Light emitting device and method of manufacturing the same

Abstract

The application provides a manufacturing method of a light-emitting device, comprising the following steps: S1: punching a conductive blank plate to form a continuous substrate plate with a frame part, a plurality of pairs of conductive substrates and a plurality of connecting parts, each pair of conductive substrates comprises two conductive substrates arranged oppositely, each conductive substrate comprises a conductive part and a protruding part, and each pair of conductive substrates is connected to the frame part through the connecting part; S2: arranging a bearing support combined with each pair of conductive substrates; the part of the conductive substrate exposed outside the bearing support is the protruding part; S3: cutting part of the protruding part to form a first cutting surface, and reserving at least one connecting part to keep the frame part connected with each conductive substrate; S4: arranging a light-emitting element in a containing space and electrically connecting the light-emitting element with the conductive substrate; filling glue in the containing space; and S5: cutting the connecting part to form a second cutting surface, and separating the conductive substrate from the frame part. The application also provides a light-emitting device. The manufacturing method of the light-emitting device has the advantage of high yield.

Description

Technical Field

[0001] This application relates to the field of light-emitting diode packaging, and specifically to a method for manufacturing a light-emitting device and the light-emitting device itself. Background Technology

[0002] In the field of light-emitting diode packaging, reference Figure 1 To fabricate the light-emitting device 7', the conventional manufacturing process is as follows: a metal frame 3' is manufactured, and several arrayed pad units are integrally formed on the metal frame 3'. Figure 1 An exemplary metal frame structure with only one pad unit is shown. Typically, a pad unit consists of two separate and oppositely arranged metal pads 2'. The pad unit is connected to a metal frame 3', and the metal frame 3' also has a locking point 1' for supporting the carrier bracket. Then, a carrier bracket 5' is formed on the pad unit. The carrier bracket 5' is usually made of resin material. After the carrier bracket 5' is formed, the connection part 4' between the pad unit and the metal frame 3' can be separated, leaving only the locking point 1' supporting the carrier bracket 5'. Then, the die bonding and encapsulation of the light-emitting diode chip 6' are completed within the carrier bracket 5'. Then, by stamping, the locking point 1' is separated from the carrier bracket 5', thereby obtaining the light-emitting device 7'. However, during the stamping process, when separating the carrier bracket 3' from the metal frame 3', the carrier bracket 3' is easily damaged by the force of the locking point during stamping, resulting in a decrease in product yield. Summary of the Invention

[0003] The main technical problem addressed in this application is how to improve the yield rate in the manufacturing process of light-emitting devices.

[0004] To address the aforementioned technical problems, this application provides a method for manufacturing a light-emitting device, comprising the following steps:

[0005] S1: Stamping process is performed on the conductive blank plate to form a continuous substrate having a frame part, multiple pairs of conductive substrates and multiple connecting parts. Each pair of conductive substrates includes two conductive substrates arranged at relative intervals. Each pair of conductive substrates is connected to the frame part through the connecting parts.

[0006] S2: A support bracket is provided to be combined with each pair of conductive substrates; the support bracket is stacked and fixed on each of the conductive substrates and surrounds each of the conductive substrates to form an accommodating space, and the portion of the conductive substrate exposed outside the support bracket is a protrusion.

[0007] S3: Cut off part of the protrusion to remove part of the protrusion to form a first cutting surface, retain at least one connecting part to keep the frame part connected to each conductive substrate;

[0008] S4: disposing the light emitting piece into the accommodating space, and electrically connecting the light emitting piece with the conductive substrate; and filling glue into the accommodating space to encapsulate the light emitting piece in the bearing support;

[0009] S5: cutting the connection part to form a second cutting surface, and separating the conductive substrate from the frame.

[0010] As a further improvement of the technical solution of the present application, the manufacturing method of the light emitting device further comprises a step S23: electroplating the reflective layer on the continuous substrate before or after the step S2.

[0011] As a further improvement of the technical solution of the present application, the side wall of the bearing support is made of transparent material; the first cutting surface is closer to the bearing support than the second cutting surface; the two sides of each connection part have the first cutting surface; the remaining part of the protruding part after being partially cut includes an edge area and a buffer area, the edge area is close to the edge of the bearing support, and the buffer area is connected with the connection part and close to the middle position of the conductive substrate.

[0012] In an embodiment, each conductive substrate formed in the step S1 has at least two connection parts connected with the frame part;

[0013] In the step S3, part of the protruding part and part of the connection part are cut off, and only one connection part of each conductive substrate is left to be connected with the frame part; so that each bearing support has only one connection part on each side connected with the frame part, and the connection parts on the two opposite sides of each bearing support are staggered in the first direction and rotationally symmetric relative to the center point of the bearing support.

[0014] In an embodiment, when part of the protruding part is cut off in the step S3, at least part of the protruding part on both sides of the connection part is cut off, and the first cutting surface formed on both sides of the remaining connection part includes a plane and a curved surface, wherein the planes are located on the same plane.

[0015] The present application also provides a light emitting device, characterized in that it comprises a bearing support, a light emitting piece, at least one pair of conductive substrates and a connection residual part.

[0016] The pair of conductive substrates comprises two oppositely spaced conductive substrates, each of the conductive substrates comprises a conductive part and a protruding residual part which are connected in the first direction; the carrier support is fixed on each of the conductive parts and encloses a receiving space with each of the conductive parts; the protruding residual part is exposed on two opposite sides of the carrier support, and the connecting residual part protrudes from one side of each of the protruding residual parts away from the conductive part; the protruding residual part is provided with a first cutting surface formed by partial cutting, the first cutting surface is formed on both sides of the connecting residual part, and the connecting residual part has a second cutting surface formed after being cut off; the light emitting element is mounted in the receiving space, and the light emitting element is electrically connected with the conductive part.

[0017] In an embodiment, among the two opposite sides of the light emitting device provided with the connecting residual part, the connecting residual part of each side is only one and deviates from the middle position of one side of the light emitting device, and the connecting residual parts of the two opposite sides of the light emitting device are staggered in the first direction and rotationally symmetric about the center point of the carrier support.

[0018] In an embodiment, the protruding residual part comprises an edge region and a buffer region; the edge region is closer to the edge of the carrier support than the buffer region, and the buffer region is away from the edge of the carrier support and connected with the connecting residual part and located in the middle position of the connecting residual part close to the conductive substrate.

[0019] In an embodiment, the first cutting surface on both sides of the connecting residual part comprises a plane located in the edge region of the protruding residual part and a curved surface located in the buffer region of the protruding residual part, wherein the planes located in the edge region of the light emitting device on the same side are located on the same plane, and the curved surface is connected with the plane and extends away from the carrier support. Specifically, referring to Figure 5a When cutting the partial protruding part 22, the partial protruding parts 22 on the same side of the longitudinally arranged adjacent carrier supports can be cut at the same time, so that the planes located in the edge region of the light emitting device on the same side are located on the same plane. At the same time, one of the connecting parts on one side of the two adjacent carrier supports in the longitudinal direction can also be cut together.

[0020] In an embodiment, the carrier support is made of light-transmitting material; the surface of the conductive substrate is provided with a reflective layer; the first cutting surface and the second cutting surface are not covered by the reflective layer, and the reflective layer at least covers the joint surface of the carrier support and the conductive substrate.

[0021] The application provides a manufacturing method of a light-emitting device and the light-emitting device.

[0022] In addition, a mold is needed when the supporting frame is formed on the conductive substrate. The conductive substrate has a part protruding from the mold cavity (i.e. the part outside the supporting frame and clamped by the mold, i.e. the protruding part in the application), which can facilitate clamping of the pad unit by the mold, and reduce the overflow of glue during the process of forming the supporting unit by glue injection. After the supporting unit is formed, the protruding part with such a large area is no longer needed, and therefore only the connecting part capable of being connected with the metal frame needs to be reserved. The part of the protruding part on both sides of the connecting part can be cut off, so as to reduce the light absorption phenomenon of the metal material. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 A structure diagram of the light-emitting device in the prior art in cooperation with the metal frame in the manufacturing process;

[0024] Figure 2a , Figure 2b and Figure 2c A brief flowchart of the manufacturing method of the light-emitting device according to an embodiment of the application;

[0025] Figure 3a A structure diagram of the metal blank in step S1 of the manufacturing method of the light-emitting device according to an embodiment of the application;

[0026] Figure 3b A structure diagram of the continuous substrate in step S1 of the manufacturing method of the light-emitting device according to an embodiment of the application;

[0027] Figure 3c A zoomed-in view of part A in Figure 3b ;

[0028] Figure 4a A structure diagram of the supporting frame in step S2 of the manufacturing method of the light-emitting device according to an embodiment of the application;

[0029] Figure 4b A zoomed-in view of part B in Figure 4a ;

[0030] Figure 4c and Figure 4d A structure diagram of the light-emitting device after the reflecting layer is arranged in step S23 of the manufacturing method of the light-emitting device according to an embodiment of the application; Figure 4bA-A sectional view for the base;

[0031] Figure 5a A schematic view of cutting part of the protrusion in step S3 of the manufacturing method of the light emitting device according to an embodiment of the present application;

[0032] Figure 5b A schematic view after cutting part of the protrusion in step S3 of the manufacturing method of the light emitting device according to another embodiment of the present application;

[0033] Figure 6 A schematic view after disposing the light emitting member in step S4 of the manufacturing method of the light emitting device according to another embodiment of the present application;

[0034] Figure 7 A schematic view of cutting the connecting part in step S5 of the manufacturing method of the light emitting device according to another embodiment of the present application;

[0035] Figure 8a A schematic view of cutting part of the protrusion in step S3 of the manufacturing method of the light emitting device according to another embodiment of the present application;

[0036] Figure 8b A schematic view after disposing the light emitting member in step S4 of the manufacturing method of the light emitting device according to another embodiment of the present application;

[0037] Figure 8c A schematic view of cutting the connecting part in step S5 of the manufacturing method of the light emitting device according to another embodiment of the present application;

[0038] Figure 9a A schematic view of cutting part of the protrusion in step S3 of the manufacturing method of the light emitting device according to another embodiment of the present application;

[0039] Figure 9b A schematic view after disposing the light emitting member in step S4 of the manufacturing method of the light emitting device according to another embodiment of the present application;

[0040] Figure 9c A schematic view of cutting the connecting part in step S5 of the manufacturing method of the light emitting device according to another embodiment of the present application;

[0041] Figure 10a and Figure 10b A schematic view of the front and back of the light emitting device according to another embodiment of the present application;

[0042] Figure 11a and Figure 11b A schematic view of the front and back of the light emitting device according to another embodiment of the present application;

[0043] Figure 12a and Figure 12bThe structure diagram of the front surface and the back surface of the light emitting device provided by another embodiment of the present application. DETAILED DESCRIPTION

[0044] The present application will be further described below in conjunction with the drawings. Like elements in different embodiments are denoted by like reference numerals. In the following embodiments, many details are described in order to provide a more thorough understanding of the present application. However, one skilled in the art will readily recognize that some of the features, throughout the various embodiments, are optional and can be replaced or supplemented by alternative features, materials, methods. In some cases, some operations related to the present application are not shown or described in the specification in order to avoid obscuring the core of the present application, and it is not necessary to describe these operations in detail for one skilled in the art to fully understand them based on the description in the specification and the general knowledge in the art.

[0045] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate manner to form various embodiments. Meanwhile, the steps or actions in the method description can also be sequentially adjusted or adjusted in a manner that is apparent to one skilled in the art. Therefore, the various sequences in the specification and the drawings are only for the purpose of clearly describing a certain embodiment, and do not mean that the sequence is necessary, unless otherwise stated that a certain sequence must be followed.

[0046] The serial numbers of components in this paper, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any sequence or technical meaning. Unless otherwise specified, "connection" and "coupling" in this paper include direct and indirect connection (coupling).

[0047] The embodiment of the present application provides a light emitting device, which aims to solve the problem of high damage rate and low yield in the manufacturing process of the light emitting device in the prior art. Embodiment one

[0048] The embodiment provides a manufacturing method of a light emitting device, which aims to solve the problem of yield reduction caused by breakage in the manufacturing process of the light emitting device in the prior art.

[0049] Please refer to Figure 2a The manufacturing method of the light emitting device specifically comprises the following steps:

[0050] Step S1: manufacturing a continuous sheet substrate 1. Please refer to Figure 3a , Figure 3b and Figure 3c; providing a conductive blank plate 10 and stamping the conductive blank plate 10 to form a continuous substrate 1 having a frame part 3, a plurality of pairs of conductive substrates 2 and a plurality of connecting parts 4, each pair of conductive substrates 2 being connected to the frame part 3 by the connecting part 4. In this embodiment, the conductive blank plate 10 is a whole piece of metal plate material, in this embodiment, Figure 3a The conductive blank plate 10 shown in the figure is a square copper plate; after stamping, referring to Figure 3b , the dark gray part is removed by stamping through the copper plate, and the light gray part is not stamped through and is thinned. Each pair of conductive substrates 2 and the connecting part 4 are integrally formed with the frame part 3, and the frame part 3 provides connection and support for each pair of conductive substrates 2, and each pair of conductive substrates 2 will not be separated from the frame part 3. Referring to Figure 3c , in this embodiment, a pair of conductive substrates 2 includes two conductive substrates arranged opposite to each other in the first direction, each conductive substrate 2 includes a conductive part 21 and a protruding part 22 connected to each other, so that there are two conductive parts 21 arranged opposite to each other in the first direction, respectively serving as the positive and negative conductive areas of the light emitting device 7 (referring to Figure 10a and Figure 10b ) for connection with the light emitting device; each conductive part 21 is connected to a protruding part 22, and one conductive substrate 2 can be connected to the frame part 3 by one connecting part 4, or can be connected to the frame part 3 by a plurality of connecting parts 4. In this embodiment, it is preferred that each protruding part 22 and the frame part 3 are connected by two connecting parts 4, which can maintain the stability of the conductive part 21 when the bearing support 5 is arranged. In other embodiments, each protruding part 22 and the frame part 3 are also connected to the frame part 3 by three or four connecting parts 4. Between each connecting part 4, a stamping hole 11 formed after the conductive blank plate 10 is stamped is arranged, which can distinguish the connecting parts 4 and the protruding parts 21. Figure 3b Exemplarily, 3 rows and 4 columns of a total of 12 pairs of arrayed conductive substrates 2 are arranged on a continuous substrate, each pair of conductive substrates is connected to the frame part 3 by the connecting part 4 in the first direction, and each pair of conductive substrates 2 has the same structure. The purpose of arranging the continuous substrate 1 is to integrate each pair of conductive substrates 2 on the same component, which can be processed in batches to improve the processing convenience.

[0051] Step S2: arranging a bearing support 5. Please refer to Figure 4a , Figure 4b and Figure 4cThe carrier supports 5 are arranged on the continuous substrate 1, and each carrier support 5 is combined with each pair of conductive substrates 2. After the carrier supports 5 are arranged, the conductive substrates 2 can be divided into the conductive portions 21 and the protruding portions 22 according to the positional relationship between the conductive substrates 2 themselves and the carrier supports 5. The carrier supports 5 are stacked and fixed on the conductive portions 21 and enclose the conductive portions 21 to form the accommodation spaces 51, and the protruding portions 22 are exposed to the outside of the carrier supports 5. The protruding portions 22 have a preset size, which can provide sufficient support area for the injection mold when the carrier supports 5 are arranged on the conductive substrates 2 by the injection mold. Figure 4a In this embodiment, the continuous substrate 1 is clamped by an injection mold (not shown), and then resin material is injected into the mold cavity of the injection mold, Figure 4a The shaded area covered by the diagonal line is the range of the resin material when the carrier supports 5 are injection molded. The flow channel (the position of which corresponds to 52 in Figure 4a ) and the overflow channel (the position of which corresponds to 53 in Figure 4a ) are connected between each carrier support 5, so that the mold cavities for molding each carrier support 5 are connected to each other, facilitating the flow of resin material to fully fill the mold cavities, so as to mold multiple carrier supports 5 at one time. Figure 4a An example is shown in which 3 rows and 4 columns of carrier supports 5 are molded on the continuous substrate, and a total of 12 arrayed carrier supports 5 are formed. Adjacent carrier supports in each column of carrier supports 5 are connected by the support communication portion 52 and the support overflow portion 53 formed by the flow channel in the second direction.

[0052] Step S3: cutting part of the protruding portion. Referring to Figure 5a , a punching and cutting device is used to cut part of the protruding portion 22. Figure 5a The gray part has the shape of the outer contour of the cutting knife of the punching and cutting device. In this embodiment, part of the protruding portion 22 is cut off, and part of the connecting portion 4 and the support communication portion 52 and the support overflow portion 53 are also cut off, so that each protruding portion 22 has only one connecting portion 4 connected to the frame portion 3. The first cutting surface P1 is formed on the protruding portion. Cutting part of the protruding portion reduces the area of the protruding portion 22 exposed to the outside of the carrier support 5, which can also reduce the adverse effects on the light efficiency of the product caused by the exposure of metal to the outside of the carrier support 5. The upper and lower edges of the protruding portion 22 are arranged in parallel along the first direction, and when part of the protruding portion is cut off, part of the material on the upper and lower sides of the protruding portion can be removed, but at least a margin is left at the edge of the carrier support 5 to avoid cutting stress that can damage the carrier support 5. Figure 10a and Figure 10b The remaining part of the protruding portion 22 after cutting part of the protruding portion 22 is the protruding residual portion 220.

[0053] Step S4: arranging the light emitting member 6. Referring to Figure 6The light emitting element 6 is arranged in the accommodating space 51, and the light emitting element 6 is electrically connected to the pair of conductive substrates 2. In order to further seal the light emitting device, a filling operation is further needed to be performed on the accommodating space 51 enclosed by the carrier support 5 and the conductive part 21, and the encapsulation glue is filled in the accommodating space 51, so as to encapsulate the light emitting element 6 in the carrier support 5. The light emitting element 6 can be a positive structure, a flip structure or a vertical structure LED light emitting chip or other light emitting element. In the embodiment, the light emitting element 6 is preferably a flip LED chip. When the flip light emitting chip is arranged in the accommodating space 51, two electrodes of the flip light emitting chip are respectively fixed to the conductive part 21 of the two conductive substrates 2 and are electrically connected to the two conductive parts 21. The use of the flip light emitting chip does not need to additionally provide a wire bonding space in the accommodating space 51, so that the size of the light emitting device 7 is miniaturized and lightened, and the load of the connecting part 4 can be reduced.

[0054] Step S5: cutting the connecting part 4. Please continue to refer to Figure 6 and Figure 7 After the light emitting element 6 is arranged, in order to obtain the light emitting device 7 (please refer to Figure 10a and Figure 10b ), the connecting part 4 can be cut along the cutting line L1 to separate the conductive substrate 2 from the frame part 3, and the light emitting device 7 shown in Figure 10a and Figure 10b is obtained. The connecting part 4 forms a second cutting surface P2 through the cutting line L1, and after cutting, a part of the connecting part 4 remains on one side of the protruding part 22, which can be referred to as a connecting residual part 41. In the embodiment, please refer to Figure 7 , the connecting part 4 extends along a first direction, the cutting line L1 extends along a second direction, the second direction intersects the first direction, and the cutting line L1 has a predetermined distance from the carrier support 5, which reduces the stress transmission and reduces the possibility of cracking of the carrier support 5. The second direction can be perpendicular to the first direction. The position of the cutting line L1 is preferably located at the narrowest part of the connecting part 4 in the second direction, so that the connecting part 4 is more easily cut off.

[0055] As a further improvement of the embodiment, before step S2 or after step S2, step S23 of electroplating the continuous substrate with a reflective layer 23 is further included. In one example, please refer to Figure 2b and Figure 4c Before step S2, the continuous substrate 1 is electroplated with a reflective layer 23, so as to arrange the reflective layer 23 on the surface of the continuous substrate 1. Before the first cutting surface P1 is cut, the entire conductive substrate 2 is covered with the reflective layer 23. Even after the carrier support 5 is subsequently arranged, the conductive part 21 (i.e. the surface of the combination of the conductive part 21 and the carrier support 5) arranged below the carrier support 5 is also covered with the reflective layer 23. In another example, please refer to Figure 2c and Figure 4dAfter step S2, the continuous substrate 1 is electroplated with a reflective layer 23. Since the carrier support 5 has been set at this time, the surface of the carrier support 5 combined with the conductive part 21 is blocked and cannot be electroplated, but the other exposed surface of the conductive substrate 2 can be electroplated. The reflective layer 23 can be a silver plating layer. Since the reflectivity of silver is higher than that of copper, silver plating can improve the reflectivity of the components including the conductive substrate 2, the conductive part 21, and the protruding part 22, and improve the brightness of the prepared light emitting device 7.

[0056] In the above method, the conductive substrate 2 has at least two functions, one of which is to provide electrical connection for the set light emitting element 6, and the other of which is to provide support for the carrier support 5. The punching hole 11 can also provide a positioning point for the mold during the step of setting the carrier support 5, facilitate the installation of the mold, and also reduce the weight of the continuous substrate 1.

[0057] In the above method, the carrier support 5 is set before cutting part of the protruding part 22 in order to make full use of the area of the protruding part 22, so that the mold provides a clamping position when the carrier support 5 is set by the mold. After the carrier support 5 is formed, the mold is not needed in the subsequent process, and the protruding part 22 does not need to provide a clamping position for the mold and maintain the area. In order to reduce the weight of the continuous substrate 1 and recycle materials, and because the remaining support communication part 52 and support overflow part 53 need to be removed, part of the protruding part 22 can be cut off to reduce the material of the continuous substrate 1, recycle part of the metal material, and remove the remaining support communication part 52 and support overflow part 53 at the same time, which facilitates the subsequent setting of the light emitting element 6. Therefore, in this embodiment, after the step of setting the carrier support 5, part of the protruding part 22 is cut off before the light emitting element 6 is set.

[0058] In the above method, if the continuous substrate 1 is electroplated before and after step S2, in step S5, the connecting part 4 is cut along the cutting line L1 to separate the conductive substrate 2 from the frame part 3; after separation, the connecting part 4 connected with the protruding part 22 is cut to form a second cutting surface P2, and the second cutting surface P2 does not cover the reflective layer, but is the original material of the continuous substrate 1 exposed by cutting. If the continuous substrate is electroplated before step S3, the first cutting surface P1 formed after cutting part of the protruding part 22 in step S3 will not cover the reflective layer, but will be the original material of the continuous substrate 1 exposed.

[0059] In one embodiment, the step of setting the reflective layer is placed before the step of setting the supporting frame 5, so that the whole continuous substrate 1 is plated to form the reflective layer, and if the supporting frame 5 is made of transparent material, the light emitted by the light emitting element 6 can be refracted outward through the transparent sidewall of the supporting frame 5, so as to increase the light emitting angle of the light emitting device 7; and since the conductive part 21 under the supporting frame 5 is also covered with the reflective layer, it has the function of reflecting light, so as to reduce the absorption of light by the part of the conductive substrate 2 covered with transparent material, and improve the light efficiency of the light emitting device 7.

[0060] In the embodiment, the second cutting surface P2 is farther away from one side of the supporting frame 5 than the first cutting surface P1. The first cutting surface P1 includes the surface formed by cutting the corner area of the protruding part 22, so that the excess glue part 53 of the supporting frame can be removed more completely, and the protruding part closer to the middle area can be retained in part when cutting to connect with the connecting part 4, so as to maintain the stability of the connection between the conductive part 21 and the frame part 3.

[0061] In the embodiment, the second cutting surface P2 is farther away from one side of the supporting frame 5 than the first cutting surface P1. The first cutting surface P1 includes the surface formed by cutting the corner area of the protruding part 22, so that the excess glue part 53 of the supporting frame can be removed more completely, and the protruding part closer to the middle area can be retained in part when cutting to connect with the connecting part 4, so as to maintain the stability of the connection between the conductive part 21 and the frame part 3. Figure 5a and Figure 5b In the step S3, part of the protruding part 22 is cut, and part of the connecting part 4 is also removed, so that only one connecting part 4 is left on each side to connect with the conductive substrate 2 and the frame part 3, and the connecting parts 4 on the two opposite sides of the supporting frame 5 are staggered in the first direction and rotationally symmetrical about the center point of the supporting frame 5. When the light emitting element 6 and the encapsulating glue are set, the two connecting parts 4 can maintain the stability of the conductive part 21 and the supporting frame 5. At the same time, this is also to make it easier to cut the connecting part 4 in the step S5 to separate the supporting frame 5 from the frame part 3, and if the number of connecting parts 4 is large, it will increase the difficulty of cutting the connecting part 4 in the step S5. In the embodiment, part of the protruding part 22 is also retained to connect with the remaining connecting part 4, and reference is made to Figure 10a and Figure 10bThe remaining protruding portion 22 is a protruding residual portion 220. The protruding residual portion 220 includes an edge area 221 and a buffer area 222. The edge area 221 is closer to the edge of the carrier support 5 than the buffer area 222. The buffer area 222 is located between the edge area 221 and the cutting line L1. Thus, when cutting along the cutting line L1 to form the first cutting surface, the buffer area 222 is not cut, facilitating the cutting of the connecting portion 4. The buffer area 222 is located away from the edge of the carrier support 5 and is connected to the connecting portion 4 and is located at the middle of the connecting portion 4 close to the conductive substrate 2. In the step S5 of cutting the connecting portion 4, the buffer area 222 can provide stress buffering. The stress generated when cutting the connecting portion 4 can be received and dispersed by the buffer area 222, avoiding the situation that the carrier support 5 is cracked when the cutting position is close to the carrier support 5. The buffer area 222 can also strengthen the structural strength of the connecting portion 4, so that the connecting portion 4 can sufficiently maintain the stability of the conductive portion 21 and the carrier support 5. In the embodiment, the light emitting element 6 is preferably a flip chip, so that the size of the light emitting device 7 can be miniaturized and lightened, the load of the connecting portion 4 can be reduced, and the structure in which the conductive portion 21 is connected to the frame portion 3 through two connecting portions 4 arranged staggered on two opposite sides of the carrier support 5 is more suitable.

[0062] In another embodiment, referring to Figure 8a , Figure 8b and Figure 8c , in the step S3 of cutting part of the protruding portion 22, any connecting portion 4 is not cut off. There are still two connecting portions 4 on each side to connect the conductive substrate 2 to the frame portion 3. The connecting portions 4 on the two opposite sides of the carrier support 5 are symmetrical about the longitudinal axis of the carrier support 5. The two connecting portions 4 on each side of the carrier support 5 can maintain the stability of the conductive portion 21 and the carrier support 5. Referring to the light emitting device 7 shown in Figure 11a and Figure 11b , the remaining protruding residual portion 220 can only retain the edge area and does not need the buffer area. Thus, the volume of the protruding residual portion 220 can be reduced, the cost can be saved, and the light emitting device can be miniaturized and lightened. Of course, part of the connecting portion 4 can also be cut in the step S3 of cutting part of the protruding portion 22, but the connecting portion 4 is not cut off. The width of the connecting portion 4 in the second direction is narrowed. This is done to make it easier to cut the connecting portion 4 in the step S5. The light emitting device obtained after the connecting portion 4 is cut off is shown in Figure 11a and Figure 11b . The width of the connecting portion 4 is not necessarily smaller. It also needs to be able to maintain the connection state between the conductive substrate 2 and the frame portion 3. If the width of the connecting portion 4 in the second direction is already very small when the continuous sheet substrate 1 is formed in the step S1, and part of the material is removed, the carrier support 5 cannot be supported. Thus, the connecting portion 4 cannot be removed.

[0063] In another embodiment, referring to Figure 9a ,Figure 9b And Figure 9c Since the setting of the carrier support 5 has been completed before the cutting of the protruding portion, the carrier support 5 is connected to two conductive substrates 2, therefore only the protruding portion on one side of the carrier support 5 is cut in step S3 when cutting the protruding portion 22, while all the connecting portions on the same side can be cut off, leaving only two connecting portions on the other side still connected to one conductive substrate 2 and the frame portion 3, the two connecting portions 4 on one side of the carrier support 5 are symmetrical about the transverse axis of the carrier support 5. The width of the two connecting portions 4 on one side of the carrier support 5 in the second direction is wide enough to maintain the stability of the conductive portion 21 and the carrier support 5, please refer to Figure 11a And Figure 11b The remaining protruding residual portion 220 can only leave the edge area 221 without the need for a buffer area, so that the volume of the protruding residual portion 220 can be reduced, saving costs. The light emitting device 7 obtained after cutting the connecting portion 4, please refer to Figure 12a And Figure 12b .

[0064] According to the manufacturing method of the light emitting device 7 provided by the embodiment of the present application, since the carrier support 5 is only supported by the conductive portion 21, it is not necessary to set metal clamping points to provide support to the carrier support 5, thereby avoiding damage to the carrier support 5 caused by the metal clamping points, reducing the damage rate of the carrier support, and improving the product yield. Embodiment Two

[0065] Please refer to Figure 10a And Figure 10b The embodiment provides a light emitting device 7, which comprises a carrier support 5, a light emitting element 6, a pair of conductive substrates 2 and a connecting residual portion 41; the pair of conductive substrates 2 comprises two conductive substrates 2 arranged opposite to each other in a first direction, and each conductive substrate 2 comprises a conductive portion 21 and a protruding residual portion 220 connected to each other; the carrier support 5 is fixed to the conductive portion 21 and encloses the conductive portion 21 to form a containing space 51; the protruding residual portion 220 is exposed to two opposite sides of the carrier support 5, and the connecting residual portion 41 protrudes away from the conductive portion 21 on one side of each protruding residual portion 220; the protruding residual portion 220 is provided with a first cutting surface P1 formed by being partially cut, and the first cutting surface P1 is formed on both sides of the connecting residual portion 41; the connecting residual portion 41 has a second cutting surface P2 formed by being cut off; the light emitting element 6 is installed in the containing space 51, and the light emitting element 6 is electrically connected to the conductive portion 21.

[0066] In the embodiment, the first direction is a direction consistent with the connecting line of the center points of the two conductive substrates 2.

[0067] The light emitting device 7 of the embodiment can be manufactured by the manufacturing method of the light emitting device provided by the embodiment one, but is not limited thereto.

[0068] Reference is made to Figure 4b , Figure 5a and Figure 5b , the protruding residual part 220 is the part left after the protruding part 22 protruding outside the carrier support 5 is partially cut during the manufacturing process of the light emitting device 7. The purpose of cutting the protruding part 22 is to reduce the area of the protruding part 22 exposed to the carrier support 5 to reduce the influence of the light absorption of the protruding part on the light efficiency of the light emitting device 7. In order to avoid excessive stress being transmitted to the carrier support 5 during the cutting process of the protruding part 22, causing the carrier support 5 to crack, the first cutting surface P1 is kept a certain distance from the carrier support 5, reducing the stress transmission and effectively reducing the possibility of the carrier support 5 cracking due to cutting the protruding residual part 220.

[0069] Reference is made to Figure 7 , the connecting residual part 41 is the part left after the connecting part 4 connecting the light emitting device 7 with other components is cut along the cutting line L1 during the manufacturing process of the light emitting device 7. The second cutting surface P2 is the cutting surface formed by cutting the connecting part 4 along the second direction. In this embodiment, the first direction is perpendicular to the second direction.

[0070] In this embodiment, the first cutting surface P1 is closer to the carrier support than the second cutting surface P2, and the first cutting surface P2 is at least partially formed by cutting the corner area of the protruding part 22.

[0071] In this embodiment, among the two opposite sides of the light emitting device 7 provided with the connecting residual part 41, there is only one connecting residual part 41 on each side, and the connecting residual part 41 on each side is arranged offset from the middle position of the side of the light emitting device 7, and the connecting residual parts 41 on the two opposite sides of the light emitting device 7 are staggered in the first direction and rotationally symmetric about the center point of the carrier support 5. Reference is made to Figure 6 and Figure 7 , during the manufacturing process of the light emitting device 7, after the carrier support 5 and the light emitting device 6 are arranged, before the connecting part 22 is cut, each conductive substrate 2 is connected to the frame part 3 through a connecting part 4. In this embodiment, there is only one connecting residual part 41 on each of the two opposite sides of the light emitting device 7 in the first direction, so that during the manufacturing process of the light emitting device 7, the connecting residual part 41 can be connected to the frame 3, which can maintain the connection state between the conductive substrate 2 and the frame part 3, and also makes it easy to cut the connecting part 4, thereby making the light emitting device 7.

[0072] In this embodiment, the protruding residual part 41 includes an edge area 221 and a buffer area 222; the edge area 221 is closer to the edge of the carrier support 5 than the buffer area 222, and the buffer area 222 is away from the edge of the carrier support 5 and is connected to the connecting residual part 41 and is located at the middle position of the connecting residual part 41 close to the conductive substrate 2. Reference is made to Figure 7The buffer area 222 can provide stress buffering during the process of cutting the connecting portion 4 during the manufacturing of the light emitting device 7. The edge of the buffer area 222 away from the conductive portion 21 is located between the edge of the conductive portion 21 and the cutting line L1 of the second cutting surface P2, so that the buffer area 222 will not be cut when the second cutting surface P2 is cut along the cutting line L1. Since the buffer area 222 is away from the carrier support 5, the buffer area 222 can provide stress buffering and reduce the impact on the carrier support 5 when the second cutting surface P2 is cut. The buffer area 222 can also enhance the mechanical strength of the connecting portion 4.

[0073] The width of the buffer area 222 in the second direction is less than the width of the conductive portion 21.

[0074] In the present embodiment, the first cutting surface P1 connecting the two sides of the connecting residual portion 41 includes a plane P11 located at the side of the edge area 221 of the protruding residual portion 41 and a curved surface P12 located at the side of the buffer area of the protruding residual portion 41. In the plane P11 connecting the two sides of the connecting residual portion 41, the planes P11 of the edge areas 221 located at the same side of the light emitting device 7 are all located on the same plane in the second direction, and the curved surface P12 is connected to the plane P11 and extends away from the carrier support. In the present embodiment, the curved surface P12 smoothly transitions from the first direction to the second direction, which is perpendicular to the first direction. The curved surface P12 has the effect of avoiding stress concentration between the buffer area 222 and the edge area 221 when the connecting portion is cut.

[0075] In the second direction, the area of the first cutting surface P1 is less than the area of the second cutting surface P2.

[0076] In the present embodiment, referring to Figure 4c and Figure 4d The conductive substrate 2 is provided with a reflective layer 23 covering at least part of the surface of the conductive substrate 2 facing the carrier support 5. The reflective layer 23 can reflect the light emitted by the light emitting device 6, reducing the light absorption of the conductive substrate 2 and reducing the impact on the light efficiency of the light emitting device 7. The reflective layer 23 can be formed by electroplating to form a metal reflective layer. Specifically, the conductive substrate 2 is generally made of copper, and the required reflective layer 23 can be formed by silver plating. Since the reflectivity of silver is higher than that of copper, silver plating can improve the reflectivity of the components including the conductive portion 21, the protruding portion 22, and the like of the conductive substrate 2, and improve the brightness of the light emitting device 7. In the present embodiment, referring to Figure 4cThe side wall of the bearing bracket 5 is made of transparent material, the reflective layer 23 can cover the surface of the whole conductive substrate 2, including the surface of the conductive substrate 2 combined with the bearing bracket 5, the light emitted by the light emitting element 6 can be refracted outward through the transparent side wall of the bearing bracket 5, which can increase the light emitting angle of the light emitting device 7, and since the conductive part 21 arranged below the bearing bracket 5 is also covered with the reflective layer 23, the light can also be reflected, thereby further improving the light intensity reflected from the bearing bracket 5. In the embodiment, the first cutting surface P1 and the second cutting surface P2 are not covered with the reflective layer, but are the original material of the continuous substrate 1 exposed after cutting. Figure 4d If the bearing bracket is made of light-proof material, the reflective layer can only cover the surface of the conductive substrate 2 that is not covered by the bearing bracket 5, excluding the surface of the conductive substrate combined with the bearing bracket 5, which can reduce the manufacturing cost of the light emitting device 7.

[0077] In some optional embodiments, the light emitting element 6 includes a flip chip, and two electrodes of the flip chip are fixed to the two conductive substrates 2 and form electrical connection with the conductive substrates 2. Using the flip chip does not require additional wire bonding space in the accommodation space 51 enclosed by the bearing bracket 5 and the conductive part 21, which can miniaturize and lighten the light emitting device 7.

[0078] According to the light emitting device 7 provided by the embodiment of the present application, since the bearing bracket 5 is only supported by the conductive part 21, it is not necessary to provide metal clamping points to support the bearing bracket, thereby avoiding damage to the bearing bracket 5 caused by the metal clamping points, reducing the damage rate of the bearing bracket 5, and improving the product yield. Embodiment three

[0079] Referring to Figure 11a and Figure 11b , the embodiment provides a light emitting device 7. The difference between the embodiment and the embodiment one is that, in the embodiment, the light emitting device 7 is provided with two connection residual parts 41 on each of the two opposite sides, the two connection residual parts 41 on each side are two, and the two connection residual parts 41 on the two sides are symmetrically arranged with respect to the longitudinal axis of the light emitting device 7, and the two connection residual parts 41 on the same side are symmetrically arranged with respect to the transverse axis of the light emitting device 7. Moreover, the width of the connection residual part 41 in the second direction in the embodiment is narrower than that in the connection residual part 41 in the embodiment two. Moreover, the protruding residual part 220 in the embodiment has no buffer zone, but only has an edge zone 221. The edge zone 221 is close to the edge of the bearing bracket 5 and maintains a predetermined distance from the edge of the bearing bracket 5, and the edge zone 221 and the protruding residual part 41 are connected by a curved surface P12, wherein the side surface of the edge zone 221 on the same side of the light emitting device 4 is a plane P11 and the planes are located on the same plane. The curved surfaces P11 and P12 are both components of the first cutting surface P1.

[0080] In the embodiment, the light emitting device 7 is stably supported by two pairs of connecting portions on two opposite sides during the manufacturing process, and the stress is uniformly distributed. Therefore, the protruding portions can be cut off in multiple parts, and the buffer zone is not needed. The volume of the protruding residual portion 220 can be reduced, the weight of the light emitting device 7 can be reduced, and the production cost can be reduced. In addition, the connecting portions are relatively narrow, and the connecting portions can be easily cut off. The other parts of the embodiment are the same as those of the second embodiment. Embodiment Four

[0081] Reference Figure 12a and Figure 12b The embodiment provides a light emitting device 7. The difference between the embodiment and the first embodiment is that, in the embodiment, the reference Figure 9a , Figure 9b , Figure 9c In the manufacturing process of the light emitting device 7, the connecting portion 4 on one side of the light emitting device 7 is cut off together with the cutting of the protruding portion 22, and the light emitting device 7 is provided with the connecting residual portion 41 only on the other side. In the embodiment, the protruding portion on the side provided with the connecting residual portion 41 does not need to be cut off in multiple parts. Therefore, the protruding portion 22 on the side is a complete protruding portion, and is not cut off in any way, and does not have a protruding residual portion. Since there is only one connecting portion, the mechanical strength of the connecting portion is relatively high. Therefore, the width of the connecting portion in the second direction is larger than the width of the connecting portion in the second and third embodiments. The other parts of the embodiment are the same as those of the second embodiment.

[0082] In the embodiment, the pair of conductive substrates includes two first conductive substrates 2a and two second conductive substrates 2b, which are oppositely arranged in the first direction. The first conductive substrate 2a includes the conductive portion 21 and the protruding residual portion 220. The second conductive substrate 2b includes the conductive portion 21, the protruding portion 22, and the connecting residual portion 41. The connecting residual portion 41 protrudes from the protruding portion 22 to the side away from the conductive portion 21. The bearing bracket 5 is fixed to the conductive portion 21 of the first and second conductive substrates 2a and 2b, and encloses the conductive portion 21 to form the accommodation space 51. The protruding portion 22 and the protruding residual portion 220 are exposed on the two opposite sides of the bearing bracket 5, and the protruding residual portion 220 is provided with the first cutting surface P1 formed by cutting. The first cutting surface P1 is formed on the side of the first conductive substrate 2a. The connecting residual portion 41 has the second cutting surface P2 formed by cutting. The light emitting element 6 is mounted in the accommodation space 51, and the light emitting element 6 is electrically connected to the conductive portion 21.

[0083] The light emitting device 7 in the embodiment can be separated from the frame part in the last step of the manufacturing process. Since the connecting part 4 is only arranged on one side, only the connecting part on the side needs to be cut, which is convenient for manufacturing. In the manufacturing process, after the light emitting device is arranged in the accommodating space 51 of the supporting frame 5, when the reflow soldering equipment is used, the deformation of the continuous substrate 1 and the supporting frame 5 caused by the heat can be released to a certain extent through the other side without the connecting part, so that the stress concentration is reduced, and the supporting frame and the conductive substrate are not damaged due to excessive deformation.

[0084] Based on the disclosure of the embodiment, in other embodiments, if the strength of the connecting part 4 is sufficient to support the supporting frame 5 during the manufacturing process of the light emitting device 7, and cutting the protruding part 22 does not affect the support of the supporting frame 5 by the connecting part 4, then a part of the protruding part adjacent to the connecting part on the other side can also be cut off when the protruding part 22 on one side is cut and the connecting part on the side is removed, or a part of the connecting part on the side can also be cut off, so that the width of the remaining connecting part is smaller, thereby facilitating the cutting of the connecting part in the subsequent process.

[0085] The above application of specific examples is used to illustrate the present application, which is only used to help understand the present application, and does not limit the present application. For those skilled in the art to which the present application belongs, according to the idea of the present application, a number of simple deductions, deformations or substitutions can be made.

Claims

1. A method for manufacturing a light emitting device, characterized by, The method comprises the following steps: S1: providing a conductive blank plate and performing stamping treatment on the conductive blank plate to form a continuous substrate having a frame part, a plurality of pairs of conductive substrates, and a plurality of connecting parts, each pair of the conductive substrates comprising two conductive substrates arranged opposite to each other; and each pair of the conductive substrates is connected to the frame part through the connecting part; S2: arranging a bearing support combined with each pair of the conductive substrates; the bearing support is fixed on each of the conductive substrates and encloses a containing space with each of the conductive substrates, and a part of the conductive substrate exposed outside the bearing support is a protruding part; S3: cutting part of the protruding part to remove part of the protruding part to form a first cutting surface, and retaining at least one connecting part to keep the frame part connected to each of the conductive substrates; S4: arranging a light emitting element in the containing space, so that the light emitting element is electrically connected to the conductive substrate; and filling glue in the containing space to encapsulate the light emitting element in the bearing support; S5: cutting the connecting part to form a second cutting surface, and separating the conductive substrate from the frame part; wherein the first cutting surface is closer to the bearing support than the second cutting surface, and each of the connecting parts has the first cutting surface on both sides; and the part of the protruding part remaining after being partially cut comprises an edge region close to the edge of the bearing support and a buffer region close to the middle position of the conductive substrate and connected to the connecting part.

2. The method for manufacturing a light emitting device according to claim 1, wherein Before step S2 or after step S2, the method further comprises step S23: electroplating a reflective layer on the continuous substrate.

3. The method for manufacturing a light emitting device according to claim 1 or 2, wherein The side wall of the bearing support is made of a transparent material.

4. The method for manufacturing a light emitting device according to claim 1, wherein Each of the conductive substrates formed in step S1 has at least two connecting parts connected to the frame part; In step S3, part of the protruding part is cut off at the same time as part of the connecting part is cut off, and only one connecting part is left on each of the conductive substrates to be connected to the frame part; so that each of the bearing supports has only one connecting part on each of the two sides connected to the frame part, and the connecting parts on the two sides of each of the bearing supports are staggered in a first direction and rotationally symmetric with respect to a center point of the bearing support.

5. The method for manufacturing a light emitting device according to claim 1, wherein When part of the protruding part is cut off in step S3, at least part of the protruding part on both sides of the connecting part is cut off, and the first cutting surface formed on both sides of the remaining connecting part comprises a plane and a curved surface, wherein the planes are located on the same plane.

6. A light-emitting device, characterized in that, The light emitting device is prepared by the method according to any one of claims 1-5; and the light emitting device comprises a bearing support, a light emitting element, at least one pair of conductive substrates, and a connecting residual part. The pair of conductive substrates includes two conductive substrates oppositely arranged in a first direction, each of the conductive substrates including a conductive portion and a protruding residual portion; the bearing bracket is fixed on each of the conductive portions and forms a containing space with each of the conductive portions; the protruding residual portion is exposed on two opposite sides of the bearing bracket, and the connecting residual portion protrudes from one side of each of the protruding residual portions away from the conductive portion; the protruding residual portion is provided with a first cutting surface formed by partial cutting, the first cutting surface is formed on both sides of the connecting residual portion, and the connecting residual portion has a second cutting surface formed after being cut off; the light emitting element is mounted in the containing space, and the light emitting element is electrically connected with the conductive portion.

7. The light emitting device of claim 6, wherein the first and second light emitting layers are formed of a material having a band gap of 2.5 eV or more. Among the two opposite sides of the light emitting device provided with the connecting residual portion, the connecting residual portion of each side is only one and deviates from the middle position of one side of the light emitting device, and the connecting residual portions of the two opposite sides of the light emitting device are staggered in the first direction and rotationally symmetric about the center point of the bearing bracket.

8. The light emitting device of claim 6, wherein the first and second light emitting layers are formed of a material having a band gap of 2.5 eV or more. The protruding residual portion includes an edge region and a buffer region; the edge region is closer to the edge of the bearing bracket than the buffer region, and the buffer region is away from the edge of the bearing bracket and connected with the connecting residual portion and located at the middle position of the connecting residual portion close to the conductive substrate.

9. The light emitting device of claim 8, wherein the first and second light emitting layers are formed of a material having a band gap of 2.5 eV or more. The first cutting surface on both sides of the connecting residual portion includes a plane located in the edge region of the protruding residual portion and a curved surface located in the buffer region of the protruding residual portion, wherein the planes located in the edge regions of the same side of the light emitting device are located on the same plane, and the curved surface is connected with the plane and extends away from the bearing bracket.

10. The light emitting device of claim 6, wherein the first and second light emitting layers are formed of a material having a band gap of 2.5 eV or more. The bearing bracket is made of light-transmitting material; the surface of the conductive substrate is provided with a reflective layer; the first cutting surface and the second cutting surface do not cover the reflective layer, and the reflective layer covers at least the joint surface of the bearing bracket and the conductive substrate.

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