm and 400 rpm, respectively. Specifically, the magnetic composite fluid 1000 was injected into the polishing surface 120 of the polishing wheel 100, and a large amount of magnetic composite fluid 1000 was left at one position to form a magnetic composite fluid 1000 accumulation area (such as Figure 5 The first driving device 300 and the second driving device 400 are used to drive the polishing wheel 100 and the magnet 210 to rotate at the same speed to form a static magnetic field on the polishing surface 120. The experimental results are shown in FIG. Figure 5 As shown in (a), Figure 5 As can be seen in (a), at 1.44 seconds and 5 seconds, the magnetic composite fluid 1000 is still concentrated in place and does not diffuse to the surroundings, resulting in uneven distribution of magnetic clusters around the polishing wheel 100.

[0060] The polishing wheel 100 and the magnetic field generating device 200 rotate at different speeds to form a dynamic magnetic field on the polishing surface 120. The experimental results are as follows: Figure 5 As shown in (b), under the dynamic magnetic field, the height of the magnetic clusters in the magnetic composite fluid 1000 decreases. By t = 1.44 seconds, the magnetic composite fluid 1000 is evenly distributed around the polished surface 120 and remains stable at 5 seconds. These experimental results demonstrate that the dynamic magnetic field has a significant stirring effect on the magnetic composite fluid 1000, resulting in a more uniform distribution of the magnetic composite fluid 1000 on the polished surface 120.

[0061] Furthermore, the workpiece was polished using static and dynamic magnetic fields. The experimental results are shown in Figure 2. Figure 6 As shown. Figure 6 As shown in (a), under a static magnetic field, at t = 0 seconds, the polishing surface 120 forms a flexible grinding head. The polishing wheel 100 presses down to polish the workpiece, and the flexible grinding head is squeezed. At t = 10 seconds, the flexible grinding head is flattened (worn) around the polishing wheel 100, and the height of the flexible grinding head does not recover significantly over time. Figure 6 As shown in Figure (b), under a dynamic magnetic field, when the magnetic composite fluid 1000 contacts the workpiece at t = 0 seconds, the height of the flexible grinding head remains essentially unchanged after 10 seconds of rotation. This demonstrates that the flexible grinding head exhibits good recovery capabilities under dynamic magnetic fields.

[0062] In some embodiments, the polishing wheel 100 rotates about its own axis, and the first direction coincides with the axial direction of the polishing wheel 100. Therefore, during operation, regardless of the position of the magnet 210 relative to the polishing wheel 100, the distance between the magnetic pole of the magnet 210 and the polishing surface 120 is the same. For example, the magnet 210 is disposed in the accommodating cavity 110, with the north pole facing the polishing surface 120, and the distance between the north pole and the side surface is L. Since the polishing wheel 100 is a circular structure and the magnet 210 rotates about the axis of the polishing wheel 100, regardless of the position to which the magnet 210 rotates, the distance between the north pole and the side surface corresponding to that position is L. This ensures that the magnetic field strength formed by the magnet 210 on any side surface is the same, forming magnetic clusters of equal size. That is, regardless of the position to which the magnet 210 rotates, the shape and size of the flexible grinding head formed on the side surface of the polishing wheel 100 are close to the same, thereby improving the consistency of the polishing effect on the workpiece and enhancing the polishing effect.

[0063] Reference Figure 2 In some embodiments, the polishing device further includes a mounting frame 500, a first connecting shaft 600, and a second connecting shaft 700. The mounting frame 500 includes a first mounting portion 510 and a second mounting portion 520 disposed opposite to each other. The polishing wheel 100 has a first end face 130 and a second end face 140 along its own axial direction. One end of the first connecting shaft 600 is rotatably connected to the first mounting portion 510 and is connected to the first driving device 300, and the other end is connected to the first end face 130. The accommodating cavity 110 extends to the second end face 140 and forms an opening 150 on the second end face 140. One end of the second connecting shaft 700 is rotatably connected to the second mounting portion 520 and is connected to the second driving device 400. The other end extends from the opening 150 into the accommodating cavity 110 and is connected to the magnetic field generating device 200. Illustratively, the mounting frame 500 has a mounting cavity 531. The first drive device 300 and the second drive device 400 are both disposed within the mounting cavity 531 and distributed vertically to reduce the horizontal size of the polishing apparatus. The second drive device 400 and the second drive device 400 extend in opposite directions and are connected to the first connecting shaft 600 and the second connecting shaft 700, respectively, via belts. Specifically, in this embodiment, the second drive device 400 is disposed outside the accommodating cavity 110, which simplifies the structure of the polishing wheel 100 and reduces processing costs. Furthermore, when the first drive device 300 drives the polishing wheel 100 to rotate, the second drive device 400 can avoid adding an additional load to the first drive device 300, thereby saving energy consumption during operation.

[0064] Reference Figure 3In some embodiments, the first connecting shaft 600 and the polishing wheel 100 are integrally formed to improve the coaxiality between the polishing wheel 100 and the first connecting shaft 600 while simplifying the structure. Specifically, the first connecting shaft 600 and the polishing wheel 100 are integrally formed using a process such as die casting, metal injection molding, or CNC machining, without the need for assembly. This eliminates assembly errors, thereby improving the coaxiality between the first connecting shaft 600 and the polishing wheel 100, and improving the stability of the polishing wheel 100 during rotation, thereby improving the polishing effect of this embodiment.

[0065] Reference Figure 3 In some embodiments, the second connecting shaft 700 includes a rotating portion 710, the radial side surface of which slides against the polishing wheel 100. For example, the polishing wheel 100 further includes a rotating hole 160 communicating with the accommodating cavity 110. The end of the second connecting shaft 700 facing away from the second mounting portion 520 is the rotating portion 710. The rotating portion 710 is inserted into the rotating hole 160 and slides against the radial sidewall of the rotating hole 160. Therefore, both the first connecting shaft 600 and the second connecting shaft 700 have supports at both ends in the axial direction, thereby improving the stability of the polishing wheel 100 and the magnetic field generating device 200. Taking the first connecting shaft 600 as an example, one end of the first connecting shaft 600 is connected to the first mounting portion 510, and the other end is connected to the polishing wheel 100. If there is no contact between the polishing wheel 100 and the second connecting shaft 700, the whole formed by the first connecting shaft 600 and the polishing wheel 100 is similar to a cantilever beam. On the one hand, the first mounting portion 510 will be subjected to a larger bending moment, so higher requirements are put forward for the strength of the first mounting portion 510. On the other hand, during the working process, the polishing wheel 100 may be at risk of vibration. In this embodiment, the polishing wheel 100 is in sliding contact with the second connecting shaft 700. Therefore, as for the whole formed by the first connecting shaft 600 and the polishing wheel 100, support points are formed at both ends, which can not only reduce the bending moment subjected to the first mounting portion 510, but also improve the rotation stability of the polishing wheel 100. Similarly, for the whole formed by the second connecting shaft 700 and the magnet 210, support points are formed at both axial ends, which can not only reduce the bending moment exerted on the second mounting part 520, but also improve the stability of the movement of the magnet 210, thereby improving the polishing effect of the polishing equipment of this embodiment.

[0066] Further, refer to Figure 3In some embodiments, the polishing apparatus further includes a rotating member 800, which is connected to the rotating portion 710 and the polishing wheel 100 to rotatably connect the rotating portion 710 and the polishing wheel 100. Specifically, the rotating member 800 is, for example, a bearing, a coupling, or an annular ring with a self-lubricating function, so that the connecting shaft and the polishing wheel 100 rotate more smoothly, reducing the wear of the polishing wheel 100 and the second connecting shaft 700, thereby extending the service life of the polishing apparatus of this embodiment. Exemplarily, the rotating part 800 is a bearing, which includes an inner ring and an outer ring. The polishing wheel 100 also has a rotating hole 160 connected to the accommodating cavity 110. The outer ring is clamped in the rotating hole 160, and the second connecting shaft 700 is inserted into the inner ring so that the second connecting shaft 700 is rotatably connected to the polishing wheel 100. Therefore, whether it is for the first connecting shaft 600 or the second connecting shaft 700, both ends of its axial direction have support, thereby improving the stability of the rotation of the polishing wheel 100 and the magnet 210, and thereby improving the polishing effect of the polishing equipment of this embodiment.

[0067] Reference Figure 3 Based on the above embodiment, the second connecting shaft 700 includes at least two rotating portions 710 distributed along its own axis, that is, there are two support points between the polishing wheel 100 and the second connecting shaft 700, thereby further improving the stability of the polishing wheel 100 and the magnet 210. Specifically, taking the second connecting shaft 700 as an example, multiple connection points can more effectively disperse the load generated by the second connecting shaft 700 during rotation. That is, each connection point bears a portion of the load, thereby reducing the force on a single connection point and reducing the risk of damage due to overload. At the same time, multiple connection points increase the rigidity of the entire structure formed by the first connecting shaft 600, the polishing wheel 100, the second connecting shaft 700, and the magnetic field generating device 200, making the polishing wheel 100 and the magnetic field generating device 200 more stable during rotation and reducing vibration and swing.

[0068] Reference Figure 2In some embodiments, the mounting frame 500 further includes a third mounting portion 530, and at least one of the first mounting portion 510 and the second mounting portion 520 is a separate structure from the third mounting portion 530. For example, the first mounting portion 510 and the third mounting portion 530 are separate structures. Therefore, during installation, the second connecting shaft 700 can be first inserted into the first mounting portion 510, and then the first mounting portion 510 is connected to the third mounting portion 530, thereby simplifying the installation of the first connecting shaft 600 on the third mounting portion 530. Specifically, it can be understood that the first mounting portion 510 and the second mounting portion 520 are arranged opposite each other, and the polishing wheel 100 is connected to the first connecting shaft 600 to form an integrated structure (for convenience of explanation, this integrated structure is referred to as a first structure). The first structure has a larger end and a smaller end. Therefore, during installation, the first structure needs to be placed between the first mounting portion 510 and the second mounting portion 520, and then the first connecting shaft 600 needs to be passed through the first mounting portion 510. Therefore, the size of the first structure cannot be larger than the distance between the first mounting portion 510 and the second mounting portion 520, which limits the size of the polishing wheel 100. For example, the distance between the first mounting portion 510 and the second mounting portion 520 is L1, the length of the first connecting shaft 600 is L2, and the axial dimension of the polishing wheel 100 is L3. Here, L2+L3≤L1 must be satisfied, that is, the axial dimension of the polishing wheel 100 is L3≤L1-L2. In this embodiment, the first mounting portion 510 and the third mounting portion 530 are separate structures. The first structure can be first inserted into the first mounting portion 510, and then the first mounting portion 510 and the third mounting portion 530 are connected. Therefore, only L3≤L1 is required. Therefore, while the distance between the first mounting portion 510 and the second mounting portion 520 is constant, this embodiment can enable the polishing wheel 100 to have a larger polishing surface 120 area.

[0069] In addition, during installation, the first structure, the magnetic field generating device 200 and the second connecting shaft 700 can be installed externally as an integral structure, and then the integral structure can be installed on the first mounting part 510 and the second mounting part 520, thereby making the installation of the polishing equipment of this embodiment simpler and more convenient.

[0070] Reference Figure 2 and Figure 3 Based on the above embodiment, the first connecting shaft 600 has a first shoulder 610, which slides against the surface of the first mounting portion 510 facing the second mounting portion 520, and the second connecting shaft 700 has a second shoulder 720, which slides against the surface of the second mounting portion 520 facing the first mounting portion 510 to limit the axial movement of the polishing wheel 100, thereby improving the polishing effect of the polishing equipment of this embodiment.

[0071] Reference Figure 3 In some embodiments, the polishing apparatus further includes a first bearing 801 and a second bearing 802. The first connecting shaft 600 is inserted into the inner ring of the first bearing 801, and the first shoulder 610 abuts against the inner ring of the first bearing 801, so that the first connecting shaft 600 is rotatably connected to the first mounting portion 510. The second connecting shaft 700 is inserted into the inner ring of the second bearing 802, and the second shoulder 720 abuts against the inner ring of the second bearing 802.

[0072] Reference Figure 4 In some embodiments, the plurality of magnets 210 are evenly distributed along the circumference of the second connecting shaft 700, thereby improving the rotational stability of the second connecting shaft 700. Specifically, the plurality of magnets 210 are evenly distributed along the circumference of the second connecting shaft 700 so that the center of gravity of the magnetic field generating device 200 is located at the axis of the second connecting shaft 700, thereby improving the rotational stability of the second connecting shaft 700, and further improving the rotational stability of the magnets 210, thereby improving the polishing effect of the polishing apparatus of this embodiment.

[0073] Reference Figure 7 , Figure 7 This is a schematic structural diagram of another magnetic field generating device and polishing wheel according to an embodiment of the first aspect of the present invention. In some embodiments, the magnetic poles of adjacent magnets 210 are arranged in opposite directions along the circumference of the second connecting shaft 700 to form gradually opening and closing magnetic lines of force on the polishing surface 120, thereby enhancing the stirring effect on the magnetic composite fluid 1000, thereby improving the renewal efficiency of the abrasive particles at the flexible grinding head, thereby enhancing the polishing effect of the flexible grinding head and improving the polishing effect of the polishing device of this embodiment. In addition, since the magnetic poles of adjacent magnets 210 are arranged in opposite directions. Therefore, for one end close to the polishing surface 120, the magnetic lines of force are emitted from the magnetic pole of one magnet 210 and enter the other magnet 210, thereby enhancing the field strength between the adjacent magnets 210, thereby improving the polishing effect of the polishing device of this embodiment.

[0074] Reference Figure 8 , Figure 8 for Figure 2An exploded view of the medium magnetic field generating device. In some embodiments, the polishing equipment includes a mounting member 220, which has a plurality of mounting grooves 221 distributed around a first direction. The mounting grooves 221 are adapted to the shape and size of the magnet 210, that is, the mounting grooves 221 are contoured grooves adapted to the shape and size of the magnet 210. A magnet 210 is clamped in each mounting groove 221, thereby making the installation of the magnet 210 simpler and more convenient. Specifically, it is understandable that due to the interaction force between the magnets 210, the magnets 210 may repel or attract each other, so there is a risk of the magnets 210 pinching hands or popping out and injuring people during installation. In this embodiment, the mounting member 220 has a mounting groove 221 that is adapted to the size and shape of the magnet 210. During installation, the magnet 210 can be snapped into the mounting groove 221, which not only avoids the mutual attraction between the magnets 210 from clamping and pinching hands, but also avoids the repulsion between the magnets 210 from popping out and injuring people, thereby making the installation of the magnet 210 simpler.

[0075] It should be noted that the size and shape of the mounting groove 221 are adapted to the size and shape of the magnet 210, and cannot be simply interpreted as the size of the mounting groove 221 being completely equal to the size of the magnet 210. For the convenience of installation, the magnet 210 is slightly smaller than the mounting groove 221. For example, there is a gap of 0.1 mm to 0.5 mm between the side of the magnet 210 and the side of the mounting groove 221.

[0076] In some embodiments, the edge of the opening 150 is sealed to the second connecting shaft 700 to shield the opening 150 and prevent the magnetic composite fluid 1000 from entering the accommodating chamber 110 during the processing process, thereby improving the stability of the rotation of the polishing wheel 100 and improving the polishing device of this embodiment. Specifically, the edge of the opening 150 is sealed to the second connecting shaft 700, for example, a sealing ring is provided on the outside of the second connecting shaft 700, and the sealing ring is pressed against the edge of the opening 150, thereby shielding the opening 150, thereby preventing the magnetic composite fluid 1000 from entering the accommodating chamber 110 from the opening 150 during the polishing process. This can prevent the wear caused by the magnetic composite fluid 1000 entering the connection between the connecting shaft and the polishing wheel 100, and at the same time prevent the magnetic composite fluid 1000 from hindering the rotation of the magnetic field generating device 200, making the rotation of the polishing wheel 100 and the magnetic field generating device 200 more stable.

[0077] It is understandable that the size of the opening 150 determines the size of the magnet 210 that extends into the accommodating cavity 110. The larger the opening 150, the larger the magnet 210 that can be placed through the opening 150. However, if the opening 150 is too large, the gap between the edge of the opening 150 and the second connecting shaft 700 will be larger, making it more difficult to seal the opening 150. Based on this, in this embodiment, the polishing device further includes a shielding member 900, such as Figure 3 As shown, the shielding member 900 has a mounting hole 910. The first connecting shaft 600 is disposed through the mounting hole 910 and is sealed to the inner wall of the mounting hole 910. The shielding member 900 is connected to the polishing wheel 100 and is sealed to the edge of the opening 150, thereby sealing the opening 150. It can be understood that, compared to the gap between the inner wall of the opening 150 and the second connecting shaft 700, in this embodiment, the gap between the inner wall of the opening 150 and the shielding member 900, as well as the gap between the second connecting shaft 700 and the inner wall of the mounting hole 910 are smaller, thereby making the sealing of the opening 150 easier.

[0078] Reference Figure 2 In some embodiments, the polishing surface 120 is a spherical surface. Specifically, due to its shape characteristics, the spherical polishing surface 120 can better adapt to various complex curved surfaces and irregularly shaped workpieces, so that the polishing device of this embodiment can be used not only for polishing flat surfaces but also for polishing curved surfaces, thereby improving the practicality of the polishing device of this embodiment.

[0079] Furthermore, in some embodiments, the polishing device has multiple polishing wheels 100, each of which has a different size and shape. The polishing wheels 100 are detachably connected to the first mounting portion 510, and each polishing wheel 100 can be individually mounted on the first mounting portion 510, so that the polishing device of this embodiment has multiple working states, thereby improving the practicality of this embodiment. For example, the polishing device has two polishing wheels 100, one polishing wheel 100 has a cylindrical polishing surface 120, and the other polishing wheel 100 has a spherical polishing surface 120. When polishing a large flat surface, the cylindrical polishing wheel 100 can be used to improve polishing efficiency. When polishing a curved surface, the spherical polishing wheel 100 is replaced to improve the polishing accuracy of the spherical surface.

[0080] The polishing method of the second embodiment of the present invention is performed using the polishing equipment described in the first embodiment, and the polishing method includes:

[0081] Adding a magnetic composite fluid 1000 to the polishing surface 120;

[0082] The first driving device 300 and the second driving device 400 are started to rotate the polishing wheel 100 and the magnet 210 at different speeds.

[0083] Specifically, the first driving device 300 and the second driving device 400 are used to rotate the polishing wheel 100 and the magnetic field generating device 200 at different speeds. The magnetic field generating device 200 will generate a dynamic magnetic field on the polishing surface 120, which can not only make the magnetic composite fluid 1000 on the polishing surface 120 more uniform, but also make the magnetic composite fluid 1000 of each flexible grinding head more uniform, so as to improve the polishing effect, and at the same time reduce the wear rate of each flexible grinding head, thereby reducing the frequency of fluid replenishment to improve the polishing efficiency.

[0084] It should be noted that, since this embodiment adopts all the technical features of the polishing equipment of the first embodiment, this embodiment has all the beneficial effects brought by the first embodiment, which will not be repeated here.

[0085] While the embodiments of the present invention have been described in detail above with reference to the accompanying drawings, the present invention is not limited to the embodiments described above. Various modifications may be made within the scope of knowledge possessed by a person skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof may be combined with one another unless there is a conflict.

Claims

1. Polishing equipment, characterized in that, include: A polishing wheel having an accommodating cavity, wherein the radial side surface of the polishing wheel is a polishing surface; a magnetic field generating device comprising a plurality of magnets, the plurality of magnets being distributed around a first direction, the first direction being parallel to the axial direction of the polishing wheel, the magnetic field generating device being disposed in the accommodating cavity and being used to generate a magnetic field on the polishing surface to adsorb the magnetic composite fluid onto the polishing surface; a first driving device, connected to the polishing wheel, and used to drive the polishing wheel to rotate; a second driving device, connected to the magnet, for driving the magnetic field generating device to rotate around the first direction; Wherein, the first driving device and the second driving device can make the polishing wheel and the magnetic field generating device rotate at different speeds; The polishing wheel rotates about its own axis, and the first direction coincides with the axial direction of the polishing wheel; The magnetic field generating device further includes a mounting member having a plurality of mounting slots distributed around the first direction. The size and shape of the mounting slots are adapted to the magnets, and each magnet is individually disposed in the mounting slot.

2. The polishing device according to claim 1, characterized in that The polishing device further comprises a mounting frame, a first connecting shaft and a second connecting shaft, wherein the mounting frame comprises a first mounting portion and a second mounting portion disposed opposite to each other; The polishing wheel has a first end face and a second end face along its own axial direction, one end of the first connecting shaft is rotatably connected to the first mounting portion and connected to the first driving device, and the other end is connected to the first end face, the accommodating cavity extends to the second end face, and an opening is formed on the second end face, one end of the second connecting shaft is rotatably connected to the second mounting portion and connected to the second driving device, and the other end extends from the opening into the accommodating cavity and is connected to the magnetic field generating device.

3. The polishing device according to claim 2, characterized in that The second connecting shaft includes a rotating portion; The radial side surface of the rotating portion is in sliding contact with the polishing wheel; or The polishing device further includes a rotating member connected to the rotating portion and the polishing wheel, and configured to enable the rotating portion to be rotatably connected to the polishing wheel.

4. The polishing device according to claim 3, characterized in that The second connecting shaft includes at least two rotating parts distributed along its axial direction.

5. The polishing device according to claim 4, characterized in that Along the circumference of the second connecting shaft, the magnetic poles of adjacent magnets are arranged in opposite directions.

6. The polishing device according to claim 2, characterized in that The edge of the opening is sealed to the second connecting shaft.

7. The polishing device according to claim 6, characterized in that The polishing device further includes a shielding member having a first mounting hole. The shielding member is connected to the polishing wheel and covers the opening. The second connecting shaft is passed through the first mounting hole.

8. The polishing device according to claim 1, characterized in that The polished surface is a spherical surface.

9. A polishing method, characterized in that Polishing is performed using the polishing apparatus according to any one of claims 1 to 8, the polishing method comprising: adding a magnetic composite fluid to the polishing surface; The first driving device and the second driving device are started to make the polishing wheel and the magnetic field generating device rotate at different speeds.

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