Device for aligning wafers and wafer alignment method

Abstract

The present application relates to the field of wafer alignment, and discloses a device for alignment between wafers and a wafer alignment method, including: a wafer alignment base; a chuck groove and at least two wafer bearing grooves of different sizes are arranged on the surface of the wafer alignment base, the chuck groove and the wafer bearing grooves of different sizes are distributed in a concentric structure, and the chuck groove is located at the outermost side of the wafer alignment base; the wafer bearing groove is used to place the wafer, and the chuck groove is used to place the chuck; the wafer alignment base is provided with a notch, the notch extends from the edge of the wafer alignment base to the center of the wafer alignment base, and there is an overlapping area between the notch and the innermost wafer bearing groove. The device in the present application is very convenient when aligning wafers, and the operation is simple, and the alignment time is greatly reduced; the device in the present application has a simple structure and low manufacturing cost, thereby reducing the cost of wafer alignment; and the wafer does not need to be transferred during the alignment process of the device in the present application, which can improve the alignment accuracy.

Description

Technical Field

[0001] The present application relates to the field of wafer alignment, and in particular to a device and a wafer alignment method for aligning wafers. Background Art

[0002] During the semiconductor production process, wafers of different sizes need to be aligned, and concentricity alignment is a common method. Currently, concentricity alignment is mainly performed using an alignment machine. The alignment machine process is broken down as follows: place wafer on - arm transfers wafer - upper plate adsorption - arm returns to position - place wafer down - arm transfers wafer - lower plate adsorption - alignment.

[0003] When using an alignment machine for alignment, there are the following problems: first, the alignment process is complex and cumbersome. It takes about 8 minutes to align a wafer, which is time-consuming. Second, the alignment machine is expensive, about 2 million, resulting in high alignment costs. Third, there may be slight displacement during the wafer transfer process, affecting the alignment accuracy.

[0004] Therefore, how to solve the above technical problems should be the focus of technical personnel in this field. Summary of the invention

[0005] The purpose of the present application is to provide a device for aligning wafers and a wafer alignment method to shorten the wafer alignment time, reduce the alignment cost, and ensure the alignment accuracy.

[0006] In order to solve the above technical problems, the present application provides a device for aligning wafers, including: a wafer alignment base;

[0007] The surface of the wafer alignment base is provided with a chuck groove and at least two wafer bearing grooves of different sizes, the chuck groove and the wafer bearing grooves of different sizes are distributed in a concentric structure, and the chuck groove is located at the outermost side of the wafer alignment base; the wafer bearing groove is used to place the wafer, and the chuck groove is used to place the chuck;

[0008] The wafer alignment base is provided with a notch, the notch extends from the edge of the wafer alignment base to the center of the wafer alignment base, and the notch and the innermost wafer bearing groove have an overlapping area.

[0009] Optionally, also include:

[0010] A suction hole is located in each of the wafer carrying grooves.

[0011] Optionally, it also includes: a vacuum adsorption component, which includes a vacuum generating device, a switch and a pipeline, the pipeline is connected to the adsorption hole and the vacuum generating device, and the switch is arranged in the pipeline.

[0012] Optionally, the vacuum adsorption assembly further includes:

[0013] A vacuum regulating valve is arranged in the pipeline.

[0014] Optionally, the arrangement of the adsorption holes includes any one or any combination of the following:

[0015] Array arrangement, circular arrangement, linear arrangement, arc arrangement.

[0016] Optionally, the distance between adjacent adsorption holes is greater than or equal to 5 cm.

[0017] Optionally, the surface flatness of each of the wafer-carrying grooves is no more than 2 degrees.

[0018] Optionally, the number of the notches is two, and they are symmetrically distributed on the wafer alignment base.

[0019] Optionally, also include:

[0020] A positioning pin is arranged on the surface of the chuck groove.

[0021] The present application also provides a wafer alignment method based on the above-mentioned device for aligning wafers, comprising:

[0022] The wafers to be aligned are placed upside down in the wafer bearing grooves on the wafer alignment base in order from small to large in size, so as to perform flip-chip alignment of the wafers of different sizes;

[0023] Place the chuck upside down in the chuck slot on the wafer alignment base, and open the clamp on the chuck, the clamp fixes all the wafers to be aligned through the notches on the wafer alignment base;

[0024] The chuck is removed to remove the wafers of different sizes together with the chuck.

[0025] The present application provides a device for aligning wafers, comprising: a wafer alignment base; a surface of the wafer alignment base is provided with a chuck groove and at least two wafer carrying grooves of different sizes, the chuck groove and the wafer carrying grooves of different sizes are distributed in a concentric structure, and the chuck groove is located at the outermost side of the wafer alignment base; the wafer carrying groove is used to place the wafer, and the chuck groove is used to place the chuck; the wafer alignment base is provided with a notch, the notch extends from the edge of the wafer alignment base to the center of the wafer alignment base, and the notch and the innermost wafer carrying groove have an overlapping area.

[0026] It can be seen that the device for wafer alignment in the present application includes a wafer alignment base, and the wafer alignment base is provided with wafer bearing grooves of different sizes, and the wafer bearing grooves are distributed in a concentric structure. When aligning the wafers, each wafer is placed on the wafer bearing groove in sequence to achieve alignment between each wafer. The notch on the wafer alignment base extends from the edge to the center, and there is an overlapping area with the innermost wafer bearing groove, so the surface of the bottom layer of the wafer and the top layer of the wafer on the wafer alignment base overlaps with the notch. After placing the wafer, the chuck is placed on the chuck groove, and the chuck has a clip, which can fix wafers of different sizes through the notch, thereby fixing the aligned wafer on the chuck. The device in the present application is very convenient when aligning the wafer, and the operation is simple, and the alignment time is greatly reduced; the device structure of the present application is simple, and the manufacturing cost is low, thereby reducing the cost of wafer alignment; and the wafer is placed in the alignment process of the device of the present application without the need for wafer transfer, which can improve the alignment accuracy.

[0027] In addition, the present application also provides a wafer alignment method having the above advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0029] Figure 1 A schematic diagram of the structure of a device for aligning wafers provided in an embodiment of the present application;

[0030] Figure 2 A schematic diagram of placing a smaller wafer on a device for wafer-to-wafer alignment;

[0031] Figure 3 A schematic diagram of placing a second wafer on a device for alignment between wafers;

[0032] Figure 4 A schematic diagram of placing a chuck on a device for alignment between wafers;

[0033] In the figure, 1. wafer alignment base, 11. chuck groove, 12. wafer supporting groove, 13. notch, 2. adsorption hole, 3. switch, 4. vacuum regulating valve, 5. positioning pin, 6. support. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0035] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0036] As described in the background technology section, currently when using an alignment machine for alignment, there are defects such as a complex alignment process, a long time consumption, a high alignment cost and poor alignment accuracy.

[0037] In view of this, the present application provides a device for aligning wafers, please refer to Figure 1 , comprising: a wafer alignment base 1;

[0038] The surface of the wafer alignment base 1 is provided with a chuck groove 11 and at least two wafer bearing grooves 12 of different sizes, the chuck groove 11 and the wafer bearing grooves 12 of different sizes are distributed in a concentric structure, the chuck groove 11 is located at the outermost side of the wafer alignment base 1; the wafer bearing groove 12 is used to place the wafer, and the chuck groove 11 is used to place the chuck;

[0039] The wafer alignment base 1 is provided with a notch 13 , which extends from the edge of the wafer alignment base 1 to the center of the wafer alignment base 1 , and there is an overlapping area between the notch 13 and the innermost wafer bearing groove 12 .

[0040] It should be noted that, in this embodiment, the number of wafer bearing grooves 12 on the wafer alignment base 1 is not limited, and it depends on the situation. For example, the number of wafer bearing grooves 12 can be two, three, four, and so on.

[0041] The shape of the wafer carrying groove 12 is the same as the shape of the wafer to be aligned. For example, when the shape of the wafer to be aligned is circular, the shape of the wafer carrying groove 12 is circular, when the shape of the wafer to be aligned is square, the shape of the wafer carrying groove 12 is square, when the shape of the wafer to be aligned is elliptical, the shape of the wafer carrying groove 12 is elliptical, and when the shape of the wafer to be aligned is irregular, the shape of the wafer carrying groove 12 is irregular.

[0042] The specific type of the concentric structure distribution is not limited in this embodiment and is determined according to the shape of the wafer to be aligned. The concentric structure distribution includes but is not limited to concentric circle distribution, concentric square distribution, and concentric ellipse distribution.

[0043] The chuck groove 11 and the wafer carrying grooves 12 of different sizes are distributed in a stepped manner in a direction perpendicular to the surface of the wafer alignment base 1. In the direction perpendicular to the surface of the wafer alignment base 1, the wafer carrying grooves 12 are distributed in order of size from small to large, the size of the chuck groove 11 is larger than the size of the largest wafer carrying groove, and the chuck groove 11 is located at the top of the wafer alignment base 1.

[0044] A wafer-carrying groove 12 and a chuck groove 11 are provided on a wafer alignment base 1 in the device for aligning wafers. The structure of the wafer alignment base 1 is very simple and the manufacturing cost is relatively low.

[0045] When the wafer needs to be aligned, the wafer to be aligned can be directly placed into the wafer carrying groove 12. The operation is very simple and fast, and the alignment accuracy is relatively high.

[0046] The sizes of wafers to be aligned include but are not limited to 2-inch, 4-inch, 6-inch, 8-inch, and 12-inch wafers.

[0047] The thickness of the wafer bearing groove 12 is the same as the thickness of the wafer to be aligned. The size of the wafer bearing groove 12 is the same as the size of the wafer to be aligned. For example, when the diameters of the two wafers to be aligned are 145 mm and 159 mm respectively, the diameters of the wafer bearing groove 12 are 145 mm and 159 mm respectively.

[0048] It should be noted that the number of the notches 13 is not limited in this embodiment and can be set at will. For example, the number of the notches 13 can be 1, 2, 3, and so on.

[0049] As an implementation method, the number of the notches 13 can be two, and they can be symmetrically distributed on the wafer alignment base 1 to avoid too many notches 13. At the same time, the clamps on the chuck can improve the stability of the wafer fixation when fixing the wafer, further avoid displacement between wafers, and thus further improve the alignment accuracy.

[0050] As another possible implementation method, when the number of the notches 13 is three, the three notches 13 are distributed on the edge of the wafer alignment base 1, the clamp on the chuck can improve the stability of the wafer fixation when fixing the wafer, further avoid displacement between wafers, and thus further improve the alignment accuracy.

[0051] It should also be noted that the shape of the notch 13 is not limited in this embodiment and can be set as desired. For example, the shape of the notch 13 can be a semi-ellipse, a rectangle, or any irregular shape.

[0052] In a direction perpendicular to the surface of the wafer alignment base 1 , that is, in a thickness direction of the wafer alignment base 1 , the notch 13 penetrates the wafer alignment base 1 .

[0053] The innermost wafer bearing groove 12 is also the smallest wafer bearing groove 12, and the notch 13 has an overlapping area with the innermost wafer bearing groove 12, that is, the notch 13 extends into the innermost wafer bearing groove 12 at one end close to the wafer alignment base 1. Figure 1 shown.

[0054] The reason why there is an overlapping area between the notch 13 and the innermost wafer carrying groove 12 is that the lower surface of the wafer to be aligned in the innermost wafer carrying groove 12 (that is, the bottom wafer carrying groove 12) can be exposed, so that the clamp on the chuck can be clamped onto the wafer to be aligned in the bottom wafer carrying groove 12, thereby fixing all the wafers to be aligned together.

[0055] In this embodiment, the material of the wafer alignment base 1 is not limited and can be selected at will.

[0056] Exemplarily, the material of the wafer alignment base 1 includes but is not limited to any one of stainless steel, ceramics, and titanium, so that the wafer alignment base 1 has good stability and is not easily deformed after long-term use, while having a certain hardness to facilitate operations such as drilling on the wafer alignment base 1.

[0057] The device for wafer alignment in this embodiment can be used when aligning wafers when there is no glue between the wafers and the surfaces are smooth.

[0058] The device for wafer alignment in this embodiment includes a wafer alignment base 1, on which wafer alignment base 1 is provided wafer bearing grooves 12 of different sizes, and the wafer bearing grooves 12 are distributed in a concentric structure. When aligning wafers, each wafer is placed in turn on the wafer bearing grooves 12 to achieve alignment between each wafer. The notch 13 on the wafer alignment base 1 extends from the edge to the center, and there is an overlap area with the innermost wafer bearing groove 12, so the surfaces of the bottom layer wafer and the top layer wafer on the wafer alignment base 1 have an overlap area with the notch 13. After placing the wafers, a chuck is placed on the chuck groove 11, and the chuck has a clamp, which can fix wafers of different sizes through the notch 13, thereby fixing the aligned wafer on the chuck. The device in the present application is very convenient for aligning wafers, and the operation is simple, and the alignment time is greatly reduced; the device structure of this embodiment is simple and the manufacturing cost is low, thereby reducing the cost of wafer alignment; and the wafer does not need to be transferred during the alignment process of the device in the present application, which can improve the alignment accuracy.

[0059] Based on the above embodiments, in one embodiment of the present application, the device for aligning wafers may further include:

[0060] A suction hole 2 is located in each of the wafer carrying grooves 12 .

[0061] After the wafer to be aligned is placed in the wafer carrying groove 12 , the wafer to be aligned can be fixed through the adsorption holes 2 , thereby improving the stability of the wafer to be aligned in the wafer carrying groove 12 .

[0062] It should be noted that the shape of the adsorption hole 2 is not limited in this embodiment and can be set at will. For example, the shape of the adsorption hole 2 includes but is not limited to any one or any combination of circular, elliptical, rectangular, square, hexagonal, etc.

[0063] It should also be noted that in this embodiment, the number of adsorption holes 2 in each wafer bearing groove 12 is not limited and can be set at will. For example, the number of adsorption holes 2 in each wafer bearing groove 12 can be 2, 3, 4, 5, 6, 7, 8, 9, etc.

[0064] It should be pointed out that in the present embodiment, the arrangement of the adsorption holes 2 in each wafer carrying groove 12 is not limited and the adsorption holes 2 can be arranged at will.

[0065] As an implementable embodiment, the arrangement of the adsorption holes 2 may include any one or any combination of the following:

[0066] Array arrangement, circular arrangement, linear arrangement, arc arrangement.

[0067] The distances between adjacent adsorption holes 2 may be equal or unequal, which is not specifically limited in this embodiment.

[0068] As an implementation method, the distance between adjacent adsorption holes 2 is greater than or equal to 5 cm to improve the adsorption effect on the wafer to be aligned. When the distance between adjacent adsorption holes 2 is less than 5 cm, the adsorption effect on the wafer to be aligned will be poor.

[0069] For example, when each wafer carrying groove 12 is provided with four adsorption holes 2, the four adsorption holes 2 may be arranged in a 2×2 array, that is, arranged in a square form.

[0070] It should also be noted that in this embodiment, the size of the adsorption hole 2 is not limited and can be set at will.

[0071] As an implementation method, the diameter of the adsorption hole 2 can range from 0.9 mm to 1.1 mm, including the end values. If the diameter of the adsorption hole 2 is too large, the adsorption effect on the wafer to be aligned is poor and it is easy to leak. If the diameter of the adsorption hole 2 is too small, the adsorption hole 2 is easy to be blocked.

[0072] Based on any of the above embodiments, in one embodiment of the present application, the device for aligning wafers may also include: a vacuum adsorption component, the vacuum adsorption component includes a vacuum generating device, a switch 3 and a pipeline, the pipeline is connected to the adsorption hole 2 and the vacuum generating device, and the switch 3 is arranged in the pipeline.

[0073] The vacuum generating device includes but is not limited to any one of a vacuum pump and a vacuum generator.

[0074] The switch 3 can be used to control whether the vacuum generating device adsorbs the wafer to be aligned or not.

[0075] It should be noted that in this embodiment, there is no limitation on the number of vacuum adsorption components, which depends on the circumstances.

[0076] Exemplarily, the number of the vacuum adsorption assembly may be one, and the adsorption and fixation of each wafer to be aligned may be controlled by the vacuum adsorption assembly.

[0077] Exemplarily, the number of vacuum adsorption components may be equal to the number of wafer carrying grooves 12, and one vacuum adsorption component controls the adsorption and fixation of one wafer to be aligned.

[0078] All the adsorption holes 2 on a wafer carrying groove 12 are connected to pipelines respectively, and finally gathered and connected to one pipeline.

[0079] In one embodiment of the present application, the vacuum adsorption assembly may further include: a vacuum regulating valve 4, which is arranged in the pipeline.

[0080] The vacuum degree of the wafer to be aligned can be adjusted by the vacuum regulating valve 4 , that is, the suction strength of the wafer to be aligned can be adjusted.

[0081] like Figure 1 As shown, the device for aligning wafers may also include an L-shaped support member 6, the wafer alignment base 1 is fixed to the horizontal part of the support member 6, and the vacuum regulating valve 4 and the switch 3 may be fixed to the vertical part of the support member 6.

[0082] Based on any of the above embodiments, in one embodiment of the present application, the surface flatness of each of the wafer carrying grooves 12 is not greater than 2 degrees.

[0083] Exemplarily, the surface flatness of the wafer supporting groove 12 can be 2 degrees, 1.5 degrees, 1 degree, 0.5 degrees, etc.

[0084] When the surface flatness of the wafer supporting groove 12 is greater than 2 degrees and the vacuum suction force is too large, the wafer may be broken.

[0085] Based on any of the above embodiments, in one embodiment of the present application, the device for aligning wafers may further include:

[0086] The positioning pin 5 is arranged on the surface of the chuck groove 11 .

[0087] When the chuck is placed in the chuck groove 11 , the chuck can be fixed by the positioning pin 5 to prevent the chuck from being offset.

[0088] Based on any of the above embodiments, in one embodiment of the present application, the device for aligning wafers may further include a robot for placing the wafer to be aligned in the wafer carrying groove 12 to improve the wafer alignment efficiency.

[0089] In summary, the device for wafer alignment in this application has the following advantages:

[0090] 1. Simplify the concentricity alignment process of wafers: The equipment used for wafer alignment in this application takes 3 minutes to align a wafer, which is 62.5% less time than the alignment machine in the prior art, which takes 8 minutes;

[0091] 2. Reduce alignment costs: The manufacturing cost of the equipment used for wafer alignment in this application is about 10,000 yuan, while the price of the alignment machine in the prior art is about 2 million yuan. The equipment cost is greatly reduced, thereby reducing the alignment cost;

[0092] 3. The alignment accuracy of the equipment used for alignment between wafers in this application can reach the level of hundreds of microns, and the alignment accuracy is very high.

[0093] The present application also provides a wafer alignment method based on the device for aligning wafers according to the above embodiment, comprising:

[0094] Step S101: wafers to be aligned are placed upside down in the wafer bearing grooves on the wafer alignment base in order from small to large in size, so as to perform flip-chip alignment of the wafers of different sizes.

[0095] When placing the wafer to be aligned into the wafer carrying groove, it can be placed manually or by a robot, which is not limited in this embodiment.

[0096] Step S102: placing the chuck upside down in the chuck slot on the wafer alignment base, and opening the clamp on the chuck, wherein the clamp fixes all wafers to be aligned through the notches on the wafer alignment base.

[0097] There is an overlapping area between the notch and the innermost wafer carrying groove, so part of the lower surface of the wafer to be aligned in the innermost wafer carrying groove is exposed in the notch. The clamp can be clamped on the part of the surface of the wafer to be aligned in the innermost wafer carrying groove exposed in the notch, thereby fixing all the wafers to be aligned on the chuck.

[0098] Since the wafers to be aligned have been flip-chip aligned through the wafer carrying grooves, when the wafers to be aligned are fixed on the chuck by the clamps, the wafers to be aligned are still aligned with each other.

[0099] Step S103: removing the chuck, so as to remove the wafers of different sizes together with the chuck.

[0100] It can be seen that when the device for aligning wafers of the present application is used for alignment, the operation is very simple; the alignment accuracy is also very high, and the alignment accuracy can achieve hundreds of microns.

[0101] The alignment method is described by taking the alignment of two wafers to be aligned as an example.

[0102] A schematic diagram of a smaller wafer being placed on a device used for wafer-to-wafer alignment is shown in Figure 2 As shown in the figure, a smaller wafer is first placed upside down in the wafer holding groove at the bottom layer and aligned, and the wafer is vacuum adsorbed using the adsorption holes and vacuum adsorption components in the wafer holding groove at the bottom layer; a second wafer (also called a carrier) is placed on the device for aligning wafers as shown in the figure. Figure 3 As shown, another wafer is placed upside down in the wafer holding groove of the upper layer and aligned, and the wafer is vacuum adsorbed by using the adsorption holes and vacuum adsorption components in the wafer holding groove of the upper layer; the schematic diagram of placing a chuck on the device for aligning between wafers is shown in Figure 4As shown, place the chuck in the chuck slot, open the clamp of the chuck, rotate and fix it on the wafer, and finally turn off the vacuum adsorption of the two wafers and remove the chuck.

[0103] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0104] The above is a detailed introduction to the device for wafer alignment and wafer alignment method provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the scheme and core ideas of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the present application.

Claims

1. A device for aligning wafers, characterized in that: include: Wafer alignment base (1); The surface of the wafer alignment base (1) is provided with a chuck groove (11) and at least two wafer bearing grooves (12) of different sizes, the chuck groove (11) and the wafer bearing grooves (12) of different sizes are arranged in a concentric structure, the chuck groove (11) is located at the outermost side of the wafer alignment base (1); the wafer bearing groove (12) is used to place a wafer, and the chuck groove (11) is used to place a chuck; The wafer alignment base (1) is provided with a notch (13), the notch (13) extending from the edge of the wafer alignment base (1) towards the center of the wafer alignment base (1), and an overlapping area exists between the notch (13) and the innermost wafer bearing groove (12); In a direction perpendicular to the surface of the wafer alignment base (1), the notch (13) penetrates the wafer alignment base (1); After the wafer is placed, a chuck is placed on the chuck groove (11). The chuck has a clamp, and the clamp fixes wafers of different sizes through the notch (13), thereby fixing the aligned wafers on the chuck.

2. The device for wafer alignment according to claim 1, characterized in that: Also includes: Adsorption holes (2) are located in each of the wafer carrying grooves (12).

3. The device for wafer alignment according to claim 2, characterized in that: Also includes: A vacuum adsorption component, the vacuum adsorption component comprising a vacuum generating device, a switch (3) and a pipeline, the pipeline being connected to the adsorption hole (2) and the vacuum generating device, and the switch (3) being arranged in the pipeline.

4. The device for wafer alignment according to claim 3, characterized in that: The vacuum adsorption assembly also includes: A vacuum regulating valve (4) is arranged in the pipeline.

5. The device for wafer alignment according to claim 2, characterized in that: The arrangement of the adsorption holes (2) includes any one or any combination of the following: Array arrangement, circular arrangement, linear arrangement, arc arrangement.

6. The device for wafer alignment according to claim 2, characterized in that: The distance between adjacent adsorption holes (2) is greater than or equal to 5 centimeters.

7. The device for wafer alignment according to claim 1, characterized in that: The surface flatness of each wafer-carrying groove (12) is no greater than 2 degrees.

8. The device for wafer alignment according to claim 1, characterized in that: The number of the notches (13) is two, and they are symmetrically distributed on the wafer alignment base (1).

9. The device for wafer alignment according to any one of claims 1 to 8, characterized in that: Also includes: A positioning pin (5) is arranged on the surface of the chuck groove (11).

10. A wafer alignment method based on the device for wafer alignment according to claim 1, characterized in that: include: The wafers to be aligned are placed upside down in the wafer bearing grooves (12) on the wafer alignment base (1) in order from small to large in size, so as to perform flip-chip alignment of the wafers of different sizes; The chuck is placed upside down in the chuck groove (11) on the wafer alignment base (1), and the clamp on the chuck is opened, wherein the clamp fixes all wafers to be aligned through the notch (13) on the wafer alignment base (1); The chuck is removed to remove the wafers of different sizes together with the chuck.

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