A semiconductor packaging structure

Abstract

The present invention discloses a semiconductor packaging structure, including a packaging device and a sealing device, wherein the sealing device is threadedly connected to the upper end of the packaging device, and the packaging device includes a connector 1, a metal bump, a connection assembly and a pad, wherein the connector 1 is fixedly connected to the outward end of the connection assembly, the metal bump is fixedly connected to the inner bottom surface of the connection assembly, and the pad is fixedly connected to the top surface of the metal bump. The present invention is provided with a packaging shell, a metal bearing plate and a hexagonal nut, wherein the hexagonal nut rotates at the upper end of the metal slide bar, thereby determining the position of the metal bearing plate, determining the position of the pin, avoiding the pin from shaking, avoiding the pin from being affected by the outside world, thereby causing damage to the pin, and shortening the time for replacing the pin, wherein the bottom surface of the sealing cover plate is connected to the top surface of the packaging shell, and the sealing cover plate and the packaging shell are threadedly connected, thereby protecting the safety of the pin.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a semiconductor packaging structure. Background Art

[0002] With the continuous advancement of semiconductor technology, packaging technology is also constantly innovating. At present, the mainstream technology of the global packaging industry is in the third stage dominated by CSP and BGA, and is moving towards the fourth and fifth stage packaging technology represented by system-level packaging (SiP), flip-chip packaging (FC), and chip bumping. Advanced packaging technologies such as 2.5D packaging, 3D packaging, TSV (Through Silicon Via) technology are gradually becoming mainstream, injecting new vitality into the development of the semiconductor industry.

[0003] Semiconductor packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements. The main purpose of packaging technology is to provide protection, mechanical support, thermal management, and electronic connection for chips to ensure chip stability and reliability.

[0004] The prior art discloses an application number: CN202311839991.8, a semiconductor packaging structure, comprising a lower shell; a buffer mechanism is installed inside the lower shell, a semiconductor body is installed on the top of the buffer mechanism, a connecting structure is installed on both sides of the semiconductor body, and semiconductor pins are installed on both sides of the lower shell; the connecting structure comprises a connecting wire, a conductive sheet and a conductive block, a conductive sheet is installed on the top of the semiconductor body, a connecting wire is installed on one side of the conductive sheet, and a conductive block is installed on the end of the connecting wire far from the conductive sheet; the present invention uses a connecting wire, a conductive sheet and a conductive block in combination, fixes the conductive sheet to the surface of the semiconductor body by bolts, and then installs the conductive block on the outside of the semiconductor pin, at this time, the semiconductor body and the semiconductor pin can be electrically connected through the connecting wire, when part of the structure is damaged, personnel can directly replace it, which is convenient for personnel to operate later.

[0005] The semiconductors are connected via wires, which can easily cause the wires to break, rendering the pins inoperable and requiring replacement of the pins. The entire device must be disassembled, and the replacement of the pins takes a lot of time. Summary of the invention

[0006] The object of the present invention is to provide a semiconductor packaging structure to solve the problems raised in the above background technology.

[0007] In order to solve the above technical problem, the present invention provides the following technical solution: a semiconductor packaging structure, comprising a packaging device and a sealing device, wherein the sealing device is threadedly connected to the upper end of the packaging device.

[0008] The packaging device includes a connector, a metal bump, a connecting assembly and a pad. The connector is fixedly connected to the outward end of the connecting assembly, the metal bump is fixedly connected to the bottom surface of the connecting assembly, and the pad is fixedly connected to the top surface of the metal bump.

[0009] The connecting assembly includes a packaging shell, a coil spring, a metal slide bar, a metal supporting plate, a hexagonal nut and a semiconductor. The metal slide bar is fixedly connected to the bottom surface inside the packaging shell, the metal supporting plate is slidably connected to the upper surface of the metal slide bar, the coil spring is fixedly connected to the bottom surface inside the packaging shell, the semiconductor is installed inside the packaging shell, and the hexagonal nut is threadedly connected to the upper end of the metal slide bar.

[0010] The semiconductor includes a pin, a second connector, a connecting wire, a semiconductor body and a rectangular plate, wherein the rectangular plate is mounted on the outward end of the second connector, the second connector is mounted on the upper end of the pin, the connecting wire is mounted on the inward end of the second connector, and the connecting wire is fixedly connected to the top surface of the semiconductor body.

[0011] According to the above technical solution, the sealing device includes a sealing cover plate, a limiting frame, an activated carbon plate and a fixed threaded rod, the activated carbon plate is fixedly connected to the bottom end surface of the sealing cover plate, the limiting frame is fixedly connected to the outward end of the sealing cover plate, and the fixed threaded rod is fixedly connected to the bottom end surface of the sealing cover plate.

[0012] According to the above technical solution, the metal supporting plate is fixedly connected to the top surface of the coil spring, and the coil spring is divided into two groups. The two groups of coil springs are distributed on the left and right, and the number of coil springs in one group is nine, and the nine coil springs are distributed at equal intervals. The compressed coil spring begins to rebound, and the coil spring can push the metal supporting plate to move upward, thereby maintaining the balance of the metal supporting plate.

[0013] According to the above technical solution, the semiconductor body is movably connected to the bottom surface of the pad, the metal bump is fixedly connected to the bottom surface inside the packaging shell, the connector is fixedly connected to the outer surface of the packaging shell, the metal bump and the packaging shell are connected, the metal bump and the pad can clamp and fix semiconductor bodies of different specifications, and the position of the semiconductor body can be determined.

[0014] According to the above technical solution, the pins are movably connected to the upper end of the packaging shell, and the metal supporting plate is movably connected to the upper end of the pins. The pins are divided into two groups, and the two groups of pins are distributed on the left and right. The number of pins in one group is nine, and the nine pins are distributed at equal intervals. The packaging shell and the metal supporting plate can determine the position of the pins and prevent the pins from shaking.

[0015] According to the above technical solution, there are two limit frames, which are distributed on the left and right, and the activated carbon plate is located in the middle of the two limit frames. The limit frames and the sealing cover plates are bolted together, so that different types of limit frames can be used according to the specifications of the semiconductor body.

[0016] According to the above technical solution, the connecting piece is threadedly connected to the lower end of the fixed threaded rod, the number of the fixed threaded rods is two, the two fixed threaded rods are distributed front and back, the fixed threaded rod is located in front of the limiting frame, the lower end of the fixed threaded rod is threadedly connected with a nut, the nut rotates on the threaded rod surface of the fixed threaded rod, and the nut can threadably fix the sealing cover plate and the packaging shell through the fixed threaded rod, thereby preventing the sealing cover plate from detaching from the packaging shell.

[0017] According to the above technical solution, the sealing cover plate is movably connected to the bottom surface of the packaging shell, the sealing cover plate is movably connected to the top surface of the pin, and the sealing cover plate is movably connected to the top surface of the metal supporting plate. The sealing cover plate can determine the position of the pin, prevent the pin from shaking, and protect the safety of the pin.

[0018] According to the above technical solution, the activated carbon plate is movably connected to the inner wall surface of the packaging shell, and the activated carbon plate is located above the semiconductor body. The activated carbon plate can absorb moisture in the air and protect the safety of the semiconductor body, thereby increasing the service life of the packaging shell.

[0019] According to the above technical solution, there are two connecting members one, which are distributed front and back, and are located in the middle of the packaging shell. The two connecting members one are threadedly connected to the fixed threaded rod, so that the position of the sealing cover plate can be determined, and different types of sealing cover plates can be replaced and used.

[0020] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0021] 1. The present invention is provided with a packaging shell, a metal carrier plate and a hexagonal nut. The hexagonal nut rotates on the upper end of the metal slide bar, so that the position of the metal carrier plate can be determined, the position of the pin can be determined, the pin can be prevented from shaking, and the pin can be prevented from being affected by the outside world to cause damage to the pin, the time for replacing the pin can be shortened, and the use time of the device can be increased.

[0022] 2. The present invention is provided with a packaging shell, a sealing cover plate and a fixed threaded rod. The sealing cover plate drives the fixed threaded rod to move downward, the bottom surface of the sealing cover plate is connected to the top surface of the packaging shell, and the sealing cover plate and the packaging shell are threadedly connected, so that the position of the pin can be determined and the safety of the pin can be protected.

[0023] 3. The present invention is provided with a sealing cover plate, a limiting frame and a fixed threaded rod. The sealing cover plate can push the fixed threaded rod to move downward so that the fixed threaded rod is inserted into the inner wall surface of the connector one, and then the nut is rotated. The nut rotates on the threaded end surface of the fixed threaded rod. At the same time, the sealing cover plate and the limiting frame can determine the position of the semiconductor body, thereby protecting the safety of the semiconductor body.

[0024] 4. The present invention is provided with a coil spring, a metal slide rod and a hexagonal nut. The hexagonal nut rotates on the upper end of the metal slide rod. The hexagonal nut can be connected to the surface of the metal bearing plate. At the same time, the coil spring and the hexagonal nut can determine the position of the metal bearing plate, thereby protecting the safety of the metal bearing plate and increasing the use time of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0026] Figure 1 It is an overall three-dimensional schematic diagram of the present invention;

[0027] Figure 2 is a three-dimensional schematic diagram of the sealing device of the present invention;

[0028] Figure 3 It is a three-dimensional schematic diagram of the internal device of the packaging device of the present invention;

[0029] Figure 4 The present invention Figure 3 A local enlarged schematic diagram of the structure at A in FIG.

[0030] Figure 5 The present invention Figure 3 A local enlarged schematic diagram of the structure at B in FIG.

[0031] Figure 6 It is a three-dimensional schematic diagram of the internal device of the connection component of the present invention.

[0032] In the figure: 1. packaging device; 11. connector 1; 12. metal bump; 13. connecting assembly; 131. packaging shell; 132. spiral spring; 133. metal slide bar; 134. metal bearing plate; 135. hexagonal nut; 136. semiconductor; 1361. pin; 1362. connector 2; 1363. connecting wire; 1364. semiconductor body; 1365. rectangular plate; 14. gasket; 2. sealing device; 21. sealing cover plate; 22. limiting frame; 23. activated carbon plate; 24. fixing threaded rod. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] See also Figure 1-6 , the present invention provides the following technical solutions:

[0035] A semiconductor packaging structure comprises a packaging device 1 and a sealing device 2. The sealing device 2 is threadedly connected to the upper end of the packaging device 1.

[0036] The packaging device 1 includes a connector 11, a metal bump 12, a connecting component 13 and a pad 14. The connector 11 is fixedly connected to the outward end of the connecting component 13, the metal bump 12 is fixedly connected to the inner bottom surface of the connecting component 13, and the pad 14 is fixedly connected to the top surface of the metal bump 12.

[0037] The connecting component 13 includes a packaging shell 131, a coil spring 132, a metal slide bar 133, a metal bearing plate 134, a hexagonal nut 135 and a semiconductor 136. The metal slide bar 133 is fixedly connected to the bottom surface of the interior of the packaging shell 131, the metal bearing plate 134 is slidably connected to the upper surface of the metal slide bar 133, the coil spring 132 is fixedly connected to the bottom surface of the interior of the packaging shell 131, the metal bearing plate 134 is fixedly connected to the top surface of the coil spring 132, the coil spring 132 is divided into two groups, the two groups of coil springs 132 are distributed on the left and right, the number of one group of coil springs 132 is nine, and the nine coil springs 132 are distributed at equal intervals. The compressed coil spring 132 begins to rebound, and the coil spring 132 can push the metal bearing plate 134 to move upward, and can maintain the balance of the metal bearing plate 134. The semiconductor 136 is installed inside the packaging shell 131, and the hexagonal nut 135 is threadedly connected to the upper end of the metal slide bar 133.

[0038] Semiconductor 136 includes pins 1361, a second connector 1362, a connecting wire 1363, a semiconductor body 1364 and a rectangular plate 1365. Rectangular plate 1365 is mounted on the outward end of the second connector 1362. The second connector 1362 is mounted on the upper end of pin 1361. Pin 1361 is movably connected to the upper end of package shell 131. Metal carrier plate 134 is movably connected to the upper end of pin 1361. Pin 1361 is divided into two groups. The two groups of pins 1361 are distributed left and right. The number of pins in one group 1361 is nine. The nine pins 1361 are distributed at equal intervals. Package shell 131 and metal carrier plate 134 can connect pin 1361. The position of pin 1361 is determined, which can prevent pin 1361 from shaking. The connecting wire 1363 is installed at the inward end of the connecting piece 1362. The connecting wire 1363 is fixedly connected to the top surface of the semiconductor body 1364. The semiconductor body 1364 is movably connected to the bottom surface of the pad 14. The metal bump 12 is fixedly connected to the bottom surface inside the packaging shell 131. The connecting piece 11 is fixedly connected to the outer surface of the packaging shell 131. The metal bump 12 is connected to the packaging shell 131. The metal bump 12 and the pad 14 can clamp and fix semiconductor bodies 1364 of different specifications, so that the position of the semiconductor body 1364 can be determined.

[0039] The sealing device 2 includes a sealing cover plate 21, a limiting frame 22, an activated carbon plate 23 and a fixed threaded rod 24. The activated carbon plate 23 is fixedly connected to the bottom surface of the sealing cover plate 21. The sealing cover plate 21 is movably connected to the bottom surface of the packaging shell 131. The sealing cover plate 21 is movably connected to the top surface of the pin 1361. The sealing cover plate 21 is movably connected to the top surface of the metal carrier plate 134. The sealing cover plate 21 can determine the position of the pin 1361, can prevent the pin 1361 from shaking, and can protect the pin 1361. The activated carbon plate 23 is movably connected to the inner wall surface of the package shell 131, and the activated carbon plate 23 is located above the semiconductor body 1364. The activated carbon plate 23 can absorb moisture in the air and protect the safety of the semiconductor body 1364, thereby increasing the service life of the package shell 131. The limiting frame 22 is fixedly connected to the outward end of the sealing cover plate 21. The number of the limiting frames 22 is two, and the two limiting frames 22 are distributed on the left and right, and the activated carbon plate 23 is located in the middle of the two limiting frames 22. The position frame 22 and the sealing cover plate 21 are connected by bolts, so that different types of position limit frames 22 can be used according to the specifications of the semiconductor body 1364. The fixed threaded rod 24 is fixedly connected to the bottom surface of the sealing cover plate 21. The connecting piece 11 is threadedly connected to the lower end of the fixed threaded rod 24. There are two fixed threaded rods 24, and the two fixed threaded rods 24 are distributed front and back. The fixed threaded rod 24 is located in front of the position limit frame 22. The lower end of the fixed threaded rod 24 is threadedly connected with a nut, and the nut is fixed to the fixed threaded rod 24. The nut can be rotated on the surface of the threaded rod, and the nut can threadably fix the sealing cover plate 21 and the packaging shell 131 through the fixed threaded rod 24, so as to prevent the sealing cover plate 21 from being separated from the packaging shell 131. There are two connecting pieces 11, and the two connecting pieces 11 are distributed front and back. The connecting piece 11 is located in the middle position of the packaging shell 131. The two connecting pieces 11 and the fixed threaded rod 24 are threadedly connected, so that the position of the sealing cover plate 21 can be determined, and different types of sealing cover plates 21 can be replaced and used.

[0040] When in use, the coil spring 132 is pushed downward, the bottom surface of the coil spring 132 is connected to the bottom surface inside the packaging shell 131, and the metal slide bar 133 is located inside the coil spring 132, and the position of the coil spring 132 can be determined.

[0041] The metal bearing plate 134 is pushed downward and slides on the surface of the metal slide bar 133 , so that the bottom surface of the metal bearing plate 134 is connected to the top surface of the coil spring 132 , thereby determining the position of the metal bearing plate 134 .

[0042] The hexagonal nut 135 is rotated so that the hexagonal nut 135 rotates on the upper end of the metal slide bar 133 , and the bottom end surface of the hexagonal nut 135 is movably connected to the lower end of the metal bearing plate 134 , so that the position of the metal bearing plate 134 can be determined.

[0043] The semiconductor body 1364 is pushed downward to connect the bottom surface of the semiconductor body 1364 with the top surface of the pad 14 , thereby determining the position of the semiconductor body 1364 .

[0044] The second connector 1362 can be pushed and inserted into the upper end of the pin 1361 to determine the position of the second connector 1362. A rectangular plate 1365 is installed at the outward end of the second connector 1362 to limit and fix the pin 1361 and the second connector 1362.

[0045] Push the second connector 1362 to be inserted into the inward end of the second connector 1362 , place tin powder at the connection between the second connector 1362 and the connecting wire 1363 , and heat the tin powder, so that the second connector 1362 and the connecting wire 1363 can be fixedly connected.

[0046] Push pin 1361 downward and insert it into the upper end of the packaging shell 131 and the metal supporting plate 134, so that the position of pin 1361 can be determined. Pin 1361 can drive connecting wire 1363 downward, place tin powder on the bottom surface of connecting wire 1363 and the top surface of semiconductor body 1364, and then heat them, so that the connecting wire 1363 and semiconductor body 1364 can be fixedly connected.

[0047] The sealing cover plate 21 is pushed to move downward, and the sealing cover plate 21 can drive the fixed threaded rod 24 to move downward, so that the fixed threaded rod 24 is inserted into the lower end of the connector 11, so that the bottom end surface of the sealing cover plate 21 is connected with the top end surface of the packaging shell 131 and the pin 1361, and then the nut is turned, and the nut rotates on the threaded end surface of the fixed threaded rod 24, so that the sealing cover plate 21 and the packaging shell 131 can be threadedly fixed.

[0048] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0049] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor packaging structure, comprising a packaging device (1) and a sealing device (2), characterized in that: The sealing device (2) is threadedly connected to the upper end of the packaging device (1); The packaging device (1) comprises a connector (11), a metal bump (12), a connection assembly (13) and a pad (14), wherein the connector (11) is fixedly connected to an outward end of the connection assembly (13), the metal bump (12) is fixedly connected to an inner bottom surface of the connection assembly (13), and the pad (14) is fixedly connected to a top surface of the metal bump (12); The connection assembly (13) comprises a packaging shell (131), a coil spring (132), a metal slide bar (133), a metal bearing plate (134), a hexagonal nut (135) and a semiconductor (136); the metal slide bar (133) is fixedly connected to the inner bottom surface of the packaging shell (131); the metal bearing plate (134) is slidably connected to the upper end surface of the metal slide bar (133); the coil spring (132) is fixedly connected to the inner bottom surface of the packaging shell (131); the semiconductor (136) is installed inside the packaging shell (131); and the hexagonal nut (135) is threadedly connected to the upper end of the metal slide bar (133); The semiconductor (136) comprises a pin (1361), a second connector (1362), a connecting wire (1363), a semiconductor body (1364) and a rectangular plate (1365), wherein the rectangular plate (1365) is mounted on the outward end of the second connector (1362), the second connector (1362) is mounted on the upper end of the pin (1361), the connecting wire (1363) is mounted on the inward end of the second connector (1362), and the connecting wire (1363) is fixedly connected to the top surface of the semiconductor body (1364).

2. A semiconductor package structure according to claim 1, characterized in that: The sealing device (2) comprises a sealing cover plate (21), a limiting frame (22), an activated carbon plate (23) and a fixed threaded rod (24); the activated carbon plate (23) is fixedly connected to the bottom surface of the sealing cover plate (21); the limiting frame (22) is fixedly connected to an outward end of the sealing cover plate (21); and the fixed threaded rod (24) is fixedly connected to the bottom surface of the sealing cover plate (21).

3. A semiconductor package structure according to claim 2, characterized in that: The metal bearing plate (134) is fixedly connected to the top surface of the coil spring (132); the coil spring (132) is divided into two groups; the two groups of coil springs (132) are distributed on the left and right; the number of coil springs (132) in one group is nine; and the nine coil springs (132) are distributed at equal intervals.

4. A semiconductor package structure according to claim 3, characterized in that: The semiconductor body (1364) is movably connected to the bottom surface of the pad (14), the metal bump (12) is fixedly connected to the inner bottom surface of the packaging shell (131), and the connector 1 (11) is fixedly connected to the outer surface of the packaging shell (131).

5. The semiconductor package structure according to claim 4, characterized in that: The pins (1361) are movably connected to the upper end of the packaging shell (131), and the metal supporting plate (134) is movably connected to the upper end of the pins (1361). The pins (1361) are divided into two groups, and the two groups of pins (1361) are distributed on the left and right. The number of pins (1361) in one group is nine, and the nine pins (1361) are distributed at equal intervals.

6. The semiconductor package structure according to claim 5, characterized in that: The number of the limiting frames (22) is two, the two limiting frames (22) are distributed on the left and right, and the activated carbon plate (23) is located in the middle of the two limiting frames (22).

7. The semiconductor package structure according to claim 6, characterized in that: The connecting member 1 (11) is threadedly connected to the lower end of a fixed threaded rod (24), the number of the fixed threaded rods (24) is two, the two fixed threaded rods (24) are distributed front and back, and the fixed threaded rods (24) are located in front of the limiting frame (22).

8. The semiconductor package structure according to claim 7, characterized in that: The sealing cover plate (21) is movably connected to the bottom surface of the packaging shell (131), the sealing cover plate (21) is movably connected to the top surface of the pin (1361), and the sealing cover plate (21) is movably connected to the top surface of the metal supporting plate (134).

9. The semiconductor package structure according to claim 8, characterized in that: The activated carbon plate (23) is movably connected to the inner wall surface of the packaging shell (131), and the activated carbon plate (23) is located above the semiconductor body (1364).

10. The semiconductor package structure according to claim 9, characterized in that: The number of the connecting pieces one (11) is two, and the two connecting pieces one (11) are distributed front and back, and the connecting piece one (11) is located in the middle of the packaging shell (131).

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