Self-driven one-way valve solid-state heat dissipation device based on mems technology
The solid-state heat dissipation device with a self-driven one-way valve using MEMS technology solves the problem of driving frequency that needs to be considered in the existing technology by utilizing mechanical buckling plate and vibrating thin plate structure. It achieves low power consumption, high efficiency heat dissipation and miniaturization heat dissipation effect, and is suitable for portable devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZHEJIANG UNIV
- Filing Date
- 2024-09-09
- Publication Date
- 2026-05-22
Smart Images
Figure CN119050077B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of thermal functional device technology, specifically a self-driven one-way valve solid-state heat dissipation device based on MEMS technology that does not require consideration of driving frequency. Background Technology
[0002] In today's high-performance electronic devices, heat dissipation technology has become a key factor restricting performance improvement. Especially in portable devices such as smartphones, heat dissipation issues severely impact chip performance and user experience. Traditional heat dissipation solutions, such as VC graphite heat pipes and TEC active cooling, suffer from drawbacks such as large size, heavy weight, and the need for external power supplies, limiting further device development. The industry urgently needs a more efficient and cost-effective heat dissipation method.
[0003] With the continuous advancement of Micro-Electro-Mechanical Systems (MEMS) technology, MEMS-based piezoelectric solid-state heat dissipation technology has gradually become a research hotspot. For example, Frore Systems' AirJet technology, as the world's first solid-state active heat dissipation device, is rapidly changing the electronics industry with its quiet operation and portability. However, existing solid-state heat dissipation technologies such as AirJet, despite breakthroughs in thickness and weight, still require further optimization in certain application scenarios to meet higher performance demands and design simplification.
[0004] Currently, there is no simpler solid-state cooling technology that does not require consideration of the frequency of piezoelectric drive voltage, which makes it impossible to further reduce the size and power consumption to fit the limited space of portable devices such as smartphones.
[0005] Therefore, designing a simple solid-state heat dissipation device that does not require consideration of the piezoelectric drive voltage frequency is very meaningful for solving the above problems. Summary of the Invention
[0006] The purpose of this invention is to solve the problems existing in the prior art and to provide a solid-state heat dissipation device that does not need to consider the piezoelectric drive frequency.
[0007] This invention is achieved through the following technical solution:
[0008] A self-driven one-way valve solid-state heat dissipation device based on MEMS technology that does not require consideration of driving frequency includes a package shell, a vibrating sheet, and a mechanically buckling plate.
[0009] The enclosure is rectangular in shape and includes a front wall, a rear wall, a left wall, and a right wall. The top and bottom of the enclosure are open, with the top opening serving as an air inlet and the bottom opening as an air outlet. A lead wire hole is provided on the left or right wall of the enclosure. A front support is fixed to the front end of the bottom of the enclosure, and a rear support is fixed to the rear end of the bottom of the enclosure. The front and rear supports are symmetrically arranged relative to the enclosure, supporting and lifting it.
[0010] The vibrating sheet is positioned in the middle of the inside of the packaging shell. The vibrating sheet is horizontally positioned, with its left end connected and fixed to the left shell wall of the packaging shell and its right end connected and fixed to the right shell wall of the packaging shell. The width of the vibrating sheet in the front-to-back direction is smaller than the width of the inner cavity of the packaging shell in the front-to-back direction. The vibrating sheet includes a metal sheet, and the upper surface of the metal sheet is coated with piezoelectric material.
[0011] The mechanical buckling plate is located at the air outlet inside the encapsulation shell. A mass block is placed at the middle position of the mechanical buckling plate, and the weight of the mass block is equal to the buckling load of the mechanical buckling plate. The left end of the mechanical buckling plate is connected and fixed to the left shell wall of the encapsulation shell, and the right end of the mechanical buckling plate is connected and fixed to the right shell wall of the encapsulation shell. The width of the mechanical buckling plate in the front-to-back direction is smaller than the width of the inner cavity of the encapsulation shell in the front-to-back direction.
[0012] As a preferred technical solution, the front support and the rear support have the same structure, which includes a support horizontal plate. The inner end plate of the support horizontal plate is fixedly connected to the shell wall of the encapsulation shell, and the outer end plate of the support horizontal plate is fixed with a support vertical plate that extends downward.
[0013] As a preferred technical solution, the height to which the encapsulation shell is supported and lifted by the front and rear support seats is greater than the downward displacement distance of the mechanical buckling plate.
[0014] As a preferred technical solution, the piezoelectric material on the vibrating sheet is a piezoelectric ceramic, PZT, or a piezoelectric polymer.
[0015] As a preferred technical solution, the gap between the front and rear edges of the mechanical buckling plate and the front and rear shell walls of the inner cavity of the encapsulation shell is less than 200μm.
[0016] As a preferred technical solution, the mechanical buckling plate includes a left buckling plate and a right buckling plate. The right end of the left buckling plate is connected and fixed to the left end of the mass block, and the left end of the left buckling plate is connected and fixed to the left shell wall of the encapsulation shell. The left end of the right buckling plate is connected and fixed to the right end of the mass block, and the right end of the right buckling plate is connected and fixed to the right shell wall of the encapsulation shell. The left and right buckling plates are symmetrically arranged with respect to the mass block.
[0017] In this invention, a mass block is disposed in the middle of the mechanical buckling plate. The weight of the mass block is equal to the buckling load of the mechanical buckling plate. Therefore, the mechanical buckling plate only requires a very small force to cause a large displacement in the deflection direction, thereby achieving active heat dissipation with low power consumption. Specifically, since the weight of the mass block is equal to the buckling load of the mechanical buckling plate, when the force on the mechanical buckling plate in the direction of gravity is greater than the buckling load, a large displacement can be generated in the deflection direction. Therefore, when the vibrating plate moves downward, the pressure inside the encapsulation shell only needs to be slightly higher than the external pressure, so that when a force is applied to the mass block, the mechanical buckling plate can have a large displacement, thereby achieving an active heat dissipation effect. When the vibrating plate moves upward, the external pressure is higher than the pressure inside the encapsulation shell, and the mechanical buckling plate returns to its initial state when subjected to a force opposite to the direction of gravity. In addition, the width of the mechanical buckling plate is slightly smaller than the width of the inner cavity of the encapsulation shell, and the gap between the two is less than 200μm. Therefore, when the mechanical buckling plate returns to its initial state, hot air from the surface of the heat-generating object will not enter the inner cavity of the encapsulation shell.
[0018] The device of this invention can be fabricated using MEMS, resulting in advantages such as miniaturization, low cost, and monolithic design. The device not only possesses efficient heat dissipation capabilities but also features a simplified design, particularly in the air outlet design which utilizes the nonlinear characteristics of a mechanically buckled plate. Since the buckled plate has no resonant frequency, this innovation eliminates the need to consider the frequency of the piezoelectric drive voltage during operation, thereby simplifying system design.
[0019] Compared with existing active heat dissipation devices, the device of the present invention has the following advantages:
[0020] 1) In the device of the present invention, since the mechanical buckling plate is not constrained by the resonant frequency, the piezoelectric driving voltage is not constrained by the frequency, and the wind speed can be adjusted at any frequency.
[0021] 2) The device of the present invention is made using MEMS integrated processing technology. Compared with traditional mechanical one-way valves, the mechanical buckling plate can ignore the influence of mechanical fatigue effect and extend the service life of the device.
[0022] 3) In the device of the present invention, the mechanical buckling plate can achieve a large displacement with only a small force, and the cold air inside the encapsulation shell is expelled to achieve a cooling effect. Therefore, the piezoelectric driving voltage is very small to maintain the normal operation of the device, so that the solid heat dissipation device that does not need to consider the driving frequency has extremely low power consumption.
[0023] 4) The device of the present invention can achieve advantages such as low cost, small size and integration.
[0024] 5) The device of the present invention can be arrayed based on MEMS technology to form an array arrangement, and the heat can be quickly discharged by directly impacting the hot surface through high-speed micro airflow.
[0025] In summary, the device of this invention, while maintaining low noise and efficient heat dissipation, further improves heat dissipation efficiency and system integration through optimized mechanical structure design, making it particularly suitable for portable devices with high battery life requirements. These characteristics make the device not only suitable for smartphones, but also expected to be applied to portable devices such as tablets and laptops, providing a completely new solution for heat dissipation in electronic devices. Attached Figure Description
[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. The accompanying drawings are used to provide further explanation of the present invention and constitute a part of this application. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention.
[0027] Figure 1 This is a schematic diagram of the structure of the device of the present invention.
[0028] Figure 2 This is a partial enlarged view of the air outlet of the device of the present invention.
[0029] Figure 3 This is a graph showing the mechanical properties of the mechanical buckling plate in the device of the present invention.
[0030] Figure 4 This is a front view showing the shape of the mechanical buckling plate and the gas flow direction of the device of the present invention during heat dissipation.
[0031] Figure 5 This is a side view showing the shape of the mechanical buckling plate and the gas flow direction of the device of the present invention during heat dissipation.
[0032] Figure 6 This is a front view showing the shape of the mechanical buckling plate and the gas flow direction when the vibrating sheet in the device of the present invention is facing upward.
[0033] In the diagram: 1-Encapsulation shell, 2-Vibrating sheet, 3-Mechanical buckling plate, 3-1-Mass block, 3-2-Left buckling plate, 3-3-Right buckling plate, 4-Air inlet, 5-Air outlet, 6-Air chamber, 7-Lead hole, 8-Front support, 9-Rear support. Detailed Implementation
[0034] The embodiments of the technical solution of the present invention will now be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and are therefore merely examples and should not be used to limit the scope of protection of the present invention. It should be noted that, unless otherwise stated, the technical or scientific terms used in this application should have the ordinary meaning understood by those skilled in the art to which this invention pertains.
[0035] In the description of this invention, it should be understood that the terms "front", "rear", "left", "right", "top", "bottom", "upper", "lower", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0036] like Figure 1 and Figure 2 As shown, this embodiment provides a self-driven one-way valve solid-state heat dissipation device based on MEMS technology that does not require consideration of driving frequency. It includes a package shell 1 with an air inlet 4 and an air outlet 5, a vibrating sheet 2 with piezoelectric material attached, and a mechanical buckling plate 3 with mechanical nonlinear characteristics.
[0037] The encapsulation shell 1 is rectangular in shape and includes a front shell wall, a rear shell wall, a left shell wall, and a right shell wall. The top and bottom ends of the left and right shell walls each have inwardly horizontally folded edges. The top and bottom of the encapsulation shell 1 are open, with the top opening forming an air inlet 4 and the bottom opening forming an air outlet 5. The inner cavity of the encapsulation shell 1 forms an air chamber 6. The air inlet 4 draws in external cold air into the air chamber 6, and the air outlet 5 provides fixed support for the mechanically buckling plate 3. When the mechanically buckling plate 3 flexes, the air outlet 5 blows the cold air from the air chamber 6 onto the surface of the heated object, achieving active heat dissipation. A lead wire hole 7 is provided on the left or right shell wall of the encapsulation shell 1, and the lead wire hole 7 provides electrical drive to the vibrating sheet 2 via an external lead wire. A front support base 8 is fixed at the bottom front end, and a rear support base 9 is fixed at the bottom rear end of the encapsulation shell 1. The front support base 8 and the rear support base 9 are symmetrically arranged relative to the encapsulation shell 1. Specifically, the front support base 8 and the rear support base 9 have the same structure, including a support horizontal plate. The inner end plate edge of the support horizontal plate is fixedly connected to the shell wall of the encapsulation shell 1, and a downwardly extending support vertical plate is fixed to the outer end plate edge of the support horizontal plate. The front support base 8 and the rear support base 9 support and lift the encapsulation shell 1, and the height of the support and lifting is greater than the downward displacement distance of the mechanical buckling plate 3. The front support base 8 and the rear support base 9 form a fixed support structure at the air outlet 5 that changes the air direction, ensuring that the air outlet 5 can directly blow the cold air in the air chamber 6 onto the surface of the heated object to achieve a cooling effect.
[0038] The vibrating sheet 2 is positioned in the middle of the interior of the encapsulation shell 1, which provides fixed support for the vibrating sheet 2. The vibrating sheet 2 is horizontally positioned, with its left end fixedly connected to the left shell wall of the encapsulation shell 1 and its right end fixedly connected to the right shell wall of the encapsulation shell 1. The width of the vibrating sheet 2 in the front-to-back direction is smaller than the width of the inner cavity of the encapsulation shell 1 in the front-to-back direction, which facilitates gas flow. The vibrating sheet 2 includes a metal sheet, and the upper surface of the metal sheet is coated with a piezoelectric material, which is a piezoelectric ceramic, PZT, or a piezoelectric polymer. The driving voltage frequency is not limited and can be manually adjusted to any desired frequency. Since the mechanical buckling plate 3 only requires a small force to produce a large displacement, the vibrating sheet 2 only needs to provide a very small driving force to enable the device to achieve active heat dissipation.
[0039] The mechanical buckling plate 3 is located at the air outlet 5 inside the encapsulation shell 1. A mass block 3-1 is located at the middle of the mechanical buckling plate 3, and the weight of the mass block 3-1 is equal to the buckling load of the mechanical buckling plate 3. The left end of the mechanical buckling plate 3 is connected and fixed to the left shell wall of the encapsulation shell 1, and the right end of the mechanical buckling plate 3 is connected and fixed to the right shell wall of the encapsulation shell 1. The width of the mechanical buckling plate 3 in the front-to-back direction is smaller than the width of the inner cavity of the encapsulation shell 1 in the front-to-back direction. The gap between the front and rear edges of the mechanical buckling plate 3 and the front and rear shell walls of the inner cavity of the encapsulation shell 1 is less than 200μm. Since the width of the mechanical buckling plate 3 is slightly smaller than the width of the air chamber 6 inside the encapsulation shell 1, and the back buckling behavior of the mechanical buckling plate 3 results in the mechanical buckling plate 3 not having a resonant frequency. Specifically, the mass block 3-1 adopts a T-shaped mass block 3-1, including a horizontal plate and a vertical plate, with the vertical plate located in the middle of the inner cavity of the encapsulation shell 1; the mechanical buckling plate 3 includes a left buckling plate 3-2 and a right buckling plate 3-3, the right end of the left buckling plate 3-2 is connected and fixed to the left end of the vertical plate of the mass block 3-1, the left end of the left buckling plate 3-2 is connected and fixed to the folded edge at the bottom of the left shell wall of the encapsulation shell 1, the left end of the right buckling plate 3-3 is connected and fixed to the right end of the vertical plate of the mass block 3-1, and the right end of the right buckling plate 3-3 is connected and fixed to the folded edge at the bottom of the right shell wall of the encapsulation shell 1, and the left buckling plate 3-2 and the right buckling plate 3-3 are symmetrically arranged with respect to the vertical plate of the mass block 3-1. When the vibrating sheet 2 moves downward, the pressure inside the air chamber 6 is greater than that outside, causing the mechanical buckling plate 3 to move downward. Since the mass block 3-1 has already brought the mechanical buckling plate 3 to the critical point between linear buckling and post-buckling, a very small force can cause the mechanical buckling plate 3 to exhibit post-buckling behavior and a large displacement, thereby expelling the cold air in the air chamber 6 and achieving an active heat dissipation effect.
[0040] Since the weight of mass block 3-1 is equal to the buckling load of mechanical buckling plate 3, when the force on mechanical buckling plate 3 in the direction of gravity is greater than the buckling load, it can produce a large displacement in the deflection direction. Therefore, when the vibrating sheet moves downward, the pressure inside the air chamber 6 of the encapsulation shell 1 only needs to be slightly higher than the external pressure, so that when force is applied to mass block 3-1, mechanical buckling plate 3 can have a large displacement, thereby achieving an active heat dissipation effect. When the vibrating sheet moves upward, the external pressure is higher than the pressure inside the air chamber 6 of the encapsulation shell 1, and mechanical buckling plate 3 returns to its initial state when it is subjected to a force opposite to the direction of gravity.
[0041] like Figure 3 As shown, the mechanical characteristic curve of the mechanical buckling plate 3 in the device of this invention, in the force-displacement relationship curve, region I indicates that the mechanical buckling plate 3 exhibits a positive stiffness effect, region II indicates that the mechanical buckling plate 3 exhibits a negative stiffness effect, and the intersection of region I and region II is the buckling load of the mechanical buckling plate 3. When the load on the mechanical buckling plate 3 in the direction of gravity is higher than the buckling load, even a small force can cause the mechanical buckling plate 3 to undergo a large displacement. Region III indicates that the mechanical buckling plate 3 exhibits a positive stiffness effect. In this invention, the gravity of the mass block 3-1 is equal to the buckling load of the mechanical buckling plate 3, causing the mechanical buckling plate 3 to be in a critical instability state. When the mechanical buckling plate 3 is subjected to a very small force in the direction of gravity, it is in an unstable state and produces a large displacement. When the force is removed, the mechanical buckling plate 3 returns to the initial critical instability state.
[0042] like Figures 4 to 6 As shown, the device of the present invention has the shape of the mechanical buckling plate 3 and the gas flow diagram under two working states. When an external electrical signal is applied to the vibrating plate 2, the vibrating plate 2 produces a fixed frequency of vertical displacement. When the vibrating plate 2 produces a downward displacement, the air pressure in the lower part of the air chamber 6 is greater than the external atmospheric pressure, and the air pressure in the upper part of the air chamber 6 is less than the external atmospheric pressure. Cold air is drawn in through the air inlet 4, and the mass block 3-1 is subjected to a force in the direction of gravity, causing the mechanical buckling plate 3 to produce a large displacement, thus expelling the cold air from the air chamber 6. Figure 4 , 5 As shown. When the vibrating sheet 2 is displaced upward, the mass block 3-1 is no longer subjected to the force in the direction of gravity, and the mechanical buckling plate 3 returns to its initial displacement. Since the gap between the mechanical buckling plate 3 and the shell wall of the encapsulation shell 1 is less than 200μm, the hot air on the surface of the heated object will not enter the air chamber 6, thereby achieving an active heat dissipation effect.
[0043] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered within the scope of the claims and specification of the present invention.
Claims
1. A self-driven one-way valve solid-state heat dissipation device based on MEMS technology that does not require consideration of driving frequency, characterized in that: Includes the encapsulation housing, vibrating sheet, and mechanical buckling plate; The enclosure is rectangular in shape and includes a front wall, a rear wall, a left wall, and a right wall. The top and bottom of the enclosure are open, with the top opening serving as an air inlet and the bottom opening as an air outlet. A lead wire hole is provided on the left or right wall of the enclosure. A front support is fixed to the front end of the bottom of the enclosure, and a rear support is fixed to the rear end of the bottom of the enclosure. The front and rear support are symmetrically arranged relative to the enclosure, supporting and lifting it. The vibrating sheet is positioned in the middle of the inside of the packaging shell. The vibrating sheet is horizontally positioned, with its left end connected and fixed to the left shell wall of the packaging shell and its right end connected and fixed to the right shell wall of the packaging shell. The width of the vibrating sheet in the front-to-back direction is smaller than the width of the inner cavity of the packaging shell in the front-to-back direction. The vibrating sheet includes a metal sheet, and the upper surface of the metal sheet is coated with piezoelectric material. The mechanical buckling plate is located at the air outlet inside the encapsulation shell. A mass block is placed at the middle position of the mechanical buckling plate, and the weight of the mass block is equal to the buckling load of the mechanical buckling plate. The left end of the mechanical buckling plate is connected and fixed to the left shell wall of the encapsulation shell, and the right end of the mechanical buckling plate is connected and fixed to the right shell wall of the encapsulation shell. The width of the mechanical buckling plate in the front-to-back direction is smaller than the width of the inner cavity of the encapsulation shell in the front-to-back direction.
2. The self-driven one-way valve solid-state heat dissipation device based on MEMS technology without considering the driving frequency as described in claim 1, characterized in that: The front support and the rear support have the same structure, including a support plate. The inner end plate of the support plate is fixedly connected to the shell wall of the encapsulation shell, and the outer end plate of the support plate is fixed with a downwardly extending support plate.
3. The self-driven one-way valve solid-state heat dissipation device based on MEMS technology without considering the driving frequency as described in claim 1, characterized in that: The height to which the encapsulated housing is supported and lifted by the front and rear supports is greater than the downward displacement distance of the mechanical buckling plate.
4. The self-driven one-way valve solid-state heat dissipation device based on MEMS technology without considering the driving frequency as described in claim 1, characterized in that: The piezoelectric material on the vibrating sheet is a piezoelectric ceramic, PZT, or piezoelectric polymer.
5. The self-driven one-way valve solid-state heat dissipation device based on MEMS technology without considering the driving frequency as described in claim 1, characterized in that: The gap between the front and rear edges of the mechanical buckling plate and the front and rear shell walls of the inner cavity of the encapsulation shell is less than 200μm.
6. The self-driven one-way valve solid-state heat dissipation device based on MEMS technology without considering the driving frequency as described in claim 1, characterized in that: The mechanical buckling plate includes a left buckling plate and a right buckling plate. The right end of the left buckling plate is connected and fixed to the left end of the mass block, and the left end of the left buckling plate is connected and fixed to the left shell wall of the encapsulation shell. The left end of the right buckling plate is connected and fixed to the right end of the mass block, and the right end of the right buckling plate is connected and fixed to the right shell wall of the encapsulation shell. The left and right buckling plates are arranged symmetrically with respect to the mass block.