A high-temperature superconducting unit, a joint and a method for preparing a high-temperature superconducting joint

Abstract

The present disclosure proposes a high-temperature superconducting unit, a joint and a method for preparing a high-temperature superconducting joint, wherein the high-temperature superconducting unit includes: a first connecting section, a second connecting section, a bridging layer and a first solder layer; wherein the first high-temperature superconducting tape includes: a first connecting section, and the second high-temperature superconducting tape includes: a second connecting section; the first solder layer and the bridging layer are stacked along a first direction, and the first connecting section and the second connecting section are arranged on a side of the first solder layer away from the bridging layer, and the superconducting surface of the bridging layer is arranged opposite to the superconducting surface of the first connecting section and the superconducting surface of the second connecting section, respectively, and the first connecting section and the second connecting section are spaced apart along a third direction. In the method for preparing a high-temperature superconducting unit, a joint and a high-temperature superconducting joint disclosed in the present disclosure, a low-resistance connection between the first high-temperature superconducting tape and the second high-temperature superconducting tape is achieved, and multiple reliable current paths are formed between the first high-temperature superconducting stacking cable and the second high-temperature superconducting stacking cable.

Description

Technical Field

[0001] The present disclosure relates to the technical field of high-temperature superconducting joints, and in particular to a high-temperature superconducting unit, a joint, and a method for preparing the high-temperature superconducting joint. Background Art

[0002] In recent years, high-temperature superconducting material technology and preparation processes have developed rapidly. Compared with low-temperature superconducting materials, high-temperature superconducting materials generally have higher critical temperatures and better thermal stability. Among them, the high-temperature superconducting magnet system is usually composed of several single-coil or double-coil coils in series. In order to achieve circuit connection between different coils, it is usually necessary to prepare superconducting joints between coils during the manufacturing process of high-temperature superconducting magnets. In the multi-coil stacking structure of superconducting magnets, how to achieve effective low-resistance connection between each stacked cable and form a reliable current path is a key and difficult point in superconducting magnet technology. Summary of the invention

[0003] The present disclosure aims to solve one of the technical problems in the related art at least to some extent.

[0004] To this end, the purpose of the present disclosure is to provide a high-temperature superconducting unit, a joint, and a method for preparing the high-temperature superconducting joint.

[0005] To achieve the above-mentioned purpose, the first aspect of the present disclosure provides a high-temperature superconducting unit, comprising: a first connecting section, a second connecting section, a bridging layer and a first solder layer; wherein the first high-temperature superconducting tape comprises: the first connecting section, and the second high-temperature superconducting tape comprises: the second connecting section; the first solder layer and the bridging layer are stacked along a first direction, and the first connecting section and the second connecting section are arranged on a side of the first solder layer away from the bridging layer, the superconducting surface of the bridging layer is respectively arranged opposite to the superconducting surface of the first connecting section and the superconducting surface of the second connecting section, the first connecting section and the second connecting section are respectively arranged along the second direction, and the first connecting section and the second connecting section are spaced apart along a third direction, and there are preset angles between the first direction, the second direction and the third direction.

[0006] Optionally, the bridging layer includes: a plurality of high-temperature superconducting short strips, the high-temperature superconducting short strips being arranged on a side of the first solder layer away from the first connecting section and the second connecting section, and the superconducting surfaces of the high-temperature superconducting short strips being arranged opposite to the superconducting surfaces of the first connecting section and the second connecting section respectively, the high-temperature superconducting short strips being arranged along the third direction, and the plurality of high-temperature superconducting short strips being distributed sequentially along the second direction.

[0007] Optionally, a second solder layer is provided on the superconducting surface of the high-temperature superconducting short tape, the second solder layer is connected to the first solder layer, and the thickness of the second solder layer along the first direction is less than the thickness of the first solder layer along the first direction.

[0008] Optionally, a length of the high-temperature superconducting short tape along the third direction is greater than a distance between a side of the first connecting segment away from the second connecting segment and a side of the second connecting segment away from the first connecting segment.

[0009] Optionally, the overlapping area of ​​the bridging layer and the first connecting segment along the first direction forms a first area, the overlapping area of ​​the bridging layer and the second connecting segment along the first direction forms a second area, the first area and the second area form a welding area, and the first solder layer covers the welding area along the first direction.

[0010] Optionally, the high temperature superconducting unit further includes: a first supporting and stabilizing layer, wherein the first supporting and stabilizing layer is arranged on a side of the first connecting section away from the first solder layer and on a side of the second connecting section away from the first solder layer.

[0011] Optionally, the high temperature superconducting unit further includes: a second supporting and stabilizing layer, wherein the second supporting and stabilizing layer is arranged on a side of the bridging layer away from the first solder layer.

[0012] A second aspect of the present disclosure provides a high-temperature superconducting joint, comprising: a plurality of high-temperature superconducting units as provided in the first aspect of the present disclosure, wherein the plurality of high-temperature superconducting units are sequentially distributed along a first direction and isolated from each other, and the plurality of first high-temperature superconducting tapes of the first high-temperature superconducting stacking cable respectively comprise: a plurality of first connecting segments of the high-temperature superconducting units, and the plurality of second high-temperature superconducting tapes of the second high-temperature superconducting stacking cable respectively comprise: a plurality of second connecting segments of the high-temperature superconducting units.

[0013] The third aspect of the present disclosure provides a method for preparing the high-temperature superconducting joint provided in the first aspect of the present disclosure, comprising: S1: arranging the first connecting section of the first high-temperature superconducting tape in the first high-temperature superconducting stacking cable and the second connecting section of the second high-temperature superconducting tape in the second high-temperature superconducting stacking cable respectively along the second direction, and making the superconducting surface of the first connecting section and the superconducting surface of the second connecting section in the same plane and perpendicular to the first direction respectively, and at the same time, distributing the first connecting section and the second connecting section at intervals along the third direction; S2: arranging the solder sheet on the superconducting surface of the first connecting section and the superconducting surface of the second connecting section along the first direction; S3: arranging the bridging layer along the first direction The first high-temperature superconducting stacking cable and the second high-temperature superconducting stacking cable are connected to each other by a plurality of welding units, and the plurality of welding units are connected to each other by a plurality of welding layers. The plurality of welding units are connected to each other by a plurality of welding layers. The plurality of welding units are connected to each other by a plurality of welding layers. The plurality of welding units are connected to each other by a plurality of welding layers. The plurality of welding units are connected to each other by a plurality of welding layers.

[0014] Optionally, the preparation method also includes: arranging the first connecting segment and the second connecting segment along the second direction on the first supporting stabilizing layer, respectively, and making the superconducting surface of the first connecting segment and the superconducting surface of the second connecting segment on the side away from the first supporting stabilizing layer, and at the same time, distributing the first connecting segment and the second connecting segment at intervals along a third direction; after arranging the bridging layer on the solder sheet along the first direction, arranging the second supporting stabilizing layer on the bridging layer along the first direction to form the unit to be welded; wherein, among the multiple units to be welded arranged in a stacked manner, the second supporting stabilizing layer of the previous unit to be welded is used as the first supporting stabilizing layer of the next unit to be welded.

[0015] The technical solution provided by the present disclosure may have the following beneficial effects:

[0016] Since the first solder layer and the bridge layer are stacked along the first direction, and the first connecting segment and the second connecting segment are arranged on the side of the first solder layer away from the bridge layer, the first connecting segment and the second connecting segment can be connected to the bridge layer by using the first solder layer, so that the first connecting segment and the second connecting segment can be connected by using the bridge layer, thereby realizing the current transmission between the first high-temperature superconducting tape and the second high-temperature superconducting tape; and the superconducting surface of the bridge layer is arranged opposite to the superconducting surface of the first connecting segment and the superconducting surface of the second connecting segment, respectively, which can avoid the current from crossing from the superconducting layer to the high-resistance base layer during the transmission process, thereby effectively reducing the resistance of the high-temperature superconducting unit. At the same time, since the first connecting segment and the second connecting segment are arranged along the second direction, respectively, and the first connecting segment and the second connecting segment are spaced apart along the third direction, when the first connecting segment and the second connecting segment are connected by using the bridge layer, there is a large contact area between the first connecting segment and the bridge layer, and a small space occupancy, thereby realizing a small size of the high-temperature superconducting unit while further reducing the resistance of the high-temperature superconducting unit. Therefore, by utilizing the cooperation of the first connecting section, the second connecting section, the bridging layer and the first solder layer, a low-resistance connection between the first high-temperature superconducting tape and the second high-temperature superconducting tape is achieved, forming a reliable current path and ensuring the high performance of the superconducting magnet system.

[0017] Additional aspects and advantages of the present disclosure will be given in part in the following description and in part will be obvious from the following description or learned through practice of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present disclosure will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0019] Figure 1 is a three-dimensional assembly diagram of a high-temperature superconducting unit proposed in one embodiment of the present disclosure;

[0020] Figure 2 is a cross-sectional schematic diagram of a high-temperature superconducting unit proposed in one embodiment of the present disclosure;

[0021] Figure 3 is a three-dimensional schematic diagram of a high-temperature superconducting joint proposed in an embodiment of the present disclosure;

[0022] Figure 4 It is a schematic diagram of a process of preparing a high-temperature superconducting joint according to an embodiment of the present disclosure;

[0023] As shown in the figure: 1, the first connecting section, 2, the second connecting section;

[0024] 3. Bridging layer, 31. High temperature superconducting short strip;

[0025] 4. The first solder layer, 5. The first supporting and stabilizing layer, 6. The second supporting and stabilizing layer. DETAILED DESCRIPTION

[0026] Embodiments of the present disclosure are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present disclosure, and are not to be construed as limitations of the present disclosure. On the contrary, the embodiments of the present disclosure include all changes, modifications, and equivalents that fall within the spirit and connotation of the appended claims.

[0027] like Figure 1 and Figure 2 As shown, the embodiment of the present disclosure proposes a high-temperature superconducting unit, including: a first connecting section 1, a second connecting section 2, a bridging layer 3 and a first solder layer 4; wherein, the first high-temperature superconducting tape includes: a first connecting section 1, the second high-temperature superconducting tape includes: a second connecting section 2, the first solder layer 4 and the bridging layer 3 are stacked along a first direction, and the first connecting section 1 and the second connecting section 2 are arranged on a side of the first solder layer 4 away from the bridging layer 3, the superconducting surface of the bridging layer 3 is arranged opposite to the superconducting surface of the first connecting section 1 and the superconducting surface of the second connecting section 2, respectively, the first connecting section 1 and the second connecting section 2 are arranged along the second direction, and the first connecting section 1 and the second connecting section 2 are spaced apart along the third direction, and there are preset angles between the first direction, the second direction and the third direction.

[0028] It can be understood that since the first solder layer 4 and the bridging layer 3 are stacked along the first direction, and the first connecting segment 1 and the second connecting segment 2 are arranged on the side of the first solder layer 4 away from the bridging layer 3, the first connecting segment 1 and the second connecting segment 2 can be connected to the bridging layer 3 respectively by using the first solder layer 4, so that the first connecting segment 1 and the second connecting segment 2 can be connected by using the bridging layer 3, thereby realizing current transmission between the first high-temperature superconducting tape and the second high-temperature superconducting tape.

[0029] Moreover, the superconducting surface of the bridge layer 3 is arranged opposite to the superconducting surface of the first connection section 1 and the superconducting surface of the second connection section 2, respectively, which can prevent the current from crossing from the superconducting layer to the high-resistance base layer during transmission, thereby effectively reducing the resistance of the high-temperature superconducting unit. At the same time, since the first connection section 1 and the second connection section 2 are arranged along the second direction respectively, and the first connection section 1 and the second connection section 2 are spaced and distributed along the third direction, the first connection section 1 and the second connection section 2 are connected by the bridge layer 3, and there is a large contact area between the first connection section 1 and the bridge layer 3, and a small space occupancy between the second connection section 2 and the bridge layer 3, thereby further reducing the resistance of the high-temperature superconducting unit while realizing a small size of the high-temperature superconducting unit. Therefore, by using the cooperation of the first connection section 1, the second connection section 2, the bridge layer 3 and the first solder layer 4, a low-resistance connection between the first high-temperature superconducting tape and the second high-temperature superconducting tape is realized, a reliable current path is formed, and the high performance of the superconducting magnet system is guaranteed.

[0030] It should be noted that the first high-temperature superconducting tape and the second high-temperature superconducting tape are used as two high-temperature superconducting circuits, which use high-temperature superconducting units to achieve low-resistance connection. The specific types of the first high-temperature superconducting tape and the second high-temperature superconducting tape can be set according to actual needs, and there is no limitation on this. For example, the first high-temperature superconducting tape and the second high-temperature superconducting tape can be sub-tapes in two stacked cables respectively. Multiple first high-temperature superconducting tapes are stacked along a first direction to form a first high-temperature superconducting stacking cable, and multiple second high-temperature superconducting tapes are stacked along the first direction to form a second high-temperature superconducting stacking cable. The first high-temperature superconducting stacking cable and the second high-temperature superconducting stacking cable are connected at a low resistance through multiple high-temperature superconducting units, wherein the first high-temperature superconducting stacking cable and the second high-temperature superconducting stacking cable are used to prepare rare earth barium copper oxide coils of a high-temperature superconducting magnet system.

[0031] Among them, the first connecting segment 1 serves as the connecting part of the first high-temperature superconducting tape, and the second connecting segment 2 serves as the connecting part of the second high-temperature superconducting tape. The specific types of the first connecting segment 1 and the second connecting segment 2 can be set according to actual needs, and there is no limitation on this. For example, the first connecting segment 1 and the other parts of the first high-temperature superconducting tape are integrally formed, and the second connecting segment 2 and the other parts of the second high-temperature superconducting tape are integrally formed, that is, one end of the first high-temperature superconducting tape extends to the side of the first solder layer 4 away from the bridging layer 3 and forms the first connecting segment 1, and the second high-temperature superconducting tape extends to the side of the first solder layer 4 away from the bridging layer 3 and forms the second connecting segment 2.

[0032] The first solder layer 4 is used to realize soldering between the bridging layer 3 and the first connecting section 1 and between the bridging layer 3 and the second connecting section 2, so that the first connecting section 1 and the second connecting section 2 are connected by using the bridging layer 3. The first solder layer 4 serves as an intermediate conductive medium and a connecting structure. The specific type of the first solder layer 4 can be set according to actual needs and is not limited to this. For example, the first solder layer 4 is formed by condensing a solder sheet after being melted at a high temperature. The solder sheet can be a Sn60Pn40 solder sheet, a pure indium solder sheet, an In52Sn48 solder sheet, etc. The thickness of the solder sheet can range from 0.035mm to 0.1mm.

[0033] The bridging layer 3 is used to connect the first connecting segment 1 and the second connecting segment 2. The bridging layer 3 is distributed along the second direction as the first connecting segment 1 and the second connecting segment 2 are set, and when the first connecting segment 1 and the second connecting segment 2 transmit current, the current passes through the bridging layer 3 along the third direction. Therefore, based on the larger contact area between the bridging layer 3 and the first connecting segment 1 and between the bridging layer 3 and the second connecting segment 2, and the larger width of the bridging layer 3 in the second direction, the current transmission efficiency is higher, thereby achieving a low-resistance connection between the first connecting segment 1 and the second connecting segment 2. The specific type of the bridging layer 3 can be set according to actual needs and is not limited to this. For example, the bridging layer 3 is a rectangular sheet structure made of high-temperature superconducting material, and the first high-temperature superconducting tape and the second high-temperature superconducting tape can be respectively located at one end of the bridging layer 3 along the second direction, or at both ends of the bridging layer 3 along the second direction.

[0034] The first direction, the second direction and the third direction can be set according to actual needs without limitation. For example, the first direction, the second direction and the third direction are perpendicular to each other, that is, the preset angle between the first direction and the second direction is 90 degrees, the preset angle between the first direction and the third direction is 90 degrees, and the preset angle between the second direction and the third direction is 90 degrees.

[0035] like Figure 1 As shown, in some embodiments, the bridging layer 3 includes: a plurality of high-temperature superconducting short tapes 31, the high-temperature superconducting short tapes 31 are arranged on a side of the first solder layer 4 away from the first connecting section 1 and the second connecting section 2, and the superconducting surfaces of the high-temperature superconducting short tapes 31 are arranged opposite to the superconducting surfaces of the first connecting section 1 and the second connecting section 2, respectively, the high-temperature superconducting short tapes 31 are arranged along the third direction, and the plurality of high-temperature superconducting short tapes 31 are distributed sequentially along the second direction.

[0036] It can be understood that, since the high-temperature superconducting short tape 31 is arranged on the side of the first solder layer 4 away from the first connecting section 1 and the second connecting section 2, the first connecting section 1 and the second connecting section 2 can be connected to the high-temperature superconducting short tape 31 respectively by using the first solder layer 4, so that the first connecting section 1 and the second connecting section 2 can be connected by using the high-temperature superconducting short tape 31, thereby realizing the current transmission between the first high-temperature superconducting tape and the second high-temperature superconducting tape, and since the superconducting surface of the high-temperature superconducting short tape 31 is respectively connected to the superconducting surface of the first connecting section 1 and the superconducting surface of the second connecting section 2 The surfaces are arranged relative to each other, which can avoid the current from crossing from the superconducting layer to the high-resistance base layer during transmission, thereby effectively reducing the resistance of the high-temperature superconducting unit. At the same time, the bridging structure of the bridging layer 3 is formed by the sequential distribution of multiple high-temperature superconducting short strips 31, which not only simplifies the structure of the bridging layer 3, but also makes the preparation of the bridging layer 3 more flexible and convenient. In addition, the multiple high-temperature superconducting short strips 31 are independently arranged on the side of the first solder layer 4 away from the first connecting section 1 and the second connecting section 2, so that the fit between the bridging layer 3 and the first solder layer 4 is higher and the connection is more stable.

[0037] It should be noted that the high-temperature superconducting short tape 31 is used to connect the first connecting section 1 and the second connecting section 2 using the first solder layer 4. Multiple high-temperature superconducting short tapes 31 constitute the bridging layer 3. The specific type of the high-temperature superconducting short tape 31 can be set according to actual needs and is not limited to this.

[0038] Among them, in the selection of the high-temperature superconducting short tape 31, while ensuring the stable connection between the first connecting section 1 and the second connecting section 2, a smaller number of but wider high-temperature superconducting short tapes 31 can be selected, which simplifies the overall production process on the one hand, and improves the stability of welding during the preparation process on the other hand.

[0039] The bridging layer 3 is suitable for cross-plane joints between coils in different planes. The high-temperature superconducting short tape 31 inside the bridging layer 3 is arranged along the third direction, and its length direction is consistent with the internal current flow direction, both of which are perpendicular to the length direction (second direction) of the first high-temperature superconducting tape and the second high-temperature superconducting tape in different planes, so as to realize the vertical crossing flow of current from the stacking cable under one plane to the stacking cable under another plane.

[0040] In some embodiments, the superconducting surface of the high-temperature superconducting short tape 31 is provided with a second solder layer, the second solder layer is connected to the first solder layer 4, and the thickness of the second solder layer along the first direction is less than the thickness of the first solder layer 4 along the first direction.

[0041] It can be understood that since the superconducting surface of the high-temperature superconducting short tape 31 is provided with a second solder layer, the high-temperature superconducting unit can use the thinner second solder layer to quickly melt the first solder layer 4 during the preparation process, thereby achieving rapid preparation of the second solder layer between the high-temperature superconducting short tape 31 and the first connecting section 1 and the second connecting section 2, and then achieving efficient welding of the high-temperature superconducting short tape 31 on the first connecting section 1 and the second connecting section 2.

[0042] It should be noted that the second solder layer is used as a pre-plating layer, which is used for uniform welding of the solder sheet as the first solder layer 4 during the preparation process of the high-temperature superconducting unit. The specific type of the second solder layer can be set according to actual needs and is not limited to this. For example, the material of the second solder layer can be Sn60Pn40 solder, pure indium solder, In52Sn48 solder, etc. The material of the second solder layer is consistent with that of the first solder layer 4.

[0043] On this basis, a pre-plating structure similar to the second solder layer may be provided on both the superconducting surface of the first connecting section 1 and the superconducting surface of the second connecting section 2 to ensure welding quality and ensure sufficient and uniform welding.

[0044] like Figure 2 As shown, in some embodiments, the length of the high temperature superconducting short tape 31 along the third direction is greater than the distance between the first connecting segment 1 away from the second connecting segment 2 and the second connecting segment 2 away from the first connecting segment 1 .

[0045] It can be understood that since the length of the high-temperature superconducting short tape 31 along the third direction is greater than the spacing between the first connecting segment 1 and the second connecting segment 2, when the high-temperature superconducting short tape 31 is connected to the first connecting segment 1 and the second connecting segment 2 respectively by using the first solder layer 4, the high-temperature superconducting short tape 31 has a certain margin relative to the first connecting segment 1 and the second connecting segment 2, so that the superconducting surface of the bridging layer 3 can be completely welded to the superconducting surface of the first connecting segment 1 and the superconducting surface of the second connecting segment 2 respectively by using the first solder layer 4, and to a certain extent, the phenomenon of cold welding caused by the disturbance of the high-temperature superconducting short tape 31 during the welding process is avoided.

[0046] It should be noted that the distance between the first connecting segment 1 away from the second connecting segment 2 and the second connecting segment 2 away from the first connecting segment 1 is the maximum distance between the first connecting segment 1 and the second connecting segment 2. Correspondingly, the distance between the first connecting segment 1 close to the second connecting segment 2 and the second connecting segment 2 close to the first connecting segment 1 is the minimum distance between the first connecting segment 1 and the second connecting segment 2.

[0047] In some embodiments, the overlapping area of ​​the bridging layer 3 and the first connecting segment 1 along the first direction forms a first area, the overlapping area of ​​the bridging layer 3 and the second connecting segment 2 along the first direction forms a second area, the first area and the second area form a welding area, and the first solder layer 4 covers the welding area along the first direction.

[0048] It can be understood that since the first solder layer 4 covers the welding area between the bridging layer 3 and the first connecting section 1 and the second connecting section 2 along the first direction, the first solder layer 4 can achieve sufficient welding in the welding area, avoiding problems such as high resistance and loose connection caused by insufficient welding.

[0049] It should be noted that the first area in the welding area is the overlapping area of ​​the bridging layer 3 and the first connecting section 1, the second area in the welding area is the overlapping area of ​​the bridging layer 3 and the second connecting section 2, and the first solder layer 4 is used for sufficient welding of the first area and the second area.

[0050] like Figure 1 , Figure 2 and Figure 3 As shown, in some embodiments, the high temperature superconducting unit further includes: a first supporting stabilizing layer 5 , which is arranged on a side of the first connecting section 1 away from the first solder layer 4 and on a side of the second connecting section 2 away from the first solder layer 4 .

[0051] It can be understood that, since the first supporting stabilizing layer 5 is arranged on the side of the first connecting segment 1 away from the first solder layer 4 and the side of the second connecting segment 2 away from the first solder layer 4, the first supporting stabilizing layer 5 can form an effective and uniform support for the first connecting segment 1 and the second connecting segment 2, thereby ensuring the stable welding of the bridging layer 3 on the first connecting segment 1 and the second connecting segment 2. At the same time, by utilizing the shunting of the first supporting stabilizing layer 5, it can also act as a stabilizing layer during the quenching process of the high-temperature superconducting unit to protect the joint.

[0052] It should be noted that the first supporting stabilizing layer 5 is used to provide support and diversion for the first connecting section 1 and the second connecting section 2. Specifically, the first supporting stabilizing layer 5 is used to ensure the uniformity of temperature and pressure transmission during hot pressing welding, and to act as a stabilizing layer to protect the joint during quenching. The specific type of the first supporting stabilizing layer 5 can be set according to actual needs, and there is no limitation on this. For example, the first supporting stabilizing layer 5 can be a copper sheet, and the thickness of the first supporting stabilizing layer 5 can range from 0.05mm to 0.2mm. When the first supporting stabilizing layer 5 is set, its size should be larger than the bridging layer 3 and the first solder layer 4.

[0053] like Figure 1 , Figure 2 and Figure 3As shown, in some embodiments, the high temperature superconducting unit further includes: a second supporting and stabilizing layer 6 , which is disposed on a side of the bridging layer 3 away from the first solder layer 4 .

[0054] It can be understood that, since the second supporting stabilizing layer 6 is arranged on the side of the bridging layer 3 away from the first solder layer 4, the second supporting stabilizing layer 6 can form an effective and uniform support for the bridging layer 3, thereby ensuring the stable arrangement of the bridging layer 3. At the same time, by utilizing the shunting of the second supporting stabilizing layer 6, it can also act as a stabilizing layer during the quenching process of the high-temperature superconducting unit to protect the joint.

[0055] It should be noted that the second supporting stabilizing layer 6 is used to provide support and diversion for the bridging layer 3. Specifically, the second supporting stabilizing layer 6 is used to ensure the uniformity of temperature and pressure transmission during hot pressing welding, and to act as a stabilizing layer protection joint during the quenching process. The specific type of the second supporting stabilizing layer 6 can be set according to actual needs, and there is no limitation on this. For example, the second supporting stabilizing layer 6 can be a copper sheet, and the thickness of the second supporting stabilizing layer 6 can range from 0.05mm to 0.2mm. When the second supporting stabilizing layer 6 is set, its size should be larger than the bridging layer 3 and the first solder layer 4.

[0056] Among them, a solder layer can be set between the first supporting and stabilizing layer 5 and the first connecting segment 1 and the second connecting segment 2, and between the second supporting and stabilizing layer 6 and the bridging layer 3 to achieve welding using the solder layer. That is to say, each high-temperature superconducting unit has three solder layers, one solder layer is used for the connection between the bridging layer 3 and the first connecting segment 1 and the second connecting segment 2, another solder layer is used for the connection between the first supporting and stabilizing layer 5 and the first connecting segment 1 and the second connecting segment 2, and the last one is used for the connection between the bridging layer 3 and the second supporting and stabilizing layer 6.

[0057] When preparing a high temperature superconducting joint, that is, when a plurality of high temperature superconducting units are stacked, the second supporting and stabilizing layer 6 of the previous high temperature superconducting unit can be used as the first supporting and stabilizing layer 5 of the next high temperature superconducting unit.

[0058] like Figure 3 As shown, the embodiment of the present disclosure further proposes a high-temperature superconducting joint, comprising: a plurality of high-temperature superconducting units as in the embodiment of the present disclosure, the plurality of high-temperature superconducting units are sequentially distributed along a first direction and isolated from each other, and the plurality of first high-temperature superconducting tapes of the first high-temperature superconducting stacking cable respectively comprise: a plurality of first connecting segments 1 of the high-temperature superconducting units, and the plurality of second high-temperature superconducting tapes of the second high-temperature superconducting stacking cable respectively comprise: a plurality of second connecting segments 2 of the high-temperature superconducting units.

[0059] It can be understood that since the first solder layer 4 and the bridging layer 3 are stacked along the first direction, and the first connecting segment 1 and the second connecting segment 2 are arranged on the side of the first solder layer 4 away from the bridging layer 3, the first connecting segment 1 and the second connecting segment 2 can be connected to the bridging layer 3 respectively by using the first solder layer 4, so that the first connecting segment 1 and the second connecting segment 2 can be connected by using the bridging layer 3, thereby realizing current transmission between the first high-temperature superconducting tape and the second high-temperature superconducting tape.

[0060] Moreover, the superconducting surface of the bridge layer 3 is arranged opposite to the superconducting surface of the first connection section 1 and the superconducting surface of the second connection section 2, respectively, which can prevent the current from crossing from the superconducting layer to the high-resistance base layer during transmission, thereby effectively reducing the resistance of the high-temperature superconducting unit. At the same time, since the first connection section 1 and the second connection section 2 are arranged along the second direction respectively, and the first connection section 1 and the second connection section 2 are spaced and distributed along the third direction, the first connection section 1 and the second connection section 2 are connected by the bridge layer 3, and there is a large contact area between the first connection section 1 and the bridge layer 3, and a small space occupancy between the second connection section 2 and the bridge layer 3, thereby further reducing the resistance of the high-temperature superconducting unit while realizing a small size of the high-temperature superconducting unit. Therefore, by using the cooperation of the first connection section 1, the second connection section 2, the bridge layer 3 and the first solder layer 4, a low-resistance connection between the first high-temperature superconducting tape and the second high-temperature superconducting tape is realized, and multiple reliable current paths are formed between the first high-temperature superconducting stacking cable and the second high-temperature superconducting stacking cable, ensuring the high performance of the superconducting magnet system.

[0061] It should be noted that the resistance of the joint is an important parameter indicator. Generally, the joint resistance is required to be as small as possible. This can improve the operating stability of high-temperature superconducting stacked cables, coils and other devices, and make them generate less heat when operating in a low-temperature environment, thereby reducing the cooling power and improving the overall performance of the equipment.

[0062] like Figure 4 As shown, the embodiment of the present disclosure also provides a method for preparing a high-temperature superconducting joint as in the embodiment of the present disclosure, comprising:

[0063] S1: The first connecting section 1 of the first high temperature superconducting tape in the first high temperature superconducting stacking cable and the second connecting section 2 of the second high temperature superconducting tape in the second high temperature superconducting stacking cable are respectively arranged along the second direction, and the superconducting surface of the first connecting section 1 and the superconducting surface of the second connecting section 2 are in the same plane and perpendicular to the first direction respectively, and the first connecting section 1 and the second connecting section 2 are spaced apart and distributed along the third direction;

[0064] S2: placing a solder sheet along a first direction on the superconducting surface of the first connecting section 1 and the superconducting surface of the second connecting section 2;

[0065] S3: arranging the bridge layer 3 on the solder sheet along the first direction, and making the superconducting surface of the bridge layer 3 face the superconducting surface of the first connecting section 1 and the superconducting surface of the second connecting section 2 respectively, so as to form a unit to be welded;

[0066] S4: repeating steps S1 to S3 to form a plurality of units to be welded arranged in a stacked manner along a first direction between the first high-temperature superconducting stack cable and the second high-temperature superconducting stack cable;

[0067] S5: heating the plurality of units to be welded according to a first preset temperature, and pressing the plurality of units to be welded along a first direction according to a preset pressure;

[0068] S6: Cooling the plurality of units to be welded, so that the plurality of melted solder sheets are converted into a plurality of first solder layers 4, and the plurality of units to be welded are converted into high-temperature superconducting joints.

[0069] It can be understood that after the first connecting section 1 and the second connecting section 2 are arranged, the solder sheet and the bridging layer 3 are arranged on the first connecting section 1 and the second connecting section 2 in sequence, and then the stacking operation is repeated to form a plurality of units to be welded stacked along the first direction, and finally the solder sheet is converted into the first solder layer 4 by heating and pressurizing, thereby realizing the welding of the bridging layer 3 on the first connecting section 1 and the second connecting section 2, and then realizing the preparation of the high-temperature superconducting joint.

[0070] Among them, since the first solder layer 4 and the bridging layer 3 are stacked along the first direction, and the first connecting segment 1 and the second connecting segment 2 are arranged on the side of the first solder layer 4 away from the bridging layer 3, the first connecting segment 1 and the second connecting segment 2 can be connected to the bridging layer 3 respectively by using the first solder layer 4, so that the first connecting segment 1 and the second connecting segment 2 can be connected by using the bridging layer 3, thereby realizing current transmission between the first high-temperature superconducting tape and the second high-temperature superconducting tape.

[0071] Moreover, the superconducting surface of the bridge layer 3 is arranged opposite to the superconducting surface of the first connection section 1 and the superconducting surface of the second connection section 2, respectively, which can prevent the current from crossing from the superconducting layer to the high-resistance base layer during transmission, thereby effectively reducing the resistance of the high-temperature superconducting unit. At the same time, since the first connection section 1 and the second connection section 2 are arranged along the second direction, respectively, and the first connection section 1 and the second connection section 2 are spaced and distributed along the third direction, the first connection section 1 and the second connection section 2 are connected by the bridge layer 3, and there is a large contact area between the first connection section 1 and the bridge layer 3, and a small space occupancy between the second connection section 2 and the bridge layer 3, thereby further reducing the resistance of the high-temperature superconducting unit while realizing a small size of the high-temperature superconducting unit. Therefore, by using the preparation of the first connection section 1, the second connection section 2, the bridge layer 3 and the first solder layer 4, a low-resistance connection between the first high-temperature superconducting tape and the second high-temperature superconducting tape is realized, and a reliable current path is formed between the first high-temperature superconducting stacking cable and the second high-temperature superconducting stacking cable, ensuring the high performance of the superconducting magnet system.

[0072] It should be noted that the unit to be welded is a high-temperature superconducting unit that has not been welded. The unit to be welded is heated according to a first preset temperature, and is pressed along a first direction according to a preset pressure, thereby utilizing temperature and pressure to achieve welding of the unit to be welded, so that the unit to be welded is converted into a high-temperature superconducting unit after cooling.

[0073] The first preset temperature and the preset pressure can be set according to actual needs and are not limited thereto.

[0074] Among them, at the first preset temperature, the solder sheet melts into liquid solder, fully contacts the superconducting surface of the bridge layer 3, the superconducting surface of the first connecting section 1 and the superconducting surface of the second connecting section 2, and relies on the external preset pressure to squeeze out excess solder, and forms the first solder layer 4 after condensation. This method can effectively reduce the contact resistance caused by the solder thickness.

[0075] The unit to be welded is cooled according to the preset time and the second preset temperature, so as to achieve rapid cooling of the high temperature superconducting unit, so as to alleviate the critical current degradation phenomenon of the high temperature superconducting unit caused by the high temperature. The control of the preset time and the second preset temperature can be achieved by using a cooling device, which can be an electric hair dryer or the like.

[0076] When arranging the first connecting section 1 and the second connecting section 2 and arranging the bridge layer 3, a small amount of soldering flux may be applied on the welding area of ​​the superconducting surface to improve the welding efficiency and quality.

[0077] When preparing a high-temperature superconducting joint, a plurality of units to be welded may be prepared in sequence along the first direction according to the above steps S1 to S3, and finally a high-temperature superconducting joint may be prepared according to the above steps S4 to S5.

[0078] In some embodiments, the preparation method further comprises:

[0079] The first connecting segment 1 and the second connecting segment 2 are respectively arranged along the second direction on the first supporting and stabilizing layer 5, and the superconducting surface of the first connecting segment 1 and the superconducting surface of the second connecting segment 2 are located on the side away from the first supporting and stabilizing layer 5, and the first connecting segment 1 and the second connecting segment 2 are spaced apart and distributed along the third direction;

[0080] After the bridge layer 3 is arranged on the solder sheet along the first direction, the second supporting and stabilizing layer 6 is arranged on the bridge layer 3 along the first direction to form a unit to be welded;

[0081] Among the multiple units to be welded arranged in a stacked manner, the second supporting and stabilizing layer 6 of the previous unit to be welded is used as the first supporting and stabilizing layer 5 of the next unit to be welded.

[0082] It can be understood that the arrangement of the first supporting stabilizing layer 5 and the second supporting stabilizing layer 6 can form effective support for the high-temperature superconducting unit, thereby ensuring the stable preparation of the high-temperature superconducting unit. At the same time, the shunting of the first supporting stabilizing layer 5 and the second supporting stabilizing layer 6 can also act as a stabilizing layer during the quenching process of the high-temperature superconducting unit to protect the joint.

[0083] It should be noted that the first supporting and stabilizing layer 5 and the second supporting and stabilizing layer 6 can also be used to separate a plurality of high-temperature superconducting units, thereby ensuring stable preparation of high-temperature superconducting joints.

[0084] The previous high-temperature superconducting unit and the next high-temperature superconducting unit refer to two adjacent high-temperature superconducting units in the stacked preparation structure.

[0085] The high-temperature superconducting unit, high-temperature superconducting joint and preparation method of the present embodiment greatly reduce the joint resistance and heat generation between high-temperature superconducting stacked cables, relieve the refrigeration pressure, and ensure the thermal stability of the superconducting magnet; effectively reduce the joint size between high-temperature superconducting stacked cables and reduce the joint manufacturing cost; have a simple structure, easy manufacturing, a wide range of applications, and can meet the joint design in different scenarios; can achieve relatively uniform pressure and temperature rise during the welding process, and effectively slow down the critical current drop phenomenon caused by the joint welding process.

[0086] In the description of the present disclosure, the terms "first", "second", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. In addition, in the description of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0087] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, segment or portion of code that includes one or more executable instructions for implementing the steps of a specific logical function or process, and the scope of the preferred embodiments of the present disclosure includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order depending on the functions involved, which should be understood by those skilled in the art to which the embodiments of the present disclosure belong.

[0088] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0089] Although the embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present disclosure. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present disclosure.

Claims

1. A high temperature superconducting joint, characterized in that: include: A plurality of high temperature superconducting units, wherein the high temperature superconducting units include: a first connecting section, a second connecting section, a bridging layer and a first solder layer, a first high temperature superconducting tape includes: the first connecting section, a second high temperature superconducting tape includes: the second connecting section, the first solder layer and the bridging layer are stacked along a first direction, and the first connecting section and the second connecting section are arranged on a side of the first solder layer away from the bridging layer, a superconducting surface of the bridging layer is arranged opposite to a superconducting surface of the first connecting section and a superconducting surface of the second connecting section, respectively, the first connecting section and the second connecting section are arranged along a second direction, and the first connecting section and the second connecting section are spaced and arranged side by side along a third direction, and the first direction, the second direction and the third direction are 90 degrees apart from each other; The plurality of high temperature superconducting units are sequentially distributed along the first direction and isolated from each other, and the plurality of first high temperature superconducting tapes of the first high temperature superconducting stacking cable respectively include: a plurality of first connecting sections of the high temperature superconducting units, and the plurality of second high temperature superconducting tapes of the second high temperature superconducting stacking cable respectively include: a plurality of second connecting sections of the high temperature superconducting units; The bridging layer comprises: a plurality of high-temperature superconducting short strips, the high-temperature superconducting short strips are arranged on a side of the first solder layer away from the first connecting section and the second connecting section, and the superconducting surfaces of the high-temperature superconducting short strips are arranged opposite to the superconducting surfaces of the first connecting section and the second connecting section respectively, the high-temperature superconducting short strips are arranged along the third direction, and the plurality of high-temperature superconducting short strips are sequentially distributed along the second direction; The superconducting surface of the high-temperature superconducting short tape is provided with a second solder layer, the second solder layer is connected to the first solder layer, and the thickness of the second solder layer along the first direction is less than the thickness of the first solder layer along the first direction; The length of the high temperature superconducting short tape along the third direction is greater than the distance between the first connecting section and the second connecting section; The high temperature superconducting unit further includes: a first supporting and stabilizing layer, the first supporting and stabilizing layer being arranged on a side of the first connecting section away from the first solder layer and a side of the second connecting section away from the first solder layer, the first supporting and stabilizing layer being used to provide support and shunt for the first connecting section and the second connecting section; The high temperature superconducting unit further includes: a second supporting and stabilizing layer, which is arranged on a side of the bridging layer away from the first solder layer, and is used to provide support and shunting for the bridging layer.

2. The high temperature superconducting joint according to claim 1, characterized in that: The overlapping area of ​​the bridging layer and the first connecting segment along the first direction forms a first area, the overlapping area of ​​the bridging layer and the second connecting segment along the first direction forms a second area, the first area and the second area form a welding area, and the first solder layer covers the welding area along the first direction.

3. A method for preparing a high temperature superconducting joint as claimed in claim 1, characterized in that: include: S1: Arrange the first connecting section of the first high-temperature superconducting tape in the first high-temperature superconducting stacking cable and the second connecting section of the second high-temperature superconducting tape in the second high-temperature superconducting stacking cable respectively along the second direction, and make the superconducting surface of the first connecting section and the superconducting surface of the second connecting section in the same plane and perpendicular to the first direction respectively, and at the same time, distribute the first connecting section and the second connecting section at intervals along the third direction; S2: placing a solder sheet on the superconducting surface of the first connecting section and the superconducting surface of the second connecting section along the first direction; S3: arranging a bridge layer on the solder sheet along the first direction, and making the superconducting surface of the bridge layer face the superconducting surface of the first connecting section and the superconducting surface of the second connecting section respectively, so as to form a unit to be welded; S4: repeating steps S1 to S3 to form a plurality of the to-be-welded units stacked and arranged along the first direction between the first high-temperature superconducting stacking cable and the second high-temperature superconducting stacking cable; S5: heating the plurality of units to be welded according to a first preset temperature, and pressing the plurality of units to be welded along the first direction according to a preset pressure; S6: Cooling the plurality of units to be welded, so that the plurality of melted solder sheets are converted into a plurality of first solder layers, and the plurality of units to be welded are converted into the high temperature superconducting joints.

4. The method for preparing a high temperature superconducting joint according to claim 3, characterized in that: The preparation method further comprises: The first connecting segment and the second connecting segment are respectively arranged along the second direction on the first supporting and stabilizing layer, and the superconducting surface of the first connecting segment and the superconducting surface of the second connecting segment are located on the side away from the first supporting and stabilizing layer, and the first connecting segment and the second connecting segment are spaced apart and distributed along the third direction; After the bridging layer is disposed on the solder sheet along the first direction, a second supporting and stabilizing layer is disposed on the bridging layer along the first direction to form the unit to be welded; Among the plurality of units to be welded that are stacked, the second supporting and stabilizing layer of the previous unit to be welded is used as the first supporting and stabilizing layer of the next unit to be welded.

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