Communication networks for semiconductor devices

Abstract

A communication network for semiconductor devices includes: a master station; one or more slave station groups, each slave station group comprising multiple slave stations; a primary link, configured between the master station and the slave station groups, and between adjacent slave stations, wherein the master station and multiple slave stations in a slave station group are signal connected via the primary link, and the master station and multiple slave stations in a slave station group form a series path via the primary link; and a redundant link, configured between the master station and the slave station at the end of the series path, wherein the master station and the slave station at the end of the series path are signal connected via the redundant link, wherein the master station and the slave station groups form a ring link via the primary link, and the master station and the slave station groups form a ring link via the redundant link, and the communication methods of the primary link and the redundant link are consistent. When a primary link in the series path is disconnected, the master station can still perform data transmission and reception functions with multiple slave stations in the slave station groups through the primary link and the redundant link, thereby improving the robustness of the semiconductor device communication network.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and more particularly to a communication network for semiconductor devices. Background Technology

[0002] A communication network is a link that physically connects various isolated devices to enable information exchange between people, between people and computers, and between computers, thereby achieving the purpose of resource sharing and communication.

[0003] In today's semiconductor industry, devices often employ a combination of communication methods to control underlying devices. Examples include Ethernet, DeviceNet, FINS, and serial communication. Different communication methods require different communication modules for adaptation, and their corresponding interface types and communication protocols also differ. This not only increases the cost of device development but also the maintenance costs for developers. Furthermore, because these communication methods do not support network redundancy, a disconnection in one slave device's communication line will cause all subsequent slave devices to lose connection. Therefore, traditional communication methods have low network robustness, which is detrimental to stable device operation.

[0004] Currently, the robustness of communication networks for semiconductor devices needs to be improved. Summary of the Invention

[0005] The problem addressed by the embodiments of the present invention is to provide a communication network for semiconductor devices to improve the robustness of the communication network for semiconductor devices.

[0006] To address the aforementioned problems, embodiments of the present invention provide a communication network for a semiconductor device, comprising: a master station; one or more slave station groups, each slave station group including multiple slave stations; a primary link disposed between the master station and the slave station groups, and between adjacent slave stations, wherein the master station and multiple slave stations in the slave station groups are signal connected via the primary link, and the master station and multiple slave stations in the slave station groups form a series path via the primary link; and a redundant link disposed between the master station and a slave station at the end of the series path, wherein the master station and a slave station at the end of the series path are signal connected via the redundant link, wherein the master station and the slave station groups form a ring link via the primary link, and the master station and the slave station groups form a ring link via the redundant link, and the communication methods of the primary link and the redundant link are consistent.

[0007] Optionally, the master station includes multiple communication port groups, each corresponding to a slave station group; the communication port group includes a first network port and a second network port, the first network port being used to connect to the primary link signal, and the second network port being used to connect to the redundant link signal.

[0008] Optionally, the slave station includes a third network port, the third network ports between adjacent slave stations are connected to the primary link signal, and the third network port of the slave station at the end of the serial path is connected to the redundant link signal, while the third network port of the slave station at the beginning of the serial path is connected to the master station through the primary link signal.

[0009] Optionally, the slave stations in the slave station group have multiple functions; in the ring link, the master station and the multiple slave stations in the slave station group transmit data through data frames, and the data frame includes multiple data packets, each of which transmits data with the slave station with the same function.

[0010] Optionally, in the slave group, there are one or more slaves with the same function; the data packet includes one or more sub-data packets, the sub-data packets having a destination address and data payload corresponding to one or more slaves with the same function.

[0011] Optionally, the data frame may further include a flag bit set between adjacent data packets.

[0012] Optionally, the functions of multiple slave groups are inconsistent, and the functions of multiple slaves in a slave group are consistent.

[0013] Optionally, in the ring link, the master station and multiple slave stations in the slave station group transmit data through data frames, and the data frame includes a data packet, which transmits data with the multiple slave stations in the slave station group.

[0014] Optionally, the slave group may include a security slave group, a motion slave group, or a normal slave group.

[0015] Optionally, the safety level coefficient of the safe slave group is higher than that of the moving slave group; the safety level coefficient of the moving slave group is higher than that of the ordinary slave group.

[0016] Optionally, the slave station may function as a security slave station, a motion slave station, or a normal slave station.

[0017] Optionally, the security level coefficient of the secure slave station is higher than that of the moving slave station; the security level coefficient of the moving slave station is higher than that of the ordinary slave station.

[0018] Optionally, the slave station includes one or more pluggable modules, each pluggable module having a communication port; when the slave station includes multiple pluggable modules, adjacent pluggable modules are connected via the communication port.

[0019] Optionally, the communication method of the primary link includes EtherCAT, PROFINET, Modbus TCP, or EtherNet / IP; the communication method of the redundant link includes EtherCAT, PROFINET, Modbus TCP, or EtherNet / IP.

[0020] Compared with the prior art, the technical solution of the embodiments of the present invention has the following advantages:

[0021] The communication network for semiconductor devices provided in this invention includes a primary link between a master station and a group of slave stations, as well as between adjacent slave stations. The master station and multiple slave stations in the slave station group are connected via the primary link, and the master station and multiple slave stations in the slave station group form a series path via the primary link. A redundant link is provided between the master station and the slave station at the end of the series path. The master station and the slave station at the end of the series path are connected via the redundant link. The master station and the slave station group form a ring link via the primary link, and the master station and the slave station group form a ring link via the redundant link. The communication methods of the primary link and the redundant link are consistent. Compared to existing schemes that only a primary link is set between the master station and the slave station group, and between adjacent slave stations, this invention provides a more efficient communication network by using a primary link between the master station and the slave station at the end of the series path. Redundant links are set up between the master station and the slave station group to form a ring link through the primary link and the redundant link. Even if the primary link in the serial path is disconnected at some point, the master station can still bypass the disconnected primary link through the redundant link and receive data from the slave station at the end of the serial path to the slave station following the disconnected primary link. At the same time, the master station can receive data from the slave station preceding the disconnected primary link through the primary link. In other words, even if the primary link in the serial path is disconnected at some point, the master station can still receive data from multiple slave stations in the slave station group through the primary link and the redundant link. This reduces the probability of equipment downtime due to primary link disconnection, thereby improving the robustness of the communication network of semiconductor equipment. Attached Figure Description

[0022] Figure 1 This is a schematic diagram corresponding to the first embodiment of the communication network of the semiconductor device of the present invention;

[0023] Figure 2 This is a schematic diagram corresponding to the second embodiment of the communication network of the semiconductor device of the present invention. Detailed Implementation

[0024] As the background technology shows, different communication methods currently require different communication modules for adaptation, and the corresponding interface forms and communication protocols are also different. Semiconductor device communication networks use a variety of different communication protocols, that is, multiple different communication protocols are used between the master station and multiple slave stations. Because multiple different communication protocols are used between the master station and multiple slave stations, once the communication link connected to one slave station is disconnected, all subsequent slave stations will be disconnected from the master station. Therefore, the communication network of semiconductor devices using traditional communication methods has low robustness, which is not conducive to the stable operation of semiconductor devices.

[0025] To address the aforementioned technical problems, embodiments of the present invention provide a communication network for a semiconductor device, comprising: a master station; one or more slave station groups, each slave station group including multiple slave stations; a primary link disposed between the master station and the slave station groups, and between adjacent slave stations, wherein the master station and multiple slave stations in the slave station groups are signal connected via the primary link, and the master station and multiple slave stations in the slave station groups form a series path via the primary link; and a redundant link disposed between the master station and a slave station at the end of the series path, wherein the master station and a slave station at the end of the series path are signal connected via the redundant link, wherein the master station and the slave station groups form a ring link via the primary link, and the master station and the slave station groups form a ring link via the redundant link, and the communication methods of the primary link and the redundant link are consistent.

[0026] The communication network for semiconductor devices provided in this invention includes a primary link between a master station and a group of slave stations, as well as between adjacent slave stations. The master station and multiple slave stations in the slave station group are connected via the primary link, and the master station and multiple slave stations in the slave station group form a series path via the primary link. A redundant link is provided between the master station and the slave station at the end of the series path. The master station and the slave station at the end of the series path are connected via the redundant link. The master station and the slave station group form a ring link via the primary link, and the master station and the slave station group form a ring link via the redundant link. The communication methods of the primary link and the redundant link are consistent. Compared to existing schemes that only a primary link is set between the master station and the slave station group, and between adjacent slave stations, this invention provides a more efficient communication network by using a primary link between the master station and the slave station at the end of the series path. Redundant links are set up between the master station and the slave station group to form a ring link through the primary link and the redundant link. Even if the primary link in the serial path is disconnected at some point, the master station can still bypass the disconnected primary link through the redundant link and receive data from the slave station at the end of the serial path to the slave station following the disconnected primary link. At the same time, the master station can receive data from the slave station preceding the disconnected primary link through the primary link. In other words, even if the primary link in the serial path is disconnected at some point, the master station can still receive data from multiple slave stations in the slave station group through the primary link and the redundant link. This reduces the probability of equipment downtime due to primary link disconnection, thereby improving the robustness of the communication network of semiconductor equipment.

[0027] To make the above-mentioned objects, features, and advantages of the embodiments of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Figure 1 This is a schematic diagram corresponding to the first embodiment of the communication network of the semiconductor device of the present invention.

[0028] refer to Figure 1The communication network of the semiconductor device includes: a master station 160; one or more slave station groups 100, each slave station group 100 including multiple slave stations 101; and a master link 120 disposed between the master station 160 and the slave station groups 100, and between adjacent slave stations 101. The master station 160 and the multiple slave stations 101 in the slave station groups 100 are connected by the master link 120, and the master station 160 and the multiple slave stations 101 in the slave station groups 100 form a series connection through the master link 120. A redundant link 126 is provided between the master station 160 and the slave station 101 at the end of the serial path. The master station 160 and the slave station 101 at the end of the serial path are connected by the redundant link 126. The master station 160 and the slave station group 100 form a ring link 130 through the primary link 120 and the master station 160 and the slave station group 100 through the redundant link 126. The communication methods of the primary link 120 and the redundant link 126 are consistent.

[0029] It should be noted that by setting up a redundant link 126 between the master station 160 and the slave station 101 at the end of the serial path, the master station 160 and the slave station group 100 form a ring link 130 through the primary link 120 and the redundant link 126. Even if the primary link 120 in the serial path is disconnected at some point, the master station 160 can still bypass the disconnected primary link 120 through the redundant link 126 and connect with the slave station 101 at the end of the serial path to the subsequent slave station on the disconnected primary link 120. Station 101 enables data transmission and reception. Meanwhile, master station 160 enables data transmission and reception with slave station 101 preceding the disconnected master link 120 via master link 120. In other words, even if the master link 120 in the serial path is disconnected, master station 160 can still enable data transmission and reception with multiple slave stations 101 in slave station group 100 through master link 120 and redundant link 126. This reduces the probability of equipment downtime due to disconnection of master link 120, thereby improving the robustness of the communication network of semiconductor equipment.

[0030] Specifically, the master station 160 is used to control the communication network of the semiconductor device. The master station 160 initiates a communication process to send data to the slave station 101 and receive data returned by the slave station 101.

[0031] As an example, the master station 160 includes a central processing unit that handles network communication and control logic.

[0032] In this embodiment, the master station 160 includes multiple communication port groups 112, and each communication port group 112 corresponds to a slave station group 100.

[0033] Specifically, the communication port group 112 is used to realize the signal connection between the master station 160 and the slave station group 100, so as to receive and send data.

[0034] It should be noted that each communication port group 112 corresponds to one slave group 100, enabling each communication port group to be specifically configured to meet the communication needs of its corresponding slave group 100. Furthermore, the fact that each communication port group 112 corresponds to one slave group 100 can distribute communication network traffic and avoid overloading of a single communication port. At the same time, when one communication port group 112 fails, it will not affect the communication port groups 112, allowing the other communication port groups 112 to still transmit data with their corresponding slave groups 100, thereby improving the robustness of the communication network of the semiconductor device.

[0035] In this embodiment, the communication port group 112 includes a first network port 110 and a second network port 111. The first network port 110 is used to connect to the primary link 120, and the second network port 111 is used to connect to the redundant link 126.

[0036] Specifically, the first network port 110 is used to connect to the master link 120, so that the master station 160 can connect to the slave station group 100 through the first network port 110 and the master link 120, thereby enabling data transmission.

[0037] Meanwhile, the second network port 111 is used to connect to the redundant link 126, providing a backup data transmission link between the master station 160 and the slave station 101. When the primary link 120 is disconnected at some point in the serial path, the master station 160 can bypass the disconnected primary link 120 through the redundant link 126 connected to the second network port 111 and achieve data reception and transmission with the subsequent slave station 101 of the disconnected primary link 120.

[0038] It should be noted that the slave station group 100 includes multiple slave stations 101. The slave station 101 is used as a controlled unit in the communication network of semiconductor devices. It responds to the instruction data sent by the master station 160 and performs the reading, writing and control tasks of the instruction data. At the same time, the slave station 101 also returns the execution result data to the master station 160 through the primary link 120 or the redundant link 126.

[0039] As an example, a communication network for a semiconductor device includes one or more slave groups 100, and multiple slaves 101 in the slave group 100 have various functions.

[0040] Specifically, different semiconductor manufacturing processes and techniques require different types of control and detection, which means that the corresponding slave station 101 needs to have corresponding functions to meet the requirements. Therefore, the multiple slave stations 101 in the slave station group 100 have multiple functions.

[0041] As an example, the slave station's functions include a secure slave station, a motion slave station, or a normal slave station.

[0042] Specifically, security slaves are used as critical slaves in the communication network of semiconductor devices. When a security slave reports a data error, it can cause the entire semiconductor device to crash. Motion slaves are used in the communication network of semiconductor devices to control motion, such as speed or position control. Ordinary slaves are used in the communication network of semiconductor devices to monitor or measure.

[0043] As an example, a safety slave includes safety I / O (safety-related input / output devices) or a heating controller.

[0044] As an example, motion slaves include servo drives, frequency converters, or stepper motor drives.

[0045] As an example, a typical slave station includes a vacuum gauge, pressure gauge, or thermometer.

[0046] In this embodiment, the security level coefficient of the secure slave station is higher than that of the motion slave station, and the security level coefficient of the motion slave station is higher than that of the ordinary slave station.

[0047] It should be noted that the security level coefficient of the secure slave station is higher than that of the motion slave station. When a data error occurs in the secure slave station, the entire semiconductor device will stop in time to prevent further equipment damage. Since the security level coefficient of the secure slave station is higher than that of the motion slave station, and the security level coefficient of the motion slave station is higher than that of the ordinary slave station, in other words, when a data error occurs in the ordinary slave station 101 and the motion slave station, only the corresponding device alarm will be triggered, and the entire semiconductor device will not crash.

[0048] As an example, in the slave group 100, there are one or more slaves 101 with the same function.

[0049] In this embodiment, the slave station 101 includes a third network port 102. The third network port 102 between adjacent slave stations 101 is signal-connected to the primary link 120. The third network port 102 of the slave station 101 at the end of the serial path is signal-connected to the redundant link 126. The third network port 102 of the slave station 101 at the beginning of the serial path is signal-connected to the master station 160 through the primary link 120.

[0050] Specifically, the third network port 102 between adjacent slave stations 101 is used for signal connection with the master link 120, and the master station 160 and slave station group 100 are connected via the master link 120, thereby enabling the master station 160 and multiple slave stations 101 in the slave station group 100 to form a series path through the master link 120. Simultaneously, the third network port 102 of the slave station 101 at the end of the series path is connected to the redundant link 126, and the redundant link 126 is located between the master station 160 and the slave station 101 at the end of the series path, thereby enabling the master station 160 and slave station group 100 to connect. The primary link 120 and the master station 160 and the slave station group 100 form a ring link 130 through the redundant link 126. Accordingly, even if the primary link 120 in the serial path is disconnected at some point, the master station 160 can still bypass the disconnected primary link 120 through the redundant link 126 and achieve data transmission and reception through the slave station 101 at the end of the serial path and the subsequent slave station 101 of the disconnected primary link 120. This reduces the probability of equipment downtime due to the disconnection of the primary link 120, thereby improving the robustness of the communication network of semiconductor equipment.

[0051] As an example, the slave station 101 at the end of the serial path has at least two third network ports 102. For example... Figure 1 As shown, only two third network ports 102 are shown.

[0052] Specifically, one of the third network ports 102 is connected to the third network port 102 of the adjacent slave station 101 via the primary link 120, and the other third network port 102 is connected to the second network port 111 of the master station 160 via the redundant link 126.

[0053] In this embodiment, the slave station 101 includes one or more pluggable modules 181, each having a communication port (not shown).

[0054] It should be noted that the slave station 101 includes one or more pluggable modules 181, which allow users to insert or remove different modules according to application requirements, providing high flexibility and scalability for semiconductor devices. At the same time, the pluggable module 181 has a communication port, which facilitates the pluggable module 181 to achieve data transmission with other slave stations 101 or other pluggable modules 181.

[0055] Specifically, the plug-in module 181 has dedicated functional units, such as motion control units, safety control units, or data processing units.

[0056] In this embodiment, when the slave station 101 includes a pluggable module 181, the communication port is the third network port 102, thereby enabling data transmission and reception with the adjacent slave station 101 through the third network port 102.

[0057] In this embodiment, when the slave station 101 includes multiple plug-in modules 181, adjacent plug-in modules 181 are connected by a signal through the communication port.

[0058] Specifically, adjacent plug-in modules 181 are connected via a communication port, meaning that multiple plug-in modules 181 in a single slave station 101 can transmit and receive data via a communication port.

[0059] It should be noted that the primary link 120 is used as the main channel for data transmission in the semiconductor device communication network.

[0060] In this embodiment, the primary link 120 and the redundant link 126 communicate in the same way.

[0061] Specifically, the primary link 120 and the redundant link 126 communicate in the same way, which means that the primary link 120 and the redundant link 126 use the same communication protocol and communication parameters. When the primary link 120 fails or is disconnected, the master station 160 can seamlessly switch to the redundant link 126, so that the master station 160 can continue to transmit data with the slave station 101 through the redundant link 126. This reduces the probability of equipment downtime due to the disconnection of the primary link 120, thereby improving the robustness of the communication network of semiconductor equipment.

[0062] In this embodiment, the communication method of the primary link 120 includes EtherCAT, PROFINET, Modbus TCP, or EtherNet / IP.

[0063] Specifically, EtherCAT, PROFINET, Modbus TCP, and EtherNet / IP are all commonly used communication protocols in the semiconductor industry. Taking EtherCAT as an example, EtherCAT is based on Ethernet technology and can directly use Ethernet interfaces for communication, thus offering lower costs and higher cost-effectiveness. This helps reduce the overall cost of communication networks for semiconductor devices. Furthermore, EtherCAT frames can be transmitted directly within Ethernet frames, enabling the transmission of multiple data packets within a single EtherCAT frame, thereby improving the transmission efficiency between master station 160 and slave station 101, as well as between slave stations 101 themselves.

[0064] It should be noted that the redundant link 126 is used as a backup channel for data transmission in the semiconductor device communication network. When the primary link 120 is disconnected at some point in the serial path, the master station 160 can still receive and send data with multiple slave stations 101 in the slave station group 100 through the primary link 120 and the redundant link 126. This reduces the probability of equipment downtime due to the disconnection of the primary link 120, thereby improving the robustness of the semiconductor device communication network.

[0065] In this embodiment, the communication method of the redundant link 126 includes EtherCAT, PROFINET, Modbus TCP, or EtherNet / IP.

[0066] Specifically, EtherCAT, PROFINET, Modbus TCP, and EtherNet / IP are all commonly used communication protocols in the semiconductor industry. Taking EtherCAT as an example, EtherCAT is based on Ethernet technology and can directly use Ethernet interfaces for communication, thus offering lower costs and higher cost-effectiveness. This helps reduce the overall cost of communication networks for semiconductor devices. Furthermore, EtherCAT frames can be transmitted directly within Ethernet frames, enabling the transmission of multiple data packets within a single EtherCAT frame, thereby improving the transmission efficiency between master station 160 and slave station 101, as well as between slave stations 101 themselves.

[0067] It should be noted that the master station 160 and the slave station group 100 form a ring link 130 through the primary link 120 and the master station 160 and the slave station group 100 through the redundant link 126.

[0068] In this embodiment, the master station 160 in the ring link 130 and multiple slave stations 101 in the slave station group 100 transmit data through data frames, and each data frame includes multiple data packets, with each data packet transmitting data with the slave station 101 having the same function.

[0069] Specifically, the data frame includes multiple data packets, each of which transmits data with the slave station 101 of the same function. That is, one data packet corresponds to one slave station 101 of the same function, so that the data packets of slave stations 101 with different functions do not affect each other. Correspondingly, even if a data packet of a certain function is erroneous, it will not cause the data packets of other functions to fail because the data packets of slave stations 101 with different functions are separated from each other. Thus, the slave station 101 corresponding to the data packets of other functions will not report errors, thereby reducing the probability of the entire semiconductor device going down and improving the stability of the semiconductor device.

[0070] As an example, the redundant link 126 and the primary link 120 both use the EtherCAT communication protocol for communication. Correspondingly, the master station 160 in the ring link 130 and multiple slave stations 101 in the slave station group 100 transmit data through EtherCAT frames.

[0071] Specifically, an EtherCAT frame includes an EtherCAT frame header, one or more data packets, and an EtherCAT frame trailer.

[0072] In this embodiment, the data packet includes one or more sub-data packets, each sub-data packet having a target address and data payload corresponding to one or more slave stations 101 with the same function.

[0073] It should be noted that there are one or more slave stations 101 with the same function. Each slave station 101 undertakes different control tasks in each specific function. Therefore, the sub-data packet has a destination address and data payload corresponding to one or more slave stations 101 with the same function. Each destination address corresponds to a slave station 101 that undertakes a different control task. This allows the data payload in the sub-data packet to be sent to the corresponding slave station 101 according to the destination address, so that the slave station 101 can correctly execute the control task.

[0074] Specifically, the data load includes information such as control commands, configuration parameters, or process variables.

[0075] In this embodiment, the data frame further includes a flag bit, which is set between adjacent data packets.

[0076] Specifically, by setting a flag, data separation between adjacent data packets can be achieved, so that adjacent data packets do not affect each other.

[0077] Figure 2 This is a schematic diagram corresponding to the second embodiment of the communication network of the semiconductor device of the present invention.

[0078] The similarities between the embodiments of the present invention and the first embodiment will not be repeated here. The differences between the embodiments of the present invention and the first embodiment are as follows:

[0079] refer to Figure 2 The functions of multiple slave groups 200 are inconsistent, while the functions of multiple slave stations 201 in the slave group 200 are consistent.

[0080] It should be noted that the functions of the multiple slave station groups 200 are inconsistent, and the functions of the multiple slave stations 201 in the slave station group 200 are consistent. That is, each slave station group 200 forms a ring link 230. Even if the primary link 220 in the serial path is disconnected, the master station 260 can still bypass the disconnected primary link 220 through the redundant link 226 and achieve data transmission and reception with the slave station 201 at the end of the serial path and the subsequent slave station 201 of the disconnected primary link 220. At the same time, the master station 260 achieves data transmission and reception with the preceding slave station 201 of the disconnected primary link 220 through the primary link 220. In other words, even if the primary link 220 in the serial path is disconnected, the master station 260 can still achieve data transmission and reception with multiple slave stations 201 in the slave station group 200 through the primary link 220 and the redundant link 226. This reduces the probability of equipment downtime due to the disconnection of the primary link 220, thereby improving the robustness of the communication network of semiconductor equipment.

[0081] It should also be noted that the functions of the multiple slave groups 200 are inconsistent, and the functions of the multiple slave stations 201 in the slave group 200 are consistent. This means that the data packets in the ring link 230 formed by each slave group 200 and the master station 260 are single, thereby reducing the probability that data packets of other functions will affect the slave stations 201 in the slave group 200, and further enhancing the robustness of the semiconductor device communication network.

[0082] Specifically, different semiconductor manufacturing processes and techniques require different types of control and detection, which means that the corresponding slave station group 200 needs to have corresponding functions to meet the requirements. Therefore, the slave station group 200 has multiple functions.

[0083] As an example, the slave group 200 may include a security slave group, a motion slave group, or a normal slave group.

[0084] Specifically, the security slave group is used as a critical slave group 200 in the communication network of the semiconductor device. When the security slave group reports a data error, it will cause the entire semiconductor device to crash. The motion slave group is used in the communication network of the semiconductor device to be responsible for motion control devices, such as speed or position control. The ordinary slave group is used in the communication network of the semiconductor device to be responsible for monitoring or measuring devices.

[0085] As an example, a security slave group includes multiple security slaves, which may include security I / O (security-related input / output devices) or heating controllers.

[0086] As an example, a motion slave group includes multiple motion slaves, which may include servo drives, frequency converters, or stepper motor drives.

[0087] As an example, a typical slave group includes multiple typical slaves, which may include vacuum gauges, pressure gauges, or thermometers.

[0088] In this embodiment, the security level coefficient of the safe slave group is higher than that of the moving slave group, and the security level coefficient of the moving slave group is higher than that of the ordinary slave group.

[0089] It should be noted that the security level coefficient of the secure slave group is higher than that of the moving slave group. When a data error occurs in the secure slave group, the entire semiconductor device will stop in time to prevent further equipment damage. Since the security level coefficient of the secure slave group is higher than that of the moving slave group, and the security level coefficient of the moving slave group is higher than that of the ordinary slave group, in other words, the security level coefficient of the secure slave group is higher than that of the ordinary slave group. When data errors occur in the ordinary slave group and the moving slave group, only the corresponding equipment alarm will be triggered, and the entire semiconductor device will not crash, thereby improving the robustness of the semiconductor device communication network.

[0090] In this embodiment, the master station 260 in the ring link 230 and multiple slave stations 201 in the slave station group 200 transmit data through data frames, and the data frame includes a data packet, which transmits data with the multiple slave stations 201 in the slave station group 200.

[0091] Specifically, a data frame includes a data packet, which transmits data with multiple slave stations 201 in the slave station group 200. Compared to a scheme where a data frame includes multiple data packets, a single data packet reduces the complexity of data processing and can reduce the latency caused by processing multiple data packets, thereby improving the data transmission rate of the data frame in the ring link 230. At the same time, the reduction in the number of data packets also reduces the probability of errors in the semiconductor device, further improving the robustness of the semiconductor device communication network.

[0092] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A communication network of semiconductor devices, characterized by, The application relates to a communication network of a semiconductor device, comprising: a master station, the master station comprising a plurality of communication port groups, each of the communication port groups corresponding to a slave station group; one or more slave station groups, the slave station groups comprising a plurality of slave stations, and the plurality of slave stations in the slave station groups having a plurality of functions; a main link, the main link being arranged between the master station and the slave station groups and between adjacent slave stations, the master station and the plurality of slave stations in the slave station groups being connected by the main link, and the master station and the plurality of slave stations in the slave station groups forming a serial path by the main link; a redundant link, the redundant link being arranged between the master station and a slave station at the end of the serial path, the master station and the slave station at the end of the serial path being connected by the redundant link, the master station and the slave station groups being connected by the main link and the master station and the slave station groups being connected by the redundant link, and the main link and the redundant link having the same communication mode; wherein the master station and the plurality of slave stations in the slave station groups are connected by data frames in the ring link, and each of the data frames comprises a plurality of data packets, and each of the data packets is used for data transmission with the slave stations having the same function.

2. The communication network of the semiconductor device according to claim 1, wherein: the communication port groups comprise a first network port and a second network port, the first network port being used for signal connection with the main link, and the second network port being used for signal connection with the redundant link.

3. The communication network of semiconductor devices according to claim 1, wherein, the slave stations comprise a third network port, the third network ports between adjacent slave stations being connected with the main link, and the third network port of the slave station at the end of the serial path being connected with the redundant link, and the third network port of the slave station at the start of the serial path being connected with the master station by the main link.

4. The communication network of semiconductor devices according to claim 1, wherein, in the slave station groups, the slave stations having the same function are one or more; the data packets comprise one or more sub-data packets, and each of the sub-data packets has a target address and a data load corresponding to one or more slave stations having the same function.

5. The communication network of semiconductor devices according to claim 1, wherein, the data frames further comprise a flag bit arranged between adjacent data packets.

6. The communication network of semiconductor devices of claim 1, wherein, the functions of the plurality of slave station groups are inconsistent, and the functions of the plurality of slave stations in the slave station groups are consistent.

7. The communication network of semiconductor devices according to claim 6, wherein, the master station and the plurality of slave stations in the slave station groups are connected by data frames in the ring link, and each of the data frames comprises one data packet, and the data packet is used for data transmission with the plurality of slave stations in the slave station groups.

8. The communication network of semiconductor devices according to claim 6, wherein, the functions of the slave station groups comprise a safety slave station group, a motion slave station group or a common slave station group.

9. The communication network of semiconductor devices according to claim 8, wherein, the safety level coefficient of the safety slave station group is higher than that of the motion slave station group; the safety level coefficient of the motion slave station group is higher than that of the common slave station group.

10. The communication network of semiconductor devices according to claim 1 or 6, wherein, the functions of the slave stations comprise a safety slave station, a motion slave station or a common slave station.

11. The communication network of semiconductor devices according to claim 10, wherein, the safety level coefficient of the safety slave station is higher than that of the motion slave station; the safety level coefficient of the motion slave station is higher than that of the common slave station.

12. The communication network of semiconductor devices according to claim 1, wherein, the slave stations comprise one or more plug-in modules, and the plug-in modules have communication ports. When the slave station comprises a plurality of plug-in modules, adjacent plug-in modules are connected by the communication ports.

13. The communication network of semiconductor devices according to claim 1, wherein, The communication mode of the main link comprises EtherCAT, PROFINET, Modbus TCP or EtherNet / IP. The communication mode of the redundant link comprises EtherCAT, PROFINET, Modbus TCP or EtherNet / IP.

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