A quantum dot Mini LED packaging device and display device

Abstract

The present application provides a quantum dot Mini LED packaging device and a display device. The quantum dot Mini LED packaging device includes a flip-chip blue light LED chip, a first color conversion layer and a second color conversion layer. The flip-chip blue light LED chip includes a first surface and a second surface relative to each other, and the second surface is a light emitting surface of the flip-chip blue light LED chip; the first color conversion layer is arranged on a side of the second surface away from the first surface, and the first color conversion layer includes red phosphor and first light scattering particles; the second color conversion layer is arranged on a side of the first color conversion layer away from the flip-chip blue light LED chip, and the second color conversion layer includes green quantum dots and first light scattering particles; the first light scattering particles are silicon dioxide nanoparticles, and the density of the first light scattering particles in the second color conversion layer is greater than the density of the first light scattering particles in the first color conversion layer. The quantum dot Mini LED packaging device provided by the present application has the advantages of high stability, long service life and high color gamut.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and specifically to a quantum dot Mini LED packaging device and a display device. Background Art

[0002] Light Emitting Diode (LED) is an electroluminescent semiconductor light-emitting device. It has been widely used in lighting, display, medical treatment, optical communication and other fields due to its advantages of low energy consumption, small size, long life, good stability, fast response and stable wavelength. Taking the display field as an example, in many scenarios such as office and entertainment, users will use medium and large-sized display devices to carry out activities such as watching movies, e-sports, video editing, image processing, etc., which have high requirements on the color expression of the display device. At present, liquid crystal display devices are still the mainstream of medium and large-sized display devices.

[0003] The liquid crystal display device generally includes two parts: a backlight module and a liquid crystal display panel. The LED light board in the backlight module is used to generate basic light for display. The basic light is processed by the light-homogenizing component in the backlight source and becomes a uniform surface light source to be emitted into the liquid crystal display panel. The liquid crystal display panel includes an array substrate, a liquid crystal layer and a color film substrate. The basic light emitted by the LED light board is sequentially emitted from the liquid crystal display panel through the light-homogenizing component, the array substrate, the liquid crystal layer and the color film substrate and is perceived by the user. Specifically, the output light of the LED package device in the LED light board is white light. The array substrate can control the deflection of the liquid crystal molecules in each sub-pixel unit area, so that the white light in a specific sub-pixel unit area can be transmitted to the color film substrate in the corresponding sub-pixel unit area. After the white light is filtered by the color filter in the color film substrate, each sub-pixel unit area can only emit red, green and blue monochromatic light in a fixed wavelength range in the white light, thereby realizing color display. That is, the spectrum of the white light emitted by the LED package device plays a key role in the color performance of the display device. When the monochromatic spectrum purity of the white light emitted by the LED package device is low and the color gamut performance is poor, it will directly affect the color performance of the monochromatic output light of each sub-pixel unit area, thereby affecting the overall color performance of the liquid crystal display device and reducing its market competitiveness.

[0004] At present, the color gamut performance of the white light LED package device of blue light LED chip + phosphor layer can no longer meet the color performance requirements of high-end display products, and the packaging structure of a simple blue light LED chip + quantum dot layer has the problems of low stability and short service life. Therefore, how to improve the color gamut of the emitted white light of the LED package device while taking into account the stability and service life of the LED package device, thereby improving the color expression and market competitiveness of the display device, is a technical problem that technicians in this field need to solve urgently. Summary of the invention

[0005] The present application provides a quantum dot Mini LED packaging device and a display device, which can effectively solve the problem that white light LED packaging devices in related technologies cannot simultaneously meet the requirements of high stability, long service life and high color gamut.

[0006] In a first aspect, the present application provides a quantum dot Mini LED packaging device, which includes: a flip-chip blue light LED chip, including a first surface and a second surface arranged opposite to each other, the second surface being one of the light emitting surfaces of the flip-chip blue light LED chip; a first color conversion layer, arranged on a side of the second surface away from the first surface, the first color conversion layer including red phosphor and first light scattering particles; a second color conversion layer, arranged on a side of the first color conversion layer away from the flip-chip blue light LED chip, the second color conversion layer including green quantum dots and first light scattering particles; wherein the first light scattering particles are silicon dioxide nanoparticles, and the density of the first light scattering particles in the second color conversion layer is greater than the density of the first light scattering particles in the first color conversion layer.

[0007] Optionally, the second color conversion layer further includes first thermally conductive particles, the thermal conductivity of the first thermally conductive particles is greater than the thermal conductivity of the first light scattering particles, and the difference between the thermal conductivity of the first thermally conductive particles and the thermal conductivity of the first light scattering particles is greater than 10.

[0008] Optionally, the first thermally conductive particles are boron nitride nanosheets.

[0009] Optionally, the quantum dot Mini LED packaging device also includes: a heat sink; a heat sink dam, which is arranged on the side of the heat sink facing the flip-chip blue light LED chip, and the heat sink dam has a groove, and the flip-chip blue light LED chip, the first color conversion layer, and the second color conversion layer are located in the groove and are stacked in sequence in the direction of the heat sink toward the heat sink dam; wherein the side wall of the second color conversion layer is in direct contact with the heat sink dam.

[0010] Optionally, the side walls of the second color conversion layer, the side walls of the first color conversion layer, and the side walls of the flip-chip blue light LED chip are all in direct contact with the heat dissipation dam, wherein the quantum dot Mini LED packaging device also includes a first thermal barrier layer, and the first thermal barrier layer is arranged between the flip-chip blue light LED chip and the first color conversion layer.

[0011] Optionally, the side walls of the second color conversion layer and the side walls of the first color conversion layer are in direct contact with the heat dissipation dam, and the side walls of the flip-chip blue light LED chip are spaced apart from the heat dissipation dam, wherein the quantum dot MiniLED packaging device also includes a second thermal barrier layer, and the second thermal barrier layer covers the flip-chip blue light LED chip.

[0012] Optionally, the side walls of the first color conversion layer and the side walls of the flip-chip blue light LED chip are spaced apart from the heat dissipation dam, wherein the quantum dot Mini LED packaging device also includes a third thermal barrier layer, and the third thermal barrier layer covers the flip-chip blue light LED chip and the first color conversion layer.

[0013] Optionally, a thermal interface material layer is provided on the side wall of the second color conversion layer, and the thermal interface material layer is in direct contact with the heat dissipation dam, wherein the quantum dot Mini LED packaging device further includes: a fourth thermal barrier layer, covering the side wall of the flip-chip blue light LED chip and the side wall of the first color conversion layer, and exposing the surface of the first color conversion layer away from the flip-chip blue light LED chip; a fifth thermal barrier layer, arranged between the first color conversion layer and the second color conversion layer; wherein the fifth thermal barrier layer includes the first light scattering particles, wherein the density of the first light scattering particles in the second color conversion layer is greater than the density of the first light scattering particles in the fifth thermal barrier layer, and the density of the first light scattering particles in the fifth thermal barrier layer is greater than the density of the first light scattering particles in the first color conversion layer.

[0014] Optionally, the quantum dot Mini LED packaging device also includes a light-transmitting substrate, which is arranged on the side of the second color conversion layer away from the first color conversion layer and is located in the groove; wherein the side wall of the light-transmitting substrate is flush with the side wall of the second color conversion layer and is in direct contact with the heat dissipation dam.

[0015] In a second aspect, the present application provides a display device, comprising: a backlight module, including an LED light board; a liquid crystal display panel, arranged on the light output side of the backlight module, the liquid crystal display panel comprising an array substrate, a color film substrate and a liquid crystal layer, the liquid crystal layer being located between the array substrate and the color film substrate; wherein the LED light board comprises the quantum dot Mini LED packaging device described in any one of the above items.

[0016] Beneficial effects of this application:

[0017] The quantum dot Mini LED packaging device provided in the present application utilizes the blue light of the flip-chip blue LED chip to irradiate the red phosphor in the first color conversion layer, thereby generating red light, and utilizes the blue light of the flip-chip blue LED chip to irradiate the green quantum dots in the second color conversion layer, thereby generating green light. The red light, green light and blue light are mixed to realize the white light emission of the LED packaging device. Moreover, since the green light excited by the green quantum dots has a wider excitation spectrum and a narrower emission spectrum than the green light excited by the green phosphor, the spectral coverage is higher, thereby effectively improving the color gamut of the emitted white light of the quantum dot Mini LED packaging device. Moreover, since the green quantum dots with poor temperature resistance are arranged on the side of the first color conversion layer away from the flip-chip blue LED chip, the risk of heat failure of the green quantum dots caused by the temperature increase of the flip-chip blue LED chip can be reduced, thereby improving the stability of the quantum dot Mini LED packaging device and extending its service life. On this basis, the present application can effectively reduce the blue light energy per unit area of ​​the second color conversion layer by setting first light scattering particles in the first color conversion layer, and enhance scattering and improve quantum excitation efficiency by setting first light scattering particles in the second color conversion layer. In addition, the present application can effectively increase the spacing between green quantum dots in the second color conversion layer by making the density of the first light scattering particles in the second color conversion layer greater than the density of the first light scattering particles in the first color conversion layer, thereby reducing the probability of reabsorption and weakening the self-heating effect, thereby further improving stability, extending life and improving color gamut, thereby improving the color expression of the display device using the quantum dot Mini LED packaging device and enhancing market competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0019] Figure 1 This is a schematic diagram of the structure of the quantum dot Mini LED packaging device provided in Example 1 of the present application.

[0020] Figure 2 A schematic diagram of the structure of a display device provided in an embodiment of the present application.

[0021] Figure 3 This is a schematic diagram of the structure of the quantum dot Mini LED packaging device provided in Example 2 of the present application.

[0022] Figure 4 This is a schematic diagram of the structure of the quantum dot Mini LED packaging device provided in Example 3 of the present application.

[0023] Figure 5 This is a schematic diagram of the structure of the quantum dot Mini LED packaging device provided in Example 4 of the present application.

[0024] Description of reference numerals:

[0025] Quantum dot Mini LED packaging device M0; flip-chip blue light LED chip 10; first surface 11; second surface 12; first color conversion layer 20; second color conversion layer 30; heat dissipation carrier 40; heat dissipation dam 50; groove 51; first thermal barrier layer 60; transparent substrate 70; second thermal barrier layer 80; first part 81; second part 82; third thermal barrier layer 90; third part 91; fourth part 92; fourth thermal barrier layer 100; fifth thermal barrier layer 110; backlight module M1; LED light board M11; optical element M12; liquid crystal display panel M2; array substrate M21; color film substrate M22; liquid crystal layer M23. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0027] The terms "first" and "second" in this document are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0028] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0029] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0030] Embodiment 1

[0031] Figure 1 This is a schematic diagram of the structure of the quantum dot Mini LED packaging device provided in Example 1 of the present application. Figure 1 As shown, in the first aspect, the first embodiment of the present application provides a quantum dot Mini LED package device M0, the quantum dot Mini LED package device M0 includes a flip-chip blue light LED chip 10, a first color conversion layer 20 and a second color conversion layer 30, wherein the flip-chip blue light LED chip 10 includes a first surface 11 and a second surface 12 arranged opposite to each other, the first surface 11 is an electrode setting surface of the flip-chip blue light LED chip 10, and the second surface 12 is one of the light emitting surfaces of the flip-chip blue light LED chip 10; the first color conversion layer 20 is arranged on the side of the second surface 12 away from the first surface 11, and the first color conversion layer 20 includes red phosphor and first light scattering particles; the second color conversion layer 30 is arranged on the side of the first color conversion layer 20 away from the flip-chip blue light LED chip 10, and the second color conversion layer 30 includes green quantum dots and first light scattering particles; wherein the first light scattering particles are silicon dioxide nanoparticles, and the density of the first light scattering particles in the second color conversion layer 30 is greater than the density of the first light scattering particles in the first color conversion layer 20.

[0032] In the quantum dot Mini LED package device M0 provided in the embodiment of the present application, the flip-chip blue light LED chip 10 is capable of generating blue light and emitting the blue light into the first color conversion layer 20 from the second surface 12 . Part of the blue light incident into the first color conversion layer 20 can be absorbed by the red phosphor and stimulated to emit red light after being irradiated by the red phosphor, and the red light can be emitted to the outside of the quantum dot Mini LED package device M0 via the second color conversion layer 30; another part of the blue light incident into the first color conversion layer 20 can be incident into the second color conversion layer 30, wherein part of the blue light incident into the second color conversion layer 30 can be absorbed by the green quantum dots and stimulated to emit green light with higher spectral purity after being irradiated by the green quantum dots, and then emitted to the outside of the quantum dot Mini LED package device M0; another part of the blue light incident into the second color conversion layer 30 can be emitted to the outside of the quantum dot Mini LED package device M0 via the second color conversion layer 30, and the red light, green light and blue light are mixed to achieve white light emission of the LED package device. Moreover, since the green light excited by green quantum dots has a wider excitation spectrum and a narrower emission spectrum than the green light excited by green phosphor, and has a higher spectral coverage, it can effectively improve the problem of low purity of the green spectrum excited by the phosphor layer in the related technology, thereby effectively improving the color gamut of the output white light of the quantum dot Mini LED packaging device M0.

[0033] Secondly, in the quantum dot Mini LED package device M0 provided in the embodiment of the present application, there is a threshold value for the electro-optical conversion efficiency of the flip-chip blue LED chip 10. During the light-emitting process of the flip-chip blue LED chip 10, a portion of the electrical energy will be lost in the form of heat energy, that is, the flip-chip blue LED chip 10 will generate a large amount of heat during the light-emitting process, and cause the temperature of the flip-chip blue LED chip 10 to rise, and the quantum dot material is more sensitive to temperature and is prone to failure due to heat. The present application sets the green quantum dots with poor temperature resistance on the side of the first color conversion layer 20 away from the flip-chip blue LED chip 10, thereby reducing the risk of heat failure of the green quantum dots caused by the temperature increase of the flip-chip blue LED chip 10, thereby improving the stability of the quantum dot Mini LED package device M0 and extending its service life.

[0034] In addition, in the quantum dot Mini LED packaging device M0 provided in the embodiment of the present application, since the first color conversion layer 20 is provided with first light scattering particles, part of the blue light that is not absorbed by the red phosphor and is incident on the first color conversion layer 20 can be more evenly incident on the second color conversion layer 30 after being scattered by the first light scattering particles, thereby destroying the Lambertian distribution of the blue light intensity, allowing the blue light to be more evenly irradiated to various positions of the second color conversion layer 30, effectively reducing the blue light energy per unit area of ​​the second color conversion layer 30, and avoiding the problem of quantum dot failure caused by blue light concentration, thereby improving the stability of the quantum dot Mini LED packaging device M0 and extending its service life.

[0035] Moreover, in the quantum dot Mini LED packaging device M0 provided in the embodiment of the present application, since the second color conversion layer 30 is provided with the first light scattering particles, the blue light incident into the second color conversion layer 30 can be more dispersed, thereby increasing the optical path of the blue light in the second color conversion layer 30, thereby allowing as many green quantum dots as possible to be excited, thereby improving the quantum excitation efficiency.

[0036] More importantly, the applicant has found that a key problem in the application of quantum dots in LED packaging devices is that the packaging devices are small in size and have strong spatial sealing, which makes the quantum dots very easy to fail due to excessive temperature. However, when the distance between the green quantum dots in the quantum dot layer is too close, reabsorption is likely to occur, which not only wastes light energy and reduces light efficiency, but also generates heat due to reabsorption, thereby causing quantum dot failure. In the quantum dot Mini LED packaging device M0 provided in the embodiment of the present application, since the first light scattering particles are silicon dioxide nanoparticles, the silicon dioxide nanoparticles not only have excellent scattering effects, but can also increase the spacing between the green quantum dots in the second color conversion layer 30, thereby reducing the probability of reabsorption, weakening the self-heating effect, and avoiding the problem of quantum dot failure caused by self-heating of green quantum dots, thereby improving stability and extending life.

[0037] Furthermore, the applicant has found that in the process of preparing the first color conversion layer 20 and the second color conversion layer 30 of the same thickness, when the same dosage of silica nanoparticles is doped into the first color conversion layer 20 and the second color conversion layer 30 respectively, after a long period of aging, a certain proportion of green quantum dots in the second color conversion layer 30 will still have a certain probability of failure. Since the silica nanoparticles in the second color conversion layer 30 have the functions of both scattering and increasing the distance between quantum dots, when the density of silica nanoparticles in the second color conversion layer 30 is greater than the density of silica nanoparticles in the first color conversion layer 20, not only can the distance between two adjacent quantum dots be enlarged, but also the dispersion degree of blue light in the second color conversion layer 30 can be further enlarged compared with the dispersion degree of blue light in the first color conversion layer 20, thereby avoiding the blue light energy aggregation at a single point, and also greatly increasing the probability that the green light excited by the green quantum dots is dispersed by the silica nanoparticles, thereby further improving the stability and extending the life.

[0038] In some embodiments of the present application, in a direction in which the second color conversion layer 30 is away from the first color conversion layer 20 , the density of the first light scattering particles in the second color conversion layer 30 increases sequentially.

[0039] After further research, the applicant found that in the process of preparing the first color conversion layer 20 and the second color conversion layer 30 of the same thickness, when the same dose of silicon dioxide nanoparticles are doped into the first color conversion layer 20 and the second color conversion layer 30 respectively, after a long period of aging, a certain proportion of green quantum dots in the second color conversion layer 30 will still have a certain probability of failure. The deep-seated reason is that in the process of blue light being emitted from the first color conversion layer 20 to the outside through the second color conversion layer 30, the amount of blue light is continuously reduced due to the absorption of green quantum dots, that is, the closer the green quantum dots are to the first color conversion layer 20, the more susceptible they are to the adverse effects of high-energy blue light, and then failure occurs. Therefore, the present application increases the density of the first light scattering particles in the second color conversion layer 30 in the direction in which the second color conversion layer 30 deviates from the first color conversion layer 20, so that the blue light energy in each layer of the second color conversion layer 30 can be more uniform, thereby further improving stability and extending life.

[0040] In some embodiments of the present application, the first color conversion layer 20 includes a first substrate, and the red phosphor and the first light scattering particles are arranged in the first substrate; the second color conversion layer 30 includes a second substrate, and the green quantum dots and the first light scattering particles are arranged in the first substrate; wherein, the first substrate and the second substrate have the same thickness, and the first substrate and the second substrate have the same material.

[0041] As mentioned above, the first light scattering particles are provided in both the first color conversion layer 20 and the second color conversion layer 30. In order to better regulate the density difference of the first light scattering particles in the first color conversion layer 20 and the second color conversion layer 30 during the preparation process of the quantum dot Mini LED packaging device M0, so as to control the spacing between two adjacent quantum dots and the dispersion degree of blue light and green light in the second color conversion layer 30, the present application makes the thickness and material of the first substrate and the second substrate the same.

[0042] In some embodiments of the present application, the first substrate includes at least one of polycarbonate, silicone resin, epoxy resin, polypropylene, polyethylene, polyvinyl chloride and polystyrene.

[0043] In some embodiments of the present application, the density of the first light scattering particles in the second color conversion layer 30 is a first density, and the density of the first light scattering particles in the first color conversion layer 20 is a second density, wherein the first density is 1.2 to 1.6 times the second density.

[0044] It should be noted that, in order to facilitate the quantification of the first density and the second density, and to facilitate the preparation of the first color conversion layer 20 and the second color conversion layer 30, the mass ratio of the first light scattering particles in the second substrate to the second substrate is 1.2 to 1.6 times the mass ratio of the first light scattering particles in the first substrate to the first substrate.

[0045] In some embodiments of the present application, the red phosphor is a KSF phosphor whose excitation light color is red. KSF phosphor is currently widely used in commercial applications. Its full width at half maximum (FWHM) is 18nm and it has strong stability. Under the irradiation of blue light, KSF phosphor can absorb 20% to 40% of the blue light energy, and excite to produce red light, and the remaining 60% to 80% of the blue light energy.

[0046] In some embodiments of the present application, the green quantum dots may be semiconductor nanocrystals formed by elements of Group II-VI or Group III-V in the periodic table, such as: ZnTe, ZnSe, ZnS, ZnO, AgS, CdTe, CdSe, CdS, CdO, InSb, InAs or InP; in addition to the above-mentioned nanocrystals, the quantum dots may also be a core / shell structure, such as: CdSe / CdS, CdTe / CdS, CdZnSe / CdZnS or CdSe / CdZnS; or, it may also be a core / shell / shell structure, such as: CdSe / CdS / ZnS or CdTe / CdS / ZnS. Optionally, the green quantum dots may be CdSe / CdS / ZnS because CdSe / CdS / ZnS is a covalent bond crystal with a photoluminescence quantum yield (PLQY) of more than 85% and good stability.

[0047] In some embodiments of the present application, the second color conversion layer 30 further includes first thermally conductive particles, the thermal conductivity of the first thermally conductive particles is greater than the thermal conductivity of the first light scattering particles, and the difference between the thermal conductivity of the first thermally conductive particles and the thermal conductivity of the first light scattering particles is greater than 10.

[0048] In the quantum dot Mini LED package device M0 provided in the embodiment of the present application, the applicant found that although the energy aggregation can be avoided and the self-heating effect can be weakened by setting the first light scattering particles in the first color conversion layer 20 and the second color conversion layer 30, the problem of heat generation due to reabsorption of quantum dots cannot be eliminated. The applicant found in actual tests that the efficiency of heat generation due to reabsorption of quantum dots is even greater than the heat generation efficiency of the chip. Therefore, it is extremely important to effectively and timely export the heat in the second color conversion layer 30 in the sealed quantum dot Mini LED package device M0 to reduce the temperature of the second color conversion layer 30 and reduce the failure rate of green quantum dots. Unfortunately, the thermal conductivity (also known as thermal conductivity) of the first light scattering particles is small and does not have the function of improving the heat dissipation capacity of the second color conversion layer 30. Therefore, the present application further arranges the first thermally conductive particles in the second color conversion layer 30, and makes the thermal conductivity of the first thermally conductive particles greater than the thermal conductivity of the first light scattering particles, and the difference between the thermal conductivity of the first thermally conductive particles and the thermal conductivity of the first light scattering particles is greater than 10, so as to ensure that the first thermally conductive particles have the ability to significantly improve the heat dissipation efficiency of the second color conversion layer 30, thereby improving the stability of the quantum dot Mini LED packaging device M0 and extending its life.

[0049] In some embodiments of the present application, in the second color conversion layer 30 , the median particle size of the first thermal conductive particles is greater than the median particle size of the first light scattering particles.

[0050] In the quantum dot Mini LED packaging device M0 provided in the embodiment of the present application, the present application ensures that the first thermally conductive particles have a certain volume by making the median particle size of the first thermally conductive particles larger than the median particle size of the first light scattering particles, so as to ensure its ability to enhance heat dissipation.

[0051] In some embodiments of the present application, the first thermally conductive particles are boron nitride nanosheets.

[0052] In the quantum dot Mini LED package device M0 provided in the embodiment of the present application, the refractive index of the boron nitride nanosheet is similar to that of the silicon dioxide nanoparticles, and the refractive index difference can be controlled within 0.2-0.4, and the thermal conductivity of the boron nitride nanosheet is relatively high, which is 51.1W / (m·K). Moreover, the key point is that the boron nitride nanosheet can enhance the balance between forward and backward scattering, thereby adjusting the light type of each monochromatic light emitted from the second color conversion layer 30, and improving the light emission effect of the quantum dot Mini LED package device M0.

[0053] In some embodiments of the present application, the quantum dot Mini LED package device M0 further includes a heat dissipation carrier 40, wherein the heat dissipation carrier 40 is, for example, a ceramic carrier, for quickly dissipating heat from the quantum dot Mini LED package device M0.

[0054] In some embodiments of the present application, the packaging form of the quantum dot Mini LED package device M0 is a chip-scale package with a carrier (full name in English: Near Chip Scale Package, abbreviated as: NCSP), and the flip-chip blue light LED chip 10, the first color conversion layer 20, and the second color conversion layer 30 are stacked in sequence on the heat dissipation carrier 40, and the edges of the flip-chip blue light LED chip 10, the first color conversion layer 20, and the second color conversion layer 30 are flush to minimize the package size, wherein the electrode setting surface of the flip-chip blue light LED chip 10 is provided with a first electrode (not shown in the figure) and a second electrode (not shown in the figure), and the first electrode and the second electrode are welded and fixed on the heat dissipation carrier 40, for example, the first electrode and the second electrode can be fixed on the heat dissipation carrier 40 by solder welding.

[0055] In some embodiments of the present application, the edge of the heat dissipation carrier 40 is located outside the edge of the flip-chip blue LED chip 10, that is, the size of the heat dissipation carrier 40 is larger than the size of the flip-chip blue LED chip 10. Optionally, the heat dissipation carrier 40 has a first area and a second area, the second area surrounds the first area, wherein the orthographic projections of the flip-chip blue LED chip 10, the first color conversion layer 20, and the second color conversion layer 30 on the heat dissipation carrier 40 are located in the first area.

[0056] In some embodiments of the present application, the heat dissipation dam 50 is arranged on a side of the heat dissipation carrier 40 facing the flip-chip blue light LED chip 10, and the heat dissipation dam 50 has a groove 51. The flip-chip blue light LED chip 10, the first color conversion layer 20, and the second color conversion layer 30 are located in the groove 51 and are stacked in sequence in the direction of the heat dissipation carrier 40 toward the heat dissipation dam 50; wherein the side wall of the second color conversion layer 30 is in direct contact with the heat dissipation dam 50.

[0057] In the quantum dot Mini LED package device M0 provided in the embodiment of the present application, it can be understood that the orthographic projection of the heat dissipation dam 50 on the heat dissipation carrier 40 is located in the second area, and the heat dissipation dam 50 is formed with the groove 51 at a position corresponding to the first area, and the groove 51 exposes the first area of ​​the heat dissipation carrier 40 to form a cavity for accommodating the flip-chip blue light LED chip 10, the first color conversion layer 20, and the second color conversion layer 30. Under this architecture, since the side wall of the second color conversion layer 30 is in direct contact with the heat dissipation dam 50, the heat dissipation dam 50 can be used to quickly export the heat in the second color conversion layer 30 to the outside of the quantum dot Mini LED package device M0, and the setting of the heat dissipation dam 50 greatly increases the heat dissipation path of the second color conversion layer 30, so that the second color conversion layer 30 can achieve rapid heat dissipation in both the horizontal and vertical directions.

[0058] In some embodiments of the present application, the heat dissipation dam 50 includes a first thermally conductive material, and the thermal conductivity of the first thermally conductive material is greater than the thermal conductivity of the first thermally conductive particle. Optionally, the first thermally conductive material is silicon carbide, and the heat dissipation dam 50 can be a silicon carbide ceramic dam. Of course, the heat dissipation dam 50 can also include other thermally conductive materials with better thermal conductivity, or replace the first thermally conductive material with other thermally conductive materials with better thermal conductivity, such as graphene.

[0059] In some embodiments of the present application, the heat dissipation dam 50 may further include organic matter to adjust the plasticity of the heat dissipation dam 50 .

[0060] In some embodiments of the present application, the heat dissipation dam 50 is in an opaque state to block the side light emitted by the flip-chip blue LED chip 10 .

[0061] In some embodiments of the present application, the side walls of the second color conversion layer 30, the side walls of the first color conversion layer 20, and the side walls of the flip-chip blue light LED chip 10 are all in direct contact with the heat dissipation dam 50, wherein the quantum dot Mini LED packaging device M0 also includes a first thermal barrier layer 60, and the first thermal barrier layer 60 is arranged between the flip-chip blue light LED chip 10 and the first color conversion layer 20.

[0062] In the quantum dot Mini LED packaging device M0 provided in the embodiment of the present application, the overall thermal conductivity of the first thermal barrier layer 60 is relatively poor. The first thermal barrier layer 60 arranged between the flip-chip blue light LED chip 10 and the first color conversion layer 20 can block the heat of the flip-chip blue light LED chip 10 and minimize the heat dissipation of the flip-chip blue light LED chip 10 to the second color conversion layer 30, thereby improving the stability of the quantum dot Mini LED packaging device M0 and extending its service life.

[0063] In some embodiments of the present application, the first thermal barrier layer 60 may be aerogel, or relatively lower cost thermal insulation silica gel, or other materials with good light transmittance and good thermal insulation.

[0064] In some embodiments of the present application, the quantum dot Mini LED packaging device M0 also includes a light-transmitting substrate 70, which is arranged on the side of the second color conversion layer 30 away from the first color conversion layer 20 and is located in the groove 51; wherein the side wall of the light-transmitting substrate 70 is flush with the side wall of the second color conversion layer 30 and is in direct contact with the heat dissipation dam 50.

[0065] In the quantum dot Mini LED package device M0 provided in the embodiment of the present application, the transparent substrate 70 covering the side of the second color conversion layer 30 away from the first color conversion layer 20 is used to form a sealed chamber with the heat dissipation dam 50 to avoid the problem of green quantum dot failure caused by the invasion of water and oxygen from the outside, thereby improving the stability of the quantum dot Mini LED package device M0 and extending its service life. In addition, since the transparent substrate 70 is located in the groove 51, and the side wall of the transparent substrate 70 is flush with the side wall of the second color conversion layer 30 and is in direct contact with the heat dissipation dam 50, the heat dissipated from the second color conversion layer 30 to the transparent substrate 70 can be quickly dissipated to the outside through the heat dissipation dam 50, thereby avoiding the high temperature of the transparent substrate 70, thereby affecting the shape and optical effect of the optical element M12 (such as a light guide plate, an optical film) adjacent to the transparent substrate 70 in the display device.

[0066] In some embodiments of the present application, the light-transmitting substrate 70 may be a silicone plate, polymethyl methacrylate, a high-barrier film, glass, sapphire, or the like.

[0067] In some embodiments of the present application, in order to ensure the sealing performance of the quantum dot Mini LED packaging device M0, it is possible to first form a heat dissipation material layer covering the flip-chip blue light LED chip 10, the first color conversion layer 20, the second color conversion layer 30, and the transparent substrate 70, and then remove the heat dissipation material layer covering the transparent substrate 70 by grinding, thereby forming the heat dissipation dam 50 and the transparent substrate 70 in direct contact with the heat dissipation dam 50.

[0068] Figure 2 This is a schematic diagram of the structure of a display device provided in an embodiment of the present application. Figure 1 and Figure 2 As shown, in the second aspect, embodiment 1 of the present application provides a display device, wherein the display device includes a backlight module M1 and a liquid crystal display panel M2, wherein the backlight module M1 includes an LED light board M11, and the liquid crystal display panel M2 is arranged on the light emitting side of the backlight module M1, and the liquid crystal display panel M2 includes an array substrate M21, a color film substrate M22 and a liquid crystal layer M23, and the liquid crystal layer M23 is located between the array substrate M21 and the color film substrate M22; wherein the LED light board M11 includes the quantum dot Mini LED packaging device M0 described in any one of the above items.

[0069] Embodiment 2

[0070] Figure 3 This is a schematic diagram of the structure of the quantum dot Mini LED packaging device provided in Example 2 of the present application. Figure 3As shown, in the first aspect, embodiment 2 of the present application provides a quantum dot Mini LED package device M0 and a display device, wherein the quantum dot Mini LED package device M0 includes a flip-chip blue light LED chip 10, a first color conversion layer 20 and a second color conversion layer 30, wherein the flip-chip blue light LED chip 10 includes a first surface 11 and a second surface 12 arranged opposite to each other, the first surface 11 is an electrode setting surface of the flip-chip blue light LED chip 10, and the second surface 12 is one of the light emitting surfaces of the flip-chip blue light LED chip 10; the first color conversion layer 20 is arranged on a side of the second surface 12 away from the first surface 11, and the first color conversion layer 20 includes red phosphor and first light scattering particles; the second color conversion layer 30 is arranged on a side of the first color conversion layer 20 away from the flip-chip blue light LED chip 10, and the second color conversion layer 30 includes green quantum dots and first light scattering particles; wherein the first light scattering particles are silicon dioxide nanoparticles, and the density of the first light scattering particles in the second color conversion layer 30 is greater than the density of the first light scattering particles in the first color conversion layer 20.

[0071] It should be noted that the quantum dot Mini LED package device M0 provided in the second embodiment of the present application is similar to the quantum dot Mini LED package device M0 provided in the first embodiment of the present application, for example, the quantum dot Mini LED package device M0 further includes: a heat dissipation carrier 40; a heat dissipation dam 50, which is arranged on the side of the heat dissipation carrier 40 facing the flip-chip blue LED chip 10, and the heat dissipation dam 50 has a groove 51, and the flip-chip blue LED chip 10, the first color conversion layer 20, and the second color conversion layer 30 are located in the groove 51, and are stacked in sequence in the direction from the heat dissipation carrier 40 to the heat dissipation dam 50; wherein the side wall of the second color conversion layer 30 is in direct contact with the heat dissipation dam 50. Accordingly, the second embodiment of the present application will not be repeated for the same parts.

[0072] In some embodiments of the present application, the side walls of the second color conversion layer 30 and the side walls of the first color conversion layer 20 are in direct contact with the heat dissipation dam 50, and the side walls of the flip-chip blue light LED chip 10 are spaced apart from the heat dissipation dam 50, wherein the quantum dot Mini LED packaging device M0 also includes a second thermal barrier layer 80, and the second thermal barrier layer 80 covers the flip-chip blue light LED chip 10.

[0073] In the quantum dot Mini LED packaging device M0 provided in the embodiment of the present application, since the side walls of the second color conversion layer 30 and the side walls of the first color conversion layer 20 are in direct contact with the heat dissipation dam 50, the heat dissipation efficiency of the first color conversion layer 20 and the second color conversion layer 30 can be improved.

[0074] The key point is that in the quantum dot Mini LED packaging device M0 provided in the embodiment of the present application, since the side wall of the flip-chip blue light LED chip 10 is spaced apart from the heat dissipation dam 50, and the second thermal barrier layer 80 in the quantum dot Mini LED packaging device M0 covers the flip-chip blue light LED chip 10, it is possible to form two relatively independent heat dissipation systems in the quantum dot Mini LED packaging device M0 with the second thermal barrier layer 80 as the boundary, wherein one of the heat dissipation systems is that the flip-chip blue light LED chip 10, which is one of the heat sources, dissipates heat through the heat dissipation carrier 40; and the other heat dissipation system is that the second color conversion layer 30, which is one of the heat sources, dissipates heat through the heat dissipation dam 50 and the heat dissipation carrier 40.

[0075] The two heat dissipation systems are relatively independent. On the one hand, they can avoid the problem of increased risk of green quantum dot failure caused by overheating of the flip-chip blue light LED chip 10 and the increase in the temperature of the second color conversion layer 30; on the other hand, they can avoid the problem of overheating of the flip-chip blue light LED chip 10 and the increase in the temperature of the heat dissipation dam 50 caused by the heat transmission through the heat dissipation dam 50, and the failure to dissipate the heat generated by the second color conversion layer 30 to the outside in time. In other words, the heat dissipation dam 50 can serve only the second color conversion layer 30 as much as possible, thereby further improving the thermal conductivity of the second color conversion layer 30, greatly reducing the problem of increased risk of quantum dot failure caused by heat generated by the second color conversion layer 30 due to reabsorption of green quantum dots, thereby improving the stability of the quantum dot Mini LED packaging device M0 and extending its service life.

[0076] In some embodiments of the present application, the second thermal barrier layer 80 includes a first portion 81 and a second portion 82, wherein the first portion 81 is disposed on the second surface 12, and the second portion 82 is disposed on the side wall of the flip-chip blue LED chip 10, wherein the thickness of the second portion 82 is greater than the thickness of the first portion 81.

[0077] In the quantum dot Mini LED packaging device M0 provided in the embodiment of the present application, since the first color conversion layer 20 itself has a certain heat insulation effect, in order to make the heat dissipation dam 50 serve only the second color conversion layer 30 as much as possible, it is necessary to increase the thickness of the second thermal barrier layer 80 between the heat dissipation dam 50 and the side wall of the flip-chip blue light LED chip 10, and then make the thickness of the second part 82 greater than the thickness of the first part 81.

[0078] In some embodiments of the present application, the material selection of the second thermal barrier layer 80 may refer to the material selection of the first thermal barrier layer 60 in the first embodiment.

[0079] Combination Figure 2 and Figure 3 As shown, in the second aspect, Embodiment 2 of the present application provides a display device, wherein the display device includes a backlight module M1 and a liquid crystal display panel M2, wherein the backlight module M1 includes an LED light board M11, and the liquid crystal display panel M2 is arranged on the light emitting side of the backlight module M1, and the liquid crystal display panel M2 includes an array substrate M21, a color film substrate M22 and a liquid crystal layer M23, and the liquid crystal layer M23 is located between the array substrate M21 and the color film substrate M22; wherein the LED light board M11 includes the quantum dot Mini LED packaging device M0 described in any one of the above items.

[0080] Embodiment 3

[0081] Figure 4 This is a schematic diagram of the structure of the quantum dot Mini LED packaging device provided in Example 3 of the present application. Figure 4 As shown, in the first aspect, embodiment three of the present application provides a quantum dot Mini LED package device M0 and a display device, wherein the quantum dot Mini LED package device M0 includes a flip-chip blue light LED chip 10, a first color conversion layer 20 and a second color conversion layer 30, wherein the flip-chip blue light LED chip 10 includes a first surface 11 and a second surface 12 arranged opposite to each other, the first surface 11 is an electrode setting surface of the flip-chip blue light LED chip 10, and the second surface 12 is one of the light emitting surfaces of the flip-chip blue light LED chip 10; the first color conversion layer 20 is arranged on a side of the second surface 12 away from the first surface 11, and the first color conversion layer 20 includes red phosphor and first light scattering particles; the second color conversion layer 30 is arranged on a side of the first color conversion layer 20 away from the flip-chip blue light LED chip 10, and the second color conversion layer 30 includes green quantum dots and first light scattering particles; wherein the first light scattering particles are silicon dioxide nanoparticles, and the density of the first light scattering particles in the second color conversion layer 30 is greater than the density of the first light scattering particles in the first color conversion layer 20.

[0082] It should be noted that the quantum dot Mini LED package device M0 provided in the third embodiment of the present application is similar to the quantum dot Mini LED package device M0 provided in the second embodiment of the present application, for example, the quantum dot Mini LED package device M0 further includes: a heat dissipation carrier 40; a heat dissipation dam 50, which is arranged on the side of the heat dissipation carrier 40 facing the flip-chip blue LED chip 10, and the heat dissipation dam 50 has a groove 51, and the flip-chip blue LED chip 10, the first color conversion layer 20, and the second color conversion layer 30 are located in the groove 51, and are stacked in sequence in the direction from the heat dissipation carrier 40 to the heat dissipation dam 50; wherein the side wall of the second color conversion layer 30 is in direct contact with the heat dissipation dam 50. Accordingly, the third embodiment of the present application will not repeat the same parts.

[0083] In some embodiments of the present application, the side walls of the first color conversion layer 20 and the side walls of the flip-chip blue light LED chip 10 are spaced apart from the heat dissipation dam 50, wherein the quantum dot Mini LED packaging device M0 also includes a third thermal barrier layer 90, and the third thermal barrier layer 90 covers the flip-chip blue light LED chip 10 and the first color conversion layer 20.

[0084] In the quantum dot Mini LED packaging device M0 provided in the embodiment of the present application, since the side walls of the first color conversion layer 20 and the side walls of the flip-chip blue light LED chip 10 are spaced apart from the heat dissipation dam 50, and the third thermal barrier layer 90 covers the flip-chip blue light LED chip 10 and the first color conversion layer 20, two relatively independent heat dissipation systems can be formed in the quantum dot Mini LED packaging device M0 with the third thermal barrier layer 90 as the boundary, wherein one of the heat dissipation systems is that the flip-chip blue light LED chip 10, which is one of the heat sources, dissipates heat through the heat dissipation carrier 40; and the other heat dissipation system is that the second color conversion layer 30, which is one of the heat sources, dissipates heat through the heat dissipation dam 50 and the heat dissipation carrier 40.

[0085] The two heat dissipation systems are relatively independent. On the one hand, they can avoid the problem of increased risk of green quantum dot failure caused by overheating of the flip-chip blue light LED chip 10 and the increase in the temperature of the second color conversion layer 30; on the other hand, they can avoid the problem of overheating of the flip-chip blue light LED chip 10 and the increase in the temperature of the heat dissipation dam 50 caused by the heat transmission through the heat dissipation dam 50, and the failure to dissipate the heat generated by the second color conversion layer 30 to the outside in time. In other words, the heat dissipation dam 50 can serve only the second color conversion layer 30 as much as possible, thereby further improving the thermal conductivity of the second color conversion layer 30, greatly reducing the problem of increased risk of quantum dot failure caused by heat generated by the second color conversion layer 30 due to reabsorption of green quantum dots, thereby improving the stability of the quantum dot Mini LED packaging device M0 and extending its service life.

[0086] In some embodiments of the present application, the third thermal barrier layer 90 includes a third portion 91 and a fourth portion 92, the third portion 91 being disposed on a side of the first color conversion layer 20 away from the flip-chip blue LED chip 10, and the fourth portion 92 being disposed on the sidewall of the flip-chip blue LED chip 10 and the sidewall of the first color conversion layer 20, wherein the thickness of the second portion 82 is equal to the thickness of the first portion 81.

[0087] Different from the second embodiment, the quantum dot Mini LED packaging device M0 provided in the embodiment of the present application divides the first color conversion layer 20 and the flip-chip blue light LED chip 10 into one heat dissipation system. Therefore, the first color conversion layer 20 and the flip-chip blue light LED chip 10 are regarded as an integral heat source. Accordingly, there is no need to design the thermal insulation capacity of different areas of the third thermal barrier layer 90 differently, so that the thickness of the second part 82 can be equal to the thickness of the first part 81. Therefore, the difficulty of preparing the third thermal barrier layer 90 can be reduced.

[0088] In some embodiments of the present application, the quantum dot Mini LED package device M0 further includes a first thermal barrier layer 60 , and the first thermal barrier layer 60 is disposed between the flip-chip blue light LED chip 10 and the first color conversion layer 20 .

[0089] In some embodiments of the present application, the material selection of the third thermal barrier layer 90 may refer to the material selection of the first thermal barrier layer 60 in the first embodiment.

[0090] Combination Figure 2 and Figure 4As shown, in the second aspect, Embodiment 3 of the present application provides a display device, wherein the display device includes a backlight module M1 and a liquid crystal display panel M2, wherein the backlight module M1 includes an LED light board M11, and the liquid crystal display panel M2 is arranged on the light emitting side of the backlight module M1, and the liquid crystal display panel M2 includes an array substrate M21, a color film substrate M22 and a liquid crystal layer M23, and the liquid crystal layer M23 is located between the array substrate M21 and the color film substrate M22; wherein the LED light board M11 includes the quantum dot Mini LED packaging device M0 described in any one of the above items.

[0091] Embodiment 4

[0092] Figure 5 This is a schematic diagram of the structure of the quantum dot Mini LED packaging device provided in Example 4 of the present application. Figure 5 As shown, in the first aspect, embodiment 4 of the present application provides a quantum dot Mini LED package device M0 and a display device, wherein the quantum dot Mini LED package device M0 includes a flip-chip blue light LED chip 10, a first color conversion layer 20 and a second color conversion layer 30, wherein the flip-chip blue light LED chip 10 includes a first surface 11 and a second surface 12 arranged opposite to each other, the first surface 11 is an electrode setting surface of the flip-chip blue light LED chip 10, and the second surface 12 is one of the light emitting surfaces of the flip-chip blue light LED chip 10; the first color conversion layer 20 is arranged on a side of the second surface 12 away from the first surface 11, and the first color conversion layer 20 includes red phosphor and first light scattering particles; the second color conversion layer 30 is arranged on a side of the first color conversion layer 20 away from the flip-chip blue light LED chip 10, and the second color conversion layer 30 includes green quantum dots and first light scattering particles; wherein the first light scattering particles are silicon dioxide nanoparticles, and the density of the first light scattering particles in the second color conversion layer 30 is greater than the density of the first light scattering particles in the first color conversion layer 20.

[0093] It should be noted that the quantum dot Mini LED package device M0 provided in the fourth embodiment of the present application is similar to the quantum dot Mini LED package device M0 provided in the third embodiment of the present application, for example, the quantum dot Mini LED package device M0 further includes: a heat dissipation carrier 40; a heat dissipation dam 50, which is arranged on the side of the heat dissipation carrier 40 facing the flip-chip blue LED chip 10, and the heat dissipation dam 50 has a groove 51, and the flip-chip blue LED chip 10, the first color conversion layer 20, and the second color conversion layer 30 are located in the groove 51, and are stacked in sequence in the direction from the heat dissipation carrier 40 to the heat dissipation dam 50; wherein the side wall of the second color conversion layer 30 is in direct contact with the heat dissipation dam 50. Accordingly, the fourth embodiment of the present application will not repeat the same parts.

[0094] In some embodiments of the present application, the quantum dot Mini LED packaging device M0 also includes a fourth thermal barrier layer 100 and a fifth thermal barrier layer 110, wherein the fourth thermal barrier layer 100 covers the side walls of the flip-chip blue light LED chip 10 and the side walls of the first color conversion layer 20, and exposes the surface of the first color conversion layer 20 facing away from the flip-chip blue light LED chip 10; the fifth thermal barrier layer 110 is arranged between the first color conversion layer 20 and the second color conversion layer 30; wherein the fifth thermal barrier layer 110 includes the first light scattering particles, wherein the density of the first light scattering particles in the second color conversion layer 30 is greater than the density of the first light scattering particles in the fifth thermal barrier layer 110, and the density of the first light scattering particles in the fifth thermal barrier layer 110 is greater than the density of the first light scattering particles in the first color conversion layer 20.

[0095] Similar to the third embodiment, in the quantum dot Mini LED packaging device M0 provided in the embodiment of the present application, the fourth thermal barrier layer 100 and the fifth thermal barrier layer 110 can also cover the first color conversion layer 20 and the flip-chip blue light LED chip 10, thereby forming two relatively independent heat dissipation systems, thereby improving the stability of the quantum dot Mini LED packaging device M0 and extending its service life.

[0096] However, the difference is that in the quantum dot Mini LED package device M0 provided in the embodiment of the present application, the fourth thermal barrier layer 100 and the fifth thermal barrier layer 110 are relatively independent and are prepared by different processes. The present application additionally arranges the first light scattering particles in the fifth thermal barrier layer 110, so that the first light scattering particle distribution with a density gradient increasing in sequence can be formed in the light emitting direction of the first color conversion layer 20, the fifth thermal barrier layer 110, and the second color conversion layer 30, thereby further optimizing the uniformity of the blue light irradiated into the second color conversion layer 30, improving the problem of green quantum dot failure caused by excessive blue light energy per unit area, and enhancing the quantum excitation effect, thereby improving the color gamut of the emitted white light of the quantum dot Mini LED package device M0.

[0097] In some embodiments of the present application, the fifth heat barrier layer 110 includes a matrix layer and the first light scattering particles, wherein the matrix layer is a light-transmitting layer.

[0098] In some embodiments of the present application, the fourth thermal barrier layer 100 includes a first sub-film layer and a second sub-film layer, and the first sub-film layer and the second sub-film layer are stacked in sequence in a direction away from the side wall of the flip-chip blue light LED chip 10, wherein the refractive index of the first sub-film layer is different from the refractive index of the second sub-film layer to form a distributed Bragg reflector, thereby improving the output light efficiency of the flip-chip blue light LED chip 10, and thereby improving the brightness of the quantum dot Mini LED package device M0.

[0099] Combination Figure 2 and Figure 5 As shown, in the second aspect, Embodiment 4 of the present application provides a display device, wherein the display device includes a backlight module M1 and a liquid crystal display panel M2, wherein the backlight module M1 includes an LED light board M11, and the liquid crystal display panel M2 is arranged on the light emitting side of the backlight module M1, and the liquid crystal display panel M2 includes an array substrate M21, a color film substrate M22 and a liquid crystal layer M23, and the liquid crystal layer M23 is located between the array substrate M21 and the color film substrate M22; wherein the LED light board M11 includes the quantum dot Mini LED packaging device M0 described in any one of the above items.

[0100] In summary, the present application provides a quantum dot Mini LED packaging device and a display device. The quantum dot Mini LED packaging device includes a flip-chip blue light LED chip, a first color conversion layer and a second color conversion layer. The flip-chip blue light LED chip includes a first surface and a second surface arranged opposite to each other, and the second surface is one of the light emitting surfaces of the flip-chip blue light LED chip; the first color conversion layer is arranged on the side of the second surface away from the first surface, and the first color conversion layer includes red phosphor and first light scattering particles; the second color conversion layer is arranged on the side of the first color conversion layer away from the flip-chip blue light LED chip, and the second color conversion layer includes green quantum dots and first light scattering particles; wherein the first light scattering particles are silicon dioxide nanoparticles, and the density of the first light scattering particles in the second color conversion layer is greater than the density of the first light scattering particles in the first color conversion layer. The quantum dot Mini LED packaging device provided by the present application has the advantages of high stability, long service life and high color gamut, and the display device has the advantages of strong color expression, high stability, long service life and strong market competitiveness.

[0101] The above is a detailed introduction to a quantum dot Mini LED packaging device and a display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A quantum dot Mini LED packaging device, characterized in that: The quantum dot Mini LED packaging device includes: A flip-chip blue light LED chip, comprising a first surface and a second surface arranged opposite to each other, wherein the second surface is one of the light emitting surfaces of the flip-chip blue light LED chip; A first color conversion layer is disposed on a side of the second surface away from the first surface, the first color conversion layer comprising red phosphor and first light scattering particles; A second color conversion layer is disposed on a side of the first color conversion layer away from the flip-chip blue LED chip, the second color conversion layer comprising green quantum dots and first light scattering particles; The first light scattering particles are silicon dioxide nanoparticles, and the density of the first light scattering particles in the second color conversion layer is greater than the density of the first light scattering particles in the first color conversion layer.

2. The quantum dot Mini LED package device according to claim 1, characterized in that: The second color conversion layer further includes first thermally conductive particles, the thermal conductivity of the first thermally conductive particles is greater than the thermal conductivity of the first light scattering particles, and the difference between the thermal conductivity of the first thermally conductive particles and the thermal conductivity of the first light scattering particles is greater than 10.

3. The quantum dot Mini LED package device according to claim 2, characterized in that: The first thermally conductive particles are boron nitride nanosheets.

4. The quantum dot Mini LED package device according to claim 1, characterized in that: The quantum dot Mini LED packaging device also includes: Heat dissipation carrier board; A heat dissipation dam is arranged on a side of the heat dissipation carrier plate facing the flip-chip blue LED chip, the heat dissipation dam has a groove, the flip-chip blue LED chip, the first color conversion layer, and the second color conversion layer are located in the groove and are stacked in sequence in a direction from the heat dissipation carrier plate toward the heat dissipation dam; Wherein, the side wall of the second color conversion layer is in direct contact with the heat dissipation dam.

5. The quantum dot Mini LED package device according to claim 4, characterized in that: The side walls of the second color conversion layer, the side walls of the first color conversion layer, and the side walls of the flip-chip blue light LED chip are all in direct contact with the heat dissipation dam, wherein the quantum dot Mini LED packaging device also includes a first thermal barrier layer, which is arranged between the flip-chip blue light LED chip and the first color conversion layer.

6. The quantum dot Mini LED package device according to claim 4, characterized in that: The side walls of the second color conversion layer and the side walls of the first color conversion layer are in direct contact with the heat dissipation dam, and the side walls of the flip-chip blue light LED chip are spaced apart from the heat dissipation dam, wherein the quantum dot Mini LED packaging device also includes a second thermal barrier layer, and the second thermal barrier layer covers the flip-chip blue light LED chip.

7. The quantum dot Mini LED package device according to claim 4, characterized in that: The side walls of the first color conversion layer and the side walls of the flip-chip blue light LED chip are spaced apart from the heat dissipation dam, wherein the quantum dot MiniLED packaging device also includes a third thermal barrier layer, and the third thermal barrier layer covers the flip-chip blue light LED chip and the first color conversion layer.

8. The quantum dot Mini LED package device according to claim 4, characterized in that: The quantum dot Mini LED packaging device also includes: a fourth heat-blocking layer, covering the sidewalls of the flip-chip blue LED chip and the sidewalls of the first color conversion layer, and exposing a surface of the first color conversion layer on a side away from the flip-chip blue LED chip; a fifth heat-blocking layer, disposed between the first color conversion layer and the second color conversion layer; Wherein, the fifth thermal barrier layer includes the first light scattering particles, wherein the density of the first light scattering particles in the second color conversion layer is greater than the density of the first light scattering particles in the fifth thermal barrier layer, and the density of the first light scattering particles in the fifth thermal barrier layer is greater than the density of the first light scattering particles in the first color conversion layer.

9. The quantum dot Mini LED package device according to claim 4, characterized in that: The quantum dot Mini LED package device further includes a light-transmitting substrate, which is disposed on a side of the second color conversion layer away from the first color conversion layer and is located in the groove; Wherein, the side wall of the light-transmitting substrate is flush with the side wall of the second color conversion layer and is in direct contact with the heat dissipation dam.

10. A display device, characterized in that: The display device comprises: Backlight module, including LED light board; A liquid crystal display panel is arranged on the light-emitting side of the backlight module, and the liquid crystal display panel comprises an array substrate, a color filter substrate and a liquid crystal layer, wherein the liquid crystal layer is located between the array substrate and the color filter substrate; Wherein, the LED light board includes the quantum dot Mini LED packaging device as described in any one of claims 1 to 9.

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