Micro-LED device preparation method, micro-LED device and display device

Abstract

The present disclosure provides a method for preparing a micro-LED device, a micro-LED device, and a display device. The method includes: disposing a first micro-LED module on a substrate; disposing a flexible support layer on the substrate and around the first micro-LED module; disposing a second micro-LED module and a third micro-LED module on the flexible support layer, such that the second micro-LED module and the third micro-LED module are electrically connected to the driving substrate of the first micro-LED module; removing the transparent substrate; disposing the driving substrate of the first micro-LED module on a flexible circuit board in an electrically connected manner to obtain a first intermediate structure; bending the first intermediate structure so that the second micro-LED module and the third micro-LED module face each other to form a receiving space; and disposing a light combining module in the receiving space to form the micro-LED device.

Description

Technical Field

[0001] The present disclosure relates to the technical field of semiconductor Micro LEDs, and more particularly to a method for preparing a Micro LED device, a Micro LED device, and a display device. Background Art

[0002] With the continuous pursuit of display technology, display technology is gradually developing in the direction of small size and high resolution. Among them, Micro LED is a representative of miniaturized display technology. Micro LED technology is a technology that miniaturizes, matrices, and thin films LED chips. Its pixel size is less than 50μm. Currently, the main method of Micro LED full-color solution is to use a light-combining module (X Cube) to achieve three-color light combination. That is, three different color single-color light-emitting modules that are connected to the circuit board and packaged are attached to the three sides of the light-combining module, and the alignment error during the attachment is mechanically corrected. In this solution, the overall structure after assembly takes up a large space. Summary of the Invention

[0003] In order to solve the technical problems mentioned in the background technology, the solution disclosed in the present invention provides a method for preparing a micro LED device, a micro LED device and a display device.

[0004] According to one aspect of an embodiment of the present disclosure, a method for preparing a micro LED device is provided, wherein the method comprises: providing a first micro LED module, a second micro LED module, a third micro LED module, a substrate, a flexible circuit board and a light combining module, wherein the first micro LED module, the second micro LED module and the third micro LED module emit light of different colors and each include a driving substrate and a micro LED chip arranged on the driving substrate; arranging one side of the driving substrate of the first micro LED module on the substrate; arranging a flexible supporting layer on the substrate and around the first micro LED module; arranging the second micro LED module and the third micro LED module separately on the flexible supporting layer and on both sides of the first micro LED module, so that the The second micro LED module and the third micro LED module are electrically connected to the driving substrate of the first micro LED module; the substrate is removed; the driving substrate of the first micro LED module is electrically connected and arranged on the flexible circuit board, so that the flexible circuit board controls the first micro LED module, the second micro LED module and the third micro LED module to obtain a first intermediate structure; the first intermediate structure is bent so that the second micro LED module and the third micro LED module are opposite to each other to form a accommodating space, wherein the light emitting directions of the first micro LED module, the second micro LED module and the third micro LED module are toward the accommodating space to obtain a device composition structure; the light combining module is arranged in the accommodating space to form the micro LED device.

[0005] Furthermore, the second micro LED module and the third micro LED module are separately arranged on the flexible supporting layer and on both sides of the first micro LED module, so that the second micro LED module and the third micro LED module are electrically connected to the driving substrate of the first micro LED module, including: the second micro LED module and the third micro LED module are separately arranged on the flexible supporting layer and on both sides of the first micro LED module, so that the driving substrate of the second micro LED module is electrically connected to the first to-be-connected part on the driving substrate of the first micro LED module, and the driving substrate of the third micro LED module is electrically connected to the second to-be-connected part on the driving substrate of the first micro LED module, and the driving substrate of the first micro LED module is electrically connected and arranged on the flexible circuit board, including: the first to-be-connected part and the second to-be-connected part are respectively connected to the corresponding parts of the flexible circuit board.

[0006] Furthermore, the second micro LED module and the third micro LED module are arranged on the flexible supporting layer, so that the driving substrate of the second micro LED module is electrically connected to the first to-be-connected portion on the driving substrate of the first micro LED module, and the driving substrate of the third micro LED module is electrically connected to the second to-be-connected portion on the driving substrate of the first micro LED module, comprising: forming a first contact hole and a second contact hole on the micro LED chip of the first micro LED module, so that the first contact hole exposes the first to-be-connected portion on the driving substrate of the first micro LED module, and the second contact hole exposes the second to-be-connected portion on the driving substrate of the first micro LED module; arranging a first metal wire connected as an integral whole on the first to-be-connected portion and on the flexible supporting layer, and arranging a first metal wire connected as an integral whole on the second to-be-connected portion and on the flexible supporting layer. a second metal wire of the body to obtain a second intermediate structure; a protective layer is provided on the second intermediate structure, and a third contact hole and a fourth contact hole are opened on the protective layer, so that the third contact hole exposes a first preset exposed portion of the first metal wire located on the flexible supporting layer, and the fourth contact hole exposes a second preset exposed portion of the second metal wire located on the flexible supporting layer; a first metal layer is provided on the first preset exposed portion and a second metal layer is provided on the second preset exposed portion; a first metal block is provided on the first metal layer and a second metal block is provided on the second metal layer to obtain a third intermediate structure; the third intermediate structure is connected to the corresponding portion of the driving substrate of the second micro LED module through the first metal block, and the third intermediate structure is connected to the corresponding portion of the driving substrate of the third micro LED module through the second metal block.

[0007] Furthermore, setting a flexible supporting layer on the substrate and around the first micro LED module includes: setting a flexible supporting material on the substrate and the first micro LED module; grinding the flexible supporting material until the upper surface of the first micro LED module is exposed to form the flexible supporting layer.

[0008] Furthermore, after connecting the third intermediate structure to the corresponding part of the driving substrate of the second micro LED module through the first metal block, and connecting the third intermediate structure to the corresponding part of the driving substrate of the third micro LED module through the second metal block, the method also includes filling a protective part in the gap between the second micro LED module and the third micro LED module and the third intermediate structure.

[0009] Furthermore, the light combining module is used to combine the lights of different colors emitted by the first micro LED module, the second micro LED module and the third micro LED module. The light combining module includes a light combining prism, and the substrate includes a transparent substrate, which includes a glass substrate.

[0010] Furthermore, the flexible supporting material includes an organic compound with fluidity, and the organic compound with fluidity includes epoxy resin.

[0011] Furthermore, the material of the protection layer includes polyimide, and the protection portion includes underfill.

[0012] According to another aspect of the present disclosure, a micro LED device is also provided. The micro LED device includes a device component structure and a light combining module. The device component structure includes a flexible circuit board, a first micro LED module, a second micro LED module, a third micro LED module, a flexible supporting layer, and a storage space. The first micro LED module, the second micro LED module, and the third micro LED module emit light of different colors and each include a driver substrate and a micro LED chip disposed on the driver substrate. The driver substrate of the first micro LED module is electrically connected and disposed on the flexible circuit board. The flexible supporting layer includes a horizontal portion and first and second vertical portions located on both sides of the horizontal portion. The horizontal portion of the flexible supporting layer is disposed on the flexible circuit board and around the first micro LED module. The second micro LED module is disposed on the first vertical portion of the flexible supporting layer and is electrically connected to the driver substrate of the first micro LED module. The third micro LED module is disposed on the second vertical portion of the flexible supporting layer and is electrically connected to the driver substrate of the first micro LED module. The first, second, and third micro LED modules form the storage space. The light emission directions of the first, second, and third micro LED modules are toward the storage space. The light combining module is disposed in the storage space.

[0013] Furthermore, the driving substrate of the first micro LED module includes a first portion to be connected and a second portion to be connected, the first portion to be connected and the second portion to be connected are respectively connected to corresponding portions of the flexible circuit board, the driving substrate of the second micro LED module is electrically connected to the first portion to be connected of the first micro LED module, and the driving substrate of the third micro LED module is electrically connected to the second portion to be connected of the first micro LED module. Furthermore, the device component structure also includes: a first contact hole and a second contact hole, which are arranged on the micro LED chip of the first micro LED module, the first contact hole exposes the first portion to be connected on the driving substrate of the first micro LED module, and the second contact hole exposes the second portion to be connected on the driving substrate of the first micro LED module; a first metal wire and a second metal wire, the first metal wire is integrally formed on the first portion to be connected and on the horizontal portion and the first vertical portion of the flexible supporting layer, and the second metal wire is integrally formed on the second portion to be connected and on the horizontal portion and the second vertical portion of the flexible supporting layer; a protective layer, which is arranged on the first metal wire, the second metal wire and the first micro LED module; a third contact hole and a fourth contact hole. a hole, which is arranged on the protective layer, the third contact hole exposing the first preset exposed portion of the first metal wire located on the first vertical portion of the flexible supporting layer, and the fourth contact hole exposing the second preset exposed portion of the second metal wire located on the second vertical portion of the flexible supporting layer; a first metal layer and a second metal layer, the first metal layer is arranged on the first preset exposed portion, and the second metal layer is arranged on the second preset exposed portion; a first metal block and a second metal block, the first metal block is arranged on the first metal layer, and the second metal block is arranged on the second metal layer, the first metal block is connected to the corresponding portion of the driving substrate of the second micro LED module, and the second metal block is connected to the corresponding portion of the driving substrate of the third micro LED module.

[0014] Furthermore, the device structure further includes a protection portion, which is disposed in a gap between the second micro LED module, the third micro LED module, and the protection layer.

[0015] According to another aspect of the embodiments of the present disclosure, a display device is provided, comprising the aforementioned micro LED device.

[0016] Using the technical solution of the present disclosure, a flexible support layer can be arranged around a first micro LED module, and a second micro LED module and a third micro LED module can be arranged on the flexible support layer. The second micro LED module and the third micro LED module are electrically connected to the driver substrate of the first micro LED module. The driver substrate of the first micro LED module is also electrically connected and arranged on a flexible circuit board, so that the flexible circuit board controls the first, second, and third micro LED modules, thereby forming a first intermediate structure. The first intermediate structure is then bent so that the second micro LED module and the third micro LED module face each other, forming a storage space. Finally, a light combining module is placed in the storage space to form a micro LED device. As a result, the first, second, and third micro LED modules can share a single flexible circuit board, i.e., they are controlled by only one flexible circuit board, thereby reducing the volume of the entire micro LED device and facilitating its application in smaller environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an illustrative and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0018] Figure 1 is a flow chart illustrating a method for preparing a micro LED device according to one embodiment of the present disclosure;

[0019] Figures 2 to 15 1 is a schematic diagram illustrating a process flow of a method for preparing a micro LED device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0020] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0021] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which the present application belongs.

[0022] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways, rotated 90 degrees or in other orientations, and the spatially relative descriptions used herein are interpreted accordingly.

[0023] Now, exemplary embodiments according to the present disclosure will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in a variety of different forms and should not be construed as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of this application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art. In the accompanying drawings, for clarity, the thickness of layers and regions is exaggerated, and the same reference numerals are used to represent the same devices, and thus their descriptions will be omitted.

[0024] In related technologies, full-color Micro LED solutions primarily utilize a light-combining module (X Cube) to achieve three-color light combination. This involves attaching three monochromatic light-emitting modules, each individually connected to a circuit board and packaged, to the three surfaces of the light-combining module, with mechanical correction for alignment errors during assembly. In this solution, each monochromatic light-emitting module forms a module with its own circuit board, and the three modules are then attached to corresponding surfaces of the light-combining module. This results in a relatively large overall assembly footprint.

[0025] The present disclosure provides a method for preparing a micro LED device. Figures 1 to 15 , Figure 1 is a flow chart illustrating a method for preparing a micro LED device according to one embodiment of the present disclosure; Figures 2 to 15 1 is a schematic diagram illustrating a process flow of a method for preparing a micro LED device according to an embodiment of the present disclosure.

[0026] According to embodiments of the present disclosure, the pixel size in the micro LED device is typically less than 50 microns.

[0027] like Figure 1 As shown, the method for preparing a micro LED device includes the following steps S101-S108.

[0028] Step S101: Provide a first micro LED module, a second micro LED module, a third micro LED module, a substrate, a flexible circuit board and a light combining module, wherein the first micro LED module, the second micro LED module and the third micro LED module each include a driving substrate and a micro LED chip arranged on the driving substrate.

[0029] Step S102: Disposing one side of the driving substrate of the first micro LED module on the substrate.

[0030] Step S103: Disposing a flexible supporting layer on the substrate and around the first micro LED module.

[0031] Step S104: separately arranging the second micro LED module and the third micro LED module on the flexible supporting layer and on both sides of the first micro LED module, so that the second micro LED module and the third micro LED module are electrically connected to the driving substrate of the first micro LED module.

[0032] Step S105: removing the substrate.

[0033] Step S106: electrically connecting the driving substrate of the first micro LED module to the flexible circuit board, so that the flexible circuit board controls the first micro LED module, the second micro LED module and the third micro LED module, to obtain a first intermediate structure.

[0034] Step S107: Bend the first intermediate structure so that the second micro LED module and the third micro LED module are opposite to each other to form a receiving space, wherein light emission directions of the first micro LED module, the second micro LED module, and the third micro LED module are toward the receiving space, thereby obtaining a device assembly structure.

[0035] Step S108: placing the light combining module in the accommodation space to form the micro LED device.

[0036] According to this technical solution, a flexible support layer can be arranged around a first micro LED module, and a second micro LED module and a third micro LED module can be arranged on the flexible support layer. The second micro LED module and the third micro LED module are electrically connected to the driver substrate of the first micro LED module. The driver substrate of the first micro LED module is also electrically connected and arranged on a flexible circuit board, so that the flexible circuit board controls the first, second, and third micro LED modules, thereby forming a first intermediate structure. The first intermediate structure is then bent so that the second micro LED module and the third micro LED module face each other, forming a storage space. Finally, a light combining module is placed in the storage space to form a micro LED device. As a result, the first, second, and third micro LED modules can share a single flexible circuit board, i.e., they are controlled by only one flexible circuit board, thereby reducing the volume of the entire micro LED device and facilitating its application in smaller environments.

[0037] In step S101, a first micro LED module, a second micro LED module, a third micro LED module, a substrate, a flexible circuit board and a light combining module can be provided, wherein the first micro LED module, the second micro LED module and the third micro LED module emit light of different colors and each include a driving substrate and a micro LED chip arranged on the driving substrate.

[0038] According to the embodiments of the present disclosure, the first micro LED module, the second micro LED module, the third micro LED module, the substrate, the flexible circuit board, and the light combining module required for preparing a micro LED device can be first obtained. The first micro LED module, the second micro LED module, and the third micro LED module are any micro LED modules suitable for preparing a micro LED device and composed of a micro LED chip and a driver substrate. It is worth noting that the first micro LED module, the second micro LED module, the third micro LED module, the substrate, the flexible circuit board, and the light combining module can also be obtained in any step before the step of using these components.

[0039] Furthermore, the light combining module is used to combine the different colors of light emitted by the first micro LED module, the second micro LED module and the third micro LED module. The first micro LED module can, for example, emit blue light, the second micro LED module can, for example, emit green light, and the third micro LED module can, for example, emit red light. Of course, the first micro LED module, the second micro LED module and the third micro LED module can also emit light of other colors, as long as they are suitable for achieving full color, and there is no limitation here. The light combining module may include a light combining prism, and the light combining module may also be any other applicable device that can combine the different colors of light emitted by the first micro LED module, the second micro LED module and the third micro LED module to achieve full color. The substrate may include a transparent substrate, and the transparent substrate may include a glass substrate, a sapphire substrate, etc.

[0040] In step S102 , a driving substrate side of the first micro LED module is disposed on the substrate.

[0041] According to an embodiment of the present disclosure, a first micro LED module may be provided on the substrate, and a driving substrate of the first micro LED module may be connected to the substrate.

[0042] Reference Figure 2-Figure 15 ,in Figure 2 FIG. 1 shows a side view of a first micro LED module 10 disposed on a substrate 103 according to one embodiment of the present disclosure. Figure 2 As shown, the first micro LED module 10 includes a first driving substrate 101 and a first micro LED chip 102 electrically connected to the first driving substrate 101. The first micro LED module 10 can emit blue light, for example. Specifically, the first micro LED chip 102 can include a light emitting unit array consisting of at least one first light emitting unit 1021. Figure 2 Only two first light-emitting units 1021 are schematically shown, and this is not intended to be limiting. The first drive substrate 101 may be, for example, a CMOS substrate. The substrate 103 may be, for example, a transparent substrate, preferably a glass substrate. The first drive substrate 101 of the first micro LED module 10 is disposed on the substrate 103.

[0043] In step S103 , a flexible supporting layer may be provided on the substrate and around the first micro LED module.

[0044] According to an embodiment of the present disclosure, after the first micro LED module is disposed on the substrate, a flexible supporting layer may be disposed on the substrate around the first micro LED module.

[0045] Furthermore, disposing a flexible supporting layer on the substrate and around the first micro LED module may include: disposing a flexible supporting material on the substrate and the first micro LED module; and grinding the flexible supporting material until the upper surface of the first micro LED module is exposed to form the flexible supporting layer. The flexible supporting material may include a fluid organic compound, which may include epoxy resin.

[0046] Reference Figure 2-Figure 15 ,in Figure 3 FIG. 1 shows a side view of a flexible support material 104 disposed on a substrate 103 and a first micro LED module 10 according to one embodiment of the present disclosure. Figure 3 As shown, a molding device can be used to cover the substrate 103 and the first micro LED module 10 with a flexible support material such as epoxy resin, and the epoxy resin with fluidity can be leveled in a vacuum environment. In addition, the molding device can control the thickness of the flexible support material by, for example, controlling a sensor, and at the same time, ensure that the flexible support material is free of bubbles in a high vacuum environment, thereby forming a film after curing. Figure 3 The flexible supporting material 104 shown is flexible and insulating. Of course, the flexible supporting material can also be any other suitable material.

[0047] Reference Figure 2-Figure 15 ,in Figure 4 FIG. 1 shows a side view of a flexible supporting layer 105 formed of a flexible supporting material 104 according to one embodiment of the present disclosure. Figure 4 As shown, the flexible support material 104 can be processed by chemical mechanical polishing using physical friction and chemical reaction until the upper surface of the first micro LED chip 102 of the first micro LED module 10 is exposed to form a flexible support layer 105. This method can obtain a plane with extremely high flatness. The mechanical friction is mainly achieved by the polishing equipment and the polishing particles (such as silicon oxide particles) added to the polishing liquid. The smaller the particle size of the silicon oxide particles, the smaller the surface roughness obtained. The chemical reaction is mainly achieved through the solvent components in the polishing liquid, such as citric acid, hydrogen peroxide, etc. The endpoint detection device of the polishing equipment can be used to monitor in real time whether the upper surface of the first micro LED chip 102 of the first micro LED module 10 is exposed.

[0048] In step S104, the second micro LED module and the third micro LED module may be separately arranged on the flexible supporting layer and on both sides of the first micro LED module, so that the second micro LED module and the third micro LED module are electrically connected to the driving substrate of the first micro LED module.

[0049] According to an embodiment of the present disclosure, after setting a flexible supporting layer, a second micro LED module and a third micro LED module can be set on the flexible supporting layer and on both sides of the first micro LED module, and the second micro LED module and the third micro LED module can be electrically connected to the driving substrate of the first micro LED module.

[0050] According to an embodiment of the present disclosure, separately arranging the second and third micro LED modules on the flexible supporting layer and on either side of the first micro LED module so that the second and third micro LED modules are electrically connected to the driver substrate of the first micro LED module includes: separately arranging the second and third micro LED modules on the flexible supporting layer and on either side of the first micro LED module so that the driver substrate of the second micro LED module is electrically connected to a first portion to be connected on the driver substrate of the first micro LED module, and the driver substrate of the third micro LED module is electrically connected to a second portion to be connected on the driver substrate of the first micro LED module. It is worth noting that the first portion to be connected and the second portion to be connected may be intermediate connection points on the driver substrate of the first micro LED module. The intermediate connection points may be included in the driver substrate of the first micro LED module itself, or may be provided on the driver substrate of the first micro LED module. In either case, the intermediate connection points, when electrically connected to other components, do not affect the normal operation of the first micro LED module itself.

[0051] Furthermore, the second micro LED module and the third micro LED module are separately arranged on the flexible supporting layer and on both sides of the first micro LED module, so that the driving substrate of the second micro LED module is electrically connected to the first to-be-connected portion on the driving substrate of the first micro LED module, and the driving substrate of the third micro LED module is electrically connected to the second to-be-connected portion on the driving substrate of the first micro LED module. This may include: forming a first contact hole and a second contact hole on the micro LED chip of the first micro LED module, so that the first contact hole exposes the first to-be-connected portion on the driving substrate of the first micro LED module, and the second contact hole exposes the second to-be-connected portion on the driving substrate of the first micro LED module; arranging a first metal wire connected as an integral whole on the first to-be-connected portion and on the flexible supporting layer, and forming a first metal wire connected as an integral whole on the second to-be-connected portion and on the flexible supporting layer. A second metal wire is integrally connected and disposed on the supporting layer to form a second intermediate structure; a protective layer is disposed on the second intermediate structure, and a third contact hole and a fourth contact hole are formed in the protective layer, such that the third contact hole exposes a first predetermined exposed portion of the first metal wire on the flexible supporting layer, and the fourth contact hole exposes a second predetermined exposed portion of the second metal wire on the flexible supporting layer; a first metal layer is disposed on the first predetermined exposed portion, and a second metal layer is disposed on the second predetermined exposed portion; a first metal block is disposed on the first metal layer, and a second metal block is disposed on the second metal layer, to form a third intermediate structure; the third intermediate structure is connected to a corresponding portion of a driver substrate of the second micro LED module via the first metal block, and the third intermediate structure is connected to a corresponding portion of a driver substrate of the third micro LED module via the second metal block. It is noteworthy that the corresponding portion of the driver substrate of the second micro LED module may be a connection terminal on the driver substrate, to which a component having a control function is connected to control the driver substrate. Similarly, the corresponding portion of the driver substrate of the third micro LED module can be a connection terminal on the driver substrate, and the component with control function is connected to the connection terminal to control the driver substrate. The material of the protective layer includes polyimide, and the material of the protective layer can also be any other suitable material.

[0052] Furthermore, after connecting the third intermediate structure to a corresponding portion of the driver substrate of the second micro LED module via the first metal block, and connecting the third intermediate structure to a corresponding portion of the driver substrate of the third micro LED module via the second metal block, the method may further include filling a gap between the second micro LED module, the third micro LED module, and the second intermediate structure with a protective portion. The protective portion may include an underfill and may be formed of any suitable material.

[0053] Reference Figure 2-Figure 15 ,in Figure 5 FIG. 1 shows a side view of a first contact hole 1023 and a second contact hole 1024 provided on a first micro LED chip 102 of a first micro LED module 10 according to an embodiment of the present disclosure. Figure 5 As shown, photolithography can be used to form first contact holes 1023 and second contact holes 1024 on the first micro LED chip 102 of the first micro LED module 10. The first contact hole 1023 exposes the first portion 1011 to be connected on the first driving substrate 101 of the first micro LED module 10, while the second contact hole 1024 exposes the second portion 1012 to be connected on the first driving substrate 101 of the first micro LED module 10. The first and second contact holes 1023 and 1024 can be located on both sides of the periphery of the first micro LED chip 102. The number of first contact holes 1023 corresponds to the number of first portions 1011 to be connected, and the number of second contact holes 1024 corresponds to the number of second portions 1012 to be connected. The first and second portions 1011 and 1012 to be connected are used to electrically connect to a subsequently installed flexible printed circuit board. The number of first and second portions 1011 and 1012 to be connected depends on the actual control requirements of the flexible printed circuit board.

[0054] Reference Figure 2-Figure 15 ,in Figure 6 A side view of a first metal wire 106 connected to a first portion to be connected 1011 and disposed on a flexible supporting layer 105 adjacent to the first portion to be connected 1011, and a second metal wire 107 connected to a second portion to be connected 1012 and disposed on a flexible supporting layer 105 adjacent to the second portion to be connected 1012, according to an embodiment of the present disclosure is shown. The first metal wire 106 and the second metal wire 107 can be prepared simultaneously. Figure 6As shown, the patterns of the first metal line 106 and the second metal line 107 can be patterned using photoresist, and then the first metal line 106 and the second metal line 107 are deposited using an electron beam evaporation method, that is, a Ti layer and a Cu layer are deposited in sequence, and finally, acetone or a degumming solution is used to remove the photoresist and excess metal by a lift-off process to obtain the following: Figure 6 The second intermediate structure 50 is shown. Figure 6 As shown, first metal wires 106 are connected to first portion 1011 to be connected, and second metal wires 107 are connected to second portion 1012 to be connected. The number of first metal wires 106 corresponds to the number of first contact holes 1023, and the number of second metal wires 107 corresponds to the number of second contact holes 1024.

[0055] Reference Figure 2-Figure 15 ,in Figure 7 According to one embodiment of the present disclosure, Figure 6 The side view of the protective layer 108 with the third contact hole 1081 and the fourth contact hole 1082 provided on the second intermediate structure 50 is shown. Figure 7 As shown, it can be Figure 6 Transparent polyimide is spin-coated on the second intermediate structure 50 to form a protective layer 108. Then, a third contact hole 1081 and a fourth contact hole 1082 can be formed in the protective layer 108 using photolithography. The third contact hole 1081 exposes a first predetermined exposed portion of the first metal line 106 located on the flexible supporting layer 105, and the fourth contact hole 1082 exposes a second predetermined exposed portion of the second metal line 107 located on the flexible supporting layer 105. The third contact holes 1081 and the fourth contact holes 1082 are located on both sides of the first micro LED module 10. The number of the third contact holes 1081 can be determined based on the number of the first metal lines 106, and the number of the fourth contact holes 1082 can be determined based on the number of the second metal lines 107. Each first metal line 106 and each second metal line 107 has a corresponding contact hole, but the number of contact holes depends on actual needs, for example, Figure 7 It is schematically shown that each first metal line 106 corresponds to three third contact holes 1081 , and each second metal line 107 corresponds to three fourth contact holes 1082 .

[0056] Reference Figure 2-Figure 15 ,in Figure 8 FIG. 1 shows a side view of a first metal layer 109 disposed on a first predetermined exposed portion and a second metal layer 110 disposed on a second predetermined exposed portion according to an embodiment of the present disclosure. Figure 8As shown, the pattern of the first metal layer 109 and the second metal layer 110 can be formed by photolithography using a photoresist, and then the first metal layer 109 and the second metal layer 110 are deposited by an electron beam evaporation method, that is, the Ti layer and the Cu layer are deposited in sequence, and finally the photoresist and the excess metal are removed by a lift-off process using acetone or a degumming solution to obtain the following: Figure 8 The structure shown.

[0057] Reference Figure 2-Figure 15 ,in Figure 9 FIG2 shows a side view of a first metal block 111 disposed on a first metal layer 109 and a second metal block 112 disposed on a second metal layer 110 according to an embodiment of the present disclosure. The materials of the first metal block 111 and the second metal block 112 may be, for example, indium, or any other suitable material. Figure 9 As shown, the pattern of the first metal block 111 and the second metal block 112 can be formed by photolithography using photoresist, and then an indium metal layer is deposited by vacuum thermal evaporation. Finally, the photoresist and excess metal are removed by a lift-off process using acetone or a degumming solution to obtain the following: Figure 9 The third intermediate structure 60 shown includes a first metal block 111 and a second metal block 112 .

[0058] Reference Figure 2-Figure 15 ,in Figure 10 The bonding according to one embodiment of the present disclosure is shown in FIG. Figure 9 The side view of the second micro LED module 20 and the third micro LED module 30 on the third intermediate structure 60 is shown. Figure 10 As shown, the second micro LED module 20 includes a second driving substrate 201 and a second micro LED chip 202 electrically connected to the second driving substrate 201. The third micro LED module 30 includes a third driving substrate 301 and a third micro LED chip 302 electrically connected to the third driving substrate 301. The second micro LED module 20 can emit green light, for example, and the third micro LED module 30 can emit red light, for example. Specifically, the second micro LED chip 202 can include a light-emitting unit array consisting of at least one second light-emitting unit 2021, and the third micro LED chip 302 can include a light-emitting unit array consisting of at least one third light-emitting unit 3021. Figure 10Only two second light-emitting units 2021 and two third light-emitting units 3021 are schematically shown in the figure, and no limitation is given here. The second drive substrate 201 and the third drive substrate 301 can be, for example, CMOS type substrates. The third intermediate structure 60 can be electrically connected to the corresponding part of the second drive substrate 201 of the second micro LED module 20 through the first metal block 111, and the third intermediate structure 60 can be connected to the corresponding part of the third drive substrate 301 of the third micro LED module 30 through the second metal block 112, so as to obtain the following: Figure 10 The structure shown.

[0059] In addition, refer to Figure 2-Figure 15 ,in Figure 11 FIG2 shows a side view of a protective portion 113 filling the gap between the second micro LED module 20 and the third micro LED module 30 and the third intermediate structure 60 according to an embodiment of the present disclosure. The protective portion 113 may include an underfill, such as a UV curing adhesive. Figure 11 As shown, the underfill can be applied at the edge of the gap between the second micro LED module 20 and the third micro LED module 30 and the protective layer 108 of the third intermediate structure 60 and heated to fully fill the gap. The gap is then placed in a vacuum device to remove internal bubbles, and the underfill is finally cured by UV and heating to obtain a Figure 11 For example, the protective portion 113 of the underfill can protect the first metal blocks 111 and the second metal blocks 112 from external water vapor corrosion.

[0060] In step S105 , the substrate may be removed.

[0061] According to an embodiment of the present disclosure, after obtaining Figure 11 After the structure shown, the substrate can be removed. The substrate can include a transparent substrate, which can include a glass substrate.

[0062] Reference Figure 2-Figure 15 ,in Figure 12 An embodiment according to the present disclosure is shown Figure 11 The structure shown is a side view after removing the substrate 103. Figure 12 As shown, in the case where the substrate 103 is a transparent substrate such as a glass substrate, a laser can be used to irradiate the flexible supporting layer 105 and the bottom surface of the first micro LED module through the glass substrate, so that the bottom surface is partially decomposed and melted, thereby separating the substrate 103 and obtaining the following Figure 12 It is worth noting that the substrate 103 may also be any other applicable type, for example, it may be an opaque substrate, so that the substrate can be removed using a corresponding method.

[0063] In step S106 , the driving substrate of the first micro LED module may be electrically connected and disposed on the flexible circuit board, so that the flexible circuit board controls the first micro LED module, the second micro LED module and the third micro LED module, thereby obtaining a first intermediate structure.

[0064] According to an embodiment of the present disclosure, electrically connecting the driving substrate of the first micro LED module to the flexible circuit board may include: connecting the first to-be-connected portion and the second to-be-connected portion to corresponding portions of the flexible circuit board, respectively. Notably, the corresponding portions of the flexible circuit board may be connection terminals of the flexible circuit board, through which the flexible circuit board can control other components.

[0065] Specifically, when obtaining Figure 12 Following the structure shown, the driver substrate of the first micro LED module in this structure can be electrically connected to a flexible circuit board, allowing the flexible circuit board to control the first micro LED module. Furthermore, the first and second portions to be connected on the driver substrate of the first micro LED module are respectively connected to corresponding portions of the flexible circuit board. As described above, the first portion to be connected is electrically connected to the second micro LED module via the first metal wire, the first metal layer, and the first metal block, while the second portion to be connected is electrically connected to the third micro LED module via the second metal wire, the second metal layer, and the second metal block. Thus, the flexible circuit board controls the second and third micro LED modules. Thus, the first, second, and third micro LED modules can share a single flexible circuit board and, therefore, be controlled by the same flexible circuit board.

[0066] Reference Figure 2-Figure 15 ,in Figure 13 An embodiment of the present disclosure is shown. Figure 12 The structure shown is a side view of the flexible circuit board 40 electrically connected together. Figure 13As shown, the first driving substrate 101 of the first micro LED module 10 can be electrically connected to the flexible circuit board 40, so that the flexible circuit board 40 can control the first micro LED module 10. Furthermore, the first to-be-connected portion 1011 and the second to-be-connected portion 1012 on the first driving substrate 101 of the first micro LED module 10 are respectively connected to corresponding portions of the flexible circuit board. This connection can be achieved by connecting the first to-be-connected portion 1011 and the second to-be-connected portion 1012 to corresponding portions on the flexible circuit board 40 via internal wiring passing through the first driving substrate 101, or by providing through-holes connected to the first to-be-connected portion 1011 and the second to-be-connected portion 1012 in the flexible supporting layer 105 and the first micro LED chip 102, and then routing metal wires to connect the corresponding portions on the flexible circuit board 40. Of course, any other connection method is also possible and is not limited here. Furthermore, since the first portion to be connected 1011 is electrically connected to the second micro LED module 20 via the first metal wire 106, the first metal layer 109, and the first metal block 111, and the second portion to be connected 1012 is electrically connected to the third micro LED module 30 via the second metal wire 107, the second metal layer 110, and the second metal block 112, the flexible circuit board 40 can control the second micro LED module 20 and the third micro LED module 30. Thus, the first micro LED module 10, the second micro LED module 20, and the third micro LED module 30 can share the same flexible circuit board 40, that is, be controlled by the same flexible circuit board 40, thereby obtaining the following: Figure 13 The first intermediate structure 70 shown in FIG. The first intermediate structure 70 has only one flexible circuit board 40, so the volume of the first intermediate structure 70 is greatly reduced.

[0067] In step S107, the first intermediate structure can be bent so that the second micro LED module and the third micro LED module are opposite to each other to form an accommodation space, wherein the light emission directions of the first micro LED module, the second micro LED module and the third micro LED module are toward the accommodation space, thereby obtaining a device component structure.

[0068] According to an embodiment of the present disclosure, after obtaining the first intermediate structure as described above, the first intermediate structure can be bent so that the light-emitting surface of the second micro LED module is opposite to the light-emitting surface of the third micro LED module, thereby forming an accommodating space for the first micro LED module, the second micro LED module and the third micro LED module, and the light-emitting directions of the first micro LED module, the second micro LED module and the third micro LED module are toward the accommodating space.

[0069] Reference Figure 2-Figure 15 ,in Figure 14FIG. 8 shows a side view of a device structure 80 formed by bending the first intermediate structure 70 according to an embodiment of the present disclosure. Figure 14 As shown, Figure 13 The first intermediate structure 70 is bent so that the second light-emitting unit 2011 of the second micro LED module 20 and the third light-emitting unit 3011 of the third micro LED module 30 are opposite each other. As a result, the first micro LED module 10, the second micro LED module 20, and the third micro LED module 30 form a receiving space 801, and the light emission directions of the first micro LED module 10, the second micro LED module 20, and the third micro LED module 30 are toward the receiving space 801. It is worth noting that Figure 13 The lateral distances between the second micro LED module 20 and the third micro LED module 30 and the first micro LED module 10 in the first intermediate structure 70 are schematic. In practical applications, the lateral distances can ensure that the first intermediate structure 70 can be bent into Figure 14 The device structure 80 is shown, and the lateral distance can be determined according to the size of the subsequently arranged composite module.

[0070] In step S108 , the light combining module may be placed in the accommodation space to form the micro LED device.

[0071] According to an embodiment of the present disclosure, after obtaining Figure 14 After the structure shown, the light combining module can be placed in the accommodation space. Specifically, as described above, the accommodation space is determined based on the size of the light combining module. Therefore, when the light combining module is placed in the accommodation space, the surfaces of the first micro LED module, the second micro LED module, and the third micro LED module can be close to the light combining module.

[0072] Furthermore, the light combining module is used to combine the lights of different colors emitted by the first micro LED module, the second micro LED module and the third micro LED module, and the light combining module includes a light combining prism.

[0073] Reference Figure 2-Figure 15 ,in Figure 15 According to one embodiment of the present disclosure, Figure 14 A side view of the light combining module 90 provided in the structure shown. Figure 15As shown, a light combining module 90 such as a light combining prism is inserted into the accommodation space 801, and the surfaces of the first micro LED module 10, the second micro LED module 20 and the third micro LED module 30 are close to the corresponding parts of the three surfaces of the light combining module 90, so that the light combining module 90 combines the lights of different colors emitted by the first micro LED module 10, the second micro LED module 20 and the third micro LED module 30, and the combined light is emitted from the surface of the light combining module 90 that is different from the three surfaces, that is, from the attached surface shown in FIG. Figure 15 Emitted from the upper surface.

[0074] Thus, the micro LED device is prepared. Figure 15 The micro LED device 1 is shown in FIG. 1 . It is worth noting that, since the micro LED device 1 uses only one flexible circuit board 40, the size of the micro LED device 1 is greatly reduced, which is conducive to the application of the device in a smaller size environment. In addition, since a flexible support layer such as epoxy resin is used in the preparation of the micro LED device 1, the micro LED device 1 is easily bent. Figure 13 The first intermediate structure shown has bending convenience and ductility, and after inserting the synthesis module, the bending degree can also be adjusted to change the position of the second micro LED module and the third micro LED module, thereby conveniently reducing the alignment error between the first micro LED module, the second micro LED module and the third micro LED module and the light combining module.

[0075] The present disclosure also provides a micro LED device.

[0076] like Figure 2-Figure 15As shown, the micro LED device 1 includes a device assembly structure 80 and a light combining module 90. The device assembly structure 80 includes a flexible circuit board 40, a first micro LED module 10, a second micro LED module 20, a third micro LED module 30, a flexible supporting layer 105, and a receiving space 801. The first micro LED module 10, the second micro LED module 20, and the third micro LED module 30 emit light of different colors and each include a driver substrate and a micro LED chip disposed on the driver substrate. The driver substrate 101 of the first micro LED module 10 is electrically connected to the flexible circuit board 40. The flexible supporting layer 105 includes a horizontal portion 1051 and first and second vertical portions 1052 and 1053 located on either side of the horizontal portion 1051. The horizontal portion 1051 of the flexible supporting layer 105 is disposed on the flexible circuit board 40 and around the first micro LED module 10. The second micro LED module 20 is disposed on the first vertical portion 1052 of the flexible supporting layer 105 and is electrically connected to the driving substrate 101 of the first micro LED module 10. The third micro LED module 30 is disposed on the second vertical portion 1053 of the flexible supporting layer 105 and is electrically connected to the driving substrate 101 of the first micro LED module 10. The first micro LED module 10, the second micro LED module 20, and the third micro LED module 30 form the accommodation space 801. Light emission directions of the first micro LED module 10, the second micro LED module 20, and the third micro LED module 30 are toward the accommodation space. The light combining module 90 is disposed in the accommodation space 801.

[0077] According to an embodiment of the present disclosure, the driving substrate 101 of the first micro LED module 10 includes a first portion to be connected 1011 and a second portion to be connected 1012, each of which is connected to a corresponding portion of the flexible circuit board 40. The driving substrate 201 of the second micro LED module 20 is electrically connected to the first portion to be connected 1011 of the first micro LED module 10, and the driving substrate 301 of the third micro LED module 30 is electrically connected to the second portion to be connected 1012 of the first micro LED module 10.

[0078] According to an embodiment of the present disclosure, the device component structure 80 further includes: a first contact hole 1023 and a second contact hole 1024, which are arranged on the micro LED chip of the first micro LED module 10, the first contact hole 1023 exposing the first to-be-connected portion 1011 on the driving substrate of the first micro LED module 10, and the second contact hole 1024 exposing the second to-be-connected portion 1012 on the driving substrate of the first micro LED module 10; a first metal wire 106 and a second metal wire 107, the first metal wire 106 being integrally formed on the first to-be-connected portion 1011 and the horizontal portion 1051 and the first vertical portion 1052 of the flexible supporting layer 105, and the second metal wire 107 being integrally formed on the second to-be-connected portion 1012 and the horizontal portion 1051 and the second vertical portion 1053 of the flexible supporting layer 105; a protective layer 108, which is arranged on the first micro LED module 10 a first metal wire 106, a second metal wire 107 and the first micro LED module 10; a third contact hole 1081 and a fourth contact hole 1082, which are arranged on the protective layer 108, the third contact hole 1081 exposing a first preset exposed portion of the first metal wire 106 located on the first vertical portion 1052 of the flexible supporting layer 105, and the fourth contact hole 1082 exposing a second preset exposed portion of the second metal wire 107 located on the second vertical portion 1053 of the flexible supporting layer 105; a first metal layer 109 and a second metal layer 110, the first metal layer 109 being arranged on the first preset exposed portion, and the second metal layer 110 being arranged on the second preset exposed portion; a first metal block 111 and a second metal block 112, the first metal block 111 being arranged on the first metal layer 109, and the second metal block 112 being arranged on the second metal layer 110. The first metal block 111 is connected to a corresponding portion of the driving substrate of the second micro LED module 20 , and the second metal block 112 is connected to a corresponding portion of the driving substrate of the third micro LED module 30 .

[0079] According to an embodiment of the present disclosure, the device assembly structure 80 further includes a protection portion 113 , which is disposed in a gap between the second micro LED module 20 , the third micro LED module 30 , and the protection layer 108 .

[0080] It is worth noting that any relevant description of the micro LED device in the above-mentioned micro LED device preparation method (including but not limited to technical features and their functions, explanations, etc.) can be applied to the micro LED device disclosed in the present invention.

[0081] The present disclosure also provides a display device comprising the aforementioned micro LED device.

[0082] The display device can be applied to flexible electronic devices to implement technologies such as augmented reality (AR), virtual reality (VR), extended reality (XR), and mixed reality (MR). For example, the display device can be the projection part of an electronic device, such as a projector or a head-up display (HUD). In another example, the display device can also be the display part of an electronic device, such as a smartphone, smartwatch, laptop, tablet computer, dashcam, navigation system, head-mounted device, or any other device with a display screen.

[0083] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0084] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned steps / processes does not mean the order of execution, and the execution order of each step / process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application. In addition, the serial numbers of the embodiments of the present application mentioned above are only for description and do not represent the advantages and disadvantages of the embodiments.

[0085] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0086] The foregoing description is merely a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. Those skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present disclosure shall be included within the scope of protection of the present disclosure.

Claims

1. A method for preparing a micro LED device, wherein: The method comprises: Providing a first micro LED module, a second micro LED module, a third micro LED module, a substrate, a flexible circuit board, and a light combining module, wherein the first micro LED module, the second micro LED module, and the third micro LED module each include a driving substrate and a micro LED chip disposed on the driving substrate; Disposing one side of the driving substrate of the first micro LED module on the substrate; providing a flexible supporting layer on the substrate and around the first micro LED module; Disposing the second micro LED module and the third micro LED module separately on the flexible supporting layer and on both sides of the first micro LED module, so that the second micro LED module and the third micro LED module are electrically connected to the driving substrate of the first micro LED module; removing the substrate; electrically connecting the driving substrate of the first micro LED module to the flexible circuit board, so that the flexible circuit board controls the first micro LED module, the second micro LED module, and the third micro LED module, thereby obtaining a first intermediate structure; The first intermediate structure is bent so that the second micro LED module and the third micro LED module face each other to form an accommodation space, wherein light emission directions of the first micro LED module, the second micro LED module, and the third micro LED module are toward the accommodation space, thereby obtaining a device assembly structure; The light combining module is arranged in the accommodation space to form the micro LED device.

2. The method for preparing a micro LED device according to claim 1, wherein: The second micro LED module and the third micro LED module are separately arranged on the flexible supporting layer and on both sides of the first micro LED module, so that the second micro LED module and the third micro LED module are electrically connected to the driving substrate of the first micro LED module, including: the second micro LED module and the third micro LED module are separately arranged on the flexible supporting layer and on both sides of the first micro LED module, so that the driving substrate of the second micro LED module is electrically connected to the first to-be-connected part on the driving substrate of the first micro LED module, and the driving substrate of the third micro LED module is electrically connected to the second to-be-connected part on the driving substrate of the first micro LED module, and the driving substrate of the first micro LED module is electrically connected and arranged on the flexible circuit board, including: the first to-be-connected part and the second to-be-connected part are respectively connected to the corresponding parts of the flexible circuit board.

3. The method for preparing a micro LED device according to claim 2, wherein: The second micro LED module and the third micro LED module are separately arranged on the flexible supporting layer and on both sides of the first micro LED module, so that the driving substrate of the second micro LED module is electrically connected to the first to-be-connected portion on the driving substrate of the first micro LED module, and the driving substrate of the third micro LED module is electrically connected to the second to-be-connected portion on the driving substrate of the first micro LED module, comprising: forming a first contact hole and a second contact hole on the micro LED chip of the first micro LED module, such that the first contact hole exposes a first portion to be connected on the driving substrate of the first micro LED module, and the second contact hole exposes a second portion to be connected on the driving substrate of the first micro LED module; Arranging a first metal wire connected as an integral whole on the first portion to be connected and on the flexible supporting layer, and arranging a second metal wire connected as an integral whole on the second portion to be connected and on the flexible supporting layer, to obtain a second intermediate structure; Disposing a protective layer on the second intermediate structure, and forming a third contact hole and a fourth contact hole in the protective layer, such that the third contact hole exposes a first predetermined exposed portion of the first metal wire on the flexible supporting layer, and the fourth contact hole exposes a second predetermined exposed portion of the second metal wire on the flexible supporting layer; disposing a first metal layer on the first predetermined exposed portion and disposing a second metal layer on the second predetermined exposed portion; disposing a first metal block on the first metal layer and a second metal block on the second metal layer to obtain a third intermediate structure; The third intermediate structure is connected to a corresponding portion of the driving substrate of the second micro LED module through the first metal block, and the third intermediate structure is connected to a corresponding portion of the driving substrate of the third micro LED module through the second metal block.

4. The method for preparing a micro LED device according to claim 1, wherein: Providing a flexible supporting layer on the substrate and around the first micro LED module includes: disposing a flexible support material on the substrate and the first micro LED module; The flexible supporting material is ground until the upper surface of the first micro LED module is exposed to form the flexible supporting layer.

5. The method for preparing a micro LED device according to claim 3, wherein: After connecting the third intermediate structure to the corresponding part of the driving substrate of the second micro LED module through the first metal block, and connecting the third intermediate structure to the corresponding part of the driving substrate of the third micro LED module through the second metal block, the method also includes filling a protective part in the gap between the second micro LED module and the third micro LED module and the third intermediate structure.

6. The method for preparing a micro LED device according to any one of claims 1 to 5, wherein: The light combining module is used to combine the lights of different colors emitted by the first micro LED module, the second micro LED module and the third micro LED module. The light combining module includes a light combining prism. The substrate includes a transparent substrate, and the transparent substrate includes a glass substrate.

7. The method for preparing a micro LED device according to claim 4, wherein: The flexible supporting material includes an organic compound with fluidity, and the organic compound with fluidity includes epoxy resin.

8. A micro LED device, wherein: The micro LED device includes a device component structure and a light combining module. The device component structure includes a flexible circuit board, a first micro LED module, a second micro LED module, a third micro LED module, a flexible support layer and a receiving space. The first micro LED module, the second micro LED module and the third micro LED module each include a driving substrate and a micro LED chip arranged on the driving substrate. The driving substrate of the first micro LED module is electrically connected and arranged on the flexible circuit board. The flexible supporting layer includes a horizontal portion and a first vertical portion and a second vertical portion located on both sides of the horizontal portion, and the horizontal portion of the flexible supporting layer is disposed on the flexible circuit board and around the first micro LED module. The second micro LED module is arranged on the first vertical portion of the flexible supporting layer and is electrically connected to the driving substrate of the first micro LED module. The third micro LED module is arranged on the second vertical portion of the flexible supporting layer and is electrically connected to the driving substrate of the first micro LED module. The first micro LED module, the second micro LED module and the third micro LED module form the accommodating space. Light emission directions of the first micro LED module, the second micro LED module and the third micro LED module are toward the accommodating space. The light combining module is arranged in the accommodating space.

9. The micro LED device according to claim 8, wherein: The driving substrate of the first micro LED module includes a first portion to be connected and a second portion to be connected, wherein the first portion to be connected and the second portion to be connected are respectively connected to corresponding portions of the flexible circuit board. The driving substrate of the second micro LED module is electrically connected to the first to-be-connected portion of the first micro LED module, and the driving substrate of the third micro LED module is electrically connected to the second to-be-connected portion of the first micro LED module.

10. The micro LED device according to claim 9, wherein: The device composition structure also includes: a first contact hole and a second contact hole, each of which is provided on the micro LED chip of the first micro LED module, the first contact hole exposing a first portion to be connected on the driving substrate of the first micro LED module, and the second contact hole exposing a second portion to be connected on the driving substrate of the first micro LED module; a first metal wire and a second metal wire, wherein the first metal wire is integrally formed on the first portion to be connected and the horizontal portion and the first vertical portion of the flexible supporting layer, and the second metal wire is integrally formed on the second portion to be connected and the horizontal portion and the second vertical portion of the flexible supporting layer; a protective layer disposed on the first metal line, the second metal line, and the first micro LED module; a third contact hole and a fourth contact hole, each of which is disposed on the protective layer, the third contact hole exposing a first predetermined exposed portion of the first metal line on the first vertical portion of the flexible supporting layer, and the fourth contact hole exposing a second predetermined exposed portion of the second metal line on the second vertical portion of the flexible supporting layer; a first metal layer and a second metal layer, wherein the first metal layer is disposed on the first predetermined exposed portion, and the second metal layer is disposed on the second predetermined exposed portion; a first metal block and a second metal block, wherein the first metal block is disposed on the first metal layer and the second metal block is disposed on the second metal layer; The first metal block is connected to a corresponding portion of the driving substrate of the second micro LED module, and the second metal block is connected to a corresponding portion of the driving substrate of the third micro LED module.

11. The micro LED device according to claim 10, wherein: The device assembly structure further includes a protection portion, which is disposed in a gap between the second micro LED module, the third micro LED module, and the protection layer.

12. A display device, wherein: The display device includes the micro LED device according to any one of claims 8 to 11.

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