Chip plastic sealing machine and chip plastic sealing method

Abstract

The application provides a chip plastic sealing machine and a chip plastic sealing method. The chip plastic sealing machine comprises a plastic sealing device, a transfer device and an integrated rack; the integrated rack is used for loading substrates and resins, arranging a plurality of substrates and a plurality of resins to form a raw material array, and processing a semi-finished product into a finished product; the plastic sealing device and the transfer device are arranged opposite in the longitudinal direction; the integrated rack and the transfer device are arranged opposite in the transverse direction; the transfer device is used for sending the raw material array into the plastic sealing device; the plastic sealing device melts the resin to form a semi-finished product with the substrate; and the transfer device moves the semi-finished product from the plastic sealing device to the integrated rack to process the semi-finished product into a finished product. The transfer device comprises a transfer platform, a clamping platform and a mechanical hand; the transfer platform is used for placing the semi-finished product; the clamping platform comprises a first platform and a second platform; the first platform is used for realizing the overall transfer of the raw material array; and the second platform is used for realizing the one-by-one movement of the semi-finished product; and the plastic sealing efficiency is effectively improved.

Description

Technical Field

[0001] The present invention relates to the field of chip plastic packaging equipment, and in particular to a chip plastic packaging machine and a chip plastic packaging method. Background Art

[0002] Chips are usually placed on a substrate and need to be plastic-encapsulated to protect them after preparation. The plastic-encapsulation process generally involves feeding the substrate and resin into a plastic-encapsulation device, which then melts the resin. The melted resin then flows along the mold to the designated position of the substrate, thereby plastic-encapsulating the chip. After plastic-encapsulation, a semi-finished product is formed. After the semi-finished product is removed from the plastic-encapsulation device, the remaining resin is removed to form a finished sheet. In the prior art, the placement of the resin and substrate is done manually, and the substrates are usually plastic-encapsulated one by one, which is inefficient. In addition, the overall size of the equipment is large, which occupies a large amount of factory space and results in high costs. Summary of the Invention

[0003] The present invention provides a chip plastic packaging machine and a chip plastic packaging method, which can effectively improve the plastic packaging efficiency.

[0004] In one aspect, the present invention provides an integrated frame, which is in the shape of a cube, and whose four sides are respectively a loading side, a transfer side, a discharging side, and a plastic sealing side, wherein the loading side and the plastic sealing side are arranged opposite to each other in the longitudinal direction, and the discharging side and the transfer side are arranged opposite to each other in the transverse direction; the discharging side is provided with a discharge port, and the transfer side is provided with a raw material outlet and a semi-finished product inlet, wherein the raw material outlet and the semi-finished product inlet are arranged in the longitudinal direction, and the raw material outlet is closer to the plastic sealing side than the semi-finished product inlet;

[0005] The integrated frame is provided with a raw material platform, a semi-finished product processing assembly, a substrate feeding assembly, and a resin feeding assembly; the raw material platform is arranged in a horizontal direction corresponding to the raw material outlet, and is used to place a raw material array consisting of multiple substrates and multiple resins; the semi-finished product processing assembly is arranged in a horizontal direction corresponding to the semi-finished product inlet, and is used to process the semi-finished products to form finished webs;

[0006] The substrate feeding assembly is used to convey the substrate, and includes a substrate loading module, a substrate conveying module, and a substrate unloading module arranged in sequence along the longitudinal direction; the substrate loading module is located at the loading side and is used to load the substrate; the substrate conveying module is located at the discharge side and is used to convey the substrate to the substrate unloading module; the substrate unloading module is located at the raw material platform and is used to place the substrate on the raw material platform;

[0007] The resin feeding assembly is used for conveying resin, which comprises resin feeding modules, resin conveying modules and resin discharging modules arranged in sequence along the longitudinal direction; the resin feeding modules are located at the feeding side and below the substrate feeding modules, and are used for loading resin; the resin conveying modules are located at the transfer side and below the semi-finished product inlets, and are used for conveying resin to the resin discharging modules; and the resin discharging modules are arranged at the raw material platform, and are used for placing resin on the raw material platform.

[0008] The raw material platform comprises a substrate platform, resin platforms and resin lifting mechanisms, the substrate platform is used for placing a plurality of substrates and is fixed to the integrated rack, a plurality of avoiding holes are arranged on the substrate platform, the resin platforms are in one-to-one correspondence with the avoiding holes, the resin platforms are used for placing a plurality of resins and are vertically slidingly arranged at the avoiding holes, and the resin lifting mechanisms are connected to the resin platforms and are used for driving the resin platforms to move vertically.

[0009] The resin discharging modules are arranged below the substrate platform, when the resin platforms move downwardly to below the substrate platform, the resin discharging modules place resin on the resin platforms, and when the resin platforms move upwardly to the avoiding holes, the resins and the substrates form a raw material array.

[0010] The substrate discharging modules are arranged above the raw material platform.

[0011] The resin discharging modules comprise receiving platforms, receiving longitudinal moving mechanisms and resin transferring mechanisms.

[0012] The receiving platforms and the resin platforms have the same structure and are provided with a plurality of resin positioning grooves arranged along the longitudinal direction, and the receiving platforms are located below the output ends of the resin conveying modules.

[0013] The receiving longitudinal moving mechanisms are connected to the receiving platforms and are used for driving the receiving platforms to move longitudinally, so that the resins fall into the resin positioning grooves of the receiving platforms in sequence.

[0014] The resin transferring mechanisms are located above the receiving platforms and comprise resin clamping mechanisms and resin moving mechanisms, the resin clamping mechanisms are used for clamping the resins, and the resin moving mechanisms are connected to the resin clamping mechanisms and are used for driving the resin clamping mechanisms to move between the receiving platforms and the resin platforms, so as to transfer the resins in the receiving platforms to the resin platforms.

[0015] The substrate loading module includes a clip, a clip transverse conveying mechanism, a clip vertical conveying mechanism, and a substrate longitudinal pushing mechanism. Both longitudinal ends of the clip are open. Both lateral inner walls of the clip are provided with substrate receiving slots. The substrate receiving slots are arranged in a plurality of longitudinally spaced intervals so that multiple substrates can be arranged in the clip in a vertically spaced interval.

[0016] The magazine transverse conveying mechanism is used to drive the magazine to move transversely, so as to move multiple magazines one by one to the magazine vertical conveying mechanism; the magazine vertical conveying mechanism is close to the discharge side relative to the magazine transverse conveying mechanism, and is used to drive the magazine to move vertically; the substrate longitudinal pushing mechanism is arranged adjacent to the magazine vertical conveying mechanism; the substrate longitudinal pushing mechanism includes a longitudinal cylinder and a pushing member, and the longitudinal cylinder is connected to the pushing member, and is used to drive the pushing member to move longitudinally, so as to push the substrate from the magazine to the substrate conveying module.

[0017] Among them, the substrate loading module also includes a magazine collecting platform and a magazine collecting pushing mechanism. The magazine collecting platform is a long strip arranged in the transverse direction, which is located directly above the magazine transverse conveying mechanism. The magazine collecting pushing mechanism is used to push the magazine in the transverse direction to move it to the magazine collecting platform.

[0018] Among them, the semi-finished product processing component includes a base, a gluing mechanism and a scraping mechanism; a hollow area is provided on the base, and the two sides of the hollow area are used to support the semi-finished product sheet, so that the residual glue of the semi-finished product is suspended in the hollow area; the gluing mechanism is set on the base along the vertical sliding, and is located above the scraping mechanism, for knocking off the residual glue, thereby separating the sheet from the residual glue; the scraping mechanism is set on the base, which includes a scraper and a scraping drive, the scraper is set in the hollow area along the longitudinal sliding, the scraping drive is set under the base, and is connected to the scraper to drive the scraper to move longitudinally and thus remove the burrs on the water outlet of the sheet.

[0019] The integrated frame further includes a receiving assembly for collecting finished sheet materials, the receiving assembly and the semi-finished product processing assembly are arranged in a transverse direction, and the receiving assembly is arranged in a transverse direction corresponding to the discharge port;

[0020] The receiving assembly includes a receiving drive and a receiving clamp, wherein the receiving drive is connected to the receiving clamp to drive the receiving clamp to move laterally between a first position and a second position; when the receiving clamp moves to the first position, the receiving clamp is vertically located between the glue-spraying mechanism and the glue-squeegeeing mechanism to clamp the finished sheet on the base; when the receiving clamp moves to the second position, the receiving clamp is located at the discharge port to put down the finished sheet for collection;

[0021] A dust suction mechanism is provided on the side of the material receiving fixture facing the semi-finished product processing component; the dust suction mechanism is provided with two dust suction ports, which are respectively directed towards the gluing mechanism and the scraping mechanism.

[0022] On the other hand, the present invention provides a chip laminator, comprising a laminator, a transfer device and the aforementioned integrated frame;

[0023] The plastic packaging equipment has a plastic packaging feed port, and the plastic packaging feed port is arranged opposite to the transfer equipment in the longitudinal direction; the transfer side is arranged opposite to the transfer equipment in the transverse direction;

[0024] The transfer equipment is used to feed the raw material array into the molding equipment through the molding feed port, and to move the semi-finished products from the molding equipment to the integrated frame.

[0025] Among them, the transfer equipment includes a transfer platform, a clamping platform and a manipulator. The transfer platform is used to place semi-finished products, and the clamping platform is used to clamp the raw material array and semi-finished products. The manipulator is arranged on one side of the transfer platform, and the output end of the manipulator is connected to the clamping platform to drive the clamping platform to move so that the clamping platform enters and exits the raw material outlet, the semi-finished product inlet and the plastic packaging feed port.

[0026] In another aspect, the present invention provides a chip plastic packaging method, comprising the following steps:

[0027] Providing substrates and resins, and arranging a plurality of the substrates and the resins into a raw material array; in the raw material array, the plurality of substrates are arranged in a matrix and divided into a plurality of groups, each group containing two adjacent and symmetrically arranged substrates; the resin is arranged between two substrates in the same group;

[0028] The raw material array is moved as a whole to a molding device, and the molding device melts the resin and molds the substrate to form a plurality of semi-finished products, each of which includes two sheets and residual glue connecting the two sheets;

[0029] removing the plurality of semi-finished products from the plastic packaging device as a whole;

[0030] The excess glue of the plurality of semi-finished products is removed one by one to form the tablet finished product.

[0031] The integrated rack, the chip plastic sealing machine and the chip plastic sealing method provided by the application can place the substrates and the resins on the raw material platform by the substrate feeding assembly and the resin feeding assembly respectively, form a raw material array by the plurality of substrates and the plurality of resins, and can simultaneously perform plastic sealing operation on the plurality of substrates, thereby improving the plastic sealing efficiency; the substrate feeding assembly and the resin feeding assembly are respectively arranged at the two lateral sides of the integrated rack, and the two can simultaneously perform feeding and placing without affecting each other, thereby improving the placing efficiency; the semi-finished product processing assembly is integrated on the integrated rack, and the semi-finished product processing assembly and the raw material platform are arranged in the longitudinal direction, thereby fully utilizing the internal space of the integrated rack, reducing the occupied space and reducing the cost. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 is a structural schematic diagram of the chip plastic sealing machine provided by the preferred embodiment of the application;

[0033] Figure 2 is Figure 1 a structural schematic diagram of the integrated rack of the chip plastic sealing machine in

[0034] Figure 3 is Figure 2 another angle of the integrated rack in

[0035] Figure 4 is Figure 2 a structural schematic diagram of the raw material platform and the substrate feeding assembly of the integrated rack in

[0036] Figure 5 is Figure 4 a structural schematic diagram of the clip of the substrate feeding assembly in

[0037] Figure 6 is Figure 4 a structural schematic diagram of the substrate feeding module of the substrate feeding assembly in

[0038] Figure 7 is Figure 4 a structural schematic diagram of the raw material platform, the substrate conveying module and the substrate discharging module in

[0039] Figure 8 is Figure 2 a structural schematic diagram of the raw material platform and the resin feeding assembly of the integrated rack in

[0040] Figure 9 is Figure 8 another angle of the raw material platform and the resin feeding assembly in

[0041] Figure 10 is Figure 1A schematic diagram of the structure of the transfer equipment of the chip laminator;

[0042] Figure 11 yes Figure 2 Schematic diagram of the structure of the semi-finished product processing component and the material receiving component of the integrated rack;

[0043] Figure 12 It is a structural schematic diagram of a raw material array in the chip plastic packaging method provided by the present invention;

[0044] Figure 13 It is a schematic diagram of the structure of multiple semi-finished products formed after plastic sealing;

[0045] Figure 14 It is a structural diagram of the finished sheet. DETAILED DESCRIPTION

[0046] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of the present invention.

[0047] In the figures, structurally similar elements are denoted by the same reference numerals.

[0048] Please refer to Figure 1 The present invention provides a plastic encapsulation machine, comprising an integrated frame 100, a plastic encapsulation device 200, and a transfer device 300. The integrated frame 100 is used to load substrates and resins, arranging multiple substrates and multiple resins to form a raw material array; multiple chips are provided on the substrates, and the chips on the substrates can be plastic encapsulated after the resin is melted. The transfer device 300 is used to feed the raw material array into the plastic encapsulation device 200. The plastic encapsulation device 200 melts the resin and forms a semi-finished product with the substrate. The transfer device 300 then moves the semi-finished product from the plastic encapsulation device 200 to the integrated frame 100, processing the semi-finished product into a finished product.

[0049] The encapsulation device 200 has an encapsulation inlet 201, which is positioned opposite the transfer device 300 in the longitudinal direction Y. The raw material array enters the encapsulation device 200 through the encapsulation inlet 201. The encapsulation device 200 generates high temperatures to melt the resin, encapsulating the chips on the substrate. After the resin melts, only a portion is used to encapsulate the chips; the remaining portion cools to form residual resin.

[0050] Combine Figure 1 、 Figure 2 and Figure 3As shown, the integrated frame 100 is a cube, with four sides defining a loading side 101, a transfer side 102, a discharge side 103, and a molding side 104. The loading side 101 and the molding side 104 are disposed opposite each other in the longitudinal direction Y, while the discharge side 103 and the transfer side 102 are disposed opposite each other in the transverse direction X. The discharge side 103 is provided with a discharge port 1031 for users to remove finished webs. The transfer side 102 is provided with a raw material outlet 1021 and a semi-finished product inlet 1022. The raw material outlet 1021 and the semi-finished product inlet 1022 are arranged along the longitudinal direction Y, with the raw material outlet 1021 closer to the molding side 104 than the semi-finished product inlet 1022. The transfer side 102 and the transfer equipment 300 are arranged opposite to each other in the horizontal direction. Combined with the plastic packaging feed port 201 and the transfer equipment 300 being arranged opposite to each other in the vertical direction, the transfer equipment 300 can be conveniently used to move the raw material array through the raw material outlet 1021 to the plastic packaging feed port 201, and to move the semi-finished products out of the plastic packaging feed port 201 and move the semi-finished products into the semi-finished product entrance 1022. Using one transfer equipment 300, multiple movements of the raw material array and semi-finished products can be achieved, thereby reducing costs.

[0051] The loading side 101 and the molding feed port 201 are both oriented in the same longitudinal direction, so that the loading side 101 is far away from the molding device 200, so that the user is away from high temperature when loading materials.

[0052] The discharging side 103 is arranged opposite to the transfer side 102 , so the user stays away from the transfer device 300 when taking out the finished product, and will not affect the operation of the transfer device 300 .

[0053] like Figure 2 、 Figure 3 The figure shows a schematic diagram of the three-dimensional structure of the integrated frame 100 provided by the present invention. In order to show its internal structure, part of the outer shell structure is hidden in the figure. The integrated frame 100 is provided with a raw material platform 1, a semi-finished product processing component 2, a substrate feeding component 3, a resin feeding component 4 and a material receiving component 5. The raw material platform 1 is arranged in correspondence with the raw material outlet 1021 in the horizontal direction, and is used to place a raw material array formed by multiple substrates and multiple resins. The semi-finished product processing component 2 is arranged in correspondence with the semi-finished product inlet 1022 in the horizontal direction, and is used to process the semi-finished product to form a finished sheet. This structure enables the raw material platform 1 and the semi-finished product processing component 2 to be arranged in the longitudinal direction. The substrate feeding component 3 and the resin feeding component 4 are used to place the substrate and the resin on the raw material platform 1.

[0054] like Figure 4As shown, the substrate feeding assembly 3 is used to transport substrates and includes a substrate loading module 31, a substrate conveying module 32, and a substrate unloading module 33, which are arranged in sequence along the longitudinal direction. The substrate loading module 31 is located at the loading side 101 and is used to load substrates. The user can place multiple substrates at the substrate loading module 31. The substrate conveying module 32 is located at the discharge side 103 and is used to transport substrates to the substrate unloading module 33. The substrate unloading module 33 is located at the raw material platform 1 and is used to place substrates on the raw material platform 1.

[0055] The substrate conveying module 32 may be a conveyor belt mechanism, which can realize smooth conveyance of the substrate over a long distance.

[0056] The substrate loading module 31 includes a clip 311, a clip transverse conveying mechanism 312, a clip vertical conveying mechanism 313, a substrate longitudinal pushing mechanism 314, a clip collection platform 315, and a clip collection pushing mechanism 316. The clip 311 is used to hold multiple substrates. The clip transverse conveying mechanism 312 is used to move the clip 311 transversely, moving the clip 311 to the clip vertical conveying mechanism 313. The clip vertical conveying mechanism 313 drives the base tape clip 311 vertically. The substrate longitudinal pushing mechanism 314 pushes substrates out of the clip 311 one by one, allowing the substrates to enter the substrate conveying module 32. The clip collection pushing mechanism 316 is used to push empty clips 311 onto the clip collection platform 315.

[0057] like Figure 5 As shown, both longitudinal ends of the clip 311 are open. Substrates 91 can enter and exit the clip 311 through one opening. The other opening is used to cooperate with a substrate longitudinal pushing mechanism 314 to push the substrate out of the opening of the clip 311. Substrate receiving slots 3110 are provided on the inner walls of both lateral sides of the clip 311. Multiple substrate receiving slots 3110 are arranged longitudinally at intervals, allowing multiple substrates 91 to be arranged vertically in the clip 311.

[0058] Combine Figure 4 、 Figure 6As shown, the clip transverse conveying mechanism 312 is used to drive the clips 311 to move transversely, thereby moving multiple clips 311 one by one to the clip vertical conveying mechanism 313. In this embodiment, the clip transverse conveying mechanism 312 includes a clip loading platform 3121, a clip pushing block 3122, and a clip transverse driving member 3123. The clip loading platform 3121 is a bar-shaped structure extending transversely, and multiple clips 311 can be arranged transversely on the clip loading platform 3121. The clip loading platform 3121 is provided with bar holes 31210 extending transversely. The clip pushing block 3122 is slidably disposed transversely on the clip loading platform 3121 and is located above the clip loading platform 3121, abutting against the side of the clips 311 facing away from the clip vertical conveying mechanism 313. The magazine push block 3122 is provided with a bar hole 31210 and is connected to a magazine transverse drive 3123. The magazine transverse drive 3123 is disposed below the magazine loading platform 3121 and is used to drive the magazine push block 3122 in transverse movement. The magazine transverse drive 3123 can be a mechanism capable of linear movement, such as a motor and a ball screw, or a pneumatic cylinder.

[0059] After multiple magazines 311 loaded with substrates are arranged horizontally on the magazine loading platform 3121, the magazines 311 are located between the magazine push block 3122 and the magazine vertical conveying mechanism 313; the magazine horizontal driving member 3123 is activated, and the magazine horizontal driving member 3123 drives the magazine push block 3122 to move horizontally toward the magazine vertical conveying mechanism 313, so that a magazine 311 is moved onto the magazine vertical conveying mechanism 313.

[0060] The vertical clip conveying mechanism 313 is located closer to the discharge side 103 than the horizontal clip conveying mechanism 312 and is used to drive the clip 311 to move vertically. A substrate longitudinal pushing mechanism 314 is disposed adjacent to the vertical clip conveying mechanism 313. The substrate longitudinal pushing mechanism 314 includes a longitudinal cylinder 3141 and a pushing member 3142. The longitudinal cylinder 3141 is connected to the pushing member 3142 and is used to drive the pushing member 3142 to move in the longitudinal direction Y, thereby pushing the substrate from the clip 311 to the substrate conveying module 32. When the clip 311, driven by the vertical clip conveying mechanism 313, moves to a position where the substrate is located between the pushing member 3142 and the substrate conveying mechanism, the longitudinal cylinder 3141 drives the pushing member 3142 toward the substrate conveying module 32, thereby pushing the substrate onto the conveyor belt of the substrate conveying module 32, allowing the substrate to be conveyed longitudinally by the substrate conveying module 32.

[0061] Driven by the clip vertical conveying mechanism 313 , the clip 311 gradually rises so that the multiple substrates in the clip 311 are positioned one by one between the pushing member 3142 and the substrate conveying mechanism, thereby conveying the substrates in the clip 311 to the substrate conveying module 32 one by one.

[0062] In this embodiment, the two cartridge horizontal conveying mechanisms 312 are arranged vertically, so that the cartridges 311 can be arranged in two layers, to increase the capacity of the cartridges 311 and improve efficiency. In the vertical direction, the upper surface of the conveying belt of the substrate conveying module 32 can be located at the middle position of the two cartridge horizontal conveying mechanisms 312. The cartridges 311 conveyed by the lower cartridge horizontal conveying mechanism 312 can gradually rise, so that the substrates in the cartridges 311 are sequentially pushed onto the substrate conveying module 32 from top to bottom. The cartridges 311 conveyed by the upper cartridge horizontal conveying mechanism 312 can gradually lower under the driving of the cartridge vertical conveying mechanism 313, so that the substrates in the cartridges 311 are sequentially conveyed onto the substrate conveying module 32 from bottom to top, thereby facilitating the conveying of the substrates in the two layers of cartridges 311 and improving the conveying efficiency.

[0063] The cartridge collecting platform 315 is a long strip arranged horizontally and located directly above the cartridge horizontal conveying mechanisms 312. The cartridge collecting pushing mechanism 316 is used to horizontally push the cartridges 311 to move onto the cartridge collecting platform 315. In this embodiment, the cartridge collecting pushing mechanism 316 is located above the cartridge collecting platform 315 to make full use of the space and not interfere with the cartridge vertical conveying mechanism. Of course, in other embodiments, the cartridge collecting pushing mechanism 316 can be closer to the material collecting side relative to the cartridge collecting platform 315. When the cartridges 311 move to the height position corresponding to the cartridge collecting platform 315 under the driving of the cartridge vertical conveying mechanism 313, the cartridge collecting pushing mechanism 316 horizontally pushes the cartridges 311 to move and push the cartridges 311 onto the cartridge collecting platform 315.

[0064] In this embodiment, the cartridge collecting platform 315 is located above the two cartridge horizontal conveying mechanisms 312 and can also adopt a two-layer mechanism to accommodate more empty cartridges 311. As a preferred, the cartridge collecting platform 315 is only one layer, and an alarm is given when the one-layer cartridge collecting platform 315 is about to be full of empty cartridges 311, to remind the user to place the cartridges 311 on the cartridge horizontal conveying mechanisms 312 in time, to avoid insufficient substrate raw materials and ensure the normal operation of the equipment.

[0065] When the cartridges 311 gradually rise under the driving of the cartridge vertical conveying mechanism 313 and the multiple substrates in the cartridges 311 are sequentially pushed out by the substrate longitudinal pushing mechanism 314, the cartridges 311 continue to rise to the cartridge collecting platform under the driving of the cartridge vertical conveying mechanism 313, and the cartridge collecting pushing mechanism 316 pushes the cartridges 311 to move onto the cartridge collecting platform 315, so that the empty cartridges 311 are accommodated on the cartridge collecting platform 315.

[0066] The next magazine 311 can be moved to the magazine vertical conveying mechanism 313 under the driving of the magazine transverse conveying mechanism 312, and the conveying of the substrate in the next magazine 311 can be performed.

[0067] The substrate loading module 31 provided by the application can load multiple substrates at a time and convey the substrates one by one, thereby improving the substrate loading and conveying efficiency.

[0068] As shown in Figure 7 , the output end of the substrate conveying module 32 is arranged along the transverse direction of the raw material platform 1, and the substrate unloading module 33 is arranged above the substrate conveying module 32 and the raw material platform 1. The substrate unloading module 33 comprises a substrate grabbing mechanism 332 and a substrate transverse moving mechanism 331. The substrate grabbing mechanism 332 is used to grab the substrate 91, which can grab the substrate from the substrate conveying module 32 by adsorption or clamping. The substrate transverse moving mechanism 331 is used to drive the substrate grabbing mechanism 332 to move along the transverse direction, so as to move the substrate grabbing mechanism 332 and the substrate from the substrate conveying module 32 to the raw material platform 1. The substrate grabbing mechanism 332 releases the substrate, and the substrate can be placed on the raw material platform 1. In this embodiment, the substrate grabbing mechanism 332 comprises two mechanisms arranged along the longitudinal direction, which can grab two substrates at the same time. The substrates are arranged in a 2*4 matrix on the raw material platform 1. Two substrates adjacent in the transverse direction are symmetrically arranged and form a group, and the resin can be placed between the two substrates in the same group. The specific number of substrates and the array layout can be arranged according to the space in the integrated rack 100, and the amount of resin is determined according to the amount required for plastic packaging of the substrate.

[0069] As shown in Figure 8 , Figure 9 The resin feeding assembly 4 is used to convey the resin and comprises a resin loading module 41, a resin conveying module 42 and a resin unloading module 43 arranged in sequence along the longitudinal direction. The resin loading module 41 is located at the loading side 101 and below the substrate loading module 31, and is used to load the resin. The user can place the resin in the resin loading module 41. The resin loading module 41 is located below the substrate loading module 31, which can facilitate the user to load the resin, and the loading of the resin and the substrate does not affect each other.

[0070] The resin conveying module 42 is located at the transfer side 102 and below the semi-finished product inlet 1022, and is used to convey the resin to the resin unloading module 43. The resin conveying module 42 and the substrate conveying module 32 are respectively arranged at the opposite sides of the integrated rack in the transverse direction, so as to avoid mutual interference during transportation. Both of them can adopt a conveying belt mechanism for conveying.

[0071] The resin unloading module 43 is provided at the raw material platform 1 for placing the resin on the raw material platform 1. After the resin and substrate are placed on the raw material platform 1 according to the preset layout, a raw material array is formed, and the transfer equipment 300 can take the raw material array away here.

[0072] In this embodiment, the raw material platform 1 includes a substrate platform 11, a resin platform 12 and a resin lifting mechanism 13. The substrate platform 11 is used to place multiple substrates, which is fixed to an integrated frame. A limiting groove for positioning the substrate can be provided on the substrate platform 11 so that the substrate can be placed in a specified position. A plurality of avoidance holes 110 are provided on the substrate platform 11, and there are multiple resin platforms 12, which are arranged one-to-one corresponding to the multiple avoidance holes 110. The resin platform 12 is used to place multiple resins, which are arranged at the avoidance holes 110 along the vertical sliding direction. The resin lifting mechanism 13 is connected to the multiple resin platforms 12 and is used to drive the resin platform 12 to move vertically. The multiple resins placed on a resin platform 12 are located between two substrates in the same group and are used to perform plastic sealing for the two substrates in the same group. In this embodiment, there are four resin platforms 12 so as to provide four groups of resins for four groups of substrates.

[0073] The resin lifting mechanism 13 is disposed on one side of the raw material platform 1 in the horizontal direction and is located below the substrate conveying module 32 , so as to rationally utilize the space in the integrated frame and avoid affecting the resin unloading module 43 .

[0074] The resin unloading module 43 is positioned below the substrate platform 11. When the resin platform 12 moves vertically downward to the position below the substrate platform 11, the resin unloading module 43 deposits resin onto the resin platform 12. As the resin platform 12 moves the resin upward into the avoidance holes 110, the resins and substrates form a material array, which the transfer device 300 can then remove.

[0075] The unloading of the substrate and the resin is carried out on the upper and lower sides of the raw material platform 1 respectively, without affecting each other, and can be carried out simultaneously, thereby improving the placement efficiency and making full use of the space of the rack.

[0076] The resin unloading module 43 includes a receiving platform 431, a longitudinal movement mechanism (not shown), and a resin transfer mechanism 432. The longitudinal movement mechanism drives the receiving platform 431 to move longitudinally to receive resin delivered by the resin delivery module 42. After multiple resins are longitudinally arranged on the receiving platform 431, the resin transfer mechanism 432 transfers the resins to the resin platform 12.

[0077] The receiving platform 431 has the same structure as the resin platform 12, both being equipped with multiple resin positioning grooves 4310 spaced longitudinally. The receiving platform 431 is located below the output end of the resin delivery module 42. Driven by the resin delivery module 42, the resin moves longitudinally from the output end of the resin delivery module 42 and falls into the resin positioning grooves 4310 on the receiving platform 431. These multiple resin positioning grooves 4310 can be used to arrange the resin at predetermined intervals. The receiving platform 431 has the same structure as the resin platform 12, allowing for convenient transfer of multiple resins from the receiving platform 431 to the resin platform 12.

[0078] The longitudinal moving mechanism for receiving materials is connected to the material receiving platform 431, and is used to drive the material receiving platform 431 to move longitudinally so that the multiple resin positioning grooves 4310 are located one by one directly below the conveying end of the resin conveying module 42, thereby allowing multiple resins to fall into the multiple resin positioning grooves 4310 of the material receiving platform 431 in turn.

[0079] The resin transfer mechanism 432 is located above the material receiving platform 431, and includes a resin clamping mechanism 4321 and a resin moving mechanism 4322. The resin clamping mechanism 4321 is used to clamp multiple resins, and the resin moving mechanism 4322 is connected to the resin clamping mechanism 4321, and is used to drive the resin clamping mechanism 4321 to move between the material receiving platform 431 and the resin platform 12 to transfer the resin in the material receiving platform 431 to the resin platform 12.

[0080] The resin moving mechanism 4322 includes a vertical moving component 4323, a longitudinal moving component 4324 and a transverse moving component 4325. The vertical moving component 4323 is connected to the resin clamping mechanism 4321 to drive the resin clamping mechanism 4321 to move vertically up and down; the longitudinal moving component 4324 is arranged longitudinally and is connected to the vertical moving component 4323 to drive the vertical moving component 4323 and the resin clamping mechanism 4321 to move longitudinally to achieve the lifting and lowering of multiple resins; the transverse moving component 4325 is arranged transversely and is located below the substrate platform 11 and on the side away from the resin delivery module 42 in the longitudinal direction. The transverse moving component 4325 is connected to one end of the longitudinal moving component 4324 in the longitudinal direction to drive the longitudinal moving component 4324, the vertical moving component 4323 and the resin clamping mechanism 4321 to move transversely. By using the cooperation of the horizontal moving component 4325 and the vertical moving component 4324, multiple resins can be moved to any resin platform 12, and the position layout is reasonable, which does not affect the lifting and lowering movement of the resin platform 12, fully utilizes the space in the rack, and reduces the size of the equipment.

[0081] The resin positioning grooves 4310 of the receiving platform 431 allow the resin to be arranged into groups at predetermined intervals. Each group of resin is then moved to the resin positioning grooves 4310 of the resin platform 12 via the resin transfer mechanism 432. Once the resin platforms 12 are filled with resin, the resin lifting mechanism 13 moves the resin platforms 12 upward to the avoidance holes 110, completing the placement of the resin.

[0082] In this embodiment, the resin conveying module 42 is a conveyor belt mechanism for conveying resin in the longitudinal direction. The resin is cylindrical, and its axial direction when on the resin conveying module 42 is longitudinal to ensure the stability of the cylindrical resin during the conveying process.

[0083] A guide groove 421 is provided at the output end of the resin delivery module 42. This guide groove 421 is arc-shaped, with one end of the guide groove 421 oriented longitudinally toward the output end of the resin delivery module 42, and the other end of the guide groove 421 facing downward, thereby changing the axial direction of the resin from longitudinal to vertical. A material receiving platform 431 is located below the guide groove 421. Driven by a longitudinal material receiving mechanism, multiple resin positioning grooves 4310 can be sequentially aligned with the other end of the guide groove 421 to receive the resin removed from the guide groove 421. The resin is then placed vertically in the resin positioning grooves 4310. Placing the resin vertically facilitates its melting in the molding device 200.

[0084] The receiving platform 431 is a strip-shaped structure extending longitudinally to minimize space. Clamps are provided on both sides of the resin positioning groove 4310, connecting the sidewalls of the resin positioning groove 4310 and the receiving platform 431. The top of the clamp is open, and the bottom protrudes downward from the bottom surface of the resin positioning groove 4310. This allows the resin clamping mechanism 4321 to extend through the clamp into the resin positioning groove 4310 to clamp the resin therein.

[0085] like Figure 1 As shown, the transfer device 300 is used to feed the raw material array into the molding device 200 through the molding feed port 201 , and to move the semi-finished product from the molding device 200 to the integrated frame 100 .

[0086] like Figure 10 As shown, the transfer equipment 300 includes a transfer platform 301, a clamping platform 302 and a manipulator 303. The transfer platform 301 is used to place semi-finished products, the clamping platform 302 is used to clamp the raw material array and the semi-finished products, and the manipulator 303 is arranged on one side of the transfer platform 301. The output end of the manipulator 303 is connected to the clamping platform 302, which is used to drive the clamping platform 302 to move so that the clamping platform 302 can enter and exit the raw material outlet, semi-finished product inlet and plastic packaging feed port.

[0087] After the substrate and resin form a raw material array and are placed on the raw material platform 1, the clamping platform 302, driven by the manipulator 303, clamps the raw material array from the raw material outlet 1021 and feeds the raw material array into the molding device 200 through the molding feed port 201. After the molding device 200 generates high-temperature molten resin for molding, the clamping platform 302 enters the molding device 200 again to take out multiple semi-finished products and place them on the transfer platform 301; the clamping platform 302 then places the semi-finished products one by one into the semi-finished product processing component 2 for processing to form finished products, and collects them. The user can take the finished products away at the discharge port.

[0088] The plastic packaging equipment 200 is set separately to prevent high temperature from affecting the mechanisms on the integrated frame 100. Through the cooperation of the clamping platform 302 and the robot 303, the movement of the raw material array and semi-finished products can be facilitated, and multiple semi-finished products can be plastic-packaged at one time, and the semi-finished products can be carefully processed, effectively improving processing efficiency.

[0089] The clamping platform 302 comprises a first platform 3021 and a second platform 3022. The first platform 3021 is used to clamp the raw material array, while the second platform 3022 is used to clamp the semi-finished product. The first platform 3021 can be used to transfer the raw material array as a whole, while the second platform 3022 can be used to move the semi-finished products one by one. The first and second platforms 3021 and 3022 are positioned horizontally opposite each other, and their connection is rotatably connected to the output end of the manipulator 303. The first and second platforms 3021 and 3022 are selected based on the desired item being transferred.

[0090] The semi-finished product processing assembly 2 is located at the semi-finished product inlet 1022 and is used to process the semi-finished product to form a finished sheet. The semi-finished product processing assembly 2 can separate the sheet from the residual glue and remove the burrs on the nozzle of the sheet to form a finished sheet.

[0091] The semi-finished product processing assembly 2 includes a base 21, a glue-applying mechanism 22, and a glue-scraping mechanism 23. The base 21 is provided with a hollow area 210. The hollow area 210 is provided on both sides in the horizontal direction X for supporting the semi-finished product sheet, so that the residual glue of the semi-finished product is suspended in the hollow area 210. The glue-applying mechanism 22 is slidably mounted on the base 21 along the vertical direction Z and is located above the glue-scraping mechanism 23. It is used to knock off the residual glue, thereby separating the sheet from the residual glue. The glue-scraping mechanism 23 is mounted on the base 21 and includes a scraper 231 and a glue-scraping drive (not shown). The scraper 231 is slidably mounted in the hollow area 210 along the longitudinal direction Y. The glue-scraping drive is located below the base 21 and is connected to the scraper 231 to drive the scraper 231 to move in the longitudinal direction Y to remove burrs from the sheet's sprue, that is, to smooth the connection between the sheet and the residual glue.

[0092] After the clamping platform 302 clamps a semi-finished product, the robot 303 drives the clamping platform 302 and the semi-finished product to the semi-finished product processing assembly 2 and places the semi-finished product on the base. The gluing mechanism 22 moves downward to remove excess glue, and then the scraping mechanism 23 is activated. The scraper 231 of the scraping mechanism 23 moves to remove burrs from the sprue of the sheet, making the surface of the sheet smooth, thus forming two finished sheets. A positioning fixture can be provided on the base 21 to secure the semi-finished product for gluing and scraping. The downward pressure of the gluing mechanism 22 can also be used to position the semi-finished product on the base.

[0093] The integrated frame 100 is further provided with a residual glue collection module (not shown in the figure), which is located below the scraping mechanism 23, and the scraped residual glue falls into the residual glue collection module. The residual glue collection module can be placed on a cart to facilitate the removal of the collected residual glue.

[0094] like Figure 11 As shown, the integrated frame 100 further includes a receiving assembly 5 for collecting finished sheet materials. The receiving assembly 5 and the semi-finished product processing assembly 2 are arranged along the horizontal direction X, and the receiving assembly 5 is arranged corresponding to the discharge port 1031 in the horizontal direction.

[0095] The receiving assembly 5 includes a receiving drive 51 and a receiving fixture 52. The receiving drive 51 is connected to the receiving fixture 52 to drive the receiving fixture 52 to move between a first position and a second position along the horizontal direction X. When the receiving fixture 52 moves to the first position, the receiving fixture 52 is vertically located between the gluing mechanism 22 and the scraping mechanism 23 to clamp the finished sheet on the base 21; when the receiving fixture 52 moves to the second position, the receiving fixture 52 is located at the discharge port to place the finished sheet down for collection. A storage basket can be provided at the discharge port, and the finished sheet can be placed directly into the storage basket. Alternatively, other mechanisms can be provided at the discharge port to rotate the finished sheet to a certain angle before collection. This can be configured according to the stacking requirements of the finished sheet.

[0096] The finished sheet can be taken out from the semi-finished product processing component 2 through the material receiving component 5, which facilitates the collection of the finished sheet and the placement of the next semi-finished sheet.

[0097] A dust collection mechanism 53 is provided on the side of the receiving fixture 52 facing the semi-finished product processing assembly 2. The dust collection mechanism 53 has two dust collection ports 530, one facing the gluing mechanism 22 and the other facing the scraping mechanism 23. When the receiving fixture 52 moves to the first position, the dust collection mechanism 53 can be used to vacuum the semi-finished product processing assembly 2 and the finished web, removing any residual dust formed during the gluing and scraping processes to ensure the cleanliness of the finished web. When the receiving fixture 52 moves from the first position to the second position after removing the finished web, the dust collection mechanism 53 can be used to clean the scraping mechanism 23, which is now empty of the finished web, again to ensure a clean scraping mechanism 23 and facilitate the placement of the next semi-finished product.

[0098] like Figure 1 As shown, the chip laminator further includes a guard plate 401 and a door plate 402. The guard plate 401 is arranged opposite to the integrated frame 100 in the horizontal direction, and its two longitudinal sides are respectively connected to the laminating device 200 and the door plate 402; the door plate 402 is arranged opposite to the laminating device 200 in the vertical direction, and its two lateral sides are respectively connected to the integrated frame 100 and the guard plate 401. The transfer device 300 is arranged in a space enclosed by the integrated frame 100, the laminating device 200, the guard plate 401 and the door plate 402 to ensure that the transfer device 300 is not interfered with by the outside world during operation. When manual intervention is required, the emergency switch of the chip laminator is pressed. After the chip laminator stops working, the door plate 402 is opened to maintain the equipment to ensure the safety and reliability of the equipment operation.

[0099] The present invention also provides a chip plastic packaging method, which includes the following steps.

[0100] Step S100, as Figure 12 As shown, a substrate 91 and a resin 92 are provided, and multiple substrates 91 and multiple resins 92 are arranged into a raw material array 9; in the raw material array 9, multiple substrates 91 are arranged in a matrix shape and are divided into multiple groups, each group containing two adjacent and symmetrically placed substrates 91; a resin 92 is arranged between the two substrates 91 in the same group.

[0101] In this step, the substrate 91 and the resin 92 can be placed from the upper and lower sides respectively to avoid mutual influence between the two and improve the placement efficiency.

[0102] Step S200, the raw material array is moved as a whole to the molding device 200, the molding device 200 melts the resin 92 and molding the substrate 91 to form a plurality of semi-finished products 93, such as Figure 13 As shown, each semi-finished product 93 includes two sheets 932 and residual glue 931 connected between the two sheets. The sheet is the base material after the chip is plastic-sealed.

[0103] In step S300 , the plurality of semi-finished products are removed from the molding device 200 as a whole.

[0104] Step S400, remove the excess glue of the plurality of semi-finished products one by one to form the tablet finished product 94, as shown in the structure diagram of two tablet finished products 94 made of one semi-finished product. Figure 14

[0105] Through the chip plastic sealing method provided by the application, the base material 91 and the resin 92 in the raw material are arranged into a raw material array, and the whole raw material array is subjected to plastic sealing treatment by the plastic sealing device 200, so that a plurality of base materials 91 can be plastic sealed at one time to form a plurality of semi-finished products, thereby improving the plastic sealing efficiency. The base materials 91 are divided into a plurality of groups, and each group contains two base materials 91 arranged symmetrically, so that the two base materials 91 can be plastic sealed at the same time by using one group of resin 92, thereby improving the utilization rate of the resin 92 and reducing the cost. The excess glue of the semi-finished products is removed one by one, so that the quality of the tablet finished product can be ensured.

[0106] The chip plastic sealing method provided by the application can use the chip plastic sealing machine described above.

[0107] In step S100, the base material is placed on the raw material platform 1 by the base material feeding assembly 3, and the resin is placed on the raw material platform 1 by the resin feeding assembly 4, so as to form a raw material array on the raw material platform 1.

[0108] The base material unloading module 33 is arranged above the raw material platform 1, and the base material can be placed on the base material platform 11 of the raw material platform 1 from above. The resin unloading module 43 is arranged below the raw material platform 1, and the resin can be placed on the resin platform 12 from below, and then the resin platform 12 is lifted to the same height as the base material platform 11, so as to form a raw material array. The placement of the base material and the resin does not affect each other, and the placement efficiency is effectively improved.

[0109] ​More specifically, multiple substrates are loaded into the clip 311, which is then placed on the clip transverse conveying mechanism 312; and resin is placed in the resin loading module 41. After the laminating machine is started, the clip transverse conveying mechanism 312 pushes the clip 311 onto the clip vertical conveying mechanism 313. The clip vertical conveying mechanism 313 drives the clip 311 to move up and down, so that the multiple substrates in the clip 311 are aligned with the pusher 3142 in sequence. The longitudinal cylinder 3141 drives the pusher 3142 to move longitudinally, pushing the multiple substrates one by one onto the substrate conveying module 32. The substrate conveying module 32 drives the substrates to move longitudinally to the raw material platform 1. The substrate unloading module 33 picks up the substrates from the substrate conveying module 32 and moves them to the substrate platform 11 of the raw material platform 1. The substrates are arranged on the substrate platform 11 in a 2*4 matrix and divided into four groups, with the two substrates in each group arranged symmetrically in the transverse direction. At the same time, the resin is transferred to the resin unloading module 43 along the resin loading module 41 and the resin conveying module 42. The resin unloading module 43 arranges multiple resins on the material receiving platform 431 along the longitudinal intervals. The resin transfer mechanism 432 clamps a group of resins on the material receiving platform 431 and places it on a resin platform 12 until all four resin platforms 12 are placed with resin. The resin lifting mechanism 13 drives the multiple resin platforms 12 to rise to a height consistent with the substrate platform 11, so that the four groups of substrates and four groups of resins form a raw material array.

[0110] In step S200, the transfer device 300 feeds the raw material array into the molding device 200 through the molding feed port 201. More specifically, the robot 303 drives the first platform 3021 of the clamping platform 302 to move above the raw material platform 1, clamps the raw material array, transfers the entire raw material array, and releases it into the molding device 200. The clamping platform 302 then moves out of the molding device 200. The molding device 200 melts the substrate and then molds the substrate to form multiple semi-finished products.

[0111] In step S300 , the transfer device 300 is used to move the semi-finished products from the molding device 200 to the integrated frame 100 . More specifically, the robot 303 drives the first platform 3021 of the clamping platform 302 to move into the molding device 200 , takes out all the semi-finished products, and places them on the transfer platform 301 .

[0112] In step S400 , the transfer equipment 300 is used to deliver the semi-finished products one by one to the semi-finished product processing assembly 2 of the integrated frame 100 , and the residual glue of the semi-finished sheets is removed to form sheet materials.

[0113] More specifically, the robot 303 drives the second platform 3022 of the clamping platform 302 to pick up the semi-finished product from the transfer platform 301 and place it on the semi-finished product processing assembly 2. The semi-finished product can be placed on the base 21, which supports the semi-finished sheet. The residual glue of the semi-finished product hangs in the hollow area 210 of the base 21. The glue-applying mechanism 22 moves downward to remove the residual glue from the semi-finished product. The glue-scraping mechanism 23 then removes the burrs on the sheet's sprue. The glue-applying mechanism 22 moves upward to its initial position, leaving the finished sheet on the base 21.

[0114] The receiving fixture 52 and the dust suction mechanism 53 of the receiving assembly 5 are driven by the receiving drive 51 to move between the gluing mechanism 22 and the scraping mechanism 23. The dust suction mechanism 53 sucks away the residual dust from the gluing mechanism 22, the scraping mechanism 23 and the base 21. The receiving fixture 52 picks up the finished material sheet and moves it away, and then collects the finished material sheet.

[0115] The above process can complete the plastic sealing operation, plastic sealing the chip on the substrate, and plastic sealing operations can be performed on multiple substrates at the same time, effectively improving the plastic sealing efficiency.

[0116] In summary, although the present invention has been disclosed above with reference to preferred embodiments, the above preferred embodiments are not intended to limit the present invention. A person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined in the claims.

Claims

1. A chip laminator, characterized in that: Including plastic packaging equipment, transfer equipment and integrated rack; The integrated frame is used to load substrates and resins, arrange multiple substrates and multiple resins to form a raw material array, and process semi-finished products into finished products; The plastic packaging equipment has a plastic packaging feed port, and the plastic packaging feed port and the transfer equipment are arranged opposite to each other in the longitudinal direction; the integrated frame and the transfer equipment are arranged opposite to each other in the transverse direction; The transfer equipment is used to feed the raw material array into the molding equipment through the molding feed port, and to move the semi-finished products from the molding equipment to the integrated rack; the transfer equipment includes a transfer platform, a clamping platform and a manipulator, the transfer platform is used to place the semi-finished products, the clamping platform is used to clamp the raw material array and the semi-finished products, the manipulator is arranged on one side of the transfer platform, and the output end of the manipulator is connected to the clamping platform, for driving the clamping platform to move so that the clamping platform enters and exits the raw material outlet and the semi-finished product inlet of the integrated rack, as well as the molding feed port; the clamping platform, driven by the manipulator, clamps the raw material array from the raw material outlet and feeds the raw material array into the molding equipment through the molding feed port, after the molding equipment generates high-temperature molten resin for molding, the clamping platform enters the molding equipment again to take out multiple semi-finished products and place them on the transfer platform; the clamping platform then places the semi-finished products one by one into the integrated rack for processing to form finished products; The clamping platform includes a first platform and a second platform, the first platform is used to clamp the raw material array, and the second platform is used to clamp the semi-finished product; the first platform is used to realize the overall transfer of the raw material array, and the second platform is used to realize the movement of the semi-finished products one by one; the first platform and the second platform are arranged horizontally relative to each other and the connection between the two is rotatably connected to the output end of the manipulator, and the first platform and the second platform are selected according to the needs of transferring items.

2. The chip laminator according to claim 1, characterized in that: The integrated frame is in the shape of a cube, and its four sides are respectively a loading side, a transfer side, a discharging side and a plastic sealing side, the loading side and the plastic sealing side are arranged opposite to each other in the longitudinal direction, and the discharging side and the transfer side are arranged opposite to each other in the transverse direction; the discharging side is provided with a discharge port, and the transfer side is provided with a raw material outlet and a semi-finished product inlet, the raw material outlet and the semi-finished product inlet are arranged in the longitudinal direction, and the raw material outlet is closer to the plastic sealing side than the semi-finished product inlet; The integrated frame is provided with a raw material platform, a semi-finished product processing assembly, a substrate feeding assembly, and a resin feeding assembly; the raw material platform is arranged in a horizontal direction corresponding to the raw material outlet, and is used to place a raw material array consisting of multiple substrates and multiple resins; the semi-finished product processing assembly is arranged in a horizontal direction corresponding to the semi-finished product inlet, and is used to process the semi-finished products to form finished webs; The substrate feeding assembly is used to convey the substrate, and includes a substrate loading module, a substrate conveying module, and a substrate unloading module arranged in sequence along the longitudinal direction; the substrate loading module is located at the loading side and is used to load the substrate; the substrate conveying module is located at the discharge side and is used to convey the substrate to the substrate unloading module; the substrate unloading module is located at the raw material platform and is used to place the substrate on the raw material platform; The resin feeding assembly is used to convey resin, and includes a resin loading module, a resin conveying module and a resin unloading module arranged in sequence along the longitudinal direction; the resin loading module is located at the loading side and below the substrate loading module, and is used to load resin; the resin conveying module is located at the transfer side and below the semi-finished product entrance, and is used to convey resin to the resin unloading module; the resin unloading module is arranged at the raw material platform, and is used to place resin on the raw material platform.

3. The chip laminator according to claim 2, characterized in that: The raw material platform includes a substrate platform, a resin platform and a resin lifting mechanism. The substrate platform is used to place multiple substrates and is fixed to the integrated frame. A plurality of avoidance holes are provided on the substrate platform. There are multiple resin platforms, which are arranged one-to-one corresponding to the multiple avoidance holes. The resin platform is used to place multiple resins and is vertically slidable at the avoidance holes. The resin lifting mechanism is connected to the multiple resin platforms and is used to drive the resin platforms to move vertically. The resin unloading module is arranged below the substrate platform; when the resin platform moves vertically downward to the bottom of the substrate platform, the resin unloading module places the resin on the resin platform; when the resin platform drives multiple resins to move upward into the avoidance holes, multiple resins and multiple substrates form a raw material array; The substrate unloading module is arranged above the raw material platform.

4. The chip laminator according to claim 3, characterized in that: The resin unloading module includes a material receiving platform, a material receiving longitudinal movement mechanism and a resin transfer mechanism; The material receiving platform has the same structure as the resin platform, and is provided with a plurality of resin positioning grooves spaced apart in the longitudinal direction; the material receiving platform is located below the output end of the resin delivery module; The material receiving longitudinal movement mechanism is connected to the material receiving platform, and is used to drive the material receiving platform to move longitudinally, so that multiple resins fall into multiple resin positioning grooves on the material receiving platform in sequence; The resin transfer mechanism is located above the material receiving platform, and includes a resin clamping mechanism and a resin moving mechanism. The resin clamping mechanism is used to clamp multiple resins. The resin moving mechanism is connected to the resin clamping mechanism and is used to drive the resin clamping mechanism to move between the material receiving platform and the resin platform to transfer the resin in the material receiving platform to the resin platform.

5. The chip laminator according to claim 2, characterized in that: The substrate loading module includes a clip, a clip transverse conveying mechanism, a clip vertical conveying mechanism, and a substrate longitudinal pushing mechanism. Both longitudinal ends of the clip are open. Both lateral inner walls of the clip are provided with substrate receiving slots. The substrate receiving slots are arranged in a plurality of longitudinally spaced intervals so that multiple substrates can be arranged in the clip in a vertically spaced interval. The magazine transverse conveying mechanism is used to drive the magazine to move transversely, so as to move multiple magazines one by one to the magazine vertical conveying mechanism; the magazine vertical conveying mechanism is close to the discharge side relative to the magazine transverse conveying mechanism, and is used to drive the magazine to move vertically; the substrate longitudinal pushing mechanism is arranged adjacent to the magazine vertical conveying mechanism; the substrate longitudinal pushing mechanism includes a longitudinal cylinder and a pushing member, and the longitudinal cylinder is connected to the pushing member, and is used to drive the pushing member to move longitudinally, so as to push the substrate from the magazine to the substrate conveying module.

6. The chip laminator according to claim 5, characterized in that: The substrate loading module also includes a magazine collecting platform and a magazine collecting pushing mechanism. The magazine collecting platform is a long strip arranged in the transverse direction and is located directly above the magazine transverse conveying mechanism. The magazine collecting pushing mechanism is used to push the magazine in the transverse direction to move it to the magazine collecting platform.

7. The chip laminator according to claim 2, characterized in that: The semi-finished product processing component includes a base, a glue-applying mechanism and a glue-scraping mechanism; a hollow area is provided on the base, and both sides of the hollow area are used to support the semi-finished product sheet, so that the residual glue of the semi-finished product is suspended in the hollow area; the glue-applying mechanism is arranged on the base along the vertical sliding direction and is located above the glue-scraping mechanism, and is used to knock off the residual glue, thereby separating the sheet from the residual glue; the glue-scraping mechanism is arranged on the base, which includes a scraper and a glue-scraping driving member, the scraper is arranged in the hollow area along the longitudinal sliding direction, and the glue-scraping driving member is arranged under the base and connected to the scraper to drive the scraper to move longitudinally and thereby remove the burrs on the water outlet of the sheet.

8. The chip laminator according to claim 7, characterized in that: The integrated frame further includes a material receiving assembly, which is used to collect finished sheet materials. The material receiving assembly and the semi-finished product processing assembly are arranged in a transverse direction, and the material receiving assembly is arranged in a transverse direction corresponding to the discharge port. The receiving assembly includes a receiving drive and a receiving clamp, wherein the receiving drive is connected to the receiving clamp to drive the receiving clamp to move laterally between a first position and a second position; when the receiving clamp moves to the first position, the receiving clamp is vertically located between the glue applying mechanism and the glue scraping mechanism to clamp the finished sheet on the base; When the receiving fixture moves to the second position, the receiving fixture is located at the discharge port to put down the finished sheet for collection; A dust suction mechanism is provided on the side of the material receiving fixture facing the semi-finished product processing component; the dust suction mechanism is provided with two dust suction ports, which are respectively directed towards the gluing mechanism and the scraping mechanism.

9. A chip plastic packaging method, characterized in that: Using the chip laminator according to any one of claims 1 to 8 comprises the following steps: Providing substrates and resins, and arranging a plurality of the substrates and the resins into a raw material array; in the raw material array, the plurality of substrates are arranged in a matrix and divided into a plurality of groups, each group containing two adjacent and symmetrically arranged substrates; the resin is arranged between two substrates in the same group; The raw material array is moved as a whole to a molding device, and the molding device melts the resin and molds the substrate to form a plurality of semi-finished products, each of which includes two sheets and residual glue connecting the two sheets; removing the plurality of semi-finished products from the plastic packaging device as a whole; The residual glue is removed from the plurality of semi-finished products one by one to form finished sheet products.

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