A high-frequency power supply surface treatment electroplating equipment

Abstract

The present application relates to the field of metal surface treatment technology, and discloses a high-frequency power supply surface treatment electroplating equipment, which places the power supply board to be electroplated in the recessed groove of the movable rod. During the rotation of the entire electroplating rack, the power supply board is in a state of continuous position change within the limited range of the two recessed grooves, so that all surfaces of the power supply board can contact the electroplating liquid, and the power supply board can be effectively electroplated in all directions. At the same time, through the rotation of the electroplating rack, the position and angle of the movable rod and the power supply board are always in a continuous change process, and when they tend to be horizontal, they can perform a reset movement driven by a reciprocating spring, so that the gap size between two adjacent power supply boards in the width direction can be in an intermittent process of increasing and decreasing, causing the electroplating liquid in the gap to be discharged and sucked in under spatial changes, so that the electroplating liquid in the gap is always in a high-density metal ion state.

Description

Technical Field

[0001] The present application relates to the technical field of metal surface treatment, and in particular to a high-frequency power supply surface treatment electroplating device. Background Art

[0002] During the manufacturing process of high-frequency power supplies, the metal of the shell needs to be surface plated to improve the corrosion resistance and wear resistance of the shell. The existing electroplating equipment suitable for high-frequency power supply shells requires the shell plate to be clamped on the cathode frame and then immersed in the plating solution for electroplating.

[0003] In this process, in order to improve the electroplating efficiency, multiple shell plates are added to a cathode rack. The gaps between the shell plates are small, which leads to less plating solution content between the gaps. The total amount of metal ions used for electroplating in the plating solution in the gaps is small, which is not conducive to the efficiency of electroplating. In addition, the clamped parts of the shell plates cannot directly contact the plating solution, so that the clamped parts cannot obtain effective electroplating and need to be reworked for a second time to complete the electroplating, which will undoubtedly reduce the overall efficiency of electroplating. Summary of the invention

[0004] The present application proposes a high-frequency power supply surface treatment electroplating equipment, which is equipped with an electroplating rack that drives a power supply board to rotate in a plating solution. The direct contact point between the power supply board and the electroplating rack is constantly changing, and all surfaces of the power supply board can directly contact the plating solution for effective electroplating. The position of the movable rod is constantly changing, which drives the spacing between the power supply boards to constantly change, thereby increasing the fluidity of the plating solution and improving the uniformity of metal ions in the plating solution at various locations, and pushing the plating solution into a filter box for filtration and purification. It is used to solve the problem that the existing cathode rack clamps the plated workpiece, resulting in the clamping part being unable to obtain electroplating and the metal ion loss in the plating solution between the plated workpieces cannot be effectively replenished.

[0005] In order to achieve the above-mentioned purpose, the present application adopts the following technical scheme: a high-frequency power supply surface treatment electroplating equipment, including an electroplating pool and a uniformly distributed power supply board for electroplating, wherein an electroplating tank is provided in the electroplating pool, a power shaft is provided in the middle of one end of the electroplating pool for providing power, and a positioning shaft is provided in the middle of the other end for stability, and long strip-shaped chimeric bodies are respectively provided on the opposite surfaces of the power shaft and the positioning shaft; an electroplating rack is movably sleeved in the electroplating tank, and the electroplating rack includes two mounting seats symmetrical on both sides, an extension shaft provided at the center of the back faces of the two mounting seats, and a fixed Two stabilizing rods of two mounting seats and a movable rod evenly distributed between the two mounting seats; symmetrical long strip sliding grooves I are respectively provided on the top and bottom of the opposite ends of the two mounting seats, and the two ends of the movable rod are respectively inserted into the two opposite sliding grooves I on the two mounting seats, and evenly distributed reciprocating springs are provided between adjacent movable rods for the movable rod to perform reciprocating motion; recessed grooves are provided at the opposite ends of the two movable rods symmetrically arranged up and down, and the two ends of the power board are respectively movably inserted into the recessed grooves of the two movable rods symmetrically arranged up and down, so as to limit the range of motion of the power board.

[0006] Preferably, mounting bolts are respectively provided at both ends of the stabilizing rod, and the mounting bolts are threadedly connected to the mounting seat. The stabilizing rod is fixed to the mounting seat by the mounting bolts to maintain the integrity of the electroplating rack.

[0007] Preferably, the mounting seat is cylindrical, and the bottom side wall of the mounting seat is in contact with the arc-shaped bottom of the electroplating tank to stabilize the position of the mounting seat. A rectangular mating groove is provided at one end of the extension shaft away from the mounting seat, and the mating body is inserted into the mating groove to receive the rotational force input by the power shaft.

[0008] Preferably, the width of the recessed groove is greater than the thickness of the power board, so that the power board can expose different surfaces when moving. The bottom end of the power board contacts the bottom of the recessed groove below, and there is a gap between the top of the power board and the bottom of the recessed groove above, so as to provide space for the power board to move.

[0009] Preferably, the height of the sliding groove I is greater than the height of the movable rod, and the height difference is no more than one centimeter, so as to increase the exposed area of ​​the power board.

[0010] Preferably, symmetrical rectangular sliding grooves II are provided on the opposite ends of the two mounting seats, and a filter box is arranged between the two adjacent power boards in the width direction. The two ends of the filter box are respectively inserted into two symmetrical sliding grooves II. The height value of the filter box is the same as the height value of the sliding groove II, which is used to limit the movement range of the filter box.

[0011] Preferably, the box wall of the filter box is composed of a filter screen, and the inner cavity of the filter box is connected to the space of the electroplating tank through the holes of the filter screen, so as to filter and purify the flowing electroplating solution.

[0012] The present application provides a high-frequency power supply surface treatment electroplating equipment, which places a power supply board to be electroplated in a recessed groove of a movable rod, and the side wall of the power supply board is not in a state of continuous contact with the groove wall of the recessed groove. Instead, during the entire rotation process of the electroplating rack, the power supply board is in a state of continuous position change within the restricted range of the two recessed grooves, so that all surfaces of the power supply board can contact the electroplating liquid, thereby achieving all-round effective electroplating of the power supply board.

[0013] At the same time, through the rotation of the electroplating rack, the position and angle of the movable rod and the power board are always in a constant change process, so that when the power board and the movable rod rotate from the lower position to the upper position (or from the upper position to the lower position, the distribution position of the movable rod is different, the turning direction is also different, but the overall movement direction is consistent), due to the influence of their own weight, they can move in the direction of the lower position, and when they tend to be horizontal, they can perform a reset movement driven by the reciprocating spring, so that the gap size between two adjacent power boards in the width direction can be in an intermittent process of increasing and decreasing, causing the plating solution in the gap to be discharged and sucked in under the change of space, so that the plating solution in the gap is always in a high-density metal ion state.

[0014] At the same time, through the flow of plating liquid in the gap, the plating liquid can impact the filter box. At this time, the filter box will intercept the impurities in the plating liquid, and purify the plating liquid in the entire plating tank under the circulation of the plating liquid. In addition, when the filter box is moving, a state in which a large distance is formed on one side and a small distance is formed on the other side between the two adjacent power boards (the size and direction of this state are constantly changing as the two adjacent power boards are in different positions, and a state in which the distances on both sides tend to be the same is formed), so that the amount of plating liquid in contact with the two surfaces of the power board is constantly changing, further improving the turbulent state of the plating liquid, improving the uniformity of the metal ions, thereby increasing the contact amount of metal ions on the two surfaces per unit time, and improving the electroplating effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings, which constitute a part of the specification, illustrate embodiments disclosed in the present application and, together with the description, serve to explain the principles disclosed in the present application.

[0016] The present disclosure may be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0018] Figure 2 It is a schematic diagram of the structure of the electroplating pool of the present invention;

[0019] Figure 3 It is a schematic diagram of the chimera structure position of the present invention;

[0020] Figure 4 It is a schematic diagram of the structure of the electroplating rack of the present invention;

[0021] Figure 5 It is a schematic diagram of the structural distribution of the power board and the filter box of the present invention;

[0022] Figure 6 It is a schematic diagram of the structural state of the power board of the present invention.

[0023] Among them: 1. electroplating pool; 2. electroplating tank; 3. power shaft; 4. positioning shaft; 5. chimera; 6. mounting seat; 7. stabilizer bar; 8. mounting bolt; 9. extension shaft; 10. chimera groove; 11. sliding groove I; 12. sliding groove II; 13. movable rod; 14. recessed groove; 15. reciprocating spring; 16. power board; 17. filter box. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application. Embodiment 1

[0025] See also Figures 1 to 3 A high-frequency power surface treatment electroplating equipment comprises an electroplating pool 1, a plurality of power supply boards 16 for electroplating and an existing electric device for providing power. An electroplating tank 2 is provided in the electroplating pool 1, and the electroplating tank 2 is filled with an electroplating solution, and a group of plated metals connected to the positive electrode of the power supply and serving as an anode are provided in the electroplating solution. A power shaft 3 is movably sleeved in the middle of one end of the electroplating pool 1, and a positioning shaft 4 is movably sleeved in the middle of the other end. Long strip-shaped chimeras 5 are respectively welded on the opposite surfaces of the power shaft 3 and the positioning shaft 4. The power shaft 3 is fixedly connected to the output end of the electric device for providing power, so that the electric device can drive the power shaft 3 to rotate slowly to drive the entire electroplating rack connected to the power shaft 3 to rotate synchronously.

[0026] See also Figure 1 , Figures 4 to 6A plating rack is movably sleeved in the plating tank 2, and the plating rack is movably connected to the negative pole of the power supply, so that the power board 16 in contact with the plating rack serves as a cathode. When the plating rack drives the power board 16 to rotate, the cathode connection can still be maintained to carry out effective electroplating. The plating rack includes two symmetrical mounting seats 6 on both sides, an extension shaft 9 welded to the center of the back sides of the two mounting seats 6, two stabilizing rods 7 for fixing the two mounting seats 6, and a plurality of movable rods 13 movably connected between the two mounting seats 6.

[0027] See also Figure 1 , Figures 4 to 5 The two ends of the stabilizing rod 7 are respectively threadedly connected with mounting bolts 8, and the mounting bolts 8 are threadedly connected to the mounting seat 6. The stabilizing rod 7 is fixedly connected to the mounting seat 6 through the mounting bolts 8, so that the two mounting seats 6 can maintain a constant relative distance through the stabilizing rod 7, and the mounting seat 6 connected to the power shaft 3 and moving can drive the other mounting seat 6 to move synchronously through the stabilizing rod 7, so that the entire electroplating rack can move synchronously.

[0028] See also Figures 4 to 6 The mounting seat 6 is cylindrical, and the bottom side wall of the mounting seat 6 fits with the arc-shaped groove bottom of the electroplating tank 2, so that when the mounting seat 6 rotates, it can be restricted by the groove wall of the electroplating tank 2 and keep the height position unchanged. A rectangular interlocking groove 10 is opened at the end of the extension shaft 9 away from the mounting seat 6, and the chimera 5 is inserted into the interlocking groove 10, so that after the electroplating rack is placed in the electroplating tank 2, it can be restricted by the chimera 5 and the interlocking groove 10 in the length direction and keep the position unchanged, and the power shaft 3 can drive the entire electroplating rack to rotate by connecting the chimera 5 and the interlocking groove 10, and then drive another mounting seat 6 to rotate synchronously through the movable rod 13, and then drive the positioning shaft 4 to rotate synchronously through the extension shaft 9 on this mounting seat 6, so that the entire electroplating rack remains stable in the length direction and height direction.

[0029] See also Figures 4 to 6 The top and bottom of the two mounting seats 6 are respectively provided with symmetrical long strip sliding grooves Ⅰ11, and the two ends of the movable rod 13 are respectively inserted into the two opposite sliding grooves Ⅰ11 on the two mounting seats 6, so that the movable rod 13 can reciprocate in the length direction of the sliding groove Ⅰ11 under the restriction of the sliding groove Ⅰ11, and the adjacent movable rods 13 are fixedly connected with uniformly distributed reciprocating springs 15, as shown in the attached manual. Figure 6Take the perspective of taking as an example, when the electroplating rack moves in the counterclockwise direction, the movable rod 13 on the A side gradually rotates downward to change its position, while the movable rod 13 on the B side gradually changes its position upward. When the A side rotates to the lower position, all the movable rods 13 will move toward the A side under their own weight, compressing the reciprocating springs 15 between the movable rods 13, and the distance between adjacent movable rods 13 will decrease. As the electroplating rack continues to rotate, the A side will rotate to the original position of the B side, and the B side will rotate to the original position of the A side. At this time, the adjacent movable rods 13 are gradually in a horizontal state, and the component force in the direction of gravity gradually increases. The reciprocating spring 15 gradually decreases, so that the compressed reciprocating spring 15 pushes the movable rod 13 to reset. At this time, the gap between the adjacent movable rods 13 increases, and the electroplating rack continues to rotate. The A side will rotate upward, and the B side will rotate downward. At this time, all the movable rods 13 will move in the direction of the B side under their own weight, compressing the reciprocating spring 15 between the movable rods 13, and the spacing between the adjacent movable rods 13 will decrease. In this reciprocating manner, the gap between the adjacent movable rods 13 is in an intermittent change of shrinking and increasing. The opposite ends of the two symmetrical movable rods 13 are provided with recessed grooves 14, and the two ends of the power board 16 are respectively inserted into the The concave grooves 14 of the two vertically symmetrical movable rods 13 enable the rotating plating rack to drive the power board 16 to rotate synchronously through the movable rods 13, so that the plating rack and the power board 16 stir the surrounding plating liquid to increase the fluidity of the plating liquid. At the same time, when the gap size between adjacent movable rods 13 changes, the gap size between adjacent power boards 16 will also change. When the gap between adjacent power boards 16 gradually becomes smaller, the power board 16 will squeeze the plating liquid in the gap to converge to the center of the gap and flow around to leave the gap. When the gap between adjacent power boards 16 gradually increases , new plating solution will enter the gap from the openings on all sides, so that the plating solution in the gap between adjacent power boards 16 can be in a state of continuous replacement, maintaining the metal ion concentration in the plating solution in the gap, and homogenizing the concentration of metal ions, thereby avoiding the problem of slow electroplating or poor electroplating effect caused by continuous consumption of metal ions in the gap. In this process, the power board 16 actively presses against the plating solution or the plating solution flows toward the power board 16 due to the movement of the power board 16, which will increase the contact amount of the power board 16 with the metal ions in the plating solution per unit time, thereby accelerating the electroplating efficiency.

[0030] See also Figure 6 The width of the concave groove 14 is greater than the thickness of the power board 16. The bottom end of the power board 16 contacts the bottom of the lower concave groove 14. There is a gap between the top of the power board 16 and the bottom of the upper concave groove 14. The power board 16 cannot escape from the restricted range of the concave groove 14, so that the power board 16 can swing within the restricted range of the concave groove 14. Figure 6Taking the perspective as an example, the power board 16 is initially tilted between the two recessed grooves 14, the bottom of the bottom of the power board 16 fits with the bottom of the lower recessed groove 14, and the two side walls of the power board 16 fit with the two side walls of the two recessed grooves 14 respectively. At this time, the fitted parts cannot be directly in contact with the electroplating solution for electroplating. At this time, the top of the power board 16 does not fit with the bottom of the upper recessed groove 14. At this time, the top of the power board 16 is in direct contact with the electroplating solution. Taking counterclockwise rotation as an example, when the upper movable rod 13 is moved downward When the movable rod 13 at the bottom rotates upward, the top and bottom ends of the power board 16 will gradually invert. During this process, due to the extra space in the recessed groove 14, the tilt direction of the power board 16 in the recessed groove 14 will change, gradually opposite to the original tilted state, and the part that originally adhered to the wall of the recessed groove 14 will be exposed, and the part that originally did not adhere to the wall of the recessed groove 14 will adhere to the wall, and so on, so that all parts of the power board 16 can be in contact with the electroplating solution for a long time, thereby obtaining an effective electroplating effect. Embodiment 2

[0031] See also Figures 4 to 5 On the basis of the first embodiment, the height of the sliding groove Ⅰ11 is greater than the height of the movable rod 13, and the height difference is not greater than one centimeter, so that the movable rod 13 can be adjusted in the height direction of the sliding groove Ⅰ11 by a certain distance, so that the part of the power board 16 originally in the recessed groove 14 is exposed more, and the distance between the end face of the power board 16 and the bottom of the recessed groove 14 is increased, the fluidity of the electroplating solution in this distance is increased, and the uniformity of the metal ions in the recessed groove 14 is further improved. Embodiment 3

[0032] See also Figures 4 to 6On the basis of the first embodiment, symmetrical rectangular sliding grooves Ⅱ12 are provided on the opposite ends of the two mounting seats 6, and a filter box 17 is provided between two adjacent power boards 16 in the width direction. The two ends of the filter box 17 are respectively inserted into the two symmetrical sliding grooves Ⅱ12, and the height value of the filter box 17 is the same as the height value of the sliding groove Ⅱ12, so that the filter box 17 can only reciprocate in the length direction of the sliding groove Ⅱ12. When the spacing between adjacent power boards 16 decreases or increases, the filter box 17 will also move due to its own weight and the push of the flowing electroplating solution, so that the filter box 17 will not hinder the normal movement of the power board 16. It should be noted that when one surface of the filter box 17 is at the bottom and moves downward, the spacing between the two power boards 16 is reduced. At this time, the surface of the power board 16 above the filter box 17 is at the bottom and is in contact with the surface of the power board 16 above the filter box 17. The upper surfaces of the filter box 17 are opposite to each other. When the compressed reciprocating spring 15 drives the power board 16 to move and reset to increase the distance, a surface of one of the moving power boards 16 that was originally at the top will gradually approach a surface of a filter box 17 that was originally at the bottom in the moving direction, so that the distance between a surface of the power board 16 that was originally at the top and a surface of the filter box 17 that was originally at the bottom is reduced, while the distance between a surface of the power board 16 that was originally at the bottom and a surface of a filter box 17 that was originally at the top in the direction opposite to the moving direction will increase. Similarly, when the direction continues to turn, the distance between the two surfaces of the power board 16 and the two filter boxes 17 will change. This distance change further affects the flow state of the surrounding electroplating solution, so that the electroplating effects obtained on the two surfaces of the power board 16 at different positions are different, thereby improving the overall electroplating efficiency.

[0033] The wall of the filter box 17 is composed of a filter screen. The inner cavity of the filter box 17 is connected to the space of the electroplating tank 2 through the holes of the filter screen. When the distance between adjacent power boards 16 is reduced, the power boards 16 will squeeze the electroplating liquid to converge to the center of the gap. At this time, the converged electroplating liquid will be squeezed on the wall of the filter box 17 and pass through the filter screen into the inner cavity of the filter box 17, so that the electroplating liquid flowing through can be filtered for impurities once, and the electroplating liquid entering the inner cavity will be discharged from the part of the filter box 17 that is not between the adjacent power boards 16. When the distance between adjacent power boards 16 increases, the surrounding plating liquid converges into the distance, and the plating liquid in the inner cavity of the filter box 17 will pass through the filter screen again to enter the distance between adjacent power boards 16. Part of the plating liquid will enter the filter box 17 through the part of the filter box 17 that is not between the adjacent power boards 16 for a first filtration, and then enter the distance between adjacent power boards 16 through the part of the filter box 17 that is between the adjacent power boards 16 for a second filtration, and the cycle is repeated to maintain the overall cleanliness of the plating liquid.

Claims

1. A high-frequency power supply surface treatment electroplating equipment, characterized in that: The invention comprises an electroplating pool (1) and a uniformly distributed power supply board (16) for electroplating, wherein the electroplating pool (1) is provided with an electroplating tank (2), a power shaft (3) is arranged in the middle of one end of the electroplating pool (1) for providing power, and a positioning shaft (4) is arranged in the middle of the other end for stability, and long strip-shaped chimeras (5) are respectively arranged on opposite surfaces of the power shaft (3) and the positioning shaft (4); The electroplating tank (2) is movably sleeved with an electroplating rack, the electroplating rack comprising two symmetrical mounting seats (6), an extension shaft (9) arranged at the center of the opposite back surfaces of the two mounting seats (6), two stabilizing rods (7) for fixing the two mounting seats (6), and evenly distributed movable rods (13) arranged between the two mounting seats (6); The top and bottom of the opposite ends of the two mounting seats (6) are respectively provided with symmetrical long strip sliding grooves I (11), and the two ends of the movable rod (13) are respectively inserted into the two opposite sliding grooves I (11) on the two mounting seats (6), and evenly distributed reciprocating springs (15) are arranged between adjacent movable rods (13) to enable the movable rod (13) to reciprocate; Concave grooves (14) are provided at opposite ends of the two vertically symmetrical movable rods (13), and the two ends of the power board (16) are movably inserted into the concave grooves (14) of the two vertically symmetrical movable rods (13) to limit the range of movement of the power board (16).

2. The high-frequency power surface treatment electroplating equipment according to claim 1, characterized in that: Mounting bolts (8) are respectively provided at both ends of the stabilizing rod (7), and the mounting bolts (8) are threadedly connected to the mounting seat (6). The stabilizing rod (7) is fixed to the mounting seat (6) by the mounting bolts (8) to maintain the integrity of the electroplating rack.

3. The high-frequency power surface treatment electroplating equipment according to claim 1, characterized in that: The mounting seat (6) is cylindrical, and the bottom side wall of the mounting seat (6) is in contact with the arc-shaped bottom of the electroplating tank (2) to stabilize the position of the mounting seat (6). The end of the extension shaft (9) away from the mounting seat (6) is provided with a rectangular interlocking groove (10), and the interlocking body (5) is inserted into the interlocking groove (10) to receive the rotational force input by the power shaft (3).

4. The high-frequency power surface treatment electroplating equipment according to claim 1, characterized in that: The width of the recessed groove (14) is greater than the thickness of the power board (16), so that the power board (16) can expose different surfaces when moving. The bottom end of the power board (16) contacts the bottom of the recessed groove (14) below, and there is a gap between the top of the power board (16) and the bottom of the recessed groove (14) above, so as to provide a space for the power board (16) to move.

5. The high-frequency power surface treatment electroplating equipment according to claim 1, characterized in that: The height of the sliding groove I (11) is greater than the height of the movable rod (13), and the height difference is no more than one centimeter, so as to increase the exposed area of ​​the power board (16).

6. The high-frequency power surface treatment electroplating equipment according to claim 4, characterized in that: Symmetrical rectangular sliding grooves II (12) are provided on opposite ends of the two mounting seats (6), and a filter box (17) is provided between two adjacent power boards (16) in the width direction. The two ends of the filter box (17) are respectively inserted into the two symmetrical sliding grooves II (12), and the height of the filter box (17) is the same as the height of the sliding groove II (12), so as to limit the movement range of the filter box (17).

7. The high-frequency power surface treatment electroplating equipment according to claim 6, characterized in that: The box wall of the filter box (17) is composed of a filter screen, and the inner cavity of the filter box (17) is connected to the space of the electroplating tank (2) through the holes of the filter screen, so as to filter and purify the flowing electroplating liquid.

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