A modular embedded industrial control machine with high heat dissipation

Abstract

The present invention relates to a modular embedded industrial control machine with high heat dissipation performance, comprising an outer shell and an upper cover that are detachably connected. A heat dissipation base, a PCB main board, and a PCB sub-board are arranged above and below the outer shell. The top surface of the heat dissipation base has a plurality of spaced heat dissipation fins and a fan reserved slot. A pair of rotationally symmetrical U-shaped grooved tubes are recessed in the middle of the bottom surface of the heat dissipation base, and an adaptive heat-conducting copper tube is embedded in the U-shaped grooved tubes. The bottom surface of the heat dissipation base is also provided with a main heat block, a north bridge heat conduction block, and a copper tube pressing plate. One side of the bottom surface of the heat dissipation base is recessed inward to form a groove-shaped installation cavity, and one side of the bottom surface has an inclined portion, and a slope is provided on the top surface of the heat dissipation base, and heat dissipation fins are located on the slope. The present invention is modularly assembled, and the overall size is not too large. The internal components and heat dissipation design are compactly arranged within the device body, ensuring the neatness and aesthetics of the device, good heat dissipation, and the functionality of the interface.

Description

Technical Field

[0001] The present invention relates to the field of industrial control computer equipment, and in particular, it discloses a modular embedded industrial control machine with high heat dissipation performance. Background Art

[0002] An Industrial Personal Computer (IPC), or industrial control computer, is a general term for tools that utilize a bus architecture to monitor and control production processes, electromechanical equipment, and process equipment. IPCs possess key computer attributes and characteristics, such as a CPU, hard drive, memory, peripherals, and interfaces. They also include an operating system, control networks and protocols, computing power, and a user-friendly human-machine interface. The products and technologies of the industrial control industry are highly specialized, serving as intermediate products, providing reliable, embedded, and intelligent industrial computers for other industries.

[0003] Industrial controllers generate heat when they are in continuous operation. If the heat is not dissipated in time, it will affect the normal operation of the electronic components inside the device. Currently, industrial controllers are roughly divided into two categories: those with large chassis and large motherboards; and those with small and portable designs.

[0004] The advantage of large-volume devices is that they have ample internal space, which is more conducive to the layout of complex heat dissipation structure designs. For example, Chinese patent application number CN 118276658 A discloses a heat dissipation device for industrial computers. By providing a heat dissipation component, the device automatically controls the rotation of the heat dissipation fan blades when the temperature of the internal cavity of the industrial computer rises to a certain level, thereby facilitating the discharge of high-temperature air from the internal cavity of the industrial computer. However, its disadvantage is its large size, which makes it very inconvenient to install and carry. Moreover, its main innovation—the design of the heat dissipation component—is particularly complex. It includes a motor, a drive component, a first active bevel gear, a first driven bevel gear, a vertical shaft, a second active bevel gear, a second driven bevel gear, etc. These components are used to drive the heat dissipation fan blades to achieve the heat dissipation effect. However, the complex mechanical structure generally leads to increased costs and increased installation difficulty, resulting in poor promotion and not meeting current market demand.

[0005] The advantage of small devices is their small size and portability, making them highly popular in the market. However, due to the presence of components such as the motherboard, hard drive, peripherals, and interfaces, their internal design is inherently compact. Adding heat dissipation design to this already requires only simple heat dissipation structures. For example, prior art publication number CN 115826697 A discloses a fanless, modular, and efficient heat dissipation industrial computer. This computer lacks fans or heat sinks, primarily utilizing grille side guards, a top guard, a bottom guard, and a rear guard on the body to enhance ventilation and achieve heat dissipation. However, this computer is more suitable for industrial computers with low power consumption and few peripheral interfaces, and its heat dissipation performance is generally mediocre. Another example is prior art publication number CN 115523395 A, which discloses an embedded industrial computer with a compact and lightweight design. Heat dissipation is primarily achieved through conduction through external heat sink fins. While the computer lacks an internal fan, its exposed heat sink fins easily accumulate dust between them, thus affecting heat dissipation.

[0006] Based on this, the applicant considered designing an industrial computer device that is small, modular, compact, and has the characteristics of high heat dissipation and aesthetics. Summary of the Invention

[0007] The purpose of the present invention is to provide a modular embedded industrial control machine with high heat dissipation performance.

[0008] The technical solution is as follows:

[0009] A modular embedded industrial controller with high heat dissipation performance includes an outer shell having an inner cavity, an upper cover detachably fixedly mounted on the top of the outer shell, and a PCB main board and a PCB sub-board mounted in the inner cavity of the outer shell in an upper and lower separated manner. The PCB main board is electrically connected to the PCB sub-board, and a CPU chip and a northbridge chip are electrically connected to the PCB main board, wherein:

[0010] A heat dissipation base is detachably mounted between the upper cover and the PCB mainboard. A plurality of spaced heat dissipation fins are formed in an array along the width of the top surface of the heat dissipation base. A fan reserved slot for installing a fan is provided on one side of the plurality of heat dissipation fins. The fan reserved slot and the CPU chip are located on opposite sides of the industrial control machine. A pair of rotationally symmetrical U-shaped grooved tubes are recessed in the middle of the bottom surface of the heat dissipation base. Suitable heat-conducting copper tubes are embedded in the U-shaped grooved tubes.

[0011] The bottom surface of the heat dissipation base is further provided with: a main heat block that contacts one side of the two heat-conducting copper tubes, a north bridge heat-conducting block that contacts one side of one of the heat-conducting copper tubes, at least one copper tube pressing sheet for encapsulating the heat-conducting copper tube in the U-shaped groove tube, and a fan threading hole that communicates with the fan reserved groove. The layout positions of the main heat block and the north bridge heat-conducting block correspond to the installation positions of the CPU chip and the north bridge chip on the PCB motherboard respectively.

[0012] One side of the bottom surface of the heat dissipation base is recessed inward to form a groove-shaped mounting cavity, and a plurality of connector sockets communicating with the mounting cavity are provided on the side wall of the heat dissipation base. One side of the bottom of the mounting cavity has an inclined portion, and a slope is provided on the top surface of the heat dissipation base. The slope and the inclined portion are provided on the front and back surfaces of the heat dissipation base in corresponding manner, and heat dissipation fins are provided on the slope.

[0013] The upper cover includes a cover plate and symmetrical supporting side plates arranged vertically downward on both sides of the cover plate. The surface of the cover plate is provided with fan blade ventilation holes corresponding to the positions of the fan reserved slots. The surface of the supporting side plate is formed with a plurality of spaced strip holes in an array along its length direction. The number and position of the strip holes correspond to the guide gaps between the plurality of heat dissipation fins.

[0014] Furthermore, the outer shell includes a bottom plate and symmetrical side baffles vertically upwardly arranged on both sides of the bottom plate, and both side edges of the bottom plate and the side baffles are provided with step slots, and one side of the bottom plate and the two side baffles is fastened with an IO baffle through the step slot, and the other side of the bottom plate and the two side baffles is fastened with a fixed sealing plate through the step slot, the height of the IO baffle is not higher than the height of the side baffle, and the height of the fixed sealing plate is higher than the height of the side baffle, and a wall-mounted plate is fixed on the outer wall of the fixed sealing plate.

[0015] Through this embedded step slot design, when the outer shell and the IO baffle, and the outer shell and the fixed cover are assembled, they can be connected tightly to the maximum extent, which ensures the firmness and stability of the overall structure and is not prone to loosening during use. Moreover, because the gap is very small, the appearance is neat and beautiful, without abnormal protrusions or convex edges.

[0016] Furthermore, the heat dissipation base is just stuck between the two supporting side plates of the upper cover, and a certain distance is maintained between the top surface of the heat dissipation base and the bottom surface of the cover plate of the upper cover. The side wall of the heat dissipation base containing the connector socket is aligned with one side edge of the cover plate, and a gap is just left between the other side wall of the heat dissipation base relative to the connector socket and the other side edge of the cover plate for the fixed sealing plate to be snapped in, and the side wall of the heat dissipation base and the upper part of the fixed sealing plate are detachably connected by a number of screws.

[0017] In this way, the heat dissipation base is embedded in the upper cover, and the heat dissipation fins outside the heat dissipation base are protected by the upper cover to prevent dust from accumulating between the heat dissipation fins and ensure the heat conduction effect of the heat dissipation fins.

[0018] Furthermore, the top end of the side baffle of the outer shell extends along its length direction to form an upwardly protruding guide rail edge, and the thickness of the guide rail edge is less than the thickness of the side baffle; the two sides of the bottom surface of the heat dissipation base are recessed inward to form a slide groove, one end of the slide groove is connected to one side wall of the heat dissipation base, and the other end of the slide groove is not connected to the other side wall of the heat dissipation base, the guide rail edge is consistent in thickness with the slide groove and slides in fit, and the height of the guide rail edge is consistent with the depth of the slide groove.

[0019] In this way, the heat dissipation base and the outer shell can be quickly assembled with the help of the guiding cooperation of the slide groove and the guide rail edge, while also ensuring the tightness of the connection between the heat dissipation base and the outer shell. It is not easy to loosen during use, and installation and disassembly are convenient.

[0020] Furthermore, recessed mounting fitting notch grooves are symmetrically provided on both sides of the upper outer wall of the side baffle of the outer shell, and downwardly extending fitting ribs are symmetrically provided on both sides of the lower part of the supporting side plate of the upper cover, the fitting ribs are suitable for forming a snap-fit ​​structure with the mounting fitting notch groove, and the fitting ribs and the mounting fitting notch groove are detachably connected by screws, and the outer wall of the supporting side plate and the outer wall of the side baffle are aligned and installed.

[0021] In this way, the outer shell and the upper cover can be quickly assembled with the help of the perfect fit between the installation fitting notch groove and the fitting rib, while also ensuring the tightness of the connection between the outer shell and the upper cover, making it less likely to loosen during use and convenient to install and disassemble.

[0022] Furthermore, the IO shield has several port holes on its surface for connecting external devices to the main and secondary PCBs. The IO shield primarily protects the I / O ports on the two PCBs, corresponding to the I / O ports on the two PCBs. It prevents external debris such as dust and water droplets from entering the device, while also preventing electromagnetic interference and maintaining system stability and security.

[0023] Furthermore, WiFi antenna holes are symmetrically positioned on both sides of the lower surface of the side panels of the outer shell for connecting external devices to the PCB, and hard drive holders are symmetrically positioned on the inner surface of the bottom panel of the outer shell for securing and mounting hard drives. In this way, the WiFi antenna holes can be used to connect external booster antennas to improve signal strength, optimize communication quality, and adapt to different usage environments and device requirements.

[0024] Furthermore, the wall-mounted plate is detachably connected to the fixed cover plate via a plurality of screws. The wall-mounted plate has outwardly extending sides and is provided with mounting holes. The bottom edge of the wall-mounted plate is aligned with the bottom surface of the base plate, and the top edge of the wall-mounted plate is aligned with the top surface of the cover plate. Using the wall-mounted plate increases the stability and safety of the device, saves space, and provides an aesthetically pleasing design, meeting the needs of smaller spaces.

[0025] Furthermore, the ratio of the heat dissipation fin height: the heat dissipation fin thickness: the distance between adjacent heat dissipation fins is 5:1:2. Such a ratio of heat dissipation fins can ensure an excellent heat dissipation effect.

[0026] Furthermore, the heat dissipation fins are in the shape of an isosceles trapezoid, narrow at the top and wide at the bottom, with thickness gradually increasing from top to bottom. Corrugated racks are formed in an array on both sides of the heat dissipation fins from top to bottom, thereby increasing the area of ​​the heat dissipation fin surface in contact with the air and further improving the heat dissipation effect.

[0027] The industrial control machine provided by the present invention can achieve the following beneficial effects: the heat generated during the operation of devices such as the CPU chip and the north bridge chip in the device is conducted to the heat dissipation base through the heat-conducting copper tube, and then the heat on the heat dissipation fins is blown to the outside of the device by the fan. The heat dissipation fins and the heat-conducting copper tube are connected to each other at the front and back sides. The heat conducted by the heat-conducting copper tube can be quickly transferred to the heat dissipation fins, and the heat dissipation fins on the surface of the heat dissipation base have a high airflow passing capacity, and when used with a low-speed fan, the heat dissipation effect is good; the device body is mainly completed by the outer shell and the upper cover that can be detachably installed, and is modularly assembled. The overall size is not too large. The internal components and heat dissipation design are compactly arranged in the device body, ensuring the neatness and beauty of the device. In addition, the device body is provided with a variety of peripheral interfaces corresponding to the two PCB boards to ensure the functionality of the interface. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is an overall structural diagram of an embodiment of a high heat dissipation embedded industrial controller of the present invention;

[0029] Figure 2 It is a longitudinal cross-sectional schematic diagram of an embodiment of a high heat dissipation embedded industrial controller of the present invention;

[0030] Figure 3 This is a disassembly diagram of an embodiment of a high heat dissipation embedded industrial controller of the present invention;

[0031] Figure 4 Schematic diagram of the high heat dissipation embedded industrial controller of the present invention with respect to the heat dissipation base from an upward perspective;

[0032] Figure 5It is a schematic diagram of the installation and matching of the upper cover and the heat dissipation base of the embedded industrial control machine with high heat dissipation performance of the present invention;

[0033] Figure 6 This is a simplified schematic diagram of the heat dissipation fins on the heat dissipation base of the embedded industrial controller with high heat dissipation performance of the present invention;

[0034] Figure 7 This is a schematic diagram of the disassembly of the outer shell of the embedded industrial controller with high heat dissipation performance according to the present invention;

[0035] Figure 8 This is a schematic diagram of the connection effect between the heat dissipation base and the outer shell of the embedded industrial controller with high heat dissipation performance of the present invention;

[0036] Related marks in the accompanying drawings: 1-outer shell, 2-upper cover, 3-PCB main board, 4-PCB sub-board, 5-heat dissipation base, 6-wall-mounted plate, 7-fan; 11-bottom plate, 12-side baffle, 13-IO baffle, 14-fixed cover plate, 15-hard disk rack; 101-step card slot, 121-guide rail edge, 122-installation fit notch slot, 123-WIFI antenna hole, 131-port hole; 21-cover plate, 22-support side plate, 21 1-fan blade ventilation hole, 221-strip hole, 222-fitting rib; 31-CPU chip, 32-North Bridge chip; 51-heat sink fin, 52-fan reserved slot, 53-U-shaped slot pipe, 54-thermal copper pipe, 55-main heat block, 56-North Bridge heat block, 57-copper tube pressing sheet, 58-fan threading hole, 59-installation cavity, 501-slope, 502-slide groove, 591-connector socket, 592-inclined part, 61-installation reserved hole. DETAILED DESCRIPTION

[0037] Unless otherwise indicated, identical or functionally identical elements are denoted by the same reference symbols in the figures.

[0038] In the description of the present invention, it should be noted that the terms "upper", "lower", "inside", "outside", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention. Unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be a communication between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] Figure 1 and Figure 2 They are respectively the overall structure diagram and longitudinal section diagram of one embodiment of a high heat dissipation embedded industrial controller, Figure 3 This is a schematic diagram of a disassembly of one embodiment of a high-heat-dissipating embedded industrial control machine. The industrial control machine comprises a modular body, primarily constructed by assembling an outer shell 1 and an upper cover 2. These can be separated and connected using screws. Both the outer shell 1 and the upper cover 2 are made of aluminum alloy and anodized to provide excellent mechanical, thermal, and antioxidant properties. The outer shell 1 is constructed as a rectangular, open-topped shell. The outer shell 1 has an interior cavity, within which are mounted a horizontally connected, upper and lower PCB mainboard 3 and PCB sub-board 4. The PCB mainboard 3 carries various core components, such as chips, processors, memory, and slots, and is responsible for connecting various hardware devices and providing data transmission and control signals. The PCB sub-board 4 is responsible for communication between the I / O buses.

[0040] A heat dissipation base 5 is detachably installed between the upper cover 2 and the PCB mainboard 3. The heat dissipation base 5 is equivalent to being hidden in the upper cover 2. The heat dissipation base 5 is preferably made of aluminum-magnesium alloy, which has the advantage of high heat dissipation.

[0041] Figure 4 is a schematic diagram of the heat dissipation substrate 5 when viewed from above. Figure 5 This is a schematic diagram of the installation and matching of the upper cover 2 and the heat dissipation base 5. Figure 4 and Figure 5 Provide explanation.

[0042] In the middle of the top surface of the heat dissipation base 5, a plurality of spaced heat dissipation fins 51 are formed in an array along its width direction, and a fan reserved slot 52 for installing the fan 7 is provided on one side of the plurality of heat dissipation fins 51, that is, the fan 7 is ultimately hidden in the plurality of heat dissipation fins 51. It is worth noting that the fan reserved slot 52 and the CPU chip 31 must be arranged on different sides of the industrial control machine respectively. If they are designed to be on the same side of the heat dissipation base, the heat generated by the CPU chip 31 cannot be smoothly conducted to the heat dissipation fins, and thus cannot be blown away by the fan 7, causing heat accumulation and affecting the heat dissipation effect.

[0043] The design of the heat sink fins 51 will affect the heat dissipation performance of the heat sink base 5. Generally speaking, the size of the heat sink base can be increased to add more or larger heat sink fins. Alternatively, the gap between the heat sink fins can be reduced or the thickness of the heat sink fins can be reduced to add more heat sink fins while keeping the volume of the heat sink base unchanged. However, both of the above methods have certain problems: increasing the heat sink base makes its volume difficult to control, which in turn increases the overall volume of the device, which is not conducive to small portable design requirements. Adding more heat sink fins will reduce the space of the guide gap, resulting in increased wind resistance, and dust is easily accumulated between the heat sink fins, both of which are not conducive to heat dissipation. Therefore, how to design a set of heat sink fin parameters that can cooperate with each other to improve the heat dissipation performance is the key. The heat sink fin parameters are spacing, thickness, and area.

[0044] Combine Figure 6 The simplified schematic diagram of the heat sink fins shown in the figure shows that the thickness of the heat sink fins gradually increases from top to bottom, and the spacing between adjacent heat sink fins gradually narrows from top to bottom to improve convection efficiency. The number of teeth of the heat sink fins in this application is designed to be 25. H represents the height of the heat sink fins, h1 represents the thickness of the top surface of the heat sink fins, h2 represents the thickness of the bottom surface of the heat sink fins, s represents the spacing between the bottoms of adjacent heat sink fins, and α represents the inclination slope of the heat sink fins, where =(h1+h2) / 2.

[0045] The heat dissipation fin design in this application satisfies: H: ∶s=5∶1∶2, α is about 3°, and preferably, H is 9 mm, h2 is 2.25 mm, then h1 is 1.35 mm, and s is 3.6 mm.

[0046] Corrugated racks can be added to the surface of the heat dissipation fins. The depth of the corrugated racks should normally be less than 0.5mm to increase the disturbance of the fluid and improve the convection heat transfer coefficient between the fins.

[0047] A pair of U-shaped groove tubes 53 are provided in the middle recess of the bottom surface of the heat dissipation base 5 in a rotationally symmetrical distribution. The U-shaped groove tubes 53 are embedded with a matching U-shaped thermal conductive copper tube 54. This layout saves space and only requires two sets of thermal conductive copper tubes. In addition, the contact area between the thermal conductive tube and the heat dissipation base is more sufficient, so that the heat absorbed by the thermal conductive copper tube 54 can be evenly transferred to the heat dissipation fins 51 on the front of the heat dissipation base 5.

[0048] The middle of the bottom surface of the heat dissipation base 5 is detachably fixed with a main heat block 55 by screws, and the main heat block 55 is in contact with an inner side edge of the two heat-conducting copper tubes 54. A north bridge heat-conducting block 56 is detachably fixed to one side of the bottom surface of the heat dissipation base 5 by screws, and the north bridge heat-conducting block 56 is in contact with an outer side edge of one of the heat-conducting copper tubes 54. The bottom surface of the heat dissipation base 5 is also detachably fixed with multiple copper tube pressing sheets 57 by screws. The copper tube pressing sheets are used to encapsulate the heat-conducting copper tubes in the U-shaped groove tube. The layout positions of the main heat block 55 and the north bridge heat-conducting block 56 are respectively corresponding to the heat dissipation base 5. In accordance with the installation positions of the CPU chip 31 and the north bridge chip 32 on the PCB main board 3, after the heat dissipation base 5 and the PCB main board 3 are detachably fixedly connected by screws, the thickness design of the main heat block 55, the north bridge heat conducting block 56, and the copper tube pressing plate 57 needs to meet the requirements of being able to perfectly stick to the CPU chip 31, the north bridge chip 32 and other corresponding devices on the PCB main board 3 so as to absorb the heat generated when the devices are running. Therefore, the main heat block 55, the north bridge heat conducting block 56, and the copper tube pressing plate 57 are also made of heat-conducting metal materials, such as copper.

[0049] Heat dissipation effect comparison experimental group:

[0050] Test Group 1: The CPU has no cooling fan, heat sink, or any other auxiliary cooling measures.

[0051] Test Group 2: The CPU has auxiliary heat dissipation measures such as the heat dissipation substrate and the main heat block as described in the embodiment of the present application, that is, the CPU is in contact with the heat dissipation substrate through the main heat block.

[0052] Test Group 3: The CPU has auxiliary heat dissipation measures such as the main heat block, thermal copper tube, heat dissipation base, and fan as described in the above embodiments of the present application. The heat transfer relationship is CPU--main heat block--thermal copper tube--heat dissipation base--fan.

[0053] Test conditions and instructions: All three test groups were tested at room temperature of 27.5°C. The CPUs in all three test groups ran the same task for 10 minutes. HWMonitor software was used to monitor the CPU temperature in real time. The minimum, maximum, and average CPU temperatures were measured.

[0054] The test results are as follows Table 1: CPU temperature comparison table of three test groups

[0055]

[0056] It can be seen that the auxiliary heat dissipation measures provided in the embodiments of the present application can significantly improve the heat dissipation performance of the CPU.

[0057] In addition, a fan wire threading hole 58 is provided on one side of the bottom surface of the heat dissipation base 5. The fan wire threading hole 58 is communicated with the fan reserved slot 52. The fan wire threading hole 58 is mainly for facilitating the wiring harness of the fan 7 to pass downward through the heat dissipation base 5 and then connect with the PCB main board 3. The wiring is relatively concealed and simple.

[0058] In order to add more expansion interfaces but not occupy the internal space of the industrial control machine, the present application considers opening an inwardly recessed installation cavity 59 on one side of the bottom surface of the heat dissipation base 5 to form a long groove. The installation cavity is consistent with the layout direction of the heat dissipation fins, that is, both extend along the width direction of the heat dissipation base. Accordingly, three connector sockets 591 connected to the installation cavity 59 are opened on the side wall of the heat dissipation base 5 to facilitate the installation of expansion connectors, that is, the peripheral expansion connector is hidden in the installation cavity and will not protrude downward from the bottom surface of the heat dissipation base.

[0059] The heat absorbed by the thermally conductive copper tube may be conducted from the side of the mounting cavity to the mounting cavity through the heat dissipation base, resulting in excessively high temperature in the mounting cavity and being unfavorable for the use of the peripheral expansion connector. Therefore, the present application sets an inclined portion 592 along its length direction at the inner side of the bottom of the mounting cavity 59 (that is, close to the middle body of the heat dissipation base), and sets a slope 501 on the top surface of the heat dissipation base 5. The slope 501 and the inclined portion 592 are arranged correspondingly on the front and back sides of the heat dissipation base 5. It is worth noting that there is also at least one heat dissipation fin 51 on the slope 501. In this way, when the heat absorbed by the thermally conductive copper tube is conducted to the inclined portion, due to the arrangement of the heat dissipation fins on the slope, the heat will be transferred to the heat dissipation fin, thereby preventing heat from being dissipated into the mounting cavity.

[0060] like Figure 7 Figure 1 shows a disassembled schematic diagram of the outer shell 1. The outer shell 1 is primarily assembled from a base plate 11, side panels 12, an IO panel 13, and a fixed cover plate 14. Two side panels 12 are positioned vertically upward on either side of the base plate 11, and the base plate 11 and side panels 12 are integrally formed. However, since the IO panel must mate with the interface on the PCB, its design requires customization, making it inconvenient to manufacture it integrally with the base plate 11 and difficult to produce. Similarly, like the IO panel 13, the fixed cover plate 14 also requires subsequent welding and fixation to the base plate 11.

[0061] In order to ensure the neat and beautiful appearance of the outer shell 1 and avoid abnormalities such as raised connecting edges, an embedded snap-in design will be adopted, that is, concave step slots 101 are provided on both side edges of the bottom plate 11 and both side edges of the side baffle 12. The recessed depth of the step slots 101 is consistent with the thickness of the IO baffle 13 and the fixed sealing plate 14. In this way, the IO baffle 13 and the fixed sealing plate 14 are respectively snapped into the step slots 101 on both sides of the outer shell 1 to form a tight connection, and then welded. On the one hand, it can ensure the firmness and stability of the connection, and on the other hand, it can reduce the possible connection gaps, so that the side edges of the outer shell present a more straight shape.

[0062] The surface of the IO baffle 13 is provided with several port holes 131 for connecting external devices to the PCB main board 3 and the PCB sub-board 4. These port holes include but are not limited to serial ports, USB ports, video output interfaces, Ethernet ports, digital I / O ports, VGA interfaces, CAN bus interfaces, etc. The IO baffle is mainly used to protect the components of the I / O interfaces on the two PCB boards. It corresponds to the I / O interfaces on the two PCB boards, preventing external dust, water droplets and other debris from entering the device. At the same time, it can also prevent electromagnetic interference and maintain the stability and security of the system.

[0063] Additionally, WiFi antenna holes 123 are symmetrically positioned on the lower surface of the side panels 12 of the outer housing 1 for connecting external devices to the PCB 3. Hard drive holders 15 are symmetrically positioned on the inner surface of the bottom panel of the outer housing 1 for securing and mounting hard drives, saving space. In this way, the WiFi antenna holes can be used to connect external booster antennas to improve signal strength, optimize communication quality, and adapt to different usage environments and device requirements.

[0064] In other embodiments, a wall-mounted plate 6 may be added to the industrial control machine to improve its practicality. The wall-mounted plate 6 is detachably connected to the fixed cover plate 14 via a plurality of screws. Both sides of the wall-mounted plate 6 extend outward and are provided with mounting holes 61 on the surface. The bottom edge of the wall-mounted plate 6 is aligned with the bottom surface of the base plate 11, and the top edge of the wall-mounted plate 6 is aligned with the top surface of the upper cover 2. The wall-mounted plate increases the stability and safety of the equipment, saves space, and is aesthetically pleasing, meeting the needs of smaller spaces. Furthermore, once installed, the wall-mounted plate is not obtrusive and is relatively neat.

[0065] Recombination Figure 5As shown, the upper cover 2 is mainly composed of a cover plate 21 and supporting side plates 22. There are two supporting side plates 22 arranged vertically downward on both sides of the cover plate 21, and the cover plate 21 and the supporting side plates 22 are integrally formed. The surface of the cover plate 21 is provided with fan blade ventilation holes 211 corresponding to the positions of the fan reserved slots 52. In this way, the fan 7 can blow the heat absorbed by the heat dissipation fins 51 into the air through the fan blade ventilation holes 211 to complete the heat dissipation.

[0066] Correspondingly, a plurality of spaced strip holes 221 are formed in an array along the length direction of the support side plate 22. The number and position of the strip holes 221 correspond to the guide gaps between the plurality of heat dissipation fins 51. When the fan 7 is working, part of the blown wind will also flow horizontally in the guide gaps between the heat dissipation fins and flow to the outside of the equipment through the strip holes 221, so that the gas flowability is good.

[0067] The heat dissipation base 5 is hidden in the upper cover 2, so that the upper cover 2 is used to protect the heat dissipation fins 51, avoid dust accumulation between the heat dissipation fins, and ensure the heat conduction effect of the heat dissipation fins. Specifically, the heat dissipation base 5 is just stuck between the two supporting side plates 22 of the upper cover 2, and a certain distance is retained between the top surface of the heat dissipation base 5 and the bottom surface of the cover plate 21 of the upper cover 2 to prevent heat from being concentrated on the bottom surface of the cover plate and not being effectively dissipated.

[0068] Some installation details, such as the side wall of the heat dissipation base 5 containing the connector socket 591 is aligned with one side of the cover plate 21, and there is just a gap between the other side wall of the heat dissipation base 5 relative to the connector socket 591 and the other side of the cover plate 21 for the fixed sealing plate 14 to be snapped in. In other words, the width of the heat dissipation base 5 is slightly smaller than the width of the cover plate 21, and the side wall of the heat dissipation base 5 and the upper part of the fixed sealing plate 14 are detachably connected by a number of screws.

[0069] Figure 8 The figure shows a connection effect between the heat dissipation base 5 and the outer shell 1. The top of the side baffle 12 of the outer shell 1 extends along its length to form an upwardly protruding guide rail 121. The thickness of the guide rail 121 is less than that of the side baffle 12. The bottom surface of the heat dissipation base 5 is recessed on both sides to form a slide groove 502. One end of the slide groove 502 is connected to a side wall of the heat dissipation base 5, while the other end of the slide groove 502 is not connected to the other side wall of the heat dissipation base 5. The guide rail 121 and the slide groove 502 are of the same thickness and slide together. The height of the guide rail 121 is consistent with the depth of the slide groove 502.

[0070] In this way, during the assembly of the heat dissipation base 5, with the help of the guiding cooperation of the slide groove 502 and the guide rail edge 121, the heat dissipation base 5 can be quickly slid horizontally from one side of the outer shell 1 and clamped on the outer shell 1, thereby completing the rapid assembly. The installation position is accurate and tight, ensuring that it is not easy to loosen during use. After the assembly is completed, the fixed connection between the fixed sealing plate 14 and the heat dissipation base 1 is completed.

[0071] Combine Figure 5 and Figure 8 As shown, after the heat dissipation base 5 and the outer shell 1 are assembled, it is necessary to be able to accurately cover the upper cover 2. In this application, recessed installation fitting notch grooves 122 are symmetrically arranged on both sides of the upper outer wall of the side baffle 12 of the outer shell 1, and downwardly extending fitting ribs 222 are symmetrically arranged on both sides of the lower part of the supporting side plate 22 of the upper cover 2. The fitting ribs 222 are suitable for forming a snap-fit ​​structure with the installation fitting notch grooves 122, and the fitting ribs 222 and the installation fitting notch grooves 122 are detachably connected by screws, and the outer wall of the supporting side plate 22 and the outer wall of the side baffle 12 are aligned and installed.

[0072] In this way, the outer shell 1 and the upper cover 2 can be quickly assembled with the help of the perfect fit between the installation fitting notch groove 122 and the fitting rib 222, while also ensuring the tightness of the connection between the outer shell 1 and the upper cover 2, making it less likely to become loose during use, and convenient installation and disassembly. In addition, the outer wall of the supporting side panel 22 is aligned with the outer wall of the side baffle 12, ensuring that the appearance of the equipment looks smoother and more beautiful.

[0073] Compared with the prior art, the industrial control machine of this application has the following beneficial effects:

[0074] The device body is mainly composed of an outer shell and a detachable upper cover, which is modularly assembled. The overall size is not too large. The internal components and heat dissipation substrate are compactly arranged in the device body, ensuring the neatness and beauty of the device. In addition, the device body is equipped with a variety of peripheral interfaces corresponding to the two PCB boards to ensure the functionality of the interface.

[0075] The heat generated during the operation of the CPU chip, north bridge chip and other devices in the device is conducted to the heat dissipation base through the thermal copper tube, and then the fan blows the heat on the heat dissipation fins to the outside of the device. The heat dissipation fins and the thermal copper tube are connected to each other at the front and back sides. The heat conducted by the thermal copper tube can be quickly transferred to the heat dissipation fins. The heat dissipation fins on the surface of the heat dissipation base have a high airflow capacity, and when used with a low-speed fan, the heat dissipation effect is good.

[0076] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, which all fall within the scope of protection of the present invention.

Claims

1. A modular embedded industrial controller with high heat dissipation performance, characterized by: The industrial control machine comprises an outer shell (1) having an inner cavity, an upper cover (2) detachably fixedly mounted on the top of the outer shell (1), and a PCB main board (3) and a PCB sub-board (4) mounted in the inner cavity of the outer shell (1) in an upper and lower separated manner, the PCB main board (3) and the PCB sub-board (4) being electrically connected, and a CPU chip (31) and a north bridge chip (32) being electrically connected to the PCB main board (3); A heat dissipation base (5) is detachably mounted between the upper cover (2) and the PCB mainboard (3), and a plurality of spaced heat dissipation fins (51) are formed in an array along the width direction in the middle of the top surface of the heat dissipation base (5), and a fan reserved slot (52) for installing a fan (7) is provided on one side of the plurality of heat dissipation fins (51), and the fan reserved slot (52) and the CPU chip (31) are respectively located on the opposite side of the industrial control machine; a pair of rotationally symmetrical U-shaped groove tubes (53) are provided in the middle of the bottom surface of the heat dissipation base (5), and an adapted heat-conducting copper tube (54) is embedded in the U-shaped groove tube (53); the heat dissipation fin height: heat dissipation fin thickness: spacing between adjacent heat dissipation fins is 5:1:2; The bottom surface of the heat dissipation base (5) is further provided with: a main heat block (55) that contacts one side of the two heat-conducting copper tubes (54), a north bridge heat-conducting block (56) that contacts one side of one of the heat-conducting copper tubes, at least one copper tube pressing sheet (57) for encapsulating the heat-conducting copper tube in the U-shaped groove tube (53), and a fan threading hole (58) that communicates with the fan reserved groove (52). The layout positions of the main heat block (55) and the north bridge heat-conducting block (56) respectively correspond to the installation positions of the CPU chip (31) and the north bridge chip (32) on the PCB mainboard (3), and the main heat block (55) and the north bridge heat-conducting block (56) also contact the CPU chip (31) and the north bridge chip (32) respectively. One side of the bottom surface of the heat dissipation base (5) is recessed inward to form a groove-shaped mounting cavity (59), and a plurality of connector sockets (591) communicating with the mounting cavity (59) are provided on the side wall of the heat dissipation base (5), an inner side of the mounting cavity (59) has an inclined portion (592), and a slope (501) is provided on the top surface of the heat dissipation base (5), the slope (501) and the inclined portion (592) are provided on the front and back surfaces of the heat dissipation base (5), and heat dissipation fins (51) are provided on the slope (501); The upper cover (2) comprises a cover plate (21) and symmetrical supporting side plates (22) arranged vertically downward on both sides of the cover plate (21); the surface of the cover plate (21) is provided with fan blade ventilation holes (211) corresponding to the positions of the fan reserved slots (52); the surface of the supporting side plates (22) is formed with a plurality of spaced strip holes (221) in an array along its length direction; the number and position of the strip holes (221) correspond to the guide gaps between the plurality of heat dissipation fins (51); The outer shell (1) comprises a bottom plate (11) and symmetrical side baffles (12) vertically arranged on both sides of the bottom plate (11), both sides of the bottom plate (11) and both sides of the side baffles (12) are provided with step slots (101), one side of the bottom plate (11) and the two side baffles (12) is fastened with an IO baffle (13) through the step slots (101), and the other side of the bottom plate (11) and the two side baffles (12) is fastened with a fixed sealing plate (14) through the step slots (101), the height of the IO baffle (13) is not higher than the height of the side baffles (12), the height of the fixed sealing plate (14) is higher than the height of the side baffles (12), and a wall hanging plate (6) is fixed on the outer wall of the fixed sealing plate (14); The heat dissipation base (5) is just stuck between the two supporting side plates (22) of the upper cover (2), and a certain distance is kept between the top surface of the heat dissipation base (5) and the bottom surface of the cover plate (21) of the upper cover (2). The side wall of the heat dissipation base (5) containing the connector socket (591) is aligned with one side edge of the cover plate (21), and a gap is just left between the other side wall of the heat dissipation base (5) relative to the connector socket (591) and the other side edge of the cover plate (21) for the fixed sealing plate (14) to be fastened, and the side wall of the heat dissipation base (5) and the upper part of the fixed sealing plate (14) are detachably connected by a plurality of screws. The top end of the side baffle (12) of the outer shell (1) extends along its length direction to form an upwardly protruding guide rail edge (121), and the thickness of the guide rail edge (121) is less than the thickness of the side baffle (12); the two sides of the bottom surface of the heat dissipation base (5) are recessed inward to form a slide groove (502), one end of the slide groove (502) is connected to a side wall of the heat dissipation base (5), and the other end of the slide groove (502) is not connected to the other side wall of the heat dissipation base (5), the guide rail edge (121) and the slide groove (502) have the same thickness and are slidably matched, and the height of the guide rail edge (121) is consistent with the depth of the slide groove (502).

2. The modular embedded industrial controller with high heat dissipation according to claim 1, characterized in that: The outer wall of the side baffle (12) of the outer shell (1) is symmetrically provided with recessed mounting fitting notch grooves (122) on both sides of the upper portion, and the lower portion of the supporting side plate (22) of the upper cover (2) is symmetrically provided with downwardly extending fitting ribs (222), the fitting ribs (222) are suitable for forming a snap-fit ​​structure with the mounting fitting notch groove (122), and the fitting ribs (222) and the mounting fitting notch groove (122) are detachably connected by screws, and the outer wall of the supporting side plate (22) and the outer wall of the side baffle (12) are aligned and installed.

3. The modular embedded industrial controller with high heat dissipation according to claim 1, characterized in that: The surface of the IO baffle (13) is provided with a plurality of port holes (131) for connecting external devices to the PCB main board (3) and the PCB sub-board (4).

4. The modular embedded industrial controller with high heat dissipation according to claim 1, characterized in that: WIFI antenna holes (123) are symmetrically provided on both sides of the lower surface of the side baffle (12) of the outer shell (1) for connecting external devices to the PCB main board (3), and a hard disk rack (15) is symmetrically provided on the inner surface of the bottom plate (11) of the outer shell (1) for fixing and installing the hard disk.

5. The modular embedded industrial controller with high heat dissipation according to claim 1, characterized in that: The wall-mounted plate (6) and the fixed cover plate (14) are detachably connected by a plurality of screws. Both sides of the wall-mounted plate (6) extend outward and are provided with mounting holes (61) on the surface. The bottom edge of the wall-mounted plate (6) is aligned with the bottom surface of the bottom plate (11), and the top edge of the wall-mounted plate (6) is aligned with the top surface of the cover plate (21).

6. The modular embedded industrial controller with high heat dissipation according to claim 1, characterized in that: The heat dissipation fins (51) are in the shape of an isosceles trapezoid that is narrow at the top and wide at the bottom, and the thickness gradually increases from top to bottom, and the two side surfaces of the heat dissipation fins are formed with corrugated racks in an array from top to bottom.

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