A distributed integrated optoelectronic test management system and method

Abstract

The present invention relates to the field of photoelectric test management, and specifically to a distributed comprehensive photoelectric test management system and method, comprising: a test platform module, a distributed control module, a target disk test module, a photoelectric detection module and a band delay module, wherein the test platform module is used to build a test data processing center, the distributed control module is used to detect infrared radiation, the target disk test module is used to provide a test environment and a radiation source, the photoelectric detection module is used to obtain test data, and the band delay module is used to calculate the delay of a photoelectric system and adjust the calculated delay. The present invention can realize comprehensive and real-time monitoring and testing of photoelectric equipment in a large range or dispersed layout, improve test efficiency and accuracy, meet diverse test requirements, help optimize system parameters and algorithms, and improve the imaging volume and system performance of an optical imaging system in different band environments.

Description

Technical Field

[0001] The present invention relates to the field of optoelectronic test management, and in particular to a distributed integrated optoelectronic test management system and method. Background Art

[0002] Photoelectric testing is a method that uses the principle of light scattering or absorption to detect the properties of an object or measure physical quantities. It is often used to measure the quality parameters of visible light or infrared imaging systems. Multiple photoelectric testing instruments or test nodes can also be distributed in different geographical locations or between devices to achieve distributed testing of optoelectronic devices, fiber optic communications and other equipment.

[0003] In the process of testing optoelectronic imaging equipment, due to the band loss of optical analysis components, the band loss of filters, and the time delay of electronic devices, the final imaging of the optical imaging system will be delayed in time from the actual changes of the object, and this delay is different for light of different bands. The existing optoelectronic testing methods can only test the overall delay and cannot perform high-precision delay testing on light of each band.

[0004] In addition, since the temperature change of the heated target plate will change the frequency of the infrared light, the traditional method of using only a single temperature for testing is difficult to adapt to the actual working environment of the imaging system. The method of taking the average of multiple measurements can easily destroy the continuity of the test results, making it difficult to achieve high-precision output of the test results. Summary of the invention

[0005] The object of the present invention is to provide a distributed integrated optoelectronic test management system and method to solve the problems raised in the above background technology.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: a distributed integrated optoelectronic test management system, comprising: a test platform module, a distributed control module, a target disk test module, an optoelectronic detection module and a band delay module;

[0007] The test platform module is composed of a high-speed camera, a chopper, a display and a data processing device, and is used to build a test data processing center, analyze the test data transmitted by the distributed control, and uniformly control the temperature control function of the heating target plate, the distance adjustment function of the test equipment and the fading drawing function of the distributed control;

[0008] The distributed control module is composed of distributed controls arranged between the optoelectronic system and the heated target disk. The distributed controls are distributed on a spherical surface whose distance from the heated target disk is a preset value. According to the coordinates of each distributed control, the optoelectronic system and the target disk, the detection band of each distributed control is determined to detect the infrared radiation of the heated target disk in the corresponding band, and the detection results are standardized and transmitted to the test platform;

[0009] The target disk test module is used to provide a vacuum test environment and serve as a radiation source for photoelectric testing. By adjusting the temperature of the target disk, infrared light with different wavelength ratios is emitted for capture by the distributed control and the test equipment. The temperature of the target disk can be regulated according to the temperature curve set by the test platform;

[0010] The photoelectric detection module is used to obtain the identification data of the test equipment on the radiation, decompose the identification data in the frequency domain according to the frequency size of each standard detection band, and obtain the decomposed test data. It can also adjust the distance between the test equipment, the distributed control and the heating target plate, so as to change the test environment;

[0011] The band delay module is used to compare the decomposed test data with the detection of the distributed control, and after obtaining the frequency difference of each band, calculate the delay of the optoelectronic system in each standard band according to the relationship between the band attenuation and the target plate temperature, and use the re-test results to compare the difference between the test results and the standard attenuation function to obtain the significance coefficient, and use the significance coefficient to correct the calculated delay.

[0012] Further, the test platform module includes: a high-speed shooting unit and a chopping display unit;

[0013] The high-speed shooting unit is composed of a high-speed camera, and is used to shoot the light capture result obtained by the test device and add a time stamp;

[0014] The chopping display unit is used to filter the collected light data to obtain the components of the light in each frequency domain.

[0015] Further, the distributed control module includes: a control setting unit, a radiation capturing unit and a frequency band standardization unit;

[0016] The control setting unit is used to set the distributed controls in the test space and ensure that the distance between each control and the target plate is consistent;

[0017] The radiation capture unit is used to collect radiation information and transmit it to the control platform after the control detects light radiation of the corresponding band;

[0018] The frequency band standardization unit is used to filter the collected light radiation waveform and output a radiation waveform with a standardized frequency.

[0019] Further, the target plate test module includes: a temperature control unit and a vacuum pump unit;

[0020] The temperature control unit is used to adjust the temperature of the heating target plate according to the temperature curve set by the control platform;

[0021] The vacuum pump unit is used to extract the air in the test space to put the test space in a vacuum state.

[0022] Further, the photoelectric detection module includes: a test equipment unit and a spacing adjustment unit;

[0023] The test equipment unit is used to read the identification data of the test equipment on the radiation and decompose it according to the standard band;

[0024] The distance adjustment unit is used to adjust the distance between the test device and the heating target plate, and simultaneously adjust the position of the distributed control.

[0025] Further, the band delay module includes: a frequency comparison unit, a fading processing unit and a significant correction unit;

[0026] The frequency comparison unit is used to calculate the difference between the decomposed test data and the detection of the distributed control on each standard code frequency band;

[0027] The fading processing unit is used to calculate the delay of the optoelectronic system in each standard band according to the relationship between the band attenuation and the target plate temperature;

[0028] The significance correction unit is used to continuously test the time delay of the optoelectronic system during the adjustment process, calculate the significance coefficient between the test result and the standard attenuation, and correct the test result using the significance coefficient.

[0029] A distributed integrated optoelectronic test management method comprises the following steps:

[0030] Step S1. Build a test platform, connect the test platform to the imaging device to be tested, and set a heating target plate at a fixed position in front of the imaging device. The distance between the device to be tested and the heating target plate is recorded as a first distance.

[0031] Step S2. A fixed number of distributed controls are arranged on a sphere with a first distance as a radius and the heating target disk as the center, and a detection band of each distributed control is determined. The distributed control can collect thermal radiation of the heating target disk and can wirelessly transmit data to the test platform;

[0032] Step S3. adjusting the temperature of the heated target plate at a fixed rate, obtaining the wave function detected by the imaging device and each distributed control on the test platform, and decomposing the wave function according to the standard band frequency domain to obtain the standard detection;

[0033] Step S4. According to the wave function radiation law, the target plate temperature is calculated according to the standard detection amplitude of the imaging device and the distributed control in each band, the calculation results are subtracted to obtain the detection temperature difference, and the detection temperature difference is divided by the temperature adjustment rate of the heated target plate to obtain the delay of the imaging device in each band;

[0034] Step S5. Adjust the distance between the imaging device and the heated target plate, continuously calculate the temperature of the target plate according to the data collected by the imaging device, use the significance adjustment method to correct the delay of the imaging device, and output the final delay.

[0035] Further, step S1 includes:

[0036] Step S11. Building a test platform before testing the imaging device, and connecting the test platform to the imaging device to be tested, wherein the test platform includes a high-speed camera, a chopper, a display, and a computer;

[0037] Step S12: a heating target plate is arranged in the test space and fixed in front of the imaging device, and the distance between the device to be tested and the heating target plate is recorded as a first distance, and the first distance is within the imaging range of the imaging device.

[0038] Further, step S2 includes:

[0039] Step S21. A preset number of distributed controls are arranged between the imaging device and the heating target plate, so that the distributed controls are located on a spherical surface with the heating target plate as the center and the first distance as the radius, and the distances between the distributed controls and the imaging device are not equal, and the coordinates of each distributed control are obtained;

[0040] Step S22. Calculate the distance between each distributed control and the imaging device according to the coordinates of the distributed control, and number each distributed control in descending order of the distance;

[0041] Step S23. Assign detection bands to distributed controls, with the interval being [(a-1)·G / n,a·G / n], where a represents the change of distributed controls, G represents the maximum detection frequency, and n represents the number of distributed controls.

[0042] Further, step S3 includes:

[0043] Step S31. The test space is evacuated to a vacuum state, and the temperature of the heated target plate is adjusted according to the function T(t)=T0+k·t, where T(t) represents the temperature of the target plate at time t, T0 represents the initial temperature of the target plate, k is a preset proportional coefficient, and t is time;

[0044] Step S32: Turn on the imaging device to be tested to perform imaging, and transmit the imaging data to the test platform, and the test platform obtains the infrared wave function W0(t) emitted by the heated target plate during imaging;

[0045] Step S33. At the same time as step S32 is executed, the test platform reads the wave functions of infrared light detected by all distributed devices in the corresponding detection band interval, which are recorded as {r1(t), r2(t), …, rn(t)}, where rn(t) represents the wave function of infrared light detected by the distributed device numbered n;

[0046] Step S34. For each distributed device, according to the preset standard frequency table, a standard frequency is selected within the detection band of the device, and the frequency components different from the standard frequency in the wave function of the distributed device are filtered out to obtain the standard wave function. The standard wave functions of each distributed device are respectively recorded as a set R={R0(t), R2(t),…, Rn(t)}, where Rn(t) represents the standard wave function corresponding to the distributed device n, and the standard frequency is recorded as {f1, f2,…, fn}, where fn represents the frequency of Rn(t);

[0047] Step S35. Decompose the infrared wave function W0(t) according to the standard frequency determined in step S34 to obtain the components of W0(t) at each standard frequency, recorded as a set W={W1(t), W2(t),…, Wn(t)}, where Wn(t) represents the component of W0(t) at frequency fn.

[0048] Further, step S4 includes:

[0049] Step S41. Calculate the target temperature corresponding to each wave function, and list the following test equations:

[0050]

[0051] Where g represents the distance between the imaging device and the heated target plate, tc represents the test time, and P i (t) represents the wave function to be measured, D represents the imaging area, f is the frequency of the wave function to be measured, U is the estimated temperature of the target disk, h is Planck's constant, c is the speed of light, K is the Boltzmann constant, and e is the base of the natural logarithm;

[0052] Step S42. Substitute the elements in the set W and the set R into the wave function P to be tested in the test equation in sequence. i (t), solving the test equation group with the estimated target temperature U as the unknown variable, and the solution results of each element in the set W are recorded as the set X={x1,x2,…,xn}, where xn represents the estimated target temperature of the imaging device at the frequency fn, and the solution results of each element in the set R are recorded as the set Y={y1,y2,…,yn}, where yn represents the estimated target temperature obtained by the distributed device n;

[0053] Step S43. Calculate the time delay Qi of the imaging device at the frequency fi, where Qi=|xi-yi| / k, and use i to traverse from 1 to n to obtain the time delay of the imaging device at each frequency.

[0054] Further, step S5 includes:

[0055] Step S51. Adjust the distance between the imaging device and the heated target disk. During the adjustment process, the estimated temperature of the target disk of the imaging device at the frequency fi is continuously calculated according to the method of step S4. According to the calculation result, the function Ui(g) is constructed with the distance between the imaging device and the heated target disk as the independent variable and the estimated temperature of the target disk as the dependent variable;

[0056] Step S52. Calculate the significance coefficient of function Ui(g) according to the following significance calculation method:

[0057]

[0058] Wherein, Bi represents the significance coefficient of the function Ui(g), lg represents the logarithm with base 10, c is the speed of light, g1 represents the initial distance between the imaging device and the heated target disk, and g2 represents the current distance between the imaging device and the heated target disk;

[0059] Step S53. Correct the time delay Qi obtained in step S43 so that the corrected time delay QRi=(1-Bi)·Qi, and output QRi as the time delay test result of the imaging device at the frequency fi to the test platform;

[0060] Step S54. Use i to traverse from 1 to n, execute steps S51 to S53, and obtain the test delay of the imaging device at each frequency.

[0061] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0062] 1. The present invention can build a test platform using a high-speed camera, a chopper, and a display, determine the detection band of each distributed control according to the coordinates of the distributed control, the optoelectronic system, and the target disk, and realize comprehensive and real-time monitoring and testing of optoelectronic equipment in a large range or dispersed layout, thereby improving test efficiency and accuracy and meeting diverse test needs.

[0063] 2. The present invention can adjust the temperature of the heated target disk at a fixed rate, filter the detection indication into a standard detection band, compare it with the display result of the optoelectronic system, obtain the frequency difference of each band, and calculate the delay of the optoelectronic system in each standard band according to the relationship between the band attenuation and the target disk temperature. The imaging effect of the moving target under different delay conditions can be observed and analyzed, which is helpful to optimize the system parameters and algorithms, and improve the imaging volume and system performance of the optical imaging system in different band environments.

[0064] 3. The present invention can continuously adjust the distance between the photoelectric system and the heating target plate, compare the difference between the test results with the standard fading function, obtain the significance coefficient, and use the significance coefficient to correct the obtained delay to ensure that the system can obtain stable delay performance test results under various conditions, and take corresponding measures to optimize and improve. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0066] Figure 1 It is a structural schematic diagram of a distributed integrated optoelectronic test management system of the present invention;

[0067] Figure 2 It is a schematic diagram of the steps of a distributed integrated optoelectronic test management method of the present invention. DETAILED DESCRIPTION

[0068] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0069] See also Figure 1 , the present invention provides a technical solution: a distributed integrated optoelectronic test management system, including: a test platform module, a distributed control module, a target disk test module, an optoelectronic detection module and a band delay module;

[0070] The test platform module is composed of a high-speed camera, a chopper, a display and a data processing device, and is used to build a test data processing center, analyze the test data transmitted by the distributed control, and uniformly control the temperature control function of the heating target plate, the distance adjustment function of the test equipment and the fading drawing function of the distributed control;

[0071] The test platform module includes: a high-speed shooting unit and a chopping display unit;

[0072] The high-speed shooting unit is composed of a high-speed camera, and is used to shoot the light capture result obtained by the test device and add a time stamp;

[0073] The chopping display unit is used to filter the collected light data to obtain the components of the light in each frequency domain.

[0074] The distributed control module is composed of distributed controls arranged between the optoelectronic system and the heated target disk. The distributed controls are distributed on a spherical surface whose distance from the heated target disk is a preset value. According to the coordinates of each distributed control, the optoelectronic system and the target disk, the detection band of each distributed control is determined to detect the infrared radiation of the heated target disk in the corresponding band, and the detection results are standardized and transmitted to the test platform;

[0075] The distributed control module includes: a control setting unit, a radiation capture unit and a frequency band standardization unit;

[0076] The control setting unit is used to set the distributed controls in the test space and ensure that the distance between each control and the target plate is consistent;

[0077] The radiation capture unit is used to collect radiation information and transmit it to the control platform after the control detects light radiation of the corresponding band;

[0078] The frequency band standardization unit is used to filter the collected light radiation waveform and output a radiation waveform with a standardized frequency.

[0079] The target disk test module is used to provide a vacuum test environment and serve as a radiation source for photoelectric testing. By adjusting the temperature of the target disk, infrared light with different wavelength ratios is emitted for capture by the distributed control and the test equipment. The temperature of the target disk can be regulated according to the temperature curve set by the test platform;

[0080] The target plate test module includes: a temperature control unit and a vacuum pump unit;

[0081] The temperature control unit is used to adjust the temperature of the heating target plate according to the temperature curve set by the control platform;

[0082] The vacuum pump unit is used to extract the air in the test space to put the test space in a vacuum state.

[0083] The photoelectric detection module is used to obtain the identification data of the test equipment on the radiation, decompose the identification data in the frequency domain according to the frequency size of each standard detection band, and obtain the decomposed test data. It can also adjust the distance between the test equipment, the distributed control and the heating target plate, so as to change the test environment;

[0084] The photoelectric detection module includes: a test equipment unit and a spacing adjustment unit;

[0085] The test equipment unit is used to read the identification data of the test equipment on the radiation and decompose it according to the standard band;

[0086] The distance adjustment unit is used to adjust the distance between the test device and the heating target plate, and simultaneously adjust the position of the distributed control.

[0087] The band delay module is used to compare the decomposed test data with the detection of the distributed control, and after obtaining the frequency difference of each band, calculate the delay of the optoelectronic system in each standard band according to the relationship between the band attenuation and the target plate temperature, and use the re-test results to compare the difference between the test results and the standard attenuation function to obtain the significance coefficient, and use the significance coefficient to correct the calculated delay.

[0088] The band delay module includes: a frequency comparison unit, a fading processing unit and a significant correction unit;

[0089] The frequency comparison unit is used to calculate the difference between the decomposed test data and the detection of the distributed control on each standard code frequency band;

[0090] The fading processing unit is used to calculate the delay of the optoelectronic system in each standard band according to the relationship between the band attenuation and the target plate temperature;

[0091] The significance correction unit is used to continuously test the time delay of the optoelectronic system during the adjustment process, calculate the significance coefficient between the test result and the standard attenuation, and correct the test result using the significance coefficient.

[0092] like Figure 2 As shown, a distributed integrated optoelectronic test management method includes the following steps:

[0093] Step S1. Build a test platform, connect the test platform to the imaging device to be tested, and set a heating target plate at a fixed position in front of the imaging device. The distance between the device to be tested and the heating target plate is recorded as a first distance.

[0094] Step S1 includes:

[0095] Step S11. Building a test platform before testing the imaging device, and connecting the test platform to the imaging device to be tested, wherein the test platform includes a high-speed camera, a chopper, a display, and a computer;

[0096] Step S12: a heating target plate is arranged in the test space and fixed in front of the imaging device, and the distance between the device to be tested and the heating target plate is recorded as a first distance, and the first distance is within the imaging range of the imaging device.

[0097] Step S2. A fixed number of distributed controls are arranged on a spherical surface with the heating target disk as the center and the first distance as the radius, and a detection band of each distributed control is determined, wherein the distributed control can collect thermal radiation of the heating target disk and can wirelessly transmit data to the test platform;

[0098] Step S2 includes:

[0099] Step S21. A preset number of distributed controls are arranged between the imaging device and the heating target plate, so that the distributed controls are located on a spherical surface with the heating target plate as the center and the first distance as the radius, and the distances between the distributed controls and the imaging device are not equal, and the coordinates of each distributed control are obtained;

[0100] Step S22. Calculate the distance between each distributed control and the imaging device according to the coordinates of the distributed control, and number each distributed control in descending order of the distance;

[0101] Step S23. Assign detection bands to distributed controls, with the interval being [(a-1)·G / n,a·G / n], where a represents the change of distributed controls, G represents the maximum detection frequency, and n represents the number of distributed controls.

[0102] Step S3. adjusting the temperature of the heated target plate at a fixed rate, obtaining the wave function detected by the imaging device and each distributed control on the test platform, and decomposing the wave function according to the standard band frequency domain to obtain the standard detection;

[0103] Step S3 includes:

[0104] Step S31. The test space is evacuated to a vacuum state, and the temperature of the heated target plate is adjusted according to the function T(t)=T0+k·t, where T(t) represents the temperature of the target plate at time t, T0 represents the initial temperature of the target plate, k is a preset proportional coefficient, and t is time;

[0105] Step S32: Turn on the imaging device to be tested to perform imaging, and transmit the imaging data to the test platform, and the test platform obtains the infrared wave function W0(t) emitted by the heated target plate during imaging;

[0106] Step S33. At the same time as step S32 is executed, the test platform reads the wave functions of infrared light detected by all distributed devices in the corresponding detection band interval, which are recorded as {r1(t), r2(t), …, rn(t)}, where rn(t) represents the wave function of infrared light detected by the distributed device numbered n;

[0107] Step S34. For each distributed device, according to the preset standard frequency table, a standard frequency is selected within the detection band of the device, and the frequency components different from the standard frequency in the wave function of the distributed device are filtered out to obtain the standard wave function. The standard wave functions of each distributed device are respectively recorded as a set R={R0(t), R2(t),…, Rn(t)}, where Rn(t) represents the standard wave function corresponding to the distributed device n, and the standard frequency is recorded as {f1, f2,…, fn}, where fn represents the frequency of Rn(t);

[0108] Step S35. Decompose the infrared wave function W0(t) according to the standard frequency determined in step S34 to obtain the components of W0(t) at each standard frequency, recorded as a set W={W1(t), W2(t),…, Wn(t)}, where Wn(t) represents the component of W0(t) at frequency fn.

[0109] Step S4. According to the wave function radiation law, the target plate temperature is calculated according to the standard detection amplitude of the imaging device and the distributed control in each band, the calculation results are subtracted to obtain the detection temperature difference, and the detection temperature difference is divided by the temperature adjustment rate of the heated target plate to obtain the delay of the imaging device in each band;

[0110] Step S4 includes:

[0111] Step S41. Calculate the target temperature corresponding to each wave function, and list the following test equations:

[0112]

[0113] Where g represents the distance between the imaging device and the heated target plate, tc represents the test time, and P i (t) represents the wave function to be measured, D represents the imaging area, f is the frequency of the wave function to be measured, U is the estimated temperature of the target disk, h is Planck's constant, c is the speed of light, K is the Boltzmann constant, and e is the base of the natural logarithm;

[0114] Step S42. Substitute the elements in the set W and the set R into the wave function P to be tested in the test equation in sequence. i (t), solving the test equation group with the estimated target temperature U as the unknown variable, and the solution results of each element in the set W are recorded as the set X={x1,x2,…,xn}, where xn represents the estimated target temperature of the imaging device at the frequency fn, and the solution results of each element in the set R are recorded as the set Y={y1,y2,…,yn}, where yn represents the estimated target temperature obtained by the distributed device n;

[0115] Step S43. Calculate the time delay Qi of the imaging device at the frequency fi, where Qi=|xi-yi| / k, and use i to traverse from 1 to n to obtain the time delay of the imaging device at each frequency.

[0116] Step S5. Adjust the distance between the imaging device and the heated target plate, continuously calculate the temperature of the target plate according to the data collected by the imaging device, use the significance adjustment method to correct the delay of the imaging device, and output the final delay.

[0117] Step S5 includes:

[0118] Step S51. Adjust the distance between the imaging device and the heated target disk. During the adjustment process, the estimated temperature of the target disk of the imaging device at the frequency fi is continuously calculated according to the method of step S4. According to the calculation result, the function Ui(g) is constructed with the distance between the imaging device and the heated target disk as the independent variable and the estimated temperature of the target disk as the dependent variable;

[0119] Step S52. Calculate the significance coefficient of function Ui(g) according to the following formula:

[0120]

[0121] Wherein, Bi represents the significance coefficient of the function Ui(g), lg represents the logarithm with base 10, c is the speed of light, g1 represents the initial distance between the imaging device and the heated target disk, and g2 represents the current distance between the imaging device and the heated target disk;

[0122] Step S53. Correct the time delay Qi obtained in step S43 so that the corrected time delay QRi=(1-Bi)·Qi, and output QRi as the time delay test result of the imaging device at the frequency fi to the test platform;

[0123] Step S54. Use i to traverse from 1 to n, execute steps S51 to S53, and obtain the test delay of the imaging device at each frequency.

[0124] Embodiment: The distance between the imaging device and the heated target plate is 50 cm, the number of distributed controls is 3, the three distributed controls are respectively set at three different positions 50 cm away from the heated target plate, and infrared bands of 300 GHz-600 GHz, 600 GHz-800 GHz and 800 GHz-1 THz are respectively received. 500 GHz, 700 GHz and 900 GHz are selected as standard frequencies, and wave functions of the three distributed controls in the corresponding standard frequencies are obtained, which are R1 (t), R2 (t) and R3 (t), respectively. The components of the infrared waves detected by the imaging device in the frequencies of 500 GHz, 700 GHz and 900 GHz are separated to obtain wave functions W1 (t), W2 (t) and W3 (t);

[0125] After calculation, the target disk temperatures corresponding to R1(t), R2(t) and R3(t) are 30℃, 37℃ and 40℃ respectively, the target disk temperatures corresponding to W1(t), W2(t) and W3(t) are 32℃, 38℃ and 41℃ respectively, and the heating rate of the heated target disk is 1℃ / s. The delay of the imaging device at 500GHz, 700GHz and 900GHz is 2s, 1s and 1s respectively.

[0126] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0127] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A distributed integrated optoelectronic test management method, characterized in that: The method comprises the following steps: Step S1. Build a test platform, connect the test platform to the imaging device to be tested, and set a heating target plate at a fixed position in front of the imaging device to be tested. The distance between the imaging device to be tested and the heating target plate is recorded as a first distance. Step S2. A fixed number of distributed controls are arranged on a sphere with a first distance as a radius and the heating target disk as the center, and a detection band of each distributed control is determined. The distributed control can collect thermal radiation of the heating target disk and can wirelessly transmit data to the test platform; Step S3. adjusting the temperature of the heated target plate at a fixed rate, obtaining the wave function detected by the imaging device to be tested and each distributed control on the test platform, decomposing the wave function according to the standard band frequency domain, and obtaining the standard detection; Step S4. According to the wave function radiation law, the target plate temperature is calculated according to the standard detection amplitude of the imaging device to be tested and the distributed control in each band, the calculation results are subtracted to obtain the detection temperature difference, and the detection temperature difference is divided by the temperature adjustment rate of the heated target plate to obtain the delay of the imaging device to be tested in each band; Step S5. Adjust the distance between the imaging device to be tested and the heated target plate, continuously calculate the temperature of the target plate according to the data collected by the imaging device to be tested, use the significance adjustment method to correct the delay of the imaging device to be tested, and output the final delay; Step S5 includes: Step S51. Adjust the distance between the imaging device to be tested and the heated target plate. During the adjustment process, continuously calculate the target plate temperature of the imaging device to be tested at the frequency fi. According to the calculation result, a function Ui(g) is constructed with the distance between the imaging device to be tested and the heated target plate as the independent variable and the target plate temperature as the dependent variable, wherein g is the distance between the imaging device to be tested and the heated target plate. Step S52. Calculate the significance coefficient of function Ui(g) according to the following significance calculation method: Wherein, Bi represents the significance coefficient of the function Ui(g), lg represents the logarithm with base 10, c is the speed of light, g1 represents the initial distance between the imaging device to be tested and the heated target plate, and g2 represents the current distance between the imaging device to be tested and the heated target plate; Step S53. Obtain the corrected time delay QRi, where QRi=(1-Bi)·Qi, and use QRi as the time delay test result of the imaging device to be tested at the frequency fi, and output it to the test platform; Step S54. Use i to traverse from 1 to n, where n represents the number of distributed controls, and execute steps S51 to S53 to obtain the test delay of the imaging device to be tested at each frequency.

2. A distributed integrated optoelectronic test management method according to claim 1, characterized in that: Step S1 includes: Step S11. Building a test platform in front of the imaging device to be tested, and establishing a data connection between the test platform and the imaging device to be tested, wherein the test platform includes a high-speed camera, a chopper, a display, and a computer; Step S12. A heating target plate is arranged in the test space, and the heating target plate is fixed in front of the imaging device to be tested, and the distance between the imaging device to be tested and the heating target plate is recorded as a first distance, and the first distance is within the imaging range of the imaging device to be tested; Step S2 includes: Step S21. A preset number of distributed controls are arranged between the imaging device to be tested and the heated target plate, so that the distributed controls are located on a spherical surface with the heated target plate as the center and the first distance as the radius, and the distances between the distributed controls and the imaging device to be tested are not equal, and the coordinates of each distributed control are obtained; Step S22. Calculate the distance between each distributed control and the imaging device to be tested according to the coordinates of the distributed control, and number each distributed control in descending order of the distance; Step S23. Assign detection bands to distributed controls, with the interval being [(a-1)·G / n,a·G / n], where a represents the change of distributed controls, G represents the maximum detection frequency, and n represents the number of distributed controls.

3. A distributed integrated optoelectronic test management method according to claim 2, characterized in that: Step S3 includes: Step S31. The test space is evacuated to a vacuum state, and the temperature of the heated target plate is adjusted according to the function T(t)=T0+k·t, where T(t) represents the temperature of the target plate at time t, T0 represents the initial temperature of the target plate, k is a preset proportional coefficient, and t is time; Step S32: Turn on the imaging device to be tested to perform imaging, and transmit the imaging data to the test platform, and the test platform obtains the infrared wave function W0(t) emitted by the heated target plate during imaging; Step S33. At the same time as step S32 is executed, the test platform reads the wave functions of infrared light detected by all distributed controls in the corresponding detection band interval, which are recorded as {r1(t), r2(t), …, rn(t)}, where rn(t) represents the wave function of infrared light detected by the distributed control numbered n; Step S34. For each distributed control, according to the preset standard frequency table, a standard frequency is selected within the detection band range of the device, and the frequency components different from the standard frequency in the wave function of the distributed control are filtered out to obtain the standard wave function. The standard wave functions of each distributed control are respectively recorded as a set R = {R0(t), R2(t), ..., Rn(t)}, where Rn(t) represents the standard wave function corresponding to the distributed control n, and the standard frequency is recorded as {f1, f2, ..., fn}, where fn represents the frequency of Rn(t); Step S35. Decompose the infrared wave function W0(t) according to the standard frequency determined in step S34 to obtain the components of W0(t) at each standard frequency, recorded as a set W = {W1(t), W2(t), ..., Wn(t)}, where Wn(t) represents the component of W0(t) at frequency fn.

4. A distributed integrated optoelectronic test management method according to claim 3, characterized in that: Step S4 includes: Step S41. Calculate the target temperature corresponding to each wave function, and list the following test equations: Where g represents the distance between the imaging device to be tested and the heated target plate, tc represents the test time, and P i (t) represents the wave function to be measured, D represents the area of ​​the imaging region, f is the frequency of the wave function to be measured, U is the temperature of the target disk, h is Planck's constant, c is the speed of light, K is the Boltzmann constant, and e is the base of the natural logarithm; Step S42. Substitute the elements in the set W and the set R into the wave function P to be tested in the test equation in sequence. i (t), solving the test equation group with the target disk temperature U as the unknown variable, and the solution results of each element in the set W are recorded as the set X = {x1, x2, ..., xn}, where xn represents the target disk temperature of the imaging device to be tested at the frequency fn, and the solution results of each element in the set R are recorded as the set Y = {y1, y2, ..., yn}, where yn represents the target disk temperature obtained by the distributed control n; Step S43: Calculate the time delay Qi of the imaging device to be tested at the frequency fi, where Qi=|xi-yi| / k, and use i to traverse from 1 to n to obtain the time delay of the imaging device to be tested at each frequency.

5. A distributed integrated optoelectronic test management system, the system executing the distributed integrated optoelectronic test management method as claimed in claim 1, characterized in that: The system includes the following modules: a test platform module, a distributed control module, a target disk test module, a photoelectric detection module and a band delay module; The test platform module is composed of a high-speed camera, a chopper, a display and a computer, and is used to build a test data processing center, analyze the test data transmitted by the distributed control, and uniformly control the temperature control function of the heated target plate, the distance adjustment function of the imaging device to be tested, and the fading drawing function of the distributed control; The distributed control module is composed of distributed controls arranged between the imaging device to be tested and the heated target disk. The distributed controls are distributed on a spherical surface whose distance from the heated target disk is a preset value. According to the coordinates of each distributed control, the imaging device to be tested and the target disk, the detection band of each distributed control is determined to detect the infrared radiation of the heated target disk in the corresponding band, and the detection results are standardized and transmitted to the test platform; The target disk test module is used to provide a vacuum test environment and serve as a radiation source for photoelectric testing. By adjusting the temperature of the target disk, infrared light with different wavelength ratios is emitted for capture by the distributed control and the imaging device to be tested. The temperature of the target disk is regulated according to the temperature curve set by the test platform. The photoelectric detection module is used to obtain the identification data of the imaging device to be tested on the radiation, and decompose the identification data in the frequency domain according to the frequency size of each standard detection band to obtain the decomposed test data. It can also adjust the distance between the imaging device to be tested, the distributed control and the heating target plate, so as to change the test environment; The band delay module is used to compare the decomposed test data with the detection of the distributed control, and after obtaining the frequency difference of each band, calculate the delay of the imaging device to be tested in each standard band according to the relationship between the band attenuation and the target plate temperature, and use the re-test results to compare the difference between the test results and the standard attenuation function to obtain the significance coefficient, and use the significance coefficient to correct the calculated delay.

6. A distributed integrated optoelectronic test management system according to claim 5, characterized in that: The test platform module includes: a high-speed shooting unit and a chopping display unit; The high-speed shooting unit is composed of a high-speed camera, and is used to shoot the light capture result obtained by the imaging device to be tested, and add a time stamp; The chopping display unit is used to filter the collected light data to obtain the components of the light in each frequency domain.

7. A distributed integrated optoelectronic test management system according to claim 6, characterized in that: The distributed control module includes: a control setting unit, a radiation capture unit and a frequency band standardization unit; The control setting unit is used to set the distributed controls in the test space and ensure that the distance between each control and the target plate is consistent; The radiation capture unit is used to collect radiation information and transmit it to the control platform after the control detects light radiation of the corresponding band; The frequency band standardization unit is used to filter the collected light radiation waveform and output a radiation waveform with a standardized frequency.

8. A distributed integrated optoelectronic test management system according to claim 7, characterized in that: The target plate test module includes: a temperature control unit and a vacuum pump unit; The temperature control unit is used to adjust the temperature of the heating target plate according to the temperature curve set by the control platform; The vacuum pump unit is used to extract the air in the test space to make the test space in a vacuum state; The photoelectric detection module includes: an imaging device unit to be tested and a spacing adjustment unit; The imaging device unit to be tested is used to read the identification data of the imaging device to be tested on the radiation and decompose it according to the standard band; The spacing adjustment unit is used to adjust the distance between the imaging device to be tested and the heating target plate, and simultaneously adjust the position of the distributed control.

9. A distributed integrated optoelectronic test management system according to claim 8, characterized in that: The band delay module includes: a frequency comparison unit, a fading processing unit and a significant correction unit; The frequency comparison unit is used to calculate the difference between the decomposed test data and the detection of the distributed control on each standard code frequency band; The fading processing unit is used to calculate the delay of the imaging device to be tested in each standard band according to the relationship between the band attenuation and the target plate temperature; The significance correction unit is used to continuously test the delay of the imaging device to be tested during the adjustment process, calculate the significance coefficient between the test result and the standard attenuation, and correct the test result using the significance coefficient.

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