Two-in-one RGBW LED lamp bead and LED device

Abstract

The present invention provides a two-in-one RGBW LED lamp bead and LED device. The two-in-one RGBW LED lamp bead includes a first plate, a second plate, and a third plate arranged sequentially from bottom to top. The first plate is provided with a conductive layer and a first die-bonding layer. Several LED chip groups are arranged on the first die-bonding layer. The first die-bonding layer is connected to several first metal pillars. The second plate is provided with several first receiving grooves. The second plate is provided with a second die-bonding layer. First LED chips are arranged on the second die-bonding layer. The second die-bonding layer is connected to several second metal pillars. The third plate is provided with several light-transmitting grooves and second receiving grooves. By providing the first and second metal pillars instead of traditional bent pins, the problem of gaps between the bent pins and the bracket is avoided, the airtightness and anti-collision performance of the lamp bead are enhanced, the luminous effect is strong, and it performs well in various application scenarios.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor technology, and in particular to a two-in-one RGBW LED lamp bead and an LED device. Background Art

[0002] With the development of next-generation information technologies like artificial intelligence and big data, and the widespread adoption of the Internet of Things (IoT), which uses various smart devices as touchpoints and interfaces, the use cases for display screens are being reshaped. LED displays have found their way into various scenarios, including XR virtual reality filming, cinemas, in-car displays, conferences, and education. Depending on the specific scenario, the form factor of the screen has also undergone significant changes, with examples including tri-fold, curved, and T-fold screens.

[0003] The LED lamp beads currently used in the market are usually conventional indoor RGB lamp beads. This type of RGB lamp bead is stamped into a functional area through copper strips, and a bracket is formed through PPA injection molding. The metal is bent to form the lamp bead pins, some of which are tightly attached to the outside of the bracket, and finally the lamp bead is formed through a packaging process. Specifically, the bracket is divided into two sides, the front side is composed of PPA and stamped metal parts as the functional area of ​​the lamp bead. A part of the PPA is formed into a bowl through injection molding to protect the functional area; the back side is composed of PPA and pins, and the pins are formed through a bending process. The chip is fixed in the functional area with silver glue or insulating glue, and then the bonding wires are welded between the electrode and the functional area of ​​the chip to form an electrical connection. Finally, the bracket is sealed with glue through a dispensing process, and finally blanked into a conventional RGB indoor lamp bead.

[0004] However, the bending process of this method can easily create gaps between the PPA and the metal parts, resulting in poor airtightness and easy infiltration of external moisture, leading to undesirable phenomena such as lamp failure. Furthermore, the conventional four-pin structure of the lamp bead has poor resistance to bumps and collisions, and the RGB chip is usually paired with black PPA, resulting in insufficient brightness. Therefore, the quality and performance are poor for various outdoor use scenarios. Summary of the Invention

[0005] In response to the shortcomings of the existing technology, the purpose of the present invention is to provide a two-in-one RGBW LED lamp bead and LED device, aiming to solve the problems in the existing technology that conventional lamp beads have poor air tightness, anti-collision ability and brightness, and are difficult to adapt to various application scenarios.

[0006] In order to achieve the above object, the present invention is implemented through the following technical solutions:

[0007] A two-in-one RGBW LED lamp bead includes a first plate, a second plate, and a third plate arranged in sequence from bottom to top. A conductive layer is provided on the bottom surface of the first plate, a first solid crystal layer is provided on the side of the first plate facing away from the conductive layer, and a plurality of LED chip groups are provided on the side of the first solid crystal layer facing away from the first plate. The first solid crystal layer is connected to a plurality of first metal pillars. The ends of the first metal pillars facing away from the first solid crystal layer pass through the first plate and are connected to the conductive layer to conduct electricity to the LED chip group. The second plate is provided with a plurality of first receiving grooves, the first receiving grooves pass through the second plate, and the LED chip group is located in the first receiving grooves. In the groove, a second solid crystal layer is provided on the side of the second plate body facing away from the first plate body, and a first LED chip is provided on the side of the second solid crystal layer facing away from the second plate body. The second solid crystal layer is connected to a plurality of second metal pillars, and one end of the second metal pillar facing away from the second solid crystal layer passes through the second plate body and the first plate body, and is connected to the conductive layer to conduct electricity to the first LED chip. The third plate body is provided with a plurality of light-transmitting grooves and second accommodating grooves, and the light-transmitting grooves correspond to the positions of the first accommodating grooves. The plurality of light-transmitting grooves and the second accommodating grooves all pass through the third plate body, and the first LED chip is located in the second accommodating groove.

[0008] Compared with the prior art, the beneficial effects of the present invention are as follows: by providing the first metal pillar and the second metal pillar, the chip is electrically connected to the conductive layer on the bottom surface of the first plate, replacing the traditional bent pins, avoiding the problem of gaps between the bent pins and the bracket, and making the two-in-one RGBW LED lamp bead have good airtightness. Multiple first metal pillars and second metal pillars pass through the plate body, which increases the physical strength and structural integrity, and is beneficial to enhancing the anti-collision performance of the two-in-one RGBW LED lamp bead. The use of the LED chipset and the first LED chip can increase the white light emitting area, and the luminous effect is stronger than the traditional RGB chipset. The brightness of the two-in-one RGBW LED lamp bead can adapt to not only indoor applications, but also outdoor application scenarios. The two-in-one RGBW LED lamp bead performs well in various application scenarios.

[0009] Furthermore, the first solid crystal layer includes a plurality of first solid crystal parts, a plurality of second solid crystal parts, a plurality of third solid crystal parts and a plurality of fourth solid crystal parts. The LED chip group includes a second LED chip, a third LED chip and a fourth LED chip. The first conductive electrode of the second LED chip is connected to the second solid crystal part, the first conductive electrode of the third LED chip is connected to the third solid crystal part, the first conductive electrode of the fourth LED chip is connected to the fourth solid crystal part, and the second conductive electrodes of the second LED chip, the third LED chip and the fourth LED chip are all connected to the first solid crystal part.

[0010] Furthermore, the second bonding layer includes a fifth bonding portion and a sixth bonding portion, the first conductive electrode of the first LED chip is connected to the fifth bonding portion, and the second conductive electrode of the first LED chip is connected to the sixth bonding portion.

[0011] Furthermore, the first die-bonding portion, the second die-bonding portion, the third die-bonding portion, and the fourth die-bonding portion are respectively connected to the first metal column, and the fifth die-bonding portion and the sixth die-bonding portion are respectively connected to the second metal column.

[0012] Furthermore, the conductive layer includes a plurality of first conductive parts, a second conductive part, a third conductive part, a fourth conductive part, a fifth conductive part and a sixth conductive part, and the number of the first bonding parts corresponds to the number of the first conductive parts. Each of the first bonding parts is connected to the first conductive part through the corresponding first metal column, and the plurality of second bonding parts are connected to the second conductive part through the corresponding first metal column, and the plurality of third bonding parts are connected to the third conductive part through the corresponding first metal column, and the plurality of fourth bonding parts are connected to the fourth conductive part through the corresponding first metal column, and the fifth bonding part is connected to the fifth conductive part through the corresponding second metal column, and the sixth bonding part is connected to the sixth conductive part through the corresponding second metal column.

[0013] Furthermore, the first conductive part, the second conductive part, the third conductive part, the fourth conductive part, the fifth conductive part, and the sixth conductive part all include pins, and the pins are used to connect to an external circuit.

[0014] Furthermore, an ink layer is provided on a side of the conductive layer facing away from the first plate.

[0015] Furthermore, a plurality of ink grooves are provided on the ink layer, the ink grooves penetrate the ink layer, and the ink grooves correspond to the positions of the pins.

[0016] Furthermore, a first colloid is disposed in each of the first containing grooves and the light-transmitting grooves, a second colloid is disposed in each of the second containing grooves, and the second colloid includes fluorescent powder.

[0017] An LED device includes the two-in-one RGBW LED lamp bead as described in the above technical solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of a two-in-one RGBW LED lamp bead in an embodiment of the present invention at a first viewing angle;

[0019] Figure 2This is a schematic diagram of the structure of a two-in-one RGBW LED lamp bead in an embodiment of the present invention at a second viewing angle;

[0020] Figure 3 This is a schematic diagram of the structure of a two-in-one RGBW LED lamp bead in an embodiment of the present invention from a third viewing angle;

[0021] Figure 4 This is a schematic diagram of the top view of the first die-bonding layer in a two-in-one RGBW LED lamp bead according to an embodiment of the present invention;

[0022] Figure 5 Schematic diagram of the top view of the second die-bonding layer in the two-in-one RGBW LED lamp bead in an embodiment of the present invention;

[0023] Figure 6 This is a schematic diagram of the top view of the conductive layer in the two-in-one RGBW LED lamp bead in an embodiment of the present invention;

[0024] Figure 7 This is a schematic diagram of the top view of the ink layer in the two-in-one RGBW LED lamp bead in an embodiment of the present invention;

[0025] Description of main component symbols:

[0026]

[0027]

[0028] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0029] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. The drawings illustrate several embodiments of the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.

[0030] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0032] See also Figures 1 to 7 The two-in-one RGBW LED lamp bead in the embodiment of the present invention includes a first plate 100, a second plate 200, and a third plate 300 arranged in sequence from bottom to top. The bottom surface of the first plate 100 is provided with a conductive layer 110. The first plate 100 is provided with a first bonding layer 120 on the side facing away from the conductive layer 110. The first bonding layer 120 is provided with a plurality of LED chip groups on the side facing away from the first plate 100. The second plate 200 is provided with a second bonding layer 210 on the side facing away from the first plate 100. The first LED chip 410 is provided on the side facing away from the second plate 200. The first bonding layer 120 includes a plurality of first bonding portions 121, a plurality of The first plate 100, the second plate 200, and the third plate 300 are all made of BT resin. The first bonding layer 120 includes two first bonding parts 121, two second bonding parts 122, two third bonding parts 123, and two fourth bonding parts 124. The LED chip group includes a second LED chip 420, a third LED chip 430, and a fourth LED chip 440. The first conductive electrode of the second LED chip 420 is connected to the second bonding part 122, the first conductive electrode of the third LED chip 430 is connected to the third bonding part 123, and the first conductive electrode of the fourth LED chip 440 is connected to the fourth bonding part 124. The second conductive electrodes of the second LED chip 420, the third LED chip 430, and the fourth LED chip 440 are all connected to the first bonding part 121. Preferably, the first plate 100, the second plate 200, and the third plate 300 are all made of BT resin. The first bonding layer 120 includes two first bonding parts 121, two second bonding parts 122, two third bonding parts 123, and two fourth bonding parts 124. Please refer to Figure 4, a first solid crystal portion 121, a second solid crystal portion 122, a third solid crystal portion 123 and a fourth solid crystal portion 124 form a solid crystal portion group, and the two solid crystal portion groups are centrally symmetrically distributed along the center of the top surface of the first plate 100. The LED chip group is an RGB chip group, wherein the second LED chip 420 is a red chip, the third LED chip 430 is a green chip, and the fourth LED chip 440 is a blue chip. Two groups of LED chip groups are provided on the first solid crystal layer 120, and each LED chip group corresponds to a solid crystal portion group. Several second conductive electrodes in the LED chip group are connected through the first The solid crystal part 121 has a common pole, and the several first conductive electrodes in the LED chipset are independent of each other. The RGB chips in the LED chipset can be individually controlled by controlling the on / off state between the several first conductive electrodes and the external power supply. The first LED chip 410 is a blue light chip, which is used to form and emit white light in combination with the phosphor in the package. The first LED chip 410 is located at the center of the top surface of the second plate 200, and the two LED chipsets are located at both ends of the first plate 100. It can be understood that the arrangement of the LED chipset and the first LED chip 410 forms an RGBW structure, which can emit red, blue, green and white light. The two-in-one RGBW LED lamp beads have good lighting efficiency, and the brightness is greatly improved compared to conventional indoor RGB lamp beads. The lighting efficiency can still be guaranteed in the face of natural light outdoors, and it can be applied to a variety of scenarios.

[0033] The first solid crystal layer 120 is connected to a plurality of first metal pillars 130. Specifically, the first solid crystal portion 121, the second solid crystal portion 122, the third solid crystal portion 123 and the fourth solid crystal portion 124 are respectively connected to the first metal pillars 130. The end of the first metal pillar 130 facing away from the first solid crystal layer 120 passes through the first plate body 100 and is connected to the conductive layer 110 to conduct electricity to the LED chip group. The second plate body 200 is provided with a plurality of first receiving grooves 201. The first receiving grooves 201 pass through the second plate body 200, and the LED chip group is located in the first receiving grooves 201. Preferably, the number of the first metal pillars 130 is 8, and 8 through holes are opened on the first plate body 100. The first metal pillars 130 are prepared in several of the through holes. It can be understood that the pins in conventional RGB lamp beads are bent and wrapped around the outside of the bracket. Once they are bumped, they are prone to loosening and deformation, and the gap between the pins and the bracket increases, which destroys the air tightness and has poor anti-bumping performance. The first metal pillars 130 are prepared in the through holes of the first plate body 100 and are tightly combined. When bumped, no gap will be generated between the first metal pillars 130 and the through holes of the first plate body 100, and the air tightness is good. Moreover, since the first metal pillars 130 are located in the first plate body 100, the physical structural strength of the plate body is further enhanced. The integrity and strength of the structure are much better than those of traditional conventional RGB lamp beads, which greatly improves the anti-bumping performance.

[0034] The second bonding layer 210 includes a fifth bonding part 211 and a sixth bonding part 212. The first conductive electrode of the first LED chip 410 is connected to the fifth bonding part 211, and the second conductive electrode of the first LED chip 410 is connected to the sixth bonding part 212. The second bonding layer 210 is connected to a plurality of second metal pillars 220. Specifically, the fifth bonding part 211 and the sixth bonding part 212 are respectively connected to the second metal pillars 220. The end of the second metal pillar 220 facing away from the second bonding layer 210 passes through the second plate 200 and the first plate 100, and is connected to the conductive layer 110 to conduct electricity to the first LED chip 410. Preferably, the number of the second metal pillars 220 is 2, and the first plate 100 and the second plate 200 are both provided with two second metal through holes, and the positions of the second metal through holes of the two plates correspond to each other, and the second metal pillars 220 are prepared in the second metal through holes. It can be understood that the second metal pillars 220 and the first metal pillars 130 are both used to replace part of the traditional bent pins and are prepared in the through holes inside the BT resin to improve the air tightness and anti-collision performance of the lamp beads, and the second metal pillars 220 are connected to the first plate 100 and the second plate 200 at the same time, further enhancing the structural strength of the two-in-one RGBW LED lamp beads.

[0035] The conductive layer 110 includes a plurality of first conductive parts 111, a second conductive part 112, a third conductive part 113, a fourth conductive part 114, a fifth conductive part 115 and a sixth conductive part 116. The number of the first solid crystal parts 121 corresponds to the number of the first conductive parts 111. Each of the first solid crystal parts 121 is connected to the first conductive part 111 through the corresponding first metal column 130. The number of the second solid crystal parts 122 is connected to the second conductive part 112 through the corresponding first metal column 130. The number of the third solid crystal parts 123 is connected to the first conductive part 111 through the corresponding first metal column 130. The third conductive part 113, several fourth bonding parts 124 are respectively connected to the fourth conductive part 114 through the corresponding first metal pillars 130, the fifth bonding part 211 is connected to the fifth conductive part 115 through the corresponding second metal pillars 220, and the sixth bonding part 212 is connected to the sixth conductive part 116 through the corresponding second metal pillars 220. The first conductive part 111, the second conductive part 112, the third conductive part 113, the fourth conductive part 114, the fifth conductive part 115 and the sixth conductive part 116 all include pins 117, and the pins 117 are used to connect to an external circuit. Preferably, the conductive layer 110 includes two first conductive parts 111, the first conductive part 111 also includes a first lead, the second conductive part 112 also includes two second leads, the third conductive part 113 also includes a third lead, the fourth conductive part 114 also includes two fourth leads, the projection shape of the pin 117 on the horizontal plane is a rectangle, the second conductive part 112, the third conductive part 113 and the pin 117 of the fourth conductive part 114 are all located at one end of the first plate 100, the first solid crystal part 121 is connected to the first lead through the corresponding first metal column 130, and then connected to the pin 117 of the first conductive part 111 through the first lead, the first metal column 130 corresponding to the second solid crystal part 122 is connected to the second lead, and the two first The second solid crystal parts 122 are respectively connected to the pin 117 of the second conductive part 112 through two second leads, the first metal column 130 corresponding to one of the third solid crystal parts 123 is directly connected to the pin 117 of the third conductive part 113, the first metal column 130 corresponding to another third solid crystal part 123 is connected to the third lead and is connected to the pin 117 of the third conductive part 113 through the third lead, the first metal column 130 corresponding to the fourth solid crystal part 124 is connected to the fourth lead, and the two fourth solid crystal parts 124 are respectively connected to the pin 117 of the fourth conductive part 114 through the two fourth leads, and the positions where the two second metal columns 220 pass through the first plate body 100 are respectively located on the opposite sides of the first solid crystal part 121.It can be understood that by designing an external circuit to connect several of the pins 117, the chip light emission can be independently controlled. When the first conductive part 111 is energized, the RGB three-color light can be controlled by controlling the on / off connection between the second conductive part 112, the third conductive part 113, and the fourth conductive part 114 and the power supply. By controlling the on / off connection between the fifth conductive part 115 and the sixth conductive part 116 and the power supply, white light can be controlled. The two-in-one RGBW LED lamp bead has flexible control over light and can adapt to the needs of various scenarios.

[0036] An ink layer 140 is provided on the side of the conductive layer 110 facing away from the first plate 100. The ink layer 140 is provided with a plurality of ink grooves 141 that extend through the ink layer 140 and correspond to the positions of the pins 117. Preferably, the shape of the ink grooves 141 matches the shape of the pins 117. It is understood that the ink layer 140 can protect the conductive layer 110.

[0037] The third plate 300 is provided with a plurality of light-transmitting grooves 301 and second receiving grooves 302. The light-transmitting grooves 301 correspond to the positions of the first receiving grooves 201. The plurality of light-transmitting grooves 301 and the second receiving grooves 302 pass through the third plate 300. The first LED chip 410 is located in the second receiving groove 302. A first colloid is set in a plurality of the first receiving grooves 201 and a plurality of the light-transmitting grooves 301. A second colloid is set in the second receiving groove 302. The second colloid includes fluorescent powder. Preferably, the first plate 100 and the second plate 200 are pressed together to form a preliminary bowl-cup structure of the two RGB chipsets. The second plate 200 and the third plate 300 are pressed together to form a structure of the two RGB chipsets and a white light bowl-cup. The chips are fixed with die-bonding adhesive and bonded with bonding wires 411. The two-in-one RGBW LED lamp beads are glued twice: once with the first colloid, which is epoxy resin, and once with the second colloid, which is a combination of phosphor and silicone. The first LED chip 410 emits white light through the phosphor.

[0038] An embodiment of the present invention further provides an LED device, which includes the two-in-one RGBW LED lamp bead described in the above embodiment.

[0039] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0040] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A two-in-one RGBW LED lamp bead, characterized in that: The invention comprises a first plate, a second plate and a third plate which are sequentially arranged from bottom to top, a conductive layer being arranged on the bottom surface of the first plate, a first solid crystal layer being arranged on the side of the first plate facing away from the conductive layer, a plurality of LED chip groups being arranged on the side of the first solid crystal layer facing away from the first plate, the first solid crystal layer being connected to a plurality of first metal pillars, an end of the first metal pillar facing away from the first solid crystal layer passes through the first plate and is connected to the conductive layer to conduct electricity to the LED chip group, the second plate is provided with a plurality of first receiving grooves, the first receiving grooves pass through the second plate, the LED chip group is located in the first receiving grooves, a second solid crystal layer is arranged on the side of the second plate facing away from the first plate, a first LED chip is arranged on the side of the second solid crystal layer facing away from the second plate, the second solid crystal layer is connected to a plurality of second metal pillars, an end of the second metal pillar facing away from the second solid crystal layer passes through the second plate and the first plate and is connected to the conductive layer to conduct electricity to the first LED chip The third plate body is provided with a plurality of light-transmitting grooves and second accommodating grooves, the light-transmitting grooves correspond to the positions of the first accommodating grooves, and the plurality of light-transmitting grooves and the second accommodating grooves all pass through the third plate body. The first LED chip is located in the second accommodating groove, and the first solid crystal layer includes a plurality of first solid crystal parts, a plurality of second solid crystal parts, a plurality of third solid crystal parts and a plurality of fourth solid crystal parts. The LED chip group includes a second LED chip, a third LED chip and a fourth LED chip. The first conductive electrode of the second LED chip is connected to the second solid crystal part, the first conductive electrode of the third LED chip is connected to the third solid crystal part, the first conductive electrode of the fourth LED chip is connected to the fourth solid crystal part, and the second conductive electrodes of the second LED chip, the third LED chip and the fourth LED chip are all connected to the first solid crystal part. A first colloid is set in a plurality of the first accommodating grooves and a plurality of the light-transmitting grooves, a second colloid is set in the second accommodating groove, and the second colloid includes fluorescent powder.

2. The two-in-one RGBW LED lamp bead according to claim 1, characterized in that: The second bonding layer includes a fifth bonding portion and a sixth bonding portion. The first conductive electrode of the first LED chip is connected to the fifth bonding portion, and the second conductive electrode of the first LED chip is connected to the sixth bonding portion.

3. The two-in-one RGBW LED lamp bead according to claim 2, characterized in that: The first die-bonding portion, the second die-bonding portion, the third die-bonding portion, and the fourth die-bonding portion are respectively connected to the first metal pillar, and the fifth die-bonding portion and the sixth die-bonding portion are respectively connected to the second metal pillar.

4. The two-in-one RGBW LED lamp bead according to claim 3, characterized in that: The conductive layer includes a plurality of first conductive parts, a second conductive part, a third conductive part, a fourth conductive part, a fifth conductive part and a sixth conductive part. The number of the first bonding parts corresponds to the number of the first conductive parts. Each of the first bonding parts is connected to the first conductive part through the corresponding first metal column. The number of the second bonding parts is connected to the second conductive part through the corresponding first metal column. The number of the third bonding parts is connected to the third conductive part through the corresponding first metal column. The number of the fourth bonding parts is connected to the fourth conductive part through the corresponding first metal column. The fifth bonding part is connected to the fifth conductive part through the corresponding second metal column. The sixth bonding part is connected to the sixth conductive part through the corresponding second metal column.

5. The two-in-one RGBW LED lamp bead according to claim 4, characterized in that: The first conductive part, the second conductive part, the third conductive part, the fourth conductive part, the fifth conductive part, and the sixth conductive part all include pins, and the pins are used to connect to an external circuit.

6. The two-in-one RGBW LED lamp bead according to claim 5, characterized in that: An ink layer is provided on a side of the conductive layer facing away from the first plate.

7. The two-in-one RGBW LED lamp bead according to claim 6, characterized in that: A plurality of ink grooves are provided on the ink layer, the ink grooves penetrate the ink layer, and the ink grooves correspond to the positions of the pins.

8. An LED device, characterized in that: It comprises the two-in-one RGBW LED lamp bead as described in any one of claims 1 to 7.

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