Rotor lifting mechanism and semiconductor equipment

Abstract

The present invention provides a rotor lifting mechanism and semiconductor equipment, wherein the rotor lifting mechanism includes a rotor assembly and a lifting assembly; the rotor assembly is arranged in a chamber body, the rotor assembly includes a rotor base and a rotor cover sleeved in the rotor base, the rotor base can rotate relative to the rotor cover, the inner wall of the rotor base is provided with a first positioning pin and a second positioning pin extending toward the bottom of the rotor cover, and the bottom of the rotor cover is provided with a positioning hole, a first avoidance hole and a second avoidance hole; the lifting assembly includes a driving device and an adapter provided on the driving device, the driving device is located outside the chamber body, the adapter is slidably connected to the bottom of the chamber body, the driving device is used to drive the adapter to move vertically to contact the rotor cover, and drive the rotor cover to move axially along the rotor base. Through the rotor assembly and the lifting assembly, in a vacuum environment without opening a cavity, the distance between the wafer and the water cooling assembly can be changed to achieve different cooling requirements.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor manufacturing, and more particularly, relates to a rotor lifting mechanism and semiconductor equipment. Background Art

[0002] Currently, rapid thermal processing (RTP) is a wafer heat treatment method with extremely fast heating rates and short hold times. RTP can achieve heating rates of 100 to 300 degrees Celsius per second. Rapid thermal processing is a process used in semiconductor manufacturing. For example, the ISSG process, an in-situ steam oxidation process, utilizes the strong oxidizing effect of atomic oxygen generated during the ISSG reaction to fully repair the Si / SiO2 interface, reducing defects in the resulting oxide film and effectively improving film quality and electrical properties. In-situ steam generation (ISSG) processes can be categorized as either soaking or not, using either the soaking stage or the spike stage. The SPIKE process presents a new challenge for RTP equipment, requiring a direct and rapid cooling process without a soaking stage.

[0003] like Figure 1 and Figure 2 The figure shows the chamber structure of a common RTP system. It includes chamber 10, edge ring 11, support ring 12, limiting posts 13, water-cooling assembly 14, water-cooling base 15, and magnetic levitation rotor 16. In this structure, chamber 10 provides the internal environment for the entire process. The edge ring 11, support ring 12, and magnetic levitation rotor 16 together form the wafer support mechanism, providing support. Limiting posts 13 ensure the center position of support ring 12 after installation. The magnetic levitation rotor 16 and magnetic levitation stator (not shown) enable wafer rotation. The water-cooling base 15 and reflector plate together provide a support base for the wafer. The water-cooling base 15 contains a water channel, which serves as the primary cooling source for the wafer during the cooling phase. Ejector pins 17 and a lifting mechanism 18 enable the wafer to be raised and lowered relative to the edge ring, ensuring wafer transportability.

[0004] In the SPIKE process, after the wafer is heated, the heat source is turned off, and the wafer begins cooling immediately. Under existing structures, the primary methods for cooling the wafer are convection and radiation. In a vacuum environment, radiation is the primary method, and the magnitude of the heat radiation is primarily influenced by three factors: The first is the temperature and radiation area of ​​the radiating object: the higher the object's temperature, the more heat it radiates; the larger the radiation area, the more heat is radiated to the surrounding environment. The second is the distance between the radiating heat source and the radiated object: the closer the distance, the more heat the radiated object receives; the farther the distance, the less heat it receives. The third is the relative position of the radiating object and the radiated object: the radiated object receives the highest heat when the radiating surface is parallel to the radiated object. Considering these three influencing factors, factors one and three are currently fixed and immutable. Factor two is the primary means of changing the existing cooling rate, namely, changing the distance between the wafer and the water-cooled base 15.

[0005] Through simulation, we found that by reducing the distance between the wafer and the water-cooled base 15 below, the cooling time can be significantly shortened while having little effect on the temperature rise, as shown in the following table:

[0006]

[0007] In summary, the closer the distance between the wafer and the water-cooled base 15, the faster the cooling, and vice versa. To meet the different cooling rate requirements of the process, the current method is generally to change the design height of the support ring 12. However, due to the thin barrel structure of the support ring 12, the material is fragile and expensive. In addition, to replace the support ring, the cavity needs to be opened, which is cumbersome and time-consuming, and is very likely to cause contamination. From the perspective of equipment use, it is costly, inconvenient and time-consuming. Summary of the Invention

[0008] The purpose of the embodiments of the present invention is to provide a rotor lifting mechanism and semiconductor equipment, aiming to solve the problem in the prior art that the cooling rate is adjusted by replacing support rings of different heights, which increases costs, and the cavity operation is not only time-consuming but also easily causes pollution.

[0009] To achieve the above-mentioned purpose, according to a first aspect of the present invention, a rotor lifting mechanism is provided, which is applied to semiconductor equipment. The semiconductor equipment includes a chamber body, and the rotor lifting mechanism includes a rotor assembly and a lifting assembly; the rotor assembly is arranged in the chamber body, and the rotor assembly includes a rotor base and a rotor cover sleeved in the rotor base, the rotor base can rotate relative to the rotor cover, and the inner wall of the rotor base is provided with a first positioning pin and a second positioning pin extending toward the bottom of the rotor cover, and the bottom of the rotor cover is provided with a positioning hole, a first avoidance hole and a second avoidance hole; when the first positioning pin is inserted into the positioning hole , the rotor base is in the first position, the second positioning pin is inserted into the second avoidance hole, and the upper surface of the rotor cover is flush with the upper surface of the rotor base; when the second positioning pin is inserted into the positioning hole, the rotor base is in the second position, the first positioning pin is inserted into the first avoidance hole, and the upper surface of the rotor cover protrudes from the upper surface of the rotor base; the lifting assembly includes a driving device and an adapter provided on the driving device, the driving device is located outside the chamber body, the adapter is slidably connected to the bottom of the chamber body, and the driving device is used to drive the adapter to move vertically to contact the rotor cover, and drive the rotor cover to move axially along the rotor base.

[0010] Optionally, a radial flange is provided on the inner wall of the rotor base, and the first positioning pin and the second positioning pin are provided on the radial flange, and the second positioning pin is higher than the first positioning pin.

[0011] Optionally, the adapter includes a connecting rod and two drive rods, the two drive rods are slid through the bottom of the chamber body, the connecting rod is located outside the chamber body, one end of the two drive rods is respectively connected to the two ends of the connecting rod, and the other end of the two drive rods is used to contact the rotor cover.

[0012] Optionally, two sliding holes are provided at the bottom of the chamber body, and the driving rod slides through the sliding holes.

[0013] Optionally, the drive rod sleeve is provided with a bellows, and the bellows is located between the connecting rod and the bottom of the chamber body.

[0014] Optionally, the inner wall of the rotor upper cover is provided with an axial flange extending toward the bottom of the rotor upper cover, and the driving rod can contact the axial flange to move the rotor upper cover upward.

[0015] Optionally, two supporting holes are provided at the bottom of the axial flange, and the supporting holes are used to insert the driving rod.

[0016] Optionally, the support hole and the driving rod are clearance-matched.

[0017] Optionally, the driving device is a cylinder.

[0018] According to a second aspect of the present invention, a semiconductor device is provided, comprising the rotor lifting mechanism according to any one of the first aspects.

[0019] Compared with the prior art, the rotor lifting mechanism and semiconductor equipment provided by the present invention have the following beneficial effects:

[0020] (1) By forming a non-integrated structure of the rotor base and the rotor cover, the rotor cover and the rotor base can be assembled at different positions to obtain rotor assemblies of different heights, thereby achieving different relative distances between the wafer and the water-cooling assembly and achieving different cooling rates;

[0021] (2) By setting up a lifting assembly, the rotor cover and the rotor base can be changed to different installation positions in a vacuum environment without opening the cavity, thus avoiding the contamination caused by opening the cavity;

[0022] (3) Simple structure, low cost, easy to implement, and convenient to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 This is a schematic diagram of the chamber structure of a common RTP device;

[0025] Figure 2 A cross-sectional view of the chamber structure of a common RTP device;

[0026] Figure 3 A schematic structural diagram of a semiconductor device with a rotor lifting mechanism provided by an embodiment of the present invention;

[0027] Figure 4 A schematic structural diagram of a rotor base provided in an embodiment of the present invention;

[0028] Figure 5 A schematic structural diagram of a rotor upper cover provided in an embodiment of the present invention;

[0029] Figure 6 A schematic diagram of the assembly structure of the rotor base and the rotor cover provided in an embodiment of the present invention (when the upper surface of the rotor cover is flush with the upper surface of the rotor base);

[0030] Figure 7 Schematic diagram of the assembly structure of the rotor base and rotor cover provided in an embodiment of the present invention (the upper surface of the rotor cover protrudes 1 mm from the upper surface of the rotor base);

[0031] Figure 8Schematic diagram of the assembly structure of the rotor base and the rotor cover provided in an embodiment of the present invention (the upper surface of the rotor cover protrudes from the upper surface of the rotor base by mm).

[0032] The reference numerals used in the above drawings are as follows:

[0033] 10. Chamber; 11. Edge ring; 12. Support ring; 13. Limiting column; 14. Water cooling assembly; 15. Water cooling base; 16. Magnetic levitation rotor; 17. Ejector pin; 18. Lifting mechanism;

[0034] 19. Chamber body;

[0035] 20. Rotor base; 201. First positioning pin; 202. Second positioning pin; 203. Third positioning pin; 204. Radial flange;

[0036] 21. Rotor cover; 211. Positioning hole; 212. First avoidance hole; 213. Second avoidance hole; 214. Axial flange; 215. Support hole;

[0037] 22. Magnetic levitation stator; 23. Connecting rod; 24. Driving rod; 25. Bellows; 26. Cylinder. DETAILED DESCRIPTION

[0038] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0039] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or indirectly connected to the other element. The embodiments of the present invention and the features described in the embodiments may be combined with each other unless there is a conflict. The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

[0040] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means more than two, unless otherwise specifically defined.

[0042] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.

[0043] See also Figure 3 As shown, in order to solve the above problems, according to one aspect of the present invention, an embodiment of the present invention provides a rotor lifting mechanism, which is applied to semiconductor equipment. The semiconductor equipment includes a chamber body 19, and the rotor lifting mechanism includes a rotor assembly and a lifting assembly; the rotor assembly is arranged in the chamber body 19, and the rotor assembly includes a rotor base 20 and a rotor cover 21 sleeved in the rotor base 20, and the rotor base 20 can rotate relative to the rotor cover 21. The inner wall of the rotor base 20 is provided with a first positioning pin 201 and a second positioning pin 202 extending toward the bottom of the rotor cover 21, and the bottom of the rotor cover 21 is provided with a positioning hole 211, a first avoidance hole 212 and a second avoidance hole 213; the first positioning pin 201 is inserted into the positioning hole 213, and the first avoidance hole 213 is inserted into the positioning hole 213. When the second positioning pin 202 is inserted into the positioning hole 211, the rotor base 20 is in the first position, the second positioning pin 202 is inserted into the second avoidance hole 213, and the upper surface of the rotor cover 21 is flush with the upper surface of the rotor base 20; when the second positioning pin 202 is inserted into the positioning hole 211, the rotor base 20 is in the second position, the first positioning pin 201 is inserted into the first avoidance hole 212, and the upper surface of the rotor cover 21 protrudes from the upper surface of the rotor base 20; the lifting assembly includes a driving device and an adapter provided on the driving device, the driving device is located outside the chamber body 19, the adapter is slidably connected to the bottom of the chamber body 19, and the driving device is used to drive the adapter to move vertically to contact the rotor cover 21, and drive the rotor cover 21 to move axially along the rotor base 20. For example, Figure 3The semiconductor device shown includes a chamber body 19, which has a chamber 10, an edge ring 11, a support ring 12, a limiting column 13, a water-cooling assembly 14, a water-cooling base 15 and a rotor assembly arranged inside the chamber 10. The edge ring 11, the support ring 12 and the rotor assembly together constitute a support mechanism for the wafer, providing support. The limiting column 13 is used to ensure the center position of the support ring 12 after installation; the rotor assembly and the magnetic levitation stator 22 can realize the wafer rotation function, and the water-cooling base 15 and the reflector plate together provide a wafer bearing position, wherein the water-cooling base 15 has a water channel inside, which is the main cooling source for the wafer during the cooling stage. When the rotor upper cover 21 needs to be raised, the driving device drives the adapter to move vertically upward to move the adapter upward. When the adapter contacts the bottom of the rotor upper cover 21, it drives the rotor upper cover 21 to move upward. At this time, the rotor upper cover 21 is separated from the rotor base 20; when the rotor upper cover 21 needs to be lowered, the driving device drives the adapter to move vertically downward to drive the adapter and the rotor upper cover 21 to move downward. At this time, the positioning hole 211 of the rotor upper cover 21 corresponds to the first positioning pin 201 or the second positioning pin 202. When the positioning hole 211 is fully inserted into the first positioning pin 201 or the second positioning pin 202, the rotor upper cover 21 and the rotor base 20 are installed. When the distance between the wafer and the water-cooling assembly 14 needs to be adjusted (closer or farther), the adjustment is performed in the following steps: ① The driving device drives the adapter to move vertically upward to move the adapter upward. When the adapter contacts the rotor cover 21, the adapter drives the rotor cover 21 to rise together. At this time, the positioning hole 211 on the rotor cover 21 is disengaged from the first positioning pin 201 or the second positioning pin 202 on the rotor base 20 to which it is assembled, that is, the rotor cover is raised; ② Using the magnetic suspension stator 22, the rotor base 20 is rotated to a preset position. ③ After the rotor base 20 is rotated to the correct position, the drive device drives the adapter and the rotor cover 21 to move downward. At this time, the first positioning pin 201 or the second positioning pin 202 on the rotor base 20 corresponds to the positioning hole 211 of the rotor cover 21. If it continues to descend, the rotor cover 21 and the rotor base 20 are installed. At this time, the edge ring 11 on the support ring 12 and the wafer complete the relative distance adjustment with the water cooling assembly 14. Through the above operations, the change of the cooling rate is completed without opening the cavity. It can be understood that the rotor base 20 and the rotor cover 21 are both annular structures.In this embodiment, the number of the first positioning pins 201, the second positioning pins 202, the positioning holes 211, the first avoidance holes 212, and the second avoidance holes 213 are respectively multiple, and the number of the first positioning pins 201, the second positioning pins 202, the positioning holes 211, the first avoidance holes 212, and the second avoidance holes 213 are all the same. The multiple first positioning pins 201 and the multiple second positioning pins 202 are respectively evenly distributed along the circumference of the rotor base 20, the multiple positioning holes 211, the multiple first avoidance holes 212, and the multiple second avoidance holes 213 are respectively evenly distributed along the circumference of the rotor cover 21, the multiple first positioning pins 201 and the multiple second positioning pins 202 are respectively arranged in one-to-one correspondence with the multiple positioning holes 211, the multiple first positioning pins 201 are also arranged in one-to-one correspondence with the multiple first avoidance holes 212, and the multiple second positioning pins 202 are also arranged in one-to-one correspondence with the multiple second avoidance holes 213.

[0044] See also Figure 4 As shown, in another embodiment, a third positioning pin 203 can be further provided on the rotor base 20. By providing a variety of positioning pins and combining them with the positioning holes, the rotor assembly can be made to reach a variety of different heights. For example, when the upper surface of the rotor cover 21 is flush with the upper surface of the rotor base 20, the rotor base 20 is in the first position, the first positioning pin 201 is inserted into the positioning hole 211, the second positioning pin 202 is inserted into the second avoidance hole 213, and the third positioning pin 203 is inserted into the third avoidance hole (not shown in the figure); when the upper surface of the rotor cover 21 protrudes 1 mm from the upper surface of the rotor base 20, the rotor base 20 is in the second position (the arc angle between the first position and the second position is 60°), and the second positioning pin 202 is inserted into the third avoidance hole 213. Insert the first positioning pin 201 into the first avoidance hole 212, and the third positioning pin 203 into the third avoidance hole (not shown in the figure); when the upper surface of the rotor cover 21 protrudes 2mm from the upper surface of the rotor base 20, the rotor base 20 is in the third position (the arc angle between the first position and the third position is 120°), the third positioning pin 203 is inserted into the positioning hole 211, the first positioning pin 201 is inserted into the first avoidance hole 212, and the second positioning pin 202 is inserted into the second avoidance hole 213, see Figures 6 and 7 shown.

[0045] By applying the above technical solution of the present invention, a non-integrated structure is formed by the rotor base 20 and the rotor cover 21, so that rotor assemblies with different heights can be obtained after the rotor cover 21 and the rotor base 20 are assembled at different positions, thereby achieving different relative distances between the wafer and the water-cooling assembly 14, and achieving the effect of different cooling rates; by setting a lifting assembly, the change of different installation positions of the rotor cover 21 and the rotor base 20 is achieved in a vacuum environment without opening a cavity, thereby avoiding the pollution caused by opening a cavity; the structure of the present invention is simple, the cost is low, it is easy to implement, and it is convenient to operate.

[0046] See also Figure 4 As shown, in this embodiment, the inner wall of the rotor base 20 is provided with a radial flange 204, and the first locating pin 201 and the second locating pin 202 are provided on the radial flange 204, with the second locating pin 202 being higher than the first locating pin 201. Due to the different heights of the second locating pin 202 and the first locating pin 201, after the locating holes 211 are respectively assembled with the second locating pin 202 and the first locating pin 201, the rotor assembly can be ensured to reach different heights.

[0047] See also Figure 3 As shown, in this embodiment, the adapter includes a connecting rod 23 and two drive rods 24. The two drive rods 24 are slidably disposed through the bottom of the chamber body 19. The connecting rod 23 is located outside the chamber body 19. One end of the two drive rods 24 is connected to the two ends of the connecting rod 23, and the other ends of the two drive rods 24 are configured to contact the rotor cover 21. The drive rods 24 are disposed through the chamber body 19, with one end located outside the chamber 10 and the other end located inside the chamber 10. Driven by a driving device, the connecting rod 23 causes the drive rods 24 to move up and down in a vertical direction.

[0048] In this embodiment, two sliding holes (not shown) are provided at the bottom of the chamber body 19, and the drive rod 24 slides through the sliding holes. By providing the sliding holes at the bottom of the chamber body 19, the drive rod 24 slides along the through holes.

[0049] See also Figure 3 As shown, in this embodiment, the drive rod 24 is sheathed with a bellows 25, which is located between the connecting rod 23 and the bottom of the chamber body 19. The bellows 25 is retractable and sheathed around the drive rod 24, between the connecting rod 23 and the chamber body 19, to ensure a tight seal within the chamber 10. When the drive device drives the drive rod 24 upward, the bellows 25 is compressed, and when the drive device drives the drive rod 24 downward, the bellows 25 returns to its original shape.

[0050] See also Figure 5 As shown, in this embodiment, the inner wall of the rotor cover 21 is provided with an axial flange 214 extending toward the bottom of the rotor cover 21. The drive rod 24 contacts the axial flange 214 to move the rotor cover 21 upward. The axial flange 214 faces the bottom of the chamber 10, and the outer diameter of the axial flange 214 is equal to the inner diameter of the rotor cover 21. The provision of the axial flange 214 allows the drive rod 24 to move upward and contact the axial flange 214, thereby driving the rotor cover 21 upward, thereby separating the rotor cover 21 from the rotor base 20.

[0051] See also Figure 5As shown, in this embodiment, two support holes 215 are provided at the bottom of the axial flange 214. The support holes 215 are used to insert the drive rod 24. The support holes 215 are provided at corresponding positions on the bottom of the axial flange 214 to cooperate with the drive rod 24. By inserting the drive rod 24 into the support holes 215, the drive rod 24 is prevented from shaking, thereby ensuring operational stability.

[0052] In this embodiment, the support hole 215 is clearance-fitted with the driving rod 24 , so as to ensure that the driving rod 24 can be smoothly inserted into the support hole 215 .

[0053] See also Figure 3 As shown, in this embodiment, the driving device is a cylinder 26, the output shaft of the cylinder 26 is connected to the connecting rod 23, and the output shaft of the cylinder 26 is extended and retracted to drive the connecting rod 23 to move in the vertical direction. Of course, the driving device is not limited to a cylinder, and can also be a hydraulic cylinder, a screw mechanism, or other linear drive module.

[0054] See also Figure 3 According to the second aspect of the present invention, a semiconductor device is provided, comprising the rotor lifting mechanism as described in any one of the first aspects. Since the semiconductor device obviously has all the advantages of the above-mentioned rotor lifting mechanism, the description thereof will not be repeated here.

[0055] In summary, the rotor lifting mechanism and semiconductor device provided by this embodiment have at least the following beneficial technical effects:

[0056] (1) By forming a non-integrated structure with the rotor base 20 and the rotor cover 21, it is possible to obtain rotor assemblies of different heights after the rotor cover 21 and the rotor base 20 are assembled at different positions, thereby achieving different relative distances between the wafer and the water-cooling assembly 14, thereby achieving the effect of different cooling rates;

[0057] (2) By setting up a lifting assembly, the rotor cover 21 and the rotor base 20 can be changed to different installation positions in a vacuum environment without opening a cavity, thus avoiding contamination caused by opening a cavity;

[0058] (3) The present invention has a simple structure, low cost, is easy to implement, and is convenient to operate.

[0059] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A rotor lifting mechanism, characterized in that: Applicable to semiconductor equipment, the semiconductor equipment includes a chamber body, and the rotor lifting mechanism includes a rotor assembly and a lifting assembly; The rotor assembly is disposed in the chamber body, and includes a rotor base and a rotor upper cover sleeved in the rotor base. The rotor base is rotatable relative to the rotor upper cover. The inner wall of the rotor base is provided with a first positioning pin and a second positioning pin extending toward the bottom of the rotor upper cover. The bottom of the rotor upper cover is provided with a positioning hole, a first avoidance hole, and a second avoidance hole. When the first positioning pin is inserted into the positioning hole, the rotor base is located at a first position, the second positioning pin is inserted into the second avoidance hole, and the upper surface of the rotor upper cover is flush with the upper surface of the rotor base; When the second positioning pin is inserted into the positioning hole, the rotor base is located at the second position, the first positioning pin is inserted into the first avoidance hole, and the upper surface of the rotor upper cover protrudes from the upper surface of the rotor base; The lifting assembly includes a driving device and an adapter provided on the driving device. The driving device is located outside the chamber body. The adapter is slidably connected to the bottom of the chamber body. The driving device is used to drive the adapter to move vertically to contact the rotor cover and drive the rotor cover to move axially along the rotor base.

2. The rotor lifting mechanism according to claim 1, characterized in that: A radial flange is provided on the inner wall of the rotor base. The first positioning pin and the second positioning pin are provided on the radial flange, and the second positioning pin is higher than the first positioning pin.

3. The rotor lifting mechanism according to claim 1, characterized in that: The adapter includes a connecting rod and two driving rods. The two driving rods are slidably inserted into the bottom of the chamber body. The connecting rod is located outside the chamber body. One end of the two driving rods is respectively connected to the two ends of the connecting rod, and the other end of the two driving rods is used to contact the rotor cover.

4. The rotor lifting mechanism according to claim 3, characterized in that: Two sliding holes are provided at the bottom of the chamber body, and the driving rod is slidably inserted into the sliding holes.

5. The rotor lifting mechanism according to claim 3, characterized in that: The driving rod sleeve is provided with a bellows, and the bellows is located between the connecting rod and the bottom of the chamber body.

6. The rotor lifting mechanism according to claim 3, characterized in that: An inner wall of the rotor upper cover is provided with an axial flange extending toward the bottom of the rotor upper cover, and the driving rod can contact the axial flange to move the rotor upper cover upward.

7. The rotor lifting mechanism according to claim 6, characterized in that: Two supporting holes are provided at the bottom of the axial flange, and the supporting holes are used to insert the driving rod.

8. The rotor lifting mechanism according to claim 7, characterized in that: The supporting hole is loosely matched with the driving rod.

9. The rotor lifting mechanism according to claim 1, characterized in that: The driving device is a cylinder.

10. A semiconductor device, characterized in that: It comprises the rotor lifting mechanism according to any one of claims 1 to 9.

Images